TWI683716B - Laser processing apparatus comprising angle control optical system - Google Patents

Laser processing apparatus comprising angle control optical system Download PDF

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TWI683716B
TWI683716B TW107127509A TW107127509A TWI683716B TW I683716 B TWI683716 B TW I683716B TW 107127509 A TW107127509 A TW 107127509A TW 107127509 A TW107127509 A TW 107127509A TW I683716 B TWI683716 B TW I683716B
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laser processing
focal length
optical system
modulator
item
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TW107127509A
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Chinese (zh)
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TW201924837A (en
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鄭雄熙
趙成龍
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南韓商Ｅｏ科技股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/0009—Materials therefor
    • G02F1/0072—Mechanical, acoustic, electro-elastic, magneto-elastic properties

Abstract

Provided is a laser processing apparatus includes: a light source configured to emit a laser beam; an optical modulator configured to control a traveling angle of the laser beam within a swing angle; a 4F angle control optical system configured to change the swing angle of the optical modulator; and a flying head configured to process a target object by using the laser beam received from the 4F angle control optical system.

Description

包括角度控制光學系統的雷射加工裝置 Laser processing device including angle control optical system

本發明是有關於一種包括角度控制光學系統的雷射加工裝置。 The invention relates to a laser processing device including an angle control optical system.

雷射加工裝置可包括雷射光源、傳輸來自上述雷射光源的雷射光束的中繼光學系統、以及於加工對象物上變更雷射光束的照射位置而進行加工的浮動磁頭。 The laser processing apparatus may include a laser light source, a relay optical system that transmits a laser beam from the laser light source, and a floating magnetic head that performs processing by changing the irradiation position of the laser beam on the object to be processed.

此種雷射加工裝置可藉由浮動磁頭於可變距離內可變而向加工對象物照射雷射光束來進行加工。為了提高對加工對象物進行加工的速度，要求一種需克服浮動磁頭的可變距離的極限的技術。 Such a laser processing device can perform processing by irradiating a laser beam on the object to be processed by the floating magnetic head being variable within a variable distance. In order to increase the processing speed of the object to be processed, a technique that needs to overcome the limit of the variable distance of the floating head is required.

本發明欲提供一種包括角度控制光學系統的雷射加工裝置。 The present invention intends to provide a laser processing apparatus including an angle control optical system.

一實施例的雷射加工裝置包括：光源，照射雷射光束；光學調變器，於旋角內控制上述雷射光束的行進角度；4F角度控制光學系統，變更上述光學調變器的旋角；及浮動磁頭，藉由自 上述4F角度控制光學系統接收到的雷射光束而對加工對象物進行加工。 An embodiment of the laser processing apparatus includes: a light source that irradiates a laser beam; an optical modulator that controls the travel angle of the laser beam within a rotation angle; a 4F angle control optical system that changes the rotation angle of the optical modulator ; And floating heads, by The laser beam received by the 4F angle control optical system described above processes the object to be processed.

上述4F角度控制光學系統可包括具有四個焦距的光學元件。 The above-mentioned 4F angle control optical system may include optical elements having four focal lengths.

上述光學元件可包括具有第一焦距的第一透鏡、及具有第二焦距的第二透鏡。 The above optical element may include a first lens having a first focal length, and a second lens having a second focal length.

上述光學元件可更包括設置至上述第一透鏡的入射面側的第一光罩。 The above optical element may further include a first reticle provided to the incident surface side of the first lens.

上述光學元件可更包括設置至上述第一透鏡的出射面與上述第二透鏡的入射面之間的第二光罩。 The optical element may further include a second reticle disposed between the exit surface of the first lens and the entrance surface of the second lens.

上述光學調變器可包括沿第一方向調變光的第一光聲調變器、及沿作為與上述第一方向不同的方向的第二方向調變光的第二光聲調變器。 The optical modulator may include a first photoacoustic modulator that modulate light in a first direction, and a second photoacoustic modulator that modulate light in a second direction that is a direction different from the first direction.

上述光學調變器可更包括設置至上述第一光聲調變器與上述第二光聲調變器之間的半波板(half-wave plate)。 The optical modulator may further include a half-wave plate disposed between the first photoacoustic modulator and the second photoacoustic modulator.

