TWI705519B - Substrate processing device, substrate processing method, photomask cleaning method, and photomask manufacturing method - Google Patents

Abstract

Problem to be Solved： When a substrate with a back surface faced upward is cleaned by a scrubbing member or the like, foreign matters intrude onto a film surface due to intrusion of a cleaning liquid, resulting in an increased number of foreign matters which cannot be removed in film surface cleaning. Means to Solve the Problem： A substrate processing device for processing a downward-facing surface by a processing liquid has a supporting member which supports the substrate from the downward-facing surface in a state where a main surface of the substrate is horizontal, a clamping member which holds the substrate by clamping, in two directions, a part of an outer edge portion of the substrate supported by the supporting member, driving means which, moves at least one of the supporting member and the clamping member in a vertical direction in order to separate, from the supporting member, the substrate held by the clamping member, scrub moving means which moves a scrubbing member along the downward-facing surface of the substrate while the scrubbing member is kept in contact with the downward-facing surface of the substrate in a space defined by the separation, and processing liquid supplying means for supplying the processing liquid to the downward-facing surface of the substrate.

Description

Substrate processing device, substrate processing method, photomask cleaning method, and photomask manufacturing method

The present invention relates to a substrate processing, in particular to a substrate processing apparatus, a substrate processing method, a photomask cleaning method, and a photomask manufacturing method that are advantageously used in the cleaning process of a photomask substrate.

In LSI (Large Scale Integration, large scale integrated circuit) masks or FPD (Flat panel display, flat panel display) masks, the foreign matter generated during the manufacturing process or operation adheres to the transfer pattern of the mask The area, etc., causes poor transfer. Therefore, precise cleaning must be performed during or after the manufacturing process of the photomask.

Patent Document 1 describes a rotary cleaning device used for masks of different and plural sizes. The rotary cleaning device has a device for reading the size information of the put-in mask substrate, and a control unit that performs specific control based on the read substrate size information. In addition, the rotary cleaning device has a configuration in which a substrate reversing device is provided between the first cleaning tank and the second cleaning tank, and the drive unit for the clamping arm of the substrate reversing device is controlled based on the substrate size information to clamp Hold the mask substrate, thereby turning the mask substrate.

Patent Document 2 describes a substrate processing apparatus that supplies different processing liquids to the front and back surfaces of a substrate such as a glass substrate for a photomask to process the substrate. The substrate processing apparatus conveys the substrate while making the main surface of the substrate horizontal, and supplies the first processing liquid to the front surface of the substrate and the second processing liquid to the back surface of the substrate, thereby processing the front and back surfaces of the substrate. The substrate processing device is formed as a substrate processing device that can prevent the cleaning solution for the back surface from penetrating to the front surface of the substrate and can appropriately process the back surface of the substrate. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent No. 4824425 [Patent Document 2] Japanese Patent Laid-Open No. 2014-69126

[The problem to be solved by the invention]

As a method of treating the surface of a substrate with a liquid agent, spin cleaning is known. While rotating and cleaning, the horizontal substrate is rotated in the processing shield, and the surface of the substrate is supplied with processing liquid for substrate processing. According to this rotating cleaning, a scrubbing material such as a brush or a sponge can be brought into contact with the upward side of the horizontal substrate to clean the substrate.

On the other hand, the substrate is held downwardly by a holding member (rotating chuck) for placing the substrate horizontally. Therefore, it is somewhat inconvenient to apply contact cleaning using a scrubbing material or the like to the substrate facing down. Therefore, when the front and back surfaces of the substrate are cleaned by contact, the substrate must be turned over after cleaning the top surface of the substrate. However, the inversion of the substrate has the following technical problems. Therefore, in the rotary cleaning device described in Patent Document 1, there is room for improvement in that the problems associated with the inversion of the substrate are not considered.

In the substrate processing apparatus described in Patent Document 2, the substrate is transported by a transport roller while the processing liquid is supplied to the back (downward) of the substrate. In this substrate processing apparatus, the back surface is processed without turning over the substrate. However, the processing of the back surface is performed while the substrate is transported by the transport roller. Therefore, when the substrate processing apparatus is used to clean the back surface of the substrate, contaminants remain on the back surface of the substrate due to the contact between the substrate and the transfer roller.

At present, in, for example, FPD mask substrates, from the viewpoint of cost efficiency, in order to maximize the area of the main surface of the substrate as a transfer area, there is a need to arrange device patterns close to the outer edge of the substrate. Along with this, defects or foreign objects are not allowed near the outer edge of the substrate, and the allowable range becomes very small. In the substrate processing apparatus described in Patent Document 2, the transfer roller is in contact with the back surface of the substrate, and contaminants remain in the contact portion. Therefore, it cannot be applied to a photomask in which the device pattern is arranged near the outer edge of the substrate. There are still remaining problems with this processing device.

The main purpose of the present invention is to provide a technique for obtaining a substrate with reduced contamination due to adhesion of foreign matter and the like by improving the downward-facing cleaning method of the substrate. [Technical means to solve the problem]

