TW201946970A - Low-loss insulating resin composition and insulating film and product - Google Patents

Abstract

A low-loss insulating resin composition and an insulating film using the same and a product comprising the insulating film are provided by this invention. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

Description

Low loss insulating resin composition, insulating film and product

This application requires Korean Patent Application No. 10-2018-0054420, filed with the Korean Intellectual Property Office on May 11, 2018, and Korean Patent Application No. 10-2018-0090960, filed with the Korean Intellectual Property Office on August 03, 2018. The entire disclosure of the Korean patent application is incorporated herein by reference for all purposes.

The present application relates to a low-loss insulating resin composition and an insulating film using the low-loss insulating resin composition.

It is necessary to realize high-density integrated electronic components in a small area of a printed circuit board on which electronic components are mounted, and a panel-level package module using a board process is required to respond to lighter, thinner, and smaller electronic components. development of.

Therefore, there is also a need for high-performance materials for multilayer printed wiring boards and packages including the same. In addition, with the development of 5G technology, there is an increasing demand for low-loss insulation materials and molding materials and design changes in substrates and packages to minimize the loss of high-frequency signals.

In order to transmit a signal at a high speed, it is necessary to use a material having a small dielectric constant. To minimize transmission signal losses, materials with low dielectric loss factors should be used.

Generally, the molding material used for the package is mainly a granular type or a liquid type. To use such a molding material, expensive compression molding equipment may be required and processing time may be extended. Therefore, it is necessary to develop a film-type molding material such as an insulating material for a printed circuit to overcome these disadvantages. When a film-type molding material is used as a molding material for a package, a relatively inexpensive vacuum lamination apparatus can be utilized, and processing time can also be reduced because the molding process and the hardening process can be separated.

With the development of high-speed wireless communication technology, communication methods using high frequency have attracted attention. In a high-frequency antenna package in which a high-frequency circuit operating in a high frequency band (such as a microwave band or a millimeter wave band) is mounted, signal loss should be minimized in signal processing, and excellent stability and reliability are required .

This summary is provided to introduce a selection of concepts in a simplified form, and to further describe the concepts in the detailed description that follows. This summary is not intended to define key features or essential features of the claimed subject matter, nor is this summary intended to be used to define the scope of the claimed subject matter.

In a general aspect, a low-loss insulating resin composition includes: an epoxy resin compound including a cyanate resin, a biphenylaralkyl novolac resin, and a fluorine-containing epoxy resin; an active ester hardener; a thermoplastic resin ; Hardening accelerators; fillers; and viscosity enhancers.

The epoxy resin composite may include 40 to 60 parts by weight of the cyanate resin, 15 to 35 parts by weight of the biphenylaralkyl novolak resin, and 15 to 35 parts by weight of the fluorine-containing ring. Oxygen resin.

The active ester hardener may be included in an amount of 0.5 to 1.5 equivalents based on the mixed equivalent of the epoxy resin compound.

The thermoplastic resin may be included in an amount of 5 to 15 parts by weight based on 100 parts by weight of the epoxy resin composite and the active ester hardener.

The thermoplastic resin may be selected from the group consisting of a polyvinyl acetal resin, a phenoxy resin, a polyimide resin, a polyimide resin, a polyether imine resin, a polyether resin, a polyether resin, At least one of a polyphenylene ether resin, a polycarbonate resin, a polyetheretherketone resin, a polyester resin, a phenol resin, a fluorine-based thermoplastic resin, and a polyacetal resin.

The hardening accelerator may be selected from 2-ethyl-4-methylimidazole, 1- (2-cyanoethyl) -2-alkylimidazole, 2-phenylimidazole, dimethylaminopyridine (DMAP ), 3,3'-thiodipropionic acid, and 4,4'-thiodiphenol.

The hardening accelerator may be included in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite.

The filler may be an inorganic filler, and may include the filler in an amount of 40 to 85 parts by weight based on 100 parts by weight of the epoxy resin composite.

The inorganic filler may be selected from barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead magnesium niobate-lead titanate, silver, nickel, nickel-coated polymer balls, At least one of gold-coated polymer balls, tin solder, graphite, tantalum nitride, metal silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate.

The inorganic filler may be surface-treated with a silane coupling agent.

The viscosity enhancer may be included in an amount of 1 to 10 parts by weight based on 100 parts by weight of the low loss insulating resin composition.

