CN108573992A - The electronic device of display panel, the preparation method and application display panel - Google Patents
The electronic device of display panel, the preparation method and application display panel Download PDFInfo
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- CN108573992A CN108573992A CN201810433451.2A CN201810433451A CN108573992A CN 108573992 A CN108573992 A CN 108573992A CN 201810433451 A CN201810433451 A CN 201810433451A CN 108573992 A CN108573992 A CN 108573992A
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- display panel
- color conversion
- converting unit
- upper substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
A kind of display panel,Including μ LED array substrates,Upper substrate,Light shielding part and color conversion layer,The μ LED array substrate is oppositely arranged with upper substrate,Multiple μ LED for being arranged in array and being intervally installed are provided on the μ LED array substrate,The light shielding part is between μ LED array substrate and upper substrate and its both sides is contacted with μ LED array substrate and upper substrate respectively,Light shielding part correspond to every μ LED position be formed through light shielding part the both sides accommodating hole,Every μ LED are made to be placed in an accommodating hole,The light shielding part is opaque,The color conversion layer is set to the upper substrate towards the surface of μ LED array substrates,Color conversion layer includes multiple color conversion cells,Each color conversion cell is located in an accommodating hole,And the μ LED in same accommodating hole are arranged with color conversion cell interval,The color conversion layer contains quanta point material.The present invention also provides the electronic devices of the preparation method and application of the display panel display panel.
Description
Technical field
The present invention relates to a kind of display panel, the electronics dresses of the preparation method and application of the display panel display panel
It sets.
Background technology
Micro- light emitting diode (Micro-LED or μ LED) display is a kind of micro- with high density integrated on one substrate
The μ LED array of small size realizes display that image is shown as display pixel, with large-sized outdoor LED display screen one
Sample, each pixel can addressing, be operated alone and light, the scaled down version of outdoor LED display screen can be regarded as, by pixel distance
It is reduced to micron order from grade, μ light-emitting diode displays and Organic Light Emitting Diode (Organic Light-Emitting Diode,
OLED) display equally belongs to self-emitting display, but μ light-emitting diode displays also have stability of material more compared to OLED display
Well, the advantages that longer life expectancy, askiatic branding.μ LED as described herein generally refer to the LED that size is less than 200 microns.
For μ light-emitting diode displays at present there are two types of primary structure, one kind is to pass through flood tide in active matrix rear panel to transfer (mass
Transfer) red (R), green (G) and blue (B) μ LED are directly obtained by red (R), green (G) and blue (B) μ LED
Obtain full-color effect；Another structure is monochromatic (being usually blue) μ LED to be formed in active matrix rear panel, while color is arranged
Blue light is converted to full-color effect by conversion layer.The structure is caused since flood tide transfer technical difficulty is big for the first structure
Use be subject to certain restrictions.For the structure of monochromatic μ LED and color conversion layer cooperation, a kind of existing color conversion layer is
It is mixed with viscose glue using fluorescent powder, and the technical solution that fluorescent powder is mixed with glue, since fluorescent powder consistency is insufficient and position dissipates
Cloth is uneven, and optical uniformity and reliability are all undesirable.Fluorescent powder Commonly Used Size is 5~15um, can not be applied to high-resolution
Rate display is simply possible to use in backlight module or the display of low resolution.
Another color conversion layer is to carry out color conversion using quantum point.Quantum dot, it is also known as nanocrystalline, it is generally spherical
Or it is spherical, it is made of semi-conducting material (being usually made of the A of IIB~VI or IIIA~VA elements), 2~20nm of diameter
Nano-particle.The exciting light spectrum width of quantum dot and continuously distributed, and the emission spectrum of quantum dot is narrow and symmetrical, Color tunable,
Photochemical stability is high.The emission spectrum of quantum dot can be controlled by changing the size of quantum dot, and spectrum covers
Cover entire visible light region.Using quantum dot as being by the powder spray of quanta point material when color conversion layer in μ LED appearances
Face, quanta point material are in direct contact with μ LED, and the heat that μ LED are sent out is transferred directly to quanta point material, causes quanta point material
Go bad because of high temperature light, and then the display quality of display panel is made to decline.Quanta point material can be not only destroyed because of high temperature, also
Can because water, oxygen corrosion due to be destroyed.
Invention content
In view of this, the present invention provides a kind of display panel, display panel has higher service life.
In addition, also providing a kind of preparation method of the display panel and a kind of electronic device of the application display panel.
A kind of display panel, including μ LED array substrate, upper substrate, light shielding part and color conversion layer, described μ LED gusts
Row substrate is oppositely arranged with the upper substrate, be provided on the μ LED array substrate it is multiple be arranged in array and be spaced set
The μ LED set, the light shielding part between μ LED array substrate and upper substrate and its both sides respectively with μ LED array substrate and on
Substrate contact, light shielding part correspond to every μ LED position be formed through light shielding part the both sides accommodating hole, make every μ
LED is placed in an accommodating hole, and the light shielding part is opaque, and the color conversion layer is set to the upper substrate towards LED gusts of μ
The surface of row substrate, color conversion layer include multiple color conversion cells, and each color conversion cell is located in an accommodating hole, and
μ LED in same accommodating hole are arranged with color conversion cell interval, and the color conversion layer contains quanta point material.
