KR20170097425A - Apparatus and method for laser processing - Google Patents

Apparatus and method for laser processing Download PDF

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KR20170097425A
KR20170097425A KR1020160019161A KR20160019161A KR20170097425A KR 20170097425 A KR20170097425 A KR 20170097425A KR 1020160019161 A KR1020160019161 A KR 1020160019161A KR 20160019161 A KR20160019161 A KR 20160019161A KR 20170097425 A KR20170097425 A KR 20170097425A
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South Korea
Prior art keywords
processing
beams
laser beam
processing beams
time
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KR1020160019161A
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Korean (ko)
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조성용
장재경
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주식회사 이오테크닉스
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Priority to KR1020160019161A priority Critical patent/KR20170097425A/en
Priority to PCT/KR2016/010235 priority patent/WO2017142156A1/en
Priority to TW105129959A priority patent/TWI628028B/en
Publication of KR20170097425A publication Critical patent/KR20170097425A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • B23K2203/56—

Abstract

A laser processing apparatus and a laser processing method are disclosed. The disclosed laser processing apparatus time-divides the pulsed laser beam into a plurality of processing beams using an acousto-optic modulation section. The laser processing apparatus forms a processing pattern by allowing a plurality of processing beams to be irradiated at different positions.

Figure P1020160019161

Description

[0001] APPARATUS AND METHOD FOR LASER PROCESSING [0002]

And more particularly, to a laser processing apparatus and method using an acousto-optical modulating unit.

In general, the laser machining process refers to the process of machining the shape and physical properties of a workpiece surface by scanning a laser beam on the surface of the workpiece. There are various examples of such a workpiece. have. As an example of the laser machining process, there may be a process of crystallizing an amorphous silicon film into a polysilicone film by scanning a laser beam on a silicon wafer.

In laser processing, it is important to modulate the laser beam in accordance with the processing conditions. The precision of the laser processing can be improved by adjusting the intensity, traveling direction, interference condition, polarization component, etc. of the laser beam.

Techniques for modulating a laser beam include an electro-optic modulation method and an acousto-optic modulation method. The electro-optical modulation method utilizes the phenomenon that the refractive index of the medium is changed by the electric field applied to the medium, and the acousto-optic modulation method uses the phenomenon that the refractive index of the medium is changed by the acoustic wave applied to the medium.

According to embodiments, a laser processing apparatus and method using an acousto-optic modulation unit are disclosed.

In one aspect,

Emitting a pulsed laser beam;

Time division of the pulsed laser beam into a plurality of processed beams using an acousto-optic modulator; And

And adjusting a traveling path of the plurality of processing beams so that the plurality of processing beams are irradiated at different positions.

Wherein the dividing into the plurality of processing beams comprises:

The pulse laser beam can be time-divided by changing the acoustic wave to be applied to the acousto-optical modulator while the pulse laser beam is emitted.

Wherein the dividing into the plurality of processing beams comprises:

And the traveling directions of the plurality of processing beams can be changed by adjusting the frequency of the acoustic waves.

Wherein the dividing into the plurality of processing beams comprises:

One pulse in the pulsed laser beam can be time-divided into a plurality of processed beams.

Wherein the dividing into the plurality of processing beams comprises:

The pulse laser beam can be time-divided into a plurality of processing beams at the same time intervals.

Wherein the dividing into the plurality of processing beams comprises:

The pulse laser beam can be time-divided into a plurality of processing beams at different time intervals.

The step of causing the plurality of processing beams to be irradiated at different positions includes:

The irradiation position of each of the plurality of processing beams can be moved so that the plurality of processing beams divides and forms one processing pattern.

The step of causing the plurality of processing beams to be irradiated at different positions includes:

The irradiation positions of the plurality of processing beams can be moved so that each of the plurality of processing beams forms different processing patterns.

In another aspect,

A light source emitting a pulsed laser beam;

An acousto-optic modulator into which the pulsed laser beam is incident and which time-divides the pulsed laser beam into a plurality of processed beams by diffraction;

An acoustic wave driver for applying an acoustic wave to the acousto-optic modulator; And

And a light path adjusting unit adjusting a traveling path of the plurality of processing beams to irradiate a plurality of processing beams to different positions.

The acousto-optical modulating section may include a first modulating section for changing an output angle of the plurality of processing beams in a first direction and a second modulating section for changing an output angle of the plurality of processing beams in a second direction.