The viscosity enhancer may be at least one of an organic viscosity enhancer and an inorganic viscosity enhancer.

The low-loss insulation resin composition may further include a surface modifier.

The insulating film may include the low-loss insulating resin composition.

The insulating film may be a molded film having a thickness of 200 μm or more.

A product may include the insulating film.

The product may be at least one of a substrate and an antenna package for a high-frequency antenna module.

The low-loss insulation resin composition may be cast on a polyethylene terephthalate film to form the insulation film.

The filler may be an inorganic filler.

Other features and aspects will be apparent from the following detailed description, drawings, and patentable scope.

The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, devices, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent after understanding the disclosure of the present application. For example, the order of operations described herein is merely an example, and is not limited to the order of operations set forth herein, but other than operations that must occur in a particular order, one can make the following after understanding the disclosure of this application: Obvious change. In addition, to improve clarity and brevity, descriptions of features known in the art may be omitted.

The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent upon understanding the disclosure of this application. .

Throughout the specification, when an element such as a layer, region, or substrate is described as being "on", "connected to", or "coupled to" another element, the element may be "directly on" "Another element is" on "," connected to "another element, or" coupled to "another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" or "directly coupled to" another element, there may be no other intervening elements in between. element.

The term "and / or" as used herein includes any one of the related listed items and any combination of any two or more.

Although terms such as "first," "second," and "third" may be used herein to describe various components, elements, regions, layers or sections, these components, elements, regions, layers or sections are not subject to these terms limit. Rather, these terms are only used to distinguish one component, element, region, layer or section from another component, element, region, layer or section. Thus, without departing from the teachings of examples, a first component, element, region, layer, or section referred to in the examples described herein may also be referred to as a second component, element, region, layer, or section.

For ease of description, spatially relative terms such as "above," "above," "below," and "below" may be used herein to describe the relationship. This spatial relative term is intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if a device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be "under" or "down" relative to the other element. Thus, the term "above" may include both upward and downward orientations depending on the spatial orientation of the device. The device can also be positioned in other ways (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein can be interpreted accordingly.

The terminology used herein is used only to describe various examples and is not used to limit the present disclosure. Articles in the singular are intended to include the plural as well, unless the context clearly indicates otherwise. The terms "comprising," "including," and "having" list the existence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations , Components, elements, and / or combinations thereof.

Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings, but include variations in shapes that occur during manufacturing.

Throughout the description of the present disclosure, when describing that a certain technology is determined to circumvent the gist of the present disclosure, the related detailed description will be omitted.

In the following description, well-known functions or structures are not described in detail because they would obscure the present invention with unnecessary detail.

The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations will be apparent after understanding the disclosure of the present application.
A. Insulating resin composition

The low-loss insulating resin composition according to an example may include: (a) an epoxy resin composite including 40 to 60 parts by weight of a cyanate resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; (b) a hardener; (c) a thermoplastic resin; (d) a hardening accelerator; (e) a filler; (f) a viscosity enhancer; and (g) an additive.
( A ) Epoxy resin compound
Cyanate resin

The cyanate resin may be included in the epoxy resin compound in an amount of 40 to 60 parts by weight based on the total weight of the epoxy resin compound. When the amount of the cyanate resin is less than 40 parts by weight, reactivity and curability may be insufficient. On the other hand, when the amount of the cyanate resin exceeds 60 parts by weight, reaction control becomes difficult and curing may be accelerated or plasticity may be deteriorated. The cyanate resin may include, but is not limited to, a dicyclopentadienyl-bisphenol group or a tetramethylbiphenyl group.
Biphenylaralkyl novolac resin

The epoxy resin compound may include a biphenylaralkyl novolac resin to provide a cured product having high heat resistance. Since biphenyl has a symmetric structure, the biphenylaralkyl novolac resin can have excellent physical properties and crystallinity, and in particular, has many excellent physical properties such as low melt viscosity, low stress, and high adhesion. The amount of the biphenylaralkyl novolac resin in the epoxy resin compound may be, but is not limited to, 15 to 35 parts by weight based on the total weight of the epoxy resin compound. When the amount of the biphenylaralkyl novolac resin is less than 15 parts by weight, it is difficult to impart sufficient heat resistance in the insulating film. On the other hand, when the amount of the biphenylaralkyl novolac resin exceeds 35 parts by weight, curability may be deteriorated.
The fluorine-containing epoxy resin

The amount of the fluorine-containing epoxy resin in the epoxy resin compound may be, but is not limited to, 15 to 35 parts by weight based on the total weight of the epoxy resin compound.

