TWI697392B - Surface treatment liquid and optical film - Google Patents

Abstract

A surface treatment liquid and an optical film are provided. The surface treatment liquid includes a solvent and a surface treatment agent. The surface treatment agent is an ionic compound having an organic cation and having a melting point of 25 ℃ or more and 50 ℃ or less.

Description

Surface treatment liquid and optical film

The present invention relates to a surface treatment liquid and an optical film, and particularly relates to a surface treatment liquid and an optical film with ionic compounds.

When cutting the optical film, the components of the optical film will adhere to the cutting tool. These adhering components will remain on the cutting surface of the optical roll film during the next cutting, and cause pollution to the cutting surface. Therefore, there is an urgent need to propose a technology that can improve the adhesion of the components of the optical film to the cutting tool.

Therefore, the present invention provides a surface treatment liquid and optical film, which can improve the conventional problems.

An embodiment of the present invention provides a surface treatment liquid. The surface treatment liquid includes a solvent and a surface treatment agent. The surface treatment agent is an ionic compound having an organic cation and having a melting point of 25°C or more and 50°C or less.

Another embodiment of the present invention provides an optical film. The optical film includes a film body and the aforementioned surface treatment liquid. The surface treatment liquid is formed on the surface of the film body.

In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

10: Optical roll film

10’: Ingredients

10a: Optical film

10b: lower surface

10s: cut surface

10u: upper surface

11: The first protective layer

12: The first covering layer

13: Polarizing layer

14: second covering layer

15: Adhesive layer

15s: Adhesive surface

16: second protective layer

100: Cutting equipment

110: Transmission wheel

120: Support Wheel

130, 230: cutting tools

130s: surface

140: container

150: Surface treatment components

231: Knife Body

232: rough structure

231s: knife surface

232r: recess

A1: dotted line

C1: Surface treatment liquid

D1, D2: rotation direction

L1: cleaning length

L2: Enter the depth

L3: Cutting thickness

P1: Cutting area

T1: contact area

T11, T12: Tangent direction

W1: inner diameter

Figures 1 to 2 show schematic diagrams of a cutting device according to an embodiment of the invention.

Fig. 3 shows a schematic diagram of the cutting tool of Fig. 1 cutting the optical film.

Figure 4 is a cross-sectional view of a cutting tool according to another embodiment of the present invention.

FIG. 5 is a schematic diagram showing the surface treatment liquid adhered to the cut surface of the optical film according to an embodiment of the present invention.

Please refer to Figures 1 to 3. Figures 1 to 2 illustrate a schematic diagram of a cutting device 100 according to an embodiment of the present invention, and Figure 3 illustrates the cutting tool 130 of Figure 1 to cut the optical film 10 Schematic.

As shown in FIG. 1, the cutting device 100 is used for cutting the optical roll film 10. The cutting device 100 includes at least one transmission wheel 110, a supporting wheel 120, at least one cutting tool 130, at least one container 140 and a surface treatment element 150. The plurality of transmission wheels 110 are used to convey the optical film 10, and the optical film 10 can be clamped and transmitted between two of the transmission wheels 110.

Although not shown in the figure, the cutting device 100 may further include a control module that can control the operation of the transmission wheel 110, the supporting wheel 120, the cutting tool 130 and the surface treatment element 150. For example, the control module may include a controller and a driver, where the controller is, for example, a circuit made by a semiconductor process, and the driver is, for example, a motor. The motor is electrically connected to the transmission wheel 110, the supporting wheel 120, the cutting tool 130 and the surface treatment element 150, The controller can control the motor to drive these components to rotate, for example, to control the rotation speed of these components.

The transfer wheel 110 can transfer the optical film 10 through the cutting tool 130 and the supporting wheel 120. The supporting wheel 120 is arranged opposite to the cutting tool 130. The cutting tool 130 is used to cut the optical film 10. The support wheel 120 can be used as a support for the optical film 10, so that the cutting tool 130 can cut the optical film 10.

As shown in FIGS. 1 and 2, the container 140 is used to contain the surface treatment liquid C1. The surface treatment liquid C1 can clean and/or coat the cutting tool 130 to remove impurities on the cutting tool 130. In addition, the surface treatment liquid C1 can also be coated on the surface 130s of the cutting tool 130 to avoid or reduce these impurities remaining on the cutting surface of the optical film 10 or the surface of the cutting tool 130 during the next cutting. The embodiment of the present invention is not limited to that the surface treatment liquid C1 must have both cleaning and coating (or coating) functions. In another embodiment, the surface treatment liquid C1 may have one of the cleaning and coating functions.

In one embodiment, as shown in Figure 1, the optical roll film 10 includes a first protective layer 11, a first covering layer 12, a polarizing layer 13, a second covering layer 14, an adhesive layer 15, and a second protective layer 16. . The polarizing layer 13 is formed between the first covering layer 12 and the second covering layer 14. The first protective layer 11 is disposed on the first covering layer 12. The adhesive layer 15 is disposed between the second covering layer 14 and the second protective layer 16 for subsequent bonding to a liquid crystal panel (not shown). In one embodiment, the optical roll film 10 of the embodiment of the present invention may be a single-layer film or a multilayer film. For example, the optical roll film 10 may include at least one layer of the aforementioned several layer structures.

