TWI693658B - Modified spring cushion for film frame shipper - Google Patents
Modified spring cushion for film frame shipper Download PDFInfo
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- TWI693658B TWI693658B TW105107756A TW105107756A TWI693658B TW I693658 B TWI693658 B TW I693658B TW 105107756 A TW105107756 A TW 105107756A TW 105107756 A TW105107756 A TW 105107756A TW I693658 B TWI693658 B TW I693658B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
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Abstract
Description
本申請案主張2015年3月13日提出申請之第62/133,131號美國臨時專利申請案之權利,該美國臨時專利申請案之揭露內容以引用方式全文併入本文中。 This application claims the right of US Provisional Patent Application No. 62/133,131 filed on March 13, 2015. The disclosure content of the US Provisional Patent Application is incorporated herein by reference in its entirety.
本發明大體而言係關於晶圓傳送裝置,且更具體而言係關於膜架或膠帶架傳送裝置(film frame or tape frame shipper)。 The present invention generally relates to a wafer transfer device, and more specifically relates to a film frame or tape frame shipper.
膜架或膠帶架一般係由一不銹鋼架與一跨該架延伸之膜構成。該膜在其一面上具有一黏合劑。在進行處理之後,通常將一圓形半導體晶圓放置於該膜上。在定位於該膜上之後,該半導體晶圓可被切分成個別片(例如,晶片)、被輸送以供進一步處理、或被儲存。半導體處理行業所使用之晶圓愈來愈大且愈來愈薄,而該等晶圓由於其較大之易碎性而呈現出處理、輸送、及儲運問題。為此,為了搬運具有此等較大且較薄晶圓之膜架,可對習用膜架晶圓載體進行改良。 The film frame or tape frame is generally composed of a stainless steel frame and a film extending across the frame. The film has an adhesive on one side. After processing, a round semiconductor wafer is usually placed on the film. After positioning on the film, the semiconductor wafer may be diced into individual pieces (eg, wafers), transported for further processing, or stored. The wafers used in the semiconductor processing industry are getting larger and thinner, and these wafers present processing, transportation, and storage and transportation problems due to their greater fragility. For this reason, in order to transport film holders with these large and thin wafers, conventional film holder wafer carriers can be improved.
在半導體製造行業中廣泛使用膜架傳送裝置來傳送膜架。多種膜架傳送裝置皆提供一種用以傳送並儲存多達25個安裝至膜架之晶圓或經單分晶粒的安全且有效方式。一容器頂部蓋墊使得能夠重新使用傳送裝 置。可存在適於用以傳送直徑為300mm、200mm、及150mm之晶圓之膜架的膜架傳送裝置。 In the semiconductor manufacturing industry, the film frame conveying device is widely used to convey the film frame. A variety of membrane rack transfer devices provide a safe and effective way to transfer and store up to 25 wafers or diced die mounted to the membrane rack. A lid on the top of the container makes it possible to reuse the conveyor Set. There may be a film frame transfer device suitable for film frames for transferring wafers with diameters of 300 mm, 200 mm, and 150 mm.
已知裝載於習用膜架傳送裝置內之膜架會在一衝擊事件期間「跳動」。亦即,在膜架傳送裝置之外殼上引發之變形可使膜架自所指定對齊狹槽(registration slot)脫離。此種情形可使所駐存晶圓被損壞,且碰撞並損壞相鄰晶圓。 It is known that the film rack loaded in the conventional film rack conveyor will "jump" during an impact event. That is, the deformation induced on the casing of the membrane rack conveying device can cause the membrane rack to detach from the designated registration slot. This situation can cause the resident wafer to be damaged, and collide and damage the adjacent wafer.
一種在衝擊事件期間亦較可靠地將膜架保持於一所指定對齊位置之膜架傳送裝置將受到歡迎。 A film frame transfer device that also maintains the film frame in a designated alignment position more reliably during an impact event will be welcomed.
