KR101639583B1 - Laser device and method for forming micro groove and hole using acoustic optical modulator - Google Patents

Abstract

The present invention relates to a laser apparatus and method for processing fine grooves or holes using an acoustooptic modulator, and more particularly, to a laser apparatus for processing fine grooves or holes in an object by irradiating pulsed laser, And a processing unit having a plurality of sequential optical light modulators arranged so as to allow the laser emitted from the light source to pass therethrough, wherein the processing unit is configured to process the pulses in units of time from the laser passing through the respective acoustooptic modulators, The laser is extracted and irradiated to form fine grooves or holes in the object.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser device and a method for forming fine grooves or holes using an acoustic optical modulator,

The present invention relates to a laser apparatus, and more particularly, to a laser apparatus and method for machining fine grooves or holes using an acoustooptic modulator adapted to process a plurality of fine grooves or holes in a large area of an object.

In general, the air-permeable film is a functional film in which a plurality of fine grooves are processed so that air or gas can permeate and liquid can not permeate. Such a breathable film has a function of blocking the flow of liquid while permitting the gas flow between the contained contents and the outside. For example, when the content is food, the gas emitted from the food is discharged to block moisture evaporation. This breathable film has been used in various fields to utilize such functions, for example, packaging materials for corrosion prevention machines (especially medical devices), food packaging, fruit bags, diapers, sanitary napkins, disposable clothes and sheets, medical drapes , A gown, a liquid-impermeable back sheet for wound dressing, and a liquid-permeable top sheet.

Such a breathable film is provided with a plurality of fine grooves for obtaining a characteristic of air permeability. As a technique for processing the fine grooves, for example, Korean Patent Registration No. 10-1301671 (entitled " Manufacturing method). 1, a laser light source unit 10 for generating a pulsed laser, a diffraction optical element 11 for diverging the irradiated pulsed laser, And a lens 12 for radiating light. A method of forming a plurality of fine grooves G1, G2, G3, G4 and G5 in the film 13 with such a structure is a method in which a plurality of fine grooves G1, G2, G3, The pulses P1, P2, P3 and P4 of the laser beams L1, L2, L3, L4 and l5 are irradiated at intervals of a predetermined interval to form new fine grooves on one surface of the moving film 13, The pulses P1, P2, P3, and P4 are repeatedly irradiated to the generated adjacent fine grooves to complete the fine grooves having a deep depth. This reduces the number of grooves to reduce the machining time and increase the groove depth.

However, the size of the diffraction optical element 11 is limited and the number of the laser beams L1, L2, L3, L4, and L5 that branch from the diffraction optical element 11 is limited. The number and area of the fine grooves G1, G2, G3, G4, and G5 can not be limited. That is, since the size of the diffraction optical element 11 is small, the area of the fine grooves G1, G2, G3, G4, and G5 that can be machined one time is narrow. Therefore, as the area of the film 13 increases, the number of times of processing the fine grooves must increase. Of course, it is possible to extend the number and area of the fine diffraction optical element 11 by which the fine grooves can be formed by increasing the number of branching of the pulse laser, but the size of the diffractive optical element 11 There is a problem that this can not be regarded as a suitable improvement measure.

Korean Patent No. 10-1301671 (Bulletin of Sep. 2013, 2013)

An object of the present invention, which is developed to solve the above-described problems, is to provide a pulse laser for processing fine grooves or holes while sequentially passing through an acoustooptic modulator in which a plurality of continuous wave lasers emitted from a light source are arranged, By providing a plurality of acoustic optical modulators according to the area size of the object, fine grooves or holes are machined by using an acoustic optical modulator capable of processing a large number of fine grooves or holes in a short time in a wide range irrespective of the area of the object And to provide a laser apparatus and method for performing the above-described method.

