TWI707117B - Heat pipe, heat pipe assembly and assemble method thereof - Google Patents
Heat pipe, heat pipe assembly and assemble method thereof Download PDFInfo
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- TWI707117B TWI707117B TW108119906A TW108119906A TWI707117B TW I707117 B TWI707117 B TW I707117B TW 108119906 A TW108119906 A TW 108119906A TW 108119906 A TW108119906 A TW 108119906A TW I707117 B TWI707117 B TW I707117B
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Abstract
Description
本發明係關於一種熱管、熱管組及其組接方法,特別是一種轉動式的熱管、熱管組及其組接方法。The invention relates to a heat pipe, a heat pipe group and an assembling method thereof, in particular to a rotating heat pipe, a heat pipe group and an assembling method thereof.
隨著電子領域技術的演進,電子元件的效能不斷提升,而效能的提升卻也使電子元件產生的熱量增加。若無法有效將熱量自電子元件排除,電子元件的溫度將因熱量的累積而升高。當電子元件的溫度過高時,便會使電子元件發生當機,甚至燒毀的情形。因此可攜式電子裝置如可攜式電腦通常於設有中央處理器的主機座中配置散熱模組。但主機座有限的空間已漸漸不足以應付電子元件不斷提高的散熱需求。因此,為了提供電子元件額外的散熱途徑,廠商紛紛設置熱管組於顯示器以及主機座之間以將電子元件所產生的熱量傳遞至顯示器協助散熱。With the evolution of technology in the electronic field, the performance of electronic components has continued to increase, and the increase in performance has also increased the heat generated by the electronic components. If the heat cannot be effectively removed from the electronic components, the temperature of the electronic components will increase due to the accumulation of heat. When the temperature of the electronic components is too high, it will cause the electronic components to crash or even burn out. Therefore, a portable electronic device such as a portable computer is usually equipped with a heat dissipating module in a host base equipped with a central processing unit. However, the limited space of the host base is gradually insufficient to meet the increasing heat dissipation requirements of electronic components. Therefore, in order to provide additional heat dissipation paths for electronic components, manufacturers have installed heat pipe groups between the display and the host base to transfer the heat generated by the electronic components to the display to assist in heat dissipation.
詳細來說,熱管組包含一第一熱管及一第二熱管。第一熱管設置於主機座,並熱接觸於主機座內之熱源。第二熱管具有一插槽,且插槽供第一熱管插設,以令第二熱管可轉動地接合於第一熱管。第二熱管熱接觸於顯示器之導熱外殼,以透過熱管組將熱源所產生的熱量傳遞至顯示器之導熱外殼。此外,第一熱管與第二熱管相接之處一般會塗抹潤滑劑,以讓第二熱管相對第一熱管轉動時能更順暢。不過,因為插槽不易觀察的關係,故將潤滑劑加入插槽時,潤滑劑的添加量並不易控制。若潤滑劑的添加量過少,則第二熱管與第一熱管的轉動順暢度不足。若潤滑劑的添加量過多,則在第一熱管插入時,插槽內會形成一氣阻將第一熱管向外推。如此一來,將造成第一熱管與第二熱管的組裝品質不佳以及產生潤滑劑外漏的問題。In detail, the heat pipe group includes a first heat pipe and a second heat pipe. The first heat pipe is arranged on the main base and is in thermal contact with the heat source in the main base. The second heat pipe has a slot, and the slot is inserted into the first heat pipe so that the second heat pipe can be rotatably connected to the first heat pipe. The second heat pipe is in thermal contact with the heat conducting shell of the display, so as to transfer the heat generated by the heat source to the heat conducting shell of the display through the heat pipe group. In addition, a lubricant is generally applied to the junction of the first heat pipe and the second heat pipe, so that the second heat pipe rotates more smoothly relative to the first heat pipe. However, because the slot is not easy to observe, the amount of lubricant added is not easy to control when adding lubricant to the slot. If the amount of lubricant added is too small, the smoothness of the rotation of the second heat pipe and the first heat pipe is insufficient. If the amount of lubricant added is too much, when the first heat pipe is inserted, an air resistance will be formed in the slot to push the first heat pipe outward. As a result, the assembly quality of the first heat pipe and the second heat pipe will be poor and the problem of lubricant leakage will occur.
