TWI689460B - Electronic component material shifting device and its operating equipment - Google Patents

Electronic component material shifting device and its operating equipment Download PDF

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TWI689460B
TWI689460B TW108127592A TW108127592A TWI689460B TW I689460 B TWI689460 B TW I689460B TW 108127592 A TW108127592 A TW 108127592A TW 108127592 A TW108127592 A TW 108127592A TW I689460 B TWI689460 B TW I689460B
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unit
electronic component
electronic components
transfer
picker
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TW108127592A
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TW202106597A (en
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陳炅煜
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鴻勁精密股份有限公司
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一種電子元件移料裝置,包含搬運單元、拾料單元及脫料單元,該搬運單元係設有作至少一方向位移之移載具,該拾料單元係裝配於移載具,並設有至少一拾料器,以拾取電子元件,該脫料單元係裝配於拾料單元,並於拾料器之周側設有脫料器,脫料器係供壓抵載框模組之膠膜脫離所黏附的電子元件,以利拾料器迅速取出電子元件,達到提高移料生產效能之實用效益。 An electronic component transfer device includes a transfer unit, a picking unit and a stripping unit. The transfer unit is provided with a transfer carrier for displacement in at least one direction. The picking unit is assembled on the transfer carrier and provided with at least A picker is used to pick up electronic components. The stripping unit is assembled to the picking unit, and a stripper is provided on the peripheral side of the picker. The stripper is used to release the pressure film that bears against the frame module. The adhered electronic components facilitate the picker to quickly take out the electronic components and achieve the practical benefit of improving the production efficiency of the material removal.

Description

電子元件移料裝置及其應用之作業設備 Electronic component material shifting device and its operating equipment

本發明係提供一種利於拾料器迅速於膠膜上取出電子元件,進而提高移料生產效能之電子元件移料裝置。 The invention provides an electronic component material transferring device which is convenient for the picker to quickly take out electronic components on the adhesive film, thereby improving the material transferring production efficiency.

在現今,載框模組10係廣泛應用於承置電子元件而執行預設作業,例如載框模組10可承置一片晶圓執行切割作業,亦或承置複數個電子元件執行測試作業或濺鍍作業;以載框模組10承置複數個電子元件為例,請參閱第1圖,該載框模組10包含框架11及膠膜12,框架11係具有中空孔洞,並於底面貼覆有膠膜12,膠膜12則供黏附複數個電子元件13,工作人員即可將一具有複數個電子元件13之載框模組10搬運至作業設備而執行預設作業。 Nowadays, the frame-carrying module 10 is widely used to support electronic components to perform preset operations. For example, the frame-carrying module 10 can support a wafer to perform cutting operations, or a plurality of electronic components to perform test operations or Sputtering operation; take the frame frame module 10 for supporting multiple electronic components as an example, please refer to FIG. 1, the frame frame module 10 includes a frame 11 and an adhesive film 12, the frame 11 has a hollow hole, and is attached to the bottom surface Covered with an adhesive film 12, the adhesive film 12 is used for adhering a plurality of electronic components 13, so that a worker can transfer a frame-bearing module 10 with a plurality of electronic components 13 to a working device to perform a preset operation.

請參閱第2圖,電子元件作業設備係於機台上設置輸送器21,以輸送具已作業電子元件13之載框模組10,並於輸送器21之側方設有收料器22,以收置已作業之電子元件13,一移料裝置23係設有作第一、二方向(如X-Y方向)位移之移載具231,並於移載具231裝配一可作第三方向(如Z方向)位移之吸料器232,以吸取或釋放電子元件13,移載具231帶動吸料器232作X-Y方向位移至輸送器21之上方,吸料器232並作Z方向位移而於載框模組10之膠膜12上吸取出已作業之電子元件13,再由移載具231帶動位移至收料器22之上方,進而將已作業之電子 元件13移入收料器22收置;惟,由於已作業電子元件13之底面係全面性貼合於載框模組10之膠膜12上,在膠膜12具有一定黏著力的條件下,吸料器232僅利用本身之吸力著實不易於膠膜12上取出電子元件13,導致必須吸取電子元件13緩慢耗時逐漸脫離膠膜12,以致增加取料作業時間,尤其在電子元件13數量龐大的情況下,更加大幅影響作業設備之生產效能。 Please refer to FIG. 2, the electronic component working equipment is provided with a conveyor 21 on the machine platform to convey the frame module 10 with the electronic components 13 already operated, and a receiver 22 is provided on the side of the conveyor 21, In order to store the electronic components 13 that have been operated, a material-moving device 23 is provided with a moving carrier 231 that is displaced in the first and second directions (such as the XY direction), and a third direction is mounted on the moving carrier 231 ( For example, the suction device 232 that is displaced in the Z direction sucks or releases the electronic component 13. The carrier 231 drives the suction device 232 to move in the XY direction to the conveyor 21, and the suction device 232 moves in the Z direction to The adhesive film 12 of the frame module 10 sucks and extracts the electronic components 13 that have been operated, and then is moved by the transfer carrier 231 to the top of the receiver 22, and then the electronic The component 13 is moved into the receiver 22 for storage; however, since the bottom surface of the electronic component 13 that has been operated is fully attached to the adhesive film 12 of the frame module 10, under the condition that the adhesive film 12 has a certain adhesive force, The feeder 232 is not easy to take out the electronic component 13 from the adhesive film 12 only by its own suction force, resulting in that the electronic component 13 must be sucked away slowly and gradually detached from the adhesive film 12, so as to increase the retrieving operation time, especially in the large number of electronic components 13 Under the circumstances, it will greatly affect the production efficiency of the operating equipment.

