TWI680492B - Substrate processing device and method for determining substrate carrying position - Google Patents

Abstract

The substrate processing apparatus of the present invention includes a container holding section for holding a substrate receiving container for carrying out and a substrate receiving container for carrying in. The substrate receiving container for carrying out is a storage substrate, and the substrate receiving container for carrying in has a plurality of A storage position for each substrate; a substrate processing section executes a formula corresponding to a process corresponding to the substrate for the substrate carried out from the above-mentioned substrate receiving container for carrying out; a substrate transfer mechanism The substrate processing unit receives the processed substrates processed in the substrate processing unit, and carries them into the above-mentioned substrate receiving container for carrying in; and the carrying-in position determining unit, which decides to carry in the processing unit corresponding to the processed substrates The destination storage position, the carry-in destination storage position is the above-mentioned storage position where the processed substrate is carried into the substrate by the substrate transfer mechanism.

Description

Substrate processing device and method for determining substrate carrying position

The present invention relates to a substrate processing apparatus and a method for determining a substrate carry-in position. The substrates to be processed and carried in include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, and substrates for magnetic disks. , Substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

The following Patent Document 1 discloses a substrate processing apparatus including: a macroscopic inspection unit that appropriately processes a semiconductor wafer taken out from a wafer cassette; and a transfer unit that is provided in a plurality of wafer cassettes and A semiconductor wafer is transferred between the inspection units; and a transfer control unit that transfers the semiconductor wafer from one cassette to another cassette by the transfer unit.

The transfer conditions of the semiconductor wafers between the two cassettes are set by operating a display on a monitor having a groove map information screen. In the state where two wafer cassettes are installed, the storage position of each semiconductor wafer in each cassette can be set in the groove map information screen displayed on the monitor.

[Prior technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2005-322854

Specifically, a conveyance direction selection screen and a storage method selection screen are displayed on the monitor. The conveyance direction selection screen is used to set the semiconductor wafer transfer conditions, and the storage method selection screen is used to set the semiconductor wafer storage. method. Through the selection operation of the conveyance direction selection screen, the wafer cassette on the semiconductor wafer side is taken out and the wafer cassette on the semiconductor wafer side is stored. In the storage method selection screen, by selecting and operating the "arbitrary storage" button from a plurality of storage selection buttons, the semiconductor wafer transfer destination is set one by one in a state corresponding to the wafer ID of the semiconductor wafer. The groove number of the wafer cassette (for example, No. 1 to No. 25). Thereby, the wafer ID of the semiconductor wafer and the groove number of the transfer destination of the semiconductor wafer can be stored in a one-to-one correspondence.

In one substrate storage container (wafer cassette), substrates (semiconductor wafers) that are processed differently from each other may be carried in. When the cleanliness of the processed substrates varies depending on the processing of the substrates, it is preferable to set the carry-in destination (transfer destination) in such a way that the substrates subjected to the common processing are collectively arranged. ) Arrangement of the substrate.

However, if the storage position (groove number) of the carrying destination of the substrate is set for each substrate one by one, it may be time-consuming and labor-intensive.

Therefore, an object of the present invention is to provide a substrate processing apparatus that can move a substrate into a desired storage position without consuming time and effort.

Another object of the present invention is to provide a method for determining a substrate carrying position, which can store the substrate in an optimal storage position.

The invention provides a substrate processing device, which includes: The holding unit is used for holding the substrate receiving container for carrying out and the substrate receiving container for carrying in. The substrate receiving container for carrying out is a receiving substrate, and the substrate receiving container for carrying in has a plurality of storage positions for storing one substrate each; substrate processing Unit, which executes a recipe corresponding to a process job corresponding to the substrate for the substrate carried out from the above-mentioned substrate-receiving container; and a substrate transfer mechanism that receives the substrate from the substrate processing unit. The processed substrate processed in the substrate processing unit is carried into the substrate receiving container for carrying in; and the carrying-in position determining unit determines the carrying-in destination storage location in a processing work unit corresponding to the processed substrate, where The carry-in destination storage position is the storage position where the processed substrate is transferred into the processed substrate by the substrate transfer mechanism.

According to this configuration, the carrying destination storage position of the processed substrate that is carried into the substrate receiving container for carrying in is determined by a manufacturing work unit corresponding to the substrate. Therefore, it is also possible to designate the entire destination at one time by the processing unit. In this case, it is possible to set the carry-in destination storage position at a desired position without performing an operation for confirming the process work corresponding to the substrate and setting the carry-in destination storage position. Accordingly, it is possible to provide a substrate processing apparatus capable of carrying a substrate into a desired storage position without consuming time and effort.

Moreover, the recipes correspond to the process work. Therefore, in the case of determining the carrying-in destination storage position by the process work unit, by setting the carrying-in destination storage position corresponding to the predetermined process work in a mutually adjacent manner, the substrates that are subjected to common processing can be collectively arranged.

In one embodiment of the present invention, a storage block (B1 to B12) is formed by a plurality of the storage positions adjacent to each other, and the substrate receiving container for carrying in has a plurality of the storage blocks. In this case, the above-mentioned carrying-in position determination unit determines the above-mentioned carrying-in destination accommodation position corresponding to the same process work as being included in the common Same as the above-mentioned storage position of the above-mentioned storage block.

According to this configuration, the carrying-in destination storage positions of the substrates corresponding to the same process work are determined as the storage positions included in the common storage block. Each storage block is composed of a plurality of adjacent storage positions, and as described above, by making the recipe correspond to the process work, the substrates that are subjected to the same processing can be centrally arranged.

A plurality of the storage positions may be arranged in a stacked state in the up-down direction, and the carrying-in position determination unit determines the loading destination storage position by sequentially loading the processed substrates from the storage block above.

A plurality of the storage positions may be arranged in a stacked state in the up-down direction, and the carrying-in position determination unit determines the storage of the carrying-in destination in such a manner that the processed substrates with high cleanliness are stored in the storage block above. position.

The cleanliness of the processed substrates carried into the substrate receiving container sometimes varies depending on the recipe corresponding to the process work. If the substrate with lower cleanliness is stored in the upper storage location, dust may fall from the substrate with lower cleanliness, and the substrate in the lower storage location may be contaminated.

