CN100544565C - The display of tool heat sinking function - Google Patents
The display of tool heat sinking function Download PDFInfo
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- CN100544565C CN100544565C CNB2005100229312A CN200510022931A CN100544565C CN 100544565 C CN100544565 C CN 100544565C CN B2005100229312 A CNB2005100229312 A CN B2005100229312A CN 200510022931 A CN200510022931 A CN 200510022931A CN 100544565 C CN100544565 C CN 100544565C
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Abstract
The invention discloses a kind of display of tool heat sinking function, it comprises substrate and cap.Substrate, the surface has made display module, by the display module show image.Cap is assembled on the substrate, with the sealing display module.One side of cap surpasses the side of substrate and constitutes the protruding end, and cap also has thermally conductive pathways, by this, and with the guiding of the heat of substrate, guiding protruding end by thermally conductive pathways.
Description
Technical field
The present invention is about a kind of display, particularly about a kind of display of organic electroluminescence that is manufactured with heat dissipation path on panel.
Background technology
Organic light emitting display (Organic Light Emitting Display) or title Organic Light Emitting Diode (Organic Light Emitting Diode; OLED), become the development priority of display floater of new generation.They are different with lcd technology, do not need to use backlight module, but are self-emitting light source by organic material layer wherein, and when electric current fed, organic material layer can the luminous demonstration of carrying out image.Except possessing self luminous characteristics, advantages such as that organic light emitting display has more is compact, deflection, high brightness and high reaction speed, and a large amount of being applied in the various portable electronic products such as personal digital aid (PDA) (PDA), digital camera, mobile phone.
Organic light emitting display can be divided into passive organic light emitting display (PassiveMatrix OLED) and active organic electroluminescent display device (Active Matrix OLED) according to its type of drive.Wherein, active organic electroluminescent display device is to utilize thin-film transistor (Thin FilmTransistor, TFT), collocation electric capacity storage assembly is controlled the intensity gray scale performance of OLED.Owing to use the electric capacity storage assembly, so after the signal of scan line passed through, pixel still can keep original brightness.In comparison, passive organic light emitting display, when then only the signal on scan line passed through, the pixel of choosing just can be lighted.Therefore under active type of drive, OLED does not need to be driven into very high brightness, and has long useful life, and can satisfy high-resolution demand.
Therefore it should be noted that because the thin-film transistor in the active organic electroluminescent display device when current flowing, can produce heat energy, cause display overheated and shorten its useful life easily.Particularly after the size of display pannel trend large scale, the heat energy that thin-film transistor caused certainly will be more considerable, will be bigger also for the influence in active organic electroluminescent display device its useful life.Person more, large-sized organic light emitting display mainly can be applied on the electronic products such as slim TV, mobile computer, is the length with its useful life, definitely is an industry focus quite deeply concerned.And,, and influenced the thickness and the outward appearance of entire product because therefore relevant its frivolous characteristic of electronic product lay special stress on also is not suitable for installing additional heat radiation instruments such as fan on making.
In addition, in known technology, because the relation of material behavior, organic light emitting display can be assembled in a cap on the display floater when assembling, intercepts aqueous vapor and air.Therefore industry tends to by the design that changes cap, the effect of promoting heat radiation.Common mode similarly be the material of making the bigger cap of surface area or insert and put some heat radiations between cap and display floater, but it does not have production or integral heat sink poor effect mostly.
Please refer to Fig. 1, this figure has shown the encapsulating structure 10 of organic light emitting display in the known technology.The cap 16 that this encapsulating structure 10 has comprised substrate 12, has been made in the organic luminescent assembly 14 on the substrate 12 and is used for intercepting aqueous vapor and air.Can find out obviously that from figure in order to promote the effect of heat radiation, the upside of cap 16 has also been made the fin 161 that polylith raises up, increase the area of dissipation of overall package lid 16 by this.
But the cost and difficulty of this kind design on increasing cap 16 making, the thickness of overall package structure 10 is increased, and then have influence on the outward appearance of organic light emitting display.And the radiating effect that this kind cap 16 can be promoted in fact is also extremely limited, and can't effectively solve along with panel size becomes big display problems of excessive heat of deriving.