The acoustic wave driving unit may cause the acousto-optic modulation unit to time-divide the pulsed laser beam by changing an acoustic wave applied to the acousto-optic modulation unit while the pulsed laser beam is emitted.

The acousto-optic modulator may time-divide one pulse in the pulsed laser beam into a plurality of processed beams.

The acoustic wave driving unit may adjust the frequencies of the acoustic waves so that the traveling direction of each of the plurality of processing beams may be changed.

The acousto-optical modulator may time-divide the pulse laser beam into a plurality of processing beams at the same time intervals.

The acousto-optic modulator may time-divide the pulse laser beam into a plurality of processing beams at different time intervals.

The optical path adjuster includes:

The irradiation positions of the plurality of processing beams can be moved so that the plurality of processing beams divides and forms the one processing pattern.

The optical path adjuster includes:

The irradiation positions of the plurality of processing beams can be moved so that each of the plurality of processing beams forms different processing patterns.

According to exemplary embodiments, the pulse laser beam emitted from the light source can be time-divided into a plurality of processing beams. Therefore, it is possible to broaden the pulse width limit required for the light source. Further, by forming a processing pattern using a plurality of processing beams, the time required for the laser processing step can be shortened.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a laser machining apparatus according to an exemplary embodiment. Fig.
2 is a diagram exemplarily showing a progression path of the laser beam changed by the first and second modulators;
3 is a flowchart showing a laser processing method using the laser processing apparatus shown in Fig.
FIG. 4 is a diagram showing an example of time-division of a pulsed laser beam. FIG.
FIG. 5 is a diagram illustrating a pulse laser beam which is time-divided. FIG.
Fig. 6 is a view showing that a processing pattern is formed by the laser processing method according to the comparative example.
7 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.
8 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.
9 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.
10 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in FIG.

Hereinafter, a mirror mount for a laser machining apparatus according to an exemplary embodiment will be described in detail with reference to the accompanying drawings.

In the following drawings, like reference numerals refer to like elements, and the size of each element in the drawings may be exaggerated for clarity and convenience of explanation. On the other hand, the embodiments described below are merely illustrative, and various modifications are possible from these embodiments.

In the following, what is referred to as "upper" or "upper"

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by terms. Terms are used only for the purpose of distinguishing one component from another.

The singular expressions include plural expressions unless the context clearly dictates otherwise. Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

Also, the terms " part, " " module, " and the like, which are described in the specification, refer to a unit that processes at least one function or operation.

Fig. 1 schematically shows a laser machining apparatus 100 according to an exemplary embodiment.

Referring to Figure 1, a laser processing apparatus 100 according to an exemplary embodiment includes a light source 110 that emits a pulsed laser beam, a light source 110 to which a pulsed laser beam is incident, An acousto-optical modulator 120 for time division, an acoustic wave driver 127 for applying an acoustic wave to the acousto-optic modulator 120, and a plurality of processing beams And a light path adjusting unit 150 for irradiating light to different positions.

The light source 110 may emit a pulsed laser beam. Pulsed laser beam means that the intensity of the laser beam varies in pulse shape with time. The pulse width and period of the pulse laser beam emitted from the light source 110 may be constant or irregular. The pulsed laser beam emitted from the light source 110 may be incident on the acousto-optic modulator 120.

The acousto-optical modulator 120 may diffract the pulsed laser beam incident on the acousto-optic modulator 120. [ Illustratively, the acousto-optical modulator 120 includes a first modulator 122 for diffracting a pulsed laser beam in a first direction and a second modulator 124 for diffracting a pulsed laser beam in a second direction .

Each of the first and second modulators 122 and 124 may include a predetermined medium. The medium may include glass, quartz and the like, but the embodiment is not limited thereto. The diffraction characteristics of the first and second modulators 122 and 124 can be adjusted by the acoustic wave driver 127. For example, the acoustic wave driver 127 may change the refractive index of the medium included in the first and second modulators 122 and 124 by applying an acoustic wave to the first and second modulators 122 and 124 . The refractive index of the medium included in the first and second modulators 122 and 124 may be periodically changed. The light incident on the first and second modulators 122 and 124 can cause a diffraction phenomenon similar to Bragg diffraction due to the interference effect.