(First aspect) The first aspect of the present invention is a substrate processing apparatus that treats the downward side of the substrate with a processing liquid, and has: a supporting member that sets the main surface of the substrate to be horizontal In the state, the substrate is supported from the lower side; a clamping member that clamps a part of the outer edge of the substrate supported by the support member from two opposing directions to hold the substrate; the drive device is for Separating the substrate held by the clamping member from the supporting member, and moving at least one of the supporting member and the clamping member in the vertical direction; scrubbing the moving device in the space formed by the separation, The scrubbing material is brought into contact with the downward surface of the substrate while moving the scrubbing material along the downward surface of the substrate; and a processing liquid supply device for supplying processing liquid to the downward surface of the substrate. (Second aspect) A second aspect of the present invention is the substrate processing apparatus of the above-mentioned first aspect, wherein a front end of the clamping member is provided with a contact that can be formed between the main surface and the end surface of the substrate The contact surface of the corner surface. (Third Aspect) A third aspect of the present invention is the substrate processing apparatus of the first or second aspect described above, which has a rotating device that rotates the substrate supported by the support member in a horizontal plane. (Fourth aspect) The fourth aspect of the present invention is a substrate processing method that treats the downward side of the substrate with a processing liquid, and has the following steps: Set the main surface of the square of the substrate to be horizontal In the state, the substrate is installed by supporting the substrate from the lower side with a supporting member; the holding step includes clamping and holding a part of the outer edge of the substrate on the opposite sides of the main surface of the substrate; A step of moving at least one of the clamped and held substrate and the supporting member in a vertical direction to separate the downward direction of the substrate from the supporting member; and a processing step, which supplies the downward direction of the substrate The processing liquid, and in the space formed by the separation, the scrubbing material is brought into contact with the downward surface of the substrate, and the scrubbing material is moved along the downward surface of the substrate, thereby processing the substrate with the processing liquid Face down. (Fifth aspect) The fifth aspect of the present invention is a substrate processing method that treats the downward side of the substrate with a processing liquid, and has the following steps: Set the main surface of the square of the substrate to be horizontal In the state, the substrate is installed by supporting the substrate from the lower side with a supporting member; the first holding step is to clamp and hold a part of the outer edge of the substrate on the opposite sides of the main surface of the substrate. Separating step, by moving at least one of the substrate and the supporting member held by the clamp to the vertical direction, so that the downward direction of the substrate is separated from the supporting member; the first processing step, which faces the above Next, the processing liquid is supplied, and in the space formed by the separation, the scrubbing material is brought into contact with the downward surface of the substrate, and the scrubbing material is moved along the downward surface of the substrate, whereby the processing liquid is used to process the The substrate facing downward; the second holding step, which releases the self-clamping and holding of the outer edge of the substrate located on the two sides, and clamps and holds a part of the outer edge of the substrate on the two sides different from the two sides; and the second process In the step, the process liquid is supplied to the downward direction, and in the space, the scrubbing material is brought into contact with the downward surface of the substrate, and the scrubbing material is moved along the downward surface of the substrate, thereby using the processing liquid to treat the substrate. The substrate faces down. (Sixth aspect) A sixth aspect of the present invention is the substrate processing method of the fifth aspect, wherein after the first processing step and before the second holding step, the substrate is rotated at a specific angle on a horizontal plane The rotation steps. (Seventh aspect) A seventh aspect of the present invention is the substrate processing method of the sixth aspect, wherein the specific angle is 90 degrees. (Eighth aspect) The substrate processing method according to the sixth or seventh aspect, wherein the rotating step is performed by supporting the substrate by the supporting member. (Ninth aspect) A ninth aspect of the present invention is the substrate processing method of any one of the above-mentioned fourth to seventh aspects, wherein the back surface of the mask substrate is cleaned by the above-mentioned substrate processing method. (Tenth aspect) The tenth aspect of the present invention is a photomask cleaning method, which has: a back surface cleaning step by the substrate processing method of any one of the above-mentioned fourth to seventh aspects Cleaning the back surface of the mask substrate; and the film surface cleaning step, in which the film surface of the mask substrate is cleaned with the film surface of the mask substrate as the upper side; and the back surface cleaning step is the same as the above Between the film surface cleaning steps, there is no step of turning the above-mentioned mask substrate upside down. (Eleventh aspect) The eleventh aspect of the present invention is a photomask manufacturing method, which includes the substrate processing method of any one of the above-mentioned fourth to seventh aspects. (Twelfth aspect) The twelfth aspect of the present invention is a photomask manufacturing method, which includes the photomask cleaning method as described in the tenth aspect. [Effects of Invention]

According to the present invention, by improving the downward-facing cleaning method of the substrate, it is possible to obtain a substrate with reduced contamination due to adhesion of foreign matter and the like.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment of the present invention, the substrate to be the target of substrate processing is, for example, a mask substrate. The mask substrate includes not only a transparent substrate used as a mask (glass substrate for a mask, etc.), but also a mask base formed by forming a specific film on the surface of the transparent substrate, or a photoresist coated on the mask base. The finished photomask substrate with resist or the photomask intermediate of the photomask manufacturing process or the completed photomask. In the description of the following embodiments, the above-mentioned mask substrate may be simply referred to as a substrate.

In the embodiment of the present invention, among the two main surfaces of the front surface and the back surface of the mask substrate, one main surface is set as the film surface, and the other main surface is set as the back surface. The so-called film surface refers to the surface on the side where film formation and transfer pattern formation are performed. In most cases, the back surface becomes the exposed surface of the glass, which is the material of the mask substrate. Therefore, in the embodiment of the present invention, the back surface of the photomask substrate is also referred to as a glass surface.

In the embodiment of the present invention, when the main surface of the substrate is made horizontal during the substrate processing, the surface facing the upper side in the vertical direction of the two main surfaces is set to face upward, and the surface facing the lower side in the vertical direction The face is set to face down.

<Rotary washing device> Fig. 1 is a schematic side view showing a configuration example of a rotating washing device as a reference example. The rotary cleaning device 50 shown in the figure is provided with a holder 51 that holds a rectangular photomask substrate 1 in a plan view; a shield 52 that can accommodate the holder 51; a rotating shaft 53 that is used to rotate the holder 51; and a drive unit 54. It drives the rotating shaft 53; the scrubbing material 55 for contact cleaning; the upper processing liquid supply line 56; and the lower processing liquid supply line 57. The holder 51 is provided with pins 58 for receiving and supporting the photomask substrate 1 from below, and chucks 59 for limiting the end surface near the four corners of the photomask substrate 1. The driving unit 54 includes, for example, a driving source such as a motor, and a driving force transmission mechanism (a pulley, a belt, etc.) that transmits the driving force of the driving source to the rotating shaft 53. The scrubbing material 55 is composed of, for example, a brush or sponge.

In the rotary cleaning device 50 including the above-mentioned structure, the photomask substrate 1 is placed on the holder 51, while the holder 51 and the photomask substrate 1 are rotated at a high speed about the rotation axis 53, while passing through the upper processing liquid supply line 56 The processing liquid (including cleaning liquid and rinsing liquid) is supplied to the upper side of the mask substrate 1. Thereby, the upper side of the mask substrate 1 can be processed by the processing liquid. At this time, the processing liquid (including the cleaning liquid and the rinsing liquid) may be sprayed from the lower side of the substrate through the lower processing liquid supply line 57 as necessary, thereby processing the lower side of the mask substrate 1 with the processing liquid.

In the example shown in FIG. 1, the upper face of the mask substrate 1 becomes a film surface, and the transfer pattern 1a is formed on the film surface. After the photomask is manufactured, when the photomask is cleaned, foreign matter existing on the film surface side of the photomask substrate 1 must be removed as much as possible. Therefore, in the rotary cleaning device 50, a contact cleaning mechanism using the scrubbing material 55 can be installed. The contact cleaning mechanism is a mechanism in which the scrubbing material 55 is arranged facing the upper side (film surface) of the mask substrate 1 by the action of the arm (not shown) holding the scrubbing material 55, and The scrubbing material 55 is brought into contact with the upper side of the mask substrate 1 to perform cleaning.

However, the photomask substrate 1 supports its own weight by being placed on the holder 51. Therefore, there is not much space on the lower side of the mask substrate 1. Therefore, although the processing liquid sprayed from the lower processing liquid supply line 57 can pass through the gap of the holder 51 to reach the lower surface of the mask substrate 1 for processing, it is extremely difficult to apply contact cleaning using a scrubbing material or the like downward. The reason is that if a scrubbing material or the like is contacted and cleaned on the downward side of the photomask substrate 1 to more actively remove foreign matter, problems such as interference between the arm holding the scrubbing material and the holder 51 may occur.