上述4F角度控制光學系統可放大由上述光學調變器控制的旋角。 The above 4F angle control optical system can amplify the rotation angle controlled by the above optical modulator.

上述第一焦距可大於上述第二焦距。 The first focal length may be greater than the second focal length.

上述4F角度控制光學系統可縮小由上述光學調變器控制的旋角。 The above 4F angle control optical system can reduce the rotation angle controlled by the above optical modulator.

上述第一焦距可小於上述第二焦距。 The first focal length may be smaller than the second focal length.

本實施例的雷射加工裝置可藉由光學調變器而二維地轉動雷射光束的角度。雷射加工裝置可改善光束品質的效率，可提高最大加工速度。 The laser processing apparatus of this embodiment can rotate the angle of the laser beam two-dimensionally by an optical modulator. Laser processing devices can improve the efficiency of beam quality and increase the maximum processing speed.

本實施例的雷射加工裝置可將光學調變器的旋角保持為1：1而進行傳輸。 The laser processing apparatus of this embodiment can maintain the rotation angle of the optical modulator at 1:1 for transmission.

本實施例的雷射加工裝置藉由光學系統放大或縮小光學調變器的旋角，藉此可克服浮動磁頭的可變距離。 The laser processing device of this embodiment uses an optical system to enlarge or reduce the rotation angle of the optical modulator, thereby overcoming the variable distance of the floating head.

本實施例的雷射加工裝置可藉由放大或縮小光學調變器的旋角而較先前的雷射鑽孔設備創新地提高加工速度。 The laser processing apparatus of this embodiment can innovatively increase the processing speed compared to the previous laser drilling equipment by enlarging or reducing the rotation angle of the optical modulator.

100、200‧‧‧雷射加工裝置 100、200‧‧‧Laser processing device

110‧‧‧光源 110‧‧‧Light source

120‧‧‧光學調變器 120‧‧‧Optical Modulator

121‧‧‧第一光聲調變器 121‧‧‧First photoacoustic modulator

122‧‧‧第二光聲調變器 122‧‧‧Second photoacoustic modulator

130、230、330、430、530‧‧‧4F角度控制光學系統 130, 230, 330, 430, 530 ‧‧‧ 4F angle control optical system

140‧‧‧浮動磁頭 140‧‧‧ floating head

223‧‧‧半波板 223‧‧‧Half wave plate

231、331、431、531‧‧‧第一透鏡 231, 331, 431, 531‧‧‧ First lens

232、332、432、532‧‧‧第二透鏡 232,332,432,532‧‧‧second lens

233、333、433‧‧‧第一光罩 233, 333, 433‧‧‧ First mask

234、334、434‧‧‧第二光罩 234,334,434‧‧‧second mask

θ1、θ2、θ3‧‧‧角度 θ 1 , θ 2 , θ 3 ‧‧‧ angle

F1、F2、F3、F4‧‧‧焦距 F1, F2, F3, F4 ‧‧‧ focal length

圖1是概略性地表示一實施例的雷射加工裝置的圖。 FIG. 1 is a diagram schematically showing a laser processing apparatus of an embodiment.

圖2是概略性地表示另一實施例的雷射加工裝置的圖。 2 is a diagram schematically showing a laser processing apparatus of another embodiment.

圖3是表示於未去除高階雷射光束的情形時形成至加工對象物的雷射光束形狀的圖。 3 is a diagram showing the shape of a laser beam formed to an object to be processed when a high-order laser beam is not removed.

圖4是概略性地表示一實施例的4F角度控制光學系統的圖。 4 is a diagram schematically showing a 4F angle control optical system of an embodiment.

圖5是概略性地表示另一實施例的4F角度控制光學系統的圖。 5 is a diagram schematically showing a 4F angle control optical system of another embodiment.

圖6是概略性地表示又一實施例的4F角度控制光學系統的圖。 6 is a diagram schematically showing a 4F angle control optical system according to still another embodiment.

