TWI694763B - Liquid cooling module and electronic device - Google Patents

Abstract

An embodiment of the present invention provides an electronic device. The electronic device carries a heat source, and the electronic device includes a circuit board and a liquid cooling module. The heat source is disposed on the circuit board. The liquid cooling module is disposed on the circuit board and contacts the heat source. The liquid cooling module includes a case and a tube. The case contacts the heat source. The tube is disposed in and passing through the case, and the tube is configured for a coolant to flow through.

Description

Liquid cooling module and electronic device

The invention relates to heat dissipation technology, in particular to a liquid-cooled module and electronic device adopting liquid-cooled heat dissipation.

Generally speaking, there are many electronic components in the electronic device, and some electronic components generate amazing heat during operation. If it is not eliminated by a proper heat dissipation mechanism, a large amount of heat may cause the electronic components or even the entire electronic device to become abnormal due to excessive temperature, reduce operating efficiency or even damage.

In recent years, with the advancement of heat dissipation technology, liquid-cooled heat dissipation has gradually become one of the mainstream of heat dissipation mechanisms. In order to improve the overall operating efficiency of electronic devices, it is relatively important how to improve the heat dissipation capacity of each electronic component.

An embodiment of the invention discloses an electronic device. The electronic device carries heating elements. The electronic device includes a circuit board and a liquid cooling module. The heating element is arranged on the circuit board. The liquid cooling module is arranged on the circuit board and contacts the heating element. The liquid cooling module includes a casing and a tube body. The housing contacts the heating element. The pipe body passes through the casing and is used for cooling liquid to circulate.

An embodiment of the invention discloses a liquid cooling module suitable for heating elements. The liquid cooling module includes a casing and a tube body. The housing contacts the heating element. The pipe body passes through the casing and is used for cooling liquid to circulate.

In order to make the above objects, features, and advantages of the embodiments of the present invention more obvious and understandable, the following description will be made in detail in conjunction with the accompanying drawings.

It must be understood that the words "first" and "second" are used to modify components, not to indicate the order of precedence or precedence, but only to distinguish components with the same name.

Figure 1 is a schematic diagram of an electronic device to which an embodiment of the present invention is applied, Figure 2 is a schematic diagram of an embodiment of a liquid cooling module on the long side, and Figure 3 is an embodiment of a liquid cooling module Schematic diagram on the short side. Please refer to Figure 1 to Figure 3. The electronic device 200 can carry at least one heating element 210. Here, the heating element 210 may refer to an electronic element that generates a large amount of heat during operation in the electronic device 200. In order to prevent the heating element 210 from being abnormal or damaged due to excessive temperature, the electronic device 200 may include the liquid cooling module 100, and the electronic device 200 may use the liquid cooling module 100 to contact the heating element 210 to assist the heating element 210 Heat dissipation. Here, the electronic device 200 includes a circuit board 220, and the heating element 210 is disposed on the circuit board 220.

In some embodiments, the circuit board 220 may be provided with a connection port corresponding to the heating element 210, and the heating element 210 may be disposed on the circuit board 210 by connecting to the connection port. In addition, the heating element 210 may be disposed on the circuit board 220 with one end inserted into the port 220, and the rest of the heating element 210 may be suspended on the circuit board 220, as shown in FIG. 2.

In some embodiments, the heating element 210 may be a solid-state drive (SSD), a central processing unit (CPU), a graphics processing unit (GPU), or any other during operation Electronic components that generate a lot of thermal energy. In addition, the circuit board 220 may be a printed circuit board such as a motherboard or an adapter card. In this embodiment, the solid-state hard disk inserted in the M.2 connector is used as an example for description.

The liquid cooling module 100 is disposed on the circuit board 220 to contact the heating element 210. The liquid cooling module 100 includes a housing 110 and a tube 120. The housing 110 is used to contact the heating element 210. The pipe body 120 is penetrated through the casing 110, and the pipe body 120 can be used for cooling liquid to circulate. In this way, through the pipes of the tube body 120, the coolant can exchange heat with the housing 110 to take away the heat energy emitted by the heating element 210 contacting the housing 110, thereby helping to reduce the temperature of the heating element 210.

