TWI690074B - Display panel, manufacture method thereof and electronic device having same - Google Patents

Abstract

A display panel comprises a μLED array substrate, an upper substrate, a light shielding portion, and a color conversion layer. The μLED array substrate faces the upper substrate. A plurality of μLEDs are formed on the μLED array substrate. The plurality of μLEDs are arranged in a matrix arrangement and spaced apart from each other. The light shielding portion is located between the μLED array substrate and the upper substrate, and both sides thereof are respectively in contact with the μLED array substrate and the upper substrate. The light shielding portion corresponding to the position of each μLED is formed with an accommodation hole of the two sides penetrating the light shielding portion. Each μLED is allowed to be placed in an accommodating hole. The light shielding portion is opaque. The color conversion layer is disposed on the surface of the upper substrate toward the μLED array substrate. The color conversion layer comprises a plurality of color conversion units. Each color conversion unit is located in an accommodating hole. The μLEDs located in a same accommodating hole are spaced from the color conversion unit. The color conversion layer contains a quantum dot material. The present disclosure also provides a method for manufacturing the display panel and an electronic device having same.

Description

Display panel, preparation method and electronic device using the display panel

The invention relates to a display panel, a preparation method of the display panel and an electronic device applying the display panel.

Micro-LED (micro-LED or μ LED) display is a display that uses a high-density micro-sized micro LED array integrated on a substrate as a display pixel to achieve image display, and a large-size outdoor LED display screen In the same way, each pixel can be addressed and driven separately, and can be regarded as a reduced version of the outdoor LED display screen, reducing the pixel point distance from millimeter level to micron level, μ LED display and organic light-emitting diode (Organic Light-Emitting Diode (OLED) displays are also self-luminous displays. However, μ LED displays have the advantages of better material stability, longer life, and no image imprinting than OLED displays. The μ LED described herein generally refers to LEDs with a size of less than 200 microns.

There are currently two main structures for μLED displays, one is the mass transfer of red (R), green (G) and blue (B) μLEDs on the active matrix backplane, with red (R ), green (G) and blue (B) μLED directly obtain the full-color effect; another structure is to form a single-color (usually blue) μLED on the active matrix backplane, and set a color conversion layer to convert blue light Get full color effect. For the first structure, due to the difficulty of mass transfer technology, the use of this structure is limited. Aiming at the structure in which the monochromatic μ LED and the color conversion layer are combined, a conventional color conversion layer adopts phosphor powder and viscose mixed, and the technical solution of phosphor powder and glue mixed, due to insufficient density and location of phosphor powder The dispersion is uneven, and its optical uniformity and reliability are not ideal. The conventional size of fluorescent powder is 5~15um, which cannot be applied to high-resolution displays, and can only be used for backlight modules or low-resolution displays.

Another color conversion layer uses quantum dots for color conversion. Quantum dots, also known as nanocrystals, are generally spherical or quasi-spherical, and are made of semiconductor materials (usually composed of IIB~VIA or IIIA~VA elements) and have a diameter of 2-20nm. The excitation spectrum of quantum dots is wide and continuous, and the emission spectrum of quantum dots is narrow and symmetrical, with adjustable color and high photochemical stability. The emission spectrum of quantum dots can be controlled by changing the size of quantum dots, and the spectrum covers the entire visible light region. When using quantum dots as the color conversion layer, the powder of quantum dot materials is sprayed on the outer surface of the μ LED, the quantum dot materials are in direct contact with the μ LED, and the heat emitted by the μ LED is directly transferred to the quantum dot materials, causing the quantum dot materials to be exposed to high temperature light However, the deterioration deteriorates the display quality of the display panel. Quantum dot materials will be destroyed not only by high temperature, but also by the corrosion of water and oxygen.

In view of this, the present invention provides a display panel, which has a long service life.

In addition, a preparation method of the display panel and an electronic device using the display panel are also provided.

A display panel includes a μ LED array substrate, an upper substrate, a light-shielding portion, and a color conversion layer, the μ LED array substrate is disposed opposite to the upper substrate, and the μ LED array substrate is provided with a plurality of arrays arranged in an array and each other Μ LEDs arranged at intervals, the light shielding portion is located between the μ LED array substrate and the upper substrate and both sides are in contact with the μ LED array substrate and the upper substrate respectively, and the light shielding portion is formed corresponding to each μ LED position through the light shielding portion The accommodating holes on both sides allow each μ LED to be accommodated in an accommodating hole, the shading portion is opaque, and the color conversion layer is provided on the surface of the upper substrate facing the μ LED array substrate, The color conversion layer includes a plurality of color conversion units, each color conversion unit is located in a The μ LEDs located in the accommodating hole and located in the same accommodating hole are spaced apart from the color conversion unit, and the color conversion layer contains quantum dot material.

A preparation method of a display panel includes: providing a light-transmitting upper substrate, forming a light-shielding portion on the surface of the upper substrate, the light-shielding portion being formed of an opaque material, and forming a plurality of accommodating holes penetrating the light-shielding portion; A color conversion layer is formed on the surface of the upper substrate where the light-shielding portion is formed, the color conversion layer includes a plurality of color conversion units, each color conversion unit is located in a receiving hole; a μ LED array substrate is provided, and the μ LED array The substrate is provided with a plurality of μ LEDs arranged in an array and spaced apart from each other; the upper substrate and the μ LED array substrate are butted so that the light shielding portion is located between the μ LED array substrate and the upper substrate and both sides thereof Contact with the μ LED array substrate and the upper substrate, so that each μ LED is accommodated in a containing hole.