A kind of preparation method of display panel, including：
The upper substrate for providing a light transmission forms light shielding part in upper substrate surface, which is formed by light-proof material, should
Light shielding part is formed with multiple accommodating holes through the light shielding part；
The surface that the light shielding part is formed in the upper substrate forms color conversion layer, and the color conversion layer includes multiple colors
Color converting unit, each color conversion cell are located in an accommodating hole；
A μ LED array substrates are provided, which, which is provided with, multiple are arranged in array and are intervally installed
μLED；
The upper substrate is docked with the μ LED array substrate, the light shielding part is made to be located at μ LED array substrate and upper base
Between plate and its both sides are contacted with μ LED array substrate and upper substrate respectively, and every μ LED is made to be placed in an accommodating hole.
A kind of electronic device, the electronic device include ontology and are set to the intrinsic display panel.
In the display panel of the present invention, quanta point material is placed in confined space, and after encapsulation is completed, water, oxygen will be difficult to
Into in confined space, quanta point material is effectively avoided to be corroded by water, oxygen.And quanta point material is not directly contacted with LED,
The heat that LED is sent out is not directly transferred to quanta point material and causes quanta point material rotten.
Description of the drawings
Fig. 1 is the floor map of the display panel of first embodiment of the invention.
Fig. 2 is sectional views of the Fig. 1 along II-II.
Fig. 3 is the schematic cross-section of the display panel of second embodiment of the invention.
Fig. 4 is the electronic device schematic diagram using the display panel of present pre-ferred embodiments.
Main element symbol description
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
In order to keep techniques disclosed in this application content more detailed with it is complete, be referred to attached drawing and the present invention under
Various specific embodiments are stated, identical label represents same or similar element in attached drawing.However, the ordinary skill of this field
Personnel should be appreciated that embodiment provided hereinafter is not to be used for limiting the range that the present invention is covered.In addition, attached drawing is only
It is drawn to scale for being schematically illustrated, and not according to border size in fact.
With reference to the accompanying drawings, the specific implementation mode of the present invention is described in further detail.
First embodiment
Please refer to Fig.1 and Fig. 2, Fig. 1 show first embodiment of the invention display panel floor map, Fig. 2 institutes
The display panel of Fig. 1 is shown as along the schematic cross-sectional view of Section line II-II.
The display panel 10 of the present embodiment includes μ LED array substrate 12, upper substrate 13, light shielding part 15 and color conversion
Layer 16.
As shown in Fig. 2, μ LED array substrate 12 is oppositely arranged with upper substrate 13, it is provided on μ LED array substrate 12 multiple
The μ LED 123 for being arranged in array and being intervally installed, light shielding part 15 be located between upper substrate 13 and μ LED array substrate 12 and
Its both sides is contacted with μ LED array substrate 12 and upper substrate 13 respectively, and light shielding part 15 has certain thickness, and light shielding part 15 is right
Should every μ LED 123 position be formed through light shielding part 15 the both sides accommodating hole 151, so that every μ LED 123 is held
It is placed in an accommodating hole 151, the light shielding part 15 is opaque.Color conversion layer 16 is formed in upper substrate 13 towards μ LED array bases
The surface of plate 12, color conversion layer 16 include multiple color conversion cells, and each color conversion cell is located at an accommodating hole 151
It is interior, and the μ LED 123 in same accommodating hole are arranged with color conversion cell interval.μ LED array substrate 12 is for sending out
Light contains quanta point material using the display light source as display panel 10 in color conversion layer 16, can be to μ LED array bases
The color for the light that plate 12 is sent out is converted to obtain the color needed for display, and light shielding part 15 can cover μ LED array substrate 12
The light propagated to certain specific directions sent out.
It is closed for one that light shielding part 15, upper substrate 13 and the cooperation of μ LED array substrate 12 make accommodating hole 151 be sealed to form
Space.
μ LED array substrate 12 is including bottom plate 121 and is set to the μ of the bottom plate 121 towards the surface of upper substrate 13
LED 123, every μ LED123 are located in an accommodating hole 151.In the present embodiment, μ LED 123 can be containing gallium nitride
(GaN) micro-led, the micro-led light for sending out blue wave band of gallium nitride.
The material of bottom plate 121 can be inorganic matter, such as silica (SiO2)；The material of bottom plate 121 can also be organic
Object, e.g., polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polyimides
(Polyimide, PI), polyethylene naphthalate (Polyethylene naphthalate two formic acid
Glycol ester, PEN), makrolon (Polycarbonate, PC) or polyethylene terephthalate
(polyethylene glycol terephthalate, PET).Bottom plate 121 can be flexible material or non-flexible material,
In the present embodiment, bottom plate 121 is non-flexible material, and bottom plate 121 is PMMA, has preferable rigidity, makes μ LED array substrates
12 are unlikely to deform, to ensure that the structure of accommodating hole 151 is stablized relatively and holding seals.In other embodiments, bottom plate 121 also may be used
Think flexible material (such as PC, PMMA, PI or PEN), corresponding, upper substrate 13 should be flexible material, and light shielding part 15 should also have
Preferably can deformability so that accommodating hole 151 bend in display panel 10, around deformation such as foldings when be unlikely to lose its it is close
Feng Xing.
