TW201946750A - Cutting tool, cutting apparatus and cutting method using the same - Google Patents

Cutting tool, cutting apparatus and cutting method using the same Download PDF

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Publication number
TW201946750A
TW201946750A TW108103264A TW108103264A TW201946750A TW 201946750 A TW201946750 A TW 201946750A TW 108103264 A TW108103264 A TW 108103264A TW 108103264 A TW108103264 A TW 108103264A TW 201946750 A TW201946750 A TW 201946750A
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Taiwan
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cutting
surface treatment
patent application
item
scope
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TW108103264A
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Chinese (zh)
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TWI679093B (en
Inventor
能木直安
劉君偉
李勝儀
林如倫
楊以權
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住華科技股份有限公司
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Priority to CN201910298840.3A priority Critical patent/CN110465978A/en
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Publication of TW201946750A publication Critical patent/TW201946750A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/088Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out

Abstract

A cutting tool, a cutting apparatus and a cutting method using the same are provided. The cutting apparatus is used for cutting an optical film. The cutting apparatus includes a cutting tool and a container. The cutting tool is used for cutting the optical film. The container is used for accommodate a surface treatment agent, and the surface treatment agent is used for cleaning the cutting tool.

Description

裁切刀具、裁切設備及應用其之裁切方法Cutting tool, cutting equipment and cutting method using same

本發明是有關於一種裁切刀具、裁切設備及應用其之裁切方法,且特別是有關於一種裁切刀具、裁切設備及應用其之裁切方法。The present invention relates to a cutting tool, a cutting device and a cutting method using the same, and more particularly to a cutting tool, a cutting device and a cutting method using the same.

在裁切光學捲膜時,光學捲膜的成分會沾附在裁切刀具上。此些沾附成分在下次裁切時會殘留在光學捲膜的裁切面,而對裁切面造成汙染。因此,亟需提出一種能改善光學捲膜的成分沾附在裁切刀具的技術。When cutting the optical roll film, the components of the optical roll film will adhere to the cutting blade. These sticking components will remain on the cutting surface of the optical roll film during the next cutting, and cause pollution to the cutting surface. Therefore, there is an urgent need to propose a technology capable of improving the adhesion of the components of the optical roll film to the cutting blade.

因此,本發明提出一種裁切刀具、裁切設備及應用其之裁切方法,可改善習知問題。Therefore, the present invention provides a cutting tool, a cutting device, and a cutting method using the cutting tool, which can improve the conventional problems.

本發明一實施例提出一種裁切刀具。裁切刀具用以裁切一光學捲膜且包括一刀體及一粗糙化結構。粗糙化結構形成於刀面,粗糙化結構包括數個凹部。An embodiment of the present invention provides a cutting tool. The cutting blade is used for cutting an optical roll film and includes a blade body and a roughened structure. The roughened structure is formed on the blade surface, and the roughened structure includes a plurality of concave portions.

本發明一實施例提出一種裁切設備。裁切設備用以裁切一光學捲膜。裁切設備包括一裁切刀具及一容器。裁切刀具用以裁切光學捲膜。容器用以容納一表面處理液,表面處理液用以清潔及/或塗佈裁切刀具。An embodiment of the present invention provides a cutting device. The cutting device is used for cutting an optical roll film. The cutting equipment includes a cutting knife and a container. The cutting tool is used to cut the optical roll film. The container is used for containing a surface treatment liquid, and the surface treatment liquid is used for cleaning and / or coating the cutting knife.

本發明另一實施例提出一種裁切方法。裁切方法包括以下步驟。提供前述裁切設備;裁切設備之裁切刀具裁切光學捲膜;以及,裁切設備之表面處理液清潔及/或塗佈裁切刀具。Another embodiment of the present invention provides a cutting method. The cutting method includes the following steps. The aforementioned cutting equipment is provided; the cutting blade of the cutting equipment cuts the optical roll film; and the surface treatment liquid of the cutting equipment cleans and / or coats the cutting blade.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

請參照第1~3圖,第1~2圖繪示依照本發明一實施例之裁切設備100的示意圖,而第3圖繪示第1圖之裁切刀具130切斷光學捲膜10的示意圖。Please refer to FIGS. 1 to 3, which are schematic diagrams of a cutting device 100 according to an embodiment of the present invention, and FIG. 3 illustrates a cutting tool 130 of FIG. 1 cutting the optical roll film 10. schematic diagram.

如第1圖所示,裁切設備100用以裁切光學捲膜10。裁切設備100包括至少一傳輸輪110、承靠輪120、至少一裁切刀具130、至少一容器140及一表面處理元件150。數個傳輸輪110用以傳輸光學捲膜10,光學捲膜10可被夾持於及傳輸於此些傳輸輪110之其中二者之間。As shown in FIG. 1, the cutting device 100 is used to cut the optical roll film 10. The cutting device 100 includes at least one transfer wheel 110, a bearing wheel 120, at least one cutting tool 130, at least one container 140, and a surface treatment element 150. The plurality of transfer wheels 110 are used to transfer the optical roll film 10. The optical roll film 10 can be clamped and transferred between the two transfer wheels 110.

雖然圖未繪示,然裁切設備100可更包含一控制模組,此控制模組可控制傳輸輪110、承靠輪120、裁切刀具130及表面處理元件150的運轉。例如,控制模組可包含控制器及驅動器,其中控制器例如是由半導體製程製成的電路,而驅動器例如是馬達。馬達電性連接傳輸輪110、承靠輪120、裁切刀具130及表面處理元件150,使控制器可控制馬達驅動此些元件轉動,例如是控制此些元件的轉速。Although not shown in the drawings, the cutting device 100 may further include a control module, which can control the operation of the transmission wheel 110, the bearing wheel 120, the cutting tool 130, and the surface treatment element 150. For example, the control module may include a controller and a driver, where the controller is a circuit made of a semiconductor process, and the driver is a motor, for example. The motor is electrically connected to the transmission wheel 110, the bearing wheel 120, the cutting tool 130, and the surface treatment element 150, so that the controller can control the motor to drive the elements to rotate, for example, to control the rotation speed of the elements.

