TWI712739B - Actuation system - Google Patents
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- TWI712739B TWI712739B TW108139895A TW108139895A TWI712739B TW I712739 B TWI712739 B TW I712739B TW 108139895 A TW108139895 A TW 108139895A TW 108139895 A TW108139895 A TW 108139895A TW I712739 B TWI712739 B TW I712739B
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Abstract
一種致動系統,包括一致動部、一壓電單元、一承載部、一調節層及一傳導單元。致動部包括一第一致動區、一第二致動區及位於兩致動區之間的至少一界面段。壓電單元包括電性互相絕緣的一第一訊號區及一第二訊號區。承載部與壓電單元位於同一平面之間,壓電單元設置於致動部的第一致動區,承載部設置於致動部的第二致動區。調節層位於壓電單元以及承載部同一側表面。傳導單元包括一第一傳導區及一第二傳導區,壓電單元的第一訊號區電性連結於傳導單元的第一傳導區,壓電元件的第二訊號區電性連結於傳導單元的第二傳導區。An actuation system includes an actuation part, a piezoelectric unit, a bearing part, an adjustment layer and a conduction unit. The actuation part includes a first actuation zone, a second actuation zone, and at least one interface section between the two actuation zones. The piezoelectric unit includes a first signal area and a second signal area that are electrically insulated from each other. The bearing part and the piezoelectric unit are located between the same plane, the piezoelectric unit is arranged in the first actuation zone of the actuation part, and the bearing part is arranged in the second actuation zone of the actuation part. The adjustment layer is located on the same side surface of the piezoelectric unit and the carrying part. The conduction unit includes a first conduction area and a second conduction area. The first signal area of the piezoelectric unit is electrically connected to the first conduction area of the conduction unit, and the second signal area of the piezoelectric element is electrically connected to the conduction unit. The second conduction area.
Description
本發明是有關於一種致動系統,特別是指一種透過調節層設計使致動系統整體組成結構具平整度之致動裝置。 The present invention relates to an actuating system, in particular to an actuating device that makes the overall structure of the actuating system flat through the design of the adjustment layer.
壓電泵是一種新型的流體驅動器,其無需附加驅動電機,僅透過電陶瓷的逆壓電效應便能使壓電振子產生變形,再依據前述變形產生泵腔的容積變化以實現流體輸出,或者透過壓電振子產生波動來傳輸流體,因此壓電泵已逐漸取代傳統泵而廣泛地應用於電子、生醫、航太、汽車以及石化等產業。 Piezoelectric pump is a new type of fluid driver. It does not require an additional drive motor. It only deforms the piezoelectric vibrator through the inverse piezoelectric effect of the electroceramic, and then changes the volume of the pump cavity according to the aforementioned deformation to achieve fluid output, or Piezoelectric vibrators produce fluctuations to transfer fluids. Therefore, piezoelectric pumps have gradually replaced traditional pumps and are widely used in electronics, biomedical, aerospace, automotive, and petrochemical industries.
一般來說,壓電泵是由壓電單元以及泵體所組成,其中當通電至壓電單元時,壓電單元會在電場作用下徑向壓縮,並於其內部產生拉應力而彎曲變形。當壓電單元正向彎曲時,泵體的腔室(以下稱泵腔)的容積便會增大,使得泵腔內的壓力減小,以令流體自入口流入泵腔。另一方面,當壓電單元向反向彎曲時,泵腔的容積減小,使得泵腔內的壓力增大,以令泵腔內的流體被擠壓而自出口排出。目前,用來供電至壓電單元的訊號傳導層通常為立體結構,且外加於泵體外部,整體體積較大且較容易受損,當使用正負電極分開焊接製程,對於焊點可靠度不一致性,常影 響壓電泵品質及效能表現,另,位於泵体外部之焊點突出物,易與外物接觸,導致泵體功能異常及異音發生。 Generally speaking, a piezoelectric pump is composed of a piezoelectric unit and a pump body. When the piezoelectric unit is energized, the piezoelectric unit compresses radially under the action of an electric field, and generates tensile stress in the piezoelectric unit to bend and deform. When the piezoelectric unit is bent forward, the volume of the cavity of the pump body (hereinafter referred to as the pump cavity) will increase, so that the pressure in the pump cavity will decrease, so that fluid flows into the pump cavity from the inlet. On the other hand, when the piezoelectric unit is bent in the reverse direction, the volume of the pump cavity decreases, so that the pressure in the pump cavity increases, so that the fluid in the pump cavity is squeezed and discharged from the outlet. At present, the signal conductive layer used to supply power to the piezoelectric unit is usually a three-dimensional structure and is added to the outside of the pump body. The overall volume is relatively large and easily damaged. When the positive and negative electrodes are used to separate the welding process, the reliability of the solder joints is not consistent. , Changying It affects the quality and performance of the piezoelectric pump. In addition, the solder joint protrusions located on the outside of the pump body are easy to contact with foreign objects, resulting in abnormal pump body function and abnormal noise.
