TWI689460B - Electronic component material shifting device and its operating equipment - Google Patents
Electronic component material shifting device and its operating equipment Download PDFInfo
- Publication number
- TWI689460B TWI689460B TW108127592A TW108127592A TWI689460B TW I689460 B TWI689460 B TW I689460B TW 108127592 A TW108127592 A TW 108127592A TW 108127592 A TW108127592 A TW 108127592A TW I689460 B TWI689460 B TW I689460B
- Authority
- TW
- Taiwan
- Prior art keywords
- unit
- electronic component
- electronic components
- transfer
- picker
- Prior art date
Links
Images
Abstract
一種電子元件移料裝置,包含搬運單元、拾料單元及脫料單元,該搬運單元係設有作至少一方向位移之移載具,該拾料單元係裝配於移載具,並設有至少一拾料器,以拾取電子元件,該脫料單元係裝配於拾料單元,並於拾料器之周側設有脫料器,脫料器係供壓抵載框模組之膠膜脫離所黏附的電子元件,以利拾料器迅速取出電子元件,達到提高移料生產效能之實用效益。 An electronic component transfer device includes a transfer unit, a picking unit and a stripping unit. The transfer unit is provided with a transfer carrier for displacement in at least one direction. The picking unit is assembled on the transfer carrier and provided with at least A picker is used to pick up electronic components. The stripping unit is assembled to the picking unit, and a stripper is provided on the peripheral side of the picker. The stripper is used to release the pressure film that bears against the frame module. The adhered electronic components facilitate the picker to quickly take out the electronic components and achieve the practical benefit of improving the production efficiency of the material removal.
Description
本發明係提供一種利於拾料器迅速於膠膜上取出電子元件,進而提高移料生產效能之電子元件移料裝置。 The invention provides an electronic component material transferring device which is convenient for the picker to quickly take out electronic components on the adhesive film, thereby improving the material transferring production efficiency.
在現今,載框模組10係廣泛應用於承置電子元件而執行預設作業,例如載框模組10可承置一片晶圓執行切割作業,亦或承置複數個電子元件執行測試作業或濺鍍作業;以載框模組10承置複數個電子元件為例,請參閱第1圖,該載框模組10包含框架11及膠膜12,框架11係具有中空孔洞,並於底面貼覆有膠膜12,膠膜12則供黏附複數個電子元件13,工作人員即可將一具有複數個電子元件13之載框模組10搬運至作業設備而執行預設作業。
Nowadays, the frame-carrying
請參閱第2圖,電子元件作業設備係於機台上設置輸送器21,以輸送具已作業電子元件13之載框模組10,並於輸送器21之側方設有收料器22,以收置已作業之電子元件13,一移料裝置23係設有作第一、二方向(如X-Y方向)位移之移載具231,並於移載具231裝配一可作第三方向(如Z方向)位移之吸料器232,以吸取或釋放電子元件13,移載具231帶動吸料器232作X-Y方向位移至輸送器21之上方,吸料器232並作Z方向位移而於載框模組10之膠膜12上吸取出已作業之電子元件13,再由移載具231帶動位移至收料器22之上方,進而將已作業之電子
元件13移入收料器22收置;惟,由於已作業電子元件13之底面係全面性貼合於載框模組10之膠膜12上,在膠膜12具有一定黏著力的條件下,吸料器232僅利用本身之吸力著實不易於膠膜12上取出電子元件13,導致必須吸取電子元件13緩慢耗時逐漸脫離膠膜12,以致增加取料作業時間,尤其在電子元件13數量龐大的情況下,更加大幅影響作業設備之生產效能。
Please refer to FIG. 2, the electronic component working equipment is provided with a
本發明之目的一,係提供一種電子元件移料裝置,包含搬運單元、拾料單元及脫料單元,該搬運單元係設有作至少一方向位移之移載具,該拾料單元係裝配於移載具,並設有至少一拾料器,以拾取電子元件,該脫料單元係裝配於拾料單元,並於拾料器之周側設有具至少一脫料部件之脫料器,脫料器係供壓抵載框模組之膠膜脫離所黏附的電子元件,以利拾料器迅速取出電子元件,達到提高移料生產效能之實用效益。 The first object of the present invention is to provide an electronic component transfer device, which includes a transfer unit, a pick-up unit and a strip-out unit. The transfer unit is provided with a transfer device for displacement in at least one direction, and the pick-up unit is assembled in The carrier is equipped with at least one picker to pick up electronic components. The stripping unit is assembled to the picking unit, and a stripper with at least one stripping component is provided on the peripheral side of the picker. The stripper is for the adhesive film pressed against the load frame module to detach the adhered electronic components, so that the picker can quickly take out the electronic components, and achieve the practical benefit of improving the production efficiency of the material transfer.