傳輸輪110可傳輸光學捲膜10通過裁切刀具130與承靠輪120之間。承靠輪120與裁切刀具130相對配置。裁切刀具130用以裁切光學捲膜10。承靠輪120可做為光學捲膜10的承靠,讓裁切刀具130能切斷光學捲膜10。The transfer wheel 110 can transfer the optical roll film 10 between the cutting blade 130 and the bearing wheel 120. The bearing wheel 120 is disposed opposite to the cutting blade 130. The cutting blade 130 is used for cutting the optical roll film 10. The bearing wheel 120 can be used as a bearing of the optical roll film 10, so that the cutting blade 130 can cut the optical roll film 10.

如第1及2圖所示,容器140用以容納表面處理液C1,表面處理液C1可清潔及/或塗佈裁切刀具130,以去除裁切刀具130上的雜質。此外,表面處理液C1也可塗佈於裁切刀具130之表面130s,進而避免或減少此些雜質在下次裁切時殘留在光學捲膜10的裁切面上或裁切刀具130之表面上。本發明實施例不限於表面處理液C1必須同時具備清潔及塗佈(或塗層)功能,在另一實施例中,表面處理液C1可具備清潔與塗佈功能之一者。As shown in FIGS. 1 and 2, the container 140 is used for containing the surface treatment liquid C1. The surface treatment liquid C1 can clean and / or coat the cutting blade 130 to remove impurities on the cutting blade 130. In addition, the surface treatment liquid C1 can also be applied to the surface 130s of the cutting blade 130, thereby preventing or reducing these impurities from remaining on the cutting surface of the optical roll film 10 or the surface of the cutting blade 130 during the next cutting. The embodiment of the present invention is not limited to that the surface treatment liquid C1 must have both cleaning and coating (or coating) functions. In another embodiment, the surface treatment liquid C1 may have one of cleaning and coating functions.

在一實施例中,如第1圖所示,光學捲膜10包括第一保護層11、第一覆蓋層12、偏光層13、第二覆蓋層14、黏膠層15及第二保護層16。偏光層13形成於第一覆蓋層12與第二覆蓋層14之間。第一保護層11設置於第一覆蓋層12上。黏膠層15設置於第二覆蓋層14與第二保護層16之間,用以於後續黏合至一液晶面板(圖未示)之上。在一實施例中,本發明實施例之光學捲膜10可為單層膜或為多層膜。例如,光學捲膜10可包含前述數個層結構之至少一層。In an embodiment, as shown in FIG. 1, the optical roll film 10 includes a first protective layer 11, a first cover layer 12, a polarizing layer 13, a second cover layer 14, an adhesive layer 15, and a second protective layer 16. . The polarizing layer 13 is formed between the first cover layer 12 and the second cover layer 14. The first protective layer 11 is disposed on the first cover layer 12. The adhesive layer 15 is disposed between the second cover layer 14 and the second protective layer 16 for subsequent adhesion to a liquid crystal panel (not shown). In one embodiment, the optical roll film 10 according to the embodiment of the present invention may be a single-layer film or a multi-layer film. For example, the optical roll film 10 may include at least one of the aforementioned several layer structures.

第一覆蓋層12及第二覆蓋層14的材料可選自於由三醋酸纖維素(Triacetate Cellulose, TAC)、聚甲基丙烯酸甲酯(Polymethylmethacrylate, PMMA)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚丙稀(Polypropylene, PP)、環烯烴聚合物(Cyclo Olefin Polymer, COP)、聚碳酸酯(Polycarbonate, PC)或上述之任意組合所組成的一族群。The material of the first cover layer 12 and the second cover layer 14 may be selected from the group consisting of triacetate cellulose (TAC), polymethylmethacrylate (PMMA), and polyethylene terephthalate ( A group consisting of Polyethylene Terephthalate (PET), Polypropylene (PP), Cyclo Olefin Polymer (COP), Polycarbonate (PC), or any combination thereof.

偏光層13可為吸附配向之二色性色素之聚乙烯醇(polyvinyl alcohol, PVA)薄膜或由液晶材料摻附具吸收染料分子所形成。聚乙烯醇可藉由皂化聚乙酸乙烯酯而形成。在一些實施例中,聚乙酸乙烯酯可為乙酸乙烯酯之單聚物或乙酸乙烯酯及其它單體之共聚物等。上述其它單體可為不飽和羧酸類、烯烴類、不飽和磺酸類或乙烯基醚類等。在另一些實施例中,聚乙烯醇可為經改質的聚乙烯醇,例如,經醛類改質的聚乙烯甲醛、聚乙烯乙醛或聚乙烯丁醛等。The polarizing layer 13 may be a polyvinyl alcohol (PVA) film that adsorbs and aligns dichroic pigments or is formed by mixing liquid crystal material with absorbing dye molecules. Polyvinyl alcohol can be formed by saponifying polyvinyl acetate. In some embodiments, the polyvinyl acetate may be a single polymer of vinyl acetate or a copolymer of vinyl acetate and other monomers. The other monomers may be unsaturated carboxylic acids, olefins, unsaturated sulfonic acids, vinyl ethers, and the like. In other embodiments, the polyvinyl alcohol can be modified polyvinyl alcohol, for example, aldehyde-modified polyvinyl formaldehyde, polyvinyl acetaldehyde, or polyvinyl butyral, and the like.