本發明之各種實施例提供對膜架在一膜架傳送裝置內跳動之增強的預防性。另外,用於防止跳動之結構亦加強在裝載至傳送裝置中期間對膜架之對準。此外,在某些實施例中,此等結構在膜架之厚度與對齊狹槽之間達成一較緊密容差配合,藉此減小膜架與對齊狹槽之間的遊隙且減少伴隨之顆粒產生。 Various embodiments of the present invention provide enhanced prevention of the jitter of the membrane rack within a membrane rack conveyor. In addition, the structure for preventing bouncing also enhances the alignment of the film holder during loading into the conveyor. In addition, in some embodiments, these structures achieve a tighter tolerance fit between the thickness of the membrane holder and the alignment slot, thereby reducing the play between the membrane holder and the alignment slot and reducing concomitant Particle generation.
每一晶圓皆被支撐於一金屬或聚合物晶圓支撐環或架上。晶圓支撐環被接納於定位於膜架傳送裝置之頂部及/或底部處之一彈簧墊(spring cushion)中並由該彈簧墊保持。該彈簧墊對膜架施加一徑向力,以將每一膜架固定於一相應對齊狹槽內,藉此在傳送期間減少膜架在對齊狹槽內之移動且減少顆粒轉移或產生。在某些實施例中,彈簧墊係為可拆除及/或可更換的,且可包含用於促進將彈簧墊耦合至傳送裝置之搭扣特徵(snap feature)。膜架傳送裝置之其他特徵包含:一強制性搭扣閂鎖(positive snap latch),用於固定對傳送裝置之閉合;一非阻塞性閂鎖及可堆疊設計 (non-obtrusive latch and stackable design),用於減小儲存空間及降低傳送成本;以及圓角及傾斜側,用於在清潔期間減少水滯留。膜架傳送裝置可使用防靜電放電(Electro-Static discharge;ESD)材料。亦可使用射頻識別(radio frequency identification;RFID)及雷射標記選擇方案。 Each wafer is supported on a metal or polymer wafer support ring or shelf. The wafer support ring is received in and held by a spring cushion positioned at the top and/or bottom of the film frame transfer device. The spring pad exerts a radial force on the membrane holder to fix each membrane holder in a corresponding alignment slot, thereby reducing the movement of the membrane holder in the alignment slot and reducing particle transfer or generation during transport. In some embodiments, the spring pad is removable and/or replaceable, and may include snap features for facilitating coupling of the spring pad to the transfer device. Other features of the film frame conveyor include: a mandatory snap latch (positive snap latch) used to secure the closure of the conveyor; a non-blocking latch and stackable design (non-obtrusive latch and stackable design), used to reduce storage space and reduce transmission costs; and rounded corners and inclined sides, used to reduce water retention during cleaning. An ESD (Electro-Static discharge) material can be used for the film frame conveying device. Radio frequency identification (RFID) and laser tag selection schemes can also be used.
20:膜架傳送裝置 20: Film rack conveyor
22:容器 22: Container
24:蓋 24: cover
26:內部室 26: interior room
28:模架 28: Formwork
32:側部 32: side
34:導引件 34: Guide
36:彈簧架墊 36: Spring frame pad
36a:彈簧架 36a: Spring frame
36b:彈簧架 36b: Spring frame
38:開槽軌 38: Slotted rail
40:膜架 40: Membrane frame
42:架 42: frame
44:外邊緣 44: outer edge
46:黏合隔膜 46: Adhesive diaphragm
48:晶圓 48: Wafer
52:對置軌道/對置側壁/第一對置側壁 52: Opposite rail/opposite sidewall/first opposing sidewall
54:對置軌道/對置側壁/第二對置側壁 54: Opposite rail/opposite sidewall/second opposing sidewall
55:端壁 55: end wall
56:前後方向 56: front and back direction
57:端壁 57: end wall
58:主墊部 58: Main pad
59:矩形框架 59: rectangular frame
60:彈簧襯墊元件 60: spring pad element
62:對齊狹槽 62: Align slot
64:橫向方向 64: landscape orientation
72:第一梳狀結構 72: First comb structure
74:第一梳狀突出部 74: first comb-shaped protrusion
76:垂直方向 76: vertical
78:第一梳狀間隙 78: first comb gap
79:筆直部 79: Straight
80:錐形部 80: tapered part
82:第二梳狀結構 82: Second comb structure
84:第二梳狀突出部 84: second comb protrusion
88:第二梳狀間隙 88: second comb gap
92:近端 92: Near end
94:遠端 94: far end
96:錐形輪廓 96: tapered profile
98:突出部軸線 98: protrusion axis
102:貫通狹槽 102: through slot