An electronic device includes a body and a display panel disposed in the body.

In the display panel of the present invention, the quantum dot material is placed in a closed space. After the packaging is completed, water and oxygen will be difficult to enter the closed space, effectively preventing the quantum dot material from being corroded by water and oxygen. Moreover, the quantum dot material is not in direct contact with the LED, and the heat emitted by the LED will not be directly transferred to the quantum dot material, causing the quantum dot material to deteriorate.

1: Electronic device

2: Ontology

10, 20: display panel

11, 21: Viscose

12, 22: μ LED array substrate

123, 223: μ LED

121, 221: bottom plate

13, 23: upper substrate

131, 231: first surface

14, 24: Sealant

15, 25: Shade

151, 251: receiving hole

16, 26: Color conversion layer

161,261: Red color conversion unit

162, 262: Green color conversion unit

263: Blue color conversion unit

17, 27: pixels

18, 28: Active matrix substrate

181, 281: TFT

19, 29: Sub pixels

191, 291: red sub-pixels

192, 292: green sub-pixels

193, 293: blue sub-pixel

FIG. 1 is a schematic plan view of a display panel according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view of FIG. 1 along II-II.

3 is a schematic cross-sectional view of a display panel according to a second embodiment of the invention.

4 is a schematic diagram of an electronic device using a display panel according to a preferred embodiment of the present invention.

In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention. The same symbols in the drawings represent the same or similar elements. However, those of ordinary skill in the art should understand that the embodiments provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn to scale according to their actual dimensions.

The specific embodiments of the present invention will be further described in detail below with reference to the drawings.

First embodiment

Please refer to FIGS. 1 and 2. FIG. 1 is a schematic plan view of a display panel according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 along the sectional line II-II.

The display panel 10 of this embodiment includes a μLED array substrate 12, an upper substrate 13, a light shielding portion 15, and a color conversion layer 16.

As shown in FIG. 2, the μ LED array substrate 12 and the upper substrate 13 are oppositely arranged, and the μ LED array substrate 12 is provided with a plurality of μ LEDs 123 arranged in an array and spaced apart from each other, and the light blocking portion 15 is located on the upper substrate 13 and the μ LED array Between the substrates 12 and both sides thereof are in contact with the μ LED array substrate 12 and the upper substrate 13 respectively, the light shielding portion 15 has a certain thickness, and the light shielding portion 15 is formed corresponding to the position of each μ LED 123 through the light shielding portion 15 The accommodating holes 151 on both sides allow each μ LED 123 to be accommodated in an accommodating hole 151, and the light-shielding portion 15 is opaque. The color conversion layer 16 is formed on the surface of the upper substrate 13 facing the μ LED array substrate 12. The color conversion layer 16 includes a plurality of color conversion units, and each color conversion unit is located in a receiving hole 151 and located in μ in the same receiving hole The LED 123 is set at a distance from the color conversion unit. The μ LED array substrate 12 is used to emit light as a display light source of the display panel 10, and the color conversion layer 16 contains quantum dot materials, which can convert the color of the light emitted by the μ LED array substrate 12 to obtain a display According to the required color, the light shielding portion 15 can shield the light emitted from the μ LED array substrate 12 to propagate in certain specific directions.

The light shielding portion 15, the upper substrate 13 and the μLED array substrate 12 cooperate to seal the accommodating hole 151 into a sealed space.

The μ LED array substrate 12 includes a bottom plate 121 and the μ LED 123 disposed on the surface of the bottom plate 121 facing the upper substrate 13, and each μ LED 123 is located in a receiving hole 151. In this embodiment, the μ LED 123 may be a miniature light emitting diode containing gallium nitride (GaN), and the gallium nitride miniature light emitting diode emits light in the blue wavelength band.

The material of the bottom plate 121 can be inorganic, such as silicon dioxide (SiO2); the material of the bottom plate 121 can also be organic, such as polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA), and polyimide (POLYIMIDE, PI) , Polyethylene naphthalate (POLYETHYLENE NAPHTHALATE TWO FORMIC ACID GLYCOL ESTER, PEN), polycarbonate (POLYCARBONATE, PC) or polyethylene terephthalate (POLYETHYLENE GLYCOL TEREPHTHALATE, PET). The bottom plate 121 may be a flexible material or a non-flexible material. In this embodiment, the bottom plate 121 is a non-flexible material, and the bottom plate 121 is a PMMA, which has good rigidity, so that the μ LED array substrate 12 is not easily deformed to ensure a receiving hole The structure of 151 is relatively stable and remains sealed. In other embodiments, the bottom plate 121 may also be a flexible material (such as PC, PMMA, PI, or PEN). Correspondingly, the upper substrate 13 should be a flexible material, and the shading portion 15 should also have good deformability, so that The accommodating hole 151 does not lose its sealing property when the display panel 10 is deformed, such as bending or folding.