本發明之目的一,係提供一種電子元件移料裝置,包含搬運單元、拾料單元及脫料單元,該搬運單元係設有作至少一方向位移之移載具,該拾料單元係裝配於移載具,並設有至少一拾料器,以拾取電子元件,該脫料單元係裝配於拾料單元,並於拾料器之周側設有具至少一脫料部件之脫料器,脫料器係供壓抵載框模組之膠膜脫離所黏附的電子元件,以利拾料器迅速取出電子元件,達到提高移料生產效能之實用效益。 The first object of the present invention is to provide an electronic component transfer device, which includes a transfer unit, a pick-up unit and a strip-out unit. The transfer unit is provided with a transfer device for displacement in at least one direction, and the pick-up unit is assembled in The carrier is equipped with at least one picker to pick up electronic components. The stripping unit is assembled to the picking unit, and a stripper with at least one stripping component is provided on the peripheral side of the picker. The stripper is for the adhesive film pressed against the load frame module to detach the adhered electronic components, so that the picker can quickly take out the electronic components, and achieve the practical benefit of improving the production efficiency of the material transfer.

本發明之目的二,係提供一種電子元件移料裝置,其中,該脫料單元係於脫料器之脫料部件設有導引部,以導引電子元件位於拾料器之取料作業範圍,而利於拾料單元之拾料器準確取料,達到提升移料使用效能之實用效益。 The second object of the present invention is to provide an electronic component material removal device, wherein the material removal unit is provided with a guide part in the material removal part of the material remover to guide the electronic component to be located in the material picking operation range of the material picker And it is beneficial to the accurate picking of the picker of the picking unit to achieve the practical benefit of improving the use efficiency of the material transfer.

本發明之目的三,係提供一種電子元件移料裝置,其更包含檢知單元,該檢知單元係裝配於脫料單元,並設有至少一檢知器,以供檢知拾料單元之拾料器是否移載電子元件,以防止拾料器空移至下一站裝置,達到有效檢知移料狀態及提升作業順暢性之實用效益。 The third object of the present invention is to provide an electronic component material removal device, which further includes a detection unit, the detection unit is assembled to the material removal unit, and is provided with at least one detector for detecting the picking unit Whether the picker is carrying electronic components, to prevent the picker from being moved to the next station device, and to achieve the practical benefits of effectively detecting the state of the material and improving the smoothness of the operation.

本發明之目的四,係提供一種電子元件移料裝置,其更包含頂料單元,該頂料單元係設有至少一作Z方向位移之頂料件,以於載框模組之膠膜 底面頂升電子元件,使電子元件之局部剝離膠膜,並搭配脫料單元,使得拾料器更快於膠膜上取出電子元件,以更加縮減取料時間,達到提高生產效能之實用效益。 The fourth object of the present invention is to provide an electronic component material removal device, which further includes a top material unit, the top material unit is provided with at least one top material for displacement in the Z direction, which is used for the adhesive film of the frame loading module The bottom surface lifts up the electronic components, so that the partial peeling of the adhesive film of the electronic components, together with the stripping unit, enables the picker to take out the electronic components from the adhesive film faster, so as to reduce the time for taking materials and achieve the practical benefit of improving production efficiency.

本發明之目的五,係提供一種應用電子元件移料裝置之作業設備,包含機台、供料裝置、收料裝置、本發明移料裝置及中央控制裝置,該供料裝置係配置於機台,並設有至少一供料承置器,以承置具電子元件之載框模組;該收料裝置係配置於機台,並設有至少一收料承置器,以收置電子元件;本發明之移料裝置係配置於機台,並包含搬運單元、拾料單元及脫料單元,以移載電子元件及使電子元件易於脫離載框模組之膠膜;該中央控制裝置係控制及整合各裝置作動,以執行自動化作業,達到提升生產效能之實用效益。 The fifth object of the present invention is to provide a working device using an electronic component shifting device, including a machine, a feeding device, a receiving device, a shifting device of the present invention and a central control device, the feeding device is arranged on the machine , And is equipped with at least one feeding holder to hold the frame module with electronic components; the receiving device is configured on the machine and is provided with at least one receiving holder to receive electronic components The material removal device of the present invention is configured on the machine and includes a conveying unit, a material picking unit and a material removal unit to transfer electronic components and make the electronic components easily detach from the adhesive film of the frame module; the central control device is Control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving production efficiency.