According to another aspect of the present invention, there is provided a laser apparatus for processing fine grooves or holes using an acoustooptic modulator according to the present invention, And a processing unit having a plurality of acoustooptic modulators sequentially arranged so as to allow the laser emitted from the light source to pass therethrough, wherein the processing unit comprises a laser beam passing through each of the acoustooptic modulators The pulse laser is extracted in units of time and irradiated to the object to process fine grooves or holes.

Here, the laser is a continuous wave laser.

The light source unit may further include an optical fiber installed to transmit the laser beam emitted from the light source to the acoustooptic modulator.

The light source unit may further include at least one first lens installed to adjust the size of the laser emitted from the optical fiber.

The processing unit includes a reflector provided to refract the pulsed laser extracted from the acoustooptic modulator and emitted to the object, a second lens for condensing the pulsed laser as an object to process a fine groove or hole in the object with the pulsed laser, And at least one light receiving unit into which the laser beam having passed through the acoustic light modulator disposed last in the acoustic optical modulator is introduced.

The processing section may further include a diffractive optical element for splitting the laser beam emitted from the optical fiber and a third lens provided for guiding the respective laser beams branched from the diffractive optical element to the respective acoustic optical modulators.

In addition, the processing section may refract the laser emitted from the optical fiber to enter the acoustooptic modulator, or may be used in a plurality of acoustooptic modulators arranged in the form of a straight line and a nonlinear mixed form or a nonlinear form in the acoustooptic modulator, And a reflecting member for refracting the laser beam into the laser beam.

And a transfer unit having a transfer device installed to transfer the object.

The apparatus further includes a control unit for controlling the transfer device and the light source.

At this time, the controller senses the position of the object, corrects the lateral deviation, controls the moving speed and displacement of the object, and adjusts the output of the laser in proportion to the depth of the fine groove or hole.

The method for fabricating fine grooves or holes in a laser device using an acoustooptic modulator according to the present invention comprises: a 100th step (S100) in which a laser generated in a light source flows in an optical fiber and moves; 200) S200 of extracting a pulse laser in units of time while sequentially passing the laser emitted from the optical fiber to a plurality of acoustooptic modulators; 300) S300 of irradiating a pulse laser to an object to process fine grooves or holes; (S400) a laser beam having passed through all of the acoustooptic modulators is collected in a light receiver; And a seventh step (S700) of suspending all operations when fine grooves or holes are formed on all the surfaces of the object.

In operation S500, it is determined whether or not fine grooves or holes have been formed on all the surfaces of the object between steps S200 and S700. Step 600 (S600) of moving the object to a position where the fine groove or hole is to be machined if the hole is machined and repeating step S500 in step S100 if the object is located .

In operation S100, a step S101 of adjusting the size of the laser beam emitted from the optical fiber by at least one first lens may be included.

In addition, the 100th step S100 may include a 110th step (S110) of passing a laser through the diffractive optical element to divide a plurality of laser beams into a plurality of beams, a 120th step (S110) of refracting each branched laser beam by a third lens, (S120). ≪ / RTI >

If the acoustooptic modulator is arranged in a mixed form of a straight line and a non-straight line or in a nonlinear stand-alone form, the laser beam emitted from the optical fiber is introduced into the acousto-optical modulator by the reflecting member in step 200 (S200) And a step 210 (S210) in which the laser beam emitted from the acoustic optical modulator is refracted by the reflecting member and then introduced into the next acoustic optical modulator.

As described above, according to the present invention, every time a continuous wave laser emitted from a light source sequentially passes through a plurality of successively arranged acoustic optical modulators, a fine groove or a hole processing pulse laser is extracted on a time unit basis, By irradiating the object with fine grooves or holes, it is possible to process a plurality of fine grooves or holes in a short time with a laser device of simple structure and structure.

Further, by adjusting the number and position of the fine grooves or holes that can be machined once by adjusting the installation position and number of the acoustooptic modulator, fine grooves or holes are machined narrowly or broadly irrespective of the area size of the object And it is possible to maximize the production rate while innovatively shortening the working time.