The light emitted by the μ LED array substrate 12 needs to penetrate the upper substrate 13 to be observed by the user. Therefore, the upper substrate 13 is a transparent material, which has good light transmittance; the upper substrate 13 is the color conversion layer 16 and shading For the carrier of the portion 15, the upper substrate 13 may be a flexible material or a non-flexible material. In this embodiment, both the upper substrate 13 and the bottom plate 121 are inflexible materials, and both have good rigidity, making the display panel 10 The deformation tendency is not easy to occur when the deformation tendency of twisting, bending and other deformations is caused by external force, or the degree of deformation is small, so as to ensure that the structure of the accommodating hole 151 is relatively stable and keeps it sealed; correspondingly, the material of the upper substrate 13 may be inorganic, Such as silicon dioxide (SiO2), the material of the upper substrate 13 can also be organic, such as polycarbonate (POLYCARBONATE, PC), polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA) or polyethylene terephthalate Ester (POLYETHYLENE GLYCOL TEREPHTHALATE, PET). In other embodiments, the upper substrate 13 and the bottom plate 121 are both flexible materials, so that the accommodating hole 151 will not lose its sealing property when the display panel 10 is bent, folded, etc.; the upper substrate 13 may be an optical film The material of the upper substrate 13 may be an organic substance, such as polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA), polycarbonate (POLYCARBONATE, PC), polyimide (POLYIMIDE, PI), or polyethylene naphthalate Alcohol ester (POLYETHYLENE NAPHTHALATE TWO FORMIC ACID GLYCOL ESTER, PEN).

It is understandable that the materials of the upper substrate 13 and the bottom plate 121 can be selected according to actual needs. However, when selecting the materials of the upper substrate 13 and the bottom plate 121, the influence of the material combination on the tightness of the accommodating hole 151 should be fully considered. The sealing property of the hole 151 is not damaged, so as to prevent water and oxygen from entering the receiving hole 151 and damaging the quantum dot material.

The upper substrate 13 includes a first surface 131 facing the μ LED array substrate 12, and the light shielding portion 15 is provided on the first surface 131. The light-shielding portion 15 has a certain thickness at least so that the color conversion layer 16 provided in the accommodating hole 151 is not in contact with the μ LED 123. The shading portion 15 may be a patterned black matrix layer or a black photoresist layer. The shading portion 15 may be manufactured by printing, chemical etching, laser etching and other processes.

Press the opposing upper substrate 13 and the μ LED array substrate 12 together, so that the side of the light-shielding portion 15 away from the upper substrate 13 is bonded to the μ LED array substrate 12 by the adhesive 11, and each accommodating hole 151 defines a sub-picture Element 19, there is at least one μ LED 123 in each sub-pixel, and the light emitted by the μ LED 123 Part penetrates the upper substrate 13 and the other part is blocked, absorbed or reflected by the light shielding portion 15 or the μ LED array substrate 12. In this embodiment, only one μ LED 123 is provided in each accommodating hole 151. In other embodiments, there may be two or more μ LEDs 123 in each accommodating hole 151, according to the display panel 10 The brightness requirement adjusts the number of μLEDs 123 in the accommodating hole 151.

The sub-pixel 19 includes three different red sub-pixels 191, green sub-pixels 192 and blue sub-pixels 193, and the corresponding receiving holes 151 corresponding to the red sub-pixels 191 and the green sub-pixels 192 are also provided with colors A conversion unit, the color conversion unit is disposed on a portion of the first surface 131 located in the accommodating hole 151. The color conversion layer 16 includes a red color conversion unit 161 and a green color conversion unit 162. The red color conversion unit 161 is set corresponding to the red sub-pixel 191, and the green color conversion unit 162 is set corresponding to the green sub-pixel 192. The color conversion layer 16 can be formed by coating and spraying the quantum dot material on the first surface 131; the quantum dot material in the red color conversion unit 161 is mainly a quantum dot material with a diameter of 7 nm, and the light emitted by the μ LED 123 passes through the upper substrate At 13 o'clock, the quantum dot material in the red color conversion unit 161 is converted into light in the red band; the quantum dot material in the green color conversion unit 162 is mainly a quantum dot material with a diameter of 3 nm, and the light emitted by the μ LED 123 passes through the upper substrate At 13 o'clock, the quantum dot material in the green color conversion unit 162 is converted into light in the green wavelength band; the color conversion layer 16 is not provided in the receiving hole 151 corresponding to the blue sub-pixel 193, and the blue light emitted by the blue LED μ123 emits light Directly penetrate the upper substrate 13. The display panel 10 includes complex pixels 17, one pixel 17 is composed of complex sub-pixels 19, and each sub-pixel 19 includes at least one red sub-pixel 191, one green sub-pixel 192, and one blue sub-pixel 193. GaN miniature light-emitting diodes emit blue light. Compared with the conventional white light μ LED 123, white light is formed by mixing light of different frequencies. The utilization rate of quantum dot materials for white light is lower than that of quantum dot materials. The utilization rate of monochrome blue light.

The display panel 10 further includes a sealant 14 coated on the outer side wall of the display panel 10, which covers the connection gap between the light shielding portion 15 and the μ LED array substrate 12 and the upper substrate 13 to improve the sealability of the display panel 10.