本發明之目的二,係提供一種電子元件移料裝置,其中,該脫料單元係於脫料器之脫料部件設有導引部,以導引電子元件位於拾料器之取料作業範圍,而利於拾料單元之拾料器準確取料,達到提升移料使用效能之實用效益。 The second object of the present invention is to provide an electronic component material removal device, wherein the material removal unit is provided with a guide part in the material removal part of the material remover to guide the electronic component to be located in the material picking operation range of the material picker And it is beneficial to the accurate picking of the picker of the picking unit to achieve the practical benefit of improving the use efficiency of the material transfer.
本發明之目的三,係提供一種電子元件移料裝置,其更包含檢知單元,該檢知單元係裝配於脫料單元,並設有至少一檢知器,以供檢知拾料單元之拾料器是否移載電子元件,以防止拾料器空移至下一站裝置,達到有效檢知移料狀態及提升作業順暢性之實用效益。 The third object of the present invention is to provide an electronic component material removal device, which further includes a detection unit, the detection unit is assembled to the material removal unit, and is provided with at least one detector for detecting the picking unit Whether the picker is carrying electronic components, to prevent the picker from being moved to the next station device, and to achieve the practical benefits of effectively detecting the state of the material and improving the smoothness of the operation.
本發明之目的四,係提供一種電子元件移料裝置,其更包含頂料單元,該頂料單元係設有至少一作Z方向位移之頂料件,以於載框模組之膠膜 底面頂升電子元件,使電子元件之局部剝離膠膜,並搭配脫料單元,使得拾料器更快於膠膜上取出電子元件,以更加縮減取料時間,達到提高生產效能之實用效益。 The fourth object of the present invention is to provide an electronic component material removal device, which further includes a top material unit, the top material unit is provided with at least one top material for displacement in the Z direction, which is used for the adhesive film of the frame loading module The bottom surface lifts up the electronic components, so that the partial peeling of the adhesive film of the electronic components, together with the stripping unit, enables the picker to take out the electronic components from the adhesive film faster, so as to reduce the time for taking materials and achieve the practical benefit of improving production efficiency.
本發明之目的五,係提供一種應用電子元件移料裝置之作業設備,包含機台、供料裝置、收料裝置、本發明移料裝置及中央控制裝置,該供料裝置係配置於機台,並設有至少一供料承置器,以承置具電子元件之載框模組;該收料裝置係配置於機台,並設有至少一收料承置器,以收置電子元件;本發明之移料裝置係配置於機台,並包含搬運單元、拾料單元及脫料單元,以移載電子元件及使電子元件易於脫離載框模組之膠膜;該中央控制裝置係控制及整合各裝置作動,以執行自動化作業,達到提升生產效能之實用效益。 The fifth object of the present invention is to provide a working device using an electronic component shifting device, including a machine, a feeding device, a receiving device, a shifting device of the present invention and a central control device, the feeding device is arranged on the machine , And is equipped with at least one feeding holder to hold the frame module with electronic components; the receiving device is configured on the machine and is provided with at least one receiving holder to receive electronic components The material removal device of the present invention is configured on the machine and includes a conveying unit, a material picking unit and a material removal unit to transfer electronic components and make the electronic components easily detach from the adhesive film of the frame module; the central control device is Control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving production efficiency.
