TWI503071B - Electronic device - Google Patents
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- TWI503071B TWI503071B TW101150374A TW101150374A TWI503071B TW I503071 B TWI503071 B TW I503071B TW 101150374 A TW101150374 A TW 101150374A TW 101150374 A TW101150374 A TW 101150374A TW I503071 B TWI503071 B TW I503071B
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Description
本發明是有關於一種電子裝置，且特別是有關於一種散熱效果較佳的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a better heat dissipation effect.
隨著現今科技的進步，由於筆記型電腦的功能日益茁壯，且其體積越來越小也便於攜帶，因此逐漸地成為消費性電子產品的市場主流。為了降低筆記型電腦的厚度，部分筆記型電腦搭配低瓦數的中央處理單元並採用無風扇的設計。無風扇的設計大多都是將中央處理單元的熱源透過傳導的方式把熱量傳至下機殼，下機殼的表面再藉由輻射與對流的方式以排熱。然而，受限於下機殼的表面積與材質，熱量較難被完全排除，而使得下機體發生過熱的狀況，甚至可能造成系統當機。With the advancement of today's technology, notebook computers have gradually become the mainstream of consumer electronics products due to their increasingly powerful functions and their small size and portability. To reduce the thickness of the notebook, some notebooks feature a low-wattage central processing unit and a fanless design. Most of the fanless design transmits heat to the lower casing through the conduction of the heat source of the central processing unit, and the surface of the lower casing is exhausted by radiation and convection. However, due to the surface area and material of the lower case, it is difficult to completely eliminate the heat, which may cause the lower body to overheat, and may even cause the system to crash.
目前，亦有筆記型電腦藉由將中央處理單元所產生的熱量傳導至上機體的方式以增加散熱面積，但由於筆記型電腦的上機體與下機體之間以樞接的方式連接，上下機體的熱管會承受到轉動應力而影響其使用壽命。此外，此類筆記型電腦通常會使用幫浦來使冷卻流體在上下機體的熱管中對流，以快速地帶走熱量。然而，此設計會增加筆記型電腦的厚度並產生噪音。At present, there are also notebook computers that increase the heat dissipation area by transferring the heat generated by the central processing unit to the upper body. However, since the upper body of the notebook computer is connected to the lower body in a pivotal manner, the upper and lower body are connected. The heat pipe will withstand the rotational stress and affect its service life. In addition, such notebooks typically use a pump to convect cooling fluid in the heat pipes of the upper and lower bodies to quickly remove heat. However, this design increases the thickness of the notebook and creates noise.
本發明提供一種電子裝置，其具有較佳的散熱效果。The invention provides an electronic device which has a better heat dissipation effect.
本發明提出一種電子裝置，包括一第一機體及一第二機體。第一機體包括一第一熱源、一第一熱管及一傳熱臂，第一熱管連接於傳熱臂，且第一熱管與傳熱臂的其中之一連接於第一熱源。第二機體樞接於第一機體，第二機體包括一第二熱管，第二熱管樞接且熱耦合於傳熱臂。第一熱管、傳熱臂及第二熱管內分別具有一冷卻流體。The invention provides an electronic device comprising a first body and a second body. The first body includes a first heat source, a first heat pipe and a heat transfer arm. The first heat pipe is connected to the heat transfer arm, and one of the first heat pipe and the heat transfer arm is connected to the first heat source. The second body is pivotally connected to the first body, and the second body includes a second heat pipe, and the second heat pipe is pivotally connected and thermally coupled to the heat transfer arm. The first heat pipe, the heat transfer arm and the second heat pipe respectively have a cooling fluid.