Therefore, as a method of contacting and cleaning both the film surface and the back surface of the mask substrate 1, before processing the film surface, as shown in FIG. 2(a), the mask substrate 1 is placed on the holder with the film surface facing down 51. At this time, the scrubbing material 55 is used to clean the back side facing upward. After that, as shown in FIG. 2(b), the mask substrate 1 is turned upside down and placed on the holder 51. At this time, the scrubbing material 55 is used to clean the film surface facing upward. Furthermore, when the front and back surfaces of the mask substrate 1 are cleaned separately, the film surface can be cleaned first and then the back surface can be cleaned. However, the foreign matter on the film surface side should be removed as much as possible in the end, which is advantageous. The treatment of the film surface is carried out last.

However, the present inventors found that even in the case of the last treatment of the film surface, the foreign matter removed from the back surface by washing may exist on the end surface of the mask substrate 1 when the back surface facing upward is cleaned before. The foreign matter will also penetrate into the membrane side together with the treatment liquid (Figure 3). That is, in the above-mentioned cleaning method, foreign matter attached to the back surface of the photomask substrate 1 or foreign matter attached to the end surface of the photomask substrate 1 due to the operation of the photomask manufacturing process, etc., is cleaned with the backside as the upward direction. It will penetrate into the membrane side as shown by the dotted arrow in Figure 3. In particular, when the roughness of the end surface of the mask substrate 1 is relatively thicker than that of the main surface, since many foreign substances are hidden on the end surface, the tendency of the foreign substances to penetrate to the film surface side becomes remarkable.

In addition, in the cleaning for removing foreign matter whose size is less than 50 μm (for example, about 0.5-50 μm), the cleaning environment should be sufficiently clean. If the measures to prevent the contamination of the cleaning device or the scrubbing material, the dripping or re-adhesion of the treatment liquid scattered in the cleaning device are insufficient, it is possible that the amount of foreign matter will not be reduced by one cleaning , It will increase the number of foreign objects. On the other hand, by rectifying the cleaning environment well, the amount of foreign matter can be reduced at a specific rate. However, even if about 70% of foreign matter can be removed with one wash, it is almost impossible to achieve 100% removal in reality. Therefore, it is important to minimize the amount of foreign matter in the initial stage before cleaning the film surface in the substrate cleaning step. As described above, in the case where the back surface of the mask substrate 1 is cleaned first, and the film surface of the mask substrate 1 is cleaned thereafter, during the initial washing of the back surface, foreign matter may penetrate into the film surface side. The number of foreign objects adhering to the film surface has increased. As a result, in the washing of the film surface in the subsequent steps, the amount of remaining foreign matter that is not completely removed tends to increase. That is, the inventors of the present invention have found that it is desirable that there is no process that increases the amount of foreign matter on any side of the mask substrate 1 during the cleaning step, and it is particularly advantageous to use a process to form a fine pattern (or pattern already formed) It is a step that does not even temporarily increase the number of foreign objects on the film side.

Hereinafter, specific embodiments of the present invention based on the findings of the inventors will be described.

<Substrate Processing Apparatus> Fig. 4 is a schematic side view showing a configuration example of the substrate processing apparatus according to the embodiment of the present invention. The illustrated substrate processing apparatus 10 can be used as a substrate cleaning apparatus in which a photomask substrate is used as a substrate to be processed, for example. In this case, the substrate processing apparatus 10 can be used to clean the photomask substrate as needed before or after the various steps (film formation, development, etching, inspection, defect correction, etc.) related to photomask manufacturing. In particular, the photomask substrate 1 of the embodiment of the present invention exerts a significant effect when cleaning the photomask substrate in a patterned state after the etching step and after the defect correction step in a series of photomask manufacturing.

The substrate processing apparatus 10 shown in the figure includes: a holder 11 as a supporting member that supports a substrate; a clamping member 12 that holds the outer edge of the substrate; and a driving device 13 that is opposed to the substrate held by the clamping member 12 The holder 11 is driven by approaching and leaving; the scrubbing moving device 15, which moves the scrubbing material 14; the upper surface side processing liquid supply device 16, which supplies processing liquid to the upper side of the substrate; the lower surface side processing liquid supply device 17, It supplies the processing liquid to the lower side of the substrate; and the control unit 18, which controls the driving device 13 and the scrubbing moving device 15. Hereinafter, the substrate will be described as the mask substrate 1. Among the two main surfaces of the mask substrate 1, one main surface 2 becomes a film surface on which a transfer pattern 1a is formed, and the other main surface 3 becomes a back surface including a glass surface.

The holder 11 is a member that supports the photomask substrate 1 from the lower side in a state where the main surfaces 2 and 3 of the photomask substrate 1 are horizontal as shown in the side view of FIG. 5(a). Furthermore, the term “horizontal” refers to a situation that is substantially horizontal, and includes, for example, a situation in which the mask substrate 1 is deformed due to the influence of bending caused by its own weight. When setting the photomask substrate 1 in the substrate processing apparatus 10, first, the photomask substrate 1 is placed on the holder 11. In addition to being used as a special jig for the substrate processing apparatus 10, the holder 11 can also be used as a transfer jig for transferring the mask substrate 1 from other steps to the substrate processing apparatus 10, or it can also be used as a support in other steps. The component of the mask substrate 1. Therefore, the holder 11 is preferably detachable from the substrate processing apparatus 10.

On the upper surface of the holder 11, a plurality of pins 21 each having a column shape are provided. These pins 21 support the photomask substrate 1 from the downward side by contacting the downward surface of the photomask substrate 1 when the photomask substrate 1 is placed on the holder 11. Each pin 21 is preferably located within a range of 10 mm from the outer edge of the main surface of the mask substrate 1. In addition, the contact area between the main surface (downward) of the mask substrate 1 and the pins 21 is small, for example, the total is 100 mm ² or less. In order to reduce the above-mentioned contact area, the front end (upper end) of the pin 21 contacting the main surface may be formed in a convex curved shape, preferably a hemispherical shape. Moreover, each pin 21 is preferably set as shown in the top view of FIG. 5(b) so as to be located in the vicinity of the four corners of the main surface of the mask substrate 1 which is a quadrilateral in plan view.