本發明提供一種致動系統,主要係於承載部、壓電單元與傳導單元之間設置調節層,透過泵體內部平面式電性連接,使致動系統整體外觀結構具高度平整性,不僅克服以往焊接製程可靠度降低之問題,更藉由內部平面式電性連接技術,達到致動系統外觀表面平整化及體積微型化之目的。 The present invention provides an actuation system, which is mainly connected with an adjustment layer provided between a bearing part, a piezoelectric unit and a conduction unit. Through the internal planar electrical connection of the pump body, the overall appearance of the actuation system is highly flat, which not only overcomes In the past, the reliability of the welding process was reduced, and the internal planar electrical connection technology was used to achieve the goal of smoothing the appearance of the actuator system and miniaturizing the volume.
本發明的一種致動系統,包括一致動部、一壓電單元、一承載部、一調節層及一傳導單元。致動部包括一第一致動區、一第二致動區及位於第一致動區及第二致動區之間的至少一界面段。壓電單元具有一第一訊號區、一第二訊號區,該第一訊號區及第二訊號區互相電性絕緣。承載部與壓電元件位於同一平面,且壓電單元及承載部均位於致動部的同一側方向表面上,壓電單元設置於致動部的第一致動區,承載部設置於致動部的第二致動區。調節層位於壓電單元以及承載部同一側方向表面。傳導單元包括一第一傳導區及一第二傳導區,壓電單元的第一訊號區電性連結於傳導單元的第一傳導區,壓電元件的第二訊號區電性連結於傳導單元的第二傳導區。 An actuation system of the present invention includes an actuation part, a piezoelectric unit, a bearing part, an adjustment layer and a conduction unit. The actuation part includes a first actuation zone, a second actuation zone, and at least one interface section between the first actuation zone and the second actuation zone. The piezoelectric unit has a first signal area and a second signal area, and the first signal area and the second signal area are electrically insulated from each other. The bearing portion and the piezoelectric element are located on the same plane, and the piezoelectric unit and the bearing portion are located on the same side surface of the actuating portion. The piezoelectric unit is arranged in the first actuation area of the actuating portion, and the bearing portion is arranged in the actuating portion. Section of the second actuation zone. The adjustment layer is located on the same side surface of the piezoelectric unit and the carrying part. The conduction unit includes a first conduction area and a second conduction area. The first signal area of the piezoelectric unit is electrically connected to the first conduction area of the conduction unit, and the second signal area of the piezoelectric element is electrically connected to the conduction unit. The second conduction area.
在本發明的一實施例中,上述的傳導單元更包括一絕緣層、一傳導層及一基材,該傳導單元係由絕緣層、傳導層及基材 堆疊組成。 In an embodiment of the present invention, the above-mentioned conductive unit further includes an insulating layer, a conductive layer, and a substrate. The conductive unit is composed of the insulating layer, the conductive layer, and the substrate. Stacked composition.
在本發明的一實施例中,上述的調節層具導電特性。 In an embodiment of the present invention, the aforementioned adjustment layer has conductive characteristics.
在本發明的一實施例中,上述的調節層係用以控制致動系統整體組成結構平整度。 In an embodiment of the present invention, the above-mentioned adjustment layer is used to control the flatness of the overall structure of the actuation system.
在本發明的一實施例中,上述的基材透過調節層控制,使基材具有一平整表面。 In an embodiment of the present invention, the above-mentioned substrate is controlled by the adjustment layer so that the substrate has a flat surface.
在本發明的一實施例中,上述的壓電單元、承載部、調節層及傳導單元均位於致動部同一側方向。 In an embodiment of the present invention, the piezoelectric unit, the carrying portion, the adjustment layer, and the conductive unit are all located in the same side direction of the actuating portion.
在本發明的一實施例中,壓電單元的第一訊號區、致動部的第一致動區、至少一界面段、第二致動區、承載部、調節層、傳導單元的第一傳導區之間形成第一導電路徑。 In an embodiment of the present invention, the first signal area of the piezoelectric unit, the first actuation area of the actuation portion, at least one interface section, the second actuation area, the carrying portion, the adjustment layer, and the first actuation area of the conductive unit A first conductive path is formed between the conductive regions.