本發明在於提供一種熱管、熱管組及其組接方法,藉以確保熱管組的組裝品質,以及避免潤滑劑外漏的問題。The present invention is to provide a heat pipe, a heat pipe group and an assembling method thereof, so as to ensure the assembly quality of the heat pipe group and avoid the problem of lubricant leakage.
本發明之一實施例所揭露之熱管包含一本體段及一樞接段。樞接段連接於本體段,並與本體段共同形成一中空管體。其中,樞接段具有一環形表面及至少一凹陷部,凹陷部位於環形表面。The heat pipe disclosed in an embodiment of the present invention includes a body section and a pivot section. The pivot section is connected to the main body section and forms a hollow tube body together with the main body section. Wherein, the pivot section has an annular surface and at least one recessed portion, and the recessed portion is located on the annular surface.
本發明之另一實施例所揭露之熱管組包含一第一熱管及一第二熱管。第一熱管具有一樞接槽。第二熱管包含一本體段及一樞接段。樞接段連接於本體段,並與本體段共同形成一中空管體。樞接段可轉動地位於樞接槽。其中,樞接段具有一環形表面及至少一凹陷部。至少一凹陷部位於環形表面。The heat pipe set disclosed in another embodiment of the present invention includes a first heat pipe and a second heat pipe. The first heat pipe has a pivot groove. The second heat pipe includes a body section and a pivot section. The pivot section is connected to the main body section and forms a hollow tube body together with the main body section. The pivot section is rotatably located in the pivot groove. Wherein, the pivotal section has an annular surface and at least one recess. At least one recess is located on the annular surface.
本發明之另一實施例所揭露之熱管組的組接方法包含下列步驟。將一潤滑劑塗抹於其中一熱管之一樞接段之凹陷部。將其中一熱管之樞接段插設於另一熱管之樞接槽。令其中一熱管相對另一熱管轉動,以令潤滑劑塗抹於另一熱管形成樞接槽的壁面。The assembling method of the heat pipe group disclosed in another embodiment of the present invention includes the following steps. Apply a lubricant to the recess of one of the pivoted sections of one of the heat pipes. Insert the pivot section of one heat pipe into the pivot groove of the other heat pipe. One of the heat pipes is rotated relative to the other heat pipe, so that the lubricant is spread on the wall surface of the other heat pipe to form the pivot groove.
根據上述實施例之熱管、熱管組及其組接方法,透過將潤滑劑填入第二熱管之凹陷部而非第一熱管之樞接槽,以藉由調整凹陷部之尺寸設計值來控制潤滑劑之填充量。如此一來,將可避免潤滑劑填充量過量而造成熱管組組裝品質不良與潤滑劑外漏的問題,或是避免潤滑劑填充量不足而影響熱管組之轉動順暢度。According to the heat pipes, heat pipe groups and their assembling methods of the above embodiments, the lubrication can be controlled by adjusting the design value of the recesses by filling the recesses of the second heat pipes instead of the pivot grooves of the first heat pipes with lubricant The filling amount of the agent. In this way, the problem of poor assembly quality of the heat pipe assembly and lubricant leakage caused by excessive lubricant filling can be avoided, or insufficient lubricant filling can affect the smoothness of the heat pipe assembly rotation.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.
請參閱圖1至圖3。圖1為根據本發明第一實施例所述之熱管組設置於電子裝置的立體示意圖。圖2為圖1之熱管組的分解示意圖。圖3為圖2之第二熱管的局部放大示意圖。Please refer to Figure 1 to Figure 3. FIG. 1 is a three-dimensional schematic diagram of the heat pipe set in an electronic device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of the heat pipe assembly of Fig. 1. FIG. 3 is a partial enlarged schematic diagram of the second heat pipe of FIG. 2.
