TWI717512B - 有機電子元件封裝體用組成物、使用其製造的封裝體及包括其的有機電子元件 - Google Patents
有機電子元件封裝體用組成物、使用其製造的封裝體及包括其的有機電子元件 Download PDFInfo
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- TWI717512B TWI717512B TW106115618A TW106115618A TWI717512B TW I717512 B TWI717512 B TW I717512B TW 106115618 A TW106115618 A TW 106115618A TW 106115618 A TW106115618 A TW 106115618A TW I717512 B TWI717512 B TW I717512B
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- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 239000008393 encapsulating agent Substances 0.000 title abstract 6
- 239000000178 monomer Substances 0.000 claims abstract description 32
- 230000002745 absorbent Effects 0.000 claims abstract description 28
- 239000002250 absorbent Substances 0.000 claims abstract description 28
- 229920002050 silicone resin Polymers 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- -1 polydimethylsiloxane Polymers 0.000 claims description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- QSUJHKWXLIQKEY-UHFFFAOYSA-N (2-oxooxolan-3-yl) 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OC1CCOC1=O QSUJHKWXLIQKEY-UHFFFAOYSA-N 0.000 claims description 3
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 229910021536 Zeolite Inorganic materials 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000001095 magnesium carbonate Substances 0.000 claims 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
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- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000010457 zeolite Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 38
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 26
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- 239000000463 material Substances 0.000 description 9
