1286912 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示器，特別是指一種在面板上製 作有散熱路徑之有機電激發光顯示器。 【先前技術】 有機發光顯示器（Organic Light Emitting Display) 丨 或稱有機發光二極體(Organic Light Emitting Diode; oled) ’已成為新世代顯示面板的發展重點。其與液晶顯示 技術不同，不需要使用背光模組，而是藉由其中的有“材 料層為自發光源，當有電流通入時，有機材料層即·可發光 進行影像之顯示。除了具備自發光的特點外，有機發光顯 不$更具有輕薄短小、可撓曲、高亮度以及高反應速度等 優點，而大量的應用於個人數位助理器（PDA)、數位相機、 行動電話等…各種可攜式的電子產品中。 有機發光顯示器依照其驅動方式可分為被動式有機發 光顯示器（Passive Matrix 0LED)與主動式有機發光顯示 器（ActiveMatrixOLED)。其中，主動式有機發光顯示器 疋利用薄膜電晶體(Thin Film Transistor，TFT)，搭配電 谷儲存訊號’來控制〇LED的亮度灰階表現。由於使用電容 儲存訊號，所以當掃描線的訊號通過後，畫素仍然能保持 原有的亮度。相較之下，被動式有機發光顯示器，則只有 在知描線上的sfL號通過時，選擇到的晝素才會被點亮。因 此在主動驅動方式下，〇LED並不需要驅動到非常高的亮 度，而具有較長的使用壽命，並且能滿足高解析度的需求。 1286912 # 值得注意的是，由於主動式有機發光顯示器中的薄膜 電晶體在電流流通時，會產生熱能，因此容易導致顯示器 過熱而縮短其使用壽命。特別是當顯示器面板的尺寸趨向 大尺寸後’薄膜電晶體所造成的熱能勢必更加可觀，對二 主動式有機發光顯示器其使用壽命的影響也將更大。更 者，大尺寸的有機發光顯示器，主要會應用在薄型電視、 ，記型1：腦等電子產品上’是以其使用壽命的長短，絕對 是業界相當關切的-個焦點。並且，由於相_電子產品 ，別強調其輕薄的特性，因此在製造上也不適合加裝風: 等散熱工具，而影響了整個產品的厚度與外觀。 外，在習知技術中’由於材料特性的關係，有機發 光顯示器在組裝時，會將一個封裝蓋組裝於顯示面板上， 來阻隔水氣及空氣。是以業界往往會藉著改變封裝蓋的設 計，來增進散熱的效果。常見的方式，像是製作表面積較 大的封裝蓋、或是在封裝蓋與顯示面板之間央置一些散熱 的材料，但其多半都不具有量產性或是整體散熱效果不佳。 照第一圖’此圖顯示了習知技術中有機發光顯示 =之封震結構1〇。此封裝結構1〇包括了基板12、製作於 =^上的有機發光元件14、以及用來阻隔水氣與空氣 :=16。從圖中可明顯看出，為了提昇散熱的效果， =盍^的上侧並製作了複數塊向上凸起的鰭片i6i，藉 此增加整體封輕16的賴面積。 外，十除了增加封裝蓋16製作上的成本與難度 發井顧一封裝結構10的厚度增加’進而影響到有機 ' 不益的外觀。並且，此種封裝蓋16實質上所能增進 12869121286912 IX. Description of the Invention: [Technical Field] The present invention relates to a display, and more particularly to an organic electroluminescent display having a heat dissipation path formed on a panel. [Prior Art] Organic Light Emitting Display (Organic Light Emitting Diode; oled) has become the focus of development of new generation display panels. Different from the liquid crystal display technology, the backlight module is not required, but the "material layer is a self-luminous source. When a current is passed, the organic material layer can be illuminated to display the image. In addition to the characteristics of illuminating, organic luminescence is not only thin, short, flexible, high brightness and high response speed, but also widely used in personal digital assistants (PDAs), digital cameras, mobile phones, etc. Among the portable electronic products, the organic light emitting display can be classified into a passive organic light emitting display (Passive Matrix 0LED) and an active organic light emitting display (ActiveMatrix OLED) according to the driving method thereof, wherein the active organic light emitting display uses a thin film transistor (Thin Film Transistor (TFT), with the electric valley storage signal 'to control the brightness gray scale performance of the LED. Because the capacitor is used to store the signal, the pixel can still maintain the original brightness when the signal of the scan line passes. Next, the passive organic light-emitting display is selected only when the sfL number on the line is passed. The prime will be illuminated. Therefore, in the active drive mode, the LED does not need to be driven to very high brightness, but has a long service life and can meet the requirements of high resolution. 