In some embodiments, the cooling liquid may be water, alcohol, or other suitable liquid. The housing 110 can be made of metal or other materials with suitable thermal conductivity. The tube body 120 can be realized by a metal tube (such as an aluminum tube, a copper tube, etc.), a plastic hose, or a tube made of other suitable materials. In addition, when the tube body 120 is a metal tube, the housing 110 and the tube body 120 can be made by metal extrusion processing, but the invention is not limited thereto.

FIG. 4 is a schematic diagram of an embodiment of the housing of the liquid cooling module. Please refer to Figure 4. In an embodiment, the housing 110 may be a rectangular block, but the present invention is not limited to this. Those skilled in the art should understand that the housing 110 can also be other suitable shaped blocks, such as oval blocks, etc. In addition, it can even be realized by a block with protrusions, waves or other suitable shapes on a certain surface. For ease of explanation, the following description will be made by taking the case 110 that is a rectangular block as an example.

In this embodiment, the housing 110 has two first side surfaces S11 and S12 facing each other, two second side surfaces S21 and S22 facing each other, and two third side surfaces S31 and S32 facing each other. Each first side face S11, S12 has two long sides E11, E12 facing each other and two short sides E21, E22 facing each other. Wherein, the two second side surfaces S21 and S22 are respectively connected to the short sides E21 and E22 of the first side surfaces S11 and S12, and the two third side surfaces S31 and S32 are respectively connected to the long sides E11 and E12 of the first side surfaces S11 and S12 To form a rectangular block. Here, the housing 110 may use one of the two first side surfaces S11 and S12 as a contact surface for contacting the heating element 210. Hereinafter, the first side surface S11 of the housing 110 for contacting the heating element 210 is directly referred to as the contact surface of the housing 110.

The housing 110 may include a pipe 111 and at least two through holes (hereinafter referred to as first through holes H1 and second through holes H2, respectively). The pipe 111 is disposed inside the casing 110. Here, the pipe 111 is formed between the first through hole H1 and the second through hole H2 so that the first through hole H1 can communicate with the second through hole H2 through the pipe 111. In addition, the tube body 120 may pass through the first through hole H1, the pipe 111, and the second through hole H2 (or sequentially through the second through hole H2, the pipe 111, and the first through hole H1) to pass through the casing 110 .

In an embodiment, the first through hole H1 and the second through hole H2 may be respectively disposed on the two second side surfaces S21 and S22 of the housing 110. However, the present invention is not limited to this. The first through hole H1 and the second through hole H2 may also be disposed on the two third sides S31 and S32 of the housing 110, respectively. In another embodiment, the first through hole H1 and the second through hole H2 may also be respectively disposed on a second side and a third side of the housing 110. In addition, in yet another embodiment, the first through hole H1 and the second through hole H2 may also be provided on the first side of the housing 110 (not the first side S12 of the contact heating element 210) and a second On the side (or a third side). In the following, the first through hole H1 and the second through hole H2 are respectively provided on the two second side surfaces S21 and S22 as an example for description.

In an embodiment, the first through holes H1 and the second through holes H2 respectively disposed on the two second side surfaces S21 and S22 may be opposite to each other. In other words, at this time, the first through hole H1 and the second through hole H2 may be located on the same axis. However, the present invention is not limited to this. In another embodiment, the first through holes H1 and the second through holes H2 provided on the two second side surfaces S21 and S22 may not be opposite to each other.

In some embodiments, the pipeline 111 disposed inside the housing 110 may be a straight-line, S-shaped, C-shaped, or other suitable type of pipeline, and the tube 120 passing through the pipeline 111 may appear correspondingly in the housing 110 Type. In addition, when the pipe body 120 is disposed in the pipe 111, the pipe wall of the pipe body 120 can be attached to the pipe 111. In some embodiments, when the front projection area of the tube body 120 or the pipe 111 on the contact surface of the housing 110 is larger, the heat dissipation effect of the liquid cooling module 100 on the heating element 200 may be better.