第一保護層11可由聚酯樹脂、烯烴樹脂、乙酸纖維素樹脂、聚碳酸酯樹脂、丙烯酸樹脂、聚對苯二甲酸丁二酯(polyethylene terephthalate, PET)、聚乙烯(polyethylene, PE)或聚丙烯(Polypropylene, PP)、環烯烴樹脂或上述之組合,其中聚酯樹脂例如是聚對苯二甲酸乙二酯或聚萘二甲酸乙二酯,而丙烯酸樹脂例如是聚甲基丙烯酸甲酯(PMMA)。The first protective layer 11 can be made of polyester resin, olefin resin, cellulose acetate resin, polycarbonate resin, acrylic resin, polyethylene terephthalate (PET), polyethylene (PE) or polyethylene. Polypropylene (PP), cycloolefin resin, or a combination thereof, wherein the polyester resin is, for example, polyethylene terephthalate or polyethylene naphthalate, and the acrylic resin is, for example, polymethyl methacrylate ( PMMA).

黏膠層15可由例如是(甲基)丙烯酸共聚物之材料製成,例如是可包含但不限於官能基的材料,如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯等材料。The adhesive layer 15 may be made of a material such as a (meth) acrylic copolymer, such as a material that may include, but is not limited to, a functional group, such as methyl (meth) acrylate, ethyl (meth) acrylate, (formaldehyde) Materials) such as butyl acrylate and 2-ethylhexyl (meth) acrylate.

第二保護層16例如是離型層,其可例如是表面塗有離型劑的聚對苯二甲酸乙二醇酯薄膜,其中離型劑例如是但不限於矽樹脂。如此,第二保護層16容易自黏膠層15上撕除,以露出黏膠層15,使裁切後的光學捲膜10透過黏膠層15黏合至液晶面板(圖未示)。The second protective layer 16 is, for example, a release layer, which may be, for example, a polyethylene terephthalate film coated with a release agent on the surface, wherein the release agent is, for example, but not limited to, a silicone resin. In this way, the second protective layer 16 is easily peeled off from the adhesive layer 15 to expose the adhesive layer 15, so that the cut optical roll film 10 is adhered to the liquid crystal panel (not shown) through the adhesive layer 15.

在一實施例中,光學捲膜10可選擇性地包含不聚光的成分,例如是環烯烴聚合物(Cyclo Olefin Polymer, COP)。此種不聚光的成分會導致雷射光無法聚焦,而造成無法一次切斷光學捲膜10。反觀本發明實施例,如第3圖所示,採用裁切刀具130可一次切斷光學捲膜10,不受光學捲膜10材質的影響。在另一實施例中,在裁切刀具130裁切光學捲膜10前,可先使用雷射光裁切光學捲膜10的部分厚度,然後再由裁切刀具130切斷光學捲膜10。在此實施例中,發射雷射光的雷射產生器可設置在裁切刀具130的上游,如第1圖的虛線A1處。此外,雷射產生器的數量可與裁切刀具130的數量相等。In one embodiment, the optical roll film 10 may optionally include a non-light-condensing component, such as a Cyclo Olefin Polymer (COP). Such a non-condensing component may cause the laser light to be out of focus, and it may be impossible to cut the optical roll film 10 at a time. In contrast, in the embodiment of the present invention, as shown in FIG. 3, the cutting roll 130 can cut the optical roll film 10 at a time without being affected by the material of the optical roll film 10. In another embodiment, before the cutting blade 130 cuts the optical roll film 10, a part of the thickness of the optical roll film 10 may be cut by laser light, and then the optical roll film 10 is cut by the cutting blade 130. In this embodiment, a laser generator that emits laser light may be disposed upstream of the cutting tool 130, such as at a dotted line A1 in FIG. 1. In addition, the number of laser generators may be equal to the number of cutting tools 130.

在裁切刀具130裁切光學捲膜10時,光學捲膜10的層結構的成分10’(例如是黏膠層15的成分)會沾附在裁切刀具130上,導致在後續裁切光學捲膜10時,沾附在裁切刀具130的成分10’殘留在光學捲膜10的裁切面10s (裁切面10s繪示在第3圖)上。When the cutting blade 130 cuts the optical roll film 10, a component 10 ′ (for example, a component of the adhesive layer 15) of the layer structure of the optical roll film 10 may adhere to the cutting blade 130, resulting in subsequent cutting When the film 10 is rolled, the component 10 ′ adhered to the cutting blade 130 remains on the cutting surface 10 s (the cutting surface 10 s is shown in FIG. 3) of the optical roll film 10.

在本實施例中,表面處理液C1內包含一離型劑。當裁切刀具130接觸表面處理液C1時,離型劑會塗佈沾附在裁切刀具130上。離型劑可減少成分10’對裁切刀具130的沾附性,進而減少成分10’沾附在裁切刀具130的數量。此外,表面處理液C1的的材質包含一矽氧烷聚合物,例如為矽利康(Silicone),及/或表面處理液C1可更包含一含氟化合物。In this embodiment, the surface treatment liquid C1 includes a release agent. When the cutting blade 130 contacts the surface treatment liquid C1, the release agent is coated and adhered to the cutting blade 130. The release agent can reduce the adhesion of the component 10 'to the cutting blade 130, thereby reducing the amount of the component 10' adhering to the cutting blade 130. In addition, the material of the surface treatment liquid C1 includes a siloxane polymer, such as Silicone, and / or the surface treatment liquid C1 may further include a fluorine-containing compound.

如第1及2圖所示,表面處理元件150與裁切刀具130係直接接觸。在裁切刀具130轉動時,表面處理元件150可擦拭裁切刀具130,以強制性去除(如擦拭)沾附在裁切刀具130上的成分10’。被去除的成分10’轉移至表面處理元件150上,轉移到表面處理元件150的成分10’透過表面處理元件150的轉動被帶入容器140內的表面處理液C1中,以減少表面處理元件150’上的成分10’數量。換言之,透過表面處理元件150的轉動可產生對表面處理元件150’的清潔及/或塗佈效果。當溶入表面處理液C1內的成分10’數量會愈來愈多,可更換表面處理液C1。As shown in FIGS. 1 and 2, the surface treatment element 150 and the cutting blade 130 are in direct contact. When the cutting blade 130 rotates, the surface treatment element 150 can wipe the cutting blade 130 to forcibly remove (such as wipe) the component 10 'adhering to the cutting blade 130. The removed component 10 ′ is transferred to the surface treatment element 150, and the component 10 ′ transferred to the surface treatment element 150 is brought into the surface treatment liquid C1 in the container 140 through the rotation of the surface treatment element 150 to reduce the surface treatment element 150. Number of ingredients on '10'. In other words, through the rotation of the surface treatment element 150, a cleaning and / or coating effect on the surface treatment element 150 'can be produced. When the amount of the component 10 'dissolved in the surface treatment liquid C1 becomes more and more, the surface treatment liquid C1 can be replaced.