1286912 # It is worth noting that Since the thin film transistor in the active organic light emitting display generates heat energy when current flows, it is easy to cause the display to overheat and shorten its service life, especially when the size of the display panel tends to be large, the thermal energy caused by the thin film transistor It is bound to be even more impressive, and the impact on the service life of the two active organic light-emitting displays will be even greater. Moreover, large-sized organic light-emitting displays will be mainly used in thin televisions, and on the electronic products such as brains. Because of its long service life, it is definitely a focus of the industry. And, because of the electronic products, do not emphasize its thin and light characteristics, so it is not suitable for the installation of wind: manufacturing tools, etc., affecting the whole The thickness and appearance of the product. In addition, in the prior art, the organic light-emitting display is due to the relationship of material properties. When assembled, a package cover is assembled on the display panel to block moisture and air. The industry often uses the design of the package cover to improve heat dissipation. Common methods, such as making a larger surface area The package cover, or some heat-dissipating material between the package cover and the display panel, but most of them are not mass-produced or have poor overall heat dissipation. According to the first figure, this figure shows the conventional technology. The organic light-emitting display has a sealed structure of 1. The package structure 1 includes a substrate 12, an organic light-emitting element 14 fabricated on the surface, and a barrier for moisture and air: =16. It can be seen that in order to enhance the effect of heat dissipation, the upper side of =盍^ is fabricated with a plurality of fins i6i protruding upward, thereby increasing the area of the overall sealing light 16. In addition, in addition to increasing the cost and difficulty in the manufacture of the package cover 16, the thickness of the package structure 10 increases, which in turn affects the organic 'unhelpful appearance. Moreover, such a package cover 16 can substantially enhance 1286912
» I 的散熱效果亦極其有限，而無法有效解決隨著面板尺寸變 大所衍生的顯示器過熱問題。 因此，對此領域的設計業者或生產業者而言，嘗試製 作-種易於生產實作_騎構，來有效的克服有機發光 顯示器其散熱問題，已成為相關人仕所致力之方向。 【發明内容】 | 為此’本發明提出一種具有散熱功能之顯示器，可有 ’效將顯示器内部的熱量發散至外界環境中。 本發明所提供的顯示器，主要元件包括了一基板以及 一封裝蓋。基板表面製作了許多顯示元件，可藉由該顯示 元件顯示影像。至於，封裝蓋則組裝於基板上，以密封顯 示元件。其中，封裝蓋之一側係超過基板之侧邊而構成一 凸出端，在封裝蓋上並製作了導熱路徑，藉此，基板上各 式元件在操作過程中所發出的熱量，可受到導熱路徑的引 ^ 導，流向凸出端。 為使本發明之優點及精神能更進一步的被揭示，茲配 合圖式作一詳細說明如後。 【實施方式】 請參閱第二圖及第三圖，第二圖為本發明顯示器之一 較佳實施例之立體示意圖，第三圖則為第二圖中沿A-A> 剖面線之剖面示意圖。如圖所示，本發明之顯示器2，包 ^ 括一基板21以及一封褒蓋22。 在基板21表面上，並製作了顯示元件210。一般而言， 可隨著面板尺寸或是解析度大小，在基板21上製作所需數 目的顯示元件210，並藉由該等顯示元件21〇共同顯示影 像。 在一具體實施例中，所述的顯示元件21〇為有機發光 元件’其疋由薄膜電晶體、陽極層、陰極層、電子傳輸層、 電洞傳輸層、發光材料層等等各式膜層構成。當電子與電 洞於發光材料層中結合時，將使發光材料層受激發而發出 光線。藉由控制該些顯示元件21〇的發光與否與發光強 度，可顯示所要之影像。 封裝蓋22 ’係以罩覆的方式組裝於基板21上，用以 禮、封顯示元件210，防止顯示元件與外界環境接觸， 進而達到防潮與防止灰塵沾染之目的。具體而論，封裝蓋 22係以其内侧表面，貼附於基板21上，且該内側表面具 有谷槽221，用以容納顯示元件21〇。亦即，當封裝蓋 22與基板21貼合時，封裂蓋2以容槽221會罩合於該些 顯不兀件21G的上#，使該些顯示元件21()正好位於容槽 221内。並且，藉由密封封裝蓋22與基板21的接觸面， 可使容槽221内部構成一個封閉且與外界環境隔離的獨立 空間。 、值得注意的是，前述封裝蓋22在封合後，其一侧會超 過基板21賴邊而構成—凸出端怨。如圖巾所示 端222係凸出於基板21側壁之外。另外，在封裝蓋22中 料路徑223，此導熱路徑223係分佈於封裝 盍22的板面上，並延伸至上述凸出端222。藉由此導熱路 徑223的設置’基板上各種電子元件在操作中所發出的熱 里，會受到導熱路徑223的引導，而往凸出端222流動。 