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- 229910052760 oxygen Inorganic materials 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
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- 238000004519 manufacturing process Methods 0.000 description 3
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- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
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- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- JFZBUNLOTDDXNY-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)OCC(C)OC(=O)C(C)=C JFZBUNLOTDDXNY-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
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- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
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- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- OPLZHVSHWLZOCP-UHFFFAOYSA-N [2-hydroxy-3-[2-hydroxy-3-(2-methylprop-2-enoyloxy)propoxy]propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COCC(O)COC(=O)C(C)=C OPLZHVSHWLZOCP-UHFFFAOYSA-N 0.000 description 1
- MDMKOESKPAVFJF-UHFFFAOYSA-N [4-(2-methylprop-2-enoyloxy)phenyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(OC(=O)C(C)=C)C=C1 MDMKOESKPAVFJF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005157 alkyl carboxy group Chemical group 0.000 description 1
- 125000005189 alkyl hydroxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 150000001717 carbocyclic compounds Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- VFTATQXKBPNQQF-UHFFFAOYSA-N methyl 3-hydroxy-2-methylprop-2-enoate Chemical compound COC(=O)C(C)=CO VFTATQXKBPNQQF-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000000123 silicon containing inorganic group Chemical group 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/068—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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Abstract
根據本申請案示例性實施例的一種封裝體用組成物包
含:1)矽酮樹脂;2)一或多種水分吸收劑;3)一或多種光起始劑;以及4)能夠溶解所述光起始劑的單體。本申請案亦提供使用所述封裝體用組成物形成的封裝體以及包括所述封裝體的有機電子元件。
Description
本申請案主張於2016年5月11日在韓國智慧財產局提出申請的韓國專利申請案第10-2016-0057676號的優先權及權利,所述韓國專利申請案的全部內容併入本案供參考。
本申請案是有關於一種有機電子元件封裝體用組成物及使用其形成的封裝體。
一般而言,有機電子元件為以下元件:其特徵在於當將電荷注入至設置於正極與負極之間的有機層中時發生例如發光或電力流動等現象,且可根據所選擇的有機材料製造提供各種功能的元件。
作為代表性實例,有機發光二極體(organic light emitting diode,OLED)已因厚度薄且重量輕以及色彩效果優異而作為下一
代平板顯示器引起關注,且可製造於相關技術中的玻璃基板、包含矽的無機材料基板、金屬基板及例如塑膠基板或金屬箔等可撓性基板上。該些有機電子元件非常易受水分及氧氣的影響且因此具有以下缺點:當所述元件被暴露至空氣或當水分自外部引入至面板內部時顯著降低發光效率及使用壽命。
為解決上述問題,已藉由以下方式來努力阻擋自外部引入的水分及氧氣:使用利用玻璃頂蓋層(glass cap)方法或金屬頂蓋層(metal gap)方法或積層方法的封裝體膜或者沈積無機材料。
此外,存在藉由在有機層或金屬層的表面上施加可固化膜或可固化材料且接著執行固化製程來達成黏著性質及封裝性質的方法。
然而,玻璃頂蓋層因機械損傷等而在實作大的區域方面存在問題,且金屬頂蓋層因與基板的熱膨脹係數的差異而在製程方面存在問題。此外,利用積層方法的黏著劑膜具有例如經由所述膜的黏著劑表面的界面而引入水分及氧氣等問題,並且其中有機材料是在真空下沈積且無機材料是在真空下濺射的現有製程具有生產率低的問題,此乃因無機材料需要藉由濺射系統在真空下沈積成多層以防止水及氧氣經由濺射(sputtering)頂部上的界面而被引入,並且由於有機材料及無機材料需要在真空下形成為多層而使生產率劣化且無法進行大規模生產。
另外,液體封裝方法具有以下缺點:在固化製程期間生成的副產物或固化起始劑中的未反應的殘餘物等殘留於氣密密封的結構內,且因此會中斷有機電子元件的驅動或者縮短有機電子
元件的使用壽命等。
此外,當利用其中在有機電子元件的封裝期間在面板內設置水分吸收劑的金屬頂蓋層方法時,在使用水分吸收劑的金屬頂蓋層結構中形成有以預定高度突出的延伸部分,且當使用黏著劑將金屬頂蓋層最後黏合至基板或者藉由對玻璃進行處理以形成玻璃頂蓋層來封裝有機發光元件時,利用以下方法:利用在預定溝槽內設置水分吸收劑的例如噴砂或蝕刻等方法而將金屬頂蓋層黏合至基板。相關技術中的方法因在面板變大時封裝內的空間膨脹而使得難以加工金屬頂蓋層,且可造成玻璃頂蓋層容易被外部壓力破壞的問題。
本申請案已致力提供一種組成物及使用所述組成物的封裝體,所述組成物能夠製備可提高有機電子元件的使用壽命且有效地阻擋自外部引入的氧氣或水分等的封裝體。
本申請案的示例性實施例提供一種封裝體用組成物,所述封裝體用組成物包含:1)矽酮樹脂;2)一或多種水分吸收劑;3)一或多種光起始劑;以及
4)能夠溶解所述光起始劑的單體。
此外,本申請案的另一示例性實施例提供一種使用所述封裝體用組成物的封裝體。
此外,本申請案的又一示例性實施例提供一種包括所述封裝體的有機電子元件。
根據本申請案示例性實施例的封裝體用組成物的特徵在於,可製造可提高有機電子元件的使用壽命且有效地阻擋自外部引入的氧氣及水分等的封裝體。此外,用作相關技術中的封裝體的一般組成物具有以下缺點:所述組成物黏合至有機電子元件且接著與其他材料混合因而會喪失特性,或者因在黏合期間施加的壓力不均勻而無法維持已黏合表面之間的間隙。然而,根據本申請案示例性實施例的封裝體用組成物的特徵在於,在將所述組成物黏合至有機電子元件之後可良好地維持所述間隙,此乃因使用可固化組成物而被固化的材料具有強度且因此即使施加壓力所述間隙亦不容易被改變。