〔習知〕 〔Knowledge〕
10:載框模組 10: Frame module
11:框架 11: Frame
12:膠膜 12: film
13:電子元件 13: Electronic components
21:輸送器 21: Conveyor
22:收料器 22: Receiver
23:移料裝置 23: Material shifting device
231:移載具 231: Transfer vehicle
232:吸料器 232: Suction feeder
〔本發明〕 〔this invention〕
30:移料裝置 30: Material shifting device
311:移載具 311: Transfer vehicle
312:第一搬運驅動源 312: First handling drive source
313:第二搬運驅動源 313: Second handling drive source
321:拾料驅動源 321: Pickup drive source
322:夾具 322: Fixture
323:讓位部 323: Give way
33:脫料器 33: Stripper
331:容置空間 331: accommodating space
332:頂板 332: Top plate
3321:通孔 3321: through hole
333:第一側板 333: First side panel
3331:第一脫料部件 3331: First stripping part
3332:第一導引部 3332: The first guide
334:第二側板 334: Second side panel
3341:第二脫料部件 3341: Second stripping part
3342:第二導引部 3342: Second guide
34:檢知器 34: Detector
341:抽吸部 341: Suction section
342:連接桿 342: connecting rod
343:緩衝件 343: Cushion
351:頂料件 351: Top material
352:頂料驅動源 352: Top material driving source
40:機台 40: machine
50:供料裝置 50: feeding device
51:供料承置器 51: feeding holder
61:載框模組 61: Frame module
611:膠膜 611: film
612:電子元件 612: Electronic components
70:收料裝置 70: Receiving device
71:收料承置器 71: Receiver
第1圖:習知具電子元件之載框模組示意圖。 Figure 1: Schematic diagram of a conventional frame-carrying module with electronic components.
第2圖:習知移料裝置取出電子元件之示意圖。 Figure 2: A schematic diagram of the conventional material removal device for taking out electronic components.
第3圖:本發明移料裝置第一實施例之示意圖。 Figure 3: Schematic diagram of the first embodiment of the material transfer device of the present invention.
第4圖:本發明移料裝置第一實施例之局部示意圖。 Figure 4: Partial schematic view of the first embodiment of the material transfer device of the present invention.
第5圖:本發明移料裝置第一實施例之使用示意圖(一)。 Fig. 5: The use schematic diagram (1) of the first embodiment of the material transfer device of the present invention.
第6圖:本發明移料裝置第一實施例之使用示意圖(二)。 Figure 6: A schematic view of the use of the first embodiment of the material transfer device of the present invention (2).
第7圖:本發明移料裝置第一實施例之使用示意圖(三)。 Fig. 7: A schematic view (3) of the first embodiment of the material transfer device of the present invention.
第8圖:本發明移料裝置第一實施例之使用示意圖(四)。 Fig. 8: A schematic view (4) of the first embodiment of the material transfer device of the present invention.
第9圖:本發明移料裝置第一實施例之使用示意圖(五)。 Fig. 9: A schematic view (5) of the first embodiment of the material transfer device of the present invention.
第10圖:本發明移料裝置第二實施例之示意圖。 Figure 10: A schematic diagram of a second embodiment of the material transfer device of the present invention.
第11圖:係移料裝置第二實施例應用於作業設備之示意圖。 Fig. 11: A schematic diagram of a second embodiment of a material removal device applied to a working device.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3、4圖,本發明移料裝置30之第一實施例包含搬運單元、拾料單元及脫料單元,更包含檢知單元,該搬運單元係設有作至少一方向位移之移載具311,更進一步,搬運單元係設有搬運驅動器,以驅動移載具311作至少一方向位移,於本實施例中,搬運驅動器係設有第一搬運驅動源312及第二搬運驅動源313,第一搬運驅動源312係裝配連結移載具311,以驅動移載具311作X-Y方向位移,第二搬運驅動源313係呈Z方向配置於移載具311上。
