TWI686129B - Heat dissipation module and portable electronic device - Google Patents
Heat dissipation module and portable electronic device Download PDFInfo
- Publication number
- TWI686129B TWI686129B TW108112804A TW108112804A TWI686129B TW I686129 B TWI686129 B TW I686129B TW 108112804 A TW108112804 A TW 108112804A TW 108112804 A TW108112804 A TW 108112804A TW I686129 B TWI686129 B TW I686129B
- Authority
- TW
- Taiwan
- Prior art keywords
- peripheral wall
- heat pipe
- item
- outer peripheral
- slot
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係關於一種散熱模組及可攜式電子裝置,特別是一種包含具有插槽的熱管之散熱模組及包含相互套接的熱管之可攜式電子裝置。The invention relates to a heat dissipation module and a portable electronic device, in particular to a heat dissipation module including a heat pipe with a slot and a portable electronic device including a heat pipe nested with each other.
隨著電子領域技術的演進,電子元件的效能不斷提升,而效能的提升卻也使電子元件產生的熱量增加。若無法有效將熱量自電子元件排除,電子元件的溫度將因熱量的累積而升高,進而使電子元件因過高的溫度而損毀。因此,為了提供電子元件額外的散熱途徑,廠商紛紛將相互套設且可相對旋轉的二熱管設置於顯示器以及主機座之間,藉以利用顯示器來協助逸散主機座中的電子元件所產生的熱量。With the evolution of technology in the electronics field, the performance of electronic components has been continuously improved, and the increase in performance has also increased the heat generated by electronic components. If the heat cannot be effectively removed from the electronic component, the temperature of the electronic component will increase due to the accumulation of heat, and the electronic component will be damaged due to the excessively high temperature. Therefore, in order to provide an additional heat dissipation path for electronic components, manufacturers have disposed two heat pipes that are mutually nested and relatively rotatable between the display and the mainframe, so as to use the display to help dissipate the heat generated by the electronic components in the mainframe .
然而,為了使設有插槽來供另一熱管套設的熱管的蒸氣通道保持足夠大的容積,進而維持熱管的熱傳導能力,套設於外的熱管通常需具有較大的厚度。如此一來,便導致難以兼顧套設於外的熱管之熱傳導能力以及薄化的問題。However, in order to maintain a sufficiently large volume of the vapor channel of the heat pipe provided with a slot for another heat pipe to maintain the heat conduction capacity of the heat pipe, the heat pipe sleeved outside generally needs to have a larger thickness. As a result, it becomes difficult to take into account both the heat conduction ability and the thinning of the heat pipe sheathed outside.
本發明在於提供一種散熱模組及包含此散熱模組的可攜式電子裝置,藉以解決難以兼顧熱管的熱傳導能力以及薄化之問題。The present invention is to provide a heat dissipation module and a portable electronic device including the heat dissipation module, so as to solve the problem that it is difficult to take into account the heat conduction capability and thinning of the heat pipe.
本發明之一實施例所揭露之散熱模組包含一第一熱管。第一熱管包含相對的一第一端部及一第二端部。第二端部包含一外周壁及一內周壁。內周壁位於外周壁之內。外周壁及內周壁之間形成有一蒸氣通道,且內周壁環繞出一插槽。插槽的一中心軸線與外周壁於一第一方向上保持一第一距離。插槽的中心軸線與外周壁於一第二方向上保持一第二距離。第一方向相異於第二方向,且第一距離相異於第二距離。The heat dissipation module disclosed in an embodiment of the present invention includes a first heat pipe. The first heat pipe includes a first end and a second end opposite to each other. The second end includes an outer peripheral wall and an inner peripheral wall. The inner peripheral wall is located inside the outer peripheral wall. A steam channel is formed between the outer peripheral wall and the inner peripheral wall, and the inner peripheral wall surrounds a slot. A central axis of the slot and the outer peripheral wall maintain a first distance in a first direction. The central axis of the slot and the outer peripheral wall maintain a second distance in a second direction. The first direction is different from the second direction, and the first distance is different from the second distance.
