SG10201810219TA - Wafer-level manufacture of devices, in particular of optical devices - Google Patents

Wafer-level manufacture of devices, in particular of optical devices

Info

Publication number
SG10201810219TA
SG10201810219TA SG10201810219TA SG10201810219TA SG10201810219TA SG 10201810219T A SG10201810219T A SG 10201810219TA SG 10201810219T A SG10201810219T A SG 10201810219TA SG 10201810219T A SG10201810219T A SG 10201810219TA SG 10201810219T A SG10201810219T A SG 10201810219TA
Authority
SG
Singapore
Prior art keywords
devices
wafer
amount
substrate
elements
Prior art date
Application number
SG10201810219TA
Other languages
English (en)
Inventor
Alexander Bietsch
Michel Barge
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201810219TA publication Critical patent/SG10201810219TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/752—Measuring equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Light Receiving Elements (AREA)
SG10201810219TA 2014-05-16 2015-05-14 Wafer-level manufacture of devices, in particular of optical devices SG10201810219TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201461994358P 2014-05-16 2014-05-16

Publications (1)

Publication Number Publication Date
SG10201810219TA true SG10201810219TA (en) 2018-12-28

Family

ID=54480324

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201810219TA SG10201810219TA (en) 2014-05-16 2015-05-14 Wafer-level manufacture of devices, in particular of optical devices
SG11201609001TA SG11201609001TA (en) 2014-05-16 2015-05-14 Wafer-level maufacture of devices, in particular of optical devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201609001TA SG11201609001TA (en) 2014-05-16 2015-05-14 Wafer-level maufacture of devices, in particular of optical devices

Country Status (8)

Country Link
US (1) US10682824B2 (https=)
EP (1) EP3142859B1 (https=)
JP (2) JP2017526977A (https=)
KR (1) KR102352424B1 (https=)
CN (1) CN106573460B (https=)
SG (2) SG10201810219TA (https=)
TW (1) TWI710455B (https=)
WO (1) WO2015174930A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016689B1 (en) * 2016-04-28 2017-11-20 Anteryon Wafer Optics B V Replication tool
CN109116680A (zh) * 2018-09-27 2019-01-01 京东方科技集团股份有限公司 压印模板及其制作方法
US10867955B2 (en) * 2018-09-27 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure having adhesive layer surrounded dam structure
WO2020185167A1 (en) * 2019-03-12 2020-09-17 Ams Sensors Singapore Pte. Ltd. Yard control features
CN113906319A (zh) * 2019-05-30 2022-01-07 ams传感器新加坡私人有限公司 复制光学元件的方法和复制的光学元件
GB2594998A (en) * 2020-05-15 2021-11-17 Ams Sensors Asia Pte Ltd Wafer level chip scale packaging
CN115097553B (zh) * 2022-06-24 2023-10-31 京东方科技集团股份有限公司 微透镜阵列基板及其制备方法、显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4963148B2 (ja) 2001-09-18 2012-06-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TW544894B (en) * 2002-04-10 2003-08-01 Siliconware Precision Industries Co Ltd Chip carrier with dam bar
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
US20040241323A1 (en) 2003-05-29 2004-12-02 3M Innovative Properties Company Method for applying adhesive to a substrate
JP4362380B2 (ja) * 2004-01-13 2009-11-11 フジノン株式会社 光学素子の成形方法及び組み合わせ光学素子
US20070216048A1 (en) * 2006-03-20 2007-09-20 Heptagon Oy Manufacturing optical elements
US20070216046A1 (en) * 2006-03-20 2007-09-20 Heptagon Oy Manufacturing miniature structured elements with tool incorporating spacer elements
US20080113160A1 (en) * 2006-11-14 2008-05-15 Glimmerglass Networks, Inc. Method And Apparatus For Localized Bonding
JP4507126B2 (ja) * 2007-10-29 2010-07-21 ソニー株式会社 偏光板の製造方法
US20090159200A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
JP2009204752A (ja) 2008-02-26 2009-09-10 Sanyo Electric Co Ltd 複合レンズ
JP2010052086A (ja) * 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd 半導体装置及びその製造方法
JP5047243B2 (ja) * 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8792180B2 (en) 2009-06-12 2014-07-29 Konica Minolta Opto, Inc. Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die
US20130273238A1 (en) * 2012-04-16 2013-10-17 Peter S. Andrews Inverted Curing of Liquid Optoelectronic Lenses
JP6395600B2 (ja) * 2012-05-30 2018-09-26 オリンパス株式会社 撮像装置の製造方法および半導体装置の製造方法
SG10201701641RA (en) 2012-09-11 2017-04-27 Heptagon Micro Optics Pte Ltd Manufacture of truncated lenses, of pairs of truncated lenses and of corresponding devices
CN104854483A (zh) 2012-12-15 2015-08-19 柯尼卡美能达株式会社 透镜阵列构造体的制造方法以及透镜阵列构造体