The clamping member 12 clamps a part of the outer edge of the substrate supported by the holder 11 from two opposing directions to hold the substrate. The center axes of the pair of clamping members 12 are located on a straight line. The clamping members 12 preferably respectively hold a part of two opposite sides of the main surface of the photomask substrate 1. Specifically, it may be a clamping member 12 that clamps and holds the outer edge of the main surface of the mask substrate 1. Here, the mask substrate 1 as shown in FIG. 6 has two main surfaces (2, 3) and four end surfaces 4, and is located between the main surface 2 and the four end surfaces 4 and the main surface 3 and the four end surfaces 4 There are corner surfaces 5 between them. The clamping member 12 preferably has a contact surface that contacts the corner surface 5 of the mask substrate 1. Thereby, the clamp member 12 can hold the photomask substrate 1 without surface contact with the main surface of the substrate on at least either side, but only in line contact with the main surface. At the front end of the clamping member 12, as shown in FIG. 6, by forming a cut having a substantially trapezoidal cross-section, two contact surfaces 22 having an inclination angle with respect to the main surface of the clamped and held mask substrate 1 are provided. The opening angle θ (deg) of the two contact surfaces 22 at the front end of the clamping member 12 is preferably such that the contact surface 22 can contact the corner surface formed between the main surfaces 2, 3 and the end surface 4 of the mask substrate 1. 5 ways to set. For example, it can be set to 70≦θ≦100.

Here, as shown in FIG. 7, when the mask substrate 1 is formed in a rectangular shape in plan view, and the length of the long side of the mask substrate 1 is W1 and the length of the short side is W2, the clamping member 12 holds the mask substrate 1 The contact length L (mm) can be set as follows, for example. That is, when the photomask substrate 1 is held by a pair of clamping members 12, the contact length L (mm) of the clamping member 12 in contact with the photomask substrate 1 in the length direction of the holding side is preferably considered to be applied The minimum size of the mask substrate 1 of this device is set to 50≦L≦500. In this case, it is preferable to hold the middle part or the vicinity of the longitudinal direction of each side facing each other by one clamping member 12, respectively. In this case, a pair of clamping members 12 can hold the mask substrate 1 of various sizes with one side (long side, short side) of about 500-1500 mm.

Furthermore, in FIG. 7, a pair of clamping members 12 is used to hold the two opposite long sides of the mask substrate 1, but the above-mentioned setting of the contact length L (mm) can also be applied to a The clamping member 12 holds the two short sides of the photomask substrate 1 facing each other. Also, as shown in FIG. 8, when a plurality of pairs of clamping members are used, and a plurality of clamping members 12 (two in the example of FIG. 8) are used to hold one side of the mask substrate 1, it is preferable to clamp each The contact lengths L1 and L2 of the tightening members 12 are respectively set to 50-200 mm, and the spacing distance B1 between adjacent clamping members 12 is set to 500 mm or less.

Alternatively, as shown in FIG. 9, it may be configured as follows, namely, a pair of clamping members 12a hold the opposing sides of the photomask substrate 1 (the long sides in the example of FIG. 9), on the other hand, The other pair of clamping members 12b hold the other two opposite sides of the photomask substrate 1 (short sides in the example of FIG. 9). In this configuration, two pairs of clamping members 12a, 12b can hold the four sides of the mask substrate 1 at the same time, or two pairs of clamping members 12a, 12b can alternately hold the opposing sides of the mask substrate 1 (long sides or short sides). ). Furthermore, in FIG. 7 and the like, the design of the pattern of the mask substrate 1 to indicate the direction of the mask substrate 1 does not necessarily refer to the actual transfer pattern.

The clamping member 12 is attached to the front end of the arm 25 as shown in FIG. 4 described above. The arm 25 operates in the following manner. First, when it is necessary to hold the mask substrate 1 by the clamp member 12, the arm 25 is moved forward so that the clamp member 12 contacts the outer edge of the mask substrate 1 supported by the holder 11. In addition, when it is not necessary to hold the photomask substrate 1 by the clamp member 12, the clamp member 12 is separated from the outer edge of the photomask substrate 1, and the arm 25 is moved to the outside of the holder 11 to avoid. The movement of the arm 25 is controlled by the control unit 18. By performing the control in a manner that the movements of the two arms 25 in a pair are synchronized, the pair of clamping members 12 also move synchronously.

The driving device 13 is driven to move at least one of the holder 11 and the clamping member 12 in the vertical direction to separate the mask substrate 1 held by the pair of clamping members 12 from the holder 11. When the clamp member 12 is moved in the vertical direction, after the above-mentioned arm 25 moves forward to hold the mask substrate 1 by the clamp member 12, as shown in FIG. 10(a), a pair of clamps The tight member 12 moves to the upper side in the vertical direction (hereinafter, also referred to as "up"). In addition, when the holder 11 is moved in the vertical direction, as shown in FIG. 10(b), after the photomask substrate 1 is held by a pair of clamping members 12, the holder 11 is moved to the lower side in the vertical direction. (Hereinafter, also referred to as "decline"). As a result, the lower face of the mask substrate 1 can be separated from the holder 11 in the vertical direction, thereby expanding the space on the lower face of the mask substrate 1.

Furthermore, when the downward facing of the photomask substrate 1 is separated from the holder 11, the clamping member 12 may be raised and the holder 11 may be lowered. Furthermore, the clamping member 12 after being raised as shown in Fig. 10(a) can be lowered to the original position, or the holder 11 after being lowered as shown in Fig. 10(b) can be raised to the original position, thereby The mask substrate 1 and the holder 11 are relatively close to close the space on the lower side of the mask substrate 1. For example, when the photomask substrate 1 is transferred between the holder 11 and the clamping member 12, they are relatively close to each other.

In addition, the driving device 13 also has a function as a rotating device for rotating the mask substrate 1 supported by the holder 11 in a horizontal plane. The rotating device rotates the rotating shaft 19 (FIG. 4) on which the holder 11 is mounted horizontally, so that the mask substrate 1 supported by the holder 11 rotates in a horizontal plane. Thereby, the arrangement posture (direction) of the mask substrate 1 in the horizontal plane can be changed. The rotating device can rotate the mask substrate 1 at an angle of 90 degrees in a horizontal plane, for example.

Furthermore, in this embodiment, the driving device 13 is configured to have the function of a rotating device, but the driving device 13 and the rotating device may be configured separately. Moreover, when the substrate processing apparatus 10 is equipped with the functions of a rotating cleaning device or a drying device, the above-mentioned rotating device may be one that rotates the holder 11 at a high speed.

The scrubbing moving device 15 introduces the scrubbing material 14 for contacting and cleaning the mask substrate 1 toward the lower side by the above-mentioned driving device 13 into the space formed on the lower side of the mask substrate 1. When the drive device 13 separates the photomask substrate 1 from the holder 11, the scrubbing moving device 15 moves the scrubbing material 14 in the space on the lower side of the photomask substrate 1 formed by the separation. In addition, the scrubbing moving device 15 moves the scrubbing material 14 downward along the mask substrate 1 while causing the scrubbing material 14 to contact the mask substrate 1 downward. Thereby, the lower surface of the photomask substrate 1 can be cleaned by the scrubbing material 14 contacting and cleaning.