[最佳實施方式]
以下,將詳細闡述本申請案。
有機發光元件是多晶半導體元件,且用於液晶背光等以在低電壓下獲得高亮度發光,且期待作為薄型平坦顯示元件。然而,存在以下問題:有機發光元件極易受水分的影響,可因水分的影響而使金屬電場與有機發光層之間的界面剝離,可因金屬的氧化而增大電阻,且有機材料可因水分而發生品質變化,並且因此有機發光元件不發光且亮度可能劣化。
為解決所述問題,已開發出利用可固化組成物來封裝有機發光元件的方法。作為現有封裝方法,已提出利用丙烯酸樹脂來模製有機發光元件的方法、藉由向有機發光元件的封裝體樹脂中添加水分吸收劑而阻止水分進入有機發光元件的方法等。
其中,一種將封裝體樹脂與水分吸收劑進行混合並使用所述混合物的方法使用最廣泛,但為不可固化型的封裝體具有生產產率低的缺點,此乃因當執行後製程時難以耐受在高溫及高壓下的製程限制點。
本申請案已致力提供一種可固化封裝體組成物及使用所述封裝體組成物的封裝體,所述封裝體組成物可製備能夠提高有機電子元件的使用壽命且有效地阻擋自外部引入的氧氣或水分等的封裝體並且可藉由引入可固化系統而在執行後製程時具有製程穩定性。
根據本申請案示例性實施例的一種封裝體用組成物包含:1)矽酮樹脂;2)一或多種水分吸收劑;3)一或多種光起始
劑;以及4)能夠溶解所述光起始劑的單體。
在根據本申請案示例性實施例的封裝體用組成物中,所述矽酮樹脂的具體實例包括有機聚矽酮系樹脂等,但並非僅限於此。此外,下文將更詳細地闡述有機聚矽酮系樹脂的實例。
在有機聚矽酮系樹脂中,一或多個選自由烷基、芳基、及烯基組成的群組的官能基可鍵結至矽酮主鏈。
所述烷基的具體實例包括甲基、乙基、丙基、1-甲基乙基、丁基、1-甲基丙基、2-甲基丙基、1,1-二甲基乙基、戊基、1-甲基丁基、1-乙基丙基、2-甲基丁基、3-甲基丁基、1,2-二甲基丙基、2,2-二甲基丙基、己基、庚基、辛基、壬基、癸基、環烷基等,但並非僅限於此。
所述芳基的具體實例包括:苯基;萘基;烷基芳基,例如甲苯基及二甲苯基;芳基烷基,例如苯甲基及苯乙基等,但並非僅限於此。
所述烯基通常具有2至10個碳原子,且其具體實例包括乙烯基、烯丙基、甲基丙烯酸基、甲基丙烯酸甲基、丙烯酸基等,但並非僅限於此。
所述有機聚矽酮系樹脂較佳為選自由以下化學式1表示的化合物中的一或多者。
在化學式1中,
R1至R6彼此相同或不同,且可分別獨立地選自由以下組成的群組:氫、烷基、烯基、芳基、縮水甘油基、異氰酸酯基、羥基、羧基、乙烯基、丙烯酸酯基、甲基丙烯酸酯基、環氧化物基(epoxide group)、環醚基、硫醚基、縮醛基、內酯基、醯胺基、烷基芳基、烷基縮水甘油基、烷基異氰酸酯基、烷基羥基、烷基羧基、烷基乙烯基、烷基丙烯酸酯基、烷基甲基丙烯酸酯基、烷基環醚基、烷基硫醚基(alkylsulfide group)、烷基縮醛基、烷基內酯基、及烷基醯胺基,並且
a、b、c及d分別獨立地為0至1的實數,且(a+b+c+d)為1。
所述有機聚矽酮系樹脂可具有100至1,000,000或1,000至50,000的重量平均分子量,但重量平均分子量並非僅限於此。
以所述封裝體用組成物的總重量計,所述矽酮樹脂的含量可為1重量%至80重量%,但並非僅限於此。當所述矽酮樹脂的含量處於1重量%至80重量%以內時,可混合有能夠維持足夠的水分吸收效能同時維持與水分吸收劑的優異混溶性的量的水分
吸收劑。當所述矽酮樹脂的含量小於1重量%時,不可能混合有所述水分吸收劑,而當含量大於80重量%時,不可能混合有能夠獲得足以保護所述元件的水分吸收效能的水分吸收劑。
在根據本申請案示例性實施例的所述封裝體用組成物中,所述水分吸收劑可使所述封裝體用組成物具有水分吸收性質,且可用於調整觸變性。所述水分吸收劑的具體實例包括選自以下中的一者或者二或更多者的混合物:金屬粉末(例如氧化鋁)、金屬氧化物、有機金屬氧化物、金屬鹽或五氧化二磷(P2O5),但並非僅限於此。