在另一實施例中,裁切設備100更包括一過濾模組(未繪示),其連接容器140,可將容器140內的表面處理液C1往外輸出至一過濾器,在過濾器濾除成分10’後,再將過濾後(淨化後)的表面處理液C1回送至容器140內。如此,可不需更換容器140內的表面處理液C1,或減少容器140內的表面處理液C1之更換頻率。In another embodiment, the cutting device 100 further includes a filter module (not shown), which is connected to the container 140, and can output the surface treatment liquid C1 in the container 140 to a filter, which is filtered out by the filter. After the component 10 ′, the filtered (purified) surface treatment liquid C1 is returned to the container 140. In this way, the surface treatment liquid C1 in the container 140 does not need to be replaced, or the frequency of replacement of the surface treatment liquid C1 in the container 140 can be reduced.

在一實施例中,如第1圖所示,表面處理元件150的轉動方向D1與裁切刀具130的轉動方向D2係反向。例如,表面處理元件150的轉動方向D1為逆時針,而裁切刀具130的轉動方向D2為順時針。在另一實施例中,表面處理元件150的轉動方向D1可為順時針,而裁切刀具130的轉動方向D2可為逆時針。如此,在表面處理元件150與裁切刀具130的 接觸區T1,表面處理元件150的切線方向T11與裁切刀具130的切線方向T12同向,可減少表面處理元件150過度摩擦裁切刀具130,進而減少裁切刀具130的磨損(相較於此,當表面處理元件150的切線方向T11與裁切刀具130的切線方向T12反向時,表面處理元件150與裁切刀具130的磨損會增加)。In an embodiment, as shown in FIG. 1, the rotation direction D1 of the surface treatment element 150 and the rotation direction D2 of the cutting blade 130 are opposite to each other. For example, the rotation direction D1 of the surface treatment element 150 is counterclockwise, and the rotation direction D2 of the cutting blade 130 is clockwise. In another embodiment, the rotation direction D1 of the surface processing element 150 may be clockwise, and the rotation direction D2 of the cutting tool 130 may be counterclockwise. In this way, in the contact area T1 between the surface processing element 150 and the cutting tool 130, the tangential direction T11 of the surface processing element 150 is the same as the tangential direction T12 of the cutting tool 130, which can reduce the surface processing element 150 from excessively rubbing the cutting tool 130. Furthermore, the wear of the cutting tool 130 is reduced (compared to this, when the tangential direction T11 of the surface processing element 150 and the tangential direction T12 of the cutting tool 130 are reversed, the wear of the surface processing element 150 and the cutting tool 130 increases) .

此外,表面處理元件150的轉速與裁切刀具130的轉速係相異。例如,表面處理元件150的轉速慢於裁切刀具130的轉速,此速差可增加表面處理元件150與裁切刀具130的相對移動量,以去除沾附在裁切刀具130上的成分10’。在一實施例中,表面處理元件150的轉速與裁切刀具130的轉速的比值介於0.5與2之間,此比值範圍足以去除沾附在裁切刀具130上的成分10’,且又不至於造成裁切刀具130或表面處理元件150的過度磨損。In addition, the rotation speed of the surface treatment element 150 and the rotation speed of the cutting blade 130 are different. For example, the rotation speed of the surface treatment element 150 is slower than the rotation speed of the cutting blade 130. This speed difference can increase the relative movement of the surface treatment element 150 and the cutting blade 130 to remove the component 10 'attached to the cutting blade 130 . In one embodiment, the ratio of the rotation speed of the surface processing element 150 to the rotation speed of the cutting tool 130 is between 0.5 and 2. This ratio range is sufficient to remove the component 10 'attached to the cutting tool 130 without As for the excessive wear of the cutting blade 130 or the surface treatment element 150.

此外,表面處理元件150的轉速愈慢,表面處理元件150清潔及/或塗佈裁切刀具130的效果愈差;表面處理元件150的轉速愈快,表面處理元件150將表面處理液C1甩至裁切刀具130的機會愈大或量愈多。In addition, the slower the rotation speed of the surface treatment element 150 is, the worse the cleaning and / or coating effect of the surface treatment element 150 is; the faster the rotation speed of the surface treatment element 150 is, the surface treatment element 150 throws the surface treatment liquid C1 to The greater or greater the opportunity for the cutting tool 130.

如第1圖所示,表面處理元件150部分進入表面處理液C1內,使表面處理元件150在轉動時可沾附到表面處理液C1,進而使表面處理元件150在轉動時表面處理液C1能經常性清潔及/或塗佈裁切刀具130。在一實施例中,表面處理元件150例如是海綿,其可吸收表面處理液C1,並將吸收的表面處理液C1透過毛細現象傳輸至裁切刀具130,讓更多的表面處理液C1清潔及/或塗佈裁切刀具130。在此設計下,表面處理元件150可選擇性地不轉動,透過海綿吸收表面處理液C1能可清潔及/或塗佈裁切刀具130。在另一實施例中,表面處理元件150可以是其它種類材質,如橡膠或塑膠。As shown in FIG. 1, the surface treatment element 150 partially enters the surface treatment liquid C1, so that the surface treatment element 150 can adhere to the surface treatment liquid C1 when it is rotated, so that the surface treatment liquid C1 can be The cutting knife 130 is cleaned and / or coated frequently. In one embodiment, the surface treatment element 150 is, for example, a sponge, which can absorb the surface treatment liquid C1 and transmit the absorbed surface treatment liquid C1 to the cutting blade 130 through the capillary phenomenon, so that more surface treatment liquid C1 can be cleaned and cleaned. And / or coating the cutting tool 130. Under this design, the surface treatment element 150 can be selectively not rotated, and the surface treatment liquid C1 can be absorbed through the sponge to clean and / or coat the cutting blade 130. In another embodiment, the surface treatment element 150 may be made of other materials, such as rubber or plastic.