According to this configuration, since a substrate having a high degree of cleanliness is accommodated in an upper storage block, there is no case where a substrate having a low degree of cleanliness is accommodated above the substrate having a high degree of cleanliness. Thereby, the problem of substrate contamination caused by falling dust can be effectively suppressed.

When the above-mentioned process work corresponds to the situation that the cleanliness information of the cleanliness of the substrate processed by the substrate processing section is displayed, the carrying-in position determination section may also use the cleanliness information corresponding to the processed substrate, To determine the above-mentioned loading destination storage location.

The carrying-in position determination unit may also determine the carrying method by sequentially transferring the processed substrates from above to each of the storage positions included in each storage block. Enter the destination containment location.

According to this configuration, the processed substrates are sequentially carried in from above in each storage block. Therefore, when the substrate is carried into a predetermined storage position, no substrate is carried under the storage position. Thereby, when the substrate is carried in, the substrate after the carrying in below can be prevented from being contaminated.

It may also be configured to further include: a carry-in position input unit for inputting carry-in position information as information related to the carrying-in destination storage position, and the carrying-in destination storage position can be designated by the process work unit; the carrying-in The position determination unit determines the storage position based on the carry-in position information input by the carry-in position input unit.

According to this configuration, since the boarding destination storage position can be designated all at a time by the process work unit, there is no need to specify the loading destination by confirming each process work corresponding to the board one by one. Thereby, the convenience of the substrate processing apparatus can be improved, and the storage position of the substrate can be set to a desired position without consuming time and effort.

When a storage block is formed by a plurality of the storage positions adjacent to each other, and the substrate receiving container for carrying in has a plurality of the storage blocks, the input position input unit may also include a block designation unit. The block designation unit designates the above-mentioned storage block including the above-mentioned loading destination storage position.

According to this configuration, a storage block composed of a plurality of storage positions can be designated as a destination for carrying in a substrate for each process. The containment block is composed of a plurality of containment positions adjacent to each other, and the recipe corresponds to the process work. Thereby, the substrates subjected to the common processing can be collectively arranged.

It may also be configured to further include a cleanliness input unit whose input and The cleanliness of the substrate corresponding to the above-mentioned process work; the carrying-in position determination unit determines the carrying-in destination storage position according to the cleanliness of the substrate input through the cleanness input unit.

With this configuration, the storage position can be determined based on the cleanliness of the substrate input by the cleanness input unit. Thereby, substrates having the same cleanliness can be collectively arranged.

In addition, the present invention is a method for determining a substrate carry-in position performed by a substrate processing apparatus, and used to determine a carry-in destination storage position as the storage position of the processed substrate carried in by the substrate transfer mechanism; the substrate processing apparatus Containing: a container holding section for holding a substrate receiving container for carrying out and a substrate receiving container for carrying in, the substrate receiving container for carrying out is a receiving substrate, and the substrate receiving container for carrying in has a plurality of containers for storing one substrate each. Storage location; substrate processing unit, which executes the recipe corresponding to the manufacturing process corresponding to the substrate on the substrate carried out from the substrate receiving container for carrying out; and a substrate transfer mechanism, which has been taken from the substrate processing unit The processed substrate processed by the substrate processing unit is carried into the above-mentioned substrate receiving container for carrying in; such a method for determining a substrate carrying position includes a storage position determining step based on a manufacturing process corresponding to the processed substrate Work unit to determine the above-mentioned loading destination storage location.

According to this method, the carrying-in destination storage position of the processed substrate that is carried into the carrying-in substrate receiving container is determined by a manufacturing work unit corresponding to the substrate. Therefore, it is possible to provide a method for determining a substrate carrying-in position that can store a substrate in an optimal storage position corresponding to the processing content of the substrate.

The above-mentioned substrate processing apparatus may further include: a carry-in position input unit for inputting a carry-on as information related to the carry-in destination storage position. Location information, and the above-mentioned process work unit can be used to designate the above-mentioned loading destination storage location. In this case, the storing position determining step may further include a step of determining the loading destination storage position based on the loading position information input by the loading position input unit.

According to this method, since it is possible to designate the boarding-in destination storage position in a manufacturing work unit all at once, there is no need to specify the loading-in destination by confirming each manufacturing work corresponding to the board one by one. Thereby, the convenience of the substrate processing apparatus can be improved, and the storage position of the substrate can be set to a desired position without consuming time and effort.

A storage block may also be formed by a plurality of the storage positions adjacent to each other, and the substrate receiving container for carrying in has a plurality of the storage blocks. The input position input unit includes a block designation unit, which is a block designation unit. The storage block is designated to include the storage location of the carry-in destination, and the storage position determination step includes determining the storage of the carry-in destination by the carry-in position determination unit based on the block designated by the block designation unit. Location steps.

According to this method, a storage block composed of a plurality of storage positions can be designated as a destination for carrying in a substrate for each process. The containment block is composed of a plurality of containment positions adjacent to each other, and the recipe corresponds to the process work. Thereby, the substrates subjected to the common processing can be collectively arranged.

The substrate processing apparatus may further include: a cleanliness input unit that inputs the cleanliness of the substrate corresponding to the above-mentioned process work; and the storage position determining step includes the carrying-in position determination unit based on The cleanliness of the substrate is input to determine the step of carrying in the destination storage position.

According to this method, the storage position can be determined according to the cleanliness of the substrate input by the cleanness input unit. Thereby, substrates having the same cleanliness can be collectively arranged.

The aforementioned or other objects, features, and effects of the present invention can be made clear by referring to the drawings and the description of the embodiments described below.