如前所述，由於凸出端222是突出於基板21之外，故 凸出端222的表面不會與基板21接觸，並且會直接外露於 外界環境中。因此，當導熱路徑223將顯示元件210所發 出之熱量傳導至凸出端222 b寺，熱量可有效地經由凸出端 222發散至外界環境中。 當然’隨著顯示器的設計需求，在不同的實施方式中， 也可選擇讓封裝蓋的所有側邊或是部份侧邊皆超過並凸出 於基板的侧邊之外。例如，在本案的實施例中，封裝蓋22 與基板21皆為矩形結構，且封裝蓋22其一侧邊係超過並 凸出於基板21侧壁之外，而構成上述的凸出端222。不過， 當顯不器在設計上有其它的需求時，亦可讓封裝蓋2 2的四 個側邊都超過基板21之四個侧邊，在各側邊皆甩成凸出 端。或著，也可以讓封裝蓋22任意的兩個側邊、或三個侧 邊超過且凸出於基板21之外，而構成所需的凸出端。此係 可視散熱需求而變更，在此不一一敘述。 在本發明的較佳實施例中，顯示器2更可包括一散熱 元=23，設置於封裝蓋22的凸出端222上，以加速該封 裝蓋22之散熱效率。此處的散熱元件23可以選擇由金屬 材料所製作的散熱片（heat sink)來構成。#然在增進散熱 效果的考量上，也可使賴如風射電子裝置，來構成此 散熱元件23 〇 如同前述，請參照第二圖，導熱路徑223係環繞於容 槽221的周邊，並延伸至凸出端222，用以將基板21的熱 1286912 能導向凸出端222。在-具體實施例中，此處的導熱路徑 223可由導熱管線來構成。請參閱第三圖，在此實施例中， 於封裝蓋22的内側表面上係製作了凹槽辦，此凹槽224 以線狀的圖案分佈延伸於封裝蓋22表面上，並且環繞於容 槽221的週圍而形成封閉的迴路。要特別指出的是，為了 使基板21上的熱量能有效的導向凸出端222，此凹槽奴 其線狀圖案的-端並延伸至凸出端222，而構成一延 伸端224a。 此外，為了將顯示器2中的封裝蓋22與基板21組裝 在一起’可將一層封裝膠24塗佈於封裝蓋22與基板21、 之間，以便將封裝蓋22黏合狀於基板21上，並且 封裝蓋22與基板21之間的密封效果，使容槽221内部妒 成一密閉隔離的空間。^ 如第三圖所示’塗佈於封裝蓋22與基板21間 膠24 ’會與凹槽224構成密封的獨立孔道空間。在較佳 施例中，為了提昇導熱的效果，並可選擇在封裝膠24 ^ 槽224之間的孔道中，填入導熱材料225。藉著在孔道中 填人導”可以構成上述的導熱管線，而使基板 上的熱能沿著圖中的導熱路徑223發散。 要特別說明的是，由於一般顯示器在使用時，复顧_ 面板的板面姉處在直立的狀態，因此本發明在設:二不 可選擇讓&出端222位於直立板面的上緣處。亦即°，♦第 f圖中的顯示器2直立時，其凸出端222與散熱元件&第 係位於整侧示器2靠近上方的—側。換言之，當= 22與基板21豎立起來時，延伸至凸出端微的凹槽延伸 10 1286912 如圖所示，在封裝蓋22的内側製作了熱管226，其可 為一中空的管路結構，埋設於容槽221四邊之側壁内、以 及容槽221底板内。同樣的，此熱管226之一端，亦延伸 f凸出端222。在熱管226内並填有導熱材料，藉由該熱 官226構成該封裝蓋之導熱管線，使基板21的熱量能沿著 導熱路徑發散。 當然，熱管也可不埋設於側壁及底板内部，而改採固 疋於谷槽内表面的方式製作。熱管的一端同樣延伸至凸出 端，而構成本發明所需之導熱路徑。 綜上所述，本發明所提供的顯示器，藉由設置於其封 裝蓋内的導熱路徑，將可有效的將巔示元件的熱量導出， 進而增加顯示器的使用壽命。特別是隨著大尺寸面板以及 高解析度的要求，數量龐大且密集排列的元件，顯然會使 顯示器的散熱問題變得更為嚴苛。在此情形下，本發明所 提供之散熱技術顯然有助於解決面板過熱問題，而具有其 功效。 以上所述係利用不同實施例以詳細說明本發明，其並 非用以限制本發明之實施範圍，並且熟習該項技藝者皆能 明瞭，適當做些微的修改仍不脫離本發明之精神及範圍。 【圖式簡單說明】 第一圓，係為習知技術中，有機發光顯示器之封裝結構 不意圖。 第二圖，係為本發明之顯示器之一較佳實施例之立體示 意圖。 12 1286912 第三圖，係為第二圖所示者，沿A-A /剖面線之剖面示意 圖。 第四圖，係為本發明之第二實施例之俯視示意圖。 第五圖，係為該第二實施例中，沿B-B /剖面線之剖面圖。 【主要元件符號說明】» I's cooling effect is extremely limited, and it can't effectively solve the overheating problem caused by the larger panel size. Therefore, it is a direction for the designers and manufacturers in this field to try to produce a kind of easy-to-manufacture implementation to effectively overcome the heat dissipation problem of organic light-emitting displays. SUMMARY OF THE INVENTION [The present invention] provides a display having a heat dissipation function, which can have the effect of dissipating heat inside the display to the outside environment. In the display provided by the present invention, the main components include a substrate and a package cover. A plurality of display elements are formed on the surface of the substrate, and images can be displayed by the display elements. As for the package cover, it is assembled on the substrate to seal the display element. Wherein, one side of the package cover extends beyond the side of the substrate to form a protruding end, and a heat conducting path is formed on the package cover, whereby heat generated by various components on the substrate during operation can be thermally conducted. The guidance of the path leads to the protruding end. In order to further disclose the advantages and spirit of the present invention, a detailed description will be given below. [Embodiment] Please refer to the second and third figures. The second figure