When the amount of the fluorine-containing epoxy resin is less than 15 parts by weight, specific properties such as heat resistance, high temperature resistance, high humidity resistance, and chemical resistance of the insulating film may be insufficient. On the other hand, when the amount of the fluorine-containing epoxy resin exceeds 35 parts by weight, solidification may occur due to a polarity difference related to a difference in the electronegativity of the resin composition, and because the use of an expensive fluorine-containing epoxy resin increases, Production costs may increase. The fluorine-containing epoxy resin may be, but is not limited to, selected from polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer (PFA), fluorinated ethylene-propylene copolymer (FEP), trifluorochloroethylene (CTFE), At least at least one of tetrafluoroethylene / trifluorochloroethylene copolymer (TFE / CTFE), ethylene-trifluorochloroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE), and polytrifluorochloroethylene (PCTFE) A kind of powder.

Among the above fluorinated epoxy resins, powders of polytetrafluoroethylene (PTFE) resin with extremely low dielectric constant and dielectric loss factor and high glass transition temperature (Tg) can be used to ensure dielectric properties and due to Fluorine epoxy powder minimizes deterioration of the physical properties of the composition.
( B ) Hardener

The hardener included in the exemplary insulating resin composition disclosed herein may be an active ester to improve low loss factor characteristics. The active ester hardener may be, but is not limited to, compounds having two or more highly active ester groups, such as phenol esters, thiophenol esters, N-hydroxylamine esters, esters of heterocyclic hydroxyl compounds, and the like. Although not limited thereto, the active ester hardener may include a dicyclopentadienyl bisphenol structure. The hardener may be mixed in an equivalent ratio of 0.5 to 1.5 with respect to the mixed equivalent of the epoxy resin compound, and preferably, the equivalent ratio is 1.0, but is not limited thereto. When the equivalent ratio of the hardener is less than 0.5, the low loss factor characteristic and flame retardancy of the insulating resin composition may be deteriorated. On the other hand, when the equivalent ratio is more than 1.5, adhesion and storage stability may be deteriorated.
( C ) Thermoplastic resin

The thermoplastic resin contained in the insulating resin composition of the present disclosure may be added in an amount of 5 to 15 parts by weight based on the combined amount of the epoxy resin compound and the active ester hardener to improve elongation and adhesion with the wiring material. , But not limited to this.

The thermoplastic resin may be selected from the group consisting of a polyvinyl acetal resin, a phenoxy resin, a polyimide resin, a polyimide resin, a polyetherimide resin, a polyimide resin, a polyetherimide resin, and polybenzene. At least one of an ether resin, a polycarbonate resin, a polyetheretherketone resin, a polyester resin, a phenol resin, a fluorine-based thermoplastic resin, and a polyacetal resin, but is not limited thereto.

When a polyvinyl acetal resin is used as the thermoplastic resin of the present disclosure, a functional group capable of forming a chelate bond with copper (Cu) may be partially contained in the polyvinyl acetal resin. The functional group that forms a chelate bond with copper (Cu) may be a carboxyl group, a carbonyl group, and an ether group, and is preferably a carboxyl group.
( D ) Hardening accelerator

The hardening accelerator included in the insulating resin composition of the present disclosure may be, but is not limited to, imidazole or dimethylaminophenyl. Examples of the hardening accelerator may include 2-ethyl-4-methylimidazole, 1- (2-cyanoethyl) -2-alkylimidazole, 2-phenylimidazole, dimethylaminopyridine (DMAP), At least one of 3,3'-thiodipropionic acid and 4,4'-thiodiphenol. The hardening accelerator may include an amount of 0.1 to 1 part by weight, more preferably an amount of 0.25 part by weight based on the total weight of the epoxy resin composite, but is not limited thereto. When the amount of the hardening accelerator is less than 0.1 part by weight, the hardening rate may be significantly reduced. On the other hand, when the amount of the hardening accelerator exceeds 1 part by weight, hardening may occur rapidly, and it may be difficult to obtain desired physical properties.
( E ) filler

The inorganic filler contained in the resin composition of the present disclosure may be, but is not limited to, selected from the group consisting of barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead magnesium niobate-titanate At least one of lead, silver, nickel, nickel-coated polymer balls, gold-coated polymer balls, tin solder, graphite, tantalum nitride, metal silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate.