1‧‧‧ substrate processing device

2‧‧‧ processing unit

3‧‧‧ substrate transfer unit

4‧‧‧ Processing Department

5‧‧‧ Index Department

6‧‧‧ Substrate entrance

7‧‧‧ wafer box body

8‧‧‧ Hollow inside

9‧‧‧ support groove

10‧‧‧ Manipulator

11‧‧‧ Manipulator

12‧‧‧ computer

13‧‧‧GUI (Graphical User Interface)

14‧‧‧Monitor

15‧‧‧Operation Department

16‧‧‧Storage device

17‧‧‧CPU

18‧‧‧Process work storage department

19‧‧‧ Recipe Storage Department

20‧‧‧ Substrate transfer unit control unit

21‧‧‧Process execution department

22‧‧‧ Containment trench decision unit

23‧‧‧Control work production screen

24‧‧‧Carrier selection screen

25‧‧‧Trench chart display screen

26‧‧‧Process work list screen

27‧‧‧ Carry-in position input screen

28‧‧‧Selection bar

29, 30‧‧‧ Choice

31, 32‧‧‧ select buttons

33‧‧‧ Move in destination designation screen

34‧‧‧ Containment block designation screen

35‧‧‧ Block order setting screen

36‧‧‧ Start method decision screen

37‧‧‧Same order buttons

38‧‧‧Reverse order button

39‧‧‧Auto Button

40‧‧‧Manual button

41‧‧‧GUI

42‧‧‧ Control work production screen

51‧‧‧Cleanliness level storage department

52‧‧‧Control work production screen

53‧‧‧ Cleanliness level input screen

AS1 ~ AS25‧‧‧Containment trench

B1 ~ B12‧‧‧Containment block

BS1 ~ BS25‧‧‧Containment groove

C1 ~ C3‧‧‧ carrier

CJ‧‧‧Control work

CL1 ~ CL4‧‧‧ Cleanliness information

CR‧‧‧ Central Robot

CS1 ~ CS25‧‧‧Containment groove

D‧‧‧Arrangement direction

IR‧‧‧ Index Robot

ID1 ~ ID4‧‧‧ recipe

LP‧‧‧ Loading port

PJ1 ~ PJ4‧‧‧Process work

S1 ~ S25‧‧‧Containment groove

W‧‧‧ substrate

FIG. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram of the carrier shown in FIG. 1 viewed from the index robot side.

FIG. 3 is a diagram for explaining control work and process work.

FIG. 4 is a block diagram showing an electrical configuration of the substrate processing apparatus shown in FIG. 1. FIG.

FIG. 5 is a diagram showing an example of a control work creation screen of a GUI.

FIG. 6 is a diagram showing a groove pattern of a carrier carried into a loading port for loading a substrate processing apparatus.

FIG. 7 is a diagram showing a groove pattern after the substrate is carried in the first carrying example.

FIG. 8 is a diagram showing a groove pattern after the substrate is carried in the second carrying-in example.

FIG. 9 is a diagram showing a groove pattern after a substrate is carried in a third carrying-in example.

FIG. 10 is a diagram showing a groove pattern after a substrate is carried in a fourth carrying example.

FIG. 11 is a diagram showing an example of a control work creation screen of a GUI according to a second embodiment of the present invention.

FIG. 12 is a diagram showing a trench pattern before substrate processing.

FIG. 13 is a diagram showing a groove diagram for explaining a fifth carry-in example.

FIG. 14 is a diagram showing a groove diagram for explaining a sixth carry-in example.

FIG. 15 is a control operation and a manufacturing process for explaining a modification of the second embodiment. Drawing.

Fig. 16 is a block diagram showing an electrical configuration of a modification of the second embodiment.

FIG. 17 is a diagram showing a recipe specification table.

FIG. 18 is a diagram showing a cleanliness-recipe ID correspondence table.

FIG. 19 is a diagram showing an example of a control work creation screen of a GUI according to another modification of the second embodiment.

FIG. 1 is a schematic plan view of a substrate processing apparatus 1 according to a first embodiment of the present invention. The substrate processing apparatus 1 is a monolithic apparatus for performing chemical liquid processing, cleaning processing, and the like on a main surface of a semiconductor wafer (hereinafter, simply referred to as "substrate W") as an example of a substrate.

As shown in FIG. 1, the substrate processing apparatus 1 includes a loading port LP (receiving container holding section) for holding a plurality of carriers C1 to C3 (three in this embodiment), and a plurality of carriers (in this embodiment) There are 4 processing units 2 that process the substrate W; and a substrate transfer unit 3 (the substrate transfer unit) that includes an indexing robot IR and a central robot CR. The carrier C1 is an example of a substrate receiving container for carrying out, and the carriers C2 and C3 are an example of a substrate receiving container for carrying in.

Each processing unit 2 and the central robot CR are accommodated and arranged in the processing unit 4. Each processing unit 2 performs a chemical liquid process, a cleaning process, and the like on the substrate W. The central robot CR is a robot that transfers the substrate W between the index robot IR and each processing unit 2. An indexing unit 5 is coupled to the processing unit 4.

An indexing robot IR is housed in the indexing section 5. The indexing robot IR is a robot that transfers a substrate W between a plurality of carriers C1 to C3 and a central robot CR.

Each loading port LP functions as an interface for carrying the substrate W into and out of the index section 5. Each loading port LP is arranged along a predetermined arrangement direction D. Each carrier C1 ~ C3 can be placed in each loading port LP. Hereinafter, the configuration of the plurality of carriers C1 to C3 will be described with reference to FIG. 2.

FIG. 2 is a diagram of the carriers C1 to C3 shown in FIG. 1 viewed from the IR side of the indexing robot. In addition, since the plurality of carriers C1 to C3 have the same structure, FIG. 2 illustrates the structure of the carrier C1 as an explanation including the carriers C2 and C3.

As shown in FIG. 2, the carrier C1 is, for example, a FOUP (Front Opening Unified Pod) that can store a plurality of substrates W in a stacked state at a predetermined interval inside. The carrier C1 includes a cuboid-shaped wafer box body 7 having a substrate inlet and outlet 6 for carrying the substrate W in and out on one side surface (near the front side shown in FIG. 2 in this embodiment). The carrier C1 is arranged at the loading port LP so that the board entrance / exit 6 faces the index robot IR. Although not shown in FIG. 2, the carrier C1 includes a lid for opening and closing the substrate inlet and outlet 6. After the carrier C1 is placed in the corresponding loading port LP, the cover is opened. In addition, the carrier C1 is capable of accommodating a plurality of substrates W in a sealed state with the lid closed.

Inside the wafer cassette body 7, storage grooves S1 to S25 (storage positions) capable of accommodating one substrate W at a time are arranged in a plurality of layers (25 layers in this embodiment) in the vertical direction. In this embodiment, the lowermost receiving groove is set as the receiving groove S1, and the uppermost receiving groove is set as the receiving groove S25. As shown in FIG. 2, the plurality of substrates W are housed in the wafer cassette body 7 in a state of being stacked at a certain interval.