Further, by moving the laser along the optical fiber from the light source to the acoustooptic modulator, the processing part for machining the fine grooves or the holes and the light source part for generating the laser can be separated from each other to facilitate installation, separation or transportation, So that it can be operated in a state of being operated.

As a modified example, a laser can be refracted by a reflector to sequentially pass through a plurality of adjacent acoustooptic modulators, and a large number of necessary pulse lasers can be extracted. Thus, a single continuous wave laser can process fine grooves or holes in the entire area of an object .

In another modification, by providing a plurality of continuous wave lasers while corresponding to an acoustooptic modulator, it is possible to process a large number of fine grooves or holes in one time or the shortest time even if the object has a large area.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, It should not be interpreted.
1 is a schematic view of a conventional laser device for fine groove processing.
2 is a diagram schematically showing a laser apparatus for processing fine grooves or holes using an acoustooptic modulator according to the present invention.
FIG. 3 is a schematic view illustrating a process of extracting pulses from a laser in the laser apparatus shown in FIG. 2. Referring to FIG.
Figs. 4 and 5 are schematic diagrams showing a modification of the laser device shown in Fig. 2. Fig.
Fig. 6 is a diagram showing a method of processing fine grooves or holes in an object by using the laser apparatus of Fig. 2;
Figs. 7 and 8 are diagrams further illustrating a process according to the modification of Figs. 4 and 5 based on the method of Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the detailed description of known functions and configurations incorporated herein will be omitted when it may unnecessarily obscure the subject matter of the present invention.

<Configuration>

2 is a diagram schematically showing a laser apparatus for processing fine grooves or holes using an acoustooptic modulator according to the present invention. FIG. 3 is a schematic view illustrating a process of extracting pulses from a laser in the laser apparatus shown in FIG. 2. Referring to FIG.

As shown in FIG. 2, a laser apparatus for processing fine grooves or holes using an acoustooptic modulator according to the present invention includes a light source unit 100 that emits a laser beam, a processing unit that irradiates the object 200 with a laser beam, A transfer unit 120 for moving the object 200 and a control unit 130 for controlling the light source unit 100, the processing unit 110 and the transfer unit 120. Here, the object 200 may be processed with fine holes 201 or holes (not shown) that are unperforated by a laser. This fine groove (201) or hole is made possible by allowing a gas such as air to permeate while performing a common function of not transmitting a liquid such as water, and finely scaling the size of the groove and the hole. Further, in the case of a hole, it can be processed so as to transmit not only a gas but also a liquid by enlarging the size thereof, and enlarging this hole is possible by enlarging the size of the laser.

Hereinafter, the fine grooves 201 are described as an example, but it should be appreciated that holes may be machined instead of fine grooves.

The light source unit 100 includes a light source 101, an optical fiber 102, and a first lens 103 for guiding the laser to the processing unit 110 by emitting a laser.

Here, the light source 101 is a device that generates and emits a laser, and the type of laser generated at this time is a continuous wave laser (CWL). Since the depth of the fine grooves 201 is determined by the output size of the continuous wave laser CWL, the depth of the fine grooves 201 (or holes) in the case of the high output continuous wave laser CWL is deep and the depth of the fine grooves 201 ), The depth of the fine grooves 201 is shallow. Therefore, when the depth of the fine grooves 201 is determined according to the thickness of the object 200, a continuous wave laser (CWL) having an appropriate output is emitted from the light source 101.

The optical fiber 102 guides the continuous wave laser CWL emitted from the light source 101 to an acoustic optical modulator 111 (AOM) of the processing unit 110. The laser that flows and moves in the optical fiber 102 is referred to as an optical fiber laser. When the optical fiber 102 is used, the length of the optical fiber 102 can be varied to separate the light source unit 100 including the light source 101 from the processing unit 110. There is no spatial variation of the laser, In contrast, the laser can be operated in a very stable environment.