In order for your reviewer to understand the present invention further, a preferred embodiment is given in conjunction with the drawings. The details are as follows: please refer to FIGS. 3 and 4. The first embodiment of the
該拾料單元係裝配於搬運單元,並設有至少一拾料器,以拾取電子元件,更進一步,拾料器可直接裝配於搬運單元之移載具311,或裝配於移載具311上之第二搬運驅動源313,拾料器可為吸料器或夾料器,於本實施例中,拾料器係為夾料器,包含拾料驅動源321及二夾具322,拾料驅動源321係裝配連結搬運單元之第二搬運驅動源313,而由搬運單元之第一搬運驅動源312及第二搬運驅動源313驅動作X-Y-Z方向位移,二夾具322係由拾料驅動源321驅動作夾持或釋放電子元件,更進一步,至少一夾具322係設有讓位部323,於本實施例中,二夾具322分別設有呈開口槽狀之讓位部323。
The picking unit is assembled to the handling unit and is provided with at least one picker to pick up electronic components. Furthermore, the picker can be directly mounted on the
該脫料單元係裝配於拾料單元,並於拾料器之周側設有至少一脫料器33,脫料器33係供壓抵載框模組之膠膜脫離所黏附之電子元件,更進
一步,脫料器33係設有至少一脫料部件,以供壓抵載框模組之膠膜,脫料部件設有至少一導引部,於本實施例中,脫料器33之內部設有一容置空間331,並以頂板332裝配於拾料單元之拾料驅動源321底部,使脫料器33位於二夾具322之間,頂板332並開設有通孔3321,脫料器33係於二相對的第一側板333分別向下延伸設有第一脫料部件3331,第一脫料部件3331並穿伸出二夾具322之讓位部323,二第一脫料部件3331之內面則設有呈斜面之第一導引部3332,又脫料器33係於另二相對的第二側板334分別向下延伸設有第二脫料部件3341,第二脫料部件3341之內面則設有呈斜面之第二導引部3342,以利用第一導引部3332及第二導引部3342導引電子元件位於拾料器之取料作業範圍(即二夾具322之間),而利於拾料器準確取料。
The stripping unit is assembled to the picking unit, and at least one
該檢知單元係裝配於脫料單元,並設有至少一檢知器,以供檢知拾料單元之拾料器是否移載電子元件,更進一步,檢知器可為吸料器或取像器或光纖感應器,於本實施例中,檢知單元係於脫料單元之脫料器33的容置空間331設有一為吸料器之檢知器34,該檢知器34設有至少一可供吸附電子元件之抽吸部341,另於檢知器34之頂面設有連接桿342及緩衝件343,連接桿342之第一端係連結檢知器34,而第二端穿伸出脫料器33之通孔3321而連結拾料驅動源321,緩衝件343可位於檢知器34與脫料器33之間,或位於檢知器34與拾料器之間,緩衝件343可為氣囊或膜片或彈性件,於本實施例中,緩衝件343係為彈性件,並套置於連接桿342之外部,使檢知器34可緩衝位移。
The detection unit is assembled in the unloading unit, and is provided with at least one detector for detecting whether the picker of the picking unit transfers electronic components. Furthermore, the detector can be a suction device or a picker In this embodiment, the detection unit is located in the
請參閱第5圖,電子元件作業設備係以供料裝置50之供料承置器51承載一具膠膜611之載框模組61,膠膜611上黏附複數個電子元件612,移料裝置之搬運單元係以第一搬運驅動源312驅動移載具311作X-Y方向位移,移載具311即帶動拾料單元及脫料單元等位移至載框模組61之膠膜611上方,令拾料單元之二夾具322對位於電子元件612。
Please refer to FIG. 5, the electronic component operation equipment is a
請參閱第5、6圖,搬運單元係以第二搬運驅動源313驅動拾料器、脫料器33及檢知器34同步作Z方向向下位移,由於脫料器33之二第一脫料部件3331及二第二脫料部件3341之底面位置係低於二夾具322之底面位置,使得二第一脫料部件3331及二第二脫料部件3341會先接觸膠膜611,並利用二第一導引部3332及二第二導引部3342導引電子元件612位於二第一脫料部件3331及二第二脫料部件3341之間(即位於二夾具322之取料作業範圍),二第一脫料部件3331及二第二脫料部件3341即壓抵電子元件612四周側之膠膜611,令膠膜611受到一向下撕離力量而剝離電子元件612,以大幅降低膠膜611對電子元件612之黏著力,由於檢知器34位於脫料器33之容置空間331,使得檢知器34之抽吸部341貼接於電子元件612之頂面,並受到電子元件612之頂推而作Z方向向上緩衝位移,且壓縮緩衝件343,檢知器34即以抽吸部341抽吸電子元件612,並將抽吸到電子元件612之檢知訊號傳輸至中央控制裝置(圖未示出),以檢知該拾料器已取出電子元件612,以防止拾料器空移至下一站裝置,反之,若檢知器34之抽吸部341無抽吸到電子元件612而呈現破真空狀態
,則代表二夾具322之間並無電子元件,中央控制裝置則發出異常訊號通知工作人員,以即時停機排除異常;因此,檢知單元可有效檢知該拾料單元之移料狀態,進而提升整體作業之順暢性。
Please refer to figures 5 and 6. The conveying unit uses the second conveying
請參閱第5、7、8圖,當電子元件612位於脫料器33之二第一脫料部件3331及二第二脫料部件3341之間後,亦即電子元件612位於拾料器之二夾具322間,拾料單元之拾料驅動源321即驅動二夾具322作相對位移而夾持電子元件612;接著該搬運單元之第二搬運驅動源313驅動拾料器、脫料器33及檢知器34同步作Z方向向上位移,令拾料器之二夾具322夾持電子元件612向上位移而完全剝離膠膜611,由於二第一脫料部件3331及二第二脫料部件3341已先行壓抵部分膠膜611剝離電子元件612,而大幅降低膠膜611之黏著力,使得二夾具322可迅速於膠膜611上取出電子元件612,以提高移料作業效能。