An internal cavity 8 is formed inside the wafer cassette body 7. On the inner wall of the left and right sides of the wafer cassette body 7, a plurality of edges or a plurality of edges (for example, 25 A) Supporting groove 9 extending in the horizontal direction. The peripheral edge portion of the substrate W is supported by a predetermined pair of left and right supporting grooves 9, and the substrate W is received in the predetermined receiving grooves S1 to S25. That is, in a state where the substrate W is not contained in the carrier C1, the plurality of receiving grooves S1 to S25 communicate with each other up and down.

The substrate transfer unit 3 takes out the substrate W from the carrier C1 held in the loading port LP and delivers it to the processing unit 2 and receives the substrate W processed by the processing unit 2 and carries in the carrier C2 which is different from the place where it is carried out. C3.

Referring again to FIG. 1, the indexing robot IR is provided with a robot 10 for holding the substrate W. The indexing robot IR moves the holding grooves S1 to S25 of the carrier C1 from the unloading place by moving the robot 10 (hereinafter, the holding grooves S1 to S25 of the carrier C1 are sometimes referred to as the holding grooves, respectively). AS1 to AS25 (refer to Fig. 6 etc.) for carrying out the substrate W, and for carrying the substrate W into the receiving grooves (carrying destination storage position) of the carriers C2 and C3 at the carrying destination (hereinafter, sometimes The receiving grooves S1 to S25 of the carrier C2 are referred to as receiving grooves BS1 to BS25, respectively, and the receiving grooves S1 to S25 of the carrier C3 are referred to as receiving grooves CS1 to CS25, respectively (see FIG. 6 and the like). The indexing robot IR moves the robot 10 to transfer the substrate W between the robot 10 and the central robot CR.

The central robot CR includes a robot arm 11 for holding the substrate W. The central robot CR moves the robot hand 11 to carry out a carrying-in operation of carrying the substrate W into each processing unit 2 and a carrying-out operation of carrying out the substrate W from each processing unit 2. In addition, the central robot CR moves the robot 11 to transfer the substrate W between the robot 11 and the index robot IR.

The substrate processing apparatus 1 includes a computer 12. A substrate transfer unit 3 (index robot IR and central robot CR) and a processing unit are connected to the computer 12 2. GUI (Graphical User Interface; 13). The substrate processing apparatus 1 uses a control job CJ and a process job (PJ) to control a series of actions and processes on a plurality of substrates W stored in the receiving grooves S1 to S25 of the carrier C1. Hereinafter, the control work CJ and the process work will be described with reference to FIG. 3.

FIG. 3 is a diagram for explaining control work CJ and process work.

As shown in FIG. 3, a plurality of substrates W corresponding to the process work (PJ1 to PJ4) are stored in the receiving grooves AS1 to AS25 of the carrier C1. In FIG. 3, for the convenience of explanation, four types of process work PJ1 to PJ4 are taken as examples for description. A plurality of types of process work PJ1 to PJ4 are different according to the type of processing performed on the substrate W (the formula that defines the processing conditions of the substrate W).

More specifically, the process jobs PJ1 to PJ4 include a recipe ID (ID1 to ID4), basic information (substrate ID), and cleanliness information CL1 to CL4, respectively. The recipe ID is the ID for a specific recipe. The cleanliness information CL1 to CL4 includes information on the cleanliness (cleaning level) of the processed substrate W. The board information is an ID unique to the board W.

The manufacturing process is generated by the substrate processing apparatus 1 according to the substrate ID and a recipe ID corresponding to the substrate ID. The substrate ID and a recipe ID corresponding to the substrate ID are, for example, those given to the substrate processing apparatus 1 by a host (not shown). The generated process job is stored in the process job storage unit 18 (see FIG. 4).

In the example of FIG. 3, the substrate W corresponding to the first process work PJ1 is accommodated in the receiving grooves AS1 to AS4. The substrate W corresponding to the second process work PJ2 is housed in the containing grooves AS5 to AS8. The substrate W corresponding to the third process work PJ3 is housed in the receiving grooves AS9 to AS12. The substrate W corresponding to the fourth process work PJ4 is housed in the containing grooves AS17 to AS20.

After the process job is generated, a control job CJ will be produced for each carrier. The control work CJ set in a certain carrier includes process work PJ1 to PJ4 corresponding to all substrates W housed in the carrier.

Next, the electrical configuration of the substrate processing apparatus 1 will be described with reference to FIG. 4. FIG. 4 is a block diagram showing the electrical configuration of the substrate processing apparatus 1 shown in FIG. 1.

As shown in FIG. 4, the GUI 13 includes a monitor 14 and an operation unit 15. The GUI 13 may be, for example, a touch panel type in which the monitor 14 and the operation unit 15 are integrated. As shown in FIG. 5, the monitor 14 includes various operation screens related to the production of the control work CJ. By operating the screen related to the production of the control work CJ through the operator, the carriers C2 and C3 included in the carrier C1 as the object of the control work CJ are designated by the processing unit 2 to be carried into the destination. , And the receiving grooves BS1 ~ BS25, CS1 ~ CS25 of the carrier C2, C3 into the destination.

The computer 12 includes a storage device 16 and a CPU 17. The storage device 16 is composed of a memory such as a RAM (Dynamic Random Access Memory) and a large-capacity HDD (Hard Disk). The storage device 16 includes a process work storage section 18 and a recipe storage section 19.

In the process work storage section 18, process jobs PJ1 to PJ4 of each substrate W housed in the carrier C1 are stored. As described above, the process jobs PJ1 to PJ4 generated by the substrate processing apparatus 1 are stored in the process job storage unit 18.

In the recipe storage section 19, recipes with predetermined processing conditions of the substrate W are stored. Each recipe in the recipe storage unit 19 corresponds to the recipe ID (including the recipe IDs of the process jobs PJ1 to PJ4 shown in FIG. 3) on a one-to-one basis.

The CPU 17 includes a substrate transfer unit control unit 20 and a processing execution unit 21. The substrate transfer unit control unit 20 includes a storage groove determination unit 22 (carry-in position determination unit). The receiving groove determining unit 22 is based on the operation of the GUI 13 by the operator. For the specified contents, the carriers C2 and C3 and the receiving grooves BS1 to BS25 and CS1 to CS25 are determined for the substrate W to be carried in for the substrate W. The substrate transfer unit control unit 20 controls the operation of the substrate transfer unit 3 (the index robot IR and the central robot CR) based on the decision of the storage groove determination unit 22. The processing execution unit 21 controls the operation of the processing unit 2 according to the processing conditions corresponding to the recipes of each process work PJ1 to PJ4.