本實施例之熱管組10設置於一電子裝置20。電子裝置20例如為筆記型電腦、平板電腦或折疊式手機。在本實施例中,電子裝置20以筆記型電腦為例,並包含一主機座22及一顯示器26。主機座22裝設有一熱源24。熱源24例如為中央處理器、南橋晶片、北橋晶片或顯示卡晶片。顯示器26具有顯示面板,以顯示影像。顯示器26樞設於主機座22,以令顯示器26能夠相對主機座22轉動。The
熱管組10包含一第一熱管100及一第二熱管200。第一熱管100裝設於電子裝置20之主機座22並熱接觸於主機座22之熱源24。第一熱管100具有一樞接槽110。第二熱管200裝設於顯示器26,並包含一本體段210及一樞接段220。本體段210呈扁管狀並熱接觸顯示器26之導熱外殼。樞接段220連接於本體段210並與本體段210共同形成一中空管體。中空管體之內部空間用以供冷卻流體進行冷卻循環。樞接段220插設於第一熱管100之樞接槽110並可轉動地位於樞接槽110。如此一來,當顯示器26相對主機座22轉動時,第二熱管200能夠隨著顯示器26移動而相對第一熱管100轉動。The
在本實施例中,第一熱管100的最大寬度D1大於第二熱管200之樞接段220的直徑D2。舉例來說,第一熱管100的最大寬度D1為8毫米,且樞接槽110的孔徑H為4毫米。第二熱管200之樞接段220的直徑D2匹配於樞接槽110的孔徑H同樣為4毫米。In this embodiment, the maximum width D1 of the
在本實施例中,樞接段220具有一環形表面221及多個凹陷部222。這些凹陷部222例如為凹槽並位於環形表面221。這些凹陷部222之長邊L平行於樞接段220之中心軸線A,且自樞接段220遠離本體段210之一端朝本體段210延伸。這些凹陷部222例如用以容置膏狀的潤滑劑。In this embodiment, the
在本實施例中,凹陷部222的數量為多個,但並不以此為限。在其他實施例中,凹陷部的數量也可以僅為單個。In this embodiment, the number of
以下將說明本實施例之熱管組10的組接方法。首先,請參閱圖4至圖8。圖4至圖8為熱管組的組接過程示意圖。如圖4所示,將一潤滑劑30填入第二熱管200之樞接段220之凹陷部222。接著,如圖5與圖6所示,將第二熱管200之樞接段220插設於第一熱管100之樞接槽110,且形成樞接槽110的壁面中有部分因與凹陷部222內之潤滑劑30接觸而塗佈有潤滑劑30,但有另一部分因未與凹陷部222內之潤滑劑30接觸而仍未塗佈有潤滑劑30。接著,如圖7與圖8所示,令第二熱管200沿方向A相對第一熱管100轉動,以令潤滑劑30塗抹於第一熱管100形成樞接槽110的壁面。The assembling method of the
由於潤滑劑30之填充量與凹陷部222之尺寸成正比,因此可藉由調整凹陷部222之尺寸設計值來控制潤滑劑30之填充量。如此一來,將可避免潤滑劑30填充量過量而造成熱管組10組裝品質不良與潤滑劑30外漏的問題,或是避免潤滑劑30填充量不足而影響熱管組10之轉動順暢度。Since the filling amount of the
在上述實施例中,凹陷部222之長邊L平行於樞接段220之中心軸線A,但並不以此為限。請參閱圖9與圖10,圖9為根據本發明第二實施例所述之第二熱管的局部放大示意圖。圖10為根據本發明第三實施例所述之第二熱管的局部放大示意圖。In the above embodiment, the long side L of the
如圖9所示,本實施例之第二熱管200a包含有一本體段210及一樞接段220a。本體段210之結構與上述第一實施例之本體段210之結構相似故不再贅述。樞接段220a具有一環形表面221及多個凹陷部222a。這些凹陷部222a例如為凹槽並位於環形表面221。這些凹陷部222a環繞樞接段220a之中心軸線A。As shown in FIG. 9, the
如圖10所示,本實施例之第二熱管200b包含有一本體段210及一樞接段220b。本體段210之結構與上述第一實施例之本體段210之結構相似故不再贅述。樞接段220b具有一環形表面221及一個凹陷部222b。凹陷部222b例如為凹槽並位於環形表面221。凹陷部222b呈螺旋狀,並圍繞樞接段220b之中心軸線A。As shown in FIG. 10, the
根據上述實施例之熱管、熱管組及其組接方法,透過將潤滑劑填入第二熱管之凹陷部而非第一熱管之樞接槽,以藉由調整凹陷部之尺寸設計值來控制潤滑劑之填充量。如此一來,將可避免潤滑劑填充量過量而造成熱管組組裝品質不良與潤滑劑外漏的問題,或是避免潤滑劑填充量不足而影響熱管組之轉動順暢度。According to the heat pipes, heat pipe groups and their assembling methods of the above embodiments, the lubrication can be controlled by adjusting the design value of the recesses by filling the recesses of the second heat pipes instead of the pivot grooves of the first heat pipes with lubricant The filling amount of the agent. In this way, the problem of poor assembly quality of the heat pipe assembly and lubricant leakage caused by excessive lubricant filling can be avoided, or insufficient lubricant filling can affect the smoothness of the heat pipe assembly rotation.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing embodiments as described above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.