〔習知〕 〔Knowledge〕

10:載框模組 10: Frame module

11:框架 11: Frame

12:膠膜 12: film

13:電子元件 13: Electronic components

21:輸送器 21: Conveyor

22:收料器 22: Receiver

23:移料裝置 23: Material shifting device

231:移載具 231: Transfer vehicle

232:吸料器 232: Suction feeder

〔本發明〕 〔this invention〕

30:移料裝置 30: Material shifting device

311:移載具 311: Transfer vehicle

312:第一搬運驅動源 312: First handling drive source

313:第二搬運驅動源 313: Second handling drive source

321:拾料驅動源 321: Pickup drive source

322:夾具 322: Fixture

323:讓位部 323: Give way

33:脫料器 33: Stripper

331:容置空間 331: accommodating space

332:頂板 332: Top plate

3321:通孔 3321: through hole

333:第一側板 333: First side panel

3331:第一脫料部件 3331: First stripping part

3332:第一導引部 3332: The first guide

334:第二側板 334: Second side panel

3341:第二脫料部件 3341: Second stripping part

3342:第二導引部 3342: Second guide

34:檢知器 34: Detector

341:抽吸部 341: Suction section

342:連接桿 342: connecting rod

343:緩衝件 343: Cushion

351:頂料件 351: Top material

352:頂料驅動源 352: Top material driving source

40:機台 40: machine

50:供料裝置 50: feeding device

51:供料承置器 51: feeding holder

61:載框模組 61: Frame module

611:膠膜 611: film

612:電子元件 612: Electronic components

70:收料裝置 70: Receiving device

71:收料承置器 71: Receiver

第1圖:習知具電子元件之載框模組示意圖。 Figure 1: Schematic diagram of a conventional frame-carrying module with electronic components.

第2圖:習知移料裝置取出電子元件之示意圖。 Figure 2: A schematic diagram of the conventional material removal device for taking out electronic components.

第3圖:本發明移料裝置第一實施例之示意圖。 Figure 3: Schematic diagram of the first embodiment of the material transfer device of the present invention.

第4圖:本發明移料裝置第一實施例之局部示意圖。 Figure 4: Partial schematic view of the first embodiment of the material transfer device of the present invention.

第5圖:本發明移料裝置第一實施例之使用示意圖(一)。 Fig. 5: The use schematic diagram (1) of the first embodiment of the material transfer device of the present invention.

第6圖:本發明移料裝置第一實施例之使用示意圖(二)。 Figure 6: A schematic view of the use of the first embodiment of the material transfer device of the present invention (2).

第7圖:本發明移料裝置第一實施例之使用示意圖(三)。 Fig. 7: A schematic view (3) of the first embodiment of the material transfer device of the present invention.

第8圖:本發明移料裝置第一實施例之使用示意圖(四)。 Fig. 8: A schematic view (4) of the first embodiment of the material transfer device of the present invention.

第9圖:本發明移料裝置第一實施例之使用示意圖(五)。 Fig. 9: A schematic view (5) of the first embodiment of the material transfer device of the present invention.

第10圖:本發明移料裝置第二實施例之示意圖。 Figure 10: A schematic diagram of a second embodiment of the material transfer device of the present invention.

第11圖:係移料裝置第二實施例應用於作業設備之示意圖。 Fig. 11: A schematic diagram of a second embodiment of a material removal device applied to a working device.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3、4圖,本發明移料裝置30之第一實施例包含搬運單元、拾料單元及脫料單元,更包含檢知單元,該搬運單元係設有作至少一方向位移之移載具311,更進一步,搬運單元係設有搬運驅動器,以驅動移載具311作至少一方向位移,於本實施例中,搬運驅動器係設有第一搬運驅動源312及第二搬運驅動源313,第一搬運驅動源312係裝配連結移載具311,以驅動移載具311作X-Y方向位移,第二搬運驅動源313係呈Z方向配置於移載具311上。 In order for your reviewer to understand the present invention further, a preferred embodiment is given in conjunction with the drawings. The details are as follows: please refer to FIGS. 3 and 4. The first embodiment of the material transfer device 30 of the present invention includes The conveying unit, the picking unit and the unloading unit further include a detection unit. The conveying unit is provided with a transfer carrier 311 that is displaced in at least one direction. Furthermore, the transfer unit is provided with a transfer driver to drive the transfer carrier The 311 is displaced in at least one direction. In this embodiment, the conveying driver is provided with a first conveying drive source 312 and a second conveying drive source 313. The first conveying drive source 312 is equipped with a transfer carrier 311 to drive the transfer The tool 311 is displaced in the XY direction, and the second transport driving source 313 is disposed on the transfer tool 311 in the Z direction.

