TWI643285B - Buffer structure - Google Patents

Abstract

The invention provides a buffer structure, which is mainly composed of an upper shell portion, a lower shell portion, at least one buffer ring portion, and a buffer air chamber, and the buffer ring portion is elastically pressed against the upper shell portion and the lower shell portion. When the deformation section of the buffer ring portion is deformed by an external force and the upper guiding section and the lower guiding section are close to each other, the deformation resistance force generated effectively absorbs the impact force of the wafer cassette, and achieves buffering and protection. The effect of the effect.

Description

Buffer structure

The present invention relates to a bumper structure, and more particularly to a bumper structure for use on a wafer cassette.

Press, in the fab, the wafer cassette plays a very important role in the function of storing and transferring multiple wafers between semiconductor processes, while providing a high clean placement environment for the wafer to ensure the process. The wafer is not contaminated by particles from the external environment. Since the thickness of the wafer itself is extremely thin, care must be taken during handling to avoid wafer damage due to collisions.

Referring to FIG. 1 , the conventional wafer cassette 100 is mostly locked at the bottom end of the wafer cassette 100 by a plurality of buffers 10 to reduce the probability of the wafer cassette 100 colliding, but the conventional buffer 10 only The outer casing portion 11 has a limited anti-shock effect, so that the shock caused by the wafer cassette 100 during the transfer causes the wafer cassette 100 to be damaged or the particles of the wafer cassette 100 to be dropped onto the wafer surface to cause crystals. The problem of falling wafer yield cannot fully achieve the effect of protecting the wafer; in addition, during the process of transporting the wafer cassette 100, due to the high fluctuations on the moving path, the wafer cassette 100 may be tilted, etc., and the situation may be The wafer to be transported collides, which causes a problem of wafer damage, which causes wafer fragmentation and the like.

Therefore, there is a need in the industry for a buffer structure that provides greater vibration resistance under typical transportation conditions, i.e., the direction in which the present invention is intended to be improved.

In view of the above-mentioned shortcomings of the prior art, the present invention provides a buffer structure, which mainly relies on the impact force of the wafer cassette and achieves the buffering and protection effects.

To achieve the foregoing objects, the present invention is a buffer structure comprising:

An upper shell portion includes an upper shell connecting end and at least one air venting hole.

The shell part contains the lower shell connection end.

At least one buffer ring portion capable of striking the upper casing portion and the lower casing portion between the upper casing portion and the lower casing portion, and having an upper guiding portion connecting the connecting end of the upper casing and connecting the lower casing a lower guiding section of the connecting end and a deforming section between the upper guiding section and the lower guiding section.

a buffer air chamber surrounded by the buffer ring portion, the upper shell portion and the lower shell portion, and communicating with the air venting hole, the upper guiding portion and the deforming portion being deformed by an external force The lower guiding sections are close to each other, and the gas in the buffer chamber is discharged through the venting holes.

In a preferred embodiment, a first angle of 90 degrees is formed between the upper guiding section and the upper housing connecting end.

In a preferred embodiment, a second angle of 90 degrees is formed between the lower guiding section and the lower casing connecting end.

In a preferred embodiment, the outer diameter of the buffer ring portion is larger than the outer diameters of the upper and lower casing portions.

In a preferred embodiment, the screw further includes two screws, and the upper casing has two screw holes that can be screwed to the two screws.

In a preferred embodiment, the method further comprises at least one mixed gel, and the mixed gel is contained in the buffer gas chamber.

Accordingly, the present invention provides a buffer structure which is mainly composed of an upper shell portion, a lower shell portion, at least one buffer ring portion and a buffer air chamber, and the buffer ring portion is springed against the upper shell portion and the lower portion. The shell portion is such that when the deformed section of the buffer ring portion is deformed by an external force and the upper guiding portion and the lower guiding portion are close to each other, the deformation resistance force generated effectively absorbs the impact force of the wafer cassette and reaches the buffering force. The effectiveness of protection.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to FIG. 2 to FIG. 4, a first embodiment of the present invention provides a buffer structure including an upper casing portion 20, a lower casing portion 30, at least one buffer ring portion 40, and a buffer chamber 50:

The upper casing portion 20 has a circular shape and includes an upper casing connecting end 21 and a through surface 22 having two through holes 221 and two screwing holes 222.