The material of the first covering layer 12 and the second covering layer 14 can be selected from triacetate cellulose (Triacetate Cellulose, TAC), polymethylmethacrylate (Polymethylmethacrylate, PMMA), Polyethylene Terephthalate (PET), Polypropylene (PP), Cyclo Olefin Polymer (COP), Polycarbonate (PC) or A group consisting of any combination of the above.

The polarizing layer 13 may be a polyvinyl alcohol (PVA) film that absorbs and aligns dichroic pigments or is formed by liquid crystal materials doped with absorbing dye molecules. Polyvinyl alcohol can be formed by saponifying polyvinyl acetate. In some embodiments, polyvinyl acetate may be a monomer of vinyl acetate or a copolymer of vinyl acetate and other monomers. The above-mentioned other monomers may be unsaturated carboxylic acids, olefins, unsaturated sulfonic acids or vinyl ethers. In other embodiments, the polyvinyl alcohol may be modified polyvinyl alcohol, for example, polyvinyl formaldehyde, polyvinyl acetaldehyde, or polyvinyl butyraldehyde modified by aldehydes.

The first protective layer 11 may be made of polyester resin, olefin resin, cellulose acetate resin, polycarbonate resin, acrylic resin, polybutylene terephthalate (PET), polyethylene (polyethylene, PE) or poly Polypropylene (PP), cycloolefin resin or a combination of the above, wherein the polyester resin is for example polyethylene terephthalate or polyethylene naphthalate, and the acrylic resin is for example polymethyl methacrylate ( PMMA).

The adhesive layer 15 may be made of a material such as (meth)acrylic copolymer, such as a material that may contain but not limited to functional groups, such as methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Base) butyl acrylate, 2-ethylhexyl (meth)acrylate and other materials.

The second protective layer 16 is, for example, a release layer, which may be coated with a release layer. In the polyethylene terephthalate film, the release agent is, for example, but not limited to silicone resin. In this way, the second protective layer 16 is easily torn off from the adhesive layer 15 to expose the adhesive layer 15 so that the cut optical film 10 can be bonded to the liquid crystal panel (not shown) through the adhesive layer 15.

In an embodiment, the optical roll film 10 may optionally include non-light-concentrating components, such as Cyclo Olefin Polymer (COP). Such non-condensing components will cause the laser light to be unable to focus, and thus the optical roll film 10 cannot be cut at one time. In contrast to the embodiment of the present invention, as shown in FIG. 3, the cutting tool 130 can be used to cut the optical roll film 10 at one time without being affected by the material of the optical roll film 10. In another embodiment, before the cutting tool 130 cuts the optical roll film 10, a laser light may be used to cut a part of the thickness of the optical roll film 10, and then the cutting tool 130 may cut the optical roll film 10. In this embodiment, the laser generator that emits laser light can be arranged upstream of the cutting tool 130, as shown at the dotted line A1 in FIG. 1. In addition, the number of laser generators can be equal to the number of cutting tools 130.

When the cutting tool 130 cuts the optical film 10, the components 10' of the layer structure of the optical film 10 (for example, the components of the adhesive layer 15) will adhere to the cutting tool 130, resulting in subsequent cutting of the optical film. When the film 10 is rolled, the components 10' adhering to the cutting tool 130 remain on the cutting surface 10s of the optical film 10 (the cutting surface 10s is shown in FIG. 3).

In this embodiment, the surface treatment liquid C1 contains a release agent. When the cutting tool 130 contacts the surface treatment liquid C1, the release agent is coated and adhered to the cutting tool 130. The release agent can reduce the adhesion of the component 10' to the cutting tool 130, thereby reducing the amount of the component 10' attached to the cutting tool 130. In addition, the material of the surface treatment liquid C1 includes a silicone polymer, such as Silicone, and/or the surface treatment liquid C1 may further include a fluorine-containing compound.

As shown in FIGS. 1 and 2, the surface treatment element 150 is in direct contact with the cutting tool 130. When the cutting tool 130 rotates, the surface treatment element 150 can wipe the cutting tool 130 to forcibly remove (such as wiping) the component 10' adhering to the cutting tool 130. The removed component 10' is transferred to the surface treatment element 150, and the component 10' transferred to the surface treatment element 150 is brought into the surface treatment liquid C1 in the container 140 through the rotation of the surface treatment element 150 to reduce the surface treatment element 150 The number of ingredients on '10'. In other words, the rotation of the surface treatment element 150 can produce a cleaning and/or coating effect on the surface treatment element 150'. As the number of ingredients 10' dissolved in the surface treatment liquid C1 will increase, the surface treatment liquid C1 can be replaced.

In another embodiment, the cutting device 100 further includes a filter module (not shown), which is connected to the container 140, and can output the surface treatment liquid C1 in the container 140 to a filter, where it is filtered out After the ingredient 10', the filtered (purified) surface treatment liquid C1 is returned to the container 140. In this way, it is not necessary to replace the surface treatment liquid C1 in the container 140, or reduce the frequency of replacement of the surface treatment liquid C1 in the container 140.