基於上述，本發明之電子裝置透過第一熱管或傳熱臂連接於第一熱源，傳熱臂熱耦合於第一熱管與第二熱管，以將第一熱源所產生的熱量分散至第一機體與第二機體。由於第二熱管與傳熱臂之間以樞接的方式連接，當第二機體相對於第一機體轉動時，可降低第二熱管受到轉動應力的影響。並且，傳熱臂亦藉由冷卻流體進行熱交換，可提供較佳的散熱效果。Based on the above, the electronic device of the present invention is connected to the first heat source through the first heat pipe or the heat transfer arm, and the heat transfer arm is thermally coupled to the first heat pipe and the second heat pipe to disperse heat generated by the first heat source to the first body. With the second body. Since the second heat pipe and the heat transfer arm are connected in a pivotal manner, when the second body rotates relative to the first body, the second heat pipe can be reduced in the influence of the rotational stress. Moreover, the heat transfer arm is also heat exchanged by the cooling fluid to provide a better heat dissipation effect.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1是依照本發明之一實施例之一種電子裝置的立體示意圖。請參閱圖1，本實施例之電子裝置100包括一第一機體110及一第二機體120。在本實施例中，電子裝置100為筆記型電腦，第一機體110為筆記型電腦的主機，第二機體120為筆記型電腦的螢幕，但電子裝置100、第 一機體110與第二機體120的種類不以此為限制。1 is a perspective view of an electronic device in accordance with an embodiment of the present invention. Referring to FIG. 1 , the electronic device 100 of the embodiment includes a first body 110 and a second body 120 . In this embodiment, the electronic device 100 is a notebook computer, the first body 110 is a host of a notebook computer, and the second body 120 is a screen of a notebook computer, but the electronic device 100, The types of the first body 110 and the second body 120 are not limited thereto.
圖2是圖1之電子裝置的第一熱管、傳熱臂及第二熱管的立體示意圖。圖3是圖2的局部剖面示意圖。請參閱圖2及圖3，第一機體110包括一第一熱源112、一第一熱管114、一傳熱臂116及一第一機殼119。第一熱源112、第一熱管114及傳熱臂116位於第一機殼119內。在本實施例中，第一熱源112包括一中央處理單元，但在其他實施例中，第一熱源112亦可為記憶體模組或是硬碟等。傳熱臂116連接於第一熱源112，第一熱管114連接於傳熱臂116且熱耦合於第一機殼119。在其他實施例中，亦可是第一熱管114與第一熱源112連接以將第一熱源112所產生的熱量帶離。2 is a perspective view of the first heat pipe, the heat transfer arm, and the second heat pipe of the electronic device of FIG. 1. Figure 3 is a partial cross-sectional view of Figure 2. Referring to FIG. 2 and FIG. 3 , the first body 110 includes a first heat source 112 , a first heat pipe 114 , a heat transfer arm 116 , and a first casing 119 . The first heat source 112, the first heat pipe 114, and the heat transfer arm 116 are located in the first casing 119. In this embodiment, the first heat source 112 includes a central processing unit, but in other embodiments, the first heat source 112 can also be a memory module or a hard disk. The heat transfer arm 116 is coupled to the first heat source 112, and the first heat pipe 114 is coupled to the heat transfer arm 116 and thermally coupled to the first housing 119. In other embodiments, the first heat pipe 114 may be connected to the first heat source 112 to carry away the heat generated by the first heat source 112.
第二機體120包括一第二熱管122、一第二熱源124、一第二機殼126及一樞軸128。第一機體110樞接於第二機體120之樞軸128上。第二熱管122與第二熱源124位於該第二機殼126內。第二熱管122樞接且熱耦合於傳熱臂116。在本實施例中，第二熱源124為螢幕的光源(LED light bar)，在其他實施例中，第二熱源124亦可為螢幕的晶片組(LED driver chipset)，第二熱源124之種類不以此為限制。The second body 120 includes a second heat pipe 122, a second heat source 124, a second casing 126, and a pivot 128. The first body 110 is pivotally connected to the pivot 128 of the second body 120. The second heat pipe 122 and the second heat source 124 are located in the second casing 126. The second heat pipe 122 is pivotally coupled and thermally coupled to the heat transfer arm 116. In this embodiment, the second heat source 124 is a LED light bar. In other embodiments, the second heat source 124 can also be a LED driver chipset, and the second heat source 124 is not This is a limitation.
如圖1所示，在本實施例中，第二熱管122與傳熱臂116的樞接處(也就是第二熱管122的旋轉中心)與第二機體120之樞軸128沿著相同的軸線設置。透過這樣的配置方式可使得本實施例之第二機體120相對於第一機體 110轉動的動作主要是由樞軸128負責，也就是說，第二機體120相對於第一機體110轉動時，主要受力端仍為樞軸128本身，傳熱臂116與第二熱管122之間可不需承受旋轉時所造成的切向應力。因此，可有效地提升第二熱管122與傳熱臂116之間的可靠度以及樞轉壽命。As shown in FIG. 1, in the present embodiment, the pivotal joint of the second heat pipe 122 and the heat transfer arm 116 (that is, the center of rotation of the second heat pipe 122) and the pivot 128 of the second body 120 are along the same axis. Settings. The second body 120 of the embodiment can be made relative to the first body through such a configuration. The action of the rotation of the 110 is mainly caused by the pivot 128. That is to say, when the second body 120 rotates relative to the first body 110, the main force end is still the pivot 128 itself, and the heat transfer arm 116 and the second heat pipe 122 It is not necessary to withstand the tangential stress caused by the rotation. Therefore, the reliability and the pivoting life between the second heat pipe 122 and the heat transfer arm 116 can be effectively improved.
