CN112631396A - Liquid cooling module and electronic device - Google Patents

Abstract

An embodiment of the invention provides an electronic device and a liquid cooling module. The electronic device bears the heating element and comprises a circuit board and a liquid cooling module. The heating element is arranged on the circuit board. The liquid cooling module is arranged on the circuit board and is connected with the trigger thermal element in parallel. The liquid cooling module comprises a shell and a pipe body. The housing contacts the heat generating element. The tube body is arranged through the shell and used for cooling liquid circulation.

Description

Liquid cooling module and electronic device

Technical Field

The present invention relates to heat dissipation technologies, and particularly to a liquid cooling module and an electronic device using the same.

Background

Generally, electronic devices are provided with a plurality of electronic components, and some of the electronic components generate an extraordinary amount of heat during operation. If the heat is not dissipated by a proper heat dissipation mechanism, a large amount of heat may cause an abnormality of the electronic components, even the whole electronic device, due to an excessive temperature, thereby reducing the operation efficiency and even damaging the electronic components.

In recent years, with the progress of heat dissipation technology, liquid-cooled heat dissipation has become one of the mainstream of heat dissipation mechanisms. In order to further enhance the overall operation performance of the electronic device, it is important to enhance the heat dissipation capability of each electronic component.

Disclosure of Invention

The present invention is directed to a liquid-cooled module and an electronic device to solve at least one of the above problems.

An embodiment of the invention discloses an electronic device. The electronic device carries a heating element. The electronic device comprises a circuit board and a liquid cooling module. The heating element is arranged on the circuit board. The liquid cooling module is arranged on the circuit board and is connected with the trigger thermal element in parallel. The liquid cooling module comprises a shell and a pipe body. The housing contacts the heat generating element. The tube body is arranged through the shell and used for cooling liquid circulation.

One embodiment of the invention discloses a liquid cooling module suitable for a heating element. The liquid cooling module comprises a shell and a pipe body. The housing contacts the heat generating element. The tube body is arranged through the shell and used for cooling liquid circulation.

The liquid cooling module and the electronic device provided by the embodiment of the invention have the beneficial effects that the shell of the liquid cooling module is contacted with the heating element, and the pipe body is arranged in the shell in a penetrating manner, so that the cooling liquid flowing in the pipe body can exchange heat, and the temperature of the heating element is reduced.

Drawings

Fig. 1 is a schematic diagram of an embodiment of an electronic device.

Fig. 2 is a schematic diagram of an embodiment of a liquid cooling module on a long side.

Fig. 3 is a schematic diagram of an embodiment of a liquid cooling module at a short side.

Fig. 4 is a schematic diagram of an embodiment of a housing of a liquid cooling module.

Fig. 5 is a schematic view illustrating the liquid cooling module of fig. 3 assembled on a circuit board.

Fig. 6 is a schematic diagram of an embodiment of a liquid cooling module at a short side.

Fig. 7 is a schematic diagram of an embodiment of a liquid cooling module at a short side.

Fig. 8 is an exploded view of one embodiment of the liquid cooling module of fig. 7.

Fig. 9 is a schematic view of an embodiment of the base in fig. 7.

Fig. 10 is a schematic diagram of an embodiment of a liquid cooling module at a short side.

Fig. 11 is an exploded view of one embodiment of the liquid cooling module of fig. 10.

Fig. 12 is a schematic view of an embodiment of the base in fig. 10.

Fig. 13 is a schematic view illustrating the liquid cooling module of fig. 7 assembled on a circuit board.

The reference numbers are as follows:

100 liquid cooling module

110 casing

111 pipeline

120 tube body

130 seat body

131 bearing part

132 support part

1321 supporting piece

1322 connecting piece

132H shaft hole

140 pivot

150 support tube

160 contact pad

170 fixing piece

200 electronic device

210 heating element

220 circuit board

H1 first through hole

H2 second through hole

H3 fixing groove

H4 fixing groove

H5 fixing groove

S11, S12 first side

S21, S22 second flank

Third side of S31, S32

E11, E12 Long side

E21, E22 short side

Detailed Description

In order to make the aforementioned objects, features and advantages of the embodiments of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

It should be understood that the terms first, second, etc. are used for modifying elements and are not used for indicating a priority or precedence relationship between the elements, but are used for distinguishing the elements with the same name.

