TWI710600B - Low-loss insulating resin composition and insulating film and product - Google Patents

Abstract

A low-loss insulating resin composition and an insulating film using the same and a product comprising the insulating film are provided by this invention. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

Description

Low-loss insulating resin composition, insulating film and product

This application requires the application of No. 10-2018-0054420 filed with the Korean Intellectual Property Office on May 11, 2018 and the Korean Patent Application No. 10-2018-0090960 filed with the Korean Intellectual Property Office on August 03, 2018. Rights, the entire disclosure of the Korean patent application is incorporated herein by reference for all purposes.

This application relates to a low-loss insulating resin composition and an insulating film using the low-loss insulating resin composition.

It is necessary to realize high-density integrated electronic components in a small area of a printed circuit board on which electronic components are mounted, and a panel-level package module that uses a board manufacturing process is required to respond to the development of lighter, thinner, and smaller electronic components development of.

Therefore, there is also a need for high-performance materials for multilayer printed wiring boards and packages including the materials. In addition, with the development of 5G technology, there is an increasing demand for low-loss insulating materials and molding materials in substrates and packages, as well as design changes to minimize the loss of high-frequency signals.

In order to transmit signals at high speeds, it is necessary to use materials with a small dielectric constant. In order to minimize transmission signal loss, materials with a low dielectric loss factor should be used.

Generally, the molding material used for the package is mainly a granular type or a liquid type. In order to use such molding materials, expensive compression molding equipment may be required and processing time may be extended. Therefore, it is necessary to develop film-type molding materials such as insulating materials for printed circuits to overcome these disadvantages. When a film-type molding material is used as a molding material for a package, relatively inexpensive vacuum lamination equipment can be utilized, and it is also possible to reduce processing time because the molding process and the hardening process can be separated.

With the development of high-speed wireless communication technology, a communication method using high frequency has attracted attention. In a high frequency antenna package on which a high frequency circuit operating in a high frequency band (such as a microwave band or a millimeter wave band) is installed, signal loss should be minimized in signal processing, and excellent stability and reliability are required at the same time .

The content of the present invention is provided to introduce the selected concept in a simplified form, and the concept is further described in the following specific embodiments. This summary is neither intended to limit the key features or essential features of the claimed subject matter, nor is it intended to be used to illustrate the determination of the scope of the claimed subject matter.

In a general aspect, a low-loss insulating resin composition includes: an epoxy resin compound including a cyanate ester resin, a biphenyl aralkyl novolak resin and a fluorine-containing epoxy resin; an active ester hardener; a thermoplastic resin ; Hardening accelerator; filler; and viscosity enhancer.

The epoxy resin compound may include 40 to 60 parts by weight of the cyanate ester resin, 15 to 35 parts by weight of the biphenyl aralkyl novolak resin, and 15 to 35 parts by weight of the fluorine-containing ring Oxy resin.

Based on the mixing equivalent of the epoxy resin compound, the active ester hardener may be included in an amount of 0.5 to 1.5 equivalents.

The thermoplastic resin may be included in an amount of 5 to 15 parts by weight based on 100 parts by weight of the epoxy resin compound and the active ester hardener.

The thermoplastic resin may be selected from polyvinyl acetal resins, phenoxy resins, polyimide resins, polyimide imide resins, polyether imide resins, polyether resins, polyether tert resins, At least one of polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, phenol resin, fluorine-based thermoplastic resin, and polyacetal resin.

The hardening accelerator may be selected from 2-ethyl-4-methylimidazole, 1-(2-cyanoethyl)-2-alkylimidazole, 2-phenylimidazole, dimethylaminopyridine (DMAP) ), at least one of 3,3'-thiodipropionic acid and 4,4'-thiodiphenol.

Based on 100 parts by weight of the epoxy resin compound, the hardening accelerator may be included in an amount of 0.1 to 1 part by weight.