The display panel 10 further includes an active matrix substrate 18 including a plurality of thin film transistors 181 (THIN FILM TRANSISTOR, TFT) arranged in an array, the plurality of TFTs 181 is used to control the μ LED 123 On and off, each μ LED 123 is correspondingly provided with at least one TFT 181.

The μ LED 123 and the color conversion layer 16 are not in contact, the μ LED 123 emits heat while emitting light, and the quantum dot material in the color conversion layer 16 will be deteriorated due to high temperature, and directly cause the display effect of the display panel 10 decline. The thermal conductivity of the filler in the accommodating hole 151 is smaller than the thermal conductivity of the bottom plate 121. In this embodiment, the filling in the accommodating hole 151 is air, and the average thermal conductivity of the air is 0.026 W/mK. The material of the bottom plate 121 in this embodiment is polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA). The thermal conductivity of PMMA is 0.2W/mK, and the thermal conductivity of PMMA is much greater than that of air. The heat emitted by μ LED 123 during operation will be preferentially transferred through the material with high thermal conductivity among the materials in contact with it. μ LED 123 is in contact with the air filled in the bottom plate 121 and the accommodating hole 151 at the same time, because the bottom plate 121 has a much larger thermal conductivity Due to the thermal conductivity of air, the color conversion layer 16 and the μ LED 123 are isolated from the air without direct contact. Therefore, the heat generated by the μ LED 123 is preferentially exported through the bottom plate 121, and only a small amount of heat is transferred to the color through the air The conversion layer 16 prevents the quantum dot material in the color conversion layer 16 from being damaged due to high temperature. In other embodiments, the accommodating hole 151 may also be filled with an optical adhesive whose thermal conductivity is smaller than that of the material of the bottom plate 121.

A manufacturing method of a display panel according to the first embodiment of the present invention is provided.

Step S11: providing a light-transmitting upper substrate 13, forming a light-shielding portion 15 on the surface of the upper substrate 13, the light-shielding portion 15 is formed of an opaque material, the light-shielding portion 15 is formed with a plurality of accommodating through the light-shielding portion 15孔151.

Specifically, the substrate is provided with a first surface 131 on which a dark opaque photoresist material is formed. The light-shielding portion 15 is etched by laser etching or chemical etching The etching resistant material is obtained. In this embodiment, the plurality of light-shielding portions 15 are arranged in a matrix The accommodating holes 151 are almost uniform in size, and the accommodating holes 151 penetrate the light-shielding portion 15. The photoresist anti-etching material in the area corresponding to the accommodating holes 151 is removed to expose the first surface 131 of the upper substrate 13.

Step S12: A color conversion layer 16 is formed on the surface of the upper substrate 13 where the light shielding portion 15 is formed. The color conversion layer 16 includes a plurality of color conversion units, and each color conversion unit is located in a receiving hole 151.

Specifically, the color conversion layer 16 can be prepared in a part of the area where the first surface 131 is not covered by the light-shielding portion 15 by coating, spraying, or the like. Each receiving hole 151 corresponds to a sub-pixel 19, and the sub-pixel 19 includes at least three different sub-pixels. In this embodiment, the sub-pixel 19 includes a red sub-pixel 191, a green sub-pixel 192, and The blue sub-pixel 193, the color conversion unit of the color conversion layer 16 includes a red color conversion unit 161 and a green color conversion unit 162, wherein the red color conversion unit 161 is set corresponding to the red sub-pixel 191, and the green color conversion unit 162 corresponds to green The sub-pixel 192 is set, and the color conversion layer 16 is not provided in the area corresponding to the blue sub-pixel.

Step S13: providing a μ LED array substrate 12 provided with a plurality of μ LEDs 123 arranged in an array and spaced apart from each other; the upper substrate 13 and the μ LED array substrate 12 are butted The light shielding portion 15 is located between the μ LED array substrate 12 and the upper substrate 13 and both sides thereof are in contact with the μ LED array substrate 12 and the upper substrate 13 respectively, so that each μ LED 123 is accommodated in a receiving hole 151.

Specifically, a thin film transistor array substrate 18 including a plurality of TFTs 181 stacked on the μ LED array substrate 122 is also provided. The TFTs 181 are arranged in a matrix, and each μ LED 123 is correspondingly provided with at least one TFT 181. In this embodiment, the display panel 10 may also include a sealant 14, which is applied to the outer side wall of the display panel 10 and covers the connection gap between the light shielding portion 15 and the μ LED array substrate 12 and the upper substrate 13.

Second embodiment

Please refer to FIG. 3, which is a schematic structural diagram of a display panel according to a second embodiment of the present invention. The plan schematic diagram of the display panel in the second embodiment is the same as the plan schematic diagram of the display panel in the first embodiment. .

The display panel 20 of this embodiment includes a μLED array substrate 22, an upper substrate 23, a light-shielding portion 25, and a color conversion layer 26.