104:錐形柱 104: tapered column
105:狹槽 105: slot
106:內表面 106: inner surface
107:肋 107: rib
108:狹槽 108: slot
110:基底梳狀結構 110: base comb structure
112:基底部 112: base
114:基底梳狀突出部 114: base comb protrusion
116:對齊軌 116: Align rail
118:基底梳狀間隙/間隙 118: base comb gap/gap
122:軌高度 122: rail height
124:近側末端 124: proximal end
126:間隙偏移 126: gap offset
128:遠側末端 128: distal tip
132:突出部高度 132: protrusion height
140:側梳狀結構 140: side comb structure
142:側梳狀突出部 142: side comb protrusion
148:側梳狀間隙 148: side comb gap
152:間隙深度 152: gap depth
154:近側末端 154: proximal end
156:突出部高度 156: protrusion height
158:遠側末端 158: distal tip
162:狹槽深度 162: Slot depth
164:朝上面 164: facing up
166:狹槽 166: Slot
172:最小間隙尺寸 172: minimum gap size
184:隅角 184: corner
186:突出部 186: protrusion
第1圖係為本發明一實施例中一種膜架傳送裝置及所駐存膜架之一組裝圖;第2A圖係為一膜架被裝載至第1圖所示膜架傳送裝置之一容器中之一示意圖;第2B圖係為裝載複數膜架之一膜架容器之一立體圖;第3圖係為第1圖所示膜架傳送裝置之一立體圖;第4A圖係為第1圖所示膜架傳送裝置之一剖面圖;第4B圖係為第1圖所示膜架傳送裝置之一立體剖面圖;第5圖係為一先前技術膜架之一平面圖;第6圖係為本發明一實施例中一種彈簧架墊(spring frame cushion)之一立體圖;第6A圖係為本發明一實施例中第6圖所示彈簧架墊之一放大立體圖;第7圖係為本發明一實施例中一種彈簧架墊之一立體圖;第8圖係為第6圖或第7圖所示彈簧架其中之任一者之一剖面圖;第8A圖係為第1圖所示膜架傳送裝置之蓋之內側,示出複數連接柱(attachment posts)用於接納該彈簧架之一立體圖; 第8B圖係為第8A圖所示具有彈簧架接納於其中;第9圖係為本發明一實施例中一種膜架傳送裝置之一立體剖面圖;第10圖係為本發明一實施例中第9圖所示一側梳狀結構之一放大立體剖面圖;第11圖係為本發明一實施例中第9圖所示底部梳狀結構之一放大立體剖面圖;第12圖係為本發明一實施例中一種具有一上部彈簧架墊及一下部彈簧架墊之膜架傳送裝置之一剖面示意圖;以及第13圖係為本發明一實施例中一種具有一上部彈簧架墊及一對下部彈簧架墊之膜架傳送裝置之一剖面示意圖。 Figure 1 is an assembly diagram of a film rack conveying device and a resident film rack in an embodiment of the present invention; Figure 2A is a film rack being loaded into a container of the film rack conveying device shown in Figure 1 Figure 1B is a perspective view of a film rack container loaded with a plurality of film racks; Figure 3 is a perspective view of a film rack conveying device shown in Figure 1; Figure 4A is a view of Figure 1 Fig. 4B is a perspective cross-sectional view of the membrane rack conveying apparatus shown in Fig. 1; Fig. 5 is a plan view of a prior art membrane rack; Fig. 6 is the basis A perspective view of a spring frame cushion in an embodiment of the invention; FIG. 6A is an enlarged perspective view of a spring frame cushion shown in FIG. 6 in an embodiment of the invention; FIG. 7 is an embodiment of the invention A perspective view of a spring frame pad in the embodiment; Figure 8 is a cross-sectional view of any one of the spring frames shown in Figure 6 or Figure 7; Figure 8A is a film frame conveyance shown in Figure 1 Inside the cover of the device, a perspective view of a plurality of attachment posts for receiving the spring frame is shown; Figure 8B is a perspective cross-sectional view of a film frame conveying device according to an embodiment of the present invention; Figure 9 is a perspective cross-sectional view of a film frame conveying device according to an embodiment of the present invention; Figure 10 is an embodiment of the present invention FIG. 9 is an enlarged perspective cross-sectional view of one of the comb structures on one side; FIG. 11 is an enlarged perspective cross-sectional view of one of the bottom comb structures shown in FIG. 9 in an embodiment of the present invention; A schematic cross-sectional view of a film frame conveying device with an upper spring frame pad and a lower spring frame pad in an embodiment of the invention; and FIG. 13 is an embodiment of the invention with an upper spring frame pad and a pair of A schematic cross-sectional view of the film frame conveying device of the lower spring frame pad.