The filler may be an inorganic filler, and based on 100 parts by weight of the epoxy resin compound, the filler may be included in an amount of 40 to 85 parts by weight.

The inorganic filler may be selected from barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead magnesium niobate-lead titanate, silver, nickel, nickel-coated polymer balls, At least one of gold-coated polymer balls, tin solder, graphite, tantalum nitride, metallic silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate.

The inorganic filler can be surface treated with a silane coupling agent.

Based on 100 parts by weight of the low-loss insulating resin composition, the viscosity enhancer may be included in an amount of 1 to 10 parts by weight.

The viscosity enhancer may be at least one of an organic viscosity enhancer and an inorganic viscosity enhancer.

The low-loss insulating resin composition may further include a surface modifier.

The insulating film may include the low-loss insulating resin composition.

The insulating film may be a molded film having a thickness of 200 μm or more.

The product may include the insulating film.

The product may be at least one of a substrate and an antenna package for a high-frequency antenna module.

The low-loss insulating resin composition may be cast on a polyethylene terephthalate film to form the insulating film.

The filler may be an inorganic filler.

Other features and aspects will be apparent from the following specific embodiments, drawings, and scope of patent applications.

The following detailed descriptions are provided to help readers gain a comprehensive understanding of the methods, devices and/or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices, and/or systems described herein will be apparent. For example, the order of operations described here is only an example, and is not limited to the order of operations set forth herein, but in addition to operations that must occur in a specific order, it can be done after understanding the disclosure of this application. The obvious change. In addition, in order to improve clarity and conciseness, descriptions of features known in the art may be omitted.

The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. More precisely, the examples described herein have been provided to illustrate only some of the many possible ways of implementing the methods, devices and/or systems described herein that will be obvious after understanding the disclosure of this application .

Throughout this specification, when an element such as a layer, region, or substrate is described as being "on", "connected to" or "coupled to" another element, the element can be directly "on" "Another element is "on", "connected to" or "coupled to" another element, or there may be one or more other elements in between. In contrast, when a component is described as being “directly on” another component, “on”, “directly connected to” another component, or “directly coupled to” another component, there may be no other components in between. element.

The term "and/or" as used herein includes any one of the related listed items and any combination of any two or more.

Although terms such as "first", "second" and "third" may be used herein to describe various members, elements, regions, layers or sections, these members, elements, regions, layers or sections are not subject to these terms limit. More precisely, these terms are only used to distinguish one member, element, region, layer or section from another member, element, region, layer or section. Therefore, without departing from the teaching of the examples, the first member, element, region, layer or section in the examples described herein may also be referred to as the second member, element, region, layer or section.

For ease of description, spatially relative terms such as "above", "above", "below", and "below" can be used here to describe the relationship between one element and another element as shown in the diagram. relationship. This spatial relative term is intended to include not only the orientation depicted in the drawings, but also the different orientations of the device in use or operation. For example, if the device in the drawing is turned over, an element described as "above" or "up" with respect to another element will then be "below" or "below" with respect to another element. Therefore, the term "above" can include both upward and downward orientations according to the spatial orientation of the device. The device can also be positioned in other ways (for example, rotated 90 degrees or in other orientations), and the spatial relative terms used herein can be explained accordingly.

The terms used here are only used to describe various examples, and are not used to limit the present disclosure. Unless the context clearly dictates otherwise, articles in the singular form are also intended to include the plural form. The terms "comprising", "including" and "having" enumerate the stated features, quantities, operations, components, elements and/or their combinations, but do not exclude the presence or addition of one or more other features, quantities, operations , Components, elements and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, variations in the shapes shown in the drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shapes that occur during manufacturing.

Throughout the description of the present disclosure, when describing a certain technology is determined to circumvent the gist of the present disclosure, the related detailed description will be omitted.

In the following description, well-known functions or structures are not described in detail because they may obscure the present invention with unnecessary details.