The scrubbing moving device 15 can hold scrubbing materials 14 such as sponges or brushes. In addition, the scrubbing moving device 15 introduces the scrubbing material 14 into the space when the mask substrate 1 needs to be contact cleaned downward, and when the contact cleaning is not required, the scrubbing material 14 is retracted from the space. In addition, the scrubbing moving device 15 allows the scrubbing material 14 to contact the lower surface of the mask substrate 1, and while maintaining this state, the scrubbing material 14 moves downward along the mask substrate 1, so that the entire downward processing can be performed (washing). net). Therefore, when the downward facing of the mask substrate 1 is set to the XY surface, the scrubbing moving device 15 is shown in FIG. 11, and the scrubbing material 14 is moved horizontally in a specific path in the XY plane to cover the downward facing The whole way is processed.

The scrubbing material 14 is preferably a disc brush or sponge, etc., preferably in the shape of a disc (Figure 12). As other scrubbing materials, a roller brush can also be used. However, if a roller brush with a horizontal rotating shaft is used, the foreign matter will be scattered with the treatment liquid splashed by the rotation of the roller brush, and the foreign matter will easily adhere to the substrate again. Therefore, in order to prevent upward contamination of the substrate due to re-adhesion of foreign matter, it is preferable to apply a disk-shaped scrubbing material 14 and process (clean) the substrate while moving it only in the XY plane.

The upper surface side processing liquid supply device 16 (FIG. 4) supplies the processing liquid to the upper side of the mask substrate 1 supported by the holder 11.

The lower surface side processing liquid supply device 17 (FIG. 4) supplies the processing liquid to the lower surface of the photomask substrate 1 held by the clamping member 12. For example, when the scrubbing material 14 is contacted and moved along the lower surface of the mask substrate 1 by the scrubbing moving device 15, a processing liquid (washing liquid or rinse liquid) is supplied to the vicinity of the contact surface of the mask substrate 1 and the scrubbing material 14 . Regarding the supplied processing liquid, in order to make the residence time of the mask substrate 1 toward the lower side longer, it is preferable to use a gel-like or foam-containing one with higher viscosity. Therefore, the processing liquid tank (not shown) to which the lower surface side processing liquid supply device 17 is connected may also be accompanied by a mixer for generating foam or a supply device of gas (air, nitrogen, etc.).

The control unit 18 controls the control object according to a preset control program. In addition to the drive device 13 and the scrubbing movement device 15, the control target also includes an arm 25. Therefore, the actions of the driving device 13, the scrubbing movement device 15, and the arm 25 are controlled by the control unit 18, respectively.

<Substrate Processing Apparatus> Next, the substrate processing method according to the embodiment of the present invention will be described using FIGS. 13 and 14. In addition, in FIGS. 13(a) to (f) and FIGS. 14(a) to (f), the left side shows a side view, and the right side shows a plan view.

The substrate processing method of the embodiment of the present invention can be implemented using the substrate processing apparatus 10 of the above-mentioned configuration, and can also be implemented using the substrate processing apparatus of other configurations. Here, as an example, a substrate processing method using the substrate processing apparatus 10 configured as described above will be described. Furthermore, in the substrate processing method of the embodiment of the present invention, a case will be described in which the mask substrate 1 on which the transfer pattern is formed is used as the substrate to be processed, and the light on which the transfer pattern is formed The film surface of the cover substrate 1 is set to face upward, the back surface (glass surface) is set to face downward, and is processed (washed, etc.) with a treatment liquid to face downward.

(Substrate processing method of the first embodiment) First, as shown in FIG. 13(a), the mask substrate 1 as the substrate to be processed is set in the substrate processing apparatus 10 (FIG. 4). Specifically, in a state where the main surfaces 2 and 3 of the mask substrate 1 are horizontal, the mask substrate 1 is placed on the holder 11 (installation step). At this time, the plurality of pins 21 provided in the holder 11 are in contact with the vicinity of the outer edge of the mask substrate 1 toward the lower surface, thereby supporting the weight of the substrate from the lower side of the mask substrate 1.

Next, as shown in FIG. 13(b), a pair of arms 25 (FIG. 4) facing each other approaches (moves forward) from a horizontal plane approximately the same as the mask substrate 1, and is held by a pair of clamping members 12 Mask substrate 1. At this time, the clamping member 12 installed at the front end of each arm 25 clamps and holds a part of the outer edge of the substrate located on the opposite sides of the main surface of the mask substrate 1 (short side in the illustration). Thereby, the photomask substrate 1 is clamped by a pair of clamping members 12 from both sides, and it maintains horizontally (holding process, 1st holding process).

Next, as shown in FIG. 13(c), the holder 11 is lowered by the driving device 13, thereby separating the mask substrate 1 from the holder 11 facing downward (separation step). Thereby, a space of a certain height is formed between the downward facing of the mask substrate 1 and the holder 11. The space has a height that does not interfere even if the scrubbing moving device 15 is introduced, and preferably has a height of about 40 to 80 cm. Furthermore, although the holder 11 is lowered here, the clamp member 12 holding the photomask substrate 1 may be raised. In addition, the holder 11 may be lowered and the clamp member 12 may be raised.

Next, as shown in FIG. 13(d), the scrubbing moving device 15 is introduced into the space between the lower face of the mask substrate 1 and the holder 11, and the scrubbing material 14 mounted on the scrubbing moving device 15 is placed in the space The inner part is in contact with the bottom face of the mask substrate 1. In addition, while the scrubbing material 14 is brought into contact with the lower surface of the photomask substrate 1, the scrubbing material 14 is moved downward along the photomask substrate 1. At this time, the processing liquid is supplied to the lower surface of the mask substrate 1 by the lower surface-side processing liquid supply device 17, whereby the processing liquid is used to process (in this embodiment, the cleaning process) of the mask substrate 1 (processing Step, the first processing step).

In this embodiment, a disc brush is used as the scrubbing material 14, and while the disc brush is rotated at a specific speed (rotation), while the disc brush is used to draw a specific track on the entire bottom of the mask substrate 1. Way to move. The movement of the disk brush as the scrubbing material 14 may be, for example, the reciprocating movement shown by the broken line in FIG. 12 above. Furthermore, it is preferable that a through hole penetrating in the longitudinal direction is formed in the center of the scrubbing material 14, and the lower surface side processing liquid supply device 17 sprays the processing liquid (washing liquid) through the through hole. If it is configured as described above, it can be directly The processing liquid is supplied to the contact surface of the reticle substrate 1 facing downward and the scrubbing material 14. The processing liquid supplied by the lower surface side processing liquid supply device 17 may be heated to, for example, about 30 to 60 degrees. When the treatment with the treatment liquid is finished, the scrubbing material 14 and the scrubbing moving device 15 are allowed to escape from the space between the downward face of the mask substrate 1 and the holder 11.