10:熱管組
20:電子裝置
22:主機座
24:熱源
26:顯示器
30:潤滑劑
100:第一熱管
110:樞接槽
200、200a、200b:第二熱管
210:本體段
220、220a、220b:樞接段
221:環形表面
222、222a、222b:凹陷部
A:中心軸線
D1:寬度
D2:直徑
H:孔徑
L:長邊
10: Heat pipe group
20: Electronic device
22: Main unit
24: Heat source
26: display
30: Lubricant
100: The first heat pipe
110:
圖1為根據本發明第一實施例所述之熱管組設置於電子裝置的立體示意圖。 圖2為圖1之熱管組的分解示意圖。 圖3為圖2之第二熱管的局部放大示意圖。 圖4至圖8為熱管組的組接過程示意圖。 圖9為根據本發明第二實施例所述之第二熱管的局部放大示意圖。 圖10為根據本發明第三實施例所述之第二熱管的局部放大示意圖。 FIG. 1 is a three-dimensional schematic diagram of the heat pipe set in an electronic device according to the first embodiment of the present invention. Fig. 2 is an exploded schematic diagram of the heat pipe assembly of Fig. 1. FIG. 3 is a partial enlarged schematic diagram of the second heat pipe of FIG. 2. 4 to 8 are schematic diagrams of the assembly process of the heat pipe group. Fig. 9 is a partial enlarged schematic view of the second heat pipe according to the second embodiment of the present invention. Fig. 10 is a partial enlarged schematic view of the second heat pipe according to the third embodiment of the present invention.
10:熱管組 10: Heat pipe group
100:第一熱管 100: The first heat pipe
110:樞接槽 110: pivot slot
200:第二熱管 200: second heat pipe
210:本體段 210: body segment
220:樞接段 220: pivot section
221:環形表面 221: ring surface
222:凹陷部 222: Depressed part
D1:寬度 D1: width
D2:直徑 D2: diameter
H:孔徑 H: Aperture
Claims (10)
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5718282A (en) * | 1995-08-30 | 1998-02-17 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
US6097596A (en) * | 1998-02-12 | 2000-08-01 | International Business Machines Corporation | Portable computer rotational heat pipe heat transfer |
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2019
- 2019-06-10 TW TW108119906A patent/TWI707117B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5718282A (en) * | 1995-08-30 | 1998-02-17 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
US6097596A (en) * | 1998-02-12 | 2000-08-01 | International Business Machines Corporation | Portable computer rotational heat pipe heat transfer |
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