If the laser beam causes diffraction in the first and second modulators 122 and 124, the propagation path can be changed according to the diffraction order. For example, the 0th-order diffracted beam L0 proceeds as it is without changing the progress path, and the higher the diffraction orders of the higher order diffracted beams L1, L2, and L3, the larger the diffraction angle.

The 0th-order diffracted beam L0 may not be used as a processing beam since modulation of the 0th order diffracted beam L0 is not easy because the path of the laser beam is not changed. Therefore, the 0th-order diffracted beam L0 can be dumped by using the damper 132. The higher order diffraction beams L1, L2, and L3 can change the traveling direction using the mirror 134. [

The intensity of the first order diffracted beam L1 may be approximately proportional to the intensity of the acoustic wave applied by the acoustic wave driver 127, among the higher order diffraction beams L1, L2, and L3. The first order diffracted beam L1 is easy to control the beam intensity and may be more stable than the other higher order diffracted beams L2 and L3. Therefore, the first-order diffraction beam L1 can be used as a working beam. The laser processing apparatus 100 may selectively cause the first diffraction beam L1 to enter the optical path changing unit 150 using the galvo system 140. [ The galvo system 140 may include a plurality of gallo mirrors 142 and 144. The array angle of the galvo mirrors 142 and 144 can be adjusted according to the emitting direction of the first diffraction beam L1. The galvo mirrors 142 and 144 can selectively cause the first diffraction beam L1 among the higher order diffraction beams L1, L2 and L3 to enter the optical path changing unit 150. [

The optical path changing section 150 may include a plurality of optical elements (not shown). The plurality of optical elements may include a lens, a mirror, and the like. The optical path changing unit 150 can change the position where the processing beam is irradiated by adjusting the arrangement position of the optical elements included therein.

2 is a diagram exemplarily showing a progression path of a laser beam changed by the first and second modulators 122 and 124. [

Referring to FIG. 2, the laser beam can be diffracted in the first direction (x direction) by the first modulator 122. [ Further, the laser beam can be diffracted by the second modulator 124 in the second direction (y direction). The first and second directions may be substantially orthogonal to each other.

Of the light that has passed through the first modulator 122, the 0th order diffracted beam can be dumped by the first damper 132a. The x-direction diffraction angle? X of the beam diffracted by the first modulating section 122 can be changed depending on the acoustic wave applied to the first modulating section 122. [ For example, the acoustic wave driving unit 127 can change the x-direction diffraction angle? X by changing the frequency of the acoustic wave applied to the first modulating unit 122.

Of the light that has passed through the second modulator 124, the 0th order diffracted beam can be dumped by the second damper 132b. The y-direction diffraction angle? Y of the beam diffracted by the second modulating section 124 can be changed depending on the acoustic wave applied to the second modulating section 124. For example, the acoustic wave driver 127 may change the y-direction diffraction angle? Y by changing the frequency of the acoustic wave applied to the second modulator 124.

The wavelength of the acoustic wave and the diffraction angle of the diffraction beam can satisfy the relation of the expression (1) from the Bragg diffraction condition.

Figure pat00001

In Equation (1),? Denotes a diffraction angle and m denotes a diffraction order. m may be an arbitrary integer. In addition, λ means the wavelength of light in the medium, and Λ means the wavelength of the acoustic wave in the medium.

As shown in equation (1), the diffraction angle of the diffracted light may depend on the ratio between the wavelength? Of the light inside the medium and the wavelength? Of the acoustic wave inside the medium. The acoustic wave driver 127 can adjust the frequencies of the acoustic waves applied to the first and second modulators 122 and 124, respectively. The acoustic wave driver 127 can change the wavelength of the acoustic wave by adjusting the frequency of the acoustic wave. That is, the acoustic wave driver 127 can change the x-direction diffraction angle? X and the y-direction diffraction angle? Y by changing the frequency of the acoustic wave applied to each of the first and second modulators 122 and 124 have. As the x-direction diffraction angle? x and the y-direction diffraction angle? y are adjusted, the output direction of the processing beam output from the acousto-optic modulation unit 120 can be two-dimensionally adjusted.

3 is a flowchart showing a laser machining method using the laser machining apparatus 100 shown in Fig.

Referring to FIG. 3, a laser processing method according to an exemplary embodiment includes a step 1110 of emitting a pulsed laser beam, a step 1120 of time division of the pulsed laser beam into a plurality of processing beams, And adjusting the path of the beam (step 1130).