該拾料單元係裝配於搬運單元,並設有至少一拾料器,以拾取電子元件,更進一步,拾料器可直接裝配於搬運單元之移載具311,或裝配於移載具311上之第二搬運驅動源313,拾料器可為吸料器或夾料器,於本實施例中,拾料器係為夾料器,包含拾料驅動源321及二夾具322,拾料驅動源321係裝配連結搬運單元之第二搬運驅動源313,而由搬運單元之第一搬運驅動源312及第二搬運驅動源313驅動作X-Y-Z方向位移,二夾具322係由拾料驅動源321驅動作夾持或釋放電子元件,更進一步,至少一夾具322係設有讓位部323,於本實施例中,二夾具322分別設有呈開口槽狀之讓位部323。 The picking unit is assembled to the handling unit and is provided with at least one picker to pick up electronic components. Furthermore, the picker can be directly mounted on the transfer carrier 311 of the transfer unit or on the transfer carrier 311 The second transport driving source 313, the picker may be a suction device or a gripper, in this embodiment, the picker is a gripper, including a picking drive source 321 and two clamps 322, picking drive The source 321 is equipped with a second conveying drive source 313 connected to the conveying unit, and the first conveying drive source 312 and the second conveying drive source 313 of the conveying unit are driven for displacement in the XYZ direction, and the two clamps 322 are driven by the picking drive source 321 For clamping or releasing electronic components, furthermore, at least one clamp 322 is provided with a yielding portion 323. In this embodiment, two clamps 322 are respectively provided with an opening groove-shaped yielding portion 323.

該脫料單元係裝配於拾料單元,並於拾料器之周側設有至少一脫料器33,脫料器33係供壓抵載框模組之膠膜脫離所黏附之電子元件,更進 一步,脫料器33係設有至少一脫料部件,以供壓抵載框模組之膠膜,脫料部件設有至少一導引部,於本實施例中,脫料器33之內部設有一容置空間331,並以頂板332裝配於拾料單元之拾料驅動源321底部,使脫料器33位於二夾具322之間,頂板332並開設有通孔3321,脫料器33係於二相對的第一側板333分別向下延伸設有第一脫料部件3331,第一脫料部件3331並穿伸出二夾具322之讓位部323,二第一脫料部件3331之內面則設有呈斜面之第一導引部3332,又脫料器33係於另二相對的第二側板334分別向下延伸設有第二脫料部件3341,第二脫料部件3341之內面則設有呈斜面之第二導引部3342,以利用第一導引部3332及第二導引部3342導引電子元件位於拾料器之取料作業範圍(即二夾具322之間),而利於拾料器準確取料。 The stripping unit is assembled to the picking unit, and at least one stripper 33 is provided on the peripheral side of the picker. The stripper 33 is used to press the adhesive film of the load frame module to detach the adhered electronic components. Go further In one step, the stripper 33 is provided with at least one stripping part for pressing against the adhesive film of the frame module, and the stripping part is provided with at least one guide part. In this embodiment, the inside of the stripper 33 An accommodating space 331 is provided, and the top plate 332 is assembled to the bottom of the picking drive source 321 of the picking unit, so that the stripper 33 is located between the two clamps 322. The top plate 332 is also provided with a through hole 3321, and the stripper 33 is a series On the two opposing first side plates 333, a first stripping member 3331 is extended downwards, the first stripping member 3331 extends through the yielding portion 323 of the two clamps 322, and the inner surface of the two first stripping members 3331 Then, a first guide portion 3332 with an inclined surface is provided, and the stripper 33 is attached to the two opposite second side plates 334, and a second stripping member 3341 is provided downward, and the inner surface of the second stripping member 3341 is provided. A second guide portion 3342 with a slope is provided to use the first guide portion 3332 and the second guide portion 3342 to guide the electronic component to be located in the picking operation range of the picker (that is, between the two clamps 322), And it is helpful for the picker to accurately take the material.