所述金屬氧化物的具體實例包括氧化鋰(Li2O)、氧化鈉(Na2O)、氧化鋇(BaO)、氧化鈣(CaO)、氧化鎂(MgO)等,所述金屬鹽的實例包括:硫酸鹽,例如硫酸鋰(Li2SO4)、硫酸鈉(Na2SO4)、硫酸鈣(CaSO4)、硫酸鎂(MgSO4、硫酸鈷(CoSO4)、硫酸鎵(Ga2(SO4)3)、硫酸鈦(Ti(SO4)2)、或硫酸鎳(NiSO4);金屬鹵化物,例如氯化鈣(CaCl2)、氯化鎂(MgCl2)、氯化鍶(SrCl2)、氯化釔(YCl3)、氯化銅(CuCl2)、氟化銫(CsF)、氟化鉭(TaF5)、氟化鈮(NbF5)、溴化鋰(LiBr)、溴化鈣(CaBr2)、溴化銫(CeBr3)、溴化硒(SeBr4)、溴化釩(VBr3)、溴化鎂(MgBr2)、碘化鋇(BaI2)或碘化鎂(MgI2);或者金屬氯酸鹽,例如過氯酸鋇(Ba(ClO4)2)或過氯酸鎂(Mg(ClO4)2),但所述實例並非僅限於此。
所述金屬氧化物可與處於所述水分吸收劑經大致處理的狀態下的組成物摻合。舉例而言,封裝體可為根據施加封裝體的
有機電子元件的種類而具有30微米或小於30微米厚度的薄膜,且在此種情形中,可能需要對水分吸收劑進行粉碎的製程。在粉碎水分吸收劑時,可利用例如3輥磨機(3-roll mill)、珠磨機(bead mill)、或球磨機(ball mill)等製程。
以所述封裝體用組成物的總重量計,所述水分吸收劑的含量可為10重量%至90重量%,但並非僅限於此。當以所述封裝體用組成物的總重量計所述水分吸收劑的含量小於10重量%時,難以獲得足以保護元件的水分吸收效能,而當含量超過90重量%時,黏度極度增大,因而使得水分吸收劑可無法應用於所述製程。
在根據本申請案示例性實施例的所述封裝體用組成物中,所述光起始劑為熱惰性的,但在暴露於化學射線時會產生自由基。所述光起始劑的實例包括經取代或未經取代的多核醌,所述多核醌為共軛碳環化合物中具有兩個環內碳原子的化合物,例如,2-苯甲基-2-(二甲基胺基)-1-(4-嗎啉基苯基)-1-丁酮、2,2-二甲氧基-2-苯基苯乙酮、9,10-蒽醌、2-甲基蒽醌、2-乙基蒽醌、2-第三丁基蒽醌、八甲基蒽醌、1,4-萘醌、9,10-菲醌、苯並(苯)蒽-7,12-二酮(benz(benza)anthracene-7,12-dione)、2,3-稠四苯-5,12-二酮、2-甲基-1,4-萘醌、1,4-二甲基蒽醌、2,3-二甲基蒽醌、2-苯基蒽醌、2,3-二苯基蒽醌、惹登醌(retenquinone)、7,8,9,10-四氫稠四苯-5,12-二酮、及1,2,3,4-四氫苯並(四氫苯)-蒽-7,12-二酮(1,2,3,4-tetrahydrobenz(tetrahydrobenza)-anthracene-7,12-dione),但並非僅限於此。
以所述封裝體用組成物的總重量計,所述光起始劑的含量可為0.1重量%至10重量%,但並非僅限於此。當以所述封裝體用組成物的總重量計,所述光起始劑的含量小於0.1重量%時,可能出現即使對其照射強紫外線,因促進固化的活性自由基的數目少而亦無法進行固化的問題,而當含量超過10重量%時,存在有機發光元件的使用壽命可能由於在固化後在低於100℃的溫度條件下發生逸氣而被縮短的顧慮。
能夠溶解光起始劑的所述單體可包括在與矽酮樹脂混合的同時不造成光學分離的單體。能夠溶解光起始劑的所述單體的具體實例包括丙烯酸酯系單體、甲基丙烯酸酯系單體、矽氧烷系單體等,但並非僅限於此。能夠溶解光起始劑的所述單體較佳為具有能夠與黏合劑進行交聯的官能基以在施加至元件後不會產生逸氣的單體,且可較佳為具有1,000或小於1,000、較佳地400或小於400的分子量以滿足與矽酮樹脂一起使用的光學特性的單體。能夠溶解光起始劑的所述單體的實例包括α-甲基丙烯醯氧基-γ-丁內酯、甲基丙烯酸甲酯、羥基甲基丙烯酸甲酯、苯乙烯、金剛烷基甲基丙烯酸甲酯、1,6-己二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、1,3-丙二醇二甲基丙烯酸酯、1,3-丙二醇二丙烯酸酯、新戊二醇二甲基丙烯酸酯、新戊二醇二丙烯酸酯、乙二醇二甲基丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、二乙二醇二丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、四乙二醇二甲基丙烯酸酯、四乙二醇二丙烯酸酯、丁二醇二甲基