FIG. 5 is a diagram showing an example of a control work creation screen 23 of the GUI 13. The creation screen of the control work CJ displayed on the monitor 14 of the GUI 13 will be described with reference to FIG. 5.

The control work creation screen 23 includes an on-loader selection screen 24, a groove map display screen 25, a process work list screen 26, and a carry-in position input screen 27 (carry-in position input means).

The carrier selection screen 24 includes a selection field 28 for selecting a loading carrier (substrate receiving container for carrying out), and selection fields 29 and 30 for selecting an unloading carrier (substrate receiving container for carrying in).

The trench map display screen 25 is a screen for displaying an image of information on the substrate W contained in each of the storage grooves S1 to S25 of the loading carrier (for example, the carrier C1). In the trench map display screen 25, the process work PJ1 to PJ4 of the substrate W accommodated in the storage trenches S1 to S25 is displayed as image information of each of the storage trenches S1 to S25. The groove map display screen 25 shows that each of the process work PJ1 to PJ4 corresponding to each substrate W is visualized. Therefore, the storage position of the substrate W is transmitted to the operator as visual information.

The process job list screen 26 includes selection buttons 31, 32 for selecting one or all of the process jobs PJ1 to PJ4. The operator can move one or all of the selected process work PJ1 ~ PJ4 to move by operating the selection buttons 31, 32. Enter the position input screen 27. FIG. 5 shows an example of selecting one process job PJ1 to PJ4.

The process jobs PJ1 to PJ4 selected on the process job list screen 26 are sequentially displayed on the carry-in position input screen 27 from above and upward. For example, if process job PJ3 is selected on the process job list screen 26, the input field of process job PJ3 will be displayed below the entry field of the process job PJ2 in the entry position input screen 27 (refer to the dotted line in FIG. 5) .

The carry-in position input screen 27 includes a carry-in destination designation screen 33 and a storage block designation screen 34 (block designation unit). The carry-in destination designation screen 33 is a screen for designating the carriers C2 and C3 of the carry-in destination in each of the process jobs PJ1 to PJ4. The containment block designation screen 34 is a picture used to designate the containment blocks of the carriers C2 and C3. The so-called "containment block" in this specification refers to a containment formed by a plurality of (for example, 1 to 4) containment grooves adjacent to each other in the containment grooves S1 to S25 of each carrier C2 and C3. Groove group.

FIG. 5 shows that the receiving grooves S1 to S4 of the carrier C2 (the receiving grooves BS1 to BS4 shown in FIG. 6 and the like) and the receiving grooves S5 to S8 of the carrier C2 are designated in the containing block designation screen 34, respectively. (The storage grooves BS1 to BS4 shown in FIG. 6 and the like) are examples of each storage block of the transfer destination of the substrate W corresponding to the process work PJ1 and the process work PJ2.

In this way, the operator can specify the carriers C2 and C3 as the destination of the substrate W by the process work PJ1 to PJ4 by operating the carry-in position input screen 27 (the carry-in destination designation screen 33 and the storage block designation screen 34). Containment block.

The control work creation screen 23 further includes an intra-block sequence setting screen 35 that determines the carrying order of the substrate W in the storage block, and a place where the substrate W is determined The start method decision screen 36 of the start method of the management.

The order setting screen 35 in the block includes the same order button 37 and the reverse order button 38. When the same order button 37 is selected, the arrangement order of the plurality of substrates W accommodated in the accommodation block common to the carry-in destination is set to the same order as the order of the accommodation blocks in the carry-out place. On the other hand, when the reverse order button 38 is selected, the arrangement order of the plurality of substrates W accommodated in the accommodation block common to the carry-in destination is set in the reverse order to the order of the accommodation blocks in the carry-out place.

The start method determination screen 36 includes an automatic button 39 and a manual button 40. The automatic button 39 is a button for automatically setting predetermined conditions during the production of the control job CJ. The manual button 40 is a button for calling out the operation screen for the operator to manually input the control work CJ. FIG. 5 shows a state where the manual button 40 is operated.

The production of the control work CJ is performed as follows. With the operation of the operator, the control work creation screen 23 of the GUI 13 is started, and the manual button 40 is operated.

In this state, in the carrier selection screen 24, the loading carrier (carrier C1) and the unloading carrier (carriers C2, C3) are selected by the operator's operation. In addition, if the operation control work production completion screen (not shown) is operated, the contents corresponding to the selection contents of the process work list screen 26 and the carry-in position input screen 27 can be determined. Thereby, the control operation CJ is set to the carrier C1.

Next, the loading and unloading operation of the substrate W to the carrier C1 will be described.

If the carrier C1 is placed in the loading port for loading, the door (not shown) of the loading port is opened, and the cover of the carrier C1 is opened. Then, the CPU 17 causes the robot hand 10 of the indexing robot IR to enter and exit the carrier C1, and sequentially removes the accommodated substrate W from the lowermost groove S1 upward.

The substrate W taken out from the loader C1 is transferred from the indexing robot IR to the central robot CR, and is carried into the processing unit 2 while being held by the robot 11 of the central robot CR. When the substrate W is carried into the processing unit 2, the CPU 17 reads out a recipe corresponding to the recipe ID set as the process work PJ1 to PJ4 of the substrate W from the recipe storage unit 19. Then, the CPU 17 controls the processing unit 2 and executes a series of processes predetermined by the read recipe.

When the execution of a series of processing ends, the CPU 17 carries out the processed substrate W from the processing unit 2 by the central robot CR. The processed substrate W is delivered from the central robot CR to the indexing robot IR, and is carried into the carrier C1 at the destination where the robot 10 is held by the indexing robot IR.

An example of carrying in the processed substrate W in the substrate processing apparatus 1 will be described in more detail with reference to FIGS. 6 to 10. FIG. 6 is a diagram showing the grooves of the carriers C1 to C3 of the loading port LP for loading into the substrate processing apparatus 1.