本發明之另一實施例所揭露之可攜式電子裝置,包含一主機座體、一顯示機體以及一散熱模組。主機座體包含一基座以及一熱源,且熱源設置於基座。顯示機體包含一金屬殼體以及一顯示模組。金屬殼體樞接於基座,以令金屬殼體能相對基座旋轉,且顯示模組設置於金屬殼體。散熱模組包含一第一熱管以及一第二熱管。第一熱管包含相對的一第一端部及一第二端部。第二端部包含一外周壁及一內周壁。內周壁位於外周壁之內。外周壁及內周壁之間形成有一蒸氣通道,且內周壁環繞出一插槽。第二熱管的一端部插設於插槽中,並熱接觸於第一熱管,且第二熱管可相對第一熱管轉動。第一端部與第二熱管的另一端部中的其中一者熱接觸熱源,且第一端部與第二熱管的另一端部中的另一者連接金屬殼體。插槽的一中心軸線與外周壁於一第一方向上保持一第一距離。插槽的中心軸線與外周壁於一第二方向上保持一第二距離。第一方向相異於第二方向,且第一距離相異於第二距離。The portable electronic device disclosed in another embodiment of the present invention includes a main body, a display body, and a heat dissipation module. The main body base includes a base and a heat source, and the heat source is disposed on the base. The display body includes a metal casing and a display module. The metal casing is pivotally connected to the base, so that the metal casing can rotate relative to the base, and the display module is disposed on the metal casing. The heat dissipation module includes a first heat pipe and a second heat pipe. The first heat pipe includes a first end and a second end opposite to each other. The second end includes an outer peripheral wall and an inner peripheral wall. The inner peripheral wall is located inside the outer peripheral wall. A steam channel is formed between the outer peripheral wall and the inner peripheral wall, and the inner peripheral wall surrounds a slot. One end of the second heat pipe is inserted into the slot and is in thermal contact with the first heat pipe, and the second heat pipe can rotate relative to the first heat pipe. One of the first end and the other end of the second heat pipe is in thermal contact with the heat source, and the other of the first end and the other end of the second heat pipe is connected to the metal housing. A central axis of the slot and the outer peripheral wall maintain a first distance in a first direction. The central axis of the slot and the outer peripheral wall maintain a second distance in a second direction. The first direction is different from the second direction, and the first distance is different from the second distance.
根據上述實施例所揭露的散熱模組及可攜式裝置,由於第一熱管之插槽的中心軸線與第一熱管的外周壁在相異的方向上保持不同的距離,亦即第一熱管具有扁平狀的外周壁,因此在第一熱管薄化後第一熱管的外周壁及內周壁之間的蒸氣通道仍具有足夠大的容積。如此一來,便能兼顧散熱模組的熱傳導能力以及薄化。According to the heat dissipation module and the portable device disclosed in the above embodiments, since the central axis of the slot of the first heat pipe and the outer peripheral wall of the first heat pipe maintain different distances in different directions, that is, the first heat pipe has The flat outer peripheral wall, therefore, after the first heat pipe is thinned, the vapor passage between the outer peripheral wall and the inner peripheral wall of the first heat pipe still has a sufficiently large volume. In this way, the thermal conductivity and thinning of the heat dissipation module can be taken into account.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.
請參閱圖1。圖1為根據本發明第一實施例之可攜式電子裝置的立體圖。Please refer to Figure 1. FIG. 1 is a perspective view of a portable electronic device according to a first embodiment of the invention.