is a perspective view of a preferred embodiment of the display of the present invention, and the third drawing is a schematic cross-sectional view along the line A-A> in the second figure. . As shown, the display 2 of the present invention includes a substrate 21 and a cover 22. On the surface of the substrate 21, a display element 210 is fabricated. In general, a desired number of display elements 210 can be fabricated on the substrate 21 in accordance with the panel size or resolution, and the images are collectively displayed by the display elements 21A. In a specific embodiment, the display element 21 is an organic light-emitting element, and the film layer is composed of a thin film transistor, an anode layer, a cathode layer, an electron transport layer, a hole transport layer, a light-emitting material layer, and the like. Composition. When the electrons are combined with the holes in the layer of luminescent material, the layer of luminescent material is excited to emit light. The desired image can be displayed by controlling the illumination of the display elements 21 and the intensity of the illumination. The package cover 22' is assembled on the substrate 21 in a cover manner for arranging and sealing the display element 210 to prevent the display element from coming into contact with the external environment, thereby achieving the purpose of preventing moisture and preventing dust from being contaminated. Specifically, the package cover 22 is attached to the substrate 21 with its inner side surface, and the inner surface has a valley groove 221 for accommodating the display member 21''. That is, when the package cover 22 is attached to the substrate 21, the sealing cover 2 covers the upper surface of the display member 21G with the receiving slot 221, so that the display elements 21() are located in the receiving slot 221. Inside. Moreover, by sealing the contact surface of the package cover 22 with the substrate 21, the interior of the cavity 221 can be formed as a separate space that is closed and isolated from the external environment. It should be noted that, after the sealing of the package cover 22, one side of the package cover 22 may pass over the substrate 21 to form a convex end. The end 222, as shown in the figure, protrudes beyond the side wall of the substrate 21. In addition, in the package path 22 of the package cover 22, the heat conduction path 223 is distributed on the surface of the package 22 and extends to the protruding end 222. By the arrangement of the heat conduction path 223, the heat generated by the various electronic components on the substrate during the operation is guided by the heat conduction path 223 and flows toward the protruding end 222. As described above, since the projecting end 222 protrudes beyond the substrate 21, the surface of the projecting end 222 does not come into contact with the substrate 21 and is directly exposed to the outside environment. Therefore, when the heat conduction path 223 conducts the heat generated by the display element 210 to the convex end 222b, heat can be efficiently radiated to the external environment via the convex end 222. Of course, with the design requirements of the display, in different embodiments, all