TWI700305B - 雷射蝕刻用加熱硬化型導電性糊 - Google Patents

雷射蝕刻用加熱硬化型導電性糊 Download PDF

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Publication number
TWI700305B
TWI700305B TW105105352A TW105105352A TWI700305B TW I700305 B TWI700305 B TW I700305B TW 105105352 A TW105105352 A TW 105105352A TW 105105352 A TW105105352 A TW 105105352A TW I700305 B TWI700305 B TW I700305B
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TW
Taiwan
Prior art keywords
laser
conductive
heat
epoxy resin
mass
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TW105105352A
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English (en)
Chinese (zh)
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TW201634517A (zh
Inventor
垣添浩人
深谷周平
馬場達也
杉浦照定
吉野泰
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日商則武股份有限公司
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Publication of TW201634517A publication Critical patent/TW201634517A/zh
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Publication of TWI700305B publication Critical patent/TWI700305B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW105105352A 2015-03-30 2016-02-24 雷射蝕刻用加熱硬化型導電性糊 TWI700305B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-068364 2015-03-30
JP2015068364 2015-03-30

Publications (2)

Publication Number Publication Date
TW201634517A TW201634517A (zh) 2016-10-01
TWI700305B true TWI700305B (zh) 2020-08-01

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Family Applications (1)

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TW105105352A TWI700305B (zh) 2015-03-30 2016-02-24 雷射蝕刻用加熱硬化型導電性糊

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JP (1) JP6242418B2 (ja)
CN (1) CN106024097B (ja)
TW (1) TWI700305B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1500278A (zh) * 2001-03-28 2004-05-26 E・I・内穆尔杜帮公司 用于填充印刷电路板中通孔的组合物
JP2014216432A (ja) * 2013-04-24 2014-11-17 東洋インキＳｃホールディングス株式会社 キャパシタ用電極形成用組成物、キャパシタ用電極、及びキャパシタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001236827A (ja) * 2000-02-23 2001-08-31 Hitachi Chem Co Ltd 導電ペースト
JP2005317491A (ja) * 2004-04-01 2005-11-10 Hitachi Chem Co Ltd 導電ペーストおよびそれを用いた電子部品搭載基板
WO2014013899A1 (ja) * 2012-07-20 2014-01-23 東洋紡株式会社 レーザーエッチング加工用導電性ペースト、導電性薄膜および導電性積層体
JP2014107533A (ja) * 2012-11-29 2014-06-09 Pelnox Ltd レーザーエッチング用導電性ペースト組成物
JP6049606B2 (ja) * 2013-12-25 2016-12-21 株式会社ノリタケカンパニーリミテド 加熱硬化型導電性ペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1500278A (zh) * 2001-03-28 2004-05-26 E・I・内穆尔杜帮公司 用于填充印刷电路板中通孔的组合物
JP2014216432A (ja) * 2013-04-24 2014-11-17 東洋インキＳｃホールディングス株式会社 キャパシタ用電極形成用組成物、キャパシタ用電極、及びキャパシタ

Also Published As

Publication number Publication date
CN106024097B (zh) 2019-06-28
JP6242418B2 (ja) 2017-12-06
CN106024097A (zh) 2016-10-12
JP2016191042A (ja) 2016-11-10
TW201634517A (zh) 2016-10-01

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