TWI688542B - 具有局部定界的雷射再封閉 - Google Patents

具有局部定界的雷射再封閉 Download PDF

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Publication number
TWI688542B
TWI688542B TW105140183A TW105140183A TWI688542B TW I688542 B TWI688542 B TW I688542B TW 105140183 A TW105140183 A TW 105140183A TW 105140183 A TW105140183 A TW 105140183A TW I688542 B TWI688542 B TW I688542B
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TW
Taiwan
Prior art keywords
substrate
cavity
cap
plane
area
Prior art date
Application number
TW105140183A
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English (en)
Chinese (zh)
Other versions
TW201730092A (zh
Inventor
阿奇美 布萊林
法蘭克 萊賢巴哈
猶根 蘭穆斯
尤莉亞 雅木托
Original Assignee
德商羅伯特博斯奇股份有限公司
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Application filed by 德商羅伯特博斯奇股份有限公司 filed Critical 德商羅伯特博斯奇股份有限公司
Publication of TW201730092A publication Critical patent/TW201730092A/zh
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Publication of TWI688542B publication Critical patent/TWI688542B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
TW105140183A 2015-12-08 2016-12-06 具有局部定界的雷射再封閉 TWI688542B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015224538.1A DE102015224538A1 (de) 2015-12-08 2015-12-08 Laser-Wiederverschluss mit lokaler Begrenzung
DE102015224538.1 2015-12-08

Publications (2)

Publication Number Publication Date
TW201730092A TW201730092A (zh) 2017-09-01
TWI688542B true TWI688542B (zh) 2020-03-21

Family

ID=57206222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105140183A TWI688542B (zh) 2015-12-08 2016-12-06 具有局部定界的雷射再封閉

Country Status (3)

Country Link
DE (1) DE102015224538A1 (de)
TW (1) TWI688542B (de)
WO (1) WO2017097480A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017215531A1 (de) * 2017-09-05 2019-03-07 Robert Bosch Gmbh Verfahren zum Verschließen einer mikromechanischen Vorrichtung mittels Laser-Schmelzen und mikromechanische Vorrichtung mit einem Laser-Schmelz-Verschluss
JP2019062111A (ja) * 2017-09-27 2019-04-18 日本航空電子工業株式会社 パッケージ封止構造及びデバイス用パッケージ
CN111792621B (zh) * 2020-07-06 2024-04-16 中国科学院上海微系统与信息技术研究所 一种圆片级薄膜封装方法及封装器件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090174148A1 (en) * 2005-12-20 2009-07-09 Udo Bischof Method for Sealing an Opening
US20120299127A1 (en) * 2011-05-27 2012-11-29 Denso Corporation Dynamic quantity sensor device and manufacturing method of the same
US20150123217A1 (en) * 2013-11-06 2015-05-07 Robert Bosch Gmbh Micromechanical sensor unit and method for manufacturing micromechanical sensor units

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070235501A1 (en) * 2006-03-29 2007-10-11 John Heck Self-packaging MEMS device
WO2010095367A1 (ja) * 2009-02-19 2010-08-26 日本電気株式会社 真空封止パッケージ、真空封止パッケージを有するプリント回路基板、電子機器、及び真空封止パッケージの製造方法
DE102014202801B4 (de) 2014-02-17 2023-08-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090174148A1 (en) * 2005-12-20 2009-07-09 Udo Bischof Method for Sealing an Opening
US20120299127A1 (en) * 2011-05-27 2012-11-29 Denso Corporation Dynamic quantity sensor device and manufacturing method of the same
US20150123217A1 (en) * 2013-11-06 2015-05-07 Robert Bosch Gmbh Micromechanical sensor unit and method for manufacturing micromechanical sensor units

Also Published As

Publication number Publication date
WO2017097480A1 (de) 2017-06-15
TW201730092A (zh) 2017-09-01
DE102015224538A1 (de) 2017-06-08

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