In step 1110, the light source 110 may emit a pulsed laser beam. The pulsed laser beam emitted from the light source 110 may be incident on the acousto-optic modulator 120. [

In step 1120, the light incident on the acousto-optic modulator 120 can be changed in the propagation path by the diffraction. As described with reference to FIG. 2, the acousto-optic modulator 120 can diffract the high-order diffraction beam in the x direction and the y direction. The acoustic wave driver 127 can time-demultiplex the pulsed laser beam by changing the acoustic wave applied to the acousto-optic modulator 120 of the acoustic wave over time while the pulsed laser beam is emitted.

Fig. 4 is a view showing an example in which the pulsed laser beam is time-divided. Fig.

Referring to FIG. 4, one pulse in the pulsed laser beam may be time-divided into a plurality of processing beams. For example, the acousto-optic modulator 120 may time-divide one pulse into the first through fourth time zones (a, b, c, d). Each of the first to fourth time zones may correspond to a plurality of time-divided processed beams. For example, a time-divided first processing beam in a first time period (a) proceeds in a first direction, a time-divided second processing beam in a second time period (b) proceeds in a second direction, The time-divided third processing beam advances in the third direction in the time interval (c), and the time-divided fourth processing beam in the fourth time interval (d) advances in the fourth direction. The first to fourth directions may be defined on a two-dimensional plane.

The acoustic wave driver 127 may not apply an acoustic wave to the acousto-optic modulator 120 in the time domain f where the intensity of the pulse beam increases or decreases. Thus, the beam in the time domain f in which the intensity of the pulse beam increases or decreases can be propagated to the path of the 0 < th > order beam without being diffracted and can be dumped by the damper 132. [

The acoustic wave driver 127 can apply an acoustic wave to the first and second modulators 122 and 124 of the acousto-optic modulator 120 in a time interval in which the intensity of the pulse beam is substantially constant. While one pulse is incident on the acousto-optic modulator 120, the acoustical wave driver 127 can change the frequency of the acoustic wave applied to each of the first and second modulators 122 and 124 with time . For example, the acoustic wave driver 127 may vary the frequencies of the acoustic waves applied in the first to fourth time zones a, b, c, and d, respectively. When the acoustic wave driver 127 varies the frequency of the acoustic wave in each time domain, the laser beam can be diffracted at different diffraction angles in each of the first to fourth time zones a, b, c, and d. Accordingly, a plurality of time-division processed beams can be emitted from the acousto-optic modulation section 120 in different directions.

4 shows a case where the pulse laser beam is time-divided equally, but the embodiment is not limited thereto.

FIG. 5 is a diagram illustrating a pulse laser beam which is time-divided. FIG.

Referring to FIG. 5, the pulse laser beam can be time-divided into a plurality of processing beams. In this case, the sizes of time-division time areas (a, b, c, d) may be different from each other. By varying the time interval at which the acoustic wave driver 127 changes the frequency of the acoustic wave, the size of time-division time zones a, b, c, and d can be varied. As shown in FIG. 5, by varying the size of time-division time zones (a, b, c, d), the output ratios of the plurality of processed beams can be made different.

As shown in FIGS. 4 and 5, when a pulsed laser beam is time-divided using the acousto-optical modulator 120, one pulse can be time-divided into a plurality of processed beams. Since one pulse is time-divided into a plurality of processing beams, the pulse width of each of the processing beams can be relatively small even if the pulse width of the pulse laser beam is large. Therefore, even if a low-performance laser light source is used, accurate laser processing can be performed.

Referring again to FIG. 3, in step 1130, the optical path adjusting unit 150 may change the traveling path of the processing beams so that a plurality of processing beams are irradiated to different positions. For example, the light path adjusting unit 150 may change the traveling path of the processing beams by adjusting the arrangement direction of the plurality of optical elements. The optical path adjusting unit 150 can change the irradiation position of each of the plurality of processing beams to form a laser machining pattern. The laser machining pattern is a concept including a cutting line, a grooving line, a marking shape, and the like formed on a workpiece by a laser beam.

Fig. 6 is a view showing that a processing pattern is formed by the laser processing method according to the comparative example.

Referring to FIG. 6, a processing pattern can be formed by one laser beam. The processing pattern can be formed while the position S1 at which the laser beam is irradiated moves along the machining shape. However, in this case, since it takes time for the position S1 to be irradiated with the laser beam to move along the planned machining shape, high-speed machining can be difficult.