可攜式電子裝置10包含一主機座體100、一顯示機體200、二樞接件250以及一散熱模組300。The portable
主機座體100包含一基座101、一熱源102以及一散熱組件103。熱源例如為中央處理器,且設置於基座101內。散熱組件103設置於基座101內。The
顯示機體200包含一金屬殼體201以及一顯示模組202。金屬殼體201透過樞接件250樞接於基座101,以令金屬殼體201能相對基座101旋轉,而使可攜式電子裝置10開啟或閉合。顯示模組202設置於金屬殼體201。The
舉例來說,二樞接件250可為單軸式樞軸,且各包含一第一固定部251、一第二固定部252以及一樞接部253。每一樞接件250中,第一固定部251固定於主機座體100的基座101;第二固定部252固定於顯示機體200的金屬殼體201;樞接部253則樞接於第一固定部251以及第二固定部252以令第二固定部252能相對第一固定部251旋轉,並帶動顯示機體200的金屬殼體201相對主機座體100的基座101旋轉。然,本發明並不以二樞接件250的設置為限,於其他實施例中,亦可省略二樞接件,而改以其他結構帶動顯示機體的金屬殼體相對主機座體的基座旋轉。For example, the two pivoting
請參閱圖2至圖5。圖2為根據本發明第一實施例的可攜式電子裝置之散熱模組的立體圖。圖3為圖2之散熱模組的分解示意圖。圖4為根據本發明第一實施例的可攜式電子裝置之第一熱管的第二端部沿徑向方向所繪示的剖面示意圖。圖5為圖3中之散熱模組沿軸向方向所繪示的側剖示意圖的局部放大圖。Please refer to Figure 2 to Figure 5. 2 is a perspective view of a heat dissipation module of a portable electronic device according to a first embodiment of the invention. FIG. 3 is an exploded schematic view of the heat dissipation module of FIG. 2. 4 is a schematic cross-sectional view of the second end of the first heat pipe of the portable electronic device according to the first embodiment of the present invention, drawn along the radial direction. FIG. 5 is a partially enlarged view of a schematic side sectional view of the heat dissipation module in FIG. 3 drawn along the axial direction.
散熱模組300包含一第一熱管310以及一第二熱管320。The
第一熱管310具有相對的一第一端部311及一第二端部312。第一端部311例如熱接觸熱源102,且第一熱管310熱接觸於散熱組件103(請額外參照圖1)。第二端部312包含一第一外周壁3120及一內周壁3121。內周壁3121位於第一外周壁3120之內,且例如可與第一外周壁3120相切。第一外周壁3120及內周壁3121之間形成有一第一蒸氣通道3122,其中第一蒸氣通道3122為用以供散熱流體(未繪示)通過的空間。內周壁3121環繞出一插槽313,其中插槽313具有相對的一封閉端3130及一開放端3131。The
如圖4所示,插槽313的徑向截面之外形例如可為圓形;第一外周壁3120例如包含相連的二直線段(未標號)及二弧形段(未標號),而使第一外周壁3120的徑向截面之外形為非圓形;具體來說,插槽313的一中心軸線C與第一外周壁3120於一第一方向A1上保持一第一距離D1;插槽313的中心軸線C與第一外周壁3120於一第二方向A2上保持一第二距離D2;插槽313的中心軸線C與第一外周壁3120於一第三方向A3上保持一第三距離D3;第一方向A1例如垂直於第二方向A2,且第三方向A3例如相反於第二方向A2。第一距離D1相異於第二距離D2,也就是說,第一外周壁3120的徑向截面之厚度T相異於第一外周壁3120的徑向截面之長度L,其中徑向截面之厚度T係第一外周壁3120的兩直線段之間的距離,且徑向截面之長度L係第一外周壁3120的兩弧形段之間的最大距離;舉例來說,第二距離D2與第三距離D3相同,也就是說,插槽313位於第一外周壁3120的幾何中心。As shown in FIG. 4, the outer shape of the radial cross section of the
然,本發明並不以第一方向A1垂直於第二方向A2為限;於其他實施例中,第一方向亦可與第二方向夾一銳角,也就是說,於其他實施例中,插槽的中心軸線與第一外壁面亦可於夾有銳角的兩個方向中保持相異的距離。However, the present invention is not limited to that the first direction A1 is perpendicular to the second direction A2; in other embodiments, the first direction may also form an acute angle with the second direction, that is to say, in other embodiments The center axis of the groove and the first outer wall surface may also maintain different distances in two directions with acute angles.