在本發明的一實施例中,壓電單元的第二訊號區、調節層、傳導單元的第二傳導區之間形成第二導電路徑。 In an embodiment of the present invention, a second conductive path is formed between the second signal region of the piezoelectric unit, the adjustment layer, and the second conductive region of the conductive unit.
基於上述,本發明的致動系統將壓電單元、承載部、調節層及傳導單元統一配置於致動部同一側方向,降低致動系統整體結構高度。配合調節層控制致動系統各組成元件結構平整度,進而使基材具有一平整表面,提高及穩定致動系統的工作效能。 Based on the above, the actuation system of the present invention arranges the piezoelectric unit, the bearing part, the adjustment layer, and the conduction unit in the same side direction of the actuation part, thereby reducing the overall structural height of the actuation system. Cooperate with the adjustment layer to control the flatness of the structure of each component of the actuation system, so that the base material has a flat surface, which improves and stabilizes the working efficiency of the actuation system.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
100、100a:致動系統 100, 100a: Actuation system
110:致動部 110: Actuation Department
112:第一致動區 112: The first actuation zone
114:第二致動區 114: second actuation zone
116:界面段 116: interface segment
120:承載部 120: bearing part
130:壓電單元 130: Piezoelectric unit
132:第一面 132: The first side
134:第一訊號區 134: The first signal area
136:第二面 136: The Second Side
138:第二訊號區 138: The second signal area
140:傳導單元 140: Conduction unit
141:第一電極 141: first electrode
141a:第一傳導區 141a: first conduction zone
143:第二電極 143: second electrode
143b:第二傳導區 143b: second conduction zone
144:絕緣層 144: Insulation layer
145:傳導層 145: Conductive layer
146:基材 146: Substrate
146a:平整表面 146a: flat surface
150:調節層 150: adjustment layer
圖1是依照本發明的第一實施例的一種致動系統的示意圖。 Fig. 1 is a schematic diagram of an actuation system according to a first embodiment of the present invention.
圖2是圖1的致動系統的爆炸示意圖。 Fig. 2 is an exploded schematic diagram of the actuation system of Fig. 1.
圖3是圖1的致動系統的另一視角爆炸示意圖。 Fig. 3 is an exploded schematic diagram of the actuation system of Fig. 1 from another perspective.
圖4是圖1的致動系統的A-A線剖面示意圖。 Fig. 4 is a schematic cross-sectional view taken along line A-A of the actuation system of Fig. 1.
圖5是圖4的一局部放大示意圖。 Fig. 5 is a partial enlarged schematic view of Fig. 4.
圖6是依照本發明的第二實施例的一種致動系統的剖面示意圖。 Fig. 6 is a schematic cross-sectional view of an actuation system according to a second embodiment of the present invention.
圖1是依照本發明的第一實施例的一種致動系統的示意圖。圖2是圖1的致動系統的爆炸示意圖。圖3是圖1的致動系統的另一視角爆炸示意圖。圖4是圖1的致動系統的A-A線剖面示意圖。圖5是圖4的一局部放大示意圖。請參閱圖1至圖5,本實施例的致動系統100包括一致動部110、一壓電單元130、一承載部120、一調節層150及一傳導單元140。下面對致動系統100進行詳細地說明。
Fig. 1 is a schematic diagram of an actuation system according to a first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of the actuation system of Fig. 1. Fig. 3 is an exploded schematic diagram of the actuation system of Fig. 1 from another perspective. Fig. 4 is a schematic cross-sectional view taken along line A-A of the actuation system of Fig. 1. Fig. 5 is a partial enlarged schematic view of Fig. 4. Referring to FIGS. 1 to 5, the