該檢知單元係裝配於脫料單元,並設有至少一檢知器,以供檢知拾料單元之拾料器是否移載電子元件,更進一步,檢知器可為吸料器或取像器或光纖感應器,於本實施例中,檢知單元係於脫料單元之脫料器33的容置空間331設有一為吸料器之檢知器34,該檢知器34設有至少一可供吸附電子元件之抽吸部341,另於檢知器34之頂面設有連接桿342及緩衝件343,連接桿342之第一端係連結檢知器34,而第二端穿伸出脫料器33之通孔3321而連結拾料驅動源321,緩衝件343可位於檢知器34與脫料器33之間,或位於檢知器34與拾料器之間,緩衝件343可為氣囊或膜片或彈性件,於本實施例中,緩衝件343係為彈性件,並套置於連接桿342之外部,使檢知器34可緩衝位移。 The detection unit is assembled in the unloading unit, and is provided with at least one detector for detecting whether the picker of the picking unit transfers electronic components. Furthermore, the detector can be a suction device or a picker In this embodiment, the detection unit is located in the accommodating space 331 of the stripper 33 of the stripping unit, and a detector 34 as a suction device is provided. At least one suction part 341 for attracting electronic components, and a connecting rod 342 and a buffer member 343 are provided on the top surface of the detector 34, the first end of the connecting rod 342 is connected to the detector 34, and the second end The through hole 3321 extending through the stripper 33 is connected to the pickup driving source 321, and the buffer 343 may be located between the detector 34 and the stripper 33, or between the detector 34 and the picker to buffer The member 343 may be an airbag, a diaphragm, or an elastic member. In this embodiment, the buffer member 343 is an elastic member, and is sleeved outside the connecting rod 342, so that the detector 34 can buffer the displacement.

請參閱第5圖,電子元件作業設備係以供料裝置50之供料承置器51承載一具膠膜611之載框模組61,膠膜611上黏附複數個電子元件612,移料裝置之搬運單元係以第一搬運驅動源312驅動移載具311作X-Y方向位移,移載具311即帶動拾料單元及脫料單元等位移至載框模組61之膠膜611上方,令拾料單元之二夾具322對位於電子元件612。 Please refer to FIG. 5, the electronic component operation equipment is a feed frame 51 of the feed device 50 carrying a frame module 61 with a glue film 611, a plurality of electronic components 612 are adhered to the glue film 611, and a material removal device The conveying unit is driven by the first conveying driving source 312 to move the carrier 311 for XY direction displacement. The carrier 311 drives the picking unit and the unloading unit to move above the film 611 of the carrier frame module 61 to make the picking The pair of clamps 322 of the material unit is located at the electronic component 612.

請參閱第5、6圖,搬運單元係以第二搬運驅動源313驅動拾料器、脫料器33及檢知器34同步作Z方向向下位移,由於脫料器33之二第一脫料部件3331及二第二脫料部件3341之底面位置係低於二夾具322之底面位置,使得二第一脫料部件3331及二第二脫料部件3341會先接觸膠膜611,並利用二第一導引部3332及二第二導引部3342導引電子元件612位於二第一脫料部件3331及二第二脫料部件3341之間(即位於二夾具322之取料作業範圍),二第一脫料部件3331及二第二脫料部件3341即壓抵電子元件612四周側之膠膜611,令膠膜611受到一向下撕離力量而剝離電子元件612,以大幅降低膠膜611對電子元件612之黏著力,由於檢知器34位於脫料器33之容置空間331,使得檢知器34之抽吸部341貼接於電子元件612之頂面,並受到電子元件612之頂推而作Z方向向上緩衝位移,且壓縮緩衝件343,檢知器34即以抽吸部341抽吸電子元件612,並將抽吸到電子元件612之檢知訊號傳輸至中央控制裝置(圖未示出),以檢知該拾料器已取出電子元件612,以防止拾料器空移至下一站裝置,反之,若檢知器34之抽吸部341無抽吸到電子元件612而呈現破真空狀態 ,則代表二夾具322之間並無電子元件,中央控制裝置則發出異常訊號通知工作人員,以即時停機排除異常;因此,檢知單元可有效檢知該拾料單元之移料狀態,進而提升整體作業之順暢性。 Please refer to figures 5 and 6. The conveying unit uses the second conveying drive source 313 to drive the picker, stripper 33 and detector 34 to move downward in the Z direction synchronously. The bottom surface position of the material part 3331 and the two second stripping parts 3341 is lower than the bottom surface position of the two clamps 322, so that the first and second stripping parts 3331 and 3341 will first contact the adhesive film 611 and use the two The first guide portion 3332 and the second guide portions 3342 guide the electronic component 612 between the two first stripping parts 3331 and the second stripping parts 3341 (that is, within the retrieving operation range of the two fixtures 322), Two first stripping parts 3331 and two second stripping parts 3341 are pressed against the adhesive film 611 around the electronic component 612, so that the adhesive film 611 is subjected to a downward tearing force to peel off the electronic component 612, thereby greatly reducing the adhesive film 611 For the adhesion force to the electronic component 612, since the detector 34 is located in the accommodating space 331 of the stripper 33, the suction portion 341 of the detector 34 is attached to the top surface of the electronic component 612 and is affected by the electronic component 612 Push up to buffer the displacement upward in the Z direction, and compress the buffer member 343, the detector 34 sucks the electronic component 612 with the suction portion 341, and transmits the detection signal sucked to the electronic component 612 to the central control device ( (Not shown in the figure), to detect that the picker has taken out the electronic component 612 to prevent the picker from moving to the next station device, otherwise, if the suction part 341 of the detector 34 does not suck the electronic component 612 while showing a vacuum , It means that there is no electronic component between the two fixtures 322, and the central control device sends out an abnormal signal to inform the staff to stop the machine immediately to eliminate the abnormality; therefore, the detection unit can effectively detect the material removal state of the picking unit, thereby improving The smoothness of the overall operation.