In one embodiment, as shown in FIG. 1, the rotation direction D1 of the surface treatment element 150 is opposite to the rotation direction D2 of the cutting tool 130. For example, the rotation direction D1 of the surface treatment element 150 is counterclockwise, and the rotation direction D2 of the cutting tool 130 is clockwise. In another embodiment, the rotation direction D1 of the surface treatment element 150 may be clockwise, and the rotation direction D2 of the cutting tool 130 may be counterclockwise. In this way, in the contact area T1 of the surface treatment element 150 and the cutting tool 130, the tangential direction T11 of the surface treatment element 150 and the tangent direction T12 of the cutting tool 130 are in the same direction, which can reduce excessive friction of the surface treatment element 150 on the cutting tool 130. Thereby reducing the wear of the cutting tool 130 (compared to this, when When the tangential direction T11 of the surface treatment element 150 is opposite to the tangential direction T12 of the cutting tool 130, the wear of the surface treatment element 150 and the cutting tool 130 will increase).

In addition, the rotation speed of the surface treatment element 150 is different from the rotation speed of the cutting tool 130. For example, the rotational speed of the surface treatment element 150 is slower than the rotational speed of the cutting tool 130. This speed difference can increase the relative movement of the surface treatment element 150 and the cutting tool 130 to remove the components attached to the cutting tool 130 10' . In one embodiment, the ratio of the rotation speed of the surface treatment element 150 to the rotation speed of the cutting tool 130 is between 0.5 and 2, and this ratio range is sufficient to remove the component 10' adhering to the cutting tool 130, and does not As for the excessive wear of the cutting tool 130 or the surface treatment element 150.

In addition, the slower the rotation speed of the surface treatment element 150, the worse the effect of cleaning and/or coating the cutting tool 130 of the surface treatment element 150; the faster the rotation speed of the surface treatment element 150, the surface treatment element 150 will throw the surface treatment liquid C1 to The greater the chance or the greater the amount of the cutting tool 130.

As shown in Figure 1, the surface treatment element 150 partially enters the surface treatment liquid C1, so that the surface treatment element 150 can adhere to the surface treatment liquid C1 when rotating, and the surface treatment element 150 can be The cutting tool 130 is cleaned and/or coated frequently. In one embodiment, the surface treatment element 150 is, for example, a sponge, which can absorb the surface treatment liquid C1, and transfer the absorbed surface treatment liquid C1 to the cutting tool 130 through capillary phenomenon, so that more surface treatment liquid C1 can clean and /Or coating cutting tool 130. Under this design, the surface treatment element 150 can selectively not rotate, and can clean and/or coat the cutting tool 130 by absorbing the surface treatment liquid C1 through the sponge. In another embodiment, the surface treatment element 150 may be made of other types of materials, such as rubber or plastic.

In addition, as shown in FIG. 2, since the surface treatment element 150 has softness and/or elasticity, the surface treatment element 150 is in close contact with the cutting tool 130. In this way, the effect of the surface treatment element 150 in removing the component 10' remaining on the cutting tool 130 can be enhanced.

As shown in Figure 2, the cutting tool 130 is in contact with the surface treatment element 150 at a cleaning length L1, and the surface treatment element 150 enters the surface treatment liquid C1 at an entry depth L2. The entry depth L2 is at least equal to the cleaning length L1, and passes through the container 140 The surface treatment element 150 of the inner surface treatment liquid C1 absorbs enough surface treatment liquid C1 to clean the cleaning length L1 of the cutting tool 130. As shown in Figures 1 and 3, the cleaning length L1 is substantially equal to or greater than the cutting thickness L3, so that the part of the cutting tool 130 passing through the entire cutting surface 10s of the optical film 10 (that is, the part of the cleaning length L1) is cleaned And/or coating, thereby reducing or even avoiding the amount of ingredients 10' remaining on the cutting surface 10s.

In one embodiment, as shown in FIG. 1, the cutting position P1 of the cutting tool 130 and the optical film 10 is located above the container 140. In this way, all or most of the particles of the component 10' produced by the cutting can fall into the container 140, so as to prevent the particles of the component 10' from contaminating the environment of the cutting device 100. As shown in FIG. 2, the number of containers 140 is equal to that of cutting tools 130. In another embodiment, the number of the container 140 may be one, and all the cutting knives 130 of the cutting device 100 may be located directly above the container 140, which can achieve similar technical effects as described above.

The cutting method of an embodiment of the present invention includes the following steps. First, the aforementioned cutting device 100 is provided. Then, the cutting tool 130 of the cutting device 100 cuts the optical film 10. Then, the surface treatment liquid C1 of the cutting device 100 cleans and/or coats the cutting tool 130.

Please refer to FIG. 4, which shows a cross-sectional view of a cutting tool 230 according to another embodiment of the present invention. The cutting tool 130 of the cutting device 100 of the foregoing embodiment can also be replaced by the cutting tool 230 of this embodiment.

The cutting tool 230 includes a tool body 231 and a roughened structure 232. The blade body 231 has a blade surface 231s, and the roughened structure 232 is formed on the blade surface 231s. The roughened structure 232 includes several recesses 232r.

The cutter body 231 and the roughened structure 232 may be an integrally formed structure. In terms of the manufacturing method, for example, sandblasting, water jet, laser or other suitable techniques can be used to form the knife surface 231s of the knife body 231, and the range of the formed recess 232r constitutes the roughened structure 232. In terms of the size of the recess, in terms of sandblasting, the inner diameter W1 of the recess 232r of the roughened structure 232 formed is approximately between 5 μm and 80 μm, preferably between 10 μm and 50 μm. However, the actual range of the inner diameter W1 of the concave portion 232r may be determined by the manufacturing process, and it may also be less than 5 microns, or greater than 80 microns, which is not limited in the embodiment of the present invention.