The lower casing portion 30 has a circular shape and includes a lower casing connecting end 31 having an outer diameter equal to the outer diameter of the upper casing portion 20.

The at least one buffer ring portion 40 is annular and elastic material, and can be elastically opposed to the upper shell portion 20 and the lower shell portion 30 and located between the upper shell portion 20 and the lower shell portion 30, and has a connection The upper guiding section 41 of the upper housing connecting end 21, a lower guiding section 42 connecting the lower housing connecting end 31, and a deformation section 43 between the upper guiding section 41 and the lower guiding section 42; In the first embodiment of the present invention, the at least one ring portion 40 is exemplified, but not limited thereto; the two buffer ring portions 40 are divided into a first buffer ring portion 40A, and a first buffer is connected. The second buffer ring portion 40B of the ring portion 40A, the first upper guiding portion 41A of the first buffer ring portion 40A is connected to the upper casing connecting end 21, and the first lower guiding portion 42A of the first buffer ring portion 40A Connected to the second upper guiding portion 41B of the second buffer ring portion 40B, the second lower guiding portion 42B of the second buffer ring portion 40B is connected to the lower housing connecting end 31, the first upper guiding portion 41A There is a first deformation section 43A between the first lower guiding section 42A and a second deformation section 43B between the second lower guiding section 42B and the second lower guiding section 42B. Outside of department 40 The diameter is larger than the outer diameter of the upper casing portion 20 and the lower casing portion 30; the first upper guiding portion 41A and the upper casing connecting end 21 form a first angle Q1 at 90 degrees, and the second lower guide A second angle Q2 of 90 degrees is formed between the lead portion 42B and the lower shell connecting end 31. Thereby, the design of the first angle Q1 and the second angle Q2 will enable the buffer ring portion 40 to acutely sense the deformation change of the damper structure, and react to the effect of buffering and damping energy dissipation.

Referring to FIG. 3A and FIG. 4 , the buffer air chamber 50 is surrounded by the two buffer ring portions 40 , the upper shell portion 20 and the lower shell portion 30 and communicates with the air venting hole 221 and has a linear direction 51 . Referring to FIG. 3B and FIG. 4, when the first deformation section 43A and the second deformation section 43B are deformed by an external force, the first upper guiding section 41A and the first lower guiding section 42A. Along the linear direction 51, the second upper guiding section 41B and the second lower guiding section 42B are also close to each other in the linear direction 51, and at the same time, the gas in the buffer plenum 50 is compressed. The venting hole 221 is discharged; thereby, the first deformation portion 43A and the second deformation portion 43B are deformed by the external force, and at the same time, a force against the external force is generated to the both ends, thereby achieving damping energy dissipation and The effect of the buffer (deliberately exaggerate this amount of deformation, to be easy to understand).

The above is a structure of each component of a buffer structure provided by the present invention and a configuration description thereof.

It should be noted that, as shown in FIG. 4, the present invention can be screwed to the two screw holes 222 through two screws 60 (only one screw is shown) to lock the present invention to the wafer cassette A. The bottom end, wherein the screw 60 is a hexagonal screw; in addition, the buffer air chamber 50 of the present invention can accommodate at least one mixed gel B, and the mixed gel B abuts against the inner wall surface of the lower shell portion 30, this embodiment The mixed gel B is exemplified by three superimposed compositions, but not limited thereto. Referring to FIG. 5, the buffer gas chamber 50 can also be accommodated in the two mixed gels B; As shown in FIG. 4, the buffer plenum 50 houses a connecting aluminum block C connecting the inner wall surface of the upper casing portion 20, and the connecting aluminum block C is at an appropriate distance from the mixed gel B and is provided for the two vent holes. 221 and the two screw holes 222 are penetrated. The configurations and actuation modes described above are the same as those in the prior art, and are not the focus of the present invention. Therefore, the detailed structure and operation mode of the components are not described in detail.

It is to be noted that, as shown in FIG. 5, it is a cross-sectional view of a second embodiment of the present invention. In this embodiment, the at least one buffer ring portion 40 is exemplified by three examples, and the buffer ring portion 40 is continuous. plural The connection increases the amount of deformation and ensures that the deformed force guides the direction, so that the deformation of the damper structure during the deformation process reduces the occurrence of skew and other directional forces to achieve the forward buffering requirement.