sides or portions of the side of the package cover may be exceed and protruded beyond the sides of the substrate. For example, in the embodiment of the present invention, the package cover 22 and the substrate 21 are both rectangular structures, and the package cover 22 has a side edge that protrudes beyond the sidewall of the substrate 21 to form the protruding end 222. However, when there are other requirements in the design of the display, the four sides of the package cover 2 2 can also exceed the four sides of the substrate 21, and the sides are formed into convex ends. Alternatively, any two sides or three sides of the package cover 22 may be protruded beyond the substrate 21 to form a desired projecting end. This system can be changed depending on the heat dissipation requirements, and will not be described here. In the preferred embodiment of the present invention, the display 2 further includes a heat dissipating element=23 disposed on the protruding end 222 of the package cover 22 to accelerate the heat dissipation efficiency of the package cover 22. Here, the heat dissipating member 23 can be selected from a heat sink made of a metal material. However, in the consideration of improving the heat dissipation effect, the heat dissipating component 23 may be formed by the Laiwu wind-emitting electronic device. As described above, please refer to the second figure, the heat conduction path 223 is wrapped around the periphery of the cavity 221 and extends. To the protruding end 222, the heat 1286912 of the substrate 21 can be guided to the protruding end 222. In a particular embodiment, the thermally conductive path 223 herein may be constructed of a thermally conductive line. Referring to the third figure, in this embodiment, a groove is formed on the inner surface of the package cover 22, and the groove 224 extends in a linear pattern on the surface of the package cover 22 and surrounds the cavity. A closed loop is formed around 221 . It is particularly pointed out that in order to enable the heat on the substrate 21 to be effectively guided to the projecting end 222, the recess extends from the end of the linear pattern and extends to the projecting end 222 to form an extended end 224a. In addition, in order to assemble the package cover 22 and the substrate 21 in the display 2, a layer of encapsulant 24 may be applied between the package cover 22 and the substrate 21 to bond the package cover 22 to the substrate 21, and The sealing effect between the package cover 22 and the substrate 21 causes the inside of the cavity 221 to be separated into a sealed space. ^ As shown in the third figure, the glue applied between the package cover 22 and the substrate 21 will form a sealed independent channel space with the recess 224. In the preferred embodiment, in order to enhance the effect of heat conduction, and optionally in the cells between the encapsulant 24^ slots 224, the thermally conductive material 225 is filled. By filling in the hole, the heat conduction line can be constructed, and the thermal energy on the substrate is diverged along the heat conduction path 223 in the figure. In particular, since the general display is in use, the _ panel is The plate surface is in