請參閱第5、7、8圖,當電子元件612位於脫料器33之二第一脫料部件3331及二第二脫料部件3341之間後,亦即電子元件612位於拾料器之二夾具322間,拾料單元之拾料驅動源321即驅動二夾具322作相對位移而夾持電子元件612;接著該搬運單元之第二搬運驅動源313驅動拾料器、脫料器33及檢知器34同步作Z方向向上位移,令拾料器之二夾具322夾持電子元件612向上位移而完全剝離膠膜611,由於二第一脫料部件3331及二第二脫料部件3341已先行壓抵部分膠膜611剝離電子元件612,而大幅降低膠膜611之黏著力,使得二夾具322可迅速於膠膜611上取出電子元件612,以提高移料作業效能。 Please refer to figures 5, 7 and 8, when the electronic component 612 is located between the first stripping part 3331 and the second second stripping part 3341 of the stripper 33, the electronic component 612 is positioned at the second part of the picker Between the clamps 322, the pickup driving source 321 of the picking unit drives the two clamps 322 to make relative displacement to clamp the electronic component 612; then the second transport driving source 313 of the transport unit drives the picker, stripper 33 and inspection The detector 34 is simultaneously displaced upward in the Z direction, so that the second clamp 322 of the picker clamps the electronic component 612 and moves upward to completely peel off the adhesive film 611, because the two first stripping parts 3331 and the second stripping parts 3341 have preceded Pressing part of the adhesive film 611 peels off the electronic component 612, which greatly reduces the adhesive force of the adhesive film 611, so that the two clamps 322 can quickly take out the electronic component 612 from the adhesive film 611, so as to improve the efficiency of the material transfer operation.

請參閱第5、9圖,於拾料器之二夾具322取出電子元件612後,搬運單元係以第一搬運驅動源312驅動移載具311作X-Y方向位移,移載具311即帶動二夾具322及電子元件612等位移至收料裝置70之收料承置器71上方,搬運單元再以第二搬運驅動源313驅動二夾具322及電子元件612作Z方向向下位移,使二夾具322將電子元件612移入收料承置器71,檢知器34之抽吸部341則釋放電子元件612,使電子元件612平穩收置於收料承置器71。 Please refer to Figs. 5 and 9, after the second component 322 of the picker takes out the electronic component 612, the transfer unit drives the transfer tool 311 to move in the XY direction by the first transfer driving source 312, and the transfer device 311 drives the two clips 322 and the electronic component 612 are equally displaced to the receiving holder 71 of the receiving device 70, and the conveying unit drives the second clamp 322 and the electronic component 612 to move downward in the Z direction by the second conveying driving source 313, so that the second clamp 322 The electronic component 612 is moved into the receiving container 71, and the suction part 341 of the detector 34 releases the electronic component 612, so that the electronic component 612 is stably stored in the receiving container 71.

請參閱第3、4、10圖,本發明移料裝置30之第二實施例,亦包含搬運單元、拾料單元、脫料單元及檢知單元,第二實施例與第一實施例之差異在於移料裝置30更包含頂料單元,該頂料單元係設有至少 一頂料器,以於載框模組之膠膜底面頂升電子元件,於本實施例中,頂料單元係於機台40上設有頂料器,頂料器包含頂料件351及頂料驅動源352,頂料件351係為滾輪,頂料驅動源352係連結驅動頂料件351作Z方向位移,以於載框模組之膠膜611底面頂升電子元件612,使電子元件612之局部先行剝離膠膜611,並搭配脫料單元,使得拾料器更快於膠膜611上取出電子元件612,以更加縮減取料時間,進而提高生產效能。 Please refer to FIGS. 3, 4, and 10. The second embodiment of the material removal device 30 of the present invention also includes a handling unit, a picking unit, a stripping unit, and a detection unit. Differences between the second embodiment and the first embodiment The material moving device 30 further includes a top loading unit, which is provided with at least A top feeder is used to lift the electronic components on the bottom surface of the film of the frame-carrying module. In this embodiment, the top feed unit is provided with a top feeder on the machine 40. The top feeder includes a top feeder 351 and The top material driving source 352, the top material member 351 is a roller, and the top material driving source 352 is connected to drive the top material member 351 to be displaced in the Z direction, so as to lift the electronic component 612 on the bottom surface of the film 611 of the frame module, so that the electronic The part 612 of the component 612 is stripped of the adhesive film 611 in advance, and is equipped with a stripping unit, so that the picker can take out the electronic component 612 from the adhesive film 611 faster, so as to shorten the material taking time and improve the production efficiency.