The first lens 103 is installed so as to allow a continuous wave laser (CWL) from the optical fiber 102 to pass therethrough in order to adjust the size of the optical fiber laser moved along the optical fiber 102. If the size of the optical fiber laser is appropriate, the first lens 103 may not be installed but may be moved directly from the optical fiber 102 to the acoustooptic modulator 111. When the size of the optical fiber laser is small or large, Two or more first lenses 103 may be provided to appropriately adjust the size of the optical fiber laser.

The processing unit 110 includes an acoustooptic modulator 111, a reflector 112, a second lens 113, and a light receiver 114.

First, the acoustooptic modulator 111 is a device for optical modulation, and extracts some lasers from the continuous wave laser (CWL) introduced in the optical fiber 102 directly or through the first lens 103 on a time basis. More specifically, as shown in FIG. 2 and FIG. 3, when a continuous wave laser (CWL) passes, a part of the laser, that is, the pulse laser PL in time units is extracted and refracted. Accordingly, when the continuous wave laser (CWL) sequentially passes a plurality of successively arranged acoustooptic modulators 111, the pulse laser PL is extracted on a time unit basis by each acoustooptic modulator 111, The laser PL is refracted by the reflector 112. [

The reflector 112 is a member for irradiating the object 200 with the pulse laser PL extracted by the acoustooptic modulator 111. [ The reflector 112 refracts the pulse laser PL, which is extracted from the acoustooptic modulator 111 and refracted, to the object 200 again. At this time, the reflector 112 to be used is a member capable of refracting the pulse laser PL, and for example, a normal mirror is used. The reflector 112 reflects the incident pulse laser PL to the object 200. At this time, the angle toward the object 200 is preferably an angle close to vertical or vertical.

The second lens 113 condenses the pulse laser PL refracted by the reflector 112 and focuses the pulse laser PL on a part of the object 200. [ And the pulse laser PL that has passed through the second lens 113 processes the fine grooves 201 on the surface of the object 200. [

The photodetector 114 is a device that absorbs the continuous wave laser CWL that has passed through all the acoustooptic modulators 111. Therefore, this photodetector 114 is installed at the next position of the last acoustooptic modulator 111. [

Here, the reflector 112 and the second lens 113 are installed in each of the acoustic optical modulators 111. The reflector 112 and the second lens 113 may not be provided when the pulsed laser PL refracted through the acoustooptic modulator 111 is irradiated directly onto the object 200. [ It is preferable that the reflector 112 and the second lens 113 are provided for stable operation of the pulse laser PL for processing the fine grooves 201 in the object 200.

Meanwhile, the transfer unit 120 includes a transfer device 121 for transferring the object 200. The transfer device 121 can uniformly move the object 200 at a constant speed and can perform repeatedly the transfer and the stop of the object 200 by the nature of the present invention in which the fine grooves 201 are collectively formed over a large area of the object 200 . That is, in the case of repeatedly performing the transfer and the stop, if the area of the object 200 that can process the fine grooves 201 at one time is set according to the number of the acoustic optical modulators 111, A plurality of fine grooves 201 may be processed at a time by irradiating the pulse laser PL, and then the object may be rapidly transferred and fixed so that the pulse laser PL may be irradiated to the next site. Here, when the object 200 is soft, the transfer unit 120 is also provided with a function of holding the object 200 tightly so as not to be hit.

The control unit 130 is installed to control the operation of the respective components including the light source 101 and the transfer unit 121. [ The control unit 130 corrects lateral deviations based on the positional information of the object obtained by the plurality of sensors sensing the edge of the object 200 and controls the transfer device 121 for the moving speed and the moving speed displacement of the object 200. [ . Further, the output of the continuous wave laser CWL is adjusted to be proportional to the depth of the fine grooves 201. That is, a high output continuous wave laser (CWL) is output to deepen the depth of the fine groove (201), and a low output continuous wave laser (CWL) is output to reduce the depth. The control unit 130 may adjust the angle of the reflector 112 so that the pulse laser PL can be refracted substantially perpendicularly to the second lens 113 or the object 200. [

<Modifications>

Figs. 4 and 5 are schematic diagrams showing a modification of the laser device shown in Fig. 2. Fig.