Furthermore, when it is desired to hold the photomask substrate 1 by the clamping member 12 and to clean the entire downward surface of the photomask substrate 1 by the scrubbing material 14, a part of the outer edge of the substrate where the clamping member 12 exists , Due to the interference between the clamping member 12 and the scrubbing material 14, there will be an area where the scrubbing material 14 cannot be contacted. Specifically, as shown in FIG. 6 described above, there is a region where the front end of the clamp member 12 protrudes toward the lower surface of the mask substrate 1 by a dimension d, and this region is caused by interference between the clamp member 12 and the scrubbing material 14. The untreated area (unwashed area) that has not been treated (washed). The area of the unwashed area varies according to the shape of the clamping member 12 and the thickness of the mask substrate 1, and for example, the size d is about 2-50 mm. Generally speaking, the thickness of the substrate varies with the size of the substrate size (length dimension of each side) of the mask substrate 1. Therefore, as a mask for display device manufacturing, it is impossible to handle various substrates of different sizes. avoid.

Next, as shown in FIG. 13(e), the drive device 13 raises the holder 11 that has been lowered in order to expand the space, whereby the photomask substrate 1 is placed on the holder 11 again.

Next, by making the arm 25 avoid the holder 11, as shown in FIG. 13(f), the outer edges of the substrate located on the opposite sides of the mask substrate 1 (short sides in the example) are removed from The clamping hold of the clamping member 12 is released. As a result, the photomask substrate 1 is again supported by the holder 11 having the plurality of pins 21 from the lower side. At this stage, the above-mentioned untreated area (unwashed area) 1b exists on the lower side of the mask substrate 1.

Next, as shown in FIG. 14(a), the holder 11 is rotated 90 degrees (or 270 degrees) in the horizontal plane by the driving device 13 (rotation step). Thereby, the directions of the long side and the short side of the mask substrate 1 are exchanged in the horizontal plane.

Next, as shown in FIG. 14(b), by making the pair of arms 25 approach again (advancing movement), the clamping member 12 is clamped and held at a position different from the two sides of the clamp and held in FIG. 13(b). The outer edges of the substrate on both sides (the long sides in the illustration) (the second holding step).

Next, as shown in FIG. 14(c), the holder 11 is lowered again by the driving device 13 to separate the lower face of the photomask substrate 1 from the holder 11, and the lower face of the photomask substrate 1 and the holder 11 A space of a specific height is formed between 11.

Next, as shown in FIG. 14(d), the scrubbing moving device 15 is introduced again between the lower face of the mask substrate 1 and the holder 11, and the scrubbing material 14 is brought into contact with the face of the mask substrate 1 in the space. Next, the scrubbing material 14 is moved downward along the photomask substrate 1 while processing the entire surface of the photomask substrate 1 with a processing liquid (cleaning liquid) (second processing step). At this time, the scrubbing material 14 is also in contact with the untreated area (unwashed area) 1b, so the untreated area 1b disappears. Therefore, the washing of the entire downward direction including the untreated area 1b is completed.

Next, as shown in FIG. 14(e), the drive device 13 raises the holder 11 that has been lowered in order to expand the above-mentioned space, thereby setting the photomask substrate 1 on the holder 11 again.

Next, as shown in FIG. 14(f), the outer edges of the substrate located on the opposite sides of the mask substrate 1 (the long side in the illustration) are removed from the outer edges of the substrate by making the arm 25 to the outside of the holder 11 The clamping hold of the clamping member 12 is released. Thereby, the photomask substrate 1 is restored to the state supported by the plurality of pins 21 provided in the holder 11 from the lower side.

According to the above-mentioned substrate processing apparatus 10 and the substrate processing method using the same, even if the photomask substrate 1 is not turned upside down, the scrubbing material 14 can be used to process the entire downward face of the photomask substrate 1 supported by the holder 11 with a processing liquid. Thereby, when the back surface of the photomask substrate 1 is cleaned downward, it is possible to prevent foreign matter etc. from penetrating into the film side due to the back side cleaning, thereby reducing contamination caused by adhesion of foreign matter and the like. In addition, according to this substrate processing method, by clamping and holding the opposing long sides and short sides of the photomask substrate 1 once each, the entire surface facing downward can be processed. The part that has been released from the clamp will not be clamped again. For the mask substrate 1 having a quadrilateral (square or rectangular) main surface, the simplest action that can be maintained alternately from two orthogonal directions can quickly process the entire surface downward.

(Substrate processing method of the second embodiment) The substrate processing method of the second embodiment of the present invention is different from the above-mentioned first embodiment in the following points. First, in the step of FIG. 13(b) or FIG. 14(b), the mask substrate 1 is held by a pair of clamping members 12. At this time, if the mask substrate 1 is bent due to its own weight, the height of the center of gravity position of the mask substrate 1 becomes lower than the height of the outer edge of the substrate held by the clamping member 12. Therefore, if the scrubbing material 14 is moved on a horizontal surface, the downward pressure of the scrubbing material 14 on the photomask substrate 1 may become uneven or the contact state of the two cannot be maintained properly.

Therefore, in the second embodiment of the present invention, as shown in FIG. 15, when the horizontal plane is set to the XY plane, the scrubbing moving device 15 can not only move the scrubbing material 14 in the XY plane, but can also place the scrubbing material 14 on the Move in a three-dimensional direction including the Z direction. Specifically, it is preferable to have a configuration in which the scrubbing moving device 15 is controlled by the control unit 18 (FIG. 4 ), so that the scrubbing material 14 can be moved in contact with the concave and convex of the downward shape of the mask substrate 1. In this case, for example, based on the shape of the mask substrate 1 (longitudinal and horizontal dimensions, thickness) and the physical properties of the material, the curved shape of the mask substrate 1 when it is bent due to its own weight is estimated in advance, and the shape of the mask substrate 1 is calculated three-dimensionally. Control the movement of the scrubbing material 14. Thereby, even when the mask substrate 1 is bent due to its own weight, the scrubbing material 14 can be moved downward along the mask substrate 1 by following the curved shape. Therefore, the scrubbing material 14 can be brought into contact with the entire downward surface of the mask substrate 1 with a uniform pressure.

(Substrate processing method of the third embodiment) In the substrate processing method of the first embodiment described above, the mask substrate 1 clamped and held by the clamping member 12 is horizontally maintained, and the scrubbing material 14 and the substrate face downward. The composition of contact. On the other hand, in the third embodiment, as shown in FIG. 16, a configuration is adopted in which the mask substrate 1 clamped and held by the clamp member 12 is inclined and held by a certain angle with respect to the horizontal plane. Specifically, in the step of Fig. 13(b) or Fig. 14(b), the mask substrate 1 clamped and held by the clamping member 12 is inclined at a specific angle (about 2 degrees to 20 degrees), and in this state The treatment liquid (washing liquid) 30 is supplied from the lower surface side treatment liquid supply device 17 (FIG. 4) from the lower surface side upstream side (high side) from the lower side. As a result, as shown by the dotted arrow in FIG. 16, the processing liquid 30 flows from the upstream side of the mask substrate 1 toward the lower side to the downstream side (lower side). That is, the flow direction of the processing liquid 30 can be controlled to a fixed direction from the bottom of the mask substrate 1. Therefore, stagnation or irregular dripping of the treatment liquid 30 can be suppressed. Furthermore, in the third embodiment, by configuring the scrubbing moving device 15 to move the scrubbing material 14 in a three-dimensional direction, it is also possible to control the movement of the scrubbing material 14 three-dimensionally in accordance with the tilt of the mask substrate 1. Therefore, the scrubbing material 14 can be brought into contact with the entire downward surface of the mask substrate 1 with a uniform pressure.