As shown in FIG. 3, the μ LED array substrate 22 and the upper substrate 23 are oppositely arranged, the μ LED array substrate 22 is provided with a plurality of μ LEDs 223 arranged in an array and spaced apart from each other, and the light shielding portion 25 is located on the upper substrate 23 and the μ LED Between the array substrate 22 and both sides thereof are in contact with the μ LED array substrate 22 and the upper substrate 23 respectively, the light shielding portion 25 has a certain thickness, and the light shielding portion 25 is formed corresponding to each μ LED 223 at a position penetrating the light shielding portion 25 The accommodating holes 251 on both sides allow each μ LED 223 to be accommodated in an accommodating hole 251, and the light-shielding portion 25 is opaque. The color conversion layer 26 is formed on the surface of the upper substrate 23 facing the μ LED array substrate 22. The color conversion layer 26 includes a plurality of color conversion units, and each color conversion unit is located in an accommodating hole 251 and is located in the same accommodating hole μ The LED 223 and the color conversion unit are arranged at intervals. The μ LED array substrate 22 is used to emit light as a display light source of the display panel 20, and the color conversion layer 26 contains quantum dot materials, which can convert the color of the light emitted by the μ LED array substrate 22 to obtain the desired color for display The light blocking portion 25 can block the light emitted by the μ LED array substrate 22 to propagate in certain specific directions.

The light shielding portion 25, the upper substrate 23, and the μLED array substrate 22 cooperate to seal the accommodating hole 251 into a sealed space.

The μ LED array substrate 22 includes a bottom plate 221 and the μ LED 223 disposed on the surface of the bottom plate 221 facing the upper substrate 23, and each μ LED 223 is located in a receiving hole 251. In this embodiment, the μ LED 223 may be a micro light emitting diode containing aluminum gallium nitride (AlGaN), and the gallium aluminum nitride micro light emitting diode emits ultraviolet light.

The material of the bottom plate 221 may be inorganic materials, such as silicon dioxide (SiO2); the material of the bottom plate 221 may also be organic materials, such as polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA), polyimide (POLYIMIDE, PI) , Polyethylene naphthalate (POLYETHYLENE NAPHTHALATE TWO FORMIC ACID GLYCOL ESTER, PEN), polycarbonate (POLYCARBONATE, PC) or polyethylene terephthalate (POLYETHYLENE GLYCOL TEREPHTHALATE, PET). The bottom plate 221 may be a flexible material or a non-flexible material. In this embodiment, the bottom plate 221 is a non-flexible material, and the bottom plate 221 is a PMMA, which has good rigidity, so that the μ LED array substrate 22 is not easily deformed to ensure a receiving hole The structure of 251 is relatively stable and remains sealed. In other embodiments, the bottom plate 221 may also be a flexible material (such as PC, PMMA, PI, or PEN). Correspondingly, the upper substrate 23 should be a flexible material, and the shading portion 25 should also have good deformability, so that The accommodating hole 251 does not lose its sealing property when the display panel 20 is deformed, such as bending or folding.

The light emitted by the μ LED array substrate 22 needs to penetrate the upper substrate 23 to be observed by the user. Therefore, the upper substrate 23 is a transparent material, which has good light transmittance; the upper substrate 23 is the color conversion layer 26 and shading For the carrier of the portion 25, the upper substrate 23 may be a flexible material or a non-flexible material. In this embodiment, both the upper substrate 23 and the bottom plate 221 are non-flexible materials, and both have good rigidity, so that the display panel 20 is less likely to deform or deform to a lesser degree when deformed by external forces such as twisting and bending. To ensure that the structure of the accommodating hole 251 is relatively stable and keep it sealed; correspondingly, the material of the upper substrate 23 may be inorganic, such as silicon dioxide (SiO2), and the material of the upper substrate 23 may also be organic, such as polycarbonate (POLYCARBONATE, PC), polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA) or polyethylene terephthalate (POLYETHYLENE GLYCOL TEREPHTHALATE, PET). In other embodiments, the upper substrate 23 and the bottom plate 221 are both flexible materials, so that the accommodating hole 251 will not lose its sealing property when the display panel 20 is bent, folded, etc.; the upper substrate 23 may be an optical film , The material of the upper substrate 23 may be organic, such as poly Polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA), polycarbonate (POLYCARBONATE, PC), polyimide (POLYIMIDE, PI) or polyethylene naphthalate (POLYETHYLENE NAPHTHALATE TWO FORMIC ACID GLYCOL ESTER, PEN ).

Understandably, the materials of the upper substrate 23 and the bottom plate 221 can be selected according to actual needs. However, when selecting the materials of the upper substrate 23 and the bottom plate 221, the influence of the material combination on the sealing of the receiving hole 251 should be fully considered, and the accommodation should be ensured as much as possible The sealing property of the hole 251 is not damaged, so as to prevent water and oxygen from entering the receiving hole 251 and causing damage to the quantum dot material.

The upper substrate 23 includes a first surface 231 facing the μ LED array substrate 22, and the light-shielding portion 25 is provided on the first surface 231. The light-shielding portion 25 has a certain thickness at least so that the color conversion layer 26 provided in the accommodating hole 251 does not contact the μLED 223. The light-shielding portion 25 may be a patterned black matrix layer or a black photoresist layer. The light-shielding portion 25 may be manufactured by printing, chemical etching, laser etching and other processes.