The light sent out by μ LED array substrate 12 observed after need to penetrating upper substrate 13 by user, therefore, upper substrate 13
For transparent material, with preferable translucency；Upper substrate 13 is the supporting body of color conversion layer 16 and light shielding part 15, upper substrate
13 can be flexible material or non-flexible material.In the present embodiment, upper substrate 13 and bottom plate 121 are non-flexible material,
With preferable rigidity so that display panel 10 is not susceptible to deformation when bearing external force and generating the deformation such as distortion, bending tendency
Or deformation degree is smaller, to ensure that the structure of accommodating hole 151 is relatively stable and its is made to keep sealing；It is corresponding, upper substrate 13
Material can be inorganic matter, such as silica (SiO2), the material of upper substrate 13 can also be organic matter, such as makrolon
(Polycarbonate, PC), polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA) or poly- pair
Ethylene terephthalate (polyethylene glycol terephthalate, PET).In other embodiments, upper substrate
13 and bottom plate 121 are flexible material so that accommodating hole 151 bend in display panel 10, around deformation such as foldings when be unlikely to
Lose its leakproofness；Upper substrate 13 can be optical diaphragm, and the material of upper substrate 13 can be organic matter, such as polymethylacrylic acid
Methyl esters (Polymeric Methyl Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyimides
(Polyimide, PI) or polyethylene naphthalate (Polyethylene naphthalate two formic acid
Glycol ester, PEN).
It should be understood that the material of upper substrate 13 and bottom plate 121 can select according to actual needs, but substrate in the choice
13 and bottom plate 121 material when should fully consider influence of the material adapted for 151 leakproofness of accommodating hole, should ensure to house as possible
The leakproofness in hole 151 is not destroyed, and is entered in accommodating hole 151 to avoid water, oxygen and is damaged to quanta point material.
Upper substrate 13 includes towards the first surface 131 of μ LED array substrate 12, and light shielding part 15 is set to first surface
131.Light shielding part 15 has certain thickness, and the thickness is at least so that the color conversion layer 16 and μ being set in accommodating hole 151
LED 123 is not contacted.The light shielding part 15 can be a patterned black matrix layer or the photic anti-etching oxidant layer of black, shading
Portion 15 can be made by techniques such as printing, chemical etching, laser-induced thermal etchings.
The upper substrate 13 and μ LED array substrate 12 being oppositely arranged is pressed, makes light shielding part 15 far from the side of upper substrate 13
It is bonded by viscose glue 11 with μ LED array substrate 12, one sub-pixel 190 of definition of each accommodating hole 151, in each sub-pixel extremely
There is a μ .LED 123 less, the partial penetration upper substrate 13 for the light which sends out, another part is by light shielding part 15
Or μ LED array substrate 12 is blocked, absorbs or is reflected.In the present embodiment, a μ LED is provided only in each accommodating hole 151
123, in other embodiments, two or more μ LED 123 may be present in each accommodating hole 151, it can be according to display panel 10
Brightness demand adjust accommodating hole 151 in μ LED 123 quantity.
Sub-pixel 190 includes different red sub-pixel 191, green sub-pixels 192 and the blue subpixels of three kinds of colors
193, color conversion cell is additionally provided in 192 corresponding accommodating hole 151 of red sub-pixel 191 and green sub-pixels, color turns
Unit is changed to be set on the part that first surface 131 is located in accommodating hole 151.Color conversion layer 16 includes that red color conversion is single
Member 161 and green tint converting unit 162, red color converting unit 161 correspond to red sub-pixel 191 and are arranged, green color
Color converting unit 162 corresponds to green sub-pixels 192 and is arranged.Quanta point material can be by being coated with, being sprayed at by color conversion layer 16
The formation of first surface 131；Quanta point material in red color converting unit 161 is mainly the quanta point material of diameter 7nm, μ
When the light that LED 123 is sent out passes through upper substrate 13, red wave is converted by the quanta point material in red color converting unit 161
The light of section；Quanta point material in green tint converting unit 162 is mainly the quanta point material of diameter 3nm, μ LED 123
When the light sent out passes through upper substrate 13, the light of green band is converted by the quanta point material in green tint converting unit 162
Line；Color conversion layer 16 is not set in 193 corresponding accommodating hole 151 of blue subpixels, the indigo plant that the μ LED 123 of blue light-emitting are sent out
Light is directed through upper substrate 13.Display panel 10 includes multiple pixels 17, and a pixel 17 is made of multiple sub-pixels 19, each
Sub-pixel 19 includes at least 191, green sub-pixels 192 of a red sub-pixel and a blue subpixels 193.Nitridation
The micro-led light for sending out blue of gallium, compared to traditional white light μ LED 123, white light is the light of a variety of different frequencies
It is formed after mixing, quanta point material is less than utilization rate of the quanta point material to ultra-blue-light for the utilization rate of white light.
The display panel 10 further includes fluid sealant 14, is coated on 10 lateral wall of display panel, covers light shielding part 15 and μ
Connection gap between LED array substrate 12 and upper substrate 13, to improve the leakproofness of display panel 10.