Therefore, for the design dealer in this field or produce the dealer, attempt making a kind of real encapsulating structure of doing that is easy to produce, effectively overcome its heat dissipation problem of organic light emitting display, the direction that has become the stakeholder and endeavoured.
Summary of the invention
For this reason, the present invention proposes a kind of display with heat sinking function, can be effectively the heat of display interior be dissipated in the external environment.
Display provided by the present invention, primary clustering have comprised substrate and cap.Substrate surface has been made many display modules, can be by this display module show image.As for, cap then is assembled on the substrate, with the sealing display module.Wherein, a side of cap surpasses the side of substrate and constitutes the protruding end, and on cap and made thermally conductive pathways, by this, the heat that various assembly is sent in operating process on the substrate can be subjected to the guiding of thermally conductive pathways, flows to the protruding end.
For making advantage of the present invention and the spirit can be further revealed, existing do in conjunction with the accompanying drawings detailed explanation as after.
Description of drawings
Fig. 1 is in the known technology, the encapsulating structure schematic diagram of organic light emitting display.
Fig. 2 is the schematic perspective view of the preferred embodiment of display of the present invention.
Fig. 3 is that shown in Figure 2, along the generalized section of A-A ' hatching.
Fig. 4 is the schematic top plan view of the second embodiment of the present invention.
Fig. 5 is among this second embodiment, along the profile of B-B ' hatching.
[primary clustering symbol description]
2 displays, 161 fins
10 organic light emitting display encapsulating structures, 210 display modules
12 substrates, 221 tanks
14 organic luminescent assemblies, 222 protruding ends
16 caps, 223 thermally conductive pathways
21 substrates, 224 grooves
22 cap 224a groove elongated ends
23 radiating subassemblies, 225 Heat Conduction Materials
24 packaging plastics, 226 heat pipes
Embodiment
See also Fig. 2 and Fig. 3, Fig. 2 is the schematic perspective view of the preferred embodiment of display of the present invention, and Fig. 3 then is along the generalized section of A-A ' hatching among Fig. 2.As shown in the figure, display 2 of the present invention comprises substrate 21 and cap 22.
On substrate 21 surfaces, and made display module 210.Generally speaking, can on substrate 21, make requisite number purpose display module 210 along with panel size or resolution sizes, and by these display module 210 common show images.
In one embodiment, described display module 210 is an organic luminescent assembly, and it is to be made of various retes such as thin-film transistor, anode layer, cathode layer, electron transfer layer, hole transmission layer, luminous material layers.When electronics combines in luminous material layer with the hole, will make luminous material layer be stimulated and emit beam.Whether luminous and luminous intensity by those display modules 210 of control can show desired image.
It should be noted that aforementioned cap 22 behind involution, the one side can surpass the side of substrate 21 and constitute protruding end 222.As shown in FIG., protruding end 222 protrudes from outside substrate 21 sidewalls.In addition, in cap 22 and be manufactured with thermally conductive pathways 223, this thermally conductive pathways 223 is distributed on the plate face of cap 22, and extends to above-mentioned protruding end 222.By the setting of this thermally conductive pathways 223, the various electronic building bricks heat that sends in operation can be subjected to the guiding of thermally conductive pathways 223 on the substrate, and flows in past protruding end 222.
As previously mentioned, because protruding end 222 is to protrude in outside the substrate 21,, and can directly expose in the external environment so the surface of protruding end 222 can not contact with substrate 21.Therefore, when the heat that display module 210 is sent when thermally conductive pathways 223 conducted to protruding end 222, heat can be dissipated in the external environment via protruding end 222 effectively.
Certainly, along with the design requirement of display, in different execution modes, also can select to allow all sides of cap or partly side all surpasses and protrudes from outside the side of substrate.For example, in the embodiment of this case, cap 22 is all rectangular configuration with substrate 21, and cap 22 one sides surpass and protrude from outside substrate 21 sidewalls, and constitutes above-mentioned protruding end 222.But, when display has other demand in design, also can allow four sides of cap 22 all surpass four sides of substrate 21, all form the protruding end at each side.Perhaps, also can allow cap 22 arbitrarily two sides or three sides surpass and protrude from outside the substrate 21, and constitute required protruding end.This visual radiating requirements and changing is in this narration one by one.