此外,如第2圖所示,由於表面處理元件150具有軟質性及/或彈性,使表面處理元件150與裁切刀具130緊密接觸。如此,可增強表面處理元件150去除殘留在裁切刀具130上的成分10’的效果。In addition, as shown in FIG. 2, since the surface treatment element 150 has flexibility and / or elasticity, the surface treatment element 150 and the cutting blade 130 are brought into close contact. In this way, the effect of the surface treatment element 150 on removing the component 10 'remaining on the cutting blade 130 can be enhanced.

如第2圖所示,裁切刀具130以清潔長度L1與表面處理元件150接觸,表面處理元件150以進入深度L2進入表面處理液C1內,進入深度L2至少等於清潔長度L1,使通過容器140內的表面處理液C1的表面處理元件150吸收足夠的表面處理液C1去清潔裁切刀具130的清潔長度L1的部分。如第1及3圖所示,清潔長度L1大致上等於或大於裁切厚度L3,使得經過光學捲膜10的整個裁切面10s的裁切刀具130的部分(即清潔長度L1的部分)受過清潔及/或塗佈,進而減少或甚至避免殘留在裁切面10s上的成分10’的數量。As shown in FIG. 2, the cutting tool 130 contacts the surface treatment element 150 at a cleaning length L1, and the surface treatment element 150 enters the surface treatment liquid C1 at a depth L2, and the depth L2 is at least equal to the cleaning length L1, and passes through the container 140. The surface treatment element 150 in the surface treatment liquid C1 inside absorbs enough surface treatment liquid C1 to clean a part of the cleaning length L1 of the cutting blade 130. As shown in FIGS. 1 and 3, the cleaning length L1 is substantially equal to or larger than the cutting thickness L3, so that a portion of the cutting blade 130 (that is, a portion of the cleaning length L1) that has passed through the entire cutting surface 10s of the optical roll film 10 is cleaned. And / or coating, thereby reducing or even avoiding the number of components 10 'remaining on the cutting surface 10s.

在一實施例中,如第1圖所示,裁切刀具130與光學捲膜10的裁切處P1位於容器140的上方。如此,因為裁切所產生的成分10’的顆粒全部或大部份都能掉落在容器140內,以避免成分10’的顆粒汙染到裁切設備100的所處環境。如第2圖所示,容器140的數量與裁切刀具130相等。在另一實施例中,容器140的數量可以是一個,裁切設備100的全部裁切刀具130可位於容器140的正上方,可達到類似前述的技術效果。In an embodiment, as shown in FIG. 1, the cutting position P1 between the cutting blade 130 and the optical roll film 10 is located above the container 140. In this way, all or most of the particles of the component 10 'generated by cutting can fall into the container 140 to prevent the particles of the component 10' from contaminating the environment of the cutting device 100. As shown in FIG. 2, the number of the containers 140 is equal to that of the cutting blade 130. In another embodiment, the number of the containers 140 may be one, and all the cutting knives 130 of the cutting device 100 may be located directly above the containers 140, and similar technical effects to the foregoing can be achieved.

本發明一實施例的裁切方法包括以下步驟。首先,提供前述裁切設備100。然後,裁切設備100之裁切刀具130裁切光學捲膜10。然後,裁切設備100之表面處理液C1清潔及/或塗佈裁切刀具130。A cutting method according to an embodiment of the present invention includes the following steps. First, the aforementioned cutting device 100 is provided. Then, the cutting blade 130 of the cutting apparatus 100 cuts the optical roll film 10. Then, the surface treatment liquid C1 of the cutting apparatus 100 cleans and / or coats the cutting blade 130.

請參照第4圖,其繪示依照本發明另一實施例之裁切刀具230的剖視圖。前述實施例之裁切設備100的裁切刀具130也可以本實施例之裁切刀具230取代。Please refer to FIG. 4, which illustrates a cross-sectional view of a cutting tool 230 according to another embodiment of the present invention. The cutting blade 130 of the cutting device 100 of the foregoing embodiment may also be replaced by the cutting blade 230 of this embodiment.

裁切刀具230包括刀體231及粗糙化結構232。刀體231具有刀面231s,而粗糙化結構232形成於刀面231s。粗糙化結構232包括數個凹部232r。The cutting blade 230 includes a blade body 231 and a roughening structure 232. The blade body 231 has a blade surface 231s, and the roughened structure 232 is formed on the blade surface 231s. The roughened structure 232 includes a plurality of recessed portions 232r.

刀體231與粗糙化結構232可以是一體成形結構。以製造方法來說,可採用例如是噴砂、水刀、雷射或其它合適技術形成於刀體231之刀面231s上,所形成的凹部232r的範圍即構成粗糙化結構232。以凹部尺寸來說,就噴砂而言,所形成的粗糙化結構232之凹部232r的內徑W1大致是介於約5微米與約80微米之間,較佳可介於約10微米與約50微米之間。然凹部232r的內徑W1的實際範圍可視製程而定,其也可以小於約5微米,或大於約80微米,本發明實施例不加以限定。The blade body 231 and the roughened structure 232 may be an integrally formed structure. In terms of the manufacturing method, for example, sandblasting, waterjet, laser, or other suitable techniques can be used to form the blade surface 231s of the blade body 231, and the range of the formed concave portion 232r constitutes the roughened structure 232. In terms of the size of the recess, the inner diameter W1 of the recessed portion 232r of the roughened structure 232 formed in terms of sandblasting is approximately between about 5 microns and about 80 microns, preferably between about 10 microns and about 50 microns. Between micrometers. However, the actual range of the inner diameter W1 of the recessed portion 232r may depend on the manufacturing process, and may also be less than about 5 microns, or greater than about 80 microns, which is not limited in the embodiment of the present invention.