參照與隨附圖式一併詳細地進行說明的實施例而本發明的優點、特徵、以及達成上述優點及特徵的方法變明確。然而，應理解本發明能夠以各種不同的形態實現，並不限定於下文所示的實施例，包括包含於本發明的思想及技術範圍內的所有變換、 等同物或替代物。下文所示的實施例是為了完整地揭示本發明且完整地向於本發明所屬的技術領域內具有常識者告知發明的範疇而提供。於對本發明進行說明時，在判斷為對相關公知技術的具體說明會混淆本發明的主旨的情形時，省略其詳細說明。 The advantages and features of the present invention and the method of achieving the above advantages and features will become clear with reference to the embodiments described in detail together with the accompanying drawings. However, it should be understood that the present invention can be implemented in a variety of different forms, and is not limited to the embodiments shown below, including all transformations included in the idea and technical scope of the present invention, Equivalent or substitute. The embodiments shown below are provided to fully disclose the present invention and to provide a person with common knowledge in the technical field to which the present invention belongs to inform the scope of the invention. When describing the present invention, when it is determined that the detailed description of the related well-known technology will confuse the gist of the present invention, the detailed description thereof will be omitted.

本申請案中所使用的用語僅用以說明特定的實施例，並非意欲限定本發明。只要未於文中明確地表示其他含義，則單數的表達包括複數的表達。於本申請案中，「包括」或「具有」等用語應理解為表示存在說明書中所記載的特徵、數字、步驟、動作、構成要素、零件或其等的組合，並非預先排除一個或一個以上的其他特徵、數字、步驟、動作、構成要素、零件或其等的組合的存在可能性或附加可能性。第一、第二等用語可用於說明各種構成要素，但構成要素並不限定於上述用語。上述用語僅以將一個構成要素區分於其他構成要素為目的而使用。 The terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. As long as other meanings are not expressly expressed in the text, expressions in the singular include expressions in the plural. In this application, the terms "including" or "having" should be understood to mean the existence of the features, numbers, steps, actions, constituent elements, parts, or combinations thereof described in the specification, and does not exclude one or more than one in advance The possibility of existence or additional possibility of other features, numbers, steps, actions, constituent elements, parts or combinations thereof. Terms such as first and second can be used to describe various constituent elements, but the constituent elements are not limited to the above terms. The above terms are used only for the purpose of distinguishing one component from other components.

以下，參照隨附圖式，詳細地對本發明的實施例進行說明，於參照隨附圖式進行說明時，對相同或對應的構成要素賦予相同的符號而省略其重複說明。 Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding constituent elements will be given the same symbols and their repeated description will be omitted.

圖1是概略性地表示一實施例的雷射加工裝置100的圖。參照圖1，雷射加工裝置100包括光源110、光學調變器120、4F角度控制光學系統130、浮動磁頭140。 FIG. 1 is a diagram schematically showing a laser processing apparatus 100 according to an embodiment. Referring to FIG. 1, the laser processing apparatus 100 includes a light source 110, an optical modulator 120, a 4F angle control optical system 130, and a floating magnetic head 140.

自光源110照射的雷射光束可傳輸至光學調變器120。光學調變器120可為二維地控制來自光源110的雷射光束的角度的光學構成元件。例如，光學調變器120可將雷射光束的角度轉動至角度θ1。光學調變器120可包括第一光聲調變器121及第二光聲調變器122。例如，第一光聲調變器121可沿第一方向將雷射光 束的角度轉動至角度θ1。例如，第二光聲調變器122可沿第二方向將雷射光束的角度轉動至角度θ1。第一方向與第二方向可彼此正交。可藉由此種第一光聲調變器121及第二光聲調變器122的構成而沿任意的二維方向將雷射光束的角度轉動至角度θ1。可根據光學調變器120的構成而確定角度θ1。 The laser beam irradiated from the light source 110 may be transmitted to the optical modulator 120. The optical modulator 120 may be an optical component that controls the angle of the laser beam from the light source 110 two-dimensionally. For example, the optical modulator 120 may rotate the angle of the laser beam to the angle θ 1 . The optical modulator 120 may include a first photoacoustic modulator 121 and a second photoacoustic modulator 122. For example, the first photoacoustic modulator 121 may rotate the angle of the laser beam to the angle θ 1 in the first direction. For example, the second photoacoustic modulator 122 may rotate the angle of the laser beam to the angle θ 1 in the second direction. The first direction and the second direction may be orthogonal to each other. The structure of the first photoacoustic modulator 121 and the second photoacoustic modulator 122 can rotate the angle of the laser beam to an angle θ 1 in an arbitrary two-dimensional direction. The angle θ 1 can be determined according to the configuration of the optical modulator 120.