As shown in Figure 4, the roughened structure 232 of the embodiment of the present invention can change the contact mode of the cutter and the optical film 10 from surface contact to point contact, and can reduce the friction resistance of the cutting tool 230 when cutting the optical film 10 . In addition, as shown in Figure 4, the surface treatment liquid C1 adheres to the roughened structure 232, for example, is located in the concave portion 232r of the roughened structure 232, so that the liquid lubricity between the cutter 230 and the optical film 10 can be increased, and more The friction resistance of the cutting tool 230 for cutting the optical film 10 is reduced.

Please refer to Figure 5, which illustrates an optical film according to an embodiment of the present invention A schematic diagram of the surface treatment liquid C1 attached to the cut surface 10s of 10a.

The cutting tool 230 cuts the optical film 10 to cut out the optical film 10a. Since the several recesses 232r of the cutting tool 230 contain the surface treatment liquid C1, the surface treatment liquid C1 can adhere to at least a part of the cutting surface 10s of the optical film 10a after cutting. Since the cutting tool 230 passes through the entire thickness of the optical film 10a, the cutting surface 10s includes the first protective layer 11, the first covering layer 12, the polarizing layer 13, the second covering layer 14, the adhesive layer 15, and the second protective layer 16 cutting surface. The range of the surface treatment liquid C1 attached to the cut surface 10s of the optical film 10a is determined by the range of the roughened structure 232 and/or the range of the surface treatment liquid C1 attached to the roughened structure 232.

In this embodiment, the surface treatment liquid C1 in Figures 4 and 5 is an antistatic liquid. The surface treatment liquid C1 of the cutting device 100 in FIG. 1 can be replaced by the antistatic liquid of this embodiment. The antistatic liquid includes, for example, a solvent and a surface treatment agent. The solvent includes alcohol and water, and the surface treatment agent is, for example, an antistatic agent. In one embodiment, assuming that the solvent contains 100% alcohol and water, the weight percentage of the antistatic agent is about 0.1 to 5% of the solvent, which can achieve an excellent antistatic effect. Taking the solvent as 100%, in one embodiment, the ratio of alcohol and water can be between 1:1 to 3:7, and the composition of 3:7 has a better antistatic effect (compared to the former Words).

In the case of a surface treatment agent, it is, for example, an ionic compound having an organic cation and having a melting point of 25°C or more and 50°C or less. By using an ionic compound with a melting point of 25°C or higher, that is, an ionic compound that is solid at room temperature, the change in antistatic performance over time can be suppressed, in other words, the antistatic performance can be maintained for a long time. From the viewpoint of the long-term stability of antistatic performance, the ionic compound is more preferably 30℃ or higher, or 35℃ Melting point above ℃.

Examples of the cationic components constituting the ionic compound include imidazolium cations, pyridinium cations, ammonium cations, sulfonium cations, and phosphonium cations. Among these ions, when used in the solvent of the surface treatment solution of the embodiment of the present invention, from the viewpoint that they are not easily charged when attached to a tool or an optical film, pyridinium cation or imidazole is preferred. Onium cation.

On the other hand, in the ionic compound, to become the above-described anion component may be an anionic inorganic ions, the cation may also be an organic anion of the component, for example, by the following: chlorine anions [Cl ^-], bromine anion [Br ^-], iodide anion [the I ^-], tetrachloroaluminate anion [AlCl ₄ ^-], heptachlorodialuminate anion [Al ₂ Cl ₇ ^-], tetrafluoroborate anion [BF ₄ ^-], hexafluoro phosphate anions [PF ₆ ^-], perchlorate anion [ClO ₄ ^-], nitrate anion [NO ₃ ^-], acetate anion [CH ₃ COO ^-], trifluoroacetate anion [CF ₃ COO ^-] , fluorosulfonate anion [FSO ₃ ^-], methanesulfonate anion [CH ₃ SO ₃ ^-], trifluoromethanesulfonate anion [CF ₃ SO ₃ ^-], p-toluenesulfonate anion [p-CH ^{_{3 C 6 H 4 SO 3 -}} ], bis (sulfo-fluoro-acyl) acyl imide anion ^{_{[(FSO 2) 2 N -}} ], bis (trifluoromethanesulfonyl acyl) acyl imide anion [(CF ₃ SO ₂ ) ₂ N ^-], tris (trifluoromethanesulfonyl acyl) methide anion _{[(CF 3 SO 2) 3} C -], hexafluoroarsenate anion [AsF ₆ ^-], hexafluoroantimonate anion [ SbF ₆ ^-], hexafluoro niobate anions [NbF ₆ ^-], six tantalum fluoride anions [TaF ₆ ^-], dimethylsilylene phosphonate anion ^{_{[(CH 3) 2 POO -}} ], ( poly) hydrogen fluoride fluoride anion ^{_{[F (HF) n -]}} (n is about 1 to 3), dicyanamide anion ^{_{[(CN) 2 N -]}} , thiocyanate anion [SCN ^-], perfluorobutanesulfonate anion ^{_{[C 4 F 9 SO 3 -}} ], bis (pentafluoroethane sulfonyl acyl) acyl imide anion _{[(C 2 F 5 SO 2} ) 2 N -], perfluoro butyrate anion [C ₃ F ₇ COO ^- ], (trifluoromethanesulfonyl acyl) (trifluoromethane-carbonyl) acyl imide anion _{[(CF 3 SO 2) (} CF 3 CO) N -] and the like.