Press the opposing upper substrate 23 and the μ LED array substrate 22 together, so that the side of the light-shielding portion 25 away from the upper substrate 23 and the μ LED array substrate 22 are bonded by the adhesive 21, and each accommodating hole 251 defines a sub-picture In the pixel 29, there is at least one μLED 223 in each sub-pixel, and part of the light emitted by the μLED 223 penetrates the upper substrate 23, and the other part is blocked, absorbed, or reflected by the light shield 25 or the μLED array substrate 22. In this embodiment, only one μ LED 223 is provided in each accommodating hole 251. In other embodiments, two or more μ LEDs 223 may be present in each accommodating hole 251, according to the display panel 20. The brightness requirement adjusts the number of μLEDs 223 in the accommodating hole 251.

Sub-pixel 29 includes three different colors of red sub-pixel 291, green sub-pixel 292 and blue sub-pixel 293, red sub-pixel 291, green sub-pixel 292 and blue sub-pixel 293 A color conversion unit is also disposed in the hole 251, and the color conversion unit is disposed on a portion of the first surface 231 located in the receiving hole 251. The color conversion layer 26 includes a red color conversion unit 261 and a green color conversion sheet Element 262 and the blue color conversion unit 263, the red color conversion unit 261 corresponds to the setting of the red sub-pixel 291, the green color conversion unit 262 corresponds to the setting of the green sub-pixel 292, and the blue color conversion unit 263 corresponds to the setting of the blue sub-pixel 293 . The color conversion layer 26 can be formed by coating and spraying the quantum dot material on the first surface 231; the quantum dot material in the red color conversion unit 261 is mainly a quantum dot material with a diameter of 7 nm, and the light emitted by the μ LED 223 passes through the upper substrate At 23 o'clock, the quantum dot material in the red color conversion unit 261 is converted into light in the red band; the quantum dot material in the green color conversion unit 262 is mainly a quantum dot material with a diameter of 3 nm, and the light emitted by the μ LED 223 passes through the upper substrate At 23 o'clock, the quantum dot material in the green color conversion unit 262 is converted into light in the green band; the quantum dot material in the blue color conversion unit 263 is mainly a quantum dot material with a diameter of 2 nm, and the light emitted by the μ LED 223 passes through At the time of the substrate 23, the quantum dot material in the blue color conversion unit 263 is converted into light in the blue wavelength band. The display panel 20 includes complex pixels 27, one pixel 27 is composed of complex sub-pixels 29, and each sub-pixel 29 includes at least one red sub-pixel 291, one green sub-pixel 292, and one blue sub-pixel 293. The gallium aluminum nitride miniature light emitting diode emits ultraviolet light. Compared with the conventional white light μ LED, white light is formed by mixing light of different frequencies. The utilization rate of quantum dot materials for white light is lower than that of quantum dot materials for monochromatic. Utilization of ultraviolet light.

The display panel 20 further includes a sealant 24 coated on the outer side wall of the display panel 20, which covers the connection gap between the light shielding portion 25 and the μ LED array substrate 22 and the upper substrate 23 to improve the sealability of the display panel 20.

The display panel 20 further includes an active matrix substrate 28, and the active matrix substrate includes a plurality of thin film transistors 281 (THIN FILM TRANSISTOR, TFT) arranged in an array, the plurality of TFTs 281 are used to control the μ LED 223 Turning on and off, each μ LED 223 is correspondingly provided with at least one TFT 281.

There is no contact between the μ LED 223 and the color conversion layer 26, and the μ LED 223 will emit heat while emitting light, and the quantum dot material in the color conversion layer 26 will be deteriorated due to high temperature, and directly cause the display effect of the display panel 20 decline. The thermal conductivity of the filler in the receiving hole 251 is higher than that of the bottom plate 221 Has a low thermal conductivity. In this embodiment, the filling in the accommodating hole 251 is air, and the average thermal conductivity of the air is 0.026 W/mK. The material of the bottom plate 221 in this embodiment is polymethyl methacrylate (POLYMERIC METHYL METHACRYLATE, PMMA). The thermal conductivity of PMMA is 0.2W/mK, and the thermal conductivity of PMMA is much greater than that of air. The heat emitted by the μ LED 223 during operation will be preferentially transferred through the material with high thermal conductivity among the materials in contact with it. The μ LED 223 is in contact with the air filled in the bottom plate 221 and the accommodating hole 251 at the same time. Due to the thermal conductivity of air, the color conversion layer 26 and the μ LED 223 are isolated from the air without direct contact. Therefore, the heat generated by the μ LED 223 is preferentially exported through the bottom plate 221, and only a small amount of heat is transferred to the color through the air The conversion layer 26 prevents the quantum dot material in the color conversion layer 26 from being damaged due to high temperature. In other embodiments, the accommodating hole 251 may also be filled with an optical adhesive whose thermal conductivity is smaller than that of the material of the bottom plate 221.

A manufacturing method of a display panel according to a second embodiment of the invention is provided.

Step S21: providing a light-transmitting upper substrate 23, forming a light-shielding portion 25 on the surface of the upper substrate 23, the light-shielding portion 25 is formed of an opaque material, the light-shielding portion 25 is formed with a plurality of accommodating through the light-shielding portion 25孔251.