In a preferred embodiment of the invention, display 2 also can comprise radiating subassembly 23, is arranged on the protruding end 222 of cap 22, to quicken the radiating efficiency of this cap 22.Radiating subassembly 23 herein can be selected to be made of the fin of metal material made (heat sink).Certainly promoting considering of radiating effect, also can use, constitute this radiating subassembly 23 such as electronic installations such as fans.
As aforementioned, please refer to Fig. 2, thermally conductive pathways 223 is surrounded on the periphery of tank 221, and extends to protruding end 222, in order to the heat energy guiding protruding end 222 with substrate 21.In one embodiment, thermally conductive pathways 223 herein can be made of the heat conduction pipeline.See also Fig. 3, in this embodiment, made groove 224 on the inner surface of cap 22, this groove 224 extends on cap 22 surfaces with the pattern distribution of wire, and is surrounded on the loop that forms sealing on every side of tank 221.What particularly point out is, in order to make heat on the substrate 21 protruding end 222 of effectively leading, an end of these groove 224 its linear pattern also extends to protruding end 222, and constitutes groove elongated end 224a.
In addition, for cap in the display 2 22 and substrate 21 are fitted together, one deck packaging plastic 24 can be coated between cap 22 and the substrate 21, so that cap 22 is adhesively fixed on substrate 21, and the sealing effectiveness between cap 22 and the substrate 21 is provided, makes the tank 221 inner spaces that form airtight isolation.
As shown in Figure 3, coat the packaging plastic 24 of 21 of cap 22 and substrates, can constitute the space, independent duct of sealing with groove 224.In a preferred embodiment, in order to promote the effect of heat conduction, and can be chosen in the duct between packaging plastic 24 and the groove 224, insert Heat Conduction Material 225.By in the duct, inserting Heat Conduction Material, can constitute above-mentioned heat conduction pipeline, and the heat energy on the substrate 21 is dispersed along the thermally conductive pathways 223 among the figure.
What specify is that because general display in use, the plate face of its display floater often is in upright state, so the present invention in design, can select to allow protruding end 222 be positioned at the upper limb place of upright plate face.That is when the display among Fig. 22 was upright, its protruding end 222 was positioned at the side of whole display 2 near tops with radiating subassembly 23.In other words, when cap 22 and substrate 21 erected, the groove elongated end 224a that extends to protruding end 222 can be positioned at the top of whole groove 224.Thus, when changing into gas, can diffuse among the groove elongated end 224a along thermally conductive pathways 223 when Heat Conduction Material liquid in the groove 224 225 absorption heats.At this moment, provide the effect of quickening heat radiation, can make the Heat Conduction Material 225 effective heat radiations of gas and condense into liquid state again, and down be back in the groove 224 by radiating subassembly 23.
As aforementioned, in the process of display operation, all can produce heat energy such as various electronic building bricks such as display modules 210 on the substrate 21, and the temperature of whole base plate 21 is risen.At this moment, be filled in the Heat Conduction Material 225 of 24 of groove 224 and packaging plastics, the heat that various assemblies are dispersed on can absorptive substrate 21 and be converted into gas and spread towards groove elongated end 224a, when Heat Conduction Material 225 diffuses to protruding end 222, after seeing through protruding end 222 and carrying out heat exchange with the external world, to be cooled to liquid again, be back in tank 221 groove 224 on every side.By this, can constitute aforesaid thermally conductive pathways 223,, effectively lead being dissipated in the external environment the heat of tank.
What further specify is, in this embodiment, the heat conduction pipeline is made of groove 224 that is made in encapsulation 22 surfaces and the Heat Conduction Material 225 of filling wherein, but technology consider or other design requirement under, can also alternate manner or structure replace.Same, the path of its laying also is not limited to the inner surface of cap 22, or must be surrounded on tank 221 around, and visual demand is changed or is adopted other execution mode.In the second embodiment of the present invention, promptly utilize heat pipe to form the heat conduction pipeline.