第二熱管320具有相對的一第三端部321及一第四端部322。第三端部321例如熱接觸於金屬殼體201(請額外參照圖1)。第四端部322插設於插槽313中並熱接觸於第一熱管310。舉例來說,第四端部322的徑向截面之外形可為圓形,且第四端部322包含相對的二第二外周壁3220。第四端部322的一第二蒸氣通道3221形成於二第二外周壁3220之間,其中第二蒸氣通道3221為用以供散熱流體(未繪示)通過的空間。The
此外,如圖5所示,本實施例中,內周壁3121的一頂部3123與一底部3124之間的最大距離從靠近封閉端3130的一端到靠近開放端3131的一端皆保持相同,且第四端部322的相對二第二外周壁3220之間的最大距離亦保持相同。In addition, as shown in FIG. 5, in this embodiment, the maximum distance between a top 3123 and a
此外,本發明並不限於以第一熱管310的第一端部311熱接觸熱源102,並以第二熱管320的第三端部321連接金屬殼體201;於其他實施例中,也可令第一熱管的第一端部連接金屬殼體,並令第二熱管的第三端部熱接觸熱源。In addition, the present invention is not limited to the
再者,本發明並不以插槽313的封閉端3130及開放端3131之間的距離為限。Furthermore, the present invention is not limited to the distance between the
此外,本發明並不以第一外周壁相切於內周壁為限,請參閱圖6,圖6為根據本發明第二實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖;於本實施例中,第二端部312a的第一外周壁3120a與內周壁3121a保持有間隙G。In addition, the present invention is not limited to the first outer peripheral wall being tangent to the inner peripheral wall. Please refer to FIG. 6, which is the second end of the first heat pipe of the portable electronic device according to the second embodiment of the present invention. In this embodiment, the first outer
再者,本發明並不以插槽位於第一外周壁的幾何中心為限,請參閱圖7A及圖7B,圖7A為根據本發明第三實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖。圖7B為根據本發明第三實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖;本實施例中,在第二端部312b中,插槽313b的中心軸線Cb與第一外周壁3120b於第一方向A1b上保持一第一距離D1b;插槽313b的中心軸線Cb與第一外周壁3120b於第二方向A2b上保持一第二距離D2b;插槽313b的中心軸線Cb與第一外周壁3120b於第三方向A3b上保持一第三距離D3b;第一方向A1b垂直於第二方向A2b,且第三方向A3b相反於第二方向A2b;第二距離D2b相異於與第三距離D3b,也就是說,本實施例中,插槽313b不位於第一外周壁3120b的幾何中心而偏置於第一外周壁3120b。Furthermore, the present invention is not limited to the geometric center of the slot located on the first outer peripheral wall. Please refer to FIGS. 7A and 7B. FIG. 7A is the first heat pipe of the portable electronic device according to the third embodiment of the present invention. A schematic cross-sectional view of the second end. 7B is a partial enlarged view of a side cross-sectional view of a first heat pipe of a portable electronic device according to a third embodiment of the present invention; in this embodiment, in the
再者,本發明之第一外周壁並不限於以相連的二直線段及二弧形段來呈現非圓形的徑向截面,請參閱圖8,圖8為根據本發明第四實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖;於本實施例中,第二端部312c之第一外周壁3120c的徑向截面之外形亦可為橢圓形,而使第一外周壁3120c呈現非圓形的徑向截面。Furthermore, the first outer peripheral wall of the present invention is not limited to two continuous straight segments and two arc segments to present a non-circular radial cross section. Please refer to FIG. 8, which is a fourth embodiment according to the present invention. A schematic cross-sectional view of the second end of the first heat pipe of the portable electronic device; in this embodiment, the radial cross-section of the first outer
再者,請參閱圖9,圖9為根據本發明第五實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖;相較第一實施例,本實施例中的第一熱管310d之第二端部312d額外凸出有一漸縮結構314d,且漸縮結構314d從與第二端部312d連接的一端漸縮至另一端。Furthermore, please refer to FIG. 9, which is a partial enlarged view of a side cross-sectional schematic view of a first heat pipe of a portable electronic device according to a fifth embodiment of the present invention; compared to the first embodiment, the first The