The display panel 10 further includes active-matrix substrate 18, includes multiple be arranged in array on the active-matrix substrate 18
Thin film transistor (TFT) 181 (thin film transistor, TFT), multiple TFT 181 is for controlling the μ LED's 123
It opens and closes, each μ LED 123 are at least correspondingly arranged there are one TFT 181.
It is not contacted between μ LED 123 and color conversion layer 16, μ LED 123 can also generate heat while luminous, and color
Quanta point material in color conversion layer 16 is influenced to go bad by high temperature, and is directly contributed under 10 display effect of display panel
Drop.The thermal coefficient of the thermal conductivity ratio bottom plate 121 of filler in accommodating hole 151 is small.In the present embodiment, accommodating hole 151
In filler be air, the mean coefficient of heat conductivity of air is 0.026W/mK, and 121 material of bottom plate of the present embodiment is poly- methyl
The thermal coefficient of methyl acrylate (Polymeric Methyl Methacrylate, PMMA), PMMA is 0.2W/mK, PMMA's
Thermal coefficient is much larger than the thermal coefficient of air.The heat that sends out is by the material preferentially by being in contact with it when μ LED 123 work
The big material of middle thermal coefficient is transmitted, and μ LED 123 are contacted with the air filled in bottom plate 121 and accommodating hole 151 simultaneously,
Since the thermal coefficient of bottom plate 121 is much larger than the thermal coefficient of air, and color conversion layer 16 and μ LED 123 are by air exclusion
And be not directly contacted with, therefore, the heat that μ LED 123 are generated preferentially is exported by bottom plate 121, and only a small amount of heat passes through sky
Gas is conducted makes the quanta point material in color conversion layer 16 avoid being destroyed because of high temperature to color conversion layer 16.In other realities
It applies in example, the optical cement that thermal coefficient is less than 121 material thermal conductivity of bottom plate also can be filled in accommodating hole 151.
The production method that the display panel of first embodiment of the invention is provided.
Step S11：The upper substrate 13 for providing a light transmission forms light shielding part 15, the light shielding part on 13 surface of the upper substrate
15 are formed by light-proof material, which is formed with multiple accommodating holes 151 through the light shielding part 15.
Specifically, the substrate has a first surface 131, formed on first surface 131 dark lighttight photic
Etch-resistant material, the light shielding part 15 etch photoresist quarter material by using the technique of laser-induced thermal etching or chemical etching and obtain
It arrives.In the present embodiment, there are multiple in matrix arrangement and size almost consistent accommodating hole 151 for light shielding part 15, described accommodating
Light shielding part 15 is run through in hole 151, and the photoresist of 151 corresponding region of accommodating hole carves material and is removed to expose the upper substrate 13
First surface 131.
Step S12：The surface that the light shielding part 15 is formed in the upper substrate 13 forms color conversion layer 16, color conversion layer
16 include multiple color conversion cells, and each color conversion cell is located in an accommodating hole 151.
Specifically, the color conversion layer 16 first surface 131 can be prepared in by the modes such as being coated with, spray not hidden
In the subregion of 15 overlay area of light portion.Each accommodating hole 151 corresponds to a sub-pixel 19, and the sub-pixel 19 includes extremely
Few three kinds of different sub-pixels, in the present embodiment, sub-pixel 19 includes red sub-pixel 191, green sub-pixels 192 and blue
The color conversion cell of sub-pixel 193, color conversion layer 16 includes that red color converting unit 161 and green tint conversion are single
Member 162, wherein red color converting unit 161 corresponds to red sub-pixel 191 and is arranged, and green tint converting unit 162 corresponds to green
Sub-pixels 192 are arranged, and color conversion layer 16 is not arranged for the region of corresponding blue subpixels.
Step S13：One μ LED array substrate 12 is provided, the μ LED array substrate 12 be provided with it is multiple be arranged in array and that
This spaced μ LED 123；The upper substrate 13 is docked with the μ LED array substrate 12, makes the light shielding part 15
Between μ LED array substrate 12 and upper substrate 13 and its both sides is contacted with μ LED array substrate 12 and upper substrate 13 respectively, is made every
One μ LED 123 are placed in an accommodating hole 151.
Specifically, also provide with the μ LED array substrate 122 stack setting include multiple TFT 181 film crystal
Pipe array substrate 18, the TFT 181 arrange in matrix, each μ LED 123 is at least correspondingly arranged there are one TFT 181.This
In embodiment, which can also include fluid sealant 14, and fluid sealant 14 is coated on 10 lateral wall of display panel, covers
Connection gap between light shielding part 15 and μ LED array substrate 12 and upper substrate 13.
Second embodiment
Referring to FIG. 3, Fig. 3 show the structural schematic diagram of the display panel of second embodiment of the invention, second embodiment
Display panel floor map it is identical as the floor map of the display panel of first embodiment, can refer to Fig. 1.
The display panel 20 of the present embodiment includes μ LED array substrate 22, upper substrate 23, light shielding part 25 and color conversion
Layer 26.