4F角度控制光學系統130可為將自光學調變器120傳輸的雷射光束傳輸至浮動磁頭140的中繼光學系統。4F角度控制光學系統130可保持光學調變器120的旋角θ1而進行傳輸。或者，4F角度控制光學系統130可具有於光學調變器120將旋角即θ1放大為θ2或縮小為θ3的功能。例如，4F角度控制光學系統130可包括具有四個焦距的光學元件。 The 4F angle control optical system 130 may be a relay optical system that transmits the laser beam transmitted from the optical modulator 120 to the floating magnetic head 140. The 4F angle control optical system 130 can maintain the rotation angle θ 1 of the optical modulator 120 for transmission. Alternatively, the 4F angle control optical system 130 may have a function that the optical modulator 120 enlarges the rotation angle θ 1 to θ 2 or reduces to θ 3 . For example, the 4F angle control optical system 130 may include optical elements having four focal lengths.

浮動磁頭140可將自4F角度控制光學系統130接收到的雷射光束照射至加工對象物(未圖示)上而執行雷射光束加工。浮動磁頭140的位置可於浮動距離內可變。可於傳輸至浮動磁頭140的雷射光束的影像不反轉的區域內決定浮動磁頭140的浮動距離。例如，浮動距離可於3F至4F內定義、或於超過4F的區域內實現。此處，3F作為以四個焦距為基準的第三個焦距位置，是指第二透鏡所處的位置，4F作為第四個焦距位置，是指自第二透鏡隔開第二焦距的位置。浮動磁頭140對加工對象物的加工區域進行加工的速度及範圍除浮動距離以外，可根據雷射光束的旋角而決定。本實施例的雷射加工裝置100於浮動磁頭140的浮動距離相同的情形時，亦可藉由導入4F角度控制光學系統而將旋角放大為θ2來提高加工速度。或者，可將旋角縮小為θ3來提高加工精確度。浮動磁頭140例如可包括F-θ透鏡(F-theta lens)與掃描器 (scanner)，但並不限定於此。 The floating magnetic head 140 can irradiate the laser beam received from the 4F angle control optical system 130 onto an object (not shown) to perform laser beam processing. The position of the floating head 140 may be variable within the floating distance. The floating distance of the floating magnetic head 140 can be determined in an area where the image of the laser beam transmitted to the floating magnetic head 140 is not reversed. For example, the floating distance may be defined within 3F to 4F, or realized in an area exceeding 4F. Here, 3F as the third focal length position based on the four focal lengths refers to the position where the second lens is located, and 4F as the fourth focal length position refers to the position separated from the second lens by the second focal length. The speed and range in which the floating head 140 processes the processing area of the object to be processed can be determined according to the rotation angle of the laser beam in addition to the floating distance. When the laser processing apparatus 100 according to the present embodiment is the same floating head slider 140 from the case, by also introducing 4F angle control optical system of the rotation angle θ 2 enlarged to increase the processing speed. Alternatively, the rotation angle can be reduced to θ 3 to improve the processing accuracy. The floating magnetic head 140 may include, for example, an F-theta lens (F-theta lens) and a scanner (scanner), but it is not limited thereto.

本實施例的雷射加工裝置100以如下方式構成：以通過光學調變器120的光通過4F角度控制光學系統130且將平行光收斂至4F處的方式控制雷射光束的行進路徑，於之後的區域內，位置可於浮動磁頭140的浮動距離內可變。 The laser processing apparatus 100 of this embodiment is configured in such a manner that the travel path of the laser beam is controlled in such a manner that the light passing through the optical modulator 120 passes through the 4F angle control optical system 130 and converges the parallel light to 4F. In the area of the, the position can be variable within the floating distance of the floating head 140.