Also Published As

Publication number Publication date
EP3142859A4 (en) 2018-01-24
TWI710455B (zh) 2020-11-21
SG11201609001TA (en) 2016-11-29
KR20170029422A (ko) 2017-03-15
TW201605608A (zh) 2016-02-16
JP6987907B2 (ja) 2022-01-05
EP3142859B1 (en) 2019-07-10
JP2020106856A (ja) 2020-07-09
KR102352424B1 (ko) 2022-01-17
US10682824B2 (en) 2020-06-16
CN106573460B (zh) 2019-11-29
US20170087784A1 (en) 2017-03-30
JP2017526977A (ja) 2017-09-14
WO2015174930A1 (en) 2015-11-19
CN106573460A (zh) 2017-04-19
EP3142859A1 (en) 2017-03-22

Similar Documents

Publication Publication Date Title
SG10201810219TA (en) Wafer-level manufacture of devices, in particular of optical devices
Lehrer et al. Positive solutions of asymptotically linear equations via Pohozaev manifold
EP3993298B8 (en) Method and device for allocating sl harq feedback report resource in nr v2x
MX2017000111A (es) Un aparato y un metodo para construir un elemento de construccion o un edificio.
EP3482282A4 (en) TOUCH SUBSTRATE, TOUCH DISPLAY DEVICE THEREFOR, AND METHOD FOR THE PRODUCTION THEREOF
SG11201900881YA (en) Laser irradiation device, laser irradiation method, and semiconductor device manufacturing method
SG11201901050SA (en) Method and device for aligning substrates
GB2532700A (en) A method for controlling rust
SG11201806952SA (en) Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor
EP3261145A4 (en) Flexible display substrate and method for manufacturing same, and flexible display device
EP3488329A4 (en) TOUCH SUBSTRATE, MASK PLATE FOR THEIR PRODUCTION AND PRODUCTION METHOD THEREFOR
SG11202100176VA (en) Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film
WO2015123085A3 (en) Classical simulation constants and ordering for quantum chemistry simulation
DK3409090T3 (da) Pneumatisk fordelingsmaskine og fremgangsmåde til udbringning af fordelingsmateriale med samme
EP2960055A3 (en) System and method for forming bonded substrates
PH12019500402A1 (en) Concrete block construction method and guide member for installing concrete block
GB201704184D0 (en) Systems, methods, and devices for communicating drive history path attributes
SG11201805655VA (en) Method and device for bonding substrates
GB201600549D0 (en) Electro-optical modulator based on a layered semiconductor crystal structure
EP3242319A4 (en) THIN-LAYER TRANSISTOR AND PRODUCTION PROCESS THEREFOR, AND ARRAY SUBSTRATE AND PRODUCTION METHOD THEREFOR
MX2017015201A (es) Metodo y aparato para construir una torre de hormigon.
DK2891590T3 (da) Førerløst landkøretøj, som omfatter en indretning til styring af en afsporing af køretøjet, og tilsvarende fremgangsmåde til styring af afsporingen
DK3677727T3 (da) Fremgangsmåde og apparat til dannelse af en rende på havbunden
MX2021004730A (es) Tecnicas para emparejamiento conductual en un sistema de centro de contacto.
DK3250830T3 (da) Indretning til styring af strømningen i en strømningsmaskine, strømningsmaskine og fremgangsmåde