第1圖至第4圖繪示本發明一實施例中之一膜架傳送裝置20。膜架傳送裝置20包含一容器22及一蓋24,蓋24在容器部上形成閉合,以界定一用於儲存複數個膜架28之內部室26。容器22包含側部32,側部32可包含用於將膜架28導引至容器22中之導引件34(第2圖)。一彈簧架墊36耦合至容器22及蓋24至少其中之一。在一實施例中,彈簧架墊36以可拆卸方式安裝至容器22或蓋24上之開槽軌38。
FIGS. 1 to 4 illustrate a film
參見第5圖,其繪示一膜架40。膜架40包含一架42,架42界定一外邊緣44。一黏合隔膜(adhesive membrane)46跨越架42,一晶圓48黏附至該黏合隔膜46。
See FIG. 5, which shows a
參見第6圖至第8圖,其繪示本發明實施例中彈簧架墊36之若干種形式。彈簧架墊36具體地被稱作彈簧架36a(第6圖)及彈簧架361b(第
7圖),且一般地或共同地被稱作彈簧架墊36。彈簧架墊36包含複數對置軌道或對置側壁52及54,複數對置軌道或對置側壁52及54沿一前後方向(fore/aft direction)56延伸且連接至複數端壁55、57以形成一矩形框架(rectangular framework)59。軌道支撐一主墊部58,複數個彈簧襯墊元件(spring cushion element)60跨越於主墊部58之間。各該彈簧襯墊元件60界定複數個對齊狹槽62。各該對齊狹槽62沿與前後方向56正交之一橫向方向64延伸,對齊狹槽62適以卡住膜架40之外邊緣44,以限制膜架40沿前後方向56之移動。
Refer to FIG. 6 to FIG. 8, which illustrate several forms of the
在各種實施例中,一第一梳狀結構(comb structure)72包含複數個第一梳狀突出部74,該等第一梳狀突出部74自彈簧架墊36之第一對置側壁52沿一垂直方向76延伸。(垂直方向76係與前後方向56正交且與橫向方向64正交。)該等第一梳狀突出部74彼此間隔開,以界定複數個第一梳狀間隙78。各該第一梳狀突出部74具有一筆直部79(straight portion)及一錐形部80(tapered portion)。該等第一梳狀突出部74其中之相鄰第一梳狀突出部74適以嚙合並接納膜架40之外邊緣,且各該第一梳狀間隙78係界定於第一梳狀結構72之第一梳狀突出部74其中之相鄰者之間,該等第一梳狀間隙78適以卡住膜架40之外邊緣44,以限制外邊緣44沿前後方向56之移動。此外,各該對齊狹槽62沿橫向方向64與該等第一梳狀間隙78其中之一相應者對準。
In various embodiments, a
在某些實施例中,一第二梳狀結構82包含複數個第二梳狀突出部84,該等第二梳狀突出部84自彈簧架墊36之第二對置側壁54沿垂直方向76延伸。該等第二梳狀突出部84彼此間隔開,以界定複數個第二梳狀間
隙88。該等第二梳狀突出部84其中之相鄰者適以嚙合並接納膜架40之外邊緣44,且各該第二梳狀間隙88係界定於第二梳狀結構82之該等第二梳狀突出部84其中之相鄰者之間,各該第二梳狀間隙88適以卡住膜架40之外邊緣44,以限制外邊緣44沿前後方向56之移動。此外,各該對齊狹槽62沿橫向方向64與該等第二梳狀間隙88其中之一相應者對準。
In some embodiments, a second comb-shaped
在各種實施例中,該等第一梳狀突出部74及/或該等第二梳狀突出部84之至少一部分各自包含一近端92及一遠端94且界定沿橫向方向64伸出之一錐形輪廓96。錐形輪廓96可關於沿垂直方向76延伸之一突出部軸線98(第6A圖)對稱,錐形輪廓96係自近端92至遠端94朝突出部軸線98傾斜。在一實施例中,錐形輪廓96之至少一部分係為拱形的(未繪示)。
In various embodiments, at least a portion of the first comb-shaped
在一實施例中,主墊部58界定複數個貫通狹槽(through-slot)102,各該貫通狹槽102係設置於相鄰之複數個彈簧襯墊元件60之間,且各該彈簧襯墊元件60具有各自的對齊狹槽62。
In one embodiment, the
參見第8圖至第9圖,彈簧架墊36藉由與單一之錐形柱104干涉配合而被附加至蓋24,並且自蓋24的內表面106延伸。複數個錐形柱104形成複數個狹槽105,如此複數個軌道之間夠緊而能將彈簧架墊摩擦地固定至頂部蓋。蓋24及容器22具有複數個肋107,複數個肋107用以界定複數個狹槽108來接收及穩固複數個膜架。
Referring to FIGS. 8 to 9, the