(Other Embodiments) In the above embodiment, the case where a pair of clamping members 12 are used to hold the photomask substrate 1 has been described, but for example, as shown in the above-mentioned FIG. 9, two pairs of clamping members 12 (12a, 12b) In the case of holding the photomask substrate 1, the steps (rotating step) in FIGS. 13(e), (f) and 14(a) described above can be omitted. Specifically, when the step of FIG. 13(d) is ended, in addition to holding one pair of clamping members 12a on the two opposite sides (short sides) of the mask substrate 1 so far, the other pair of clamping members 12a is also clamped The member 12b maintains two sides different from the two sides. Next, after the clamping and holding of the pair of clamping members 12a is released, the lower surface of the photomask substrate 1 is treated (washed) with the scrubbing material 14 with the treatment liquid. Next, by lifting the holder 11, after the photomask substrate 1 is set on the holder 11 again, the clamping and holding of the pair of clamping members 12b is released. Thereby, the steps are simplified compared with the above-mentioned first embodiment. Therefore, the processing of the mask substrate 1 can be efficiently performed.

In the above-mentioned embodiment, the case where the mask substrate 1 is processed facing downward has been described, but at the same time, it is also possible to process the mask substrate 1 facing upward using a scrubbing moving device or scrubbing material. That is, the substrate processing apparatus according to the embodiment of the present invention includes an aspect in which an upward scrubbing moving device or scrubbing material for processing the photomask substrate 1 is additionally provided, and a processing liquid for supplying processing liquid upward is additionally provided. The device is supplied, and its operation is controlled by the above-mentioned control unit.

In addition, after using the substrate processing method of the embodiment of the present invention to clean the back surface of the mask substrate 1 as downward by using the scrubbing material 14 and a cleaning solution, the mask substrate may be cleaned using a well-known rotary cleaning device 1 of the film surface. In this process, it is not necessary to turn the mask substrate 1 up and down. In this case, the following mask cleaning method is realized, which has a back surface cleaning step of washing the back surface with the back surface of the mask substrate 1 as the bottom, and a state where the film surface of the mask substrate 1 is the upper side The film surface cleaning step of cleaning the film surface of the photomask substrate 1 is performed, and there is no step of turning the photomask substrate 1 upside down between the back surface cleaning step and the film surface cleaning step. In this mask cleaning method, since the back surface of the mask substrate 1 is cleaned with the film surface facing upward, the risk of foreign matter infiltrating the film surface during back surface cleaning can be reduced.

In the above-mentioned embodiment, as the substrate to be processed in the substrate processing apparatus 10 or the substrate processing method, the mask substrate 1 is taken as an example for description, but the type or use of the substrate to be processed is not particularly limited . In addition, when the photomask substrate 1 is cleaned, the specification or use of the photomask is not particularly limited. For example, the substrate processing apparatus 10 or the substrate processing method of the embodiment of the present invention can be preferably applied to the case of processing photomask substrates for manufacturing display devices (liquid crystal panels, organic electroluminescence panels, etc.). In addition, as a mask substrate for display device manufacturing, for example, a mask substrate having a quadrilateral main surface with a side of about 300-2000 mm and a thickness of about 5-20 mm can be applied. In particular, if it is applied to a display device with a pattern CD (Critical Dimension) fine (for example, CD=3 μm or less, or about 1 to 3 μm) hole pattern, L/S (line/space) pattern light for display devices Cover the substrate, the effect is remarkable. These mask substrates can be used with FPD exposure equipment (with a light source including any or all of i-line, h-line, and g-line, and the NA (numerical aperture) of the optical system is about 0.08-0.15 projection exposure device or Proximity exposure device with the same light source, etc.), transfer the pattern for transfer to the body to be transferred.

The present invention can be realized in the form of a mask manufacturing method including the substrate processing method of the above-mentioned embodiment, and can also be realized in the form of a mask manufacturing method including the mask cleaning method having the above-mentioned back surface cleaning step and film surface cleaning step.

The photomask manufacturing method has the following steps, for example. The step of preparing a photomask substrate with resist. The photomask substrate with resist is formed by forming at least one optical film (such as a light-shielding film) on the main surface of the photomask, and then coating and forming a photoresist film. The step of drawing pattern data based on the design of the device to be obtained on the mask substrate using a drawing device using laser or electron beam. The step of developing the photoresist film after drawing to form a resist pattern. Using the formed resist pattern as an etching mask, the above-mentioned optical film is etched by dry etching or wet etching to form a pattern for transfer. Check the formed transfer pattern, and perform the steps of correcting the defects of the pattern as necessary. At any stage of these steps, the substrate processing method or the photomask cleaning method of the embodiment of the present invention can be applied.

1‧‧‧Mask substrate 1a‧‧‧Pattern for transfer 1b‧‧‧Unprocessed area 2.‧‧Main surface 3‧‧‧Main surface 4‧‧‧End surface 5‧‧‧Corner surface 10‧‧‧Substrate Handling device 11‧‧‧Retainer 12‧‧‧Clamping member 12a‧‧‧Clamping member 12b‧‧‧Clamping member 13‧‧‧Drive device 14‧‧‧Scrubbing material 15‧‧‧Scrubbing moving device 16‧ ‧‧Upper surface side processing liquid supply device 17‧‧‧Lower surface side processing liquid supply device 18‧‧‧Control part 19‧‧‧Rotating shaft 21‧‧‧Pin 22‧‧‧Contact surface 25‧‧‧Arm 30‧ ‧‧Processing liquid 50‧‧‧Rotary cleaning device 51‧‧‧Retainer 52‧‧‧Shield 53‧‧‧Rotating shaft 54‧‧‧Drive unit 55‧‧‧Scrubbing material 56‧‧‧Upper side treatment liquid supply Pipeline 57‧‧‧Lower processing liquid supply pipe 58‧‧‧Pin 59‧‧‧Clamp A‧‧‧Part B1‧‧‧Separation distance d‧‧‧Dimension L‧‧‧Contact length L1‧‧‧Contact length L2‧‧‧Contact length W1‧‧‧Long side length W2‧‧‧Short side length X‧‧‧Direction Y‧‧‧Direction Z‧‧‧Direction θ‧‧‧Opening angle

