CN108983931A - Electronic device and heat pipe assembly - Google Patents
Electronic device and heat pipe assembly Download PDFInfo
- Publication number
- CN108983931A CN108983931A CN201810938707.5A CN201810938707A CN108983931A CN 108983931 A CN108983931 A CN 108983931A CN 201810938707 A CN201810938707 A CN 201810938707A CN 108983931 A CN108983931 A CN 108983931A
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- CN
- China
- Prior art keywords
- heat pipe
- thermally conductive
- pin
- segment
- pivot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
The present invention discloses a kind of electronic device, including a host, a display, one first heat pipe, one second heat pipe, a thermally conductive assembly and a thermally conductive reinforcing member.Display is rotatablely arranged at host, and display has a thermally conductive shell.First heat pipe is installed in host.Second heat pipe is installed in thermally conductive shell.Thermally conductive assembly one end is installed in host and is connected in the first heat pipe, and the other end has one first pin-jointed structure.Thermally conductive reinforcing member one end is installed in thermally conductive shell and coats the second heat pipe, and the other end has one second pin-jointed structure.Second pin-jointed structure is articulated in the first pin-jointed structure, and the structural strength of thermally conductive reinforcing member is greater than the structural strength of the second heat pipe.Invention additionally discloses a kind of heat pipe assembly.
Description
Technical field
The present invention relates to a kind of electronic device and heat pipe assembly, especially a kind of electronic device with thermally conductive reinforcing member and
Heat pipe assembly.
Background technique
The heat dissipation design of electronic device such as laptop is that the heat of concatenation heat source and radiator is arranged in main engine bed mostly
Pipe, to by the heat transfer of heat source to radiator.With the enhancing efficiency of heat source, the calorific value of heat source is consequently increased, and is passed
It radiates not apply gradually merely with the space of main engine bed on system and use.Therefore, it in order to promote the heat-sinking capability to heat source, makes recently
It makes quotient also to attempt to install the heat pipe of concatenation display casing and main engine bed additional, to attempt through display casing as cooling fin
Reach the promotion of heat dissipation.The current practice is that main engine bed is installed with a pivot structure, and the heat of pivot structure and main engine bed
Pipe thermo-contact.Heat pipe at display can be rotated directly against pivot structure relative to pivot structure, so that display casing
When relative to main engine bed rotation, the heat pipe at display can be rotated therewith relative to pivot structure and be offseted with pivot structure holding.
However, structural strength is less than hinge arrangement, therefore outside display because heat pipe is a copper alloy hollow cavity
When shell phase rotates main engine bed, the heat pipe that directly offsets with pivot structure vulnerable to pivot structure extruding and deform.If heat pipe
It is deformed, then the capillary structure in heat pipe also can be therewith the heat conductive efficiency for deforming and influencing heat pipe.In this way, deformation
Heat pipe can then obstruct the transmitting of the heat of heat source and reduce the heat transfer of heat source to the efficiency of display casing.
Summary of the invention
The invention reside in a kind of electronic device and heat pipe assembly is provided, so as to solving display casing present in the prior art
When relative to main engine bed rotation, the heat pipe that directly offsets with pivot structure vulnerable to pivot structure extruding and the problem of deform.
Electronic device disclosed in one embodiment of the invention, including a host, a display, one first heat pipe, one
Two heat pipes, a thermally conductive assembly and a thermally conductive reinforcing member.Display is rotatablely arranged at host, and display is thermally conductive with one
Shell.First heat pipe is installed in host.Second heat pipe is installed in thermally conductive shell.Thermally conductive assembly one end is installed in host and is connected in
One heat pipe, the other end have one first pin-jointed structure.Thermally conductive reinforcing member one end is installed in thermally conductive shell and coats the second heat pipe, another
End has one second pin-jointed structure.Second pin-jointed structure is articulated in the first pin-jointed structure, and the structural strength of thermally conductive reinforcing member is greater than
The structural strength of second heat pipe.
Heat pipe assembly disclosed in another embodiment of the present invention, one suitable for connecting a host and a display are thermally conductive
Shell, and heat pipe assembly includes one first heat pipe, one second heat pipe, a thermally conductive assembly and a thermally conductive reinforcing member.First heat pipe is used
To be installed in host.Second heat pipe is to be installed in thermally conductive shell.Thermally conductive assembly one end is installed in host and is connected in the first heat
Pipe, the other end have one first pin-jointed structure.One end of thermally conductive reinforcing member is installed in thermally conductive shell and coats the second heat pipe, the other end
With one second pin-jointed structure.Second pin-jointed structure is articulated in the first pin-jointed structure.The structural strength of thermally conductive reinforcing member is greater than the
The structural strength of two heat pipes.