In some embodiments, the tube body 120 of the liquid cooling module 100 may be connected to the liquid cooling module for other heating elements (such as a central processing unit) to form an entire liquid cooling circulating heat dissipation system. In this way, when the user wants to repair or replace the heating element 200, it is not necessary to close the liquid cooling system or/and dismantle the liquid cooling path pipeline, only need to remove the fixing member 170, and then the liquid cooling module 100 is opposite to the heating element 200 The heating element 200 can be assembled and disassembled by being rotated in the axial direction, so that the assembly and disassembly between the heating element 200 and the liquid cooling module 100 can be more convenient.

In some embodiments, the housing 110 may further include two support tubes 150. The two support tubes 150 are respectively provided corresponding to the first through hole H1 and the second through hole H2. Here, the two support tubes 150 may extend outward from the periphery of the first through hole H1 and the periphery of the second through hole H2 respectively, and the tube body 120 passes through the two support tubes 150.

Figure 5 is a schematic diagram of the liquid cooling module of Figure 3 assembled on a circuit board. Please refer to FIG. 5. In an embodiment, the housing 110 may have a fixing groove H3. Here, the fixing groove H3 can penetrate through the two first side surfaces S11 and S12 of the housing 110. In addition, the liquid cooling module 100 may further include a fixing member 170. The fixing member 170 can be matched with the fixing slot H3, and the fixing member 170 can be inserted into the fixing slot H3 to fix the housing 110 to the circuit board 220. In addition, the heating element 210 may also have a fixing groove H5 corresponding to the fixing groove H3, so that the fixing member 170 may sequentially pass through the fixing groove H3 of the housing 110 and the fixing groove H5 of the heating element 210 to fix the liquid cooling module 100 On the circuit board 220.

In some embodiments, the short side E22 of the housing 110 has a notch shape recessed toward the inside, and the fixing groove H3 can pass through the short side E22 of the first side surfaces S11 and S12, as shown in FIG. 5. In other embodiments, the first sides S11 and S12 of the housing 110 have a hole shape, so the fixing groove H3 may not pass through the short sides E22 of the first sides S11 and S12.

In some embodiments, the fixing member 170 may be implemented by screws, nails, or other suitable fixing elements.

Please refer to FIG. 6 to FIG. 12. In an embodiment, the liquid cooling module 100 may further include a base 130. The base 130 is connected to the housing 110 and can define a housing space for accommodating the heating element 210 together with the housing 110. The base 130 may include a carrying portion 131 and a supporting portion 132. The bearing portion 131 may have a plate shape. The carrying portion 131 is located between the heating element 210 and the circuit board 220, and the carrying portion 131 is spaced apart from the housing 110. Here, the carrying portion 131 has a carrying surface for carrying the heating element 210 suspended on the circuit board 220, and the carrying surface may be parallel to the contact surface of the housing 110 and disposed on the other side of the heating element 210. The support portion 132 is connected between the carrying portion 131 and the housing 110.

In one embodiment, the supporting portion 132 may vertically protrude from the long side of the supporting surface of the supporting portion 131 and extend toward the housing 110 to be vertically connected between the housing 110 and the supporting portion 131. However, the present invention is not limited to this. In another embodiment, the supporting portion 132 may also vertically protrude from the short side of the supporting surface of the supporting portion 131 and extend toward the housing 110 to be vertically connected to the housing 110 and the supporting Department 131.

In an embodiment, the base 130 can be directly fixed under the contact surface of the housing 110, as shown in FIG. 6. In other words, at this time, the housing 110 and the base 130 cannot be separated or relatively rotated. For example, the base 130 and the housing 110 can be made in one piece, but the invention is not limited thereto. Here, when the liquid cooling module 100 is viewed from the short side of the housing 110, the base 130 and the housing 110 may form a C shape. The heating element 210 can be inserted into the accommodating space defined by the casing 110 and the base 130 through this C-shaped opening side and sandwiched between the casing 110 and the bearing portion 131, and the opposite two of the heating element 210 The surface may respectively contact the contact surface of the housing 110 and the bearing surface of the bearing portion 131. In addition, the connection position between the support portion 132 of the base 130 and the housing 110 may be located below the first through hole H1 and the second through hole H2.

In an embodiment, the base 130 can also be pivotally connected to the first side (contact surface) of the housing 110, as shown in FIGS. 7 and 10. In other words, at this time, the housing 110 can be axially rotated relative to the heating element 210 or the base 130 to facilitate disassembly and assembly between the heating element 210 and the liquid cooling module 100.

In one embodiment, as shown in FIG. 8, the support portion 132 includes two support members 1321. One end of each support member 1321 is connected to the bearing portion 131, and the other end of each support member 1321 is respectively provided with a shaft hole 132H. The liquid cooling module 100 further includes a pivot 140, and the pivot 140 can pass through a shaft hole 132H on the two supporting members 1321 to pivotally connect the base 130 to the housing 110. Here, the pivot 140 may be formed through two second sides S21 and S22 of the housing 110, or formed by bumps extending outward from the two second sides S21 and S22, respectively, and the axis of rotation of the pivot 140 It is parallel to the longitudinal direction of the housing 110.

In another embodiment, as shown in FIG. 11, the liquid cooling module 100 can further pivot the base 130 in such a manner that the tube body 120 (or the support tube 150) passes through the shaft hole 132H in the two support members 1321接接壳110。 Connected to the housing 110. In other words, at this time, the tube body 120 (or the support tube 150) can be used as a pivot for rotation, so that the housing 110 can be pivoted relative to the heating element 210 or the base body 130 with the tube body 120 (or the support tube 150) as the axis. To rotate.

In some embodiments, as shown in FIGS. 9 and 12, the support portion 132 may further include a link 1322. The connecting member 1322 can be disposed along the longitudinal direction of the housing 110 and connected between the two supporting members 1321. Here, the connecting member 1322 can be used to strengthen the supporting strength of the supporting member 1321.

In some embodiments, the housing 110 may further include the contact pad 160. The contact pad 160 is disposed on the contact surface of the housing 110. Here, the contact pad 160 can be used to fill the gap between the contact surface of the heating element 210 and the housing 110 to increase the contact area of the heating element 210 and the contact surface and allow the heating element 210 to be attached under the housing 110.

In some embodiments, as shown in FIG. 13, when the liquid cooling module 100 further includes a base 130, the carrying portion 131 of the base 130 may further have a fixing groove H4 corresponding to the fixing groove H3, so as to fix The component 170 can sequentially pass through the fixing groove H3 of the housing 110 and the fixing groove H4 of the carrying portion 131 to fix the liquid cooling module 100 on the circuit board 220.

It is worth noting that in order to clarify the invention clearly, the invention only shows the relevant elements. Those skilled in the art should understand that the liquid cooling module 100 may also include other components, such as pumps, heat sinks, etc., to provide specific functions.

In summary, the embodiments of the present invention provide a liquid-cooled module and an electronic device, which contact the heating element through the casing of the liquid-cooled module, and use the pipe body to penetrate the casing to make the circulation in the pipe body The cooling fluid in can be used for heat exchange to reduce the temperature of the heating element. In addition, in the liquid-cooled module and the electronic device of the embodiment of the present invention, the housing of the liquid-cooled module can rotate axially relative to the heating element, so that the disassembly and assembly between the heating element and the liquid-cooled module can be more convenient.

The embodiments of the present invention are disclosed as above, but they are not intended to limit the scope of the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the present invention shall be deemed as defined by the appended patent application scope.