As shown in figure 3, μ LED array substrate 22 is oppositely arranged with upper substrate 23, it is provided on μ LED array substrate 22 multiple
The μ LED 223 for being arranged in array and being intervally installed, light shielding part 25 be located between upper substrate 23 and μ LED array substrate 22 and
Its both sides is contacted with μ LED array substrate 22 and upper substrate 23 respectively, and light shielding part 25 has certain thickness, and light shielding part 25 is right
Should every μ LED 223 position be formed through light shielding part 25 the both sides accommodating hole 251, so that every μ LED 223 is held
It is placed in an accommodating hole 251, the light shielding part 25 is opaque.Color conversion layer 26 is formed in upper substrate 23 towards μ LED array bases
The surface of plate 22, color conversion layer 26 include multiple color conversion cells, and each color conversion cell is located at an accommodating hole 251
It is interior, and the μ LED 223 in same accommodating hole are arranged with color conversion cell interval.μ LED array substrate 22 is for sending out
Light contains quanta point material using the display light source as display panel 20 in color conversion layer 26, can be to μ LED array bases
The color for the light that plate 22 is sent out is converted to obtain the color needed for display, and light shielding part 25 can cover μ LED array substrate 22
The light propagated to certain specific directions sent out.
It is closed for one that light shielding part 25, upper substrate 23 and the cooperation of μ LED array substrate 22 make accommodating hole 251 be sealed to form
Space.
μ LED array substrate 22 is including bottom plate 221 and is set to the μ of the bottom plate 221 towards the surface of upper substrate 23
LED 223, every μ LED 223 are located in an accommodating hole 251.In the present embodiment, μ LED 223 can be containing aluminum gallium nitride
(AlGaN) micro-led, aluminum gallium nitride is micro-led to send out ultraviolet light.
The material of bottom plate 221 can be inorganic matter, such as silica (SiO2)；The material of bottom plate 221 can also be organic
Object, e.g., polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polyimides
(Polyimide, PI), polyethylene naphthalate (Polyethylene naphthalate two formic acid
Glycol ester, PEN), makrolon (Polycarbonate, PC) or polyethylene terephthalate
(polyethylene glycol terephthalate, PET).Bottom plate 221 can be flexible material or non-flexible material,
In the present embodiment, bottom plate 221 is non-flexible material, and bottom plate 221 is PMMA, has preferable rigidity, makes μ LED array substrates
22 are unlikely to deform, to ensure that the structure of accommodating hole 251 is stablized relatively and holding seals.In other embodiments, bottom plate 221 also may be used
Think flexible material (such as PC, PMMA, PI or PEN), corresponding, upper substrate 23 should be flexible material, and light shielding part 25 should also have
Preferably can deformability so that accommodating hole 251 bend in display panel 20, around deformation such as foldings when be unlikely to lose its it is close
Feng Xing.
The light sent out by μ LED array substrate 22 observed after need to penetrating upper substrate 23 by user, therefore, upper substrate 23
For transparent material, with preferable translucency；Upper substrate 23 is the supporting body of color conversion layer 26 and light shielding part 25, upper substrate
23 can be flexible material or non-flexible material.In the present embodiment, upper substrate 23 and bottom plate 221 are non-flexible material,
With preferable rigidity so that display panel 20 is not susceptible to deformation when bearing external force and generating the deformation such as distortion, bending tendency
Or deformation degree is smaller, to ensure that the structure of accommodating hole 251 is relatively stable and its is made to keep sealing；It is corresponding, upper substrate 23
Material can be inorganic matter, such as silica (SiO2), the material of upper substrate 23 can also be organic matter, such as makrolon
(Polycarbonate, PC), polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA) or poly- pair
Ethylene terephthalate (polyethylene glycol terephthalate, PET).In other embodiments, upper substrate
23 and bottom plate 221 are flexible material so that accommodating hole 251 bend in display panel 20, around deformation such as foldings when be unlikely to
Lose its leakproofness；Upper substrate 23 can be optical diaphragm, and the material of upper substrate 23 can be organic matter, such as polymethylacrylic acid
Methyl esters (Polymeric Methyl Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyimides
(Polyimide, PI) or polyethylene naphthalate (Polyethylene naphthalate two formic acid
Glycol ester, PEN).
It should be understood that the material of upper substrate 23 and bottom plate 221 can select according to actual needs, but substrate in the choice
23 and bottom plate 221 material when should fully consider influence of the material adapted for 251 leakproofness of accommodating hole, should ensure to house as possible
The leakproofness in hole 251 is not destroyed, and is entered in accommodating hole 251 to avoid water, oxygen and is damaged to quanta point material.
Upper substrate 23 includes towards the first surface 231 of μ LED array substrate 22, and light shielding part 25 is set to first surface
231.Light shielding part 25 has certain thickness, and the thickness is at least so that the color conversion layer 26 and μ being set in accommodating hole 251
LED 223 is not contacted.The light shielding part 25 can be a patterned black matrix layer or the photic anti-etching oxidant layer of black, shading
Portion 25 can be made by techniques such as printing, chemical etching, laser-induced thermal etchings.