The features of the examples described herein can be combined in various ways that will become apparent after understanding the disclosure of this application. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the disclosure of this application are possible. A. Insulating resin composition

The low-loss insulating resin composition according to the example may include: (a) an epoxy resin compound containing 40 to 60 parts by weight of cyanate ester resin, 15 to 35 parts by weight of biphenyl aralkyl novolak resin, and 15 to 35 parts by weight of fluorine-containing epoxy resin; (b) hardener; (c) thermoplastic resin; (d) hardening accelerator; (e) filler; (f) viscosity enhancer; and (g) additive. ( A ) Epoxy resin compound cyanate ester resin

Based on the total weight of the epoxy resin compound, the epoxy resin compound may include, but is not limited to, a cyanate resin in an amount of 40 to 60 parts by weight. When the amount of the cyanate ester resin is less than 40 parts by weight, reactivity and curability may be insufficient. On the other hand, when the amount of the cyanate ester resin exceeds 60 parts by weight, reaction control becomes difficult and hardening may be accelerated or plasticity may be deteriorated. The cyanate ester resin may include, but is not limited to, dicyclopentadienyl-bisphenol or tetramethylbiphenyl. Biphenyl aralkyl novolac resin

The epoxy resin compound may include a biphenyl aralkyl novolak resin to provide a cured product with high heat resistance. Since biphenyl has a symmetric structure, the biphenyl aralkyl novolak resin may have excellent physical properties and crystallinity, specifically, many excellent physical properties such as low melt viscosity, low stress, and high adhesion. Based on the total weight of the epoxy resin compound, the amount of the biphenyl aralkyl novolak resin in the epoxy resin compound may be, but is not limited to, 15 to 35 parts by weight. When the amount of the biphenyl aralkyl novolak resin is less than 15 parts by weight, it is difficult to impart sufficient heat resistance in the insulating film. On the other hand, when the amount of biphenyl aralkyl novolak resin exceeds 35 parts by weight, curability may be deteriorated. The fluorine-containing epoxy resin

Based on the total weight of the epoxy resin compound, the amount of the fluorine-containing epoxy resin in the epoxy resin compound may be, but is not limited to, 15 to 35 parts by weight.

When the amount of the fluorine-containing epoxy resin is less than 15 parts by weight, specific properties of the insulating film such as heat resistance, high temperature resistance, and high humidity resistance, and chemical resistance may be insufficient. On the other hand, when the amount of the fluorine-containing epoxy resin exceeds 35 parts by weight, solidification may occur due to the difference in polarity associated with the difference in electronegativity of the resin composition, and due to the increase in the use of expensive fluorine-containing epoxy resin, Production costs may increase. The fluorine-containing epoxy resin can be, but is not limited to, selected from polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer (PFA), fluorinated ethylene-propylene copolymer (FEP), chlorotrifluoroethylene (CTFE), At least one of tetrafluoroethylene/chlorotrifluoroethylene copolymer (TFE/CTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE) and polychlorotrifluoroethylene (PCTFE) A kind of powder.

Among the above fluorine-containing epoxy resins, the powder of polytetrafluoroethylene (PTFE) resin with extremely low dielectric constant, dielectric loss factor and high glass transition temperature (Tg) can be used to ensure dielectric properties and due to the addition of The powder of fluoroepoxy resin minimizes the deterioration of the physical properties of the composition. ( B ) Hardener

The hardener included in the exemplary insulating resin composition disclosed herein may be an active ester to improve low dissipation factor characteristics. The active ester hardener may be, but is not limited to, compounds having two or more highly active ester groups, such as phenol esters, thiophenol esters, N-hydroxylamine esters, esters of heterocyclic hydroxyl compounds, and the like. Although not limited thereto, the active ester hardener may include a dicyclopentadienyl bisphenol structure. The hardener may be mixed in an equivalent ratio of 0.5 to 1.5 with respect to the mixing equivalent of the epoxy resin compound, preferably, the equivalent ratio is 1.0, but is not limited thereto. When the equivalent ratio of the hardener is less than 0.5, the low dissipation factor characteristics and flame retardancy of the insulating resin composition may be deteriorated. On the other hand, when the equivalent ratio is greater than 1.5, adhesiveness and storage stability may be deteriorated. ( C ) Thermoplastic resin