7 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.

Referring to Fig. 7, a plurality of processing beams can be formed by dividing one processing pattern. For example, in the case of forming a circular machining pattern as shown in Fig. 7, the processing beams passing through the optical path adjusting section 150 can be irradiated to different positions 1, 2, 3 and 4 . The first machining beam is irradiated to the first position 1, the second machining beam is irradiated to the second position 2, the third machining beam is irradiated to the third position 3, Can be irradiated to the fourth position (4). The first to fourth positions may be arranged at intervals of 90 degrees on the original call. The acousto-optical modulating unit 120 and the optical path adjusting unit 150 may move the positions 1, 2, 3 and 4 of the first through fourth processing beams to be moved along the circle.

For example, the time-divided processing beams in the first pulse can be irradiated to the first to fourth positions 1, 2, 3, 4 as shown in Fig. Then, the time-divided processing beams in the second pulse can be irradiated to a position shifted by a predetermined angle from the first to fourth positions (1, 2, 3, 4) shown in FIG. As shown in Fig. 7, when a plurality of processing beams are formed by dividing one processing pattern, the time for forming the processing pattern can be shortened.

Although Fig. 7 shows an example in which a plurality of processing beams form one processing pattern, the embodiment is not limited thereto.

8 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.

Referring to Fig. 8, each of the plurality of processing beams can form a different processing pattern. For example, when four circular patterns are formed as shown in FIG. 8, the processing beams passing through the optical path adjusting unit 150 are irradiated to different positions 1, 2, 3 and 4 . The third machining beam is irradiated to the third position 3 and the fourth machining beam 4 is irradiated to the third position 3. The fourth machining beam 4 is irradiated to the first position 1 and the second machining beam is irradiated to the second position 2, Location. The first to fourth processing beams can form a circular machining pattern at different positions. The acousto-optic modulator 120 and the optical path adjuster 150 may move the first, second, third, and fourth irradiation positions of the first through fourth processing beams along different circles, respectively.

For example, time-divided processing beams in the first pulse can be irradiated to the first to fourth positions 1, 2, 3, 4 as shown in Fig. The time-divided processing beams in the second pulse may be irradiated to positions shifted by a predetermined angle along different circles. As shown in Fig. 8, when a plurality of processing beams are formed simultaneously on a plurality of processing patterns, the time for forming processing patterns can be shortened.

9 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in Fig.

Referring to FIG. 9, the beam sizes of the plurality of processed beams may be different from each other. The beam size of the processing beams may vary depending on the size of the time-sharing area corresponding to the processing beams and the arrangement state of the optical elements of the optical path changing part 150, and the like. Further, the direction in which the irradiation positions (1, 2, 3, 4) of the plurality of processing beams move may vary in various ways. For example, the irradiation position 1 of the first processing beam can move along a circle. Further, the irradiation position 2 of the second processing beam can move along a circle which is smaller than the circle drawn while the irradiation position 1 of the first processing beam moves. Further, the irradiation position 3 of the third processing beam can move along the polygon. Further, the irradiation position 4 of the fourth processing beam may not be changed. The laser machining apparatus 100 can quickly form various patterns of processing patterns by changing the beam size of the processing beams and the positions at which the processing beams are respectively irradiated.

10 is a view showing an example in which a processing pattern is formed by a plurality of processing beams according to the embodiment shown in FIG.

Referring to Fig. 10, the laser machining apparatus 100 can perform line beam machining by arranging the irradiation positions 1, 2, 3, and 4 of a plurality of processing beams in a row. That is, the laser processing apparatus 100 according to the embodiment can perform line beam processing without using a separate optical system for changing a spot beam emitted from the light source 110 into a line beam . The laser processing apparatus 100 may time-divide the pulsed laser beam emitted from the light source 110 into a plurality of processing beams by using the acousto-optic modulation section 120. [ The laser processing apparatus 100 causes the plurality of processing beams to be irradiated in a line by the operation of the acousto-optic modulating section 120 and the optical path changing section 150 to generate an effect such that the line beam is irradiated .