The inorganic filler may be included in an amount of 40 to 85 parts by weight, and preferably in an amount of 65 to 80 parts by weight based on 100 parts by weight of the epoxy resin composite to reduce the expansion rate of the low-loss insulating resin composition. When the amount of the inorganic filler is less than 40 parts by weight, there is a problem that the thermal expansion coefficient increases. On the other hand, when the amount of the inorganic filler exceeds 85 parts by weight, it may be difficult to apply to a substrate manufacturing process such as lamination.

The organic filler may be, but is not necessarily limited to, a polytetrafluoroethylene-based product.

In addition, the inorganic filler may be surface-treated with a silane coupling agent, and may better include fillers of different sizes and shapes. Although not limited thereto, as the silane coupling agent, various amine groups, epoxy groups, acrylic groups, vinyl groups, and the like can be used.
( F ) Viscosity enhancer

The insulating film may include a viscosity enhancer to form a high-viscosity insulating composition. The viscosity enhancer may be, but is not limited to, an inorganic viscosity enhancer and / or an organic viscosity enhancer. The viscosity enhancer may include an amount of 1 to 10 parts by weight, preferably an amount of 1 to 5 parts by weight, and more preferably an amount of 1 to 3 parts by weight based on 100 parts by weight of the low-loss insulating resin composition.

The organic viscosity enhancer may be selected from the group consisting of urea-modified polyamide wax, thixotropic resin, cellulose ether, starch, natural hydrocolloid, synthetic biopolymer, polyacrylate, alkali-activated acrylic emulsion, fatty acid alkanamine At least one of, but is not limited to.

Although not limited thereto, the inorganic viscosity enhancer may be at least one selected from the group consisting of magnesium oxide, magnesium hydroxide, amorphous silicon dioxide, and layered silicate.

Although not limited thereto, the viscosity enhancer may be selected from inorganic viscosity enhancers, such as silicon dioxide. Silicon dioxide can effectively prevent precipitation without impairing the performance of the resin composition.
( G ) Additives

In the present disclosure, in addition to the composition listed above, if necessary, another hardener, another hardening accelerator, leveling agent, flame retardant, etc. may be included as long as it does not impair the expectations of the present disclosure. Performance. Although not limited thereto, the insulating resin composition of the present disclosure may further include at least one additive such as a surface modifier, a defoamer, a thermoplastic resin, a filler, a softener, a plasticizer, an antioxidant, a flame retardant, Fuel additives, lubricants, antistatic agents, colorants, heat stabilizers, light stabilizers, UV absorbers, coupling agents or anti-settling agents.

Although not limited thereto, the insulating resin composition of the present disclosure may use different solvents having different boiling points for coating and film forming of the insulating resin composition, and includes additives such as a surface tension control agent, a defoaming agent, and a thermoplastic resin. Wait.
B. Insulation film

With the insulating resin composition of the examples of the present disclosure, an insulating film having improved moisture absorption, reliability, thermal stability, and mechanical properties can be prepared.

An insulating film may be applied to a buildup layer of the printed circuit board 110 of the package 100 of FIG. 1, a mold layer of a PLP, and a backside redistribution layer (RDL).

The insulating film may be a molded film having a thickness of 200 μm or more. In this case, by using the insulating resin composition of the present disclosure and adding a surface modifier and a viscosity enhancer, a film having a thickness of 200 μm or more can be easily manufactured.

The insulating film may be a molded film having a Cu adhesion of 0.5 kgf / cm ² or higher.

According to the present disclosure, it is possible to provide a low-loss insulating resin composition that provides package stability and high reliability and forms a thick film.

Therefore, it is possible to form an insulating film having a very large thickness using the low-loss insulating resin composition of the present disclosure compared to a general insulating material.

In addition, it is also possible to provide an antenna package and a substrate having excellent reliability based on the low-loss insulating resin composition of the present disclosure.