As shown in FIG. 6, each of the receiving grooves of the carrier C1 in the carry-in place is arranged in the arrangement described in FIG. 3, and contains a plurality of substrates W corresponding to the process work PJ1 to PJ4.

7 to 10 are diagrams showing groove patterns after the substrate is carried in the first to fourth carrying examples.

The first loading example shown in FIG. 7 is based on the designation of the loading area of the carrier C2 and C3 on the loading position input screen 27 (refer to FIG. 5) as the loading destination of the substrate W, and the receiving groove of the carrier C2 is selected. Slots BS1 ~ BS4 are used as the containment block B1 for process work PJ1, and the containment groove BS5 ~ BS8 of carrier C2 is used as the containment block B2 for process work PJ2, and the containment grooves BS9 ~ BS12 of carrier C2 are used as the process. Containment block B3 for work PJ3, choose the containment groove BS17 ~ BS20 of carrier C2 This is an example of a case where the same order button 37 is used as the storage block B4 for the process work PJ4, and the order setting screen 35 (see FIG. 5) in the block is selected.

In the first loading example shown in FIG. 7, the carrier at the loading destination is only the carrier C2. The substrate W corresponding to the process work PJ1 is moved into a receiving block B1 constituted by the receiving grooves BS1 to BS4 of the carrier C2. Specifically, the substrate W from which the receiving groove AS1 of the carrier C1 is removed is the receiving groove BS1 of the carrier C2 that is moved in, and the receiving groove AS2 of the carrier C1 is removed from the unloading place. The substrate W is the receiving groove BS2 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS3 of the carrier C1 that is carried out is the receiving groove BS3 of the carrier C2 that is carried in. On the other hand, the substrate W to be carried out from the storage groove AS4 of the carrier C1 at the place of removal is the storage groove BS4 of the carrier C2 to be carried into the destination.

In addition, the substrate W corresponding to the process work PJ2 is carried into a receiving block B2 constituted by the receiving grooves BS5 to BS8 of the carrier C2. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove BS5 of the carrier C2 that is moved into the destination, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS6 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS7 of the carrier C1 that is carried in is the receiving groove BS7 of the carrier C2 that is carried in. On the other hand, the substrate W from which the receiving groove AS8 of the carrier C1 is carried out is the receiving groove BS8 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ3 is carried into a receiving block B3 composed of the receiving grooves BS9 to BS12 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is carried out is the receiving groove BS9 of the carrier C2 that is carried in, and the receiving groove AS10 of the carrier C1 that is carried out is carried out. The substrate W is moved into the receiving groove BS10 of the carrier C2, The substrate W from which the receiving groove AS11 of the carrier C1 is removed is the substrate W from which the receiving groove AS12 of the carrier C2 is moved in, and the receiving groove AS12 from the carrier C1 is removed from the substrate W It is the receiving groove BS12 of the carrier C2 carried in.

In addition, the substrate W corresponding to the process work PJ4 is carried into a receiving block B4 constituted by the receiving grooves BS17 to BS20 of the carrier C2. Specifically, the substrate W from which the receiving groove AS17 of the carrier C1 is removed is the receiving groove BS17 of the carrier C2 that is moved in, and the receiving groove AS18 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS18 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS19 of the carrier C1 that is moved in is the receiving groove BS19 of the carrier C2 that is carried in. On the other hand, the substrate W to be carried out from the receiving groove AS20 of the carrier C1 at the place of removal is the receiving groove BS20 of the carrier C2 to be carried into the destination.

The second loading example shown in FIG. 8 is based on the designation of the loading area of the carrier C2 and C3 on the loading position input screen 27 (refer to FIG. 5) as the loading destination of the substrate W, and the receiving groove of the carrier C2 is selected. Slots BS1 ~ BS4 are used as the containment block B1 for process work PJ1, and the containment groove CS5 ~ CS8 of carrier C3 is used as the containment block B5 for process work PJ2, and the containment grooves BS9 ~ BS12 of carrier C2 are used as the process. Containment block B3 for work PJ3, select the containment grooves CS17 ~ CS20 of carrier C3 as the containment block B6 for process work JJ4, and select the same order button 37 in the block order setting screen 35 (see FIG. 5). Example of how to move in.

In the second loading example shown in FIG. 8, the carriers at the loading destination are dispersed in the carriers C2 and C3. The substrate W corresponding to the process work PJ1 is moved into a receiving block B1 constituted by the receiving grooves BS1 to BS4 of the carrier C2. in particular, The substrate W that was removed from the receiving groove AS1 of the carrier C1 is the receiving groove BS1 of the carrier C2 that is moved into the destination, and the substrate W that is removed from the receiving groove AS2 of the carrier C1 is the substrate Carry-in slot BS2 of carrier C2 in the carry-in destination, substrate W from carrier slot AS3 of carrier C1 in the carry-out destination, and carry-out groove BS3 in carrier C2 of the carry-in destination. The substrate W to be carried out of the storage groove AS4 of the carrier C1 is a storage groove BS4 of the carrier C2 that is carried into the loading destination.

In addition, the substrate W corresponding to the process work PJ2 is moved into a receiving block B5 composed of the receiving grooves CS5 to CS8 of the carrier C3. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove CS5 of the carrier C3 that is moved into the destination, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove CS6 of the carrier C3 that is moved into the destination, and the substrate W that is removed from the receiving groove AS7 of the carrier C1 that is moved into the place is the receiving groove CS7 of the carrier C3 that is moved into the destination. On the other hand, the substrate W from which the receiving groove AS8 of the carrier C1 is carried out is the receiving groove CS8 of the carrier C3 that is carried in.

In addition, the substrate W corresponding to the process work PJ3 is carried into a receiving block B3 composed of the receiving grooves BS9 to BS12 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is carried out is the receiving groove BS9 of the carrier C2 that is carried in, and the receiving groove AS10 of the carrier C1 that is carried out is carried out. The substrate W is the receiving groove BS10 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS11 of the carrier C1 that is moved in is the receiving groove BS11 of the carrier C2 that is carried in. On the other hand, the substrate W to be carried out from the receiving groove AS12 of the carrier C1 is the receiving groove BS12 of the carrier C2 that is carried in.