The thermoplastic resin contained in the insulating resin composition of the present disclosure may be added in an amount of 5 to 15 parts by weight based on the combined amount of the epoxy resin compound and the active ester hardener to improve elongation and adhesion to wiring materials , But not limited to this.

The thermoplastic resin can be selected from polyvinyl acetal resin, phenoxy resin, polyimide resin, polyimide resin, polyetherimide resin, polyether resin, polyetherether resin, polyphenylene At least one of ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, phenol resin, fluorine-based thermoplastic resin, and polyacetal resin, but is not limited thereto.

When a polyvinyl acetal resin is used as the thermoplastic resin of the present disclosure, a functional group capable of forming a chelate bond with copper (Cu) may be partially contained in the polyvinyl acetal resin. The functional group forming a chelate bond with copper (Cu) may be a carboxyl group, a carbonyl group, and an ether group, and is preferably a carboxyl group. ( D ) Hardening accelerator

The hardening accelerator included in the insulating resin composition of the present disclosure may be, but is not limited to, imidazole or dimethylaminophenyl. Examples of hardening accelerators may include 2-ethyl-4-methylimidazole, 1-(2-cyanoethyl)-2-alkylimidazole, 2-phenylimidazole, dimethylaminopyridine (DMAP), At least one of 3,3'-thiodipropionic acid and 4,4'-thiodiphenol. The hardening accelerator may include an amount of 0.1 to 1 part by weight based on the total weight of the epoxy resin compound, more preferably an amount of 0.25 part by weight, but is not limited thereto. When the amount of the hardening accelerator is less than 0.1 parts by weight, the hardening rate may be significantly reduced. On the other hand, when the amount of the hardening accelerator exceeds 1 part by weight, hardening may occur quickly, and thus it may be difficult to obtain desired physical properties. ( E ) Packing

The inorganic filler contained in the resin composition of the present disclosure may be, but is not limited to, selected from barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead magnesium niobate-titanic acid At least one of lead, silver, nickel, nickel-coated polymer balls, gold-coated polymer balls, tin solder, graphite, tantalum nitride, metallic silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate.

The inorganic filler may be included in an amount of 40 to 85 parts by weight, and preferably in an amount of 65 to 80 parts by weight based on 100 parts by weight of the epoxy resin compound, in order to reduce the expansion rate of the low-loss insulating resin composition. When the amount of the inorganic filler is less than 40 parts by weight, there is a problem that the coefficient of thermal expansion increases. On the other hand, when the amount of the inorganic filler exceeds 85 parts by weight, it may be difficult to apply to substrate processes such as lamination.

The organic filler can be, but is not necessarily limited to polytetrafluoroethylene products.

In addition, the inorganic filler can be surface-treated with a silane coupling agent, and can preferably include fillers of different sizes and shapes. Although not limited to this, as the silane coupling agent, various amine groups, epoxy groups, acrylic groups, vinyl groups, and the like can be used. ( F ) Viscosity enhancer

The insulating film may include a viscosity enhancer to form a high-viscosity insulating composition. The viscosity enhancer may be, but is not limited to, an inorganic viscosity enhancer and/or an organic viscosity enhancer. Based on 100 parts by weight of the low-loss insulating resin composition, the viscosity enhancer may include 1 to 10 parts by weight, preferably 1 to 5 parts by weight, more preferably 1 to 3 parts by weight.