圖2是概略性地表示另一實施例的雷射加工裝置200的圖。參照圖2，雷射加工裝置200可包括4F角度控制光學系統230及半波板223。除此以外的構成要素與圖1的雷射加工裝置100中所記述的內容重複，因此省略。 FIG. 2 is a diagram schematically showing a laser processing apparatus 200 of another embodiment. Referring to FIG. 2, the laser processing apparatus 200 may include a 4F angle control optical system 230 and a half-wave plate 223. The other components are the same as those described in the laser processing apparatus 100 of FIG. 1 and are therefore omitted.

半波板223可設置至第一光聲調變器121與第二光聲調變器122之間。半波板223可改變通過半波板223的雷射光束的偏光狀態。例如，半波板223可將光的偏光方向改變90度。能夠以如下方式設置半波板223：以平行光為基準而沿垂直方向旋轉45度左右。 The half-wave plate 223 may be disposed between the first photoacoustic modulator 121 and the second photoacoustic modulator 122. The half-wave plate 223 can change the polarization state of the laser beam passing through the half-wave plate 223. For example, the half-wave plate 223 may change the polarization direction of light by 90 degrees. The half-wave plate 223 can be provided in such a manner that it is rotated about 45 degrees in the vertical direction based on parallel light.

4F角度控制光學系統230可包括具有第一焦距的第一透鏡231、及具有第二焦距的第二透鏡232。4F角度控制光學系統230以第一透鏡231為基準而分別於入射面與出射面方向具有第一焦距，以第二透鏡232為基準而分別於入射面與出射面方向具有第二焦距，從而可共具有4個焦距。可根據第一透鏡231的第一焦距或第二透鏡232的第二焦距決定4F角度控制光學系統230的旋角的倍率。另外，可根據第二透鏡232的第二焦距決定浮動磁頭140的浮動距離。 The 4F angle control optical system 230 may include a first lens 231 having a first focal length, and a second lens 232 having a second focal length. The 4F angle control optical system 230 uses the first lens 231 as a reference on an incident surface and an exit surface, respectively The direction has a first focal length, and the second lens 232 is used as a reference to have a second focal length in the direction of the incident surface and the exit surface respectively, so as to have a total of 4 focal lengths. The magnification of the rotation angle of the 4F angle control optical system 230 can be determined according to the first focal length of the first lens 231 or the second focal length of the second lens 232. In addition, the floating distance of the floating head 140 can be determined according to the second focal length of the second lens 232.

4F角度控制光學系統230可更包括設置至第一透鏡231的入射面側的第一光罩233。第一光罩233可阻斷於光學調變器 120形成的高階雷射光束。4F角度控制光學系統230可更包括設置至第一透鏡231與第二透鏡232之間的第二光罩234。第二光罩234可阻斷於光學調變器120形成的高階雷射光束。可藉由同時設置第一光罩233與第二光罩234而阻斷99%以上的高階雷射光束。參照圖3，表示於未阻斷在光聲調變器形成的高階雷射光束的情形時形成至加工對象物上的雷射光束光點的形狀。低階雷射光束佔據雷射光束的輸出的大部分比率，但高階雷射光束亦佔據雷射光束的輸出的一部分比率，因此於未阻斷上述高階雷射光束的情形時，會於加工對象物上形成多個雷射光束光點。於此情形時，加工對象物的加工效率會下降。因此，4F角度控制光學系統230可藉由包括第一光罩233或第二光罩234、或者一併包括第一光罩233及第二光罩234而防止產生多餘的雷射光束光點。例如，第一光罩233可為光圈。例如，第二光罩234可為空間濾波器(spatial filter)。 The 4F angle control optical system 230 may further include a first photomask 233 provided to the incident surface side of the first lens 231. The first mask 233 can be blocked by the optical modulator 120 forms a high-order laser beam. The 4F angle control optical system 230 may further include a second photomask 234 disposed between the first lens 231 and the second lens 232. The second photomask 234 can block the high-order laser beam formed by the optical modulator 120. By setting the first mask 233 and the second mask 234 at the same time, more than 99% of the high-order laser beam can be blocked. 3, the shape of the laser beam spot formed on the object to be processed when the high-order laser beam formed by the photoacoustic modulator is not blocked is shown. The low-order laser beam occupies most of the laser beam output ratio, but the high-order laser beam also occupies a part of the laser beam output ratio. Therefore, when the above-mentioned high-order laser beam is not blocked, it will be processed. Multiple laser beam spots are formed on the object. In this case, the processing efficiency of the object to be processed will decrease. Therefore, the 4F angle control optical system 230 can prevent the generation of unnecessary laser beam spots by including the first mask 233 or the second mask 234, or the first mask 233 and the second mask 234 together. For example, the first mask 233 may be an aperture. For example, the second photomask 234 may be a spatial filter.