The substrate W corresponding to the process work PJ4 is moved into a receiving block B6 composed of the receiving grooves CS17 to CS20 of the carrier C3. Specifically, the substrate W from which the receiving groove AS17 of the carrier C1 is removed is the receiving groove CS17 of the carrier C3 that is moved in, and the receiving groove AS18 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove CS18 of the carrier C3 that is moved into the destination, and the substrate W that is removed from the receiving groove AS19 of the carrier C1 that is moved in is the receiving groove CS19 of the carrier C3 that is moved into the destination. On the other hand, the substrate W to be carried out from the storage groove AS20 of the carrier C1 from the place where it is carried out is the storage groove CS20 of the carrier C3 that is carried into the destination.

The third loading example shown in FIG. 9 is based on the designation of the loading area of the carrier C2 and C3 on the loading position input screen 27 (refer to FIG. 5) as the loading destination of the substrate W, and the receiving groove of the carrier C2 is selected. Slots BS25 ~ BS22 are used as the containment block B7 for process work PJ1, and the containment groove BS21 ~ BS18 of carrier C2 is used as the containment block B8 for process work PJ2. The containment grooves BS17 ~ BS14 of carrier C2 are used as the process Containment block B9 for work PJ3, select the containment groove BS9 ~ BS6 of carrier C2 as the containment block B10 for process work PJ4, and select the reverse order button of the sequence setting screen 35 (see FIG. 5) in the block Example of case 38.

In the third loading example shown in FIG. 9, the carrier at the loading destination is only the carrier C2. The substrate W corresponding to the process work PJ1 is moved into a receiving block B7 composed of the receiving grooves BS25 to BS22 of the carrier C2. Specifically, the substrate W from which the receiving groove AS1 of the carrier C1 is removed is the receiving groove BS25 of the carrier C2 that is moved in, and the receiving groove AS2 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS24 of the carrier C2 that is carried in, and the substrate W that is carried out from the receiving groove AS3 of the carrier C1 that is carried out is the carrier W The receiving groove BS23 of the carrier C2, and the substrate W removed from the receiving groove AS4 of the carrier C1 is the receiving groove BS22 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ2 is moved into a receiving block B8 composed of the receiving grooves BS21 to BS18 of the carrier C2. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove BS21 of the carrier C2 that is moved into the destination, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS20 of the carrier C2 that is carried in, and the substrate W that is carried out from the receiving groove AS7 of the carrier C1 that is carried out is the receiving groove BS19 of the carrier C2 that is carried in. On the other hand, the substrate W from which the receiving groove AS8 of the carrier C1 is carried out is the receiving groove BS18 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ3 is moved into a receiving block B9 composed of the receiving grooves BS17 to BS14 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is removed is the receiving groove BS17 of the carrier C2 that is moved in, and the receiving groove AS10 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS16 of the carrier C2 that is moved into the destination, and the substrate W that is removed from the receiving groove AS11 of the carrier C1 that is moved in is the receiving groove BS15 of the carrier C2 that is moved into the destination. On the other hand, the substrate W from which the receiving groove AS12 of the carrier C1 is carried out is the receiving groove BS14 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ4 is carried into a receiving block B10 composed of the receiving grooves BS9 to BS6 of the carrier C2. Specifically, the substrate W to be removed from the receiving groove AS17 of the carrier C1 is the receiving groove BS9 of the carrier C2 which is moved into the destination, and the receiving groove AS18 of the carrier C1 to be moved from the place The removed substrate W is the receiving groove BS8 of the carrier C2 carried in, and the removed substrate W AS19 of the carrier C1 is the receiving groove of the carrier C2 carried in. BS7, and the substrate W from which the receiving groove AS20 of the carrier C1 is removed is the receiving groove BS6 of the carrier C2 that is carried in.

In the third loading example, the substrate W is sequentially loaded from the upper storage block. That is, when the substrate W is carried into a predetermined receiving groove, the substrate W is not carried into the block below the receiving groove. In addition, in the third loading example, the substrates W are sequentially loaded into each of the storage blocks B7 to B10 from above. That is, in each of the storage blocks B7 to B10, when the substrate W is carried into a predetermined storage groove, the substrate W is not carried under the storage groove. Thereby, the substrate W that has been carried into the receiving groove can be prevented from being contaminated.

The fourth loading example shown in FIG. 10 is based on the designation of the loading area of the carrier C2 and C3 in the loading position input screen 27 (refer to FIG. 5) as the loading destination of the substrate W, and the receiving groove of the carrier C2 is selected. Slots BS25 to BS22 are used as the containment block B7 for process work PJ1, and the containment groove CS21 to CS18 of carrier C3 are selected as the containment block B11 for process work PJ2, and the containment grooves BS17 to BS14 of carrier C2 are used as the process. Containment block B9 for work PJ3, select the containment groove CS9 ~ CS6 of carrier C3 as the containment block B12 for process work PJ4, and select the reverse order button of the sequence setting screen 35 (see FIG. 5) in the block Example of case 38.

In the fourth carrying-in example shown in FIG. 10, the carriers at the carrying-in destination are dispersed in carriers C2 and C3. The substrate W corresponding to the process work PJ1 is moved into a receiving block B7 composed of the receiving grooves BS25 to BS22 of the carrier C2. Specifically, the substrate W from which the receiving groove AS1 of the carrier C1 of the carrier is carried out is carried in. The receiving groove BS25 of the carrier C2 at the destination, and the substrate W being removed from the receiving groove AS2 of the carrier C1 at the place of removal. The substrate W is moved to the receiving groove BS24 of the carrier C2 at the destination. The substrate W from which the storage groove AS3 of the container C1 is carried out is the storage groove BS23 of the carrier C2 that is carried in, and the substrate W from the storage groove AS4 of the carrier C1 that is carried out is the carry-in destination The receiving groove BS22 of the carrier C2.

In addition, the substrate W corresponding to the process work PJ2 is moved into a receiving block B11 composed of the receiving grooves CS21 to CS18 of the carrier C3. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove CS21 of the carrier C3 that is moved into the destination, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove CS20 of the carrier C3 that is moved into the destination, and the substrate W that is removed from the receiving groove AS7 of the carrier C1 that is moved into is the receiving groove CS19 of the carrier C3 that is moved into the destination. On the other hand, the substrate W from which the receiving groove AS8 of the carrier C1 is carried out is the receiving groove CS18 of the carrier C3 that is carried in.