再者,請參閱圖10,圖10為根據本發明第六實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖。相較於第一實施例,本實施例中的第一熱管310e的第二端部312e額外凸出有一凸部315e,其中凸部315e包含一漸縮段3150e及一平行段3151e。漸縮段3150e從與第二端部312e連接的一端漸縮至遠離第二端部312e的另一端,且平行段3151e水平地凸出於漸縮段3150e中遠離第二端部312e的另一端。Furthermore, please refer to FIG. 10, which is a partially enlarged view of a side cross-sectional schematic view of a first heat pipe of a portable electronic device according to a sixth embodiment of the present invention. Compared with the first embodiment, the
再者,本發明並不以插槽及第四端部的外形為限,請參閱圖11,圖11為根據本發明第七實施例的可攜式電子裝置之散熱模組的側剖示意圖之局部放大圖。於本實施例中,在第二端部312f中,內周壁3121f與第一外周壁3120f之間形成有第一蒸氣通道3122f,且內周壁3121f的頂部3123f與底部3124f之間的最大距離從靠近開放端3131f的一端逐漸減少至靠近封閉端3130f的一端;第四端部322f中,相對二第二外周壁3220f之間的最大距離亦從遠離封閉端3130f的一端逐漸減少至靠近封閉端3130f的一端;也就是說,內周壁3121f所圍繞出的插槽313f由開放端3131f漸縮至封閉端3130f,且第四端部322f由遠離封閉端3130f的一端漸縮至另一端,但本發明並不以此為限;於其他實施例中,亦可僅有第四端部具有上述漸縮的外形特徵,或僅有插槽具有上述漸縮的外形特徵。Furthermore, the present invention is not limited to the shape of the slot and the fourth end. Please refer to FIG. 11, which is a schematic side sectional view of a heat dissipation module of a portable electronic device according to a seventh embodiment of the present invention. Partially enlarged view. In this embodiment, in the
根據上述實施例所揭露的散熱模組及可攜式裝置,由於第一熱管之插槽的中心軸線與第一熱管的外周壁在相異的方向上保持不同的距離,亦即第一熱管具有扁平狀的外周壁,因此在第一熱管薄化後第一熱管的外周壁及內周壁之間的蒸氣通道仍具有足夠大的容積。如此一來,便能兼顧散熱模組的熱傳導能力以及薄化。According to the heat dissipation module and the portable device disclosed in the above embodiments, since the central axis of the slot of the first heat pipe and the outer peripheral wall of the first heat pipe maintain different distances in different directions, that is, the first heat pipe has The flat outer peripheral wall, therefore, after the first heat pipe is thinned, the vapor passage between the outer peripheral wall and the inner peripheral wall of the first heat pipe still has a sufficiently large volume. In this way, the thermal conductivity and thinning of the heat dissipation module can be taken into account.
此外,由於第四端部的相對二第二外壁面之間的最大距離從遠離封閉端的一端逐漸減少至靠近封閉端的另一端,並且第一內周壁的頂部及底部之間的最大距離由靠近開放端的一端逐漸減少至靠近封閉端的一端,亦即插槽由外向內漸縮,且第四端部朝端面漸縮,所以設有插槽的第一熱管中的蒸氣通道能具有較大的容積。如此一來,便能使第一熱管中位在第一外壁面及內壁面之間的蒸氣通道具有均勻的溫度,進而提升散熱模組的熱傳導能力。In addition, since the maximum distance between the opposite second outer wall surfaces of the fourth end portion gradually decreases from the end away from the closed end to the other end close to the closed end, and the maximum distance between the top and bottom of the first inner peripheral wall increases from close to The end of the end gradually decreases to the end close to the closed end, that is, the slot tapers from the outside to the inside, and the fourth end tapers toward the end face, so the vapor passage in the first heat pipe provided with the slot can have a larger volume. In this way, the vapor channel between the first outer wall surface and the inner wall surface of the first heat pipe can have a uniform temperature, thereby improving the heat conduction capacity of the heat dissipation module.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.