請參閱第3、4、11圖,係本發明移料裝置之第二實施例應用於電子元件作業設備之示意圖,作業設備係於機台40上配置有供料裝置50、收料裝置70、本發明移料裝置30及中央控制裝置(圖未示出);該供料裝置50係裝配於機台40,並設有至少一供料承置器51,以承置具電子元件612之載框模組61;該收料裝置70係裝配於機台40,並設有至少一收料承置器71,以容納至少一電子元件;本發明移料裝置30係配置於機台40,包含搬運單元、拾料單元及脫料單元,於本實施例中,更包含檢知單元及頂料單元,搬運單元之第一、二搬運驅動源312、313經移載具311而帶動拾料單元之二夾具322位移至供料承置器51之載框模組61上方,並驅動脫料單元之二第一脫料部件3331及二第二脫料部件3341先行壓抵載框模組61之膠膜611剝離電子元件612,再使拾料單元之二夾具322迅速於膠膜611上取出電子元件612,搬運單元之第一、二搬運驅動源312、313再驅動二夾具322將電子元件612移載至收料裝置70之收料承置器71收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIGS. 3, 4, and 11 for schematic diagrams of the second embodiment of the material removal device of the present invention applied to electronic component work equipment. The work equipment is equipped with a feeding device 50 and a receiving device 70 on a machine 40. The material transfer device 30 and the central control device (not shown) of the present invention; the material supply device 50 is assembled on the machine 40 and is provided with at least one material supply receiver 51 to support the load of the electronic component 612 Frame module 61; the receiving device 70 is assembled on the machine 40 and is provided with at least one receiving receiver 71 to accommodate at least one electronic component; the material moving device 30 of the present invention is configured on the machine 40 and includes The conveying unit, the picking unit and the unloading unit, in this embodiment, further include a detection unit and a topping unit. The first and second conveying drive sources 312 and 313 of the conveying unit drive the picking unit via the transfer carrier 311 The second jig 322 is displaced above the carrier frame module 61 of the feed holder 51, and drives the first and second stripping parts 3331 and 3341 of the stripping unit to press against the carrier frame module 61 in advance The adhesive film 611 peels off the electronic component 612, and then the second jig 322 of the picking unit quickly takes out the electronic component 612 on the adhesive film 611, and the first and second transport driving sources 312, 313 of the conveying unit drives the second jig 322 to move the electronic component 612 The receiving holder 71 transferred to the receiving device 70 is stored; the central control device is used to control and integrate the actions of each device to perform automated operations, so as to achieve the practical benefit of improving the operating efficiency.

321:拾料驅動源 321: Pickup drive source

322:夾具 322: Fixture

323:讓位部 323: Give way

33:脫料器 33: Stripper

331:容置空間 331: accommodating space

332:頂板 332: Top plate

3321:通孔 3321: through hole

333:第一側板 333: First side panel

3331:第一脫料部件 3331: First stripping part

3332:第一導引部 3332: The first guide

334:第二側板 334: Second side panel

3341:第二脫料部件 3341: Second stripping part

3342:第二導引部 3342: Second guide

34:檢知器 34: Detector

341:抽吸部 341: Suction section

342:連接桿 342: connecting rod

343:緩衝件 343: Cushion

Claims (9)