丙烯酸酯、丁二醇二丙烯酸酯、二丙二醇二甲基丙烯酸酯、二丙二醇二丙烯酸酯等,但並非僅限於此。
以所述封裝體用組成物的總重量計,能夠溶解光起始劑的所述單體的含量可為0.1重量%至30重量%,但並非僅限於此,乃因所使用的單體的量可端視所使用的光起始劑的溶解度而有所變化。
根據本申請案示例性實施例的所述封裝體用組成物可另外包含此項技術中已知的單體以調整矽酮樹脂材料的固化速度。
所述單體的具體實例包括丙烯酸酯系單體、甲基丙烯酸酯系單體、矽氧烷系單體等,但並非僅限於此。
所述單體的實例包括三羥乙基丙烷乙氧基三丙烯酸酯、第三丁基(甲基)丙烯酸酯、1,5-戊二醇二(甲基)丙烯酸酯、N,N-二乙基胺基乙基(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、六亞甲基二醇二(甲基)丙烯酸酯、1,3-丙二醇二(甲基)丙烯酸酯、十亞甲基二醇二(甲基)丙烯酸酯、1,4-環己二醇二(甲基)丙烯酸酯、2,2-二羥甲基丙烷二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、聚氧乙基化三羥甲基丙烷三(甲基)丙烯酸酯、2,2-二-(對羥苯基)丙烷二丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、2,2-二-(對羥苯基)丙烷二甲基丙烯酸酯、三乙二醇二丙烯酸酯、聚氧乙基-2,2-二-(對羥苯基)丙烷二甲基丙烯酸酯、
雙酚-A的二-(3-甲基丙烯醯氧基-2-羥丙基)醚、雙酚-A的二-(2-甲基丙烯醯氧基乙基)醚、雙酚-A的二-(3-丙烯醯氧基-2-羥丙基)醚、雙酚-A的二-(2-丙烯醯氧基乙基)醚、1,4-丁二醇的二-(3-甲基丙烯醯氧基-2-羥丙基)醚、三乙二醇二甲基丙烯酸酯、聚氧丙基三羥甲基丙烷三丙烯酸酯、丁二醇二(甲基)丙烯酸酯、1,2,4-丁三醇三(甲基)丙烯酸酯、2,2,4-三甲基-1,3-戊二醇二(甲基)丙烯酸酯、1-苯基乙烯-1,2-二甲基丙烯酸酯、反丁烯二酸二丙烯酯、苯乙烯、1,4-苯二酚二甲基丙烯酸酯、1,4-二異丙烯基苯、1,3,5-三異丙烯基苯、矽酮系單體、矽酮丙烯酸酯系單體、矽酮胺基甲酸酯系單體等,但並非僅限於此。
另外,根據本申請案示例性實施例的所述封裝體用組成物可端視其使用而包含一或多種添加劑,例如固化觸媒、黏度調整劑、固化劑、分散劑、穩定劑及固化促進劑。該些添加劑可單獨使用或者以其二或更多者的混合物形式使用。
此外,根據本申請案示例性實施例的一種封裝體是藉由使用所述封裝體用組成物來表徵。更具體而言,根據本申請案示例性實施例的所述封裝體可包含:1)矽酮樹脂;2)一或多種水分吸收劑;3)一或多種光起始劑;以及4)能夠溶解所述光起始劑的單體。
在根據本申請案示例性實施例的所述封裝體中,對矽酮樹脂、水分吸收劑、光起始劑、能夠溶解光起始劑的單體等的說明與上述說明相同,且因此將省略其具體說明。
除了使用上述封裝體用組成物以外,根據本申請案示例性實施例的所述封裝體可利用此項領域中已知的方法來形成。更具體而言,所述封裝體可利用在基板上施加、塗佈或印刷所述封裝體用組成物的方法來形成,但所述方法並非僅限於此。
根據本申請案示例性實施例的所述封裝體用組成物的特徵在於,可製造可提高有機電子元件的使用壽命且有效地阻擋自外部引入的氧氣及水分等的封裝體。此外,用作相關技術中的封裝體的一般吸氣劑(getter)具有以下缺點:所述吸氣劑黏合至有機電子元件且接著與其他材料混合因而會喪失特性,或者因在黏合期間施加的壓力不均勻而無法維持已黏合表面之間的間隙。然而,根據本申請案示例性實施例的所述封裝體用組成物的特徵在於,在將所述組成物黏合至有機電子元件之後可良好地維持所述間隙,此乃因使用可固化組成物而被固化的材料具有強度且因此即使施加壓力所述間隙亦不容易被改變。
根據本申請案示例性實施例的所述封裝體可應用於封裝及保護各種物體者。具體而言,所述封裝體可有效地保護包括對外部因素(例如,水分及濕氣)敏感的元件的物體。可應用封裝體的物體的實例包括:光伏打元件、整流器、傳送器或例如有機發光二極體(OLED)等有機電子元件;太陽電池;或者二次電池等,但並非僅限於此。
所述封裝體可高效地固定及支撐上部基板及下部基板同時在有機電子元件中表現出優異的水分阻擋特性及光學特性。另