Fig. 1 is a schematic diagram of an electronic device to which an embodiment of the present invention is applied, fig. 2 is a schematic diagram of an embodiment of a liquid cooling module on a long side, and fig. 3 is a schematic diagram of an embodiment of a liquid cooling module on a short side. Please refer to fig. 1 to 3. At least one heat generating element 210 can be carried in the electronic device 200. Herein, the heat generating element 210 may refer to an electronic element that generates a large amount of heat when operating in the electronic device 200. In order to avoid the abnormal condition or damage of the heat generating element 210 due to the over-high temperature, the liquid cooling module 100 may be included in the electronic device 200, and the electronic device 200 may utilize the liquid cooling module 100 to contact the heat generating element 210 to assist the heat dissipation of the heat generating element 210. Here, the electronic device 200 includes a circuit board 220, and the heat generating element 210 is disposed on the circuit board 220.

In some embodiments, the circuit board 220 may have a connection port corresponding to the heat generating element 210, and the heat generating element 210 may be disposed on the circuit board 210 by being connected to the connection port. In addition, the heat generating element 210 may be disposed on the circuit board 220 in such a manner that one end thereof is inserted into the connection port 220, and the rest of the heat generating element 210 may be suspended above the circuit board 220, as shown in fig. 2.

In some embodiments, the heat generating component 210 may be a Solid-State Drive (SSD), a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), or any other electronic component that generates a large amount of heat when operating. In addition, the circuit board 220 may be a printed circuit board such as a motherboard or an adapter card. The embodiment is described by taking a solid state disk inserted in an m.2 connector as an example.

The liquid cooling module 100 is disposed on the circuit board 220 to contact the heat generating element 210. The liquid cooling module 100 includes a housing 110 and a tube 120. The housing 110 is used to contact the heat generating element 210. The tube 120 is disposed through the housing 110, and the tube 120 is used for circulating a cooling fluid. In this way, through the pipe of the tube 120, the cooling liquid can exchange heat with the housing 110 to carry away the heat energy dissipated by the heating element 210 contacting the housing 110, thereby assisting in reducing the temperature of the heating element 210.

In some embodiments, the cooling fluid may be water, alcohols, or other suitable liquids. The housing 110 may be made of metal or other material having a suitable thermal conductivity. The tube 120 may be implemented by a metal tube (e.g., an aluminum tube, a copper tube, etc.), a plastic hose, or a tube made of other suitable materials. In addition, when the tube body 120 is a metal tube, the housing 110 and the tube body 120 may be manufactured by metal extrusion, but the invention is not limited thereto.

Fig. 4 is a schematic diagram of an embodiment of a housing of a liquid cooling module. Please refer to fig. 4. In one embodiment, the housing 110 may be a rectangular block, but the invention is not limited thereto, and those skilled in the art will appreciate that the housing 110 may also be a block with other suitable shapes, such as an oval block, and may even be implemented with a block having a protrusion, wave or other suitable manner on one side. For convenience of explanation, the following description will be given taking a case 110 having a rectangular block shape as an example.

In the present embodiment, the case 110 has two first sides S11, S12 opposite to each other, two second sides S21, S22 opposite to each other, and two third sides S31, S32 opposite to each other. Each of the first side faces S11, S12 has two long sides E11, E12 opposite to each other and two short sides E21, E22 opposite to each other. The two second side surfaces S21 and S22 are connected to the short sides E21 and E22 of the first side surfaces S11 and S12, respectively, and the two third side surfaces S31 and S32 are connected to the long sides E11 and E12 of the first side surfaces S11 and S12, respectively, so as to form a rectangular block. Here, the case 110 may have one of the two first side surfaces S11 and S12 as a contact surface contacting the heat generating element 210. Hereinafter, the first side surface S11 of the case 110 contacting the heat generating element 210 is directly referred to as a contact surface of the case 110.