10‧‧‧可攜式電子裝置 100‧‧‧主機座體 101‧‧‧基座 102‧‧‧熱源 103‧‧‧散熱組件 200‧‧‧顯示機體 201‧‧‧金屬殼體 202‧‧‧顯示模組 250‧‧‧樞接件 251‧‧‧第一固定部 252‧‧‧第二固定部 253‧‧‧樞接部 300‧‧‧散熱模組 310、310d、310e‧‧‧第一熱管 311‧‧‧第一端部 312、312a、312b、312c、312d、312e、312f‧‧‧第二端部 3120、3120a、3120b、3120c、3120f‧‧‧第一外周壁 3121、3121a、3121f‧‧‧內周壁 3122、3122f‧‧‧第一蒸氣通道 3123、3123f‧‧‧頂部 3124、3124f‧‧‧底部 313、313b、313f‧‧‧插槽 3130、3130f‧‧‧封閉端 3131、3131f‧‧‧開放端 314d‧‧‧漸縮結構 315e‧‧‧凸部 3150e‧‧‧漸縮段 3151e‧‧‧平行段 320‧‧‧第二熱管 321‧‧‧第三端部 322、322f‧‧‧第四端部 3220、3220f‧‧‧第二外周壁 3221‧‧‧第二蒸氣通道 C、Cb‧‧‧中心軸線 A1、A1b‧‧‧第一方向 D1、D1b‧‧‧第一距離 A2、A2b‧‧‧第二方向 D2、D2b‧‧‧第二距離 A3、A3b‧‧‧第三方向 D3、D3b‧‧‧第三距離 T‧‧‧厚度 L‧‧‧長度 G‧‧‧間隙 10‧‧‧Portable electronic device 100‧‧‧Main body 101‧‧‧Dock 102‧‧‧heat source 103‧‧‧Cooling components 200‧‧‧Display body 201‧‧‧Metal shell 202‧‧‧Display module 250‧‧‧Pivot 251‧‧‧First fixed part 252‧‧‧Second fixed part 253‧‧‧Pivot Department 300‧‧‧cooling module 310, 310d, 310e‧‧‧First heat pipe 311‧‧‧First end 312, 312a, 312b, 312c, 312d, 312e, 312f 3120, 3120a, 3120b, 3120c, 3120f 3121, 3121a, 3121f ‧‧‧ inner wall 3122, 3122f‧‧‧ First steam channel 3123, 3123f‧‧‧Top 3124, 3124f‧‧‧Bottom 313, 313b, 313f‧‧‧slot 3130, 3130f‧‧‧closed end 3131, 3131f‧‧‧ Open 314d‧‧‧ tapered structure 315e‧‧‧Convex 3150e‧‧‧ tapered section 3151e‧‧‧Parallel 320‧‧‧Second heat pipe 321‧‧‧The third end 322, 322f ‧‧‧ fourth end 3220, 3220f ‧‧‧ second outer wall 3221‧‧‧Second steam channel C, Cb‧‧‧Central axis A1, A1b‧‧‧ First direction D1, D1b‧‧‧ First distance A2, A2b‧Second direction D2, D2b‧‧‧Second distance A3, A3b ‧‧‧ third direction D3, D3b ‧‧‧ third distance T‧‧‧thickness L‧‧‧Length G‧‧‧Gap
圖1為根據本發明第一實施例之可攜式電子裝置的立體圖。 圖2為根據本發明第一實施例的可攜式電子裝置之散熱模組的立體圖。 圖3為圖2之散熱模組的分解示意圖。 圖4為根據本發明第一實施例的可攜式電子裝置之第一熱管的第二端部沿徑向方向所繪示的剖面示意圖。 圖5為圖3中之散熱模組沿軸向方向所繪示的側剖示意圖的局部放大圖。 圖6為根據本發明第二實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖。 圖7A為根據本發明第三實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖。 圖7B為根據本發明第三實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖。 圖8為根據本發明第四實施例的可攜式電子裝置之第一熱管的第二端部之剖面示意圖。 圖9為根據本發明第五實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖。 圖10為根據本發明第六實施例的可攜式電子裝置之第一熱管的側剖示意圖之局部放大圖。 圖11為根據本發明第七實施例的可攜式電子裝置之散熱模組的側剖示意圖之局部放大圖。 FIG. 1 is a perspective view of a portable electronic device according to a first embodiment of the invention. 2 is a perspective view of a heat dissipation module of a portable electronic device according to a first embodiment of the invention. FIG. 3 is an exploded schematic view of the heat dissipation module of FIG. 2. 4 is a schematic cross-sectional view of the second end of the first heat pipe of the portable electronic device according to the first embodiment of the present invention, drawn along the radial direction. FIG. 5 is a partially enlarged view of a schematic side sectional view of the heat dissipation module in FIG. 3 drawn along the axial direction. 6 is a schematic cross-sectional view of a second end of a first heat pipe of a portable electronic device according to a second embodiment of the invention. 7A is a schematic cross-sectional view of the second end of the first heat pipe of the portable electronic device according to the third embodiment of the present invention. 7B is a partially enlarged view of a schematic side sectional view of the first heat pipe of the portable electronic device according to the third embodiment of the present invention. 8 is a schematic cross-sectional view of a second end of a first heat pipe of a portable electronic device according to a fourth embodiment of the invention. 9 is a partial enlarged view of a schematic side sectional view of a first heat pipe of a portable electronic device according to a fifth embodiment of the invention. 10 is a partial enlarged view of a side cross-sectional view of a first heat pipe of a portable electronic device according to a sixth embodiment of the invention. 11 is a partial enlarged view of a side cross-sectional schematic view of a heat dissipation module of a portable electronic device according to a seventh embodiment of the present invention.