在本實施例中，傳熱臂116為一封閉空腔。傳熱臂116之材質可以是金屬或是塑膠，傳熱臂116內部填充冷卻流體以降溫。若傳熱臂116的材質為金屬，傳熱臂116的內部架構可如同熱板，內層有毛細結構，其搭配的冷卻流體可為水，藉由水受熱汽化及冷凝後的水沿毛細結構回來以形成循環。若傳熱臂116的材質為塑膠時，冷卻流體可為乙醚或氫氟醚(HFEs)，氫氟醚例如是市面上3M公司所生產的Novec液體，其具有低沸點、低毛細力、高熱焓的特性，藉由兩相變化而將熱量帶走。當然，傳熱臂116的材質與冷卻流體的種類不以上述為限制。In this embodiment, the heat transfer arm 116 is a closed cavity. The material of the heat transfer arm 116 may be metal or plastic, and the heat transfer arm 116 is internally filled with a cooling fluid to cool down. If the material of the heat transfer arm 116 is metal, the internal structure of the heat transfer arm 116 can be like a hot plate, and the inner layer has a capillary structure, and the cooling fluid associated with it can be water, and the water is heated and vaporized by the water along the capillary structure. Come back to form a loop. If the material of the heat transfer arm 116 is plastic, the cooling fluid may be diethyl ether or hydrofluoroether (HFEs). For example, the hydrofluoroether is a Novec liquid produced by 3M Company on the market, which has low boiling point, low capillary force and high heat. The characteristic is that the heat is taken away by two-phase changes. Of course, the material of the heat transfer arm 116 and the type of the cooling fluid are not limited to the above.
此外，如圖2所示，本實施例之第一熱管114與第二熱管122分別為一封閉式的環狀管體，第一熱管114與第二熱管122內分別填入冷卻流體，受熱時，便可產生兩相流體的循環。第一熱管114與第二熱管122的內部架構以及冷卻流體的種類可如同上面所述，但不以此為限制。並且，在其他實施例中，第一熱管114與第二熱管122亦可為直管，第一熱管114與第二熱管122的形狀不以此為限制。In addition, as shown in FIG. 2, the first heat pipe 114 and the second heat pipe 122 of the embodiment are respectively a closed annular pipe body, and the first heat pipe 114 and the second heat pipe 122 are respectively filled with a cooling fluid, and when heated, , a cycle of two-phase fluid can be produced. The internal structure of the first heat pipe 114 and the second heat pipe 122 and the kind of the cooling fluid may be as described above, but are not limited thereto. Moreover, in other embodiments, the first heat pipe 114 and the second heat pipe 122 may also be straight pipes, and the shapes of the first heat pipe 114 and the second heat pipe 122 are not limited thereto.
另外，為了使冷卻流體在第一熱管114與第二熱管122 沿特定方向循環，以避免冷卻流體與氣化後的氣體在第一熱管114與第二熱管122內混流而降低散熱效果。在本實施例中，第一熱管114在與傳熱臂116接觸位置的兩端具有不同的管徑，且第二熱管122在與傳熱臂116熱耦合處的兩端亦具有不同的管徑。In addition, in order to make the cooling fluid in the first heat pipe 114 and the second heat pipe 122 Cycling in a specific direction to prevent the cooling fluid and the vaporized gas from mixing in the first heat pipe 114 and the second heat pipe 122 to reduce the heat dissipation effect. In the present embodiment, the first heat pipe 114 has different pipe diameters at both ends in contact with the heat transfer arm 116, and the second heat pipe 122 has different pipe diameters at both ends of the heat coupling arm 116. .