100: liquid cooling module

110: shell

111: pipeline

120: tube body

130: seat body

131: Carrying Department

132: Support

1321: Support

1322: Link

132H: Shaft hole

140: pivot

150: support tube

160: contact pad

170: fixings

200: electronic device

210: heating element

220: circuit board

H1: the first through hole

H2: second through hole

H3: fixed slot

H4: fixed slot

H5: fixed slot

S11, S12: the first side

S21, S22: second side

S31, S32: the third side

E11, E12: Long side

E21, E22: short side

FIG. 1 is a schematic diagram of an embodiment of an electronic device. FIG. 2 is a schematic diagram of an embodiment of a liquid cooling module on the long side. FIG. 3 is a schematic diagram of an embodiment of a liquid cooling module on the short side. FIG. 4 is a schematic diagram of an embodiment of the housing of the liquid cooling module. Figure 5 is a schematic diagram of the liquid cooling module of Figure 3 assembled on a circuit board. FIG. 6 is a schematic diagram of an embodiment of a liquid cooling module on the short side. FIG. 7 is a schematic diagram of an embodiment of a liquid cooling module on the short side. FIG. 8 is an exploded schematic view of an embodiment of the liquid cooling module in FIG. 7. FIG. 9 is a schematic diagram of an embodiment of the seat body in FIG. 7. FIG. 10 is a schematic diagram of an embodiment of a liquid cooling module on the short side. FIG. 11 is an exploded schematic view of an embodiment of the liquid cooling module in FIG. 10. FIG. 12 is a schematic diagram of an embodiment of the seat body in FIG. 10. Figure 13 is a schematic diagram of the liquid cooling module of Figure 7 assembled on a circuit board.

110: shell

120: tube body

150: support tube

160: contact pad

170: fixings

210: heating element

220: circuit board

Claims (10)

An electronic device carrying a heating element, the electronic device includes: a circuit board, the heating element is disposed on the circuit board; and a liquid cooling module, is disposed on the circuit board, and contacts the heating element, the The liquid cooling module includes: a housing contacting the heating element; and a tube body penetrated through the housing and used to circulate a cooling liquid, wherein the liquid cooling module rotates axially relative to the heating element set off. The electronic device as described in item 1 of the patent application scope, wherein the casing includes a pipe, a first through hole and a second through hole, the pipe is formed inside the casing and communicates with the first through hole And the second through hole, wherein the tube body passes through the first through hole, the pipe and the second through hole to pass through the casing. The electronic device as described in item 2 of the patent application scope, wherein the housing further includes two support tubes, the two support tubes extending outward from the periphery of the first through hole and the periphery of the second through hole, respectively . The electronic device as described in item 1 of the patent application scope, wherein the casing has a fixing groove, and the liquid cooling module further includes a fixing piece, the fixing piece is inserted into the fixing groove to fix the casing to the On the circuit board. The electronic device as described in item 1 of the patent application scope, wherein the liquid cooling module further includes a base body, the base body includes: a bearing portion spaced apart from the housing; and A supporting portion is connected between the bearing portion and the housing, wherein the heating element is sandwiched between the bearing portion and the housing. The electronic device as described in item 5 of the patent application scope, wherein the support portion is pivotally connected to the housing. A liquid cooling module is suitable for a heating element. The liquid cooling module includes: a shell contacting the heating element; and a pipe body, which is penetrated through the shell and used for a cooling liquid to circulate, wherein the The liquid-cooled module rotates axially relative to the heating element and lifts up. The liquid cooling module as described in item 7 of the patent application scope, wherein the casing includes a pipe, a first through hole and a second through hole, the pipe is formed inside the casing and communicates with the first The through hole and the second through hole, wherein the tube body passes through the first through hole, the pipe and the second through hole to pass through the casing. The liquid cooling module as described in item 7 of the patent application scope, wherein the liquid cooling module further includes a base body, the base body includes: a bearing portion, which is spaced apart from the housing; and a support portion, connected to the Between the carrying part and the housing, the heating element is sandwiched between the carrying part and the housing. The liquid cooling module as described in item 9 of the patent application scope, wherein the support portion is pivotally connected to the housing.

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