TWI700305B - 雷射蝕刻用加熱硬化型導電性糊 - Google Patents
雷射蝕刻用加熱硬化型導電性糊 Download PDFInfo
- Publication number
- TWI700305B TWI700305B TW105105352A TW105105352A TWI700305B TW I700305 B TWI700305 B TW I700305B TW 105105352 A TW105105352 A TW 105105352A TW 105105352 A TW105105352 A TW 105105352A TW I700305 B TWI700305 B TW I700305B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- conductive
- heat
- epoxy resin
- mass
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-068364 | 2015-03-30 | ||
JP2015068364 | 2015-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201634517A TW201634517A (zh) | 2016-10-01 |
TWI700305B true TWI700305B (zh) | 2020-08-01 |
Family
ID=57081063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105105352A TWI700305B (zh) | 2015-03-30 | 2016-02-24 | 雷射蝕刻用加熱硬化型導電性糊 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6242418B2 (ja) |
CN (1) | CN106024097B (ja) |
TW (1) | TWI700305B (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1500278A (zh) * | 2001-03-28 | 2004-05-26 | E・I・内穆尔杜帮公司 | 用于填充印刷电路板中通孔的组合物 |
JP2014216432A (ja) * | 2013-04-24 | 2014-11-17 | 東洋インキScホールディングス株式会社 | キャパシタ用電極形成用組成物、キャパシタ用電極、及びキャパシタ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001236827A (ja) * | 2000-02-23 | 2001-08-31 | Hitachi Chem Co Ltd | 導電ペースト |
JP2005317491A (ja) * | 2004-04-01 | 2005-11-10 | Hitachi Chem Co Ltd | 導電ペーストおよびそれを用いた電子部品搭載基板 |
WO2014013899A1 (ja) * | 2012-07-20 | 2014-01-23 | 東洋紡株式会社 | レーザーエッチング加工用導電性ペースト、導電性薄膜および導電性積層体 |
JP2014107533A (ja) * | 2012-11-29 | 2014-06-09 | Pelnox Ltd | レーザーエッチング用導電性ペースト組成物 |
JP6049606B2 (ja) * | 2013-12-25 | 2016-12-21 | 株式会社ノリタケカンパニーリミテド | 加熱硬化型導電性ペースト |
-
2016
- 2016-02-24 TW TW105105352A patent/TWI700305B/zh not_active IP Right Cessation
- 2016-03-16 JP JP2016052317A patent/JP6242418B2/ja active Active
- 2016-03-30 CN CN201610190728.4A patent/CN106024097B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1500278A (zh) * | 2001-03-28 | 2004-05-26 | E・I・内穆尔杜帮公司 | 用于填充印刷电路板中通孔的组合物 |
JP2014216432A (ja) * | 2013-04-24 | 2014-11-17 | 東洋インキScホールディングス株式会社 | キャパシタ用電極形成用組成物、キャパシタ用電極、及びキャパシタ |
Also Published As
Publication number | Publication date |
---|---|
CN106024097B (zh) | 2019-06-28 |
JP6242418B2 (ja) | 2017-12-06 |
CN106024097A (zh) | 2016-10-12 |
JP2016191042A (ja) | 2016-11-10 |
TW201634517A (zh) | 2016-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |