JP2014123703A - Resin composition for printed board, insulating film, prepreg and printed board - Google Patents

Resin composition for printed board, insulating film, prepreg and printed board Download PDF

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Publication number
JP2014123703A
JP2014123703A JP2013086886A JP2013086886A JP2014123703A JP 2014123703 A JP2014123703 A JP 2014123703A JP 2013086886 A JP2013086886 A JP 2013086886A JP 2013086886 A JP2013086886 A JP 2013086886A JP 2014123703 A JP2014123703 A JP 2014123703A
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JP
Japan
Prior art keywords
resin
resin composition
printed circuit
epoxy resin
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013086886A
Other languages
Japanese (ja)
Inventor
Geum Hee Yun
フィ ユン,グン
Jinyoung Kim
ヨン キム,ジン
Gun Yong Lee
ヨン リ,グン
Original Assignee
Samsung Electro-Mechanics Co Ltd
サムソン エレクトロ−メカニックス カンパニーリミテッド.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020120149706A priority Critical patent/KR101987280B1/en
Priority to KR10-2012-0149706 priority
Application filed by Samsung Electro-Mechanics Co Ltd, サムソン エレクトロ−メカニックス カンパニーリミテッド. filed Critical Samsung Electro-Mechanics Co Ltd
Publication of JP2014123703A publication Critical patent/JP2014123703A/en
Pending legal-status Critical Current

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