外,由於藉由將水分吸收劑製備成奈米單位大小且將所述水分吸收劑均勻地分散於所述封裝體用組成物中而使所述封裝體表現出優異的透明度,因此無論有機電子元件的類型(例如頂部發射或底部發射)如何,所述封裝體均可被形成為穩定的封裝體。
除了封裝體是由上述材料形成以外,有機電子元件可設置有此項技術中已知的典型構型。舉例而言,可使用此項技術中常用的玻璃、金屬或聚合物膜等作為下部基板或上部基板。此外,有機電子元件可包括例如一對電極以及在所述一對電極之間形成的有機材料層。此處,所述一對電極中的一者可由透明電極形成。
此外,所述有機材料層可包括例如電洞傳輸層、發光層、電子傳輸層等。
以下,將藉由實例更詳細地闡述本說明書。然而,提供以下實例僅是為了例示本說明書,而並非旨在限制本說明書。
<實例>
<實例1>
將41.4克矽酮樹脂(1)(甲基丙烯酸酯聚二甲基矽氧烷,奧德裏奇公司(Aldrich))、45克水分吸收劑(CaO,吉澤石灰工業有限公司(Yoshizawa Lime Industry Co.,Ltd.))及3.6克巴斯夫歐洲公司(BASF SE)的光起始劑(豔佳固(Irgacure)369)溶解在了含量為10重量%的α-甲基丙烯醯氧基-γ-丁內酯(alpha-methacryloxy-gamma-butyrolactone,GBLMA)中且主要利用糊劑混合機(paste mixer)進行了混合。將經混合組成物放入至
3輥磨機中,且執行研磨製程三次以製備吸氣劑用黏合劑組成物。
以所述混合物裝滿160立方公分的注射器,且接著利用離心機充分移除了氣泡,並且在室溫下在無水氮氣氣氛下將所產生的混合物儲存於手套箱中。
<實例2>
除了在實例1中將光起始劑溶解在含量為10重量%的1,6-己二醇二甲基丙烯酸酯(1,6-hexanediol dimethacrylate,HDDA)中以外,利用與實例1相同的方法製備了組成物。
<比較例1>
除了在實例1中不使用可溶性單體而將光起始劑直接引入至組成物中且接著用矽酮樹脂代替了未使用的單體的重量部分以外,利用與實例1相同的方法製備了組成物。
<比較例2>
除了在實例1中將矽酮樹脂(1)變為41.4克由美源有限公司(Miwon Co.,Ltd)製造的丙烯酸樹脂以外,利用與實例1相同的方法製備了組成物。
<比較例3>
除了在實例1中將矽酮樹脂(1)變為1克甲基丙烯酸酯聚二甲基矽氧烷(奧德裏奇公司)且將水分吸收劑(CaO,吉澤公司)的重量變為85.4克以外,利用與實例1相同的方法製備了組成物。
<比較例4>
除了在實例1中將矽酮樹脂(1)變為81.4克甲基丙烯酸酯聚二甲基矽氧烷(奧德裏奇公司)且將水分吸收劑(CaO,吉澤公司)的重量變為5克以外,利用與實例1相同的方法製備了組成物。
對在實例1及實例2以及比較例1至比較例4中製備的組成物的特性進行了評估,且評估結果示於下表2中。
對於觸變指數(thixotropic index,T.I.),利用流變儀(rheometer)對依據於每一剪切速率(shear rate)的黏度進行了分析。所獲得的觸變指數為藉由除以在3 1/秒及30 1/秒下的黏度值而獲得的值。
對於固化能量,確定出在利用光流變儀(全方位固化)執行曝光以照射處於UV-A波長範圍內的紫外線時黏度增大,且將其中不發生黏度隨著時間增大的間隔確定為固化能量。
對於儲存壽命,藉由在40℃的條件下對每一樣本進行定位而週期性地確定出每一時間的黏度,且接著確定出黏度增大超過50%時的時間。
對於排放特性,利用具有20G大小的噴嘴並利用由武藏工程有限公司(Musashi Engineering Co.,Ltd.)製造的50立方公分的注射器在250千帕的壓力下將所述樣本排放10秒而獲得了所排放樣本的量,且確定了當排放量可被調整為0.0005克與0.003克之間時排放特性良好。
對於真空黏合可加工性,將樣本以線條形式施配在了厚度為0.5毫米的金剛玻璃上,且接著使用相同的玻璃將樣本黏合至金剛玻璃以具有100微米的間隙,將經黏合樣本留置於真空室中達1周,且確定了當施配線條的寬度不改變時,真空黏合可加工性良好。