The electronic device according to above-described embodiment and heat pipe assembly, because being set to the second of the thermally conductive shell of display
Heat pipe is coated by thermally conductive reinforcing member, and is tied by the first pivot joint that the second pin-jointed structure of thermally conductive reinforcing member is pivotally connected thermally conductive assembly
Structure, so the biggish thermally conductive reinforcing member of structural strength can be on behalf of receiving first when the thermally conductive shell phase of display rotates host
The extruding of pin-jointed structure and avoid the second heat pipe deform.In this way, which the heat-conducting effect of the second heat pipe is maintained, will be led with benefit
The thermally conductive shell of the heat continued conduction of machine to display radiates.
The explanation of explanation and the following embodiments and the accompanying drawings above with respect to the content of present invention is of the invention with explanation to demonstrate
Spirit and principle, and claims of the present invention is provided and is further explained.
Detailed description of the invention
Fig. 1 is the lateral sectional view of the electronic device according to depicted in the first embodiment of the present invention.
Fig. 2 is the lateral sectional view of the electronic device according to depicted in the second embodiment of the present invention.
Fig. 3 is the top view of the local part of the electronic device according to depicted in the third embodiment of the present invention.
Fig. 4 is the lateral sectional view of the electronic device of Fig. 3.
Wherein, appended drawing reference:
10a, 10b, 10c electronic device
100 hosts
200 displays
210 thermally conductive shells
300 first heat pipes
400 second heat pipes
410 first segments
420 second segments
421 annular surfaces
500 thermally conductive assemblies
The first pin-jointed structure of 510a, 510b, 510c
600 thermally conductive reinforcing members
The second pin-jointed structure of 610a, 610b, 610c
Specific embodiment
Describe detailed features and advantage of the invention in detail in embodiments below, content is enough to make this field
Technical staff understands technology contents of the invention and implements accordingly, and according to content disclosed in this specification, claims
And attached drawing, those skilled in the art can be readily understood upon the relevant purpose of the present invention and advantage.Embodiment below is into one
The step viewpoint that the present invention will be described in detail, but it is non-anyways to limit scope of the invention.
Referring to Fig. 1, being the lateral sectional view of the electronic device according to depicted in the first embodiment of the present invention.
The electronic device 10a of the present embodiment includes a host 100, a display 200, one first heat pipe, 300, one second heat
Pipe 400, a thermally conductive assembly 500 and a thermally conductive reinforcing member 600.
First heat pipe 300 is installed in host 100, and the second heat pipe 400 is installed in thermally conductive shell 210.First heat pipe 300 and second
Heat pipe 400 is, for example, the heat pipe of flat pattern, and the contact area of flat heat pipe and heat source connects compared with round shape heat pipe and heat source
Contacting surface product is big, therefore the heat-conducting effect of flat heat pipe is preferable.Thermally conductive 500 one end of assembly is installed in host 100, and is directly connected to
Or by thermally conductive the first heat pipe of glue connection 300, the other end has one first pin-jointed structure 510a, and the first pin-jointed structure 510a is for example
For pivot connected slot.Thermally conductive 600 one end of reinforcing member is installed in thermally conductive shell 210 and coats the second heat pipe 400, and the other end has one second pivot
Binding structure 610a, the second pin-jointed structure 610a is, for example, pivot.First pin-jointed structure 510a is articulated in the second pin-jointed structure 610a,
So that display 200 is rotatablely arranged at host 100.
Thermally conductive assembly 500 is, for example, that copper alloy, aluminium alloy, nickel alloy or kirsite are contour with thermally conductive reinforcing member 600
The material of thermal conductivity and high structural strength.Heat caused by the heat source of host 100 is conducted by the first heat pipe 300 to thermally conductive
Assembly 500, then by the first pin-jointed structure 510a, the second pin-jointed structure 610a and thermally conductive reinforcing member 600, conduct heat to
Second heat pipe 400 is radiated by the surface that thermally conductive shell 210 is, for example, the metal material of high heat conductance as cooling fin.