The upper substrate 23 and μ LED array substrate 22 being oppositely arranged is pressed, makes light shielding part 25 far from the side of upper substrate 23
It is bonded by viscose glue 21 with μ LED array substrate 22, one sub-pixel 290 of definition of each accommodating hole 251, in each sub-pixel extremely
There is a μ LED 223 less, the partial penetration upper substrate 23 for the light which sends out, another part is by light shielding part 25
Or μ LED array substrate 22 is blocked, absorbs or is reflected.In the present embodiment, a μ LED is provided only in each accommodating hole 251
223, in other embodiments, two or more μ LED 223 may be present in each accommodating hole 251, it can be according to display panel 20
Brightness demand adjust accommodating hole 251 in μ LED 223 quantity.
Sub-pixel 290 includes different red sub-pixel 291, green sub-pixels 292 and the blue subpixels of three kinds of colors
293, it is additionally provided with color in 293 corresponding accommodating hole 251 of red sub-pixel 291, green sub-pixels 292 and blue subpixels and turns
Unit is changed, color conversion cell is set on the part that first surface 231 is located in accommodating hole 251.Color conversion layer 26 includes
Red color converting unit 261, green tint converting unit 262 and blue color converting unit 263, red color conversion are single
Member 261 corresponds to red sub-pixel 291 and is arranged, and green tint converting unit 262 corresponds to green sub-pixels 292 and is arranged, blue color
Converting unit 263 corresponds to blue subpixels 293 and is arranged.Quanta point material can be by being coated with, being sprayed at by color conversion layer 26
One surface 231 is formed；Quanta point material in red color converting unit 261 is mainly the quanta point material of diameter 7nm, μ LED
When 223 light sent out pass through upper substrate 23, red band is converted by the quanta point material in red color converting unit 261
Light；Quanta point material in green tint converting unit 262 is mainly the quanta point material of diameter 3nm, and μ LED 223 are sent out
Light pass through upper substrate 23 when, the light of green band is converted by the quanta point material in green tint converting unit 262；It is blue
Quanta point material in color color conversion cell 263 is mainly the quanta point material of diameter 2nm, and the light that μ LED 223 are sent out passes through
When upper substrate 23, the light of blue wave band is converted by the quanta point material in blue color converting unit 263.Display panel 20
Including multiple pixels 27, a pixel 27 is made of multiple sub-pixels 29, and each sub-pixel 29 includes at least a sub- picture of red
Plain 291, green sub-pixels 292 and a blue subpixels 293.Aluminum gallium nitride is micro-led send out it is ultraviolet
Light, compared to traditional white light μ LED, white light is to be formed after the light of a variety of different frequencies mixes, and quanta point material is for white light
Utilization rate is less than quanta point material to the utilization rate of monochromatic ultraviolet light.
The display panel 20 further includes fluid sealant 24, is coated on 20 lateral wall of display panel, covers light shielding part 25 and μ
Connection gap between LED array substrate 22 and upper substrate 23, to improve the leakproofness of display panel 20.
The display panel 20 further includes active-matrix substrate 28, includes multiple be arranged in array on the active-matrix substrate
Thin film transistor (TFT) 281 (thin film transistor, TFT), multiple TFT 281 is for controlling opening for the μ LED 223
It opens and closes, each μ LED 223 are at least correspondingly arranged there are one TFT 281.
It is not contacted between μ LED 223 and color conversion layer 26, μ LED 223 can also generate heat while luminous, and color
Quanta point material in color conversion layer 26 is influenced to go bad by high temperature, and is directly contributed under 20 display effect of display panel
Drop.The thermal coefficient of the thermal conductivity ratio bottom plate 221 of filler in accommodating hole 251 is small.In the present embodiment, accommodating hole 251
In filler be air, the mean coefficient of heat conductivity of air is 0.026W/mK, and 221 material of bottom plate of the present embodiment is poly- methyl
The thermal coefficient of methyl acrylate (Polymeric Methyl Methacrylate, PMMA), PMMA is 0.2W/mK, PMMA's
Thermal coefficient is much larger than the thermal coefficient of air.The heat that sends out is by the material preferentially by being in contact with it when μ LED 223 work
The big material of middle thermal coefficient is transmitted, and μ LED 223 are contacted with the air filled in bottom plate 221 and accommodating hole 251 simultaneously,
Since the thermal coefficient of bottom plate 221 is much larger than the thermal coefficient of air, and color conversion layer 26 and μ LED 223 are by air exclusion
And be not directly contacted with, therefore, the heat that μ LED 223 are generated preferentially is exported by bottom plate 221, and only a small amount of heat passes through sky
Gas is conducted makes the quanta point material in color conversion layer 26 avoid being destroyed because of high temperature to color conversion layer 26.In other realities
It applies in example, the optical cement that thermal coefficient is less than 221 material thermal conductivity of bottom plate also can be filled in accommodating hole 251.
The production method that the display panel of second embodiment of the invention is provided.
Step S21：The upper substrate 23 for providing a light transmission forms light shielding part 25, the light shielding part on 23 surface of the upper substrate
25 are formed by light-proof material, which is formed with multiple accommodating holes 251 through the light shielding part 25.
Specifically, the substrate has a first surface 231, dark photoresist is formed on first surface 231 and is carved
Material, the light shielding part 25 etch photoresist quarter material by using the technique of laser-induced thermal etching or chemical etching and obtain.