2, in order to process a matrix-shaped fine groove 201 in a large area of the object 200 using a continuous wave laser (CWL) having a straight line, a continuous wave laser (CWL) is formed in a plurality of rows or columns A plurality of optical fibers 102 are required.

In view of this, as in the modification of FIG. 4, a single continuous wave laser (CWL) emitted from one optical fiber 102 is branched into a plurality of beams, and a plurality of acoustic waves A modulator 111 is installed. More specifically, one continuous wave laser (CWL) emitted from one optical fiber 102 is branched into a plurality of continuous wave lasers (CWL) through a diffractive optical element (DOE) And refracts the third lens 141 to guide the laser (CWL) to the acoustooptic modulator 111 while arranging them side by side. As described above, by using the diffractive optical element 140, the number of optical fibers 102 installed can be minimized. The structure and structure for processing the other fine grooves 201 are the same as those in the second embodiment even though they are not shown in Fig.

Meanwhile, as in the embodiment of FIG. 2, a continuous wave laser (CWL) having a straight line is generally emitted from a plurality of optical fibers 102 to process the fine grooves 201 in a matrix form.

5, a single continuous wave laser (CWL) emitted from one optical fiber 102 is continuously refracted to process a plurality of fine grooves 201 in a large area of the object 200 can do. More specifically, a plurality of acoustooptic modulators 111 are arranged only in a linear or nonlinear mixed or nonlinear form, and the laser emitted from the optical fiber 102 enters the corresponding acoustooptic modulator 111, A separate reflecting member (not shown) is installed so that the continuous wave laser CWL emitted from the acoustic optical modulator 111 is introduced into the subsequent acoustic optical modulator 111. Therefore, one continuous wave laser (CWL) emitted from one optical fiber 102 is refracted by the reflection member while passing through the acoustic optical modulator 111, and then introduced into the subsequent acoustic optical modulator 111, (111). The reflective member is installed to refract the continuous wave laser (CWL) installed outside the acoustic optical modulator 111 and to be introduced into the subsequent acoustic optical modulator 111. The structure and structure for processing the other fine grooves 201 are the same as those in the second embodiment even though they are not shown in Fig.

Here, the 'acoustooptic modulator 111' described above or described later is an acoustooptic modulator 111 in which the laser emitted from the optical fiber 102 is first introduced. In addition, the 'acoustooptic modulator 111' described above or below is an acoustooptic modulator 111 through which a laser is passed in a continuously arranged acoustooptic modulator 111. The 'next acoustic optical modulator 111' described above or hereinafter refers to the acoustic optical modulator 111 disposed after the acoustic optical modulator 111 in question.

<Method>

Fig. 6 is a diagram showing a method of processing fine grooves or holes in an object by using the laser apparatus of Fig. 2; Figs. 7 and 8 are diagrams further illustrating a process according to the modification of Figs. 4 and 5 based on the method of Fig.

With reference to Fig. 6, a method for machining fine grooves or holes in an object according to the embodiment of Fig. 2 will be described.

First, the laser generated in the light source 101 flows in the optical fiber 102 and moves (S100). The laser is a continuous wave laser (CWL). Here, the step S100 may further include adjusting the size of the laser emitted from the optical fiber 102 to at least one first lens 103 (S101).

Next, the pulse laser PL is extracted in units of time while allowing the laser emitted from the optical fiber 102 to pass through the plurality of acoustooptic modulators 111 in turn (S200). Here, each of the acoustic optical modulators 111 extracts the pulse laser PL. 3, each of the acoustic optical modulators 111 is sequentially provided, and a time difference occurs when the continuous wave laser CWL passes through each of the acoustic optical modulators 111. Therefore, (PL) extraction in the laser 111 is performed by avoiding overlapping portions in the continuous wave laser (CWL).