如第4圖所示,本發明實施例的粗糙化結構232可將刀具與光學捲膜10的接觸模式由面接觸轉變成點接觸,可降低裁切刀具230裁切光學捲膜10的摩擦阻力。此外,如第4圖所示,表面處理液C1附著於粗糙化結構232上,例如位於粗糙化結構232之凹部232r內,因此能增加刀具230與光學捲膜10之間的液體潤滑性,更降低裁切刀具230裁切光學捲膜10的摩擦阻力。As shown in FIG. 4, the roughened structure 232 of the embodiment of the present invention can change the contact mode between the cutter and the optical roll film 10 from surface contact to point contact, and can reduce the frictional resistance of the cutting blade 230 cutting the optical roll film 10. . In addition, as shown in FIG. 4, the surface treatment liquid C1 is attached to the roughened structure 232, for example, it is located in the recessed portion 232 r of the roughened structure 232. Therefore, the liquid lubricity between the cutter 230 and the optical roll film 10 can be increased, and more The frictional resistance of the cutting blade 230 for cutting the optical roll film 10 is reduced.

請參照第5圖,其繪示依據本發明一實施例之光學膜片10a的裁斷面10s附著有表面處理液C1的示意圖。Please refer to FIG. 5, which illustrates a schematic view of a surface treatment liquid C1 attached to a cutting surface 10 s of an optical film 10 a according to an embodiment of the present invention.

裁切刀具230裁斷光學捲膜10,以裁切出光學膜片10a。由於裁切刀具230之數個凹部232r容納有表面處理液C1,因此在裁切後,表面處理液C1可附著在光學膜片10a的裁斷面10s的至少一部分上。由於裁切刀具230經過光學膜片10a的整個厚度,因此裁斷面10s包含第一保護層11、第一覆蓋層12、偏光層13、第二覆蓋層14、黏膠層15及第二保護層16的裁斷面。表面處理液C1附著在光學膜片10a的裁斷面10s的範圍由粗糙化結構232的範圍及/或表面處理液C1附著在粗糙化結構232上的範圍而定。The cutting blade 230 cuts the optical roll film 10 to cut out the optical film 10a. Since the plurality of recesses 232r of the cutting blade 230 contain the surface treatment liquid C1, the surface treatment liquid C1 can adhere to at least a part of the cutting surface 10s of the optical film 10a after cutting. Since the cutting blade 230 passes through the entire thickness of the optical film 10a, the cutting surface 10s includes the first protective layer 11, the first cover layer 12, the polarizing layer 13, the second cover layer 14, the adhesive layer 15, and the second protective layer. Cutaway of 16. The range in which the surface treatment liquid C1 adheres to the cut surface 10s of the optical film 10a depends on the range of the roughened structure 232 and / or the range in which the surface treatment liquid C1 adheres to the roughened structure 232.

在本實施例中,第4及5圖之表面處理液C1為抗靜電液。第1圖之裁切設備100的表面處理液C1可以本實施例之抗靜電液取代。抗靜電液例如是包含溶劑及表面處理劑,其中溶劑包含酒精及水,而表面處理劑例如是抗靜電劑。在一實施例中,以溶劑例如包含酒精與水為100%來說,抗靜電劑的重量百分比約為溶劑的約0.1%~約5%,可達到優良的抗靜電效果。以溶劑為100%來說,在一實施例中,酒精及水的比例可介於1:1~3:7,且以3:7的組成具有更優良的抗靜電效果(相較於比例為1:1而言)。In this embodiment, the surface treatment liquid C1 in FIGS. 4 and 5 is an antistatic liquid. The surface treatment liquid C1 of the cutting device 100 of FIG. 1 may be replaced with the antistatic liquid of this embodiment. The antistatic liquid includes, for example, a solvent and a surface treatment agent, wherein the solvent includes alcohol and water, and the surface treatment agent is, for example, an antistatic agent. In one embodiment, for a solvent such as 100% containing alcohol and water, the weight percentage of the antistatic agent is about 0.1% to about 5% of the solvent, and an excellent antistatic effect can be achieved. Taking the solvent as 100%, in one embodiment, the ratio of alcohol and water may be between 1: 1 to 3: 7, and a composition with 3: 7 has a better antistatic effect (compared with the ratio is 1: 1).

如第5圖所示,由於抗靜電液附著在光學膜片10a之裁斷面10s上,因此可避免靜電吸附現象,進而減少或避免雜質沾附在裁斷面10s上,以保持裁斷面10s的潔淨度。As shown in FIG. 5, since the antistatic liquid adheres to the cutting surface 10s of the optical film 10a, the electrostatic adsorption phenomenon can be avoided, thereby reducing or preventing impurities from adhering to the cutting surface 10s to keep the cutting surface 10s clean degree.

光學膜片10a可貼附於一光學產品(未繪示)上,以提供光學產品一光學功能。在將光學膜片10a貼附於光學產品的製程中,需先將第二保護層16自光學膜片10a上撕除,以露出黏膠層15,然後再以黏膠層15與光學產品之一透光件(未繪示)對接的方式,將光學膜片10a貼附在透光件上。雖然在第二保護層16自光學膜片10a上撕除過程中會於黏膠層15的黏膠面15s產生靜電,然由於裁斷面10s具有優良潔淨度(雜質少),使被靜電吸附到黏膠面15s的雜質會明顯減少,此可避免污染黏膠層15的黏膠面15s,進而增強黏膠層15與光學產品的結合性。此外,前述光學產品例如是觸控面板、顯示面板、觸控顯示面板或任何有需要光學膜片10a的產品,而光學產品的透光件例如是玻璃、透光塑板或其它合適元件。The optical film 10a can be attached to an optical product (not shown) to provide an optical function of the optical product. In the process of attaching the optical film 10a to the optical product, the second protective layer 16 needs to be removed from the optical film 10a to expose the adhesive layer 15, and then the adhesive layer 15 and the optical product are used. A light-transmitting member (not shown) is attached to the optical film 10a on the light-transmitting member. Although static electricity is generated on the adhesive surface 15s of the adhesive layer 15 during the tearing of the second protective layer 16 from the optical film 10a, the cut surface 10s has excellent cleanliness (less impurities), which causes electrostatic adsorption to The impurities on the adhesive surface 15s will be significantly reduced, which can avoid contaminating the adhesive surface 15s of the adhesive layer 15 and thereby enhance the bonding between the adhesive layer 15 and the optical product. In addition, the foregoing optical product is, for example, a touch panel, a display panel, a touch display panel, or any product that requires an optical film 10a, and the light transmitting member of the optical product is, for example, glass, a transparent plastic plate, or other suitable components.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