一種電子元件移料裝置,包含:搬運單元:係設有作至少一方向位移之移載具;拾料單元:係裝配於該移載具,並設有至少一拾料器,以拾取電子元件;脫料單元:係裝配於該拾料單元,並設有具至少一脫料部件之脫料器,該脫料部件係供壓抵載框模組之膠膜剝離所黏附的電子元件,該脫料部件之內面設有至少一導引部,該導引部呈斜面。 An electronic component material transfer device, comprising: a conveying unit: equipped with a transfer carrier for displacement in at least one direction; a material pickup unit: equipped with the transfer carrier and provided with at least one picker to pick up electronic components ; Stripping unit: It is assembled in the picking unit and is equipped with a stripper with at least one stripping component. The stripping component is used to press against the adhesive film of the frame module to peel off the adhered electronic components. At least one guide part is provided on the inner surface of the stripping part, and the guide part is inclined. 依申請專利範圍第1項所述之電子元件移料裝置,其更包含檢知單元,該檢知單元係裝配於該脫料單元,並設有至少一檢知器,以供檢知該拾料單元之該拾料器是否移載電子元件。 The electronic component material removal device according to item 1 of the scope of the patent application further includes a detection unit, the detection unit is assembled to the material removal unit, and is provided with at least one detection device for detecting the pickup Whether the picker of the feed unit transfers electronic components. 依申請專利範圍第2項所述之電子元件移料裝置,其中,該檢知器係設有至少一緩衝件,該緩衝件係位於該檢知器與該脫料器之間,或位於該檢知器與該拾料器之間。 The electronic component material removal device according to item 2 of the scope of the patent application, wherein the detector is provided with at least one buffer element, the buffer element is located between the detector and the stripper, or is located in the Between the detector and the picker. 依申請專利範圍第1至3項中任一項所述之電子元件移料裝置,其中,該搬運單元係設有搬運驅動器,以驅動該移載具位移。 The electronic component material transfer device according to any one of items 1 to 3 of the patent application range, wherein the transfer unit is provided with a transfer driver to drive the transfer vehicle to move. 依申請專利範圍第1至3項中任一項所述之電子元件移料裝置,其中,該拾料單元之該拾料器係為吸料器或夾料器。 The electronic component material transfer device according to any one of items 1 to 3 of the patent application range, wherein the picker of the picking unit is a suction device or a gripper. 依申請專利範圍第2或3項所述之電子元件移料裝置,其中,該脫料單元之該脫料器係設有容置空間,以容置該檢知器。 The electronic component material removal device according to item 2 or 3 of the patent application scope, wherein the material removal device of the material removal unit is provided with an accommodating space for accommodating the detector. 依申請專利範圍第1或2項所述之電子元件移料裝置,其更包含頂料單元,該頂料單元係設有至少一頂料器,以於該載框模組之該膠膜底面頂升電子元件。 The electronic component material transfer device according to item 1 or 2 of the patent application scope further includes a top material unit, the top material unit is provided with at least one material ejector for the bottom surface of the adhesive film of the frame carrying module Lifting electronic components. 依申請專利範圍第7項所述之電子元件移料裝置,其中,該頂料器包含頂料件及頂料驅動源,該頂料驅動源係連結驅動該頂料件作Z方向位移,以頂升電子元件。 The electronic component material removal device according to item 7 of the patent application scope, wherein the material ejector includes a material ejection member and a material ejection driving source, and the material ejection driving source continuously drives the material ejection member to move in the Z direction to Lifting electronic components. 一種應用電子元件移料裝置之作業設備,包含:機台;供料裝置:係配置於該機台,並設有至少一供料承置器,以承置具電子元件之載框模組;收料裝置:係配置於該機台,並設有至少一收料承置器,以收置電子元件;至少一依申請專利範圍第1項所述之電子元件移料裝置,係配置於該機台;中央控制裝置:係控制及整合各裝置作動,以執行自動化作業。 An operation device using a material moving device for electronic components, including: a machine; a feeding device: the machine is arranged on the machine and is provided with at least one feeding holder to hold a frame module with electronic components; Receiving device: It is arranged on the machine, and is equipped with at least one receiving receiver to receive electronic components; at least one electronic component removal device according to item 1 of the scope of patent application is configured on this Machine; central control device: It controls and integrates the actions of each device to perform automated operations.
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CN113732688A (en) * 2021-08-27 2021-12-03 浙江朗森智能科技有限公司 Valve body assembling equipment

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Publication number Priority date Publication date Assignee Title
JP2000142936A (en) * 1998-11-12 2000-05-23 Matsushita Electric Ind Co Ltd Conveying device
KR101640525B1 (en) * 2015-01-12 2016-07-19 한미반도체 주식회사 Pick and placement device
CN108238441A (en) * 2016-12-27 2018-07-03 张家港康得新光电材料有限公司 Diaphragm pick device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000142936A (en) * 1998-11-12 2000-05-23 Matsushita Electric Ind Co Ltd Conveying device
KR101640525B1 (en) * 2015-01-12 2016-07-19 한미반도체 주식회사 Pick and placement device
CN108238441A (en) * 2016-12-27 2018-07-03 张家港康得新光电材料有限公司 Diaphragm pick device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741674B (en) * 2020-07-10 2021-10-01 鴻勁精密股份有限公司 Electronic component operation apparatus and operational equipment using the same
CN113732688A (en) * 2021-08-27 2021-12-03 浙江朗森智能科技有限公司 Valve body assembling equipment
CN113732688B (en) * 2021-08-27 2022-06-21 浙江朗森智能科技有限公司 Valve body assembling equipment

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