TWI721495B - 基板處理裝置、處理液以及基板處理方法 - Google Patents

基板處理裝置、處理液以及基板處理方法 Download PDF

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Publication number
TWI721495B
TWI721495B TW108125150A TW108125150A TWI721495B TW I721495 B TWI721495 B TW I721495B TW 108125150 A TW108125150 A TW 108125150A TW 108125150 A TW108125150 A TW 108125150A TW I721495 B TWI721495 B TW I721495B
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TW
Taiwan
Prior art keywords
substrate
liquid
processing
liquid film
gas
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TW108125150A
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English (en)
Chinese (zh)
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TW202011501A (zh
Inventor
奥谷学
阿部博史
屋敷啓之
Original Assignee
日商斯庫林集團股份有限公司
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202011501A publication Critical patent/TW202011501A/zh
Application granted granted Critical
Publication of TWI721495B publication Critical patent/TWI721495B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW108125150A 2018-08-24 2019-07-17 基板處理裝置、處理液以及基板處理方法 TWI721495B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018157133A JP7209494B2 (ja) 2018-08-24 2018-08-24 基板処理装置、処理液および基板処理方法
JP2018-157133 2018-08-24

Publications (2)

Publication Number Publication Date
TW202011501A TW202011501A (zh) 2020-03-16
TWI721495B true TWI721495B (zh) 2021-03-11

Family

ID=69592510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125150A TWI721495B (zh) 2018-08-24 2019-07-17 基板處理裝置、處理液以及基板處理方法

Country Status (5)

Country Link
JP (1) JP7209494B2 (ja)
KR (1) KR102531469B1 (ja)
CN (1) CN112514032A (ja)
TW (1) TWI721495B (ja)
WO (1) WO2020039784A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022178469A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2023121003A (ja) 2022-02-18 2023-08-30 東京応化工業株式会社 リンス液、基板の処理方法、及び半導体素子の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150279708A1 (en) * 2014-03-25 2015-10-01 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment apparatus
US20160214148A1 (en) * 2015-01-23 2016-07-28 SCREEN Holdings Co., Ltd. Substrate processing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
US5920455A (en) * 1997-05-01 1999-07-06 Wilson Greatbatch Ltd. One step ultrasonically coated substrate for use in a capacitor
JP2000097564A (ja) * 1998-09-21 2000-04-04 Hitachi Ltd 基板乾燥装置および基板洗浄乾燥装置
JP3811602B2 (ja) * 2000-09-01 2006-08-23 大日本スクリーン製造株式会社 基板表面処理方法および基板表面処理装置
JP4019258B2 (ja) * 2002-06-25 2007-12-12 日本電気株式会社 共重合高分子膜の作製方法
EP2455786A1 (en) * 2009-07-16 2012-05-23 JX Nippon Oil & Energy Corporation Diffraction grating, organic el element using same, and method for manufacturing said diffraction grating and organic el element
JP5765791B2 (ja) * 2014-01-31 2015-08-19 Ｊｘ日鉱日石エネルギー株式会社 太陽電池用透明導電性基板の製造方法
JP6566414B2 (ja) 2015-02-27 2019-08-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置ならびに流体ノズル
CN105675670A (zh) * 2016-01-13 2016-06-15 杨炳 一种用于防水汽腐蚀的电动汽车充电站
JP6671217B2 (ja) * 2016-03-31 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102008566B1 (ko) * 2016-05-24 2019-08-07 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150279708A1 (en) * 2014-03-25 2015-10-01 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment apparatus
US20160214148A1 (en) * 2015-01-23 2016-07-28 SCREEN Holdings Co., Ltd. Substrate processing method

Also Published As

Publication number Publication date
KR20210043665A (ko) 2021-04-21
TW202011501A (zh) 2020-03-16
WO2020039784A1 (ja) 2020-02-27
CN112514032A (zh) 2021-03-16
JP7209494B2 (ja) 2023-01-20
JP2020031172A (ja) 2020-02-27
KR102531469B1 (ko) 2023-05-11

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