參見第9圖至第11圖,其揭示本發明實施例中之其他梳狀結構。在一實施例中,至少一個基底梳狀結構110設置於容器22之一基底部112上,基底梳狀結構110包含複數個基底梳狀突出部114,該等基底梳狀突出部114自容器22之基底部沿垂直方向76延伸至內部室26中,該等基底梳狀突
出部114彼此間隔開,以界定複數個基底梳狀間隙118。該等基底梳狀突出部114其中之相鄰者適以嚙合並接納膜架40之外邊緣44,且各該基底梳狀間隙118係界定於基底梳狀結構110之該等基底梳狀突出部114其中之相鄰者之間。
Refer to FIG. 9 to FIG. 11, which disclose other comb structures in the embodiments of the present invention. In one embodiment, at least one
該等基底梳狀間隙118適以卡住膜架40之外邊緣44,以限制外邊緣44沿前後方向56之移動。此外,彈簧架墊36之各該對齊狹槽62係與該等基底梳狀間隙118其中之一相應者平面對準。亦即,各該基底梳狀間隙118係以一平面為中心,而該平面亦以對齊狹槽62其中之一為中心,該平面係與前後方向56正交。在一實施例中,該等基底梳狀突出部114之至少一部分包含第6A圖所繪示之錐形輪廓。
The base comb-shaped
在一實施例中,一對齊軌116自基底部伸出且沿前後方向56延伸,該對齊軌116沿垂直方向76在容器22之基底部112上方界定一軌高度122,其中各該基底梳狀間隙118之一近側末端124(即,間隙118之「底部」)界定一相對於基底部112之間隙偏移126,間隙偏移126小於軌高度122(第11圖),且其中各該基底梳狀突出部114的相對於基底部112之一遠側末端128界定一大於軌高度122之突出部高度132。
In one embodiment, an
在功能上,由於軌高度122大於相對於基底部112之間隙偏移126,因此插入至基底部112中之一膜架40將擱置於對齊軌116上。此可為基底梳狀結構110消除某些應力,且達成膜架40在膜架傳送裝置20內之一更準確對齊。
Functionally, since the
在某些實施例中,至少一個側梳狀結構140設置於容器22之側部32上,側梳狀結構140包含沿垂直方向76延伸至內部室26中之複數個側
梳狀突出部142,側梳狀結構140包含複數個彼此間隔開之側梳狀突出部142,以界定複數個側梳狀間隙148。該等側梳狀突出部142其中之相鄰者適以嚙合並接納膜架40之外邊緣44,各該側梳狀間隙148係界定於側梳狀結構140之相鄰側梳狀突出部142之間。
In some embodiments, at least one
該等側梳狀間隙148適以卡住膜架40之外邊緣44,以限制外邊緣44沿前後方向56之移動。此外,彈簧架墊36之各該對齊狹槽62係與該等側梳狀間隙148其中之一相應者平面對準。在一實施例中,該等側梳狀突出部142之至少一部分包含第6A圖所繪示之錐形輪廓。
The
在各種實施例中,且參見第8圖,各該第一梳狀間隙78及第二梳狀間隙88界定具有一近側末端154之間隙深度152。各該第一梳狀突出部74及第二梳狀突出部84沿垂直方向76自該等第一梳狀間隙78及第二梳狀間隙88其中之一相鄰者之近側末端154至該等第一梳狀突出部74/第二梳狀突出部84其中之一相鄰者之一遠側末端158界定一突出部高度156。各該對齊狹槽62沿垂直方向76相對於主墊部58之一朝上面164界定一狹槽深度162。
In various embodiments, and referring to FIG. 8, each of the
在各種實施例中,突出部高度156對狹槽深度162之一比率介於1.5至5且包含1.5及5之一範圍內。在某些實施例中,該比率介於2至4且包含2及4之一範圍內。在某些實施例中,該比率介於2.5至3.5且包含2.5及3.5之一範圍內。(本文中,一稱為「包含性(inclusive)」之範圍係包含所陳述範圍之端點值。)在所有此等實施例中,第一梳狀突出部74及第二梳狀突出部84皆大於狹槽深度162。