詳細而言，在本實施例中，藉由第一熱管114與第二熱管122的管徑大小分別具有變化，根據白努力定律，大管徑處具有較大的壓力，而使得冷卻流體往壓力較小(小管徑)的方向流動，因此，冷卻流體便可在第一熱管114與第二熱管122內自動形成循環而不需額外使用幫浦。如此一來，電子裝置100之整體外型可較為輕薄，亦可避免噪音的產生。In detail, in the present embodiment, the diameters of the first heat pipe 114 and the second heat pipe 122 are respectively changed. According to the white effort law, the large pipe diameter has a large pressure, and the cooling fluid is pressurized. The flow in the smaller (small diameter) direction allows the cooling fluid to automatically circulate in the first heat pipe 114 and the second heat pipe 122 without the need for additional pumps. In this way, the overall appearance of the electronic device 100 can be relatively thin and light, and noise can be avoided.
請參閱圖3，在本實施例中，傳熱臂116包括一容置槽116a，第二熱管122之一部分位於容置槽116a。一導熱介質10填充於容置槽116a與第二熱管122的此部分之間。導熱介質10可為散熱膏或油，但導熱介質10的種類不以此為限制。Referring to FIG. 3, in the embodiment, the heat transfer arm 116 includes a receiving groove 116a, and one of the second heat pipes 122 is partially located in the receiving groove 116a. A heat transfer medium 10 is filled between the accommodating groove 116a and the portion of the second heat pipe 122. The heat conductive medium 10 may be a thermal grease or oil, but the type of the heat conductive medium 10 is not limited thereto.
在本實施例中，自第一熱源112所產生的熱量傳遞至傳熱臂116，再經傳熱臂116往第一熱管114與第二熱管122傳去，由於第一熱管114熱耦合於第一機殼119，在第一熱管114上的熱量便會傳至第一機殼119而以輻射與對流的方式排出，其位置可能是底面或是鍵盤處等。In this embodiment, the heat generated from the first heat source 112 is transferred to the heat transfer arm 116, and then transmitted to the first heat pipe 114 and the second heat pipe 122 via the heat transfer arm 116, since the first heat pipe 114 is thermally coupled to the first heat pipe 114. The heat of the first heat pipe 114 is transmitted to the first casing 119 to be radiated and convected, and the position may be the bottom surface or the keyboard.
並且，由於第二熱管122熱耦合於第二機殼126，被傳到第二熱管122上的熱量亦會被傳至第二機殼126，再 由第二機殼126將熱量以輻射與對流的方式排出。本實施例之電子裝置100藉由使用第一機殼119與第二機殼126來進行大面積的散熱，以在無風扇的狀況下仍可保持良好的散熱效果。當然，本實施例亦可應用於有風扇的裝置，以加強整體散熱效果。Moreover, since the second heat pipe 122 is thermally coupled to the second casing 126, the heat transferred to the second heat pipe 122 is also transmitted to the second casing 126, and then Heat is discharged by the second casing 126 in a manner of radiation and convection. The electronic device 100 of the present embodiment performs large-area heat dissipation by using the first casing 119 and the second casing 126 to maintain a good heat dissipation effect without a fan. Of course, the embodiment can also be applied to a device with a fan to enhance the overall heat dissipation effect.
此外，由於高解析度之液晶螢幕成為目前的主流，高解析度的液晶螢幕伴隨著較高的耗電量，勢必會造成液晶螢幕本身的溫度上升，而液晶螢幕的壽命會隨著溫度升高而遞減。一般而言，液晶螢幕在晶片組或是光源處(也就是第二熱源124的位置)可能會有較高的溫度，因此這兩個位置較容易出現異色的現象。在本實施例中，可將第二熱管122的路徑經過第二熱源124，第二熱源124所產生的熱量以降低螢幕本身的溫度，進而增加螢幕壽命並降低亮點之發生。In addition, because the high-resolution LCD screen has become the mainstream, the high-resolution LCD screen is accompanied by higher power consumption, which will inevitably cause the temperature of the LCD screen to rise, and the life of the LCD screen will increase with temperature. And decrement. In general, the liquid crystal screen may have a higher temperature at the wafer set or the light source (that is, the position of the second heat source 124), so the two positions are more prone to heterochromatic phenomena. In this embodiment, the path of the second heat pipe 122 can pass through the heat generated by the second heat source 124 and the second heat source 124 to lower the temperature of the screen itself, thereby increasing the life of the screen and reducing the occurrence of bright spots.