The housing 110 may include a pipe 111 and at least two through holes (hereinafter, referred to as a first through hole H1 and a second through hole H2, respectively). The duct 111 is provided inside the housing 110. Here, the duct 111 is formed between the first through hole H1 and the second through hole H2 such that the first through hole H1 can communicate to the second through hole H2 through the duct 111. The tube 120 may sequentially pass through the first through hole H1, the tube 111, and the second through hole H2 (or sequentially pass through the second through hole H2, the tube 111, and the first through hole H1) and penetrate through the housing 110.

In an embodiment, the first through hole H1 and the second through hole H2 may be disposed on the two second side surfaces S21 and S22 of the housing 110, respectively. However, the invention is not limited thereto, and the first through hole H1 and the second through hole H2 may be disposed on the two third sides S31 and S32 of the housing 110, respectively. In another embodiment, the first through hole H1 and the second through hole H2 may also be disposed on a second side surface and a third side surface of the housing 110, respectively. In another embodiment, the first through hole H1 and the second through hole H2 may be disposed on the first side surface (not the first side surface S12 contacting the heat generating element 210) and a second side surface (or a third side surface) of the housing 110, respectively. Hereinafter, the first through hole H1 and the second through hole H2 are disposed on the two second side surfaces S21 and S22, respectively, for example, to explain.

In one embodiment, the first through hole H1 and the second through hole H2 respectively disposed on the two second side surfaces S21 and S22 may be opposite to each other. In other words, the first through hole H1 and the second through hole H2 may be located on the same axis. However, the invention is not limited thereto, and in another embodiment, the first through hole H1 and the second through hole H2 respectively disposed on the two second side surfaces S21 and S22 may not be opposite to each other.

In some embodiments, the duct 111 disposed inside the housing 110 may be a straight duct, an S-duct, a C-duct, or other suitable duct, and the tube 120 passing through the duct 111 may be correspondingly shaped in the housing 110. In addition, when the tube 120 is disposed in the pipe 111, the wall of the tube 120 can be attached to the pipe 111. In some embodiments, the liquid cooling module 100 can dissipate heat of the heat generating element 200 more effectively when the area of the pipe 120 or the pipe 111 projected onto the contact surface of the housing 110 is larger.

In some embodiments, the tube 120 of the liquid cooling module 100 can be connected to a liquid cooling module for other heat generating components (e.g., a cpu) to form an overall liquid cooling type circulating heat dissipation system. Therefore, when a user wants to repair or replace the heating element 200, the user only needs to detach the fixing member 170 and then lift the liquid cooling module 100 by rotating the liquid cooling module 100 axially relative to the heating element 200 without closing the liquid cooling system or detaching the pipeline of the liquid cooling path, so as to detach or install the heating element 200, and the detachment and installation between the heating element 200 and the liquid cooling module 100 are more convenient.

In some embodiments, the housing 110 may further include two support tubes 150. The two support pipes 150 are disposed corresponding to the first through hole H1 and the second through hole H2, respectively. Here, the two support pipes 150 may extend outward from the periphery of the first through hole H1 and the periphery of the second through hole H2, respectively, and the tube body 120 passes through the two support pipes 150.

Fig. 5 is a schematic view illustrating the liquid cooling module of fig. 3 assembled on a circuit board. Referring to fig. 5, in an embodiment, the housing 110 may have a fixing groove H3. Here, the fixing groove H3 may penetrate through the two first side surfaces S11 and S12 of the housing 110. In addition, the liquid cooling module 100 may further include a fixing member 170. The fixing member 170 may be matched with the fixing groove H3, and the fixing member 170 may be inserted into the fixing groove H3 to fix the housing 110 to the circuit board 220. In addition, the heat-generating element 210 may also have a fixing groove H5 corresponding to the fixing groove H3, so that the fixing member 170 may fix the liquid-cooling module 100 on the circuit board 220 after sequentially passing through the fixing groove H3 of the housing 110 and the fixing groove H5 of the heat-generating element 210.