In the present embodiment, the light shielding part 25 has a mesh pattern, light shielding part 25 there are it is multiple in matrix arrangement and size it is almost consistent
Accommodating hole 251, the photoresist of 251 corresponding region of accommodating hole carves the first table that material is removed to expose the upper substrate 23
Face 231.
Step S22：The surface that the light shielding part 25 is formed in the upper substrate 23 forms color conversion layer 26, color conversion layer
26 include multiple color conversion cells, and each color conversion cell is located in an accommodating hole 251.
Specifically, color conversion layer 26 can be prepared in first surface 231 not by light shielding part by the modes such as being coated with, spraying
In the subregion of 25 overlay areas.Each accommodating hole 251 corresponds to a sub-pixel 29, and the sub-pixel 29 includes at least three
Kind different sub-pixels, in the present embodiment, sub-pixel 29 includes red sub-pixel 291, green sub-pixels 292 and blue subpixels
293；The color conversion cell of color conversion layer 26 includes red color converting unit 261 and green tint converting unit 262,
Red color converting unit 261 corresponds to red sub-pixel 291 and is arranged, and green tint converting unit 262 corresponds to green sub-pixels 292
Setting, blue color converting unit 263 correspond to blue subpixels 293 and are arranged.
Step S23：One μ LED array substrate 22 is provided, the μ LED array substrate 22 be provided with it is multiple be arranged in array and that
This spaced μ LED 223；The upper substrate 23 is docked with the μ LED array substrate 22, makes the light shielding part 25
Between μ LED array substrate 22 and upper substrate 23 and its both sides is contacted with μ LED array substrate 22 and upper substrate 23 respectively, is made every
One μ LED 223 are placed in an accommodating hole 251.
Specifically, also provide with the μ LED array substrate 222 stack setting include multiple TFT 281 film crystal
Pipe array substrate 28, the TFT 281 arrange in matrix, each μ LED 223 is at least correspondingly arranged there are one TFT 281.This
In embodiment, which can also include fluid sealant 24, and fluid sealant 24 is coated on 20 lateral wall of display panel, covers
Connection gap between light shielding part 25 and μ LED array substrate 22 and upper substrate 23.
Referring to Fig. 4, the schematic diagram of the specific implementation mode for the electronic device 1 of application display panel of the present invention.
When the electronic device 1 of the present embodiment is described, identical element use label identical with embodiment before.In this reality
It applies in example, electronic device 1 is mobile phone, including ontology 2 and the display panel that is set in ontology 2, which is this
The display panel provided is provided, for example can be the display panel 10 described in above-described embodiment one, or for described in embodiment two
Display panel 20.
In Fig. 4 only by taking electronic device 1 is mobile phone as an example, in other embodiments, the electronic device 1 or individual calculus
Machine, intelligent appliance, industrial control unit (ICU) etc..When the electronic device 1 is mobile phone, which can correspond to the front of mobile phone
Setting.
Above, the specific implementation mode of the present invention is described with reference to the accompanying drawings.But those skilled in the art
It is understood that without departing from the spirit and scope of the present invention, can also make to the specific implementation mode of the present invention each
Kind change and replacement.These changes and replacement are all fallen in claims of the present invention limited range.
Claims (18)
1. a kind of display panel, it is characterised in that：Including μ LED array substrate, upper substrate, light shielding part and color conversion layer, institute
μ LED array substrate is stated to be oppositely arranged with the upper substrate, be provided on the μ LED array substrate it is multiple be arranged in array and that
This spaced μ LED, the light shielding part between μ LED array substrate and upper substrate and its both sides respectively with μ LED array
Substrate and upper substrate contact, light shielding part correspond to every μ LED position be formed through light shielding part the both sides accommodating hole,
Every μ LED are made to be placed in an accommodating hole, the light shielding part is opaque, and the color conversion layer is set to the upper substrate court
To the surface of μ LED array substrates, color conversion layer includes multiple color conversion cells, and each color conversion cell is located at one and holds
It sets in hole, and the μ LED in same accommodating hole are arranged with color conversion cell interval, the color conversion layer contains quantum
Point material.
2. display panel as described in claim 1, it is characterised in that：The μ LED array substrate further includes a bottom plate, described
Multiple μ LED may be contained within the bottom plate towards the surface of the upper substrate.
3. display panel as claimed in claim 2, it is characterised in that：The light shielding part is formed in upper substrate towards μ LED array
The surface of substrate, side of the light shielding part far from upper substrate are bonded with μ LED array substrates by viscose glue, light shielding part, upper substrate and
The cooperation of μ LED array substrates makes each accommodating hole be sealed to form for a confined space, and μ LED and color are removed in the confined space
Space other than converting unit is empty or is filled with optical cement, and the thermal coefficient of the bottom plate is more than the heat conduction of the optical cement
Coefficient.
4. display panel as described in claim 1, it is characterised in that：The optical cement is acrylic optical cement, heat conduction system
Number is less than or equal to 0.2.
5. display panel as described in claim 1, it is characterised in that：The multiple μ LED send out identical light.
6. display panel as claimed in claim 5, it is characterised in that：The multiple μ LED send out ultraviolet light or blue light.