Next, the extracted pulse laser PL is irradiated to the object 200 to process the fine grooves 201 or holes (S300). More specifically, the pulsed laser PL extracted by the acoustooptic modulator 111 is refracted by the reflector 112, passes through the second lens 113 and is condensed, then irradiates the surface of the object 200, To process the fine grooves 201 or holes.

Next, the continuous wave laser CWL passing through all the acoustic optical modulators 111 is collected in the light receiver 114 (S400).

Next, it is determined whether or not the fine grooves 201 or holes are formed on all the surfaces of the object 200 (S500). At this time, a plurality of acoustooptic modulators 111 and a total area for machining the fine grooves 201 or holes are provided in the object 200 to prepare the fine grooves 201 or the hole machining area once. Based on this, it is judged whether all the fine grooves 201 or holes have been machined on the entire surface of the object 200.

Next, when fine grooves 201 or holes are formed only on a part of the surface of the object 200, the object 200 is moved to a position where the fine grooves 201 or holes are to be machined. When the object 200 is positioned In step S100, step S500 is repeatedly performed (S600).

Finally, when the fine grooves 201 or holes are formed on all the surfaces of the object 200, all operations of the laser device are stopped (S700).

On the other hand, an additional step of branching the continuous wave laser (CWL) will be described with reference to Fig. Since the other processes are the same as those in the embodiment of Fig. 2, only the branch process will be described.

The step S100 includes a step S110 of passing the laser beam emitted from the optical fiber 102 to the diffractive optical element 140 and splitting the laser beam into a plurality of beams, 111) further includes step S120. Here, as shown in FIG. 4, the number of the laser beams to be branched in step S110 can be adjusted by selecting different sizes of the diffractive optical element 140 and the like, So that the number is equal to the number of the acoustooptic modulators 111 located at the head.

As shown in FIG. 5, the continuous wave laser (CWL) is refracted by arranging the acoustic optical modulator 111 in a form of mixing a straight line and a non-straight line, or in a nonlinear singular form, And the modulator 111 in order. Since the other processes are the same as those in the embodiment of FIG. 2, only the added processes for sequentially passing through the acoustic optical modulator will be described.

Step S200 further includes refracting the laser beam emitted from the acousto-optic modulator 111 using a reflective member to introduce the laser beam into the subsequent acoustooptic modulator 111 (S210). If the acoustooptic modulator 111 is arranged in a straight line, it is not necessary to separately refract the laser. However, as shown in FIG. 5, the acoustooptic modulator 111 may be a mixed form of a straight line and a non- The laser emitted from the optical fiber 102 may be introduced into the acoustic optical modulator 111 by using a separate reflection member or the laser introduced into the acoustic optical modulator 111 may be transmitted to the next acoustic optical modulator 111 ).

As described above, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100: light source 101: light source
102: optical fiber 103: first lens
110: Machining unit 111: Acoustic optical modulator
112: reflector 113: second lens
114: Receiver 120:
121: transfer device 130:
140: diffractive optical element 141: third lens
200: Object 201: Fine groove
CWL: continuous wave laser PL: pulse laser.

Claims (15)