Among these anions, especially the anion components containing fluorine atoms provide ionic compounds with excellent antistatic properties, so they can be preferably used, especially hexafluorophosphate anions, bis(fluorosulfonyl)imide Anion and bis(trifluoromethanesulfonyl)imide anion.

Specific examples of the ionic compound used in the examples of the present invention can be appropriately selected from the combination of the above-mentioned cationic components and anionic components. Specific examples of the compound combining a cationic component and an anionic component include the following.

‧Pyridinium salt: N-hexylpyridinium hexafluorophosphate, N-octylpyridinium hexafluorophosphate, N-methyl-4-hexylpyridinium hexafluorophosphate, N-butyl-4-methyl Pyridinium hexafluorophosphate, N-octyl-4-methylpyridinium hexafluorophosphate, N-hexylpyridinium bis(fluorosulfonyl) imide, N-octylpyridinium bis(fluorosulfonyl) Group) imine, N-methyl-4-hexylpyridinium bis(fluorosulfonyl) imide, N-butyl-4-methylpyridinium bis(fluorosulfonyl) imide, N -Octyl-4-methylpyridinium bis(fluorosulfonyl)imide, N-hexylpyridinium bis(trifluoromethanesulfonyl)imide, N-octylpyridinium bis(trifluoromethyl) Sulfonyl)imidine, N-methyl-4-hexylpyridinium bis(trifluoromethanesulfonyl)imidine, N-butyl-4-methylpyridinium bis(trifluoromethanesulfonyl) )Imidine, N-octyl-4-methylpyridinium bis(trifluoromethanesulfonyl)imidine, N-hexylpyridinium p-toluenesulfonate, N-octylpyridinium p-toluenesulfonic acid Salt, N-methyl-4-hexylpyridinium p-toluenesulfonate, N-butyl-4-methylpyridinium p-toluenesulfonate, N-octyl-4-methylpyridinium p-toluenesulfonic acid Salt etc.

‧Imidazolium salt: 1-ethyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-ethyl-3- Methylimidazolium bis(trifluoromethanesulfon) (Amino) imide, 1-ethyl-3-methylimidazolium p-toluenesulfonate, 1-butyl-3-methylimidazolium methanesulfonate, and the like.

‧Pyrrolidinium salt: N-butyl-N-methylpyrrolidinium hexafluorophosphate, N-butyl-N-methylpyrrolidinium bis(fluorosulfonyl)imide, N-butyl -N-methylpyrrolidinium bis(trifluoromethanesulfonyl)imide, N-butyl-N-methylpyrrolidinium p-toluenesulfonate, etc.

‧Ammonia salt: tetrabutylammonium hexafluorophosphate, tetrabutylammonium bis(fluorosulfonyl) imide, tetrahexylammonium bis(fluorosulfonyl) imide, trioctyl methyl ammonium bis( Fluorosulfonyl) imide, (2-hydroxyethyl) trimethylammonium bis(fluorosulfonyl) imide, tetrabutylammonium bis(trifluoromethanesulfonyl) imide, tetrahexyl Ammonium bis(trifluoromethanesulfonyl)imide, trioctylmethylammonium bis(trifluoromethanesulfonyl)imide, (2-hydroxyethyl)trimethylammonium bis(trifluoromethanesulfon) Amino) iminium, tetrabutylammonium p-toluenesulfonate, tetrahexylammonium p-toluenesulfonate, trioctylmethylammonium p-toluenesulfonate, (2-hydroxyethyl)trimethylammonium p-toluenesulfonate Toluenesulfonate, (2-hydroxyethyl)trimethylammonium dimethylphosphonite, etc.

This ionic compound can be used individually or in combination of 2 or more types, respectively.

In addition, in one embodiment, the ionic compound of the present invention may be a pyridinium cation, and the structural formula (1) of the compound is as follows:

塩)的陽離子例如是N-烷基吡啶鎓陽離子。結構式(1)的R₃表示具有12-16個碳原子的 直鏈烷基。結構式(1)的陽離子例如是N-十二烷基吡啶離子(N-

)、N-十三烷基吡啶離子(N-

)、N-十四烷基吡啶離子(N-

)、N-十五烷基吡啶離子(N-

)、N-十六烷基吡啶離子(N-

)、N-十二烷基-4-甲基吡啶離子(N-

-4-

)、N-十三烷基-4-甲基吡啶離子(N-

-4-

)、N-十四烷基-4-甲基吡啶離子(N-

-4-

)、N-十五烷基-4-甲基吡啶鎓離子(N-

-4-

)或N-十六烷基-4-甲基吡啶鎓離子(N-

-4-

)。 The pyridinium salt of structural formula (1) (

The cation of (塩) is, for example, N-alkylpyridinium cation. R _{3 in the} structural formula (1) represents a straight-chain alkyl group having 12-16 carbon atoms. The cation of structural formula (1) is, for example, N-dodecylpyridinium (N-

), N-tridecylpyridinium ion (N-

), N-tetradecylpyridinium ion (N-

), N-pentadecylpyridinium ion (N-

), N-hexadecylpyridinium ion (N-

), N-dodecyl-4-methylpyridinium ion (N-

-4-

), N-tridecyl-4-methylpyridinium ion (N-

-4-

), N-tetradecyl-4-methylpyridinium ion (N-

-4-

), N-pentadecyl-4-methylpyridinium ion (N-

-4-

) Or N-hexadecyl-4-methylpyridinium ion (N-

-4-

).