Please refer to figures 5, 7 and 8, when the
請參閱第5、9圖,於拾料器之二夾具322取出電子元件612後,搬運單元係以第一搬運驅動源312驅動移載具311作X-Y方向位移,移載具311即帶動二夾具322及電子元件612等位移至收料裝置70之收料承置器71上方,搬運單元再以第二搬運驅動源313驅動二夾具322及電子元件612作Z方向向下位移,使二夾具322將電子元件612移入收料承置器71,檢知器34之抽吸部341則釋放電子元件612,使電子元件612平穩收置於收料承置器71。
Please refer to Figs. 5 and 9, after the
請參閱第3、4、10圖,本發明移料裝置30之第二實施例,亦包含搬運單元、拾料單元、脫料單元及檢知單元,第二實施例與第一實施例之差異在於移料裝置30更包含頂料單元,該頂料單元係設有至少
一頂料器,以於載框模組之膠膜底面頂升電子元件,於本實施例中,頂料單元係於機台40上設有頂料器,頂料器包含頂料件351及頂料驅動源352,頂料件351係為滾輪,頂料驅動源352係連結驅動頂料件351作Z方向位移,以於載框模組之膠膜611底面頂升電子元件612,使電子元件612之局部先行剝離膠膜611,並搭配脫料單元,使得拾料器更快於膠膜611上取出電子元件612,以更加縮減取料時間,進而提高生產效能。
Please refer to FIGS. 3, 4, and 10. The second embodiment of the
請參閱第3、4、11圖,係本發明移料裝置之第二實施例應用於電子元件作業設備之示意圖,作業設備係於機台40上配置有供料裝置50、收料裝置70、本發明移料裝置30及中央控制裝置(圖未示出);該供料裝置50係裝配於機台40,並設有至少一供料承置器51,以承置具電子元件612之載框模組61;該收料裝置70係裝配於機台40,並設有至少一收料承置器71,以容納至少一電子元件;本發明移料裝置30係配置於機台40,包含搬運單元、拾料單元及脫料單元,於本實施例中,更包含檢知單元及頂料單元,搬運單元之第一、二搬運驅動源312、313經移載具311而帶動拾料單元之二夾具322位移至供料承置器51之載框模組61上方,並驅動脫料單元之二第一脫料部件3331及二第二脫料部件3341先行壓抵載框模組61之膠膜611剝離電子元件612,再使拾料單元之二夾具322迅速於膠膜611上取出電子元件612,搬運單元之第一、二搬運驅動源312、313再驅動二夾具322將電子元件612移載至收料裝置70之收料承置器71收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to FIGS. 3, 4, and 11 for schematic diagrams of the second embodiment of the material removal device of the present invention applied to electronic component work equipment. The work equipment is equipped with a
321:拾料驅動源 321: Pickup drive source
322:夾具 322: Fixture
323:讓位部 323: Give way
33:脫料器 33: Stripper
331:容置空間 331: accommodating space
332:頂板 332: Top plate
3321:通孔 3321: through hole
333:第一側板 333: First side panel
3331:第一脫料部件 3331: First stripping part
3332:第一導引部 3332: The first guide
334:第二側板 334: Second side panel
3341:第二脫料部件 3341: Second stripping part
3342:第二導引部 3342: Second guide
34:檢知器 34: Detector
341:抽吸部 341: Suction section
342:連接桿 342: connecting rod
343:緩衝件 343: Cushion
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108127592A TWI689460B (en) | 2019-08-02 | 2019-08-02 | Electronic component material shifting device and its operating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108127592A TWI689460B (en) | 2019-08-02 | 2019-08-02 | Electronic component material shifting device and its operating equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI689460B true TWI689460B (en) | 2020-04-01 |
TW202106597A TW202106597A (en) | 2021-02-16 |
Family
ID=71134614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108127592A TWI689460B (en) | 2019-08-02 | 2019-08-02 | Electronic component material shifting device and its operating equipment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI689460B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI741674B (en) * | 2020-07-10 | 2021-10-01 | 鴻勁精密股份有限公司 | Electronic component operation apparatus and operational equipment using the same |
CN113732688A (en) * | 2021-08-27 | 2021-12-03 | 浙江朗森智能科技有限公司 | Valve body assembling equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000142936A (en) * | 1998-11-12 | 2000-05-23 | Matsushita Electric Ind Co Ltd | Conveying device |