對於水分吸收量,藉由以下方式獲得了3克每一樣本所吸收的水分的量:將3克每一樣本薄薄地鋪展在培養皿(petri dish)上,將樣本置於85%的相對濕度(Relative Humidity,RH)及85℃的條件下達7天,且然後確定出樣本的重量的變化。
藉由熱解器(pyrolyzer)對逸氣進行了取樣,且利用氣相層析/質譜分析(Gas Chromatography/mass spectrometry,GC/MS)
進行了分析。藉由在280℃的熱解器溫度及300℃的氣相層析烘箱溫度的條件下進行分析而獲得了逸氣。
如在所述結果中所述,根據本申請案示例性實施例的所述封裝體用組成物的特徵在於,可製備可提高有機電子元件的使用壽命且有效地阻擋自外部引入的氧氣及水分等的封裝體。此外,用作相關技術中的封裝體的一般組成物具有以下缺點:所述組成物黏合至有機電子元件且接著與其他材料混合因而會喪失特性,或者因在黏合期間施加的壓力不均勻而無法維持已黏合表面之間的間隙。然而,根據本申請案示例性實施例的所述封裝體用組成物的特徵在於,在將所述組成物黏合至有機電子元件之後可良好地維持所述間隙,此乃因使用可固化組成物而被固化的材料具有強度且因此即使施加壓力所述間隙亦不容易被改變。
Claims (9)
- 一種封裝體用組成物,包含:1)矽酮樹脂;2)一或多種水分吸收劑;3)一或多種光起始劑;以及4)能夠溶解所述光起始劑的單體,其中所述矽酮樹脂包括甲基丙烯酸酯聚二甲基矽氧烷,以及其中所述能夠溶解所述光起始劑的單體包括選自α-甲基丙烯醯氧基-γ-丁內酯和1,6-己二醇二甲基丙烯酸酯的群組中的一或多者。
- 如申請專利範圍第1項所述的封裝體用組成物,其中以所述封裝體用組成物的總重量計,所述矽酮樹脂的含量為1重量%至80重量%。
- 如申請專利範圍第1項所述的封裝體用組成物,其中所述水分吸收劑包括選自由以下組成的群組中的一或多者:金屬粉末、金屬氧化物、有機金屬氧化物、金屬鹽及五氧化二磷(P2O5)。
- 如申請專利範圍第1項所述的封裝體用組成物,其中以所述封裝體用組成物的總重量計,所述水分吸收劑的含量為10重量%至90重量%。
- 如申請專利範圍第1項所述的封裝體用組成物,更包含:一或多種選自由以下組成的群組的無機填料:黏土、滑石、 二氧化矽、硫酸鋇、氫氧化鋁、碳酸鈣、碳酸鎂、沸石、氧化鋯、二氧化鈦及蒙脫石。
- 如申請專利範圍第1項所述的封裝體用組成物,其中以所述封裝體用組成物的總重量計,所述光起始劑的含量為0.1重量%至10重量%。
- 如申請專利範圍第1項所述的封裝體用組成物,其中以所述封裝體用組成物的總重量計,所述能夠溶解所述光起始劑的單體的含量為0.1重量%至30重量%,且所述能夠溶解所述光起始劑的單體具有1,000或小於1,000的分子量。
- 一種封裝體,使用如申請專利範圍第1項至第7項中任一項所述的封裝體用組成物來形成。
- 一種有機電子元件,包括如申請專利範圍第8項所述的封裝體。
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TW201516084A (zh) * | 2013-07-19 | 2015-05-01 | Lg Chemical Ltd | 包封組成物 |
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AU2017263740A1 (en) | 2018-11-15 |
US10618997B2 (en) | 2020-04-14 |
WO2017196088A1 (ko) | 2017-11-16 |
EP3456785A4 (en) | 2019-12-18 |
US20190071531A1 (en) | 2019-03-07 |
EP3456785B1 (en) | 2021-10-20 |
EP3456785A1 (en) | 2019-03-20 |
CN109071947A (zh) | 2018-12-21 |
AU2017263740B2 (en) | 2020-03-12 |
KR20170127267A (ko) | 2017-11-21 |
TW201807070A (zh) | 2018-03-01 |
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