312‧‧‧第二端部 312‧‧‧second end
3120‧‧‧第一外周壁 3120‧‧‧First outer wall
3121‧‧‧內周壁 3121‧‧‧Inner peripheral wall
3122‧‧‧第一蒸氣通道 3122‧‧‧The first steam channel
313‧‧‧插槽 313‧‧‧slot
C‧‧‧中心軸線 C‧‧‧Central axis
A1‧‧‧第一方向 A1‧‧‧First direction
D1‧‧‧第一距離 D1‧‧‧ First distance
A2‧‧‧第二方向 A2‧‧‧Second direction
D2‧‧‧第二距離 D2‧‧‧Second distance
A3‧‧‧第三方向 A3‧‧‧ Third direction
D3‧‧‧第三距離 D3‧‧‧ Third distance
T‧‧‧厚度 T‧‧‧thickness
L‧‧‧長度 L‧‧‧Length
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108112804A TWI686129B (en) | 2019-04-12 | 2019-04-12 | Heat dissipation module and portable electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108112804A TWI686129B (en) | 2019-04-12 | 2019-04-12 | Heat dissipation module and portable electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI686129B true TWI686129B (en) | 2020-02-21 |
TW202038693A TW202038693A (en) | 2020-10-16 |
Family
ID=70413395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108112804A TWI686129B (en) | 2019-04-12 | 2019-04-12 | Heat dissipation module and portable electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI686129B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100401507C (en) * | 2005-08-24 | 2008-07-09 | 讯凯国际股份有限公司 | Heat abstractor and heat radiation method |
CN108966599A (en) * | 2018-08-03 | 2018-12-07 | 英业达科技有限公司 | Heat pipe heat and portable electronic devices with this heat pipe heat |
-
2019
- 2019-04-12 TW TW108112804A patent/TWI686129B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100401507C (en) * | 2005-08-24 | 2008-07-09 | 讯凯国际股份有限公司 | Heat abstractor and heat radiation method |
CN108966599A (en) * | 2018-08-03 | 2018-12-07 | 英业达科技有限公司 | Heat pipe heat and portable electronic devices with this heat pipe heat |
Also Published As
Publication number | Publication date |
---|---|
TW202038693A (en) | 2020-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW390952B (en) | Rotatable heat transfer coupling | |
CN109862762B (en) | Heat dissipation module and portable electronic device | |
US9033028B2 (en) | Heat dissipation module | |
TW201725964A (en) | Liquid cooling system | |
TWI686129B (en) | Heat dissipation module and portable electronic device | |
US8356656B2 (en) | Heat dissipation device and method | |
US11353041B2 (en) | Blade and fan structure | |
US20210282283A1 (en) | Buckle assembly and electronic device using the same | |
TW201418955A (en) | Heat dissipating assembly | |
JP2003069265A (en) | Small cooling fan | |
CN108983931A (en) | Electronic device and heat pipe assembly | |
WO2020240931A1 (en) | Cooling device and cabinet | |
TWI694762B (en) | Portable electronic device | |
TW202234978A (en) | Dustproof type heat dissipating mechanism and electronic apparatus with dustproof type heat dissipating mechanism including a casing, a heat conducting member, a heat dissipating member and a first fan | |
TWM596370U (en) | Dual axis type hinge for thermal conduction | |
JP3712795B2 (en) | Notebook PC cooling structure | |
JP3977341B2 (en) | Heat dissipation hinge structure for electronic devices | |
TWM560043U (en) | Heat dissipation system | |
TWI604131B (en) | Centrifugal fan module | |
TWI484895B (en) | Heat dissipation device | |
TWI546652B (en) | Heat dissipation unit of handheld electronic device | |
CN216286393U (en) | High heat conduction notebook computer heat pipe hinge means and notebook computer | |
US20100046171A1 (en) | Fastening member | |
JPS6333441Y2 (en) | ||
TWI707117B (en) | Heat pipe, heat pipe assembly and assemble method thereof |