KR101640525B1 (en) * | 2015-01-12 | 2016-07-19 | 한미반도체 주식회사 | Pick and placement device |
CN108238441A (en) * | 2016-12-27 | 2018-07-03 | 张家港康得新光电材料有限公司 | Diaphragm pick device |
-
2019
- 2019-08-02 TW TW108127592A patent/TWI689460B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000142936A (en) * | 1998-11-12 | 2000-05-23 | Matsushita Electric Ind Co Ltd | Conveying device |
KR101640525B1 (en) * | 2015-01-12 | 2016-07-19 | 한미반도체 주식회사 | Pick and placement device |
CN108238441A (en) * | 2016-12-27 | 2018-07-03 | 张家港康得新光电材料有限公司 | Diaphragm pick device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI741674B (en) * | 2020-07-10 | 2021-10-01 | 鴻勁精密股份有限公司 | Electronic component operation apparatus and operational equipment using the same |
CN113732688A (en) * | 2021-08-27 | 2021-12-03 | 浙江朗森智能科技有限公司 | Valve body assembling equipment |
CN113732688B (en) * | 2021-08-27 | 2022-06-21 | 浙江朗森智能科技有限公司 | Valve body assembling equipment |
Also Published As
Publication number | Publication date |
---|---|
TW202106597A (en) | 2021-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI689460B (en) | Electronic component material shifting device and its operating equipment | |
CN107481958B (en) | Alignment bonding equipment and alignment bonding method | |
TW201634292A (en) | Method for peeling off board covering film | |
KR20110076302A (en) | Labeller of tire tread | |
KR20190024631A (en) | Method and apparatus for separating adhesive tape | |
KR20170127650A (en) | Collect cleaning module and die bonding apparatus having the same | |
CN107613448B (en) | Electroacoustic device assembling equipment | |
CN214918223U (en) | Busbar automatic feeding positioning device | |
KR20060051117A (en) | Parts transferring apparatus | |
CN112499207B (en) | Laminating device | |
CN113260249B (en) | Bonding equipment | |
KR101719168B1 (en) | Detaching picker module within pick and place system for wafer ring frame type | |
TWI545073B (en) | A device for the operation of a pickup - type electronic component picker and its application | |
JPH06263275A (en) | One sheet taking off method and one sheet taking-off device for plate material | |
CN213769278U (en) | Automatic unloading equipment on non-setting adhesive label paper that pastes of robot | |
TWI648808B (en) | Electronic component pick-and-place unit and its application classification equipment | |
JPH0397560A (en) | Laminating device | |
TWI672082B (en) | Working device and its application equipment | |
TWI622777B (en) | Electronic component picking test classification equipment | |
JP3630938B2 (en) | Thin sticker automatic sticking method and apparatus | |
KR20090018539A (en) | Apparatus for manufacturing semiconductor packages | |
CN112261540B (en) | Gauze assembly device | |
CN112404975B (en) | Gauze equipment | |
KR102516448B1 (en) | Die ejecting apparatus and dis bonding equipment including the same | |
CN210759695U (en) | Film tearing device |