請參閱圖2,在本實施例中,致動部包括一第一致動區112、一第二致動區114及位於第一致動區112及第二致動區114之間的至少一界面段116。第一致動區112可相對於第二致動區114作動。此外,在本實施例中,致動部110的材質可為金屬材質、導電性材質組成,但致動部110的材質不以此為限制。
Please refer to FIG. 2, in this embodiment, the actuation portion includes a
請參閱圖2及圖3,在本實施例中,壓電單元130具有互
相對應的一第一面132與一第二面136(請參閱圖3),壓電單元130包括電性隔絕的一第一訊號區134及位於相對表面之一第二訊號區138(請參閱圖3)。第一訊號區134位於第一面132,第二訊號區138位於第二面136。
2 and 3, in this embodiment, the
請參閱圖2,在本實施例中,壓電單元130的第一面132朝向致動部110。更明確地說,在本實施例中,壓電單元130固定於致動部110的第一致動區112,壓電單元130通電時會使致動部110的第一致動區112作動,進而帶動致動系統100產生振動。在本實施例中,壓電單元130的整體形狀可為片狀或任意幾何外形,而壓電單元130的外周緣輪廓可為圓形、環形、弧形、多角形、矩形、多邊形等,但壓電單元130的形狀並不以此為限制。
Referring to FIG. 2, in this embodiment, the
請參閱圖2,在本實施例中,致動系統100包括一承載部120,承載部120設置於致動部110的第二致動區114相對表面上。在本實施例中,壓電單元130的第一訊號區134接觸到致動部110的第一致動區112進行電性傳導,承載部120固定於致動部110的第二致動區114。承載部120可為金屬材質、導電性材質組成,或於承載部120塗佈導電性原料,但承載部120的材質不以此為限制。
Please refer to FIG. 2, in this embodiment, the
請參閱圖4,在本實施例中,致動系統100包括一調節層150,調節層150設置於壓電單元130以及承載部120同一側方向表面上,其中調節層150係選擇具導電特性之材質,例如:導電體、膠體、粉粒、彈性體、異方性導電材質等材料所組成,透過
控制調節層150層體厚度,進而使致動系統100整體結構具高度平整度。
4, in this embodiment, the
請參閱圖2及圖3,在本實施例中,傳導單元140設置於最底層,當傳導單元140通電時,電信號分別傳導輸入至第一電極141、第二電極143,其中第一電極141連通於第一傳導區141a,第二電極143連通於第二傳導區143b,依本發明之概念,不論承載部120、壓電單元130、調節部150及傳導單元140等各元件組成排序如何變化,只要能夠使壓電單元130的第一訊號區134電性連結於傳導單元140的第一電極141,第二訊號區138電性連結於第二電極143即可,結構上不以此實施例為限制。例如第一電極141於傳導單元140之外側周圍一第一傳導區141a,利用第一傳導區141a為媒介,使壓電單元130的第一訊號區134電性連結於傳導單元140的第一電極141;在本實施例中,第二電極143於傳導單元140之正中央處形成一第二傳導區143b,利用第二傳導區143b為媒介,使壓電單元130的第二訊號區138電性連結於傳導單元140的第二電極143,兩傳導區圖案均可任意變化所呈現之外觀形式,例如:長條形、圓弧形、三角形、多邊形等其他形狀,第一傳導區141a與第二傳導區143b之設置形狀與數量不以此實施例為限。綜合上述,本發明之第一傳導區141a與第二傳導區143b之設置形狀與構成數量於實際應用時,只要能使第一訊號區134電性連結於第一電極141,第二訊號區138電性連結於第二電極143即可,兩傳導區所設置之導電圖案的設置形狀與構成數量不以本實
施例為限制。
2 and 3, in this embodiment, the
請參閱圖4,在本實施例中,傳導單元140更包括一絕緣層144,一傳導層145及一基材146,其中傳導層145係由第一傳導區141a及第二傳導區143b組成,傳導單元140由絕緣層144、傳導層145及基材146依序堆疊組成,本實施例之第一傳導區141a及第二傳導區143b均位於同一平面,但不以此為限,透過調節層150之厚度調整,使傳導單元140整體厚度及平整性一致。絕緣層144厚度小於或等於(≦)1公釐(mm)。基材146透過調節層150厚度調整,使基材146具有一平整表面146a。
4, in this embodiment, the
請參閱圖5,為圖4的圓形圈選處之局部放大示意圖。在本實施例中,傳導單元140依序由絕緣層144、傳導層145及基材146組成。透過調節層150進行厚度調整,使傳導單元140整體結構厚度一致。並透過絕緣層144使傳導層145之導電區域互相隔離絕緣。基材146位於傳導單元140底面,並透過調節層150形成一平整表面146a,使組合後之傳導單元140平整結合於致動系統100組成構件表面。
Please refer to FIG. 5, which is a partial enlarged schematic diagram of the circle selected in FIG. 4. In this embodiment, the
在本實施例中,經上述配置設計使壓電單元130的第一訊號區134、致動部110的第一致動區112、至少一界面段116、第二致動區114、承載部120、調節層150、傳導單元140的第一電極141之間形成第一導電路徑。壓電單元130的第二訊號區138、調節層150、傳導單元140的第二電極143之間形成第二導電路徑。
In this embodiment, the
下面介紹其他形式的致動系統100a。與前一實施例相同或相近的元件以相同或相近的符號表示,不再多加贅述,下面僅就不同實施例之間的主要差異之處進行說明。圖6是依照本發明的第二實施例的一種致動系統的剖面示意圖。請共同參閱圖4及圖6,本實施例的致動系統100b與前一實施例的致動系統100的主要差異在於,致動部110之第二致動區114與承載部120為一體成形結構,亦即致動部110與承載部120為同一結構,使致動部110之第二致動區114的厚度,相較於第一致動區112的厚度明顯增加,配合調節層150與傳導單元140之導電路徑,同樣可使致動系統100a具有較高之振動效率。
