TWI686538B - 氣冷散熱裝置 - Google Patents
氣冷散熱裝置 Download PDFInfo
- Publication number
- TWI686538B TWI686538B TW105138664A TW105138664A TWI686538B TW I686538 B TWI686538 B TW I686538B TW 105138664 A TW105138664 A TW 105138664A TW 105138664 A TW105138664 A TW 105138664A TW I686538 B TWI686538 B TW I686538B
- Authority
- TW
- Taiwan
- Prior art keywords
- air
- chamber
- plate
- heat dissipation
- gas pump
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Reciprocating Pumps (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105138664A TWI686538B (zh) | 2016-11-24 | 2016-11-24 | 氣冷散熱裝置 |
JP2017224435A JP6487994B2 (ja) | 2016-11-24 | 2017-11-22 | 空冷放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105138664A TWI686538B (zh) | 2016-11-24 | 2016-11-24 | 氣冷散熱裝置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201819766A TW201819766A (zh) | 2018-06-01 |
TWI686538B true TWI686538B (zh) | 2020-03-01 |
Family
ID=62237646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105138664A TWI686538B (zh) | 2016-11-24 | 2016-11-24 | 氣冷散熱裝置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6487994B2 (ja) |
TW (1) | TWI686538B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11043444B2 (en) | 2018-08-10 | 2021-06-22 | Frore Systems Inc. | Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices |
WO2021086873A1 (en) | 2019-10-30 | 2021-05-06 | Frore System Inc. | Mems-based airflow system |
TWI747076B (zh) | 2019-11-08 | 2021-11-21 | 研能科技股份有限公司 | 行動裝置散熱組件 |
US11796262B2 (en) | 2019-12-06 | 2023-10-24 | Frore Systems Inc. | Top chamber cavities for center-pinned actuators |
CN113661568A (zh) * | 2019-12-17 | 2021-11-16 | 福珞尔系统公司 | 用于封闭和开放设备的基于mems的冷却系统 |
JP2022022557A (ja) | 2020-06-26 | 2022-02-07 | 株式会社Soken | 距離推定装置 |
WO2022072286A1 (en) | 2020-10-02 | 2022-04-07 | Frore Systems Inc. | Active heat sink |
CN112432086B (zh) * | 2020-11-25 | 2022-06-17 | 浙江北光科技股份有限公司 | Led筒灯 |
CN113710055B (zh) * | 2021-07-19 | 2024-03-29 | 南京精诚微控信息科技有限公司 | 一种智能设备用中控系统 |
CN114793410B (zh) * | 2022-04-25 | 2023-11-24 | 太仓陶氏电气有限公司 | 一种逆变器大功率风冷水冷复合散热器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7274568B1 (en) * | 2004-05-24 | 2007-09-25 | Nvidia Corporation | Apparatus and method for cooling semiconductor devices |
US20090167109A1 (en) * | 2007-12-27 | 2009-07-02 | Sony Corporation | Piezoelectric pump, cooling device, and electronic apparatus |
US7814965B1 (en) * | 2005-10-27 | 2010-10-19 | United States Thermoelectric Consortium | Airflow heat dissipation device |
US20110229356A1 (en) * | 2007-03-12 | 2011-09-22 | Murata Manufacturing Co., Ltd. | Fluid conveyance device |
US20130135823A1 (en) * | 2011-11-28 | 2013-05-30 | Samsung Electronics Co., Ltd. | Semiconductor packages usable with a mobile device |
TW201606488A (zh) * | 2014-05-22 | 2016-02-16 | 通用電機股份有限公司 | 在擴張的熱表面上的整合型密集衝擊 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2625398B2 (ja) * | 1995-03-17 | 1997-07-02 | 日本電気株式会社 | マルチチップ冷却装置 |
JP3120802B2 (ja) * | 1999-03-15 | 2000-12-25 | 富士通株式会社 | ヒートシンク |
KR101033077B1 (ko) * | 2006-12-09 | 2011-05-06 | 가부시키가이샤 무라타 세이사쿠쇼 | 압전 펌프 |
JP2010225788A (ja) * | 2009-03-23 | 2010-10-07 | Nikon Corp | 電子機器 |
JP2012124246A (ja) * | 2010-12-07 | 2012-06-28 | Murata Mfg Co Ltd | 電子機器の放熱装置 |
TWI524840B (zh) * | 2012-03-30 | 2016-03-01 | 台達電子工業股份有限公司 | 散熱模組 |
JP2013223818A (ja) * | 2012-04-20 | 2013-10-31 | Murata Mfg Co Ltd | 圧電アクチュエータ、電子機器 |
JP2014107362A (ja) * | 2012-11-27 | 2014-06-09 | Lenovo Singapore Pte Ltd | 電子デバイスの放熱装置および放熱方法 |
TWI552838B (zh) * | 2013-06-24 | 2016-10-11 | 研能科技股份有限公司 | 微型氣壓動力裝置 |
JP6028779B2 (ja) * | 2014-10-03 | 2016-11-16 | 株式会社村田製作所 | 流体制御装置 |
-
2016
- 2016-11-24 TW TW105138664A patent/TWI686538B/zh active
-
2017
- 2017-11-22 JP JP2017224435A patent/JP6487994B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7274568B1 (en) * | 2004-05-24 | 2007-09-25 | Nvidia Corporation | Apparatus and method for cooling semiconductor devices |
US7814965B1 (en) * | 2005-10-27 | 2010-10-19 | United States Thermoelectric Consortium | Airflow heat dissipation device |
US20110229356A1 (en) * | 2007-03-12 | 2011-09-22 | Murata Manufacturing Co., Ltd. | Fluid conveyance device |
US20090167109A1 (en) * | 2007-12-27 | 2009-07-02 | Sony Corporation | Piezoelectric pump, cooling device, and electronic apparatus |
US20130135823A1 (en) * | 2011-11-28 | 2013-05-30 | Samsung Electronics Co., Ltd. | Semiconductor packages usable with a mobile device |
TW201606488A (zh) * | 2014-05-22 | 2016-02-16 | 通用電機股份有限公司 | 在擴張的熱表面上的整合型密集衝擊 |
Also Published As
Publication number | Publication date |
---|---|
JP2018085510A (ja) | 2018-05-31 |
JP6487994B2 (ja) | 2019-03-20 |
TW201819766A (zh) | 2018-06-01 |
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