TWI686538B - 氣冷散熱裝置 - Google Patents

氣冷散熱裝置 Download PDF

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Publication number
TWI686538B
TWI686538B TW105138664A TW105138664A TWI686538B TW I686538 B TWI686538 B TW I686538B TW 105138664 A TW105138664 A TW 105138664A TW 105138664 A TW105138664 A TW 105138664A TW I686538 B TWI686538 B TW I686538B
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TW
Taiwan
Prior art keywords
air
chamber
plate
heat dissipation
gas pump
Prior art date
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TW105138664A
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English (en)
Chinese (zh)
Other versions
TW201819766A (zh
Inventor
陳世昌
廖家淯
韓永隆
黃啟峰
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研能科技股份有限公司
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Application filed by 研能科技股份有限公司 filed Critical 研能科技股份有限公司
Priority to TW105138664A priority Critical patent/TWI686538B/zh
Priority to JP2017224435A priority patent/JP6487994B2/ja
Publication of TW201819766A publication Critical patent/TW201819766A/zh
Application granted granted Critical
Publication of TWI686538B publication Critical patent/TWI686538B/zh

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Reciprocating Pumps (AREA)
TW105138664A 2016-11-24 2016-11-24 氣冷散熱裝置 TWI686538B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105138664A TWI686538B (zh) 2016-11-24 2016-11-24 氣冷散熱裝置
JP2017224435A JP6487994B2 (ja) 2016-11-24 2017-11-22 空冷放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105138664A TWI686538B (zh) 2016-11-24 2016-11-24 氣冷散熱裝置

Publications (2)

Publication Number Publication Date
TW201819766A TW201819766A (zh) 2018-06-01
TWI686538B true TWI686538B (zh) 2020-03-01

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ID=62237646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105138664A TWI686538B (zh) 2016-11-24 2016-11-24 氣冷散熱裝置

Country Status (2)

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JP (1) JP6487994B2 (ja)
TW (1) TWI686538B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043444B2 (en) 2018-08-10 2021-06-22 Frore Systems Inc. Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
WO2021086873A1 (en) 2019-10-30 2021-05-06 Frore System Inc. Mems-based airflow system
TWI747076B (zh) 2019-11-08 2021-11-21 研能科技股份有限公司 行動裝置散熱組件
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
CN113661568A (zh) * 2019-12-17 2021-11-16 福珞尔系统公司 用于封闭和开放设备的基于mems的冷却系统
JP2022022557A (ja) 2020-06-26 2022-02-07 株式会社Soken 距離推定装置
WO2022072286A1 (en) 2020-10-02 2022-04-07 Frore Systems Inc. Active heat sink
CN112432086B (zh) * 2020-11-25 2022-06-17 浙江北光科技股份有限公司 Led筒灯
CN113710055B (zh) * 2021-07-19 2024-03-29 南京精诚微控信息科技有限公司 一种智能设备用中控系统
CN114793410B (zh) * 2022-04-25 2023-11-24 太仓陶氏电气有限公司 一种逆变器大功率风冷水冷复合散热器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274568B1 (en) * 2004-05-24 2007-09-25 Nvidia Corporation Apparatus and method for cooling semiconductor devices
US20090167109A1 (en) * 2007-12-27 2009-07-02 Sony Corporation Piezoelectric pump, cooling device, and electronic apparatus
US7814965B1 (en) * 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US20110229356A1 (en) * 2007-03-12 2011-09-22 Murata Manufacturing Co., Ltd. Fluid conveyance device
US20130135823A1 (en) * 2011-11-28 2013-05-30 Samsung Electronics Co., Ltd. Semiconductor packages usable with a mobile device
TW201606488A (zh) * 2014-05-22 2016-02-16 通用電機股份有限公司 在擴張的熱表面上的整合型密集衝擊

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2625398B2 (ja) * 1995-03-17 1997-07-02 日本電気株式会社 マルチチップ冷却装置
JP3120802B2 (ja) * 1999-03-15 2000-12-25 富士通株式会社 ヒートシンク
KR101033077B1 (ko) * 2006-12-09 2011-05-06 가부시키가이샤 무라타 세이사쿠쇼 압전 펌프
JP2010225788A (ja) * 2009-03-23 2010-10-07 Nikon Corp 電子機器
JP2012124246A (ja) * 2010-12-07 2012-06-28 Murata Mfg Co Ltd 電子機器の放熱装置
TWI524840B (zh) * 2012-03-30 2016-03-01 台達電子工業股份有限公司 散熱模組
JP2013223818A (ja) * 2012-04-20 2013-10-31 Murata Mfg Co Ltd 圧電アクチュエータ、電子機器
JP2014107362A (ja) * 2012-11-27 2014-06-09 Lenovo Singapore Pte Ltd 電子デバイスの放熱装置および放熱方法
TWI552838B (zh) * 2013-06-24 2016-10-11 研能科技股份有限公司 微型氣壓動力裝置
JP6028779B2 (ja) * 2014-10-03 2016-11-16 株式会社村田製作所 流体制御装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274568B1 (en) * 2004-05-24 2007-09-25 Nvidia Corporation Apparatus and method for cooling semiconductor devices
US7814965B1 (en) * 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US20110229356A1 (en) * 2007-03-12 2011-09-22 Murata Manufacturing Co., Ltd. Fluid conveyance device
US20090167109A1 (en) * 2007-12-27 2009-07-02 Sony Corporation Piezoelectric pump, cooling device, and electronic apparatus
US20130135823A1 (en) * 2011-11-28 2013-05-30 Samsung Electronics Co., Ltd. Semiconductor packages usable with a mobile device
TW201606488A (zh) * 2014-05-22 2016-02-16 通用電機股份有限公司 在擴張的熱表面上的整合型密集衝擊

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Publication number Publication date
JP2018085510A (ja) 2018-05-31
JP6487994B2 (ja) 2019-03-20
TW201819766A (zh) 2018-06-01

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