Other types of actuation system 100a are described below. Elements that are the same or similar to those of the previous embodiment are represented by the same or similar symbols, and will not be repeated. The following only describes the main differences between the different embodiments. Fig. 6 is a schematic cross-sectional view of an actuation system according to a second embodiment of the present invention. 4 and 6 together, the main difference between the actuation system 100b of this embodiment and the
請參閱圖6,在本實施例中,致動部110之第一致動區112與第二致動區114的厚度,可因應壓電單元130、承載部120、調節層150、傳導單元140所形成之導電路徑作配置變化,第一致動區112與第二致動區114各別之結構厚度可隨時進行調整,在前一實施例中,請參閱圖4,第一致動區112與第二致動區114的厚度相同,本實施例中,請參閱圖6,因致動部110與承載部120為一體成形結構,所以第一致動區112與第二致動區114的厚度不相同,顯示依據本發明之設計概念,第一致動區112與第二致動區114的厚度結構得以任意變化。
Please refer to FIG. 6, in this embodiment, the thicknesses of the
綜上所述,本發明的致動系統透過將壓電單元130、承載部120、調節層150及傳導單元140配置於致動部110同一側方向,調節層150控制致動系統100整體組成結構平整度,並使基材146
具有一平整表面,相較於習知的多層致動系統組成結構,本實施例的致動系統100除具有較薄的整體厚度,結構微型化,另致動系統100整體結構具有高平整度特性,可有效增加致動系統驅動效率
In summary, the actuation system of the present invention disposes the
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
100:致動系統 100: Actuation system
110:致動部 110: Actuation Department
112:第一致動區 112: The first actuation zone
114:第二致動區 114: second actuation zone
116:界面段 116: interface segment
120:承載部 120: bearing part
130:壓電單元 130: Piezoelectric unit
134:第一訊號區 134: The first signal area
138:第二訊號區 138: The second signal area
140:傳導單元 140: Conduction unit
141a:第一傳導區 141a: first conduction zone
143b:第二傳導區 143b: second conduction zone
144:絕緣層 144: Insulation layer
145:傳導層 145: Conductive layer
146:基材 146: Substrate
146a:平整表面 146a: flat surface
150:調節層 150: adjustment layer
Claims (8)
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101785124A (en) * | 2007-05-25 | 2010-07-21 | 波音公司 | Structural health monitoring (SHM) transducer assembly and system |
WO2015125843A1 (en) * | 2014-02-21 | 2015-08-27 | 株式会社村田製作所 | Fluid control device and pump |
US20180187797A1 (en) * | 2017-01-05 | 2018-07-05 | Microjet Technology Co., Ltd. | Fluid control device |
TWM570535U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Piezoelectric driving device |
TWM570536U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Fluid driving system |
TWM570534U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Fluid driving device |
TWM591571U (en) * | 2019-11-04 | 2020-03-01 | 科際精密股份有限公司 | Actuating system |
-
2019
- 2019-11-04 TW TW108139895A patent/TWI712739B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101785124A (en) * | 2007-05-25 | 2010-07-21 | 波音公司 | Structural health monitoring (SHM) transducer assembly and system |
WO2015125843A1 (en) * | 2014-02-21 | 2015-08-27 | 株式会社村田製作所 | Fluid control device and pump |
US20180187797A1 (en) * | 2017-01-05 | 2018-07-05 | Microjet Technology Co., Ltd. | Fluid control device |
TWM570535U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Piezoelectric driving device |
TWM570536U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Fluid driving system |
TWM570534U (en) * | 2018-08-13 | 2018-11-21 | 科際精密股份有限公司 | Fluid driving device |
TWM591571U (en) * | 2019-11-04 | 2020-03-01 | 科際精密股份有限公司 | Actuating system |
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