an upright state, so the present invention is such that: the second unselectable & the output end 222 is located at the upper edge of the upright plate surface. That is, when the display 2 in the fth figure is upright, the convexity is convex. The end 222 and the heat dissipating component & are located on the side closer to the upper side of the full side display 2. In other words, when the = 22 and the substrate 21 are erected, the groove extending to the convex end is 10 1286912 as shown A heat pipe 226 is formed on the inner side of the package cover 22, which can be a hollow pipe structure embedded in the side walls of the four sides of the cavity 221 and the bottom plate of the cavity 221. Similarly, one end of the heat pipe 226 also extends. The protruding end 222. The heat pipe 226 is filled with a heat conductive material, and the heat pipe 226 constitutes a heat conduction line of the package cover, so that the heat of the substrate 21 can be dissipated along the heat conduction path. Of course, the heat pipe may not be buried in the side wall. And the inside of the bottom plate The inner tube is formed on the inner surface of the trough. One end of the heat pipe also extends to the protruding end to form a heat conducting path required by the present invention. In summary, the display provided by the present invention is disposed in the package cover thereof. The thermal path will effectively derivate the heat of the display element, thereby increasing the life of the display. Especially with the large size of the panel and the high resolution requirements, a large number of densely packed components will obviously make the display The problem of heat dissipation becomes more severe. In this case, the heat dissipation technology provided by the present invention obviously contributes to solving the problem of panel overheating, and has the effect thereof. The above description utilizes different embodiments to explain the present invention in detail, It is not intended to limit the scope of the present invention, and it is obvious to those skilled in the art that modifications may be made without departing from the spirit and scope of the invention. The first circle is a prior art. The package structure of the organic light emitting display is not intended. The second figure is a perspective view of a preferred embodiment of the display of the present invention. 12 1286912 The third figure is a schematic view along the AA / section line shown in the second figure. The fourth figure is a top view of the second embodiment of the present invention. The fifth figure is the second figure. In the embodiment, a sectional view along the BB / section line. [Main component symbol description]
2顯示器 161鰭片 10有機發光顯示器封裝結構 210顯示元件2 display 161 fin 10 organic light emitting display package structure 210 display component
12基板 14有機發光元件 16封裝蓋 21基板 22封裝蓋 23散熱元件 24封裝膠 221容槽 222凸出端 223導熱路徑 224凹槽 224a凹槽延伸端 225導熱材料 226熱管 1312 substrate 14 organic light-emitting element 16 package cover 21 substrate 22 package cover 23 heat-dissipating component 24 package adhesive 221 cavity 222 protruding end 223 heat-conducting path 224 groove 224a groove extension end 225 heat conductive material 226 heat pipe 13