Also, the structural strength of thermally conductive reinforcing member 600 is greater than the structural strength of the second heat pipe 400, when display 200 is with respect to host 100
When rotation, the biggish thermally conductive reinforcing member 600 of structural strength can avoid second on behalf of the extruding for bearing the first pin-jointed structure 510a
Heat pipe 400 deforms, and protects the structural intergrity of the second heat pipe 400, is maintained the heat-conducting effect of the second heat pipe 400, with benefit
Heat continued conduction caused by the heat source of host 100 to thermally conductive shell 210 is radiated.
In above-described embodiment, the first pin-jointed structure 510a is, for example, pivot connected slot, and the second pin-jointed structure 610a is, for example, pivot,
But not limited to this, referring to Fig. 2, being the lateral sectional view of the electronic device according to depicted in the second embodiment of the present invention.
The electronic device 10b of this embodiment, thermally conductive 500 one end of assembly have one first pin-jointed structure 510b, the first pin-jointed structure
510b is, for example, pivot structure, and thermally conductive 600 one end of reinforcing member has one second pin-jointed structure 610b, the second pin-jointed structure 610b
For example it is pivotally connected slot structure.First pin-jointed structure 510b is articulated in the second pin-jointed structure 610b, so that display 200 is rotationally set
It is placed in host 100.
In above-described embodiment, the second pin-jointed structure 610a is, for example, a solid pivot, and but not limited to this.Please refer to Fig. 3
With Fig. 4.Fig. 3 is the top view of the local part of the electronic device according to depicted in the third embodiment of the present invention.Fig. 4 is Fig. 3
Electronic device lateral sectional view.The electronic device 10c of this embodiment, the second heat pipe 400 include a first segment 410 and one
Second segment 420, first segment 410 connect second segment 420.First segment 410 is installed in thermally conductive shell 210, and thermally conductive reinforcing member 600 coats
First segment 410.Second segment 420 is, for example, circular heat pipe and has an annular surface 421.Second pin-jointed structure 610c is, for example, one
Hollow pivot structure is articulated in the first pin-jointed structure 510c.Second pin-jointed structure 610c is stacked at the annular surface of second segment 420
On 421, by the annular surface 421 of second segment 420 entirely around in being coated on, but not limited to this, and the second pin-jointed structure can also be with
Only partially envelope the annular surface of second segment.Installing second segment 420 facilitates heat in the pivot of second pin-jointed structure 610c
It more effectively conducts to first segment 410.
According to the electronic device and heat pipe assembly of above-described embodiment, the first segment of the first heat pipe 300 and the second heat pipe 400
410 be, for example, the heat pipe of flat pattern, the contact surface of the contact area of flat heat pipe and heat source compared with round shape heat pipe and heat source
Product is big, therefore the heat-conducting effect of flat heat pipe is preferable.Furthermore thermally conductive assembly 500 and thermally conductive reinforcing member 600 are all high heat conductance
Material, heat caused by the heat source of host 100 can sequentially pass through the first heat pipe 300, thermally conductive assembly 500 and thermally conductive benefit
Strong part 600, band to the second heat pipe 400 are radiated by the surface of thermally conductive shell 210 as cooling fin.Also, thermally conductive reinforcement
The structural strength of part 600 is greater than the structural strength of the second heat pipe 400, and when display 200 is rotated relative to host 100, structure is strong
The second heat pipe can be avoided on behalf of the extruding for bearing first pin-jointed structure 510a, 510b, 510c by spending biggish thermally conductive reinforcing member 600
400 deformations, are protected the structural intergrity of the second heat pipe 400, are maintained the heat-conducting effect of the second heat pipe 400, will be led with benefit
The thermally conductive shell 210 of heat continued conduction caused by the heat source of machine 100 to display 200 radiates.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any to be familiar with this skill
Technical staff, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore guarantor of the invention
Range is protected subject to the view scope of which is defined in the appended claims.
Claims (10)
1. a kind of electronic device characterized by comprising
One host；
One display is rotatablely arranged at the host, which has a thermally conductive shell；
One first heat pipe, is installed in the host；
One second heat pipe is installed in the thermally conductive shell；
One thermally conductive assembly, wherein one end is installed in the host and is connected in first heat pipe, and the other end has one first pivot joint
Structure；And
One thermally conductive reinforcing member, wherein one end is installed in the thermally conductive shell and coats second heat pipe, and the other end has one second pivot joint
Structure, second pin-jointed structure are articulated in first pin-jointed structure, and the structural strength of the thermally conductive reinforcing member is greater than second heat pipe
Structural strength.