In some embodiments, the short side E22 of the housing 110 has an inwardly concave notch shape, and the fixing groove H3 may pass through the short side E22 of the first side S11 or S12, as shown in fig. 5. In other embodiments, the first side S11, S12 of the housing 110 is formed with holes, so that the fixing groove H3 may not pass through the short side E22 of the first side S11, S12.

In some embodiments, the fastener 170 may be implemented as a screw, nail, or other suitable fastening element.

Referring to fig. 6 to 12, in an embodiment, the liquid cooling module 100 may further include a base 130. The base 130 is connected to the housing 110 and can define a receiving space with the housing 110 for receiving the heat generating element 210. The base 130 may include a supporting portion 131 and a supporting portion 132. The bearing part 131 may have a plate shape. The bearing part 131 is located between the heat generating element 210 and the circuit board 220, and the bearing part 131 is spaced apart from the housing 110. Herein, the bearing portion 131 has a bearing surface for bearing the heat generating element 210 suspended on the circuit board 220, and the bearing surface may be parallel to the contact surface of the housing 110 and disposed on the other side of the heat generating element 210. The supporting portion 132 is connected between the supporting portion 131 and the housing 110.

In one embodiment, the supporting portion 132 may vertically protrude from a long side of the carrying surface of the carrying portion 131 and extend toward the housing 110 to be vertically connected between the housing 110 and the carrying portion 131. However, the invention is not limited thereto, and in another embodiment, the supporting portion 132 may also vertically protrude from a short side of the carrying surface of the carrying portion 131 and extend toward the housing 110 to be vertically connected between the housing 110 and the carrying portion 131.

In one embodiment, the base 130 can be directly fixed under the contact surface of the housing 110, as shown in fig. 6. In other words, the housing 110 and the base 130 cannot be separated or rotated relatively. For example, the base 130 and the housing 110 can be formed integrally, but the invention is not limited thereto. Here, when the liquid cooling module 100 is viewed from the short side of the housing 110, the base 130 and the housing 110 may form a C-shape. The heating element 210 can be inserted into the accommodating space defined by the housing 110 and the base 130 through the C-shaped opening side, and is sandwiched between the housing 110 and the carrying portion 131, and two opposite surfaces of the heating element 210 can respectively contact the contact surface of the housing 110 and the carrying surface of the carrying portion 131. In addition, the connection position of the supporting portion 132 of the seat 130 and the housing 110 can be located below the first through hole H1 and the second through hole H2.

In one embodiment, the base 130 can also be pivotally connected to the first side (contact surface) of the housing 110, as shown in fig. 7 and 10. In other words, at this time, the housing 110 can axially rotate relative to the heating element 210 or the base 130, so as to facilitate the mounting and dismounting between the heating element 210 and the liquid cooling module 100.

In one embodiment, as shown in fig. 8, the supporting portion 132 includes two supporting members 1321. One end of each supporting member 1321 is connected to the supporting portion 131, and the other end of each supporting member 1321 is provided with a shaft hole 132H. The liquid cooling module 100 further includes a pivot 140, and the pivot 140 can pass through the axle holes 132H of the two supporting members 1321 to pivot the base 130 to the housing 110. Here, the pivot 140 may pass through the two second side surfaces S21 and S22 of the housing 110, or be formed by protrusions extending outward from the two second side surfaces S21 and S22, respectively, and the rotation axis of the pivot 140 is parallel to the long side direction of the housing 110.

In another embodiment, as shown in fig. 11, the liquid cooling module 100 can further pivot the holder body 130 to the housing 110 in such a way that the tube body 120 (or the support tube 150) passes through the axle holes 132H of the two support members 1321. In other words, the tube 120 (or the support tube 150) can further serve as a pivot for rotation, so that the housing 110 can rotate axially relative to the heat generating element 210 or the seat 130 with the tube 120 (or the support tube 150) as an axis.