The organic viscosity enhancer can be selected from urea-modified polyamide wax, thixotropic resin, cellulose ether, starch, natural hydrocolloid, synthetic biopolymer, polyacrylate, alkali-activated acrylic emulsion, fatty acid alkaneamide At least one of, but not limited to.

Although not limited to this, the inorganic viscosity enhancer may be at least one selected from magnesium oxide, magnesium hydroxide, amorphous silica, and layered silicate.

Although not limited to this, the viscosity enhancer may be selected from inorganic viscosity enhancers, such as silica. Silica can effectively prevent precipitation without impairing the performance of the resin composition. ( G ) Additive

In the present disclosure, in addition to the composition listed above, if necessary, another hardening agent, another hardening accelerator, a leveling agent, a flame retardant, etc. may also be included, as long as it does not harm the expectations of the present disclosure. The performance can be. Although not limited to this, the insulating resin composition of the present disclosure may also include at least one additive such as surface modifiers, defoamers, thermoplastic resins, fillers, softeners, plasticizers, antioxidants, flame retardants, Combustion additives, lubricants, antistatic agents, colorants, heat stabilizers, light stabilizers, UV absorbers, coupling agents or anti-settling agents.

Although not limited to this, the insulating resin composition of the present disclosure may use different solvents with different boiling points for coating and film formation of the insulating resin composition, and include additives such as surface tension control agents, defoamers, thermoplastic resins Wait. B. Insulating film

The insulating resin composition of the examples of the present disclosure can be used to prepare an insulating film having improved moisture absorption, reliability, thermal stability, and mechanical properties.

The insulating film may be applied to the buildup layer of the printed circuit board 110 of the package 100 of FIG. 1, the molding layer of PLP, and the backside redistribution layer (RDL).

The insulating film may be a molded film having a thickness of 200 μm or more. In this case, by using the insulating resin composition of the present disclosure and adding a surface modifier and a viscosity enhancer, a film having a thickness of 200 μm or more can be easily manufactured.

The insulating film may be a molded film having a Cu adhesion force of 0.5 kgf/cm ² or higher.

According to the present disclosure, it is possible to provide a low-loss insulating resin composition that provides packaging stability and high reliability and forms a thick film.

Therefore, the use of the low-loss insulating resin composition of the present disclosure can form an insulating film having a very large thickness compared with ordinary insulating materials.

In addition, it is also possible to provide an antenna package and a substrate with excellent reliability based on the low-loss insulating resin composition of the present disclosure.

Hereinafter, although more detailed descriptions will be given by examples, these descriptions are only used for explanation and not for limiting the present disclosure. In the following examples, only examples of realizing specific compounds are exemplified. However, it is obvious to those skilled in the art that even when the equivalents of these compounds are used, the equivalents of similar compounds can be exhibited. Example Preparation of low-loss insulating resin composition

The insulating resin compositions of Example 1 and Comparative Examples 1 to 3 of the composition shown in Table 1 below were prepared. These insulating resin compositions include: epoxy resin compounds, including cyanate ester resins, biphenyl aralkyl groups Novolac resins and fluorine-containing epoxy resins; active ester-based hardeners; hardening accelerators; inorganic fillers; organic/inorganic viscosity enhancers; initiators; and additives.

More specifically, the hardener is added in an amount of 1.0 equivalent based on the epoxy resin compound, and a spherical amine-treated silica slurry with a size distribution of 500 nm to 5 μm is added and stirred at 300 rpm for 3 hours.

絕緣膜 的製備及機械性能評價 A hardening accelerator of dimethylaminopyridine (DMAP), a surface modification additive, and a viscosity enhancer were added to the mixture and further mixed for 1 hour to provide a low-loss insulating resin composition. The components of the insulating resin composition of Example 1 and Comparative Examples 1 to 3 are shown in Table 1 in detail. Table 1

Insulation film preparation and mechanical performance evaluation

The prepared high-viscosity low-loss insulating resin composition can be cast on a polyethylene terephthalate film (PET film) to a thickness greater than 200 μm to provide a roll-shaped film product used as a film-type molding material.