圖4是圖1之電子裝置的第二熱管122相對於傳熱臂116轉動的示意圖。從圖4可看出，於使用者將電子裝置100之液晶螢幕閉合於主機時，兩熱管仍能各自獨立運作帶走熱量，提升使用者經驗。4 is a schematic view of the second heat pipe 122 of the electronic device of FIG. 1 rotated relative to the heat transfer arm 116. As can be seen from FIG. 4, when the user closes the liquid crystal screen of the electronic device 100 to the host computer, the two heat pipes can still operate independently to take away heat, thereby improving user experience.
圖5是依照本發明之另一實施例之一種電子裝置的正面示意圖。圖6是圖5之電子裝置的立體示意圖。圖7是圖5之電子裝置的側面示意圖。請參閱圖5至圖7，圖5之電子裝置200與圖1之電子裝置100的主要差異在於，圖5之電子裝置200的樞軸218位於第一機體210，第二機體220樞接於第一機體210的樞軸218以相對於第一機 體210轉動。也就是說，在圖5中，樞軸218位於較低的位置。FIG. 5 is a front elevational view of an electronic device in accordance with another embodiment of the present invention. 6 is a perspective view of the electronic device of FIG. 5. 7 is a side elevational view of the electronic device of FIG. 5. Referring to FIG. 5 to FIG. 7 , the main difference between the electronic device 200 of FIG. 5 and the electronic device 100 of FIG. 1 is that the pivot 218 of the electronic device 200 of FIG. 5 is located in the first body 210, and the second body 220 is pivotally connected to the first body 210. a pivot 218 of a body 210 relative to the first machine The body 210 rotates. That is, in Figure 5, the pivot 218 is in a lower position.
為了使第二機體220相對於第一機體210轉動的動作仍是由樞軸218負責，而使得傳熱臂216與第二熱管222之間可不需承受旋轉時所造成的切向應力，而延長第二熱管222與傳熱臂216之間的轉動壽命。在本實施例中，樞軸218與第二熱管222的旋轉中心仍為同一中心，也就是在圖5中第二熱管222的旋轉中心相較於圖1之第二熱管122的旋轉中心位於較低的位置。因為樞軸218的位置改變，本實施例之傳熱臂216與第二熱管222的外型亦隨之改變。但上述配置並不影響本實施例之電子裝置200如同前面敘述的效能與特性，也就是說本實施例之電子裝置200亦能提供良好的散熱效果並且可避免噪音。In order to rotate the second body 220 relative to the first body 210, the pivot 218 is still responsible, so that the tangential stress caused by the rotation between the heat transfer arm 216 and the second heat pipe 222 is not required to be extended. The rotational life between the second heat pipe 222 and the heat transfer arm 216. In this embodiment, the pivot center 218 and the center of rotation of the second heat pipe 222 are still at the same center, that is, the center of rotation of the second heat pipe 222 in FIG. 5 is located closer to the center of rotation of the second heat pipe 122 of FIG. Low position. Because the position of the pivot 218 changes, the appearance of the heat transfer arm 216 and the second heat pipe 222 of the present embodiment also changes. However, the above configuration does not affect the performance and characteristics of the electronic device 200 of the present embodiment as described above, that is, the electronic device 200 of the present embodiment can also provide a good heat dissipation effect and can avoid noise.