1. A laser apparatus for processing a fine groove (201) or a hole in an object (200) by irradiating a pulsed laser (PL)
A light source unit 100 having a light source 101 for generating a laser beam;
A processing unit 110 having a plurality of acoustooptic modulators 111 sequentially arranged so as to pass the laser emitted from the light source 101;
A transfer unit 120 having a transfer device 121 installed to move the object 200;
And a controller (130) for controlling the transfer device (121) and the light source (101)
The machining unit 110 extracts the pulse laser PL from the laser passing through each of the acoustic optical modulators 111 on a time basis and then irradiates the object to the fine grooves 201 or holes,
The control unit 130 corrects the lateral deviation based on the positional information of the object 200 obtained by a plurality of sensors sensing the edge of the object 200, controls the moving speed and displacement of the object 200, The output of the laser is adjusted to be proportional to the depth of the groove 201 or the hole,
The laser is a continuous wave laser (CWL)
The light source unit 100 further includes an optical fiber 102 installed to transmit the laser emitted from the light source 101 to the acoustooptic modulator 111,
The light source unit 100 may further include at least one first lens 103 installed to adjust the size of the laser emitted from the optical fiber 102,
The processing unit 110 includes a diffractive optical element 140 for splitting the laser beam emitted from the optical fiber 102 and a laser beam splitter 114 for guiding the laser beams branched from the diffractive optical element 140 to the respective acoustooptic modulators 111 And a third lens (141)
The processing unit 110 is provided between the acoustooptic modulator 111 and the acoustooptic modulator 111 so that a plurality of acoustooptic modulators 111 arranged in a nonlinear form are provided in the acoustooptic modulator 111, Further comprising a reflecting member for refracting the laser beam into the acoustooptic modulator 111,
The conveying unit 120 is configured to hold the object 200 in a taut state when the object 200 is soft,
It is determined whether or not the fine grooves 201 or holes are formed on all the surfaces of the object 200. If the fine grooves 201 or holes are formed only on a part of the surface of the object 200, Is moved to a position where the fine groove 201 or the hole is to be machined and the pulse laser PL is irradiated onto the object 200 when the object 200 is positioned to process the fine groove 201 or the hole A laser apparatus for processing fine grooves or holes using an optical modulator.
delete delete delete The method according to claim 1,
The processing unit 110 includes a reflector 112 installed to refract the pulsed laser PL extracted from the acoustooptic modulator 111 to the object 200 and a reflector 112 arranged to refract the object 200 with the pulsed laser PL. A second lens 113 for condensing the pulsed laser PL onto the object 200 to process the fine grooves 201 or holes in the first optical modulator 111 and an acoustooptic modulator 111), and a light receiver (114) into which a laser is introduced. The laser device according to claim 1, wherein the laser light source is a laser diode.
delete delete delete delete delete A method for machining fine grooves or holes in an object with the laser device according to claim 1 or 5,
A 100th step S100 in which the laser generated in the light source 101 flows and moves within the optical fiber 102;
200) S200 of extracting a pulse laser (PL) on a time-by-time basis while sequentially passing the laser emitted from the optical fiber (102) to a plurality of acoustooptic modulators (111);
300 th step S300 of irradiating the pulse laser PL onto the object 200 to process the fine grooves 201 or holes;
A step 400 of S400 in which laser beams having passed through all the acoustooptic modulators 111 are collected in a light receiver 114;
(S700) of stopping all the operations when all the surfaces of the object 200 are finely cut or when the hole is formed. The method of claim 7, A method for machining a groove or hole.
delete 12. The method of claim 11,
In operation S100, operation S101 of adjusting the size of the laser beam emitted from the optical fiber 102 by at least one first lens 103 may be performed using an acoustooptic modulator A method for machining fine grooves or holes in an object.
12. The method of claim 11,
In operation S100, the laser beam is passed through the diffraction optical element 140 to divide the laser beam into a plurality of beams. In operation 110, the divided beams are refracted by the third lens 141, (S120) of introducing the light into the modulator (111). &Lt; RTI ID = 0.0 &gt; [10] &lt; / RTI &gt;
12. The method of claim 11,
If the acoustooptic modulator 111 is arranged in a mixed form of a straight line and a nonlinear shape or in a nonlinear stand-alone form, the laser beam emitted from the optical fiber 102 is reflected by the reflecting member to the corresponding acoustic optical modulator 200 (Step 210) of causing the laser emitted from the acoustooptic modulator 111 to be refracted by the reflecting member to enter the next acoustic optical modulator 111, A method of processing fine grooves or holes in an object using a modulator.

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