The evaluation results of the mechanical properties of the films prepared by the epoxy resin compositions of Example 1 and Comparative Examples 1 to 3 are shown in Table 2 below. Table 2

When evaluating the mechanical properties of the molding material, it was confirmed that the loss factor (Df) (tan δ) of the molding material of Example 1 was less than 0.003, the thermal expansion coefficient was less than 15 ppm/℃, the moisture content was less than 0.3 wt. The adhesion force is greater than 0.5kgf/cm ² .

As shown in Table 2, it was also confirmed that the insulating resin composition of Example 1 mixed with three resins has excellent dissipation factor (Df), thermal expansion coefficient, moisture content, and the insulating resin composition of Comparative Example 1 to Comparative Example 3 Adhesion to Cu.

When the insulating resin composition of Example 1 is used as a molding material for a package, as a result of the reliability evaluation of the package, the package satisfies the high accelerated stress test (HAST) and thermal loop (TC) reliability standards all of.

Therefore, the insulating film can be used as a low-loss molding material in a printed circuit board (PCB) 110 as shown in FIG. 1.

The prepared antenna package can reduce signal loss and improve blistering of the backside redistribution layer (RDL) after reflow soldering.

By using the low-loss insulating resin composition of the present disclosure, since it is easy to control the thickness during film casting, a thick film with a thickness of 200 μm or more can be manufactured, making the low-loss insulating resin composition suitable for packaging from small areas to Large area products.

On the other hand, when a general pellet type or liquid type molding material is used, expensive compression molding equipment may be required, and since molding and hardening are performed with one equipment, a long processing time may be required. However, by using the film-type molding material prepared from the low-loss insulating resin composition of the present disclosure, relatively inexpensive laminating equipment can be used, and hardening can be performed separately in a convection oven after molding, which can shorten the processing time And improve the productivity of the final product.

The film using the low-loss dielectric resin composition of the present disclosure has a low dielectric loss factor (tan δ) of less than 0.003, a low thermal expansion coefficient of less than 15 ppm/°C, a low moisture content of less than 0.3 wt.%, and a 0.5kgf/cm ² high adhesion to Cu.

The products of the above examples may be substrates or antenna packages for high-frequency antenna modules.

The low-loss insulating resin composition may have excellent reliability and adhesion, low loss factor characteristics, and improved thermal and mechanical properties due to its low moisture absorption performance.

It may be possible to use a low-loss insulating resin composition to provide an insulating film with a thick thickness that can ensure the stability and reliability of a printed circuit board or packaged product.

Thickness control during film casting can be easy, an insulating film having a thick thickness of 200 μm or more can be manufactured, and it can be used for packaging of products ranging from small size to large size.

It may be possible to provide a substrate and antenna package for a high-frequency antenna module using the insulating film to ensure excellent processability and reliability, low loss factor characteristics, and reduced signal loss.

It is possible to use relatively inexpensive equipment using insulating films, shorten the process time, and effectively increase the productivity of substrates and packages.

Although the present disclosure includes specific examples, after understanding the disclosure of the present application, it will be obvious that without departing from the scope of the patent application and the spirit and scope of its equivalents, formal and detailed changes can be made in these examples. Various changes. The examples described herein shall be considered as descriptive meanings only, and not for the purpose of limitation. Descriptions of features or aspects in each example will be considered applicable to similar features or aspects in other examples. If the described technology is performed in a different order, and/or if the elements in the described system, architecture, device, or circuit are combined in different ways and/or the described system is replaced or added by other elements or their equivalents, Structures, devices, or components in circuits can achieve appropriate results. Therefore, the scope of the present disclosure is not limited by the specific embodiments, but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents will be construed as being included in the present disclosure.