7. display panel as described in claim 1, it is characterised in that：Display panel definition has multiple pixels, each pixel
It is made of multiple sub-pixels, each sub-pixel includes a μ LED.
8. display panel as claimed in claim 7, it is characterised in that：The sub-pixel includes different red of three kinds of colors
Pixel, green sub-pixels and blue subpixels；The color conversion cell includes red color converting unit and green color
Color converting unit, is provided with red quantum dot material in the red color converting unit, in the green tint converting unit
It is provided with green quanta point material；Each red sub-pixel includes a red color being located at its μ LED in same accommodating hole
Converting unit, each green sub-pixels include a green tint converting unit being located at its μ LED in same accommodating hole, institute
It states and color conversion cell is not set in blue subpixels.
9. display panel as claimed in claim 7, it is characterised in that：The color conversion cell includes that red color conversion is single
Member, green tint converting unit and blue color converting unit are provided with red quantum in the red color converting unit
Material is put, green quanta point material is provided in the green tint converting unit, is arranged in the blue color converting unit
There is blue quanta point material；Each red sub-pixel includes that a red color being located at its μ LED in same accommodating hole is converted
Unit, each green sub-pixels include a green tint converting unit being located at its μ LED in same accommodating hole, Mei Gelan
Sub-pixels include a blue color converting unit being located at its μ LED in same accommodating hole.
10. display panel as described in claim 1, it is characterised in that：The light shielding part is that black matrix or dark color are photic anti-
Etchant.
11. display panel as described in claim 1, it is characterised in that：The display panel further includes a fluid sealant, described close
Sealing is coated on the display panel lateral wall, the connection between the covering light shielding part and μ LED array substrate and upper substrate
Gap.
12. a kind of electronic device, which includes ontology and is set to the intrinsic display panel, it is characterised in that：
The display panel is the display panel described in claim 1-11 any one.
13. a kind of preparation method of display panel, including：
The upper substrate for providing a light transmission forms light shielding part in upper substrate surface, which is formed by light-proof material, the shading
Portion is formed with multiple accommodating holes through the light shielding part；
The surface that the light shielding part is formed in the upper substrate forms color conversion layer, and the color conversion layer includes that multiple colors turn
Unit is changed, each color conversion cell is located in an accommodating hole；
A μ LED array substrates are provided, which is provided with multiple μ for being arranged in array and being intervally installed
LED；
The upper substrate is docked with the μ LED array substrate, make the light shielding part be located at μ LED array substrate and upper substrate it
Between and its both sides contacted respectively with μ LED array substrate and upper substrate, so that every μ LED is placed in an accommodating hole.
14. a kind of preparation method of display panel as claimed in claim 13, it is characterised in that：The light shielding part is far from described
Upper substrate side and the μ LED array substrate bonding.
15. a kind of preparation method of display panel as claimed in claim 13, it is characterised in that：Display panel definition has more
A pixel, each pixel are made of multiple sub-pixels, and each sub-pixel includes a μ LED.
16. a kind of preparation method of display panel as claimed in claim 15, it is characterised in that：The sub-pixel includes three kinds
The different red sub-pixel of color, green sub-pixels and blue subpixels；The color conversion cell includes that red color turns
Unit and green tint converting unit are changed, red quantum dot material is provided in the red color converting unit, it is described green
Green quanta point material is provided in color color conversion cell；Each red sub-pixel includes one and is located at same appearance with its μ LED
The red color converting unit in hole is set, each green sub-pixels include a green being located at its μ LED in same accommodating hole
Color conversion cell is not arranged in the blue subpixels for color conversion cell.
17. a kind of preparation method of display panel as claimed in claim 15, it is characterised in that：The color conversion cell packet
Include red color converting unit, green tint converting unit and blue color converting unit, the red color converting unit
It is inside provided with red quantum dot material, green quanta point material, the blue color are provided in the green tint converting unit
Blue quanta point material is provided in color converting unit；Each red sub-pixel includes one and is located at same accommodating hole with its μ LED
Interior red color converting unit, each green sub-pixels include a green tint being located at its μ LED in same accommodating hole
Converting unit, each blue subpixels include a blue color converting unit being located at its μ LED in same accommodating hole.
18. a kind of preparation method of display panel as claimed in claim 13, it is characterised in that：The display panel further includes
One fluid sealant, the fluid sealant are coated on the display panel lateral wall, the covering light shielding part and μ LED array substrate and
Connection gap between upper substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810433451.2A CN108573992A (en) | 2018-05-08 | 2018-05-08 | The electronic device of display panel, the preparation method and application display panel |
| TW107121606A TWI690074B (en) | 2018-05-08 | 2018-06-22 | Display panel, manufacture method thereof and electronic device having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810433451.2A CN108573992A (en) | 2018-05-08 | 2018-05-08 | The electronic device of display panel, the preparation method and application display panel |
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| Publication Number | Publication Date |
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| CN108573992A true CN108573992A (en) | 2018-09-25 |
Family
ID=63571980
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| CN201810433451.2A Pending CN108573992A (en) | 2018-05-08 | 2018-05-08 | The electronic device of display panel, the preparation method and application display panel |
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| TW (1) | TWI690074B (en) |
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| TWI690074B (en) | 2020-04-01 |
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Application publication date: 20180925 |