Referring to FIG. 6, which is a cross-sectional view of a third embodiment of the present invention, the present embodiment differs from the first and second embodiments in that: the at least one buffer ring portion 40 is taken as an example, and the resistance generated during extrusion is generated. The deformation force can effectively share the impact force of the wafer cassette and achieve the requirement of positive buffering. The rest of the structure, configuration and efficacy are the same as those of the first and second embodiments.

In summary, the present invention provides a damper structure in which the damper portion 40 of the damper ring portion 40 is pressed by an external force by the buffer ring portion 40 being biased against the upper casing portion 20 and the lower casing portion 30. When the upper guiding section 41 and the lower guiding section 42 are close to each other, the deformation resistance generated is effective to share the external force of the impact of the wafer cassette, and the buffering and protection functions are achieved, thereby providing a good Damping energy dissipation and auxiliary buffering effects.

However, the above embodiments and drawings are merely preferred embodiments of the present invention, and should not be construed as limiting the scope of the embodiments of the present invention. It is within the scope of the patent of the present invention.

[study]

100‧‧‧wafer box

10‧‧‧buffer

11‧‧‧ Shell Department

〔this invention〕

A‧‧‧ wafer cassette

B‧‧‧Hybrid

C‧‧‧Connected aluminum block

20‧‧‧Upper shell

21‧‧‧Upper shell connection

22‧‧‧through surface

221‧‧‧ Ventilation holes

222‧‧‧Spiral hole

30‧‧‧ Lower shell

31‧‧‧lower shell connection

40‧‧‧buffer ring

40A‧‧‧First cushioning ring

41A‧‧‧First upper guiding section

42A‧‧‧First lower guiding section

43A‧‧‧First deformation

40B‧‧‧Second buffer ring

41B‧‧‧Second upper guiding section

42B‧‧‧Second lower guiding section

43B‧‧‧Second deformation

41‧‧‧Upper guiding section

42‧‧‧Lower guiding section

43‧‧‧ deformation section

50‧‧‧buffer chamber

51‧‧‧Line direction

60‧‧‧ screws

Q1‧‧‧The first angle

Q2‧‧‧second angle

1 is a perspective view of a conventional buffer structure; FIG. 2 is a perspective view of a first embodiment of the present invention; FIG. 3A is a partially enlarged view of the first embodiment of the present invention, showing a state in which the buffer ring portion is uncompressed; A partially enlarged view of the first embodiment of the invention, showing a state in which the buffer ring portion is compressed; FIG. 4 is a cross-sectional view showing the state of the first embodiment of the present invention, showing the state of the locked wafer cassette of the present invention; FIG. 5 is a second embodiment of the present invention. A cross-sectional view of an example showing three buffer ring portions; and Fig. 6 is a cross-sectional view showing a third embodiment of the present invention, showing a buffer ring portion.

Claims (6)

A buffer structure comprising: an upper casing portion including an upper casing connecting end and at least one air venting hole; a lower casing portion including a lower casing connecting end; at least one buffer ring portion capable of striking the upper casing portion and the a lower casing portion between the upper casing portion and the lower casing portion, and having an upper guiding portion connecting the connecting end of the upper casing, a lower guiding portion connecting the connecting end of the lower casing, and a lower guiding portion at the upper guiding portion a deformation section between the lower guiding section; and a buffer air chamber surrounded by the buffer ring portion, the upper casing portion and the lower casing portion, and communicating with the air venting hole, when the deformation portion is subjected to When the external force is pressed and deformed, the upper guiding section and the lower guiding section are close to each other, and the gas in the buffering air chamber is discharged through the air leakage hole. The damper structure of claim 1, wherein the upper guiding section and the upper casing connecting end form a first angle of 90 degrees. The damper structure of claim 1, wherein the lower guiding section and the lower casing connecting end form a second angle of 90 degrees. The damper structure of claim 1, wherein an outer diameter of the buffer ring portion is larger than an outer diameter of the upper and lower case portions. The damper structure of claim 1, further comprising two screws, the upper casing portion having two screwing holes that can be screwed to the two screws. The buffer structure of claim 1, further comprising at least one mixed gel, the mixed gel being accommodated in the buffer gas chamber.