10‧‧‧光學捲膜10‧‧‧ Optical roll film

10’‧‧‧成分 10’‧‧‧ ingredients

10a‧‧‧光學膜片 10a‧‧‧Optical diaphragm

10s‧‧‧裁切面 10s‧‧‧ cropped noodles

11‧‧‧第一保護層 11‧‧‧first protective layer

12‧‧‧第一覆蓋層 12‧‧‧ the first cover

13‧‧‧偏光層 13‧‧‧polarizing layer

14‧‧‧第二覆蓋層 14‧‧‧second cover

15‧‧‧黏膠層 15‧‧‧ Adhesive layer

15s‧‧‧黏膠面 15s‧‧‧Adhesive surface

16‧‧‧第二保護層 16‧‧‧Second protective layer

100‧‧‧裁切設備 100‧‧‧cutting equipment

110‧‧‧傳輸輪 110‧‧‧Transmission wheel

120‧‧‧承靠輪 120‧‧‧bearing wheel

130、230‧‧‧裁切刀具 130, 230‧‧‧ cutting tools

130s‧‧‧表面 130s‧‧‧ surface

140‧‧‧容器 140‧‧‧container

150‧‧‧表面處理元件 150‧‧‧surface treatment element

231‧‧‧刀體 231‧‧‧Blade

232‧‧‧粗糙化結構 232‧‧‧Roughened structure

231s‧‧‧刀面 231s‧‧‧Blade

232r‧‧‧凹部 232r‧‧‧Concave

A1‧‧‧虛線 A1‧‧‧ dotted line

C1‧‧‧表面處理液 C1‧‧‧ surface treatment fluid

D1、D2‧‧‧轉動方向 D1, D2‧‧‧rotation direction

L1‧‧‧清潔長度 L1‧‧‧Clean length

L2‧‧‧進入深度 L2‧‧‧ into depth

L3‧‧‧裁切厚度 L3‧‧‧ cutting thickness

P1‧‧‧裁切處 P1‧‧‧Cut

T1‧‧‧接觸區 T1‧‧‧contact area

T11、T12‧‧‧切線方向 T11, T12‧‧‧tangent direction

W1‧‧‧內徑 W1‧‧‧Inner diameter

第1~2圖繪示依照本發明一實施例之裁切設備的示意圖。1 to 2 are schematic diagrams of a cutting device according to an embodiment of the present invention.

第3圖繪示第1圖之裁切刀具切斷光學捲膜的示意圖。 FIG. 3 is a schematic diagram showing the cutting blade of FIG. 1 cutting the optical roll film.

第4圖繪示依照本發明另一實施例之裁切刀具的剖視圖。 FIG. 4 is a cross-sectional view of a cutting tool according to another embodiment of the present invention.

第5圖繪示依據本發明一實施例之光學膜片的裁斷面附著有表面處理液的示意圖。 FIG. 5 is a schematic view showing that a surface treatment liquid is attached to a cut surface of an optical film according to an embodiment of the present invention.

Claims (22)