於本實施例中，雷射光束於通過第一光聲調變器121與第二光聲調變器122後，經由去除高階雷射光束的第一光罩233而傳輸至第一透鏡231。經過第一透鏡231的光於第一透鏡231的第一焦距聚光。雷射光束經過第一透鏡231而再次發散後通過第二透鏡232。此時，與按照藉由第一光聲調變器121及第二光聲調變器122中的旋角形成的範圍(field)張開的角度對應的各雷射光束自第二透鏡232出射而於第二透鏡232的第二焦距處成像。雷射光束可經由第二透鏡232的4F處而構成準直光束行進。浮動磁頭140能夠以形成準直光束的區域為基準而於影像不反轉的區域內浮動。 In this embodiment, after passing through the first photoacoustic modulator 121 and the second photoacoustic modulator 122, the laser beam is transmitted to the first lens 231 through the first photomask 233 from which the high-order laser beam is removed. The light passing through the first lens 231 is condensed at the first focal length of the first lens 231. The laser beam passes through the first lens 231 and diverges again, and then passes through the second lens 232. At this time, each laser beam corresponding to an angle opening according to the field formed by the rotation angle in the first photoacoustic modulator 121 and the second photoacoustic modulator 122 exits from the second lens 232 to The second lens 232 images at the second focal length. The laser beam can travel through the second lens 232 at 4F to form a collimated beam. The floating magnetic head 140 can float in a region where the image is not inverted based on the region where the collimated light beam is formed.

圖4是概略性地表示一實施例的4F角度控制光學系統330的圖。本實施例的4F角度控制光學系統330可包括用以放大旋角的光學元件。 FIG. 4 is a diagram schematically showing a 4F angle control optical system 330 of an embodiment. The 4F angle control optical system 330 of this embodiment may include optical elements to enlarge the rotation angle.

參照圖4，4F角度控制光學系統330可包括滿足第一焦距大於第二焦距的條件的第一透鏡331及第二透鏡332。例如，於第一焦距為第二焦距的2倍的情形時，可將旋角放大2倍。4F角度控制光學系統330可包括用以去除雷射光束的高階的第一光罩333及第二光罩334。 Referring to FIG. 4, the 4F angle control optical system 330 may include a first lens 331 and a second lens 332 that satisfy the condition that the first focal length is greater than the second focal length. For example, in the case where the first focal length is 2 times the second focal length, the rotation angle can be enlarged by 2 times. The 4F angle control optical system 330 may include a high-order first mask 333 and a second mask 334 for removing laser beams.

圖5是概略性地表示另一實施例的4F角度控制光學系統430的圖。本實施例的4F角度控制光學系統430可包括用以縮小旋角的光學元件。 FIG. 5 is a diagram schematically showing a 4F angle control optical system 430 of another embodiment. The 4F angle control optical system 430 of this embodiment may include optical elements to reduce the rotation angle.

參照圖5，4F角度控制光學系統430可包括滿足第一焦距小於第二焦距的條件的第一透鏡431及第二透鏡432。例如，於第一焦距為第二焦距的1/2倍的情形時，可將旋角縮小1/2倍。4F角度控制光學系統430可包括用以去除雷射光束的高階的第一光罩433及第二光罩434。 Referring to FIG. 5, the 4F angle control optical system 430 may include a first lens 431 and a second lens 432 that satisfy the condition that the first focal length is smaller than the second focal length. For example, when the first focal length is 1/2 times the second focal length, the rotation angle can be reduced by 1/2 times. The 4F angle control optical system 430 may include a high-order first mask 433 and a second mask 434 for removing laser beams.