Specifically, the substrate is provided with a first surface 231 on which a dark photoresist anti-etching material is formed, and the light-shielding portion 25 is etched by using a laser etching or chemical etching process The material gets. In this embodiment, the light-shielding portion 25 has a mesh pattern. The light-shielding portion 25 has a plurality of accommodating holes 251 arranged in a matrix and having almost the same size. The photoresist anti-etching material in the area corresponding to the accommodating holes 251 is removed. The first surface 231 of the upper substrate 23 is exposed.

Step S22: A color conversion layer 26 is formed on the surface of the upper substrate 23 where the light shielding portion 25 is formed. The color conversion layer 26 includes a plurality of color conversion units, and each color conversion unit is located in a receiving hole 251.

Specifically, the color conversion layer 26 may be prepared in a part of the area where the first surface 231 is not covered by the light-shielding portion 25 by coating, spraying, or the like. Each receiving hole 251 corresponds to a sub-pixel 29. The sub-pixel 29 includes at least three different sub-pixels. In this embodiment, the sub-pixel 29 includes a red sub-pixel 291, a green sub-pixel 292, and a blue sub-pixel 293; the color conversion layer 26 The color conversion unit includes a red color conversion unit 261 and a green color conversion unit 262. The red color conversion unit 261 corresponds to the setting of the red sub-pixel 291, the green color conversion unit 262 corresponds to the setting of the green sub-pixel 292, and the blue color conversion unit 263 corresponds to The blue sub-pixel 293 is set.

Step S23: providing a μ LED array substrate 22 provided with a plurality of μ LEDs 223 arranged in an array and spaced apart from each other; docking the upper substrate 23 with the μ LED array substrate 22 so that The light-shielding portion 25 is located between the μ LED array substrate 22 and the upper substrate 23 and its two sides are in contact with the μ LED array substrate 22 and the upper substrate 23 respectively, so that each μ LED 223 is accommodated in a receiving hole 251.

Specifically, a thin film transistor array substrate 28 including a plurality of TFTs 281 stacked on the μ LED array substrate 222 is also provided. The TFTs 281 are arranged in a matrix, and each μ LED 223 is correspondingly provided with at least one TFT 281. In this embodiment, the display panel 20 may also include a sealant 24. The sealant 24 is applied to the outer side wall of the display panel 20 and covers the connection gap between the light shielding portion 25 and the μ LED array substrate 22 and the upper substrate 23.

Please refer to FIG. 4, which is a schematic diagram of an embodiment of an electronic device 1 using the display panel of the present invention. In describing the electronic device 1 of the present embodiment, the same reference numerals are used for the same elements as in the previous embodiment. In this embodiment, the electronic device 1 is a mobile phone, including a body 2 and a display panel disposed in the body 2. The display panel is a display panel provided by the present invention, such as the display panel 10 described in the first embodiment above Or the display panel 20 described in the second embodiment.

In FIG. 4, only the electronic device 1 is taken as a mobile phone as an example. In other embodiments, the electronic device 1 may also be a personal computer, a smart home appliance, an industrial controller, or the like. When the electronic device 1 is a mobile phone, the display panel 20 may correspond to the front of the mobile phone.

In the foregoing, specific embodiments of the present invention have been described with reference to the accompanying drawings. Of course, those of ordinary skill in the art can understand that various changes and replacements can be made to the specific embodiments of the present invention without departing from the spirit and scope of the present invention. These changes and replacements all fall within the scope defined by the patent application scope of the present invention.

10: Display panel

11: Viscose

12: μ LED array substrate

123: μ LED

121: bottom plate

13: Upper substrate

131: first surface

14: Sealant

15: Shade

16: Color conversion layer

161: Red color conversion unit

162: Green color conversion unit

17: Pixel

18: Active matrix substrate

181: TFT

Claims (18)