100‧‧‧Package 110‧‧‧Printed Circuit Board Part A‧‧‧

FIG. 1 is a schematic diagram showing an example of a package including a low-loss insulating resin composition, in which an insulating film is provided in the "A" part. Throughout the drawings and the specific embodiments, the same drawing symbols refer to the same elements. The drawings may not be drawn to scale, and for the sake of clarity, description and convenience, the relative sizes, proportions, and depictions of the elements in the drawings may be exaggerated.

100‧‧‧Package

110‧‧‧Printed Circuit Board

Part A‧‧‧

Claims (19)

A low-loss insulating resin composition comprising: Epoxy resin compound, including cyanate ester resin, biphenyl aralkyl novolac resin and fluorine-containing epoxy resin; Active ester hardener; Thermoplastic resin Hardening accelerator Filler; and Viscosity enhancer. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the epoxy resin compound comprises 40 to 60 parts by weight of the cyanate ester resin and 15 to 35 parts by weight of the biphenyl Aralkyl novolak resin and 15 to 35 parts by weight of the fluorine-containing epoxy resin. The low-loss insulating resin composition according to the first item of the scope of patent application, wherein, based on the mixing equivalent of the epoxy resin compound, the active ester hardener is contained in an amount of 0.5 to 1.5 equivalents. The low-loss insulating resin composition according to the first item of the scope of the patent application, wherein, based on 100 parts by weight of the epoxy resin compound and the active ester hardener, the composition contains 5 to 15 parts by weight of the Thermoplastic resin. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the thermoplastic resin is polyvinyl acetal resin, phenoxy resin, polyimide resin, polyimide resin, Among polyether imide resins, polyether resins, polyether resins, polyphenylene ether resins, polycarbonate resins, polyether ether ketone resins, polyester resins, phenolic resins, fluorine-based thermoplastic resins, and polyacetal resins At least one. The low-loss insulating resin composition described in item 1 of the scope of patent application, wherein the hardening accelerator is 2-ethyl-4-methylimidazole, 1-(2-cyanoethyl)-2-alkyl At least one of imidazole, 2-phenylimidazole, dimethylaminopyridine, 3,3'-thiodipropionic acid, and 4,4'-thiodiphenol. The low-loss insulating resin composition as described in item 1 of the scope of the patent application, wherein the hardening accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin compound. The low-loss insulating resin composition as described in item 1 of the scope of the patent application, wherein the filler is an inorganic filler, and based on 100 parts by weight of the epoxy resin compound, contains 40 to 85 parts by weight of all Mentioned packing. The low-loss insulating resin composition according to item 8 of the scope of patent application, wherein the inorganic filler is barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead niobate Magnesium-lead titanate, silver, nickel, nickel-coated polymer balls, gold-coated polymer balls, tin solder, graphite, tantalum nitride, metallic silicon nitride, carbon black, silicon dioxide, clay, aluminum and aluminum borate At least one of. The low-loss insulating resin composition described in item 8 of the scope of patent application, wherein the inorganic filler is surface-treated with a silane coupling agent. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the viscosity enhancer is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the low-loss insulating resin composition. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the viscosity enhancer is at least one of an organic viscosity enhancer and an inorganic viscosity enhancer. According to the low-loss insulating resin composition described in item 1 of the scope of the patent application, the low-loss insulating resin composition further includes a surface modifier. The low-loss insulating resin composition described in item 1 of the scope of patent application, wherein the filler is an inorganic filler. An insulating film comprising the low-loss insulating resin composition according to any one of items 1-14 in the scope of the patent application. The insulating film according to the 15th patent application, wherein the insulating film is a molded film having a thickness of 200 μm or more. The insulating film according to claim 15, wherein the low-loss insulating resin composition is cast on a polyethylene terephthalate film to form the insulating film. A product comprising the insulating film as described in any one of items 15 to 17 in the scope of patent application. The product described in item 18 of the scope of patent application, wherein the product is at least one of a substrate and an antenna package for a high-frequency antenna module.

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