圖6是概略性地表示另一實施例的4F角度控制光學系統530的圖。本實施例的4F角度控制光學系統530可將旋角保持為1：1。 FIG. 6 is a diagram schematically showing a 4F angle control optical system 530 of another embodiment. The 4F angle control optical system 530 of this embodiment can maintain the rotation angle at 1:1.

參照圖6，4F角度控制光學系統530可包括滿足第一焦距與第二焦距相同的條件的第一透鏡531及第二透鏡532。因此，焦距F1、F2、F3、F4可具有相同的長度。 Referring to FIG. 6, the 4F angle control optical system 530 may include a first lens 531 and a second lens 532 that satisfy the same conditions as the first focal length and the second focal length. Therefore, the focal lengths F1, F2, F3, F4 may have the same length.

本發明的上述說明為示例，於本發明所屬的技術領域內具有常識者應可理解，可不變更本發明的技術思想或必要特徵而 容易地變形為其他具體的形態。因此，應理解如上所述的實施例於所有方面均為示例，並不具有限定性含義。例如，說明為單一型的各構成要素亦可分散而實施，相同地，說明為分散型的構成要素亦能夠以結合的形態實施。 The above description of the present invention is an example, and those of ordinary knowledge in the technical field to which the present invention belongs should understand that the technical idea or essential features of the present invention may not be changed It can be easily transformed into other specific forms. Therefore, it should be understood that the embodiments described above are examples in all aspects and do not have a limiting meaning. For example, each component described as a single type may be distributed and implemented, and similarly, a component described as a distributed type may also be implemented in a combined form.

本發明的範圍由隨附的發明申請專利範圍界定，而並非上述詳細說明，應解釋為根據發明申請專利範圍的含義、範圍及其等同概念而導出的所有變更或變形的形態均包括於本發明的範圍內。 The scope of the present invention is defined by the scope of the accompanying patent application for invention, rather than the above detailed description, and it should be construed that all changes or modifications derived from the meaning, scope and equivalent concepts of the patent application scope of the invention are included in the present invention In the range.

100‧‧‧雷射加工裝置 100‧‧‧Laser processing device

110‧‧‧光源 110‧‧‧Light source

120‧‧‧光學調變器 120‧‧‧Optical Modulator

121‧‧‧第一光聲調變器 121‧‧‧First photoacoustic modulator

122‧‧‧第二光聲調變器 122‧‧‧Second photoacoustic modulator

130‧‧‧4F角度控制光學系統 130‧‧‧4F Angle Control Optical System

140‧‧‧浮動磁頭 140‧‧‧ floating head

θ1、θ2、θ3‧‧‧角度 θ 1 , θ 2 , θ 3 ‧‧‧ angle

Claims (11)