素

)、四氟硼酸根離子(

)、六氟磷酸根離子(

)、三氟乙酸根離子(

)、三氟甲磺酸根離子(

)、雙(氟磺酰基)亞胺離子(

(

)

)、雙(三氟甲磺酰基)酰亞胺離子(

(

)

)、三(三氟甲磺酰基)甲烷離子(

(

)

)、六氟砷酸根離子(

)、六氟銻酸根 離子(

)、六氟鈮酸鹽離子(

)、六氟鉭酸鹽離子(

)、(聚)氫氟氟離子((

)

)、全氟丁烷磺酸鹽離子(

)、雙(五氟乙磺酰基)酰亞胺離子(

(

)

)、全氟丁酸離子(

)或(三氟甲磺酰基)(三氟甲烷羰基)酰亞胺離子((

)(

)

)。 In the structural formula (1), R4 represents a hydrogen atom or a methyl group, and X- represents an ion having a fluorine atom. X- is like fluoride ion in pyridinium salt (

Prime

), tetrafluoroborate ion (

), hexafluorophosphate ion (

), trifluoroacetate ion (

), trifluoromethanesulfonate ion (

), bis(fluorosulfonyl)imide ion (

(

)

), bis(trifluoromethanesulfonyl)imide ion (

(

)

), tris(trifluoromethanesulfonyl)methane ion (

(

)

), hexafluoroarsenate ion (

), hexafluoroantimonate ion (

), hexafluoroniobate ion (

), hexafluorotantalate ion (

), (poly)hydrofluoride fluoride ion ((

)

), perfluorobutane sulfonate ion (

), bis(pentafluoroethanesulfonyl)imide ion (

(

)

), perfluorobutyric acid ion (

) Or (trifluoromethanesulfonyl)(trifluoromethanecarbonyl)imide ion ((

)(

)

).

素

)、四氟硼酸根離子[BF₄ ^-](

)、六氟磷酸根離子[PF₆ ^-](

)、三氟乙酸根離子[CF₃COO^-](

)、三氟甲磺酸根離子[CF₃SO₃ ^-](

)、雙(氟磺酰基)酰亞胺離子[(FSO₂)₂N^-](

(

)

)、雙(三氟甲磺酰基)酰亞胺離子[(CF₃SO₂)₂N^-](

(

)

)、三(三氟甲磺酰基)甲烷離子[(CF₃SO₂)₃C^-](

(

)

)、六氟砷酸根離子[AsF₆ ^-](

)、六氟銻酸根離子[SbF₆ ^-](

)、六氟鈮酸根離子 [NbF₆ ^-](

)、六氟鉭酸鹽離子[TaF₆ ^-](

)、(聚)氫氟氟酸離子[F(HF)_n ^-](n約為1至3)((

)

)、全氟丁烷磺酸根離子[C₄F₉SO₃ ^-](

)、雙(五氟乙磺酰基)酰亞胺離子[(C₂F₅SO₂)₂N^-](

(

)

)、全氟丁酸離子[C₃F₇COO^-](

)、(三氟甲磺酰基)(三氟甲烷羰基)酰亞胺離子[(CF₃SO₂)(CF₃CO)N^-]((

)(

)

)等。 Since the anion component X ^- of the pyridinium salt of the structural formula is an ion having a fluorine atom, an ionic compound having excellent antistatic performance can be obtained. Specifically, the anion is, for example: fluoride ion [F ^-] (

Prime

), tetrafluoroborate ion [BF ₄ ^- ](

), Hexafluorophosphate ion [PF ₆ ^-] (

), trifluoroacetate ion [CF ₃ COO ^- ](

), Triflate ions [CF ₃ SO ₃ ^-] (

), bis(fluorosulfonyl)imide ion [(FSO ₂ ) ₂ N ^- ](

(

)

), bis(trifluoromethanesulfonyl)imide ion [(CF ₃ SO ₂ ) ₂ N ^- ](

(

)

), tris(trifluoromethanesulfonyl)methane ion [(CF ₃ SO ₂ ) ₃ C ^- ](

(

)

), hexafluoroarsenate ion [AsF ₆ ^- ](

), hexafluoroantimonate ion [SbF ₆ ^- ](

), hexafluoroniobate ion [NbF ₆ ^- ](

), hexafluorotantalate ion [TaF ₆ ^- ](

), (Poly) fluoro hydrofluoric acid ion ^{_{[F (HF) n -]}} (n is about 1 to 3) ((

)

), Perfluoro butane sulfonate ion ^{_{[C 4 F 9 SO 3 -}} ] (

), bis(pentafluoroethanesulfonyl)imide ion [(C ₂ F ₅ SO ₂ ) ₂ N ^- ](

(

)

), Perfluorinated acid ion ^{_{[C 3 F 7 COO -]}} (

), (trifluoromethanesulfonyl)(trifluoromethanecarbonyl)imide ion [(CF ₃ SO ₂ )(CF ₃ CO)N ^- ]((

)(

)

)Wait.