In the following, although a more detailed description will be given by way of example, these descriptions are for explanation only and do not limit the present disclosure. In the following examples, only examples realizing specific compounds are exemplified. However, it will be apparent to those skilled in the art that even when the equivalents of these compounds are used, equivalents of similar compounds may be exhibited.
Examples
Preparation of low-loss insulation resin composition

Examples 1 and Comparative Examples 1 to 3 of the compositions shown in Table 1 below were prepared. These insulating resin compositions include: epoxy resin composites including cyanate resins, biphenylaralkyl groups Novolac resins and fluorine-containing epoxy resins; active ester-based hardeners; hardening accelerators; inorganic fillers; organic / inorganic viscosity enhancers; starters; and additives.

More specifically, a hardener of 1.0 equivalent amount based on the epoxy resin compound was added, and a spherical amine-treated silica slurry having a size distribution of 500 nm to 5 μm was added and stirred at 300 rpm for 3 hours.

A hardening accelerator, a surface modifying additive, and a viscosity enhancer of dimethylaminopyridine (DMAP) were added to the mixture and further mixed for 1 hour to provide a low-loss insulating resin composition. Table 1 shows the components of the insulating resin composition of Example 1 and Comparative Examples 1 to 3 in detail.
Table 1

Preparation of insulating film and evaluation of mechanical properties

The prepared high-viscosity low-loss insulating resin composition can be cast on a polyethylene terephthalate film (PET film) to a thickness of more than 200 μm to provide a roll film product used as a film-type molding material.

The evaluation results of the mechanical properties of the films prepared by the epoxy resin compositions of Example 1 and Comparative Examples 1 to 3 are shown in Table 2 below.
Table 2

When evaluating the mechanical properties of the molding material, it was confirmed that the loss coefficient (Df) (tan δ) of the molding material of Example 1 was less than 0.003, the coefficient of thermal expansion was less than 15 ppm / ° C, the moisture content was less than 0.3 wt. Adhesive force is greater than 0.5kgf / cm ² .

As shown in Table 2, it was also confirmed that the insulating resin composition of Example 1 in which three kinds of resins were mixed had excellent loss factor (Df), thermal expansion coefficient, moisture content, and the insulating resin compositions of Comparative Examples 1 to 3, and Adhesion to Cu.

When the insulating resin composition of Example 1 is used as a molding material for a package, as a result of the reliability evaluation of the package, the package meets the high acceleration stress test (HAST) and thermal loop (TC) reliability standards all of.

Therefore, the insulating film can be used as a low-loss molding material in the printed circuit board (PCB) 110 as shown in FIG. 1.

The prepared antenna package can reduce signal loss and improve blistering of the backside redistribution layer (RDL) after reflow.

By using the low-loss insulating resin composition of the present disclosure, since the thickness is easily controlled during film casting, a thick film having a thickness of 200 μm or more can be manufactured, making the low-loss insulating resin composition suitable for packaging from a small area to Large area products.

On the other hand, when a general pellet-type or liquid-type molding material is used, expensive compression molding equipment may be required, and since molding and hardening are performed with one equipment, a long processing time may be required. However, by using a film-type molding material prepared from the low-loss insulating resin composition of the present disclosure, a relatively inexpensive laminating apparatus can be used, and hardening can be performed separately in a convection oven after molding, which can shorten processing time And increase the productivity of the final product.

The film using the low-loss dielectric resin composition of the present disclosure has a low dielectric loss factor (tan δ) of less than 0.003, a low thermal expansion coefficient of less than 15 ppm / ° C, a low moisture content of less than 0.3 wt.%, 0.5kgf / cm ² with high adhesion to Cu.

The product of the above example may be a substrate or an antenna package for a high-frequency antenna module.

The low-loss insulating resin composition can have excellent reliability and adhesion, low loss factor characteristics, and improved thermal and mechanical properties due to its low moisture absorption performance.

It may be possible to use the low-loss insulating resin composition to provide an insulating film having a thick thickness that can ensure the stability and reliability of a printed circuit board or a packaged product.

The thickness control during film casting can be easy, an insulating film having a thickness of 200 μm or more can be manufactured, and can be used for packaging of products from a small size to a large size.

It may be possible to provide a substrate for a high-frequency antenna module and an antenna package using the insulating film to ensure excellent processability and reliability, low loss factor characteristics, and reduced signal loss.

It may be possible to use relatively inexpensive equipment using an insulating film, shorten the process time, and effectively increase the productivity of substrates and packages.