2. electronic device according to claim 1, which is characterized in that first pin-jointed structure is pivot connected slot, second pivot
Binding structure is pivot.
3. electronic device according to claim 1, which is characterized in that first pin-jointed structure is pivot, second pivot joint
Structure is pivot connected slot.
4. electronic device according to claim 2, which is characterized in that second heat pipe includes a first segment and one second
Section, which connects the second segment, which is installed in the thermally conductive shell, which coats the first segment, this
Two sections have an annular surface, which is stacked on the annular surface of the second segment, by the annular of the second segment
Face ring is in being coated on.
5. electronic device according to claim 4, which is characterized in that the first segment of first heat pipe and second heat pipe
For pancake, the second segment of second heat pipe is circle.
6. a kind of heat pipe assembly, suitable for connecting a thermally conductive shell of a host and a display, which is characterized in that the heat pipe assembly
Include:
One first heat pipe, to be installed in the host；
One second heat pipe, to be installed in the thermally conductive shell；
One thermally conductive assembly, wherein one end is installed in the host and is connected in first heat pipe, and the other end has one first pivot joint
Structure；And
One thermally conductive reinforcing member, wherein one end is installed in the thermally conductive shell and coats second heat pipe, and the other end has one second pivot joint
Structure, second pin-jointed structure are articulated in first pin-jointed structure, and the structural strength of the thermally conductive reinforcing member is greater than second heat pipe
Structural strength.
7. heat pipe assembly according to claim 6, which is characterized in that first pin-jointed structure is pivot connected slot, second pivot
Binding structure is pivot.
8. heat pipe assembly according to claim 6, which is characterized in that first pin-jointed structure is pivot, second pivot joint
Structure is pivot connected slot.
9. heat pipe assembly according to claim 7, which is characterized in that second heat pipe includes a first segment and one second
Section, which connects the second segment, which is installed in the thermally conductive shell, which coats the first segment, this
Two sections have an annular surface, which is stacked on the annular surface of the second segment, by the annular of the second segment
Face ring is in being coated on.
10. heat pipe assembly according to claim 9, which is characterized in that first heat pipe and second heat pipe this first
Section is pancake, and the second segment of second heat pipe is circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810938707.5A CN108983931A (en) | 2018-08-17 | 2018-08-17 | Electronic device and heat pipe assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810938707.5A CN108983931A (en) | 2018-08-17 | 2018-08-17 | Electronic device and heat pipe assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108983931A true CN108983931A (en) | 2018-12-11 |
Family
ID=64554215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810938707.5A Withdrawn CN108983931A (en) | 2018-08-17 | 2018-08-17 | Electronic device and heat pipe assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108983931A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110134214A (en) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | Portable electronic devices |
| CN111979966A (en) * | 2020-08-28 | 2020-11-24 | 山东省交通规划设计院有限公司 | Plug-in type road ice and snow melting heat pipe and construction method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW587766U (en) * | 2002-04-12 | 2004-05-11 | Jiun-Fu Liou | Improved heat conductive super-conductive tube and body connection pivot device |
| CN2694357Y (en) * | 2004-04-21 | 2005-04-20 | 仁宝电脑工业股份有限公司 | Heat sink of portable computer system |
| CN2735423Y (en) * | 2004-06-22 | 2005-10-19 | 上海环达计算机科技有限公司 | Radiating structure of notebook computer |
| CN101989113A (en) * | 2009-07-30 | 2011-03-23 | 联想(北京)有限公司 | Heat dissipation system and computer with same |
-
2018
- 2018-08-17 CN CN201810938707.5A patent/CN108983931A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW587766U (en) * | 2002-04-12 | 2004-05-11 | Jiun-Fu Liou | Improved heat conductive super-conductive tube and body connection pivot device |
| CN2694357Y (en) * | 2004-04-21 | 2005-04-20 | 仁宝电脑工业股份有限公司 | Heat sink of portable computer system |
| CN2735423Y (en) * | 2004-06-22 | 2005-10-19 | 上海环达计算机科技有限公司 | Radiating structure of notebook computer |
| CN101989113A (en) * | 2009-07-30 | 2011-03-23 | 联想(北京)有限公司 | Heat dissipation system and computer with same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110134214A (en) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | Portable electronic devices |
| CN111979966A (en) * | 2020-08-28 | 2020-11-24 | 山东省交通规划设计院有限公司 | Plug-in type road ice and snow melting heat pipe and construction method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181211 |