)、N-十四烷基吡啶六氟磷酸鹽(N-

)、N-十六烷基吡啶六氟磷酸鹽(N-

)、N-十二烷基-4-甲基吡啶六氟磷酸鹽(N-

-4-

)、N-十四烷基-4-甲基吡啶六氟磷酸鹽(N-

-4-

)、N-十六烷基-4-甲基吡啶六氟磷酸鹽(N-

-4-

)、N-十二烷基吡啶雙(氟磺酰基)酰亞胺(N-

(

)

)、N-十四烷基吡啶雙(氟磺酰基)酰亞胺(N-

(

)

)、N-十六烷基吡啶雙(氟磺酰基)酰亞胺(N-

(

)

)、N-十二烷基-4-甲基吡啶雙(氟磺酰基)酰亞胺(N-

-4-

(

)

)、N-十四烷基-4-甲基吡啶雙(氟磺酰基)酰亞胺(N-

-4-

(

)

)、N-十六烷基-4-甲基吡啶雙(氟磺酰基)酰亞胺(N-

-4-

(

)

)、N-十二烷基吡啶雙(三氟甲磺酰基)酰亞胺(N-

(

)

)、N-十四烷基吡啶雙(三氟甲磺酰基)酰亞胺(N-

(

)

)、N-十六烷基吡啶雙(三氟甲磺酰基)酰亞胺(N-

(

)

)、N-十二烷基-4-甲基吡啶雙(三氟甲磺酰基)酰亞胺(N-

-4-

(

)

)、N-十四烷基-4-甲基吡啶鎓雙(三氟甲磺酰基)酰亞胺(N-

-4-

(

)

)、N-十六烷基-4-甲基吡啶鎓雙(三氟甲磺酰基)酰亞胺(N-

-4-

(

)

)等等。 吡啶鎓鹽為N-十二烷基吡啶雙(三氟甲磺酰基)酰亞胺(N-

(

)

)的結構式例如是：

。 Specific examples of the pyridinium salt used in the embodiment of the present invention may be appropriately selected from the combination of the aforementioned cation and anion. A specific example of a compound composed of cations and anions is: N-dodecylpyridine hexafluorophosphate (N-

), N-tetradecylpyridine hexafluorophosphate (N-

), N-hexadecylpyridine hexafluorophosphate (N-

), N-dodecyl-4-methylpyridine hexafluorophosphate (N-

-4-

), N-tetradecyl-4-methylpyridine hexafluorophosphate (N-

-4-

), N-hexadecyl-4-methylpyridine hexafluorophosphate (N-

-4-

), N-dodecylpyridine bis(fluorosulfonyl)imide (N-

(

)

), N-tetradecylpyridine bis(fluorosulfonyl)imide (N-

(

)

), N-hexadecylpyridine bis(fluorosulfonyl)imide (N-

(

)

), N-dodecyl-4-methylpyridine bis(fluorosulfonyl)imide (N-

-4-

(

)

), N-tetradecyl-4-methylpyridine bis(fluorosulfonyl)imide (N-

-4-

(

)

), N-hexadecyl-4-methylpyridine bis(fluorosulfonyl)imide (N-

-4-

(

)

), N-dodecylpyridine bis(trifluoromethanesulfonyl)imide (N-

(

)

), N-tetradecylpyridine bis(trifluoromethanesulfonyl)imide (N-

(

)

), N-hexadecylpyridine bis(trifluoromethanesulfonyl)imide (N-

(

)

), N-dodecyl-4-methylpyridine bis(trifluoromethanesulfonyl)imide (N-

-4-

(

)

), N-tetradecyl-4-methylpyridinium bis(trifluoromethanesulfonyl)imide (N-

-4-

(

)

), N-hexadecyl-4-methylpyridinium bis(trifluoromethanesulfonyl)imide (N-

-4-

(

)

)and many more. The pyridinium salt is N-dodecylpyridine bis(trifluoromethanesulfonyl)imide (N-

(

)

The structural formula of) is, for example:

.

(

)

)的結構式例如是：

The pyridinium salt is N-hexadecylpyridinium bis(trifluoromethanesulfonyl)imide (N-

(

)

The structural formula of) is, for example:

)的結構式例如是：

The pyridinium salt is N-dodecylpyridinium hexafluorophosphate (N-

The structural formula of) is, for example:

)的結構式例如是：

The pyridinium salt is N-hexadecylpyridinium hexafluorophosphate (N-

The structural formula of) is, for example:

-4-

)的結構式例如是：

。 The pyridinium salt is N-hexyl-4-methylpyridine hexafluorophosphate (N-

-4-

The structural formula of) is, for example:

.

-4-

)的結構 式例如是：

。 The pyridinium salt is N-butyl-4-methylpyridine hexafluorophosphate (N-

-4-

The structural formula of) is, for example:

.

The pyridinium salt of structural formula (1) is characterized in that the alkyl group represented by R ₃ is a long chain. The pyridinium salt can be prepared by common preparation methods, such as the following structural formula (2).

)。通過對相當於LiX^-(其中X^-如結構式(1)所界定)的鋰鹽進行離子交換反應，然後用水洗滌，將生成的溴化鋰轉移至水相，基於有機相的製備方法，可製成結構式(1)的吡啶鎓鹽。此些吡啶鎓鹽可以單獨使用一種，也可以組合使用兩種以上。此外，吡啶鎓鹽的實例當然不限於上面列出的化合物。 Define the structural formula R (2) R ₃ and R ₄ is the same in the formula (1) Definition of R ₄ and _3. Structural formula (2) is equivalent to alkyl pyridinium bromide (

). By corresponding to LiX ^- (wherein X ^- The structure of formula (1)) a lithium salt ion exchange reaction, then washed with water, the resulting aqueous phase is transferred to lithium bromide, prepared based on the organic phase, can be made The pyridinium salt of structural formula (1). These pyridinium salts may be used alone or in combination of two or more. In addition, examples of pyridinium salts are of course not limited to the compounds listed above.