In various embodiments, the ratio of protrusion height 156 to slot depth 162 is in the range of 1.5 to 5 and inclusive. In some embodiments, the ratio is in the range of 2 to 4 and inclusive. In some embodiments, the ratio is between 2.5 and 3.5 and includes one of 2.5 and 3.5. (In this context, a range called "inclusive" includes the endpoints of the stated range.) In all such embodiments, the first comb-shaped
在功能上,第一梳狀突出部74及第二梳狀突出部84皆大於狹
槽深度162之情形有助於防止或抵抗膜架40在一衝擊事件期間之「跳動」。本文所提供之各圖繪示彈簧架墊36處於一未偏轉狀態;在被裝載一膜架40後,主墊部58將偏轉以使狹槽166之一底部與近側末端154處於相同高度。因此,若膜架40使對齊狹槽62「跳動」,則第一梳狀突出部74及第二梳狀突出部84之第一梳狀間隙78及第二梳狀間隙88之較大高度將阻止膜架40之外邊緣44並將膜架40重新引導回至對齊狹槽62中。
Functionally, both the first comb-shaped
再次參見第6A圖,在一實施例中,該等第一梳狀間隙78及第二梳狀間隙88之至少一部分各自沿前後方向56界定一最小間隙尺寸172。最小間隙尺寸172可被定為用於與膜架40達成一緊密滑動配合之尺寸。在某些實施例中,最小間隙尺寸172介於0.05英吋至0.085英吋且包含0.05英吋及0.085英吋之範圍內。在某些實施例中,最小間隙尺寸172介於0.055英吋至0.075英吋且包含0.055英吋及0.075英吋之範圍內。在某些實施例中,最小間隙尺寸172介於0.055英吋至0.065英吋且包含0.055英吋及0.065英吋之範圍內。
Referring again to FIG. 6A, in one embodiment, at least a portion of the
在功能上,最小間隙尺寸172相對於膜架40之外邊緣44之容差愈緊,對膜架40之固持則愈緊,藉此減少膜架40沿前後方向56之移動,此起到減少顆粒產生之作用。同時,狹槽62可保持為過大的,以便適應在裝載期間進行容易對準及在一衝擊事件期間進行重新對準。
Functionally, the tighter the tolerance of the
在各種實施例中,彈簧架墊36係藉由以一壓入配合形式安裝至開槽軌38中而可自膜架傳送裝置20拆卸。
In various embodiments, the
參見第12圖,一第一彈簧架墊36設置於蓋上且一第二彈簧架墊36設置於容器上。
Referring to FIG. 12, a first
參見第13圖,一第三彈簧架墊36設置於容器上。
Referring to FIG. 13, a third
在各種實施例中,且再次參見第6圖及第7圖,彈簧架墊32包含一連續架182。連續架182包含四個壁,以界定四個隅角184。對於彈簧架36b而言,第一梳狀結構72及第二梳狀結構82包含圍繞四個隅角184延伸之突出部186。
In various embodiments, and referring again to FIGS. 6 and 7, the
22‧‧‧容器 22‧‧‧Container
24‧‧‧蓋 24‧‧‧ cover
28‧‧‧模架 28‧‧‧Mold
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TW104204915U TWM510539U (en) | 2015-03-13 | 2015-04-01 | Modified spring cushion for film frame shipper |
TW105107756A TWI693658B (en) | 2015-03-13 | 2016-03-14 | Modified spring cushion for film frame shipper |
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CN (1) | CN107534006B (en) |
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US20030221985A1 (en) * | 2001-05-30 | 2003-12-04 | Toshitsugu Yajima | Precision substrate storage container and retaining member therefor |