Although this disclosure includes specific examples, it will be apparent after understanding the disclosure of this application that forms and details can be made in these examples without departing from the spirit and scope of the scope of the patent application and its equivalents Changes. The examples described herein are to be considered as descriptive only and not for purposes of limitation. Descriptions of features or aspects in each example will be considered to apply to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the described elements of the system, architecture, device, or circuit are combined in different ways and / or the described system is replaced or added by other elements or their equivalents, Architecture, device, or component in a circuit can get the right result. Therefore, the scope of the present disclosure is not limited by the specific embodiments, but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents will be construed as being included in the present disclosure.

100‧‧‧ Package

110‧‧‧printed circuit board

A‧‧‧Part

FIG. 1 is a schematic diagram illustrating an example of a package including a low-loss insulating resin composition, in which an insulating film is provided in a section “A”.

Throughout the drawings and the detailed description, the same drawing reference numerals refer to the same elements. The drawings may not be drawn to scale, and the relative sizes, ratios, and depictions of the elements in the drawings may be exaggerated for clarity, illustration, and convenience.

Claims (19)

A low loss insulating resin composition includes: Epoxy resin composites, including cyanate resins, biphenylaralkyl novolac resins, and fluorinated epoxy resins; Active ester hardener Thermoplastic resin Hardening accelerator Filler; and Viscosity enhancer. The low-loss insulating resin composition according to item 1 of the patent application scope, wherein the epoxy resin composite includes 40 to 60 parts by weight of the cyanate resin and 15 to 35 parts by weight of the biphenyl. An aralkyl novolac resin and 15 to 35 parts by weight of the fluorine-containing epoxy resin. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the active ester hardener is included in an amount of 0.5 to 1.5 equivalents based on the mixed equivalent of the epoxy resin compound. The low loss insulating resin composition according to item 1 of the scope of patent application, wherein the epoxy resin composite and the active ester hardener are contained in an amount of 5 to 15 parts by weight based on 100 parts by weight of the epoxy resin composite and the active ester hardener Thermoplastic resin. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the thermoplastic resin is a polyvinyl acetal resin, a phenoxy resin, a polyimide resin, a polyimide resin, Polyether fluorene resin, polyfluorene resin, polyether fluorene resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, phenolic resin, fluorine-based thermoplastic resin, and polyacetal resin At least one. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the hardening accelerator is 2-ethyl-4-methylimidazole, 1- (2-cyanoethyl) -2-alkyl At least one of imidazole, 2-phenylimidazole, dimethylaminopyridine, 3,3'-thiodipropionic acid, and 4,4'-thiodiphenol. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the hardening accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the filler is an inorganic filler, and contains 100 to 80 parts by weight of the epoxy resin compound based on 100 parts by weight of the epoxy resin compound. Mentioned filler. The low-loss insulation resin composition according to item 8 of the scope of the patent application, wherein the inorganic filler is barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead niobate Magnesium-lead titanate, silver, nickel, nickel-coated polymer balls, gold-coated polymer balls, tin solder, graphite, tantalum nitride, metal silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate At least one. The low-loss insulation resin composition according to item 8 of the scope of the patent application, wherein the inorganic filler is surface-treated with a silane coupling agent. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the viscosity enhancer is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the low-loss insulating resin composition. The low-loss insulating resin composition according to item 1 of the scope of the patent application, wherein the viscosity enhancer is at least one of an organic viscosity enhancer and an inorganic viscosity enhancer. According to the low-loss insulating resin composition according to item 1 of the scope of patent application, the low-loss insulating resin composition further includes a surface modifier. The low-loss insulating resin composition according to item 1 of the scope of patent application, wherein the filler is an inorganic filler. An insulating film comprising the low loss insulating resin composition according to any one of items 1 to 14 of the scope of patent application. The insulating film according to item 15 of the scope of patent application, wherein the insulating film is a molded film having a thickness of 200 μm or more. The insulating film according to item 15 of the scope of patent application, wherein the low-loss insulating resin composition is cast on a polyethylene terephthalate film to form the insulating film. A product including the insulating film according to any one of claims 15 to 17 of the scope of patent application. The product according to item 18 of the scope of patent application, wherein the product is at least one of a substrate and an antenna package for a high-frequency antenna module.