綜上所述，本發明之電子裝置透過第一熱管或傳熱臂連接於第一熱源，傳熱臂熱耦合於第一熱管與第二熱管，以將第一熱源所產生的熱量分散至第一機體與第二機體。由於第二熱管與傳熱臂之間以樞接的方式連接且與第一機體及第二機體之間的樞軸共軸，當第二機體相對於第一機體轉動時，藉由第一機體及第二機體之間的樞軸承擔兩者的轉動應力，而降低第二熱管受到轉動應力的影響。並且，傳熱臂亦藉由冷卻流體進行熱交換，可提供較佳的散熱效果。此外，第一熱管和第二熱管在與傳熱臂熱耦合處的兩端具有不同的管徑，透過白努力定律而使位於其內的冷卻流體循環，無須額外使用幫浦，有效達到省電並降低噪音 的功效。In summary, the electronic device of the present invention is connected to the first heat source through the first heat pipe or the heat transfer arm, and the heat transfer arm is thermally coupled to the first heat pipe and the second heat pipe to disperse the heat generated by the first heat source to the first A body and a second body. Since the second heat pipe and the heat transfer arm are connected in a pivotal manner and are coaxial with the pivot between the first body and the second body, when the second body rotates relative to the first body, by the first body The pivot between the second body and the second body bear the rotational stress of both, and the second heat pipe is affected by the rotational stress. Moreover, the heat transfer arm is also heat exchanged by the cooling fluid to provide a better heat dissipation effect. In addition, the first heat pipe and the second heat pipe have different pipe diameters at both ends of the thermal coupling with the heat transfer arm, and the cooling fluid located therein is circulated through the white effort law, and no additional pump is needed, thereby effectively saving power. And reduce noise The effect.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧導熱介質10‧‧‧ Thermal medium
100、200‧‧‧電子裝置100, 200‧‧‧ electronic devices
110、210‧‧‧第一機體110, 210‧‧‧ first body
112‧‧‧第一熱源112‧‧‧First heat source
114‧‧‧第一熱管114‧‧‧First heat pipe
116、216‧‧‧傳熱臂116, 216‧‧‧ heat transfer arm
116a‧‧‧容置槽116a‧‧‧容槽
119‧‧‧第一機殼119‧‧‧ first case
120、220‧‧‧第二機體120, 220‧‧‧ second body
122、222‧‧‧第二熱管122, 222‧‧‧ second heat pipe
124‧‧‧第二熱源124‧‧‧second heat source
126‧‧‧第二機殼126‧‧‧ second casing
128‧‧‧樞軸128‧‧‧ pivot
218‧‧‧樞軸218‧‧‧ pivot
圖1是依照本發明之一實施例之一種電子裝置的立體示意圖。1 is a perspective view of an electronic device in accordance with an embodiment of the present invention.
圖2是圖1之電子裝置的第一熱管、傳熱臂及第二熱管的立體示意圖。2 is a perspective view of the first heat pipe, the heat transfer arm, and the second heat pipe of the electronic device of FIG. 1.
圖3是圖2的局部剖面示意圖。Figure 3 is a partial cross-sectional view of Figure 2.
圖4是圖1之電子裝置的第二熱管相對於傳熱臂轉動的示意圖。4 is a schematic view showing the second heat pipe of the electronic device of FIG. 1 rotated relative to the heat transfer arm.
圖5是依照本發明之另一實施例之一種電子裝置的正面示意圖。FIG. 5 is a front elevational view of an electronic device in accordance with another embodiment of the present invention.
圖6是圖5之電子裝置的立體示意圖。6 is a perspective view of the electronic device of FIG. 5.
圖7是圖5之電子裝置的側面示意圖。7 is a side elevational view of the electronic device of FIG. 5.
100‧‧‧電子裝置100‧‧‧Electronic devices
110‧‧‧第一機體110‧‧‧First body
112‧‧‧第一熱源112‧‧‧First heat source
114‧‧‧第一熱管114‧‧‧First heat pipe
116‧‧‧傳熱臂116‧‧‧heat transfer arm
119‧‧‧第一機殼119‧‧‧ first case
120‧‧‧第二機體120‧‧‧Second body
122‧‧‧第二熱管122‧‧‧second heat pipe
124‧‧‧第二熱源124‧‧‧second heat source
126‧‧‧第二機殼126‧‧‧ second casing
128‧‧‧樞軸128‧‧‧ pivot
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150374A TWI503071B (en) | 2012-12-27 | 2012-12-27 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150374A TWI503071B (en) | 2012-12-27 | 2012-12-27 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201427581A TW201427581A (en) | 2014-07-01 |
| TWI503071B true TWI503071B (en) | 2015-10-01 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150374A TWI503071B (en) | 2012-12-27 | 2012-12-27 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI503071B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200110558A (en) * | 2019-03-15 | 2020-09-24 | 삼성디스플레이 주식회사 | Mounting device and display device having the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6493226B1 (en) * | 1999-11-11 | 2002-12-10 | International Business Machines Corporation | Radiation structure for electronic equipment and computer apparatus |
| US7907397B2 (en) * | 2008-10-14 | 2011-03-15 | Foxconn Technology Co., Ltd. | Heat dissipating hinge for portable electronic device |
-
2012
- 2012-12-27 TW TW101150374A patent/TWI503071B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6493226B1 (en) * | 1999-11-11 | 2002-12-10 | International Business Machines Corporation | Radiation structure for electronic equipment and computer apparatus |
| US7907397B2 (en) * | 2008-10-14 | 2011-03-15 | Foxconn Technology Co., Ltd. | Heat dissipating hinge for portable electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201427581A (en) | 2014-07-01 |
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