As shown in Figure 5, because the antistatic liquid adheres to the cutting surface 10s of the optical film 10a, electrostatic adsorption can be avoided, thereby reducing or avoiding impurities adhering to the cutting surface 10s to keep the cutting surface 10s clean degree.

The optical film 10a can be attached to an optical product (not shown) to provide an optical function of the optical product. In the process of attaching the optical film 10a to the optical product, the second protective layer 16 must be removed from the optical film 10a to expose the adhesive layer 15, and then the adhesive layer 15 and the optical product A light-transmitting member (not shown) is attached to the light-transmitting member by butting the optical film 10a. Although the second protective layer 16 is removed from the optical film 10a, static electricity will be generated on the adhesive surface 15s of the adhesive layer 15, but the cut surface 10s has It has excellent cleanliness (less impurities), so that the impurities adsorbed to the adhesive surface 15s by static electricity will be significantly reduced, which can avoid polluting the adhesive surface 15s of the adhesive layer 15, thereby enhancing the adhesion of the adhesive layer 15 and optical products . In addition, the aforementioned optical product is, for example, a touch panel, a display panel, a touch display panel, or any product that requires an optical film 10a, and the light-transmitting part of the optical product is, for example, glass, a light-transmitting plastic plate, or other suitable elements.

In addition, the surface treatment liquid C1 herein can also be directly coated on any surface of the film body of the optical film to obtain similar antistatic and/or pollution reduction technical effects. The aforementioned optical film is, for example, an optical roll film or a cut optical film. For example, before cutting and/or after cutting, the surface treatment liquid C1 can be coated on the upper surface 10u and/or lower surface 10b of the optical roll film 10 shown in Figure 3 or 4; or, before cutting And/or after cutting, the surface treatment liquid C1 can be coated on the upper surface 10u, the lower surface 10b and/or the side surface of the cut optical film 10a in FIG. 5, such as the cutting surface 10s. In addition, the aforementioned upper surface 10u, lower surface 10b, and/or side surfaces are the outermost surfaces of the diaphragm. In addition, the film body of the aforementioned optical film includes, for example, at least one of the first protective layer 11, the first covering layer 12, the polarizing layer 13, the second covering layer 14, the adhesive layer 15, and the second protective layer 16.

In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent scope.

10: Optical roll film

10’: Ingredients

11: The first protective layer

12: The first covering layer

13: Polarizing layer

14: second covering layer

15: Adhesive layer

16: second protective layer

100: Cutting equipment

110: Transmission wheel

120: Support Wheel

130: cutting tool

140: container

150: Surface treatment components

A1: dotted line

C1: Surface treatment liquid

D1, D2: rotation direction

P1: Cutting area

T1: contact area

T11, T12: Tangent direction

x, y: axial

Claims (9)

A surface treatment liquid, comprising: a solvent, wherein the solvent contains alcohol and water, wherein the ratio of the alcohol to water is between 1:1 to 3:7; and a surface treatment agent that has organic cations and has a melting point of 25°C or higher and Ionic compounds below 50°C. The surface treatment liquid described in item 1 of the scope of patent application, wherein the surface treatment agent is an antistatic agent. The surface treatment liquid as described in item 1 of the scope of patent application, wherein the weight percentage of the surface treatment agent is 0.1~5% of the solvent. The surface treatment liquid described in item 1 of the scope of the patent application, wherein the organic cation includes at least one of imidazolium cation, pyridinium cation, ammonium cation, sulfonium cation and phosphonium cation. The surface treatment liquid described in item 4 of the scope of patent application, wherein the structural formula of the pyridinium salt composed of the pyridinium cation is as follows:

Among them, R ₃ represents a linear alkyl group having 12-16 carbon atoms, R ₄ represents a hydrogen atom or a methyl group, X ^- represents an ion having a fluorine atom; X ^- is a fluoride ion in a pyridinium salt (

Prime

), tetrafluoroborate ion (

), hexafluorophosphate ion (

), trifluoroacetate ion (

), trifluoromethanesulfonate ion (

), bis(fluorosulfonyl)imide ion (

(

)

), bis(trifluoromethanesulfonyl)imide ion (

(

)

), tris(trifluoromethanesulfonyl)methane ion (

(

)

), hexafluoroarsenate ion (

), hexafluoroantimonate ion (

), hexafluoroniobate ion (

), hexafluorotantalate ion (

), (poly)hydrofluoride fluoride ion ((

)

), perfluorobutane sulfonate ion (

), bis(pentafluoroethanesulfonyl)imide ion (

(

)

), perfluorobutyric acid ion (

) Or (trifluoromethanesulfonyl)(trifluoromethanecarbonyl)imide ion ((

)(

)

). An optical film, comprising: a film body having a surface; and the surface treatment liquid according to any one of items 1 to 5 in the scope of the patent application, formed on the surface of the film body. The optical film described in item 6 of the scope of patent application, wherein the surface is the upper surface, lower surface or side surface of the film body. The optical film described in item 6 of the scope of patent application, wherein the surface is the outermost surface of the film body. The optical film described in item 6 of the scope of patent application, wherein the optical film is an optical roll film or a cut optical film.

Images