一種裁切刀具,用以裁切一光學捲膜且包括: 一刀體,具有一刀面;以及 一粗糙化結構,形成於該刀面,該粗糙化結構包括複數個凹部。A cutting tool for cutting an optical roll film and comprising: A blade body with a blade face; and A roughened structure is formed on the blade surface, and the roughened structure includes a plurality of concave portions. 如申請專利範圍第1項所述之裁切刀具,其中該刀體與該粗糙化結構為一體成形結構。The cutting tool according to item 1 of the patent application scope, wherein the blade body and the roughened structure are an integrally formed structure. 如申請專利範圍第1項所述之裁切刀具,更包括: 一表面處理液,附著於該粗糙化結構上。The cutting knives described in item 1 of the patent application scope further include: A surface treatment liquid is attached to the roughened structure. 如申請專利範圍第3項所述之裁切刀具,其中該表面處理液為抗靜電液。The cutting tool according to item 3 of the scope of the patent application, wherein the surface treatment liquid is an antistatic liquid. 如申請專利範圍第4項所述之裁切刀具,其中該抗靜電液包含溶劑及抗靜電劑,該抗靜電劑的重量百分比占該溶劑的0.1%~5%,及/或該溶劑包含酒精及水,其中該酒精及該水的比例介於1:1~3:7。The cutting tool according to item 4 of the scope of patent application, wherein the antistatic liquid contains a solvent and an antistatic agent, the weight percentage of the antistatic agent accounts for 0.1% to 5% of the solvent, and / or the solvent contains alcohol And water, wherein the ratio of the alcohol to the water is from 1: 1 to 3: 7. 如申請專利範圍第1項所述之裁切刀具,其中各該凹部的內徑介於5微米與80微米之間。The cutting tool according to item 1 of the scope of patent application, wherein the inner diameter of each of the recesses is between 5 microns and 80 microns. 如申請專利範圍第1項所述之裁切刀具,其中該粗糙化結構係以噴砂、水刀或雷射形成於該刀面上。The cutting tool according to item 1 of the patent application scope, wherein the roughened structure is formed on the blade surface by sandblasting, waterjet or laser. 一種裁切設備,用以裁切一光學捲膜,該裁切設備包括: 一裁切刀具,用以裁切該光學捲膜;以及 一容器,用以容納一表面處理液,該表面處理液用以清潔及/或塗佈該裁切刀具。A cutting device for cutting an optical roll film. The cutting device includes: A cutting blade for cutting the optical roll film; and A container is used for containing a surface treatment liquid, which is used for cleaning and / or coating the cutting blade. 如申請專利範圍第8項所述之裁切設備,更包括: 一表面處理元件,與該裁切刀具接觸且該表面處理元件部分進入該表面處理液內,使該表面處理液透過該表面處理元件清潔及/或塗佈該裁切刀具。The cutting equipment described in item 8 of the patent application scope further includes: A surface treatment element is in contact with the cutting tool and the surface treatment element partially enters the surface treatment liquid, so that the surface treatment liquid passes through the surface treatment element to clean and / or coat the cutting blade. 如申請專利範圍第8項所述之裁切設備,其中該表面處理液包含離型劑。The cutting device according to item 8 of the scope of patent application, wherein the surface treatment liquid contains a release agent. 如申請專利範圍第9項所述之裁切設備,其中該表面處理元件的轉動方向與該裁切刀具的轉動方向係反向,或該表面處理元件的轉速與該裁切刀具的轉速係相異。The cutting device according to item 9 of the scope of patent application, wherein the rotation direction of the surface treatment element is opposite to the rotation direction of the cutting knife, or the rotation speed of the surface treatment element is in accordance with the rotation speed of the cutting knife. different. 如申請專利範圍第9項所述之裁切設備,其中該裁切刀具以一清潔長度與該表面處理元件接觸,該表面處理元件以一進入深度進入該表面處理液內,該進入深度至少等於該清潔長度。The cutting device according to item 9 of the scope of patent application, wherein the cutting tool contacts the surface treatment element with a clean length, and the surface treatment element enters the surface treatment liquid with an entry depth that is at least equal to The cleaning length. 如申請專利範圍第8項所述之裁切設備,其中該表面處理液為矽氧烷聚合物,及/或含氟化合物。The cutting device according to item 8 of the scope of the patent application, wherein the surface treatment liquid is a siloxane polymer, and / or a fluorine-containing compound. 如申請專利範圍第8項所述之裁切設備,其中該裁切刀具包括如申請專利範圍第1~7項之任一項所述之裁切刀具。The cutting device according to item 8 of the patent application scope, wherein the cutting tool includes the cutting tool according to any one of the patent application scope items 1 to 7. 一種裁切方法,包括: 提供如申請專利範圍第8項所述之該裁切設備; 該裁切設備之該裁切刀具裁切該光學捲膜;以及 該裁切設備之該表面處理液清潔及/或塗佈該裁切刀具。A cutting method, including: Provide the cutting equipment as described in item 8 of the scope of patent application; The cutting blade of the cutting equipment cuts the optical roll film; and The surface treatment liquid of the cutting equipment cleans and / or coats the cutting blade. 如申請專利範圍第15項所述之裁切方法,其中該裁切設備更包括: 一表面處理元件,與該裁切刀具接觸且該表面處理元件部分進入該表面處理液內,使該表面處理液透過該表面處理元件清潔及/或塗佈該裁切刀具。The cutting method according to item 15 of the patent application scope, wherein the cutting device further includes: A surface treatment element is in contact with the cutting tool and the surface treatment element partially enters the surface treatment liquid, so that the surface treatment liquid passes through the surface treatment element to clean and / or coat the cutting blade. 如申請專利範圍第16項所述之裁切方法,更包括: 控制該表面處理元件的轉動方向與該裁切刀具的轉動方向,使該表面處理元件的該轉動方向與該裁切刀具的該轉動方向係反向,或控制該表面處理元件的轉速與該裁切刀具的轉速,使該表面處理元件的該轉速與該裁切刀具的該轉速係相異。The cutting method described in item 16 of the scope of patent application, further includes: Control the rotation direction of the surface treatment element and the rotation direction of the cutting tool, make the rotation direction of the surface treatment element and the rotation direction of the cutting tool reverse, or control the rotation speed of the surface treatment element and the cutting direction The rotation speed of the cutting tool is such that the rotation speed of the surface treatment element is different from the rotation speed of the cutting tool. 如申請專利範圍第16項所述之裁切方法,其中該裁切刀具以一清潔長度與該表面處理元件接觸,該表面處理元件以一進入深度進入該表面處理液內,該進入深度至少等於該清潔長度。The cutting method according to item 16 of the scope of patent application, wherein the cutting tool contacts the surface treatment element with a clean length, and the surface treatment element enters the surface treatment liquid with an entry depth that is at least equal to The cleaning length. 如申請專利範圍第15項所述之裁切方法,其中該表面處理液包含離型劑。The cutting method according to item 15 of the scope of patent application, wherein the surface treatment liquid contains a release agent. 如申請專利範圍第15項所述之裁切方法,其中該表面處理液為矽氧烷聚合物,及/或含氟化合物。The cutting method according to item 15 of the scope of patent application, wherein the surface treatment liquid is a siloxane polymer, and / or a fluorine-containing compound. 如申請專利範圍第15項所述之裁切方法,其中該表面處理液為抗靜電液。The cutting method according to item 15 of the scope of patent application, wherein the surface treatment liquid is an antistatic liquid. 如申請專利範圍第21項所述之裁切方法,其中該抗靜電液包含溶劑及抗靜電劑,該抗靜電劑的重量百分比占該溶劑的0.1%~5%,及/或該溶劑包含酒精及水,其中該酒精及該水的比例介於1:1~3:7。The cutting method according to item 21 of the scope of patent application, wherein the antistatic liquid contains a solvent and an antistatic agent, the weight percentage of the antistatic agent accounts for 0.1% to 5% of the solvent, and / or the solvent contains alcohol And water, wherein the ratio of the alcohol to the water is from 1: 1 to 3: 7.
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