TWI710455B - 晶圓等級的光學裝置製造方法 - Google Patents

晶圓等級的光學裝置製造方法 Download PDF

Info

Publication number
TWI710455B
TWI710455B TW104115387A TW104115387A TWI710455B TW I710455 B TWI710455 B TW I710455B TW 104115387 A TW104115387 A TW 104115387A TW 104115387 A TW104115387 A TW 104115387A TW I710455 B TWI710455 B TW I710455B
Authority
TW
Taiwan
Prior art keywords
substrate
elements
barrier
hardenable material
hardenable
Prior art date
Application number
TW104115387A
Other languages
English (en)
Chinese (zh)
Other versions
TW201605608A (zh
Inventor
亞歷山大 拜斯奇
米歇爾 巴吉
Original Assignee
新加坡商恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡商恒立私人有限公司 filed Critical 新加坡商恒立私人有限公司
Publication of TW201605608A publication Critical patent/TW201605608A/zh
Application granted granted Critical
Publication of TWI710455B publication Critical patent/TWI710455B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/752—Measuring equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Light Receiving Elements (AREA)
TW104115387A 2014-05-16 2015-05-14 晶圓等級的光學裝置製造方法 TWI710455B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461994358P 2014-05-16 2014-05-16
US61/994,358 2014-05-16

Publications (2)

Publication Number Publication Date
TW201605608A TW201605608A (zh) 2016-02-16
TWI710455B true TWI710455B (zh) 2020-11-21

Family

ID=54480324

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104115387A TWI710455B (zh) 2014-05-16 2015-05-14 晶圓等級的光學裝置製造方法

Country Status (8)

Country Link
US (1) US10682824B2 (https=)
EP (1) EP3142859B1 (https=)
JP (2) JP2017526977A (https=)
KR (1) KR102352424B1 (https=)
CN (1) CN106573460B (https=)
SG (2) SG10201810219TA (https=)
TW (1) TWI710455B (https=)
WO (1) WO2015174930A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016689B1 (en) * 2016-04-28 2017-11-20 Anteryon Wafer Optics B V Replication tool
CN109116680A (zh) * 2018-09-27 2019-01-01 京东方科技集团股份有限公司 压印模板及其制作方法
US10867955B2 (en) * 2018-09-27 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure having adhesive layer surrounded dam structure
WO2020185167A1 (en) * 2019-03-12 2020-09-17 Ams Sensors Singapore Pte. Ltd. Yard control features
CN113906319A (zh) * 2019-05-30 2022-01-07 ams传感器新加坡私人有限公司 复制光学元件的方法和复制的光学元件
GB2594998A (en) * 2020-05-15 2021-11-17 Ams Sensors Asia Pte Ltd Wafer level chip scale packaging
CN115097553B (zh) * 2022-06-24 2023-10-31 京东方科技集团股份有限公司 微透镜阵列基板及其制备方法、显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040241323A1 (en) * 2003-05-29 2004-12-02 3M Innovative Properties Company Method for applying adhesive to a substrate
CN101617387A (zh) * 2006-11-14 2009-12-30 格雷姆格拉斯网络公司 局部结合的方法和设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4963148B2 (ja) 2001-09-18 2012-06-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TW544894B (en) * 2002-04-10 2003-08-01 Siliconware Precision Industries Co Ltd Chip carrier with dam bar
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
JP4362380B2 (ja) * 2004-01-13 2009-11-11 フジノン株式会社 光学素子の成形方法及び組み合わせ光学素子
US20070216048A1 (en) * 2006-03-20 2007-09-20 Heptagon Oy Manufacturing optical elements
US20070216046A1 (en) * 2006-03-20 2007-09-20 Heptagon Oy Manufacturing miniature structured elements with tool incorporating spacer elements
JP4507126B2 (ja) * 2007-10-29 2010-07-21 ソニー株式会社 偏光板の製造方法
US20090159200A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
JP2009204752A (ja) 2008-02-26 2009-09-10 Sanyo Electric Co Ltd 複合レンズ
JP2010052086A (ja) * 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd 半導体装置及びその製造方法
JP5047243B2 (ja) * 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8792180B2 (en) 2009-06-12 2014-07-29 Konica Minolta Opto, Inc. Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die
US20130273238A1 (en) * 2012-04-16 2013-10-17 Peter S. Andrews Inverted Curing of Liquid Optoelectronic Lenses
JP6395600B2 (ja) * 2012-05-30 2018-09-26 オリンパス株式会社 撮像装置の製造方法および半導体装置の製造方法
SG10201701641RA (en) 2012-09-11 2017-04-27 Heptagon Micro Optics Pte Ltd Manufacture of truncated lenses, of pairs of truncated lenses and of corresponding devices
CN104854483A (zh) 2012-12-15 2015-08-19 柯尼卡美能达株式会社 透镜阵列构造体的制造方法以及透镜阵列构造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040241323A1 (en) * 2003-05-29 2004-12-02 3M Innovative Properties Company Method for applying adhesive to a substrate
CN101617387A (zh) * 2006-11-14 2009-12-30 格雷姆格拉斯网络公司 局部结合的方法和设备

Also Published As

Publication number Publication date
EP3142859A4 (en) 2018-01-24
SG11201609001TA (en) 2016-11-29
KR20170029422A (ko) 2017-03-15
TW201605608A (zh) 2016-02-16
JP6987907B2 (ja) 2022-01-05
EP3142859B1 (en) 2019-07-10
JP2020106856A (ja) 2020-07-09
KR102352424B1 (ko) 2022-01-17
US10682824B2 (en) 2020-06-16
CN106573460B (zh) 2019-11-29
SG10201810219TA (en) 2018-12-28
US20170087784A1 (en) 2017-03-30
JP2017526977A (ja) 2017-09-14
WO2015174930A1 (en) 2015-11-19
CN106573460A (zh) 2017-04-19
EP3142859A1 (en) 2017-03-22

Similar Documents

Publication Publication Date Title
TWI710455B (zh) 晶圓等級的光學裝置製造方法
CN1947254B (zh) 光电子器件上的微光学元件
TWI638470B (zh) 具有屏蔽以減少光漏或漫射光的光電模組及此模組之製造方法
EP2225596B1 (en) Spacer element and method for manufacturing a spacer element
TWI648554B (zh) 截頂型鏡片，截頂型鏡片對及相應裝置的製造方法
US10126530B2 (en) Fabrication of optical elements and modules incorporating the same
WO2015122769A1 (en) Method of fabricating a wafer level optical lens assembly
NL2015330B1 (en) A method of fabricating an array of optical lens elements
CN108700721A (zh) 光学元件堆叠组件
TW201403137A (zh) 透鏡結構及其製作方法