The laser processing apparatus 100 and the laser processing method according to the exemplary embodiments have been described above with reference to FIGS. 1 to 10. FIG. According to the above-described embodiments, the pulse laser beam emitted from the light source 110 can be time-divided into a plurality of processing beams. Therefore, the pulse width limitation required for the light source 110 can be widened. Further, by forming a processing pattern using a plurality of processing beams, the time required for the laser processing step can be shortened.

While a number of embodiments have been described in detail above, they should be construed as examples of preferred embodiments rather than limiting the scope of the invention. Therefore, the scope of the present invention should not be limited by the described embodiments but should be determined by the technical idea described in the claims.

100: laser processing device
110: Light source
120: acousto-optic modulation section
122: first modulation section
124: second modulation section
132: Dumper
150: Optical path changing section

Claims (17)

Emitting a pulsed laser beam;
Time division of the pulsed laser beam into a plurality of processed beams using an acousto-optic modulator; And
And adjusting the traveling path of the plurality of processing beams so that the plurality of processing beams are irradiated at different positions. The method according to claim 1,
Wherein the dividing into the plurality of processing beams comprises:
Wherein the pulsed laser beam is time-divided by changing an acoustic wave to be applied to the acousto-optic modulation section over time while the pulsed laser beam is emitted. 3. The method of claim 2,
Wherein the dividing into the plurality of processing beams comprises:
And adjusting a frequency of the acoustic wave to change the traveling direction of each of the plurality of processing beams. The method according to claim 1,
Wherein the dividing into the plurality of processing beams comprises:
Wherein the pulsed laser beam is time-divided into one pulse by a plurality of processing beams. The method according to claim 1,
Wherein the dividing into the plurality of processing beams comprises:
And the pulse laser beam is time-divided into a plurality of processing beams at the same time intervals. The method according to claim 1,
Wherein the dividing into the plurality of processing beams comprises:
And the pulse laser beam is time-divided into a plurality of processing beams at different time intervals. The method according to claim 1,
The step of causing the plurality of processing beams to be irradiated at different positions includes:
And the irradiation position of each of the plurality of processing beams is moved so that the plurality of processing beams divides and forms one processing pattern. The method according to claim 1,
The step of causing the plurality of processing beams to be irradiated at different positions includes:
And the irradiation positions of the plurality of processing beams are moved so that each of the plurality of processing beams forms different processing patterns. A light source emitting a pulsed laser beam;
An acousto-optical modulator into which the pulsed laser beam is incident and which time-divides the pulsed laser beam into a plurality of processed beams by diffraction;
An acoustic wave driver for applying an acoustic wave to the acousto-optic modulator; And
And a light path adjusting unit adjusting the traveling path of the plurality of processing beams to irradiate a plurality of processing beams to different positions. 10. The method of claim 9,
Wherein the acousto-optical modulating section includes a first modulating section for changing an output angle of the plurality of processing beams in a first direction and a second modulating section for changing an output angle of the plurality of processing beams in a second direction, . 10. The method of claim 9,
Wherein the acousto-optic driving unit causes the acousto-optic modulation unit to time-divide the pulsed laser beam by changing an acoustic wave applied to the acousto-optic modulation unit while the pulsed laser beam is emitted, over time. 10. The method of claim 9,
Wherein the acousto-optic modulator time-divides one pulse in the pulsed laser beam into a plurality of processed beams. 12. The method of claim 11,
Wherein the acoustic wave driving unit adjusts a frequency of the acoustic wave so that a traveling direction of each of the plurality of processing beams is changed. 10. The method of claim 9,
Wherein the acousto-optical modulator time-divides the pulse laser beam into a plurality of processing beams at the same time intervals. 10. The method of claim 9,
Wherein the acousto-optical modulator time-divides the pulse laser beam into a plurality of processing beams at different time intervals. 10. The method of claim 9,
The optical path adjuster includes:
And the irradiation positions of the plurality of processing beams are moved so that the plurality of processing beams divide and form one processing pattern. 10. The method of claim 9,
The optical path adjuster includes:
And the irradiation positions of the plurality of processing beams are moved so that each of the plurality of processing beams forms a different processing pattern.
KR1020160019161A 2016-02-18 2016-02-18 Apparatus and method for laser processing KR20170097425A (en)

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PCT/KR2016/010235 WO2017142156A1 (en) 2016-02-18 2016-09-12 Laser processing apparatus and method
TW105129959A TWI628028B (en) 2016-02-18 2016-09-14 Apparatus and method for laser processing

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