一種雷射加工裝置，其包括：光源，照射雷射光束；光學調變器，於旋角內二維地控制由所述光源入射的所述雷射光束的行進角度；4F角度控制光學系統，包括具有四個焦距的光學元件，所述4F角度控制光學系統變更由所述光學調變器入射的所述雷射光束的所述旋角；及浮動磁頭，藉由自所述4F角度控制光學系統接收到在變更的所述旋角內的雷射光束而對加工對象物進行加工，其中所述光學元件包括具有第一焦距的第一透鏡、及具有第二焦距的第二透鏡，其中藉由調整所述第一焦距及所述第二焦距以變更所述旋角。 A laser processing device includes: a light source that irradiates a laser beam; an optical modulator that two-dimensionally controls the travel angle of the laser beam incident from the light source within a rotation angle; a 4F angle control optical system, It includes an optical element with four focal lengths, the 4F angle control optical system changes the rotation angle of the laser beam incident from the optical modulator; and a floating magnetic head, which controls the optics from the 4F angle The system receives the laser beam within the changed rotation angle to process the object, wherein the optical element includes a first lens with a first focal length and a second lens with a second focal length, wherein The rotation angle is changed by adjusting the first focal length and the second focal length. 如申請專利範圍第1項所述的雷射加工裝置，其中所述光學元件更包括設置至所述第一透鏡的入射面側的第一光罩。 The laser processing apparatus as described in item 1 of the patent application range, wherein the optical element further includes a first photomask provided to the incident surface side of the first lens. 如申請專利範圍第1項所述的雷射加工裝置，其中所述光學元件更包括設置至所述第一透鏡的出射面與所述第二透鏡的入射面之間的第二光罩。 The laser processing apparatus according to item 1 of the patent application range, wherein the optical element further includes a second photomask disposed between the exit surface of the first lens and the entrance surface of the second lens. 如申請專利範圍第1項所述的雷射加工裝置，其中所述光學調變器包括沿第一方向調變光的第一光聲調變器、及沿作為與所述第一方向不同的方向的第二方向調變光的第二光聲調變器。 The laser processing device as described in item 1 of the patent application range, wherein the optical modulator includes a first photoacoustic modulator that modulate light in a first direction, and a direction that is different from the first direction The second direction modulates the second photoacoustic modulator. 如申請專利範圍第4項所述的雷射加工裝置，其中所述光學調變器更包括設置至所述第一光聲調變器與所述第二光聲調 變器之間的半波板。 The laser processing device as described in item 4 of the patent application scope, wherein the optical modulator further includes the first photoacoustic modulator and the second photoacoustic tone Half-wave plate between transformers. 如申請專利範圍第1項所述的雷射加工裝置，其中所述4F角度控制光學系統放大由所述光學調變器控制的旋角。 The laser processing apparatus as described in item 1 of the patent application range, wherein the 4F angle control optical system amplifies the rotation angle controlled by the optical modulator. 如申請專利範圍第6項所述的雷射加工裝置，其中所述第一焦距大於所述第二焦距。 The laser processing apparatus as described in item 6 of the patent application range, wherein the first focal length is greater than the second focal length. 如申請專利範圍第1項所述的雷射加工裝置，其中所述4F角度控制光學系統縮小由所述光學調變器控制的旋角。 The laser processing device as described in item 1 of the patent application range, wherein the 4F angle control optical system reduces the rotation angle controlled by the optical modulator. 如申請專利範圍第8項所述的雷射加工裝置，其中所述第一焦距小於所述第二焦距。 The laser processing apparatus as described in item 8 of the patent application range, wherein the first focal length is smaller than the second focal length. 如申請專利範圍第1項所述的雷射加工裝置，其中所述4F角度控制光學系統將由所述光學調變器控制的旋角保持為同一倍率。 The laser processing device as described in item 1 of the patent application range, wherein the 4F angle control optical system maintains the rotation angle controlled by the optical modulator at the same magnification. 如申請專利範圍第10項所述的雷射加工裝置，其中所述第一焦距與所述第二焦距相同。 The laser processing apparatus as described in item 10 of the patent application range, wherein the first focal length is the same as the second focal length.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068762A (en) * 2004-08-31 2006-03-16 Univ Of Tokushima Method and apparatus of laser beam machining
JP2010082672A (en) * 2008-10-01 2010-04-15 Hamamatsu Photonics Kk Laser processing apparatus and laser processing method
KR20170097425A (en) * 2016-02-18 2017-08-28 주식회사 이오테크닉스 Apparatus and method for laser processing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
JP2000263269A (en) * 1999-03-17 2000-09-26 Sumitomo Heavy Ind Ltd Laser beam machining method and multi-optical system for laser beam machining device
JP6055414B2 (en) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Laser processing system and method for beam dithering and skiving
KR101742132B1 (en) * 2015-08-10 2017-05-31 주식회사 이오테크닉스 Laser processing apparauts
JP6896702B2 (en) * 2016-03-10 2021-06-30 浜松ホトニクス株式会社 Laser light irradiation device and laser light irradiation method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068762A (en) * 2004-08-31 2006-03-16 Univ Of Tokushima Method and apparatus of laser beam machining
JP2010082672A (en) * 2008-10-01 2010-04-15 Hamamatsu Photonics Kk Laser processing apparatus and laser processing method
KR20170097425A (en) * 2016-02-18 2017-08-28 주식회사 이오테크닉스 Apparatus and method for laser processing

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