Please refer to Fig. 4 and Fig. 5.Fig. 4 is the vertical view of the second embodiment of the present invention, and Fig. 5 then is along the profile of B-B ' line segment among second embodiment.
As shown in the figure, made heat pipe 226 in the inboard of cap 22, the pipeline structure that it can be a hollow is embedded in the sidewall on tank 221 4 limits and in tank 221 base plates.Same, an end of this heat pipe 226 also extends to protruding end 222.In heat pipe 226 and be filled with Heat Conduction Material, constitute the heat conduction pipeline of these caps by this heat pipe 226, the heat of substrate 21 can be dispersed along thermally conductive pathways.
Certainly, heat pipe also can not be embedded in sidewall and base plate interior, adopts the mode that is fixed in the tank inner surface and makes and change.One end of heat pipe extends to the protruding end equally, and constitutes thermally conductive pathways required for the present invention.
In sum, display provided by the present invention by the thermally conductive pathways that is arranged in its cap, can effectively be derived the heat of display module, and then increase the useful life of display.Particularly along with large size panel and high-resolution requirement, the assembly of the huge and dense arrangement of quantity obviously can make the heat dissipation problem of display become more harsh.In this case, heat dissipation technology provided by the present invention obviously helps to solve the panel problems of excessive heat, and has its effect.
The above utilizes different embodiment describing the present invention in detail, and it is not in order to limiting practical range of the present invention, and those of ordinary skill in the art all can understand, suitably make slightly modification still without departing from the spirit or scope of the invention.
Claims (8)
1. display comprises:
Substrate, the surface has made display module; And
Cap is assembled on this substrate, to seal this display module, one side of this cap surpasses the side of this substrate and constitutes the protruding end, and this cap also has thermally conductive pathways, and this thermally conductive pathways is made of the heat conduction pipeline, allow the heat energy of this substrate this protruding end of leading, and via this protruding end heat radiation.
2. display as claimed in claim 1, wherein above-mentioned display module is an organic luminescent assembly.
3. display as claimed in claim 1, wherein above-mentioned cap is attached at this substrate with inner surface, and has tank on this inner surface in order to hold this display module.
4. display as claimed in claim 3, wherein above-mentioned inner surface also has groove, in order to the filling Heat Conduction Material, and constitutes above-mentioned thermally conductive pathways.
5. display as claimed in claim 4, wherein above-mentioned groove be surrounded on this tank around and form the loop.
6. display as claimed in claim 4 comprises that also one deck packaging plastic coats between this cap and this substrate, and this Heat Conduction Material is filled in the passage that this groove and this packaging plastic constitutes.
7. display as claimed in claim 4, wherein an end of above-mentioned groove extends to this protruding end.
8. display as claimed in claim 1 also comprises radiating subassembly, is arranged at this protruding end of this cap, to quicken the radiating efficiency of this cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100229312A CN100544565C (en) | 2005-12-22 | 2005-12-22 | The display of tool heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100229312A CN100544565C (en) | 2005-12-22 | 2005-12-22 | The display of tool heat sinking function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1805671A CN1805671A (en) | 2006-07-19 |
| CN100544565C true CN100544565C (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100229312A Active CN100544565C (en) | 2005-12-22 | 2005-12-22 | The display of tool heat sinking function |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8540386B2 (en) | 2010-06-17 | 2013-09-24 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and display apparatus |
| CN101865389A (en) * | 2010-06-17 | 2010-10-20 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| CN103855308B (en) * | 2012-11-30 | 2016-04-27 | 海洋王照明科技股份有限公司 | A kind of organic electroluminescence device and preparation method thereof |
| CN103855321A (en) * | 2012-11-30 | 2014-06-11 | 海洋王照明科技股份有限公司 | Organic light-emitting device and preparation method thereof |
| CN111600222B (en) * | 2020-06-16 | 2022-03-29 | 河南里程碑科技有限公司 | High-efficient heat dissipation type distribution automation monitor terminal |
| CN112474592B (en) * | 2020-11-09 | 2021-11-05 | 西北工业大学 | Self-cleaning cooling device and method for airborne equipment |
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