In some embodiments, as shown in fig. 9 and 12, the support portion 132 may further include a connector 1322. The connector 1322 may be disposed along a long side direction of the housing 110 and connected between the two support members 1321. Here, the connection piece 1322 may serve to reinforce the supporting strength of the supporting member 1321.

In some embodiments, the housing 110 may further include contact pads 160. The contact pad 160 is disposed on the contact surface of the housing 110. Here, the contact pads 160 may be used to fill up a gap between the heat generating element 210 and the contact surface of the housing 110, so as to increase the contact area between the heat generating element 210 and the contact surface and enable the heat generating element 210 to be attached under the housing 110.

In some embodiments, as shown in fig. 13, when the liquid cooling module 100 further includes a holder body 130, the supporting portion 131 of the holder body 130 further has a fixing groove H4 corresponding to the fixing groove H3, so that the fixing member 170 can fix the liquid cooling module 100 on the circuit board 220 after sequentially passing through the fixing groove H3 of the housing 110 and the fixing groove H4 of the supporting portion 131.

It is noted that only relevant elements are shown in order to clearly illustrate the invention. Those skilled in the art will appreciate that the liquid cooling module 100 may also include other components, such as pumps, heat sinks, etc. to provide specific functions.

In summary, embodiments of the present invention provide a liquid cooling module and an electronic device, in which a housing of the liquid cooling module contacts a heating element, and a tube is inserted into the housing, so that a cooling liquid flowing through the tube can exchange heat to reduce a temperature of the heating element. In addition, according to the liquid cooling module and the electronic device provided by the embodiment of the invention, the shell of the liquid cooling module can axially rotate relative to the heating element, so that the heating element and the liquid cooling module can be more conveniently disassembled and assembled.

The embodiments of the present invention are disclosed above, but not limited to the scope of the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present invention, therefore, the scope of the present invention should be determined by the appended claims.

Claims (10)

1. An electronic device carrying a heat generating element, the electronic device comprising:

a circuit board, on which the heating element is arranged; and

a liquid cooling module, set up on this circuit board to contact this heating element, this liquid cooling module contains:

a housing contacting the heating element; and

a tube body passing through the shell and used for circulating a cooling liquid.

2. The electronic device of claim 1, wherein the housing comprises a tube, a first through hole and a second through hole, the tube is formed inside the housing and connected to the first through hole and the second through hole, and the tube is inserted into the housing through the first through hole, the tube and the second through hole.

3. The electronic device of claim 2, wherein the housing further comprises two support tubes extending outwardly from the periphery of the first through hole and the periphery of the second through hole, respectively.

4. The electronic device as claimed in claim 1, wherein the housing has a fixing groove, and the liquid cooling module further comprises a fixing member disposed through the fixing groove to fix the housing to the circuit board.

5. The electronic device of claim 1, wherein the liquid-cooled module further comprises a housing, the housing comprising:

a bearing part which is arranged at an interval with the shell; and

a supporting part connected between the bearing part and the shell, wherein the heating element is clamped between the bearing part and the shell.

6. The electronic device of claim 5, wherein the supporting portion is pivotally connected to the housing.

7. A liquid cooling module is suitable for a heating element, and is characterized in that the liquid cooling module comprises:

a housing contacting the heating element; and

a tube body passing through the shell and used for circulating a cooling liquid.

8. The liquid cooling module of claim 7, wherein the housing includes a conduit, a first through hole and a second through hole, the conduit formed within the housing and communicating with the first through hole and the second through hole, wherein the tube is disposed through the housing through the first through hole, the conduit and the second through hole.

9. The liquid cooling module of claim 7, further comprising a base, the base comprising:

a bearing part which is arranged at an interval with the shell; and

a supporting part connected between the bearing part and the shell, wherein the heating element is clamped between the bearing part and the shell.

10. The liquid cooling module of claim 9, wherein the support portion is pivotally coupled to the housing.

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