Fig. 1 is a schematic side view showing a configuration example of a rotary cleaning device as a reference example. Figure 2 (a) is a schematic side view showing the configuration when the cleaning device shown in Figure 1 is used to clean the back of the substrate with a scrubbing material, and (b) is a schematic side view showing the use of the rotary cleaning device shown in Figure 1 A schematic side view of the configuration when the film surface of the substrate is cleaned with a scrubbing material. FIG. 3 is a schematic side view illustrating the penetration of foreign matter when cleaning the back surface of the substrate. Fig. 4 is a schematic side view showing a configuration example of the substrate processing apparatus according to the embodiment of the present invention. Fig. 5 (a) is a schematic side view showing the structure of the retainer, and (b) is a schematic plan view showing the pin arrangement of the retainer. Figure 6 is an enlarged view of part A of Figure 4; Fig. 7 is a schematic plan view showing an example of holding the substrate by the clamp member (No. 1). Fig. 8 is a schematic plan view showing an example of holding the substrate by the clamp member (Part 2). Fig. 9 is a schematic plan view showing an example of holding the substrate by the clamp member (No. 3). Fig. 10 (a) is a schematic side view showing an example in which the clamping member is moved upward in the vertical direction to separate the substrate from the holder, and (b) is a schematic side view showing an example of moving the holder downward in the vertical direction to make the substrate A schematic side view of the case separated from the holder. Fig. 11 is a schematic side view showing a state in which the scrubbing moving device is introduced into the space between the downward face of the substrate and the holder and the scrubbing material is moved. Fig. 12 is a perspective view showing an example of the shape and movement trajectory of the scrubbing material. Figures 13(a) to (f) are diagrams illustrating the substrate processing method of the first embodiment of the present invention (No. 1). 14(a) to (f) are diagrams (Part 2) for explaining the substrate processing method of the first embodiment of the present invention. Fig. 15 is a diagram illustrating a substrate processing method according to the second embodiment of the present invention. Fig. 16 is a diagram illustrating a substrate processing method according to a third embodiment of the present invention.

1‧‧‧Mask substrate

1a‧‧‧Pattern for transfer

2‧‧‧Main side

3‧‧‧Main side

10‧‧‧Substrate processing equipment

11‧‧‧Retainer

12‧‧‧Clamping member

13‧‧‧Drive device

14‧‧‧Scrubbing material

15‧‧‧Wipe the mobile device

16‧‧‧Upper surface side processing liquid supply device

17‧‧‧Bottom surface side processing liquid supply device

18‧‧‧Control Department

19‧‧‧Rotating axis

21‧‧‧pin

25‧‧‧arm

Part A‧‧‧

Claims (12)

A substrate processing device that processes the downward side of the substrate with a processing liquid, and has: a supporting member that supports the substrate from the downward side when the main surface of the substrate is set horizontally; and a clamping member , Which clamps a part of the outer edge of the substrate supported by the support member from two opposing directions to hold the substrate; a driving device for separating the substrate held by the clamping member from the support member , And make at least one of the support member and the clamping member move in the vertical direction; the scrubbing moving device, in the space formed by the separation, while the scrubbing material is in contact with the substrate facing downward, The scrubbing material moves along the downward direction of the substrate; and a processing liquid supply device that supplies the processing liquid to the downward surface of the substrate. The substrate processing apparatus of claim 1, wherein a contact surface capable of contacting a corner surface formed between the main surface and the end surface of the substrate is provided at the front end of the clamping member. The substrate processing apparatus of claim 1 or 2, which has a rotating device that rotates the substrate supported by the supporting member in a horizontal plane. A substrate processing method, which is to process the downward side of the substrate by a processing liquid, and has the following steps: in a state where the main surface of the quadrilateral of the substrate is set horizontally, by using a supporting member The substrate is supported from the lower side, and the substrate is set; the holding step is to clamp and hold part of the outer edge of the substrate on the opposite sides of the main surface of the substrate; the separation step is to make the substrate At least one of the clamped substrate and the support member moves in the vertical direction to separate the substrate downward from the support member; and a processing step of supplying the processing liquid to the downward direction, and then In the space formed by the separation, the scrubbing material is brought into contact with the downward surface of the substrate, and the scrubbing material is moved along the downward surface of the substrate, thereby treating the downward surface of the substrate with the processing liquid. A substrate processing method, which treats the downward side of the substrate by a processing liquid, and has the following steps: in a state where the main surface of the quadrilateral of the substrate is set to be horizontal, the substrate is supported from the downward side by a supporting member The substrate is provided with the substrate; the first holding step is to clamp and hold a portion of the outer edge of the substrate located on the opposite sides of the main surface of the substrate; the separation step is to hold the above-mentioned At least one of the substrate and the supporting member is moved in the vertical direction to separate the substrate from the supporting member toward the lower side; the first processing step includes supplying the processing liquid to the lower side and forming the substrate by the separation In the space, while the scrubbing material is brought into contact with the downward side of the substrate, the scrubbing material is moved along the downward direction of the substrate, thereby treating the downward surface of the substrate with the processing liquid; the second holding step, it will be located above The outer edges of the substrates on both sides are released from clamping and holding, and parts of the outer edges of the substrates located on two sides different from the above two sides are clamped and held separately; and In the second processing step, the processing liquid is supplied to the downward direction, and in the space, the scrubbing material is brought into contact with the downward surface of the substrate, and the scrubbing material is moved along the downward surface of the substrate to utilize the processing Liquid treat the above-mentioned substrate facing downward. The substrate processing method of claim 5, wherein after the first processing step and before the second holding step, there is a rotation step of rotating the substrate on a horizontal plane by a specific angle. The substrate processing method of claim 6, wherein the above-mentioned specific angle is 90 degrees. The substrate processing method of claim 6 or 7, wherein the rotation step is performed by supporting the substrate by the supporting member. The substrate processing method according to any one of claims 4 to 7, wherein the back surface of the photomask substrate is cleaned by the above-mentioned substrate processing method. A photomask cleaning method, which has: a backside cleaning step, which cleans the backside of the photomask substrate by the substrate processing method according to any one of claims 4 to 7, and a film surface cleaning step, which is In the state where the film surface of the mask substrate is on the upper side, clean the film surface of the mask substrate; and between the back surface cleaning step and the film surface cleaning step, there is no mechanism for turning the mask substrate upside down. step. A photomask manufacturing method, which includes the substrate processing method according to any one of claims 4 to 7; and includes a step of forming a pattern for transfer by etching at least one optical film formed on the main surface . A photomask manufacturing method comprising the photomask cleaning method as claimed in claim 10; and comprising a step of forming a pattern for transfer by etching at least one optical film formed on the main surface.

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