A display panel is improved in that it includes a μ LED array substrate, an upper substrate, a light-shielding portion, and a color conversion layer, the μ LED array substrate is disposed opposite to the upper substrate, and the μ LED array substrate is provided with a plurality of arrays Μ LEDs arranged and spaced apart from each other, the light shielding portion is located between the μ LED array substrate and the upper substrate and both sides thereof are in contact with the μ LED array substrate and the upper substrate, respectively, the light shielding An accommodating hole penetrating the two sides of the light shielding portion is formed at a position corresponding to each of the μ LEDs, so that each of the μ LEDs is accommodated in one of the accommodating holes, and the light shielding portion Light transmission, the color conversion layer is disposed on the surface of the upper substrate facing the μ LED array substrate, the color conversion layer includes a plurality of color conversion units, each of the color conversion units is located in a receiving hole And the μ LEDs located in the same receiving hole are spaced apart from the color conversion unit, and the color conversion layer contains quantum dot material. The display panel according to claim 1, wherein the μ LED array substrate further includes a bottom plate, and the plurality of μ LEDs are all disposed on a surface of the bottom plate facing the upper substrate. The display panel according to claim 2, wherein the light-shielding portion is formed on a surface of the upper substrate facing the μ LED array substrate, and a side of the light-shielding portion away from the upper substrate and the μ LED array The substrate is bonded by adhesive, and the light-shielding portion, the upper substrate, and the μ LED array substrate cooperate to seal each of the accommodating holes to form a sealed space. The sealed space except the μ LED and the color conversion unit The space is air or filled with optical glue, and the thermal conductivity of the bottom plate is greater than that of the optical glue. The display panel according to claim 2, wherein the material of the bottom plate is polymethyl methacrylate, the thermal conductivity of the polymethyl methacrylate is 0.2 W/mK, and the thermal conductivity of the optical adhesive is less than 0.2W/mK. The display panel according to claim 1, wherein the plural LEDs emit the same light. The display panel according to claim 5, wherein the plurality of μ LEDs emit ultraviolet light or blue light. The display panel according to claim 1, wherein the display panel defines a plurality of pixels, each of the pixels is composed of a plurality of sub-pixels, and each of the sub-pixels includes one of the μ LEDs. The display panel according to claim 7, wherein the sub-pixels include three different red sub-pixels, green sub-pixels and blue sub-pixels; the color conversion unit includes a red color conversion unit and green A color conversion unit, the red color conversion unit is provided with a red quantum dot material, and the green color conversion unit is provided with a green quantum dot material; each of the red sub-pixels includes a The red color conversion unit in the accommodating hole, each of the green sub-pixels includes a green color conversion unit in the same accommodating hole as the μ LED, the blue sub-picture The color conversion unit is not set in the element. The display panel according to claim 7, wherein the sub-pixels include three different red sub-pixels, green sub-pixels, and blue sub-pixels; the color conversion unit includes a red color conversion unit, green A color conversion unit and a blue color conversion unit, the red color conversion unit is provided with a red quantum dot material, the green color conversion unit is provided with a green quantum dot material, and the blue color conversion unit is provided with a blue color Quantum dot material; each of the red sub-pixels includes the red color conversion unit located in the same accommodation hole as the μ LED, and each of the green sub-pixels includes one and the μ LED For the green color conversion unit located in the same accommodation hole, each blue sub-pixel includes one blue color conversion unit located in the same accommodation hole as the μ LED. The display panel according to claim 1, wherein the light shielding portion is a black matrix or a dark photoresist. The display panel according to claim 1, wherein the display panel further includes a sealant, the sealant is coated on the outer side wall of the display panel, and the sealant covers the light shielding portion and the μ LED array A connection gap between the substrate and the upper substrate. An electronic device includes a body and a display panel disposed in the body, wherein the display panel is the display panel described in any one of the request items 1-11. A method for preparing a display panel, comprising: providing a light-transmitting upper substrate, forming a light-shielding portion on the surface of the upper substrate, the light-shielding portion being formed of an opaque material, and forming a plurality of light-shielding portions penetrating the light-shielding portion A receiving hole; a color conversion layer is formed on the surface of the upper substrate where the light-shielding portion is formed, the color conversion layer includes a plurality of color conversion units, and each of the color conversion units is located in one of the receiving holes; A μ LED array substrate is provided, the μ LED array substrate is provided with a plurality of μ LEDs arranged in an array and spaced apart from each other; the upper substrate is docked with the μ LED array substrate so that the light shielding portion is located at the Between the μ LED array substrate and the upper substrate and both sides thereof are in contact with the μ LED array substrate and the upper substrate, respectively, so that each of the μ LEDs is accommodated in one of the accommodating holes. The method for manufacturing a display panel according to claim 13, wherein the light-shielding portion is bonded to the μLED array substrate on a side away from the upper substrate. A method for manufacturing a display panel according to claim 13, wherein the display panel defines a plurality of pixels, each pixel is composed of a plurality of sub-pixels, and each sub-pixel includes one of the μ LED. The method for preparing a display panel according to claim 15, wherein the sub-pixels include three different red sub-pixels, green sub-pixels and blue sub-pixels; the color conversion unit includes red colors A conversion unit and a green color conversion unit, the red color conversion unit is provided with a red quantum dot material, and the green color conversion unit is provided with a green quantum dot material; each The red sub-pixel includes the red color conversion unit located in the same accommodation hole as the μ LED, and each of the green sub-pixels includes one of the same accommodation space as the μ LED In the green color conversion unit in the hole, no color conversion unit is provided in the blue sub-pixel. The method for preparing a display panel according to claim 15, wherein the sub-pixels include three different red sub-pixels, green sub-pixels and blue sub-pixels; the color conversion unit includes red colors A conversion unit, a green color conversion unit and a blue color conversion unit, the red color conversion unit is provided with a red quantum dot material, the green color conversion unit is provided with a green quantum dot material, and the blue color conversion unit A blue quantum dot material is provided; each of the red sub-pixels includes the red color conversion unit located in the same accommodation hole as the μ LED, and each of the green sub-pixels includes a The green color conversion unit in which the μ LED is located in the same accommodation hole, and each of the blue sub-pixels includes one blue in the same accommodation hole as the μ LED Color conversion unit. The method for manufacturing a display panel according to claim 13, wherein the display panel further comprises a sealant, the sealant is applied to the outer side wall of the display panel, and the sealant covers the light shielding portion and the The connection gap between the μ LED array substrate and the upper substrate.

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