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EP2270847A1 (en) * | 2008-04-25 | 2011-01-05 | Shin-Etsu Polymer Co. Ltd. | Retainer and substrate storage container provided with same retainer |
EP1133437B1 (en) * | 1998-07-10 | 2014-05-14 | Entegris, Inc. | Cushioned wafer container |
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JPS5285477A (en) * | 1976-01-09 | 1977-07-15 | Senken Kk | Wafer carrying container for integrated circuit |
US5207324A (en) * | 1991-03-08 | 1993-05-04 | Fluoroware, Inc. | Wafer cushion for shippers |
JP2586364Y2 (en) * | 1992-12-28 | 1998-12-02 | 住友シチックス株式会社 | Transport wafer case |
US20070295638A1 (en) * | 2006-06-21 | 2007-12-27 | Vantec Co., Ltd. | Wafer transportable container |
EP2544965B1 (en) * | 2010-03-11 | 2019-05-22 | Entegris, Inc. | Thin wafer shipper |
JP6203819B2 (en) * | 2012-04-09 | 2017-09-27 | インテグリス・インコーポレーテッド | Wafer transport container |
-
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2016
- 2016-03-14 JP JP2017548150A patent/JP6523479B2/en active Active
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EP1133437B1 (en) * | 1998-07-10 | 2014-05-14 | Entegris, Inc. | Cushioned wafer container |
US20030221985A1 (en) * | 2001-05-30 | 2003-12-04 | Toshitsugu Yajima | Precision substrate storage container and retaining member therefor |
US20030010673A1 (en) * | 2001-07-12 | 2003-01-16 | Entegris, Inc. | Horizontal cassette |
JP2005005396A (en) * | 2003-06-10 | 2005-01-06 | Shin Etsu Polymer Co Ltd | Substrate storing container |
EP2270847A1 (en) * | 2008-04-25 | 2011-01-05 | Shin-Etsu Polymer Co. Ltd. | Retainer and substrate storage container provided with same retainer |
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TWM510539U (en) | 2015-10-11 |
CN107534006A (en) | 2018-01-02 |
CN107534006B (en) | 2020-11-03 |
JP6523479B2 (en) | 2019-06-05 |
TW201703175A (en) | 2017-01-16 |
JP2018509767A (en) | 2018-04-05 |
WO2016149209A1 (en) | 2016-09-22 |
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