In addition, the substrate W corresponding to the process work PJ3 is moved into a receiving block B9 composed of the receiving grooves BS17 to BS14 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is removed is the receiving groove BS17 of the carrier C2 that is carried in, and the receiving groove AS10 of the carrier C1 is removed from the carrier. The substrate W being carried out is the receiving groove BS16 of the carrier C2 that is moved into the destination, and the substrate W being carried out from the receiving groove AS11 of the carrier C1 that is moved into is the receiving groove BS15 of the carrier C2 that is moved into The substrate W that is carried out of the receiving groove AS12 of the carrier C1 from the carrying-out place is a receiving groove BS14 of the carrier C2 that is carried into the carrying-in destination.

The substrate W corresponding to the process work PJ4 is moved into a receiving block B12 composed of the receiving grooves CS9 to CS6 of the carrier C3. Specifically, the substrate W from which the receiving groove AS17 of the carrier C1 is removed is the receiving groove CS9 of the carrier C3 that is moved in, and the receiving groove AS18 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove CS8 of the carrier C3 that is moved into the destination, and the substrate W that is removed from the receiving groove AS19 of the carrier C1 that is moved into is the receiving groove CS7 of the carrier C3 that is moved into the destination. On the other hand, the substrate W to be carried out from the receiving groove AS20 of the carrier C1 is the receiving groove CS6 of the carrier C3 that is carried into the loading destination.

In the fourth loading example, the substrate W is sequentially loaded from the upper storage block. That is, when the substrate W is carried into a predetermined receiving groove, the substrate W is not carried into the block below the receiving groove. In addition, in the fourth carrying-in example, the substrates W are sequentially carried in from each of the storage blocks B7, B9, B11, and B12 from above. That is, in each of the storage blocks B7, B9, B11, and B12, when the substrate W is carried into a predetermined storage groove, the substrate W is not carried under the storage groove. Thereby, the substrate W that has been carried into the receiving groove can be prevented from being contaminated.

As described above, according to the substrate processing apparatus 1, the receiving grooves S1 to S25 of the carrying destination of the substrate W are determined in units of process work PJ1 to PJ4 corresponding to the substrate W. In addition, the carry-in position input screen 27 can be used to designate the carry-in destination storage position all at a time by the manufacturing work unit. In this case, it is possible to set the storage grooves S1 to S25 of the substrate W at a desired position without performing operations of confirming the process work PJ1 to PJ4 corresponding to the substrate W and carrying in the destination storage position. Accordingly, it is possible to provide a substrate processing apparatus 1 capable of carrying a substrate into a desired receiving groove S1 to S25 without consuming time and effort.

Moreover, the recipes correspond to the process work PJ1 ~ PJ4. Therefore, in the case of determining the transfer grooves S1 to S25 of the destination by the units of process work PJ1 ~ PJ4, by setting the containment grooves corresponding to the predetermined process work PJ1 ~ PJ4 in a mutually adjacent manner. The grooves S1 to S25 can be used to collectively arrange the substrates W to be subjected to common processing.

FIG. 11 is a diagram showing an example of a control work creation screen 42 of the GUI 41 according to the second embodiment of the present invention.

The control work creation screen 42 of the GUI 41 is different from the control work creation screen 23 of the GUI 13 of the first embodiment described above, and does not include a storage block designation screen 34. In the second embodiment, the storage groove determination unit 22 determines the storage grooves S1 to S25 (referred to as the carrying destination of each substrate W) based on the cleanliness information CL1 to CL4 corresponding to each process work PJ1 to PJ4 ( (See also Figure 3 and Figure 4). Hereinafter, an example of carrying in the substrate W will be described with reference to FIGS. 12 to 14.

FIG. 12 is a diagram showing a trench pattern before substrate processing. In FIGS. 12 to 14, similar to the first embodiment described above, an example is shown in which the carrier C1 is a loading carrier, and the carriers C2 and C3 are unloading carriers.

The cleanliness information CL1 ~ CL4 (also refer to Fig. 3) of each process work PJ1 ~ PJ4 is defined in order from the highest cleanliness of the processed substrate W as Level 1, Level 2, Level 3, Level Level 4 information.

As shown in FIG. 12, a plurality of substrates W corresponding to the process work PJ1 to PJ4 are housed in each of the storage grooves of the carrier C1 at the place of entry.

The substrate W corresponding to the first process work PJ1 is accommodated in the receiving grooves AS1 to AS4. The cleanliness information CL1 (level information) corresponding to the first process work PJ1 is level 2. The substrate W corresponding to the second process work PJ2 is housed in Containment grooves AS5 ~ AS8. The cleanliness information CL2 (level information) corresponding to the second process work PJ2 is level 4. The substrate W corresponding to the third process work PJ3 is housed in the containing grooves AS9 to AS12. The cleanliness information CL3 (level information) corresponding to the third process work PJ3 is level 1. The substrate W corresponding to the fourth process work PJ4 is housed in the containing grooves AS17 to AS20. The cleanliness information CL4 (level information) corresponding to the fourth process work PJ4 is level 3.

The substrate W accommodated in the carrier C1 at the carry-in location is taken upward from the lowermost groove AS1 and sequentially taken out by the robot hand 10 of the indexing robot IR.

FIG. 13 is a diagram showing a groove diagram for explaining a fifth carry-in example. The fifth loading example shown in FIG. 13 is an example showing a plurality of substrates W contained in the carrier C1, and a process with a high degree of self-cleaning is sequentially and upwardly stored in a predetermined containing block of the carrier C2.

The fifth carry-in example is a carry-in example in the case of selecting the reverse order button 38 of the order setting screen 35 (see FIG. 5) in the block.

In the fifth carry-in example, the carrier at the carry-in destination is carrier C2 only. The substrate W corresponding to the process work PJ1 (the cleanliness is level 2) is moved into a receiving block composed of the receiving grooves BS21 to BS18 of the carrier C2. Specifically, the substrate W from which the receiving groove AS1 of the carrier C1 has been removed is the receiving groove BS21 of the carrier C2 that has been carried in, and the receiving groove AS2 of the carrier C1 has been removed from the carrier. The substrate W is the receiving groove BS20 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS3 of the carrier C1 that is moved in is the receiving groove BS19 of the carrier C2 that is carried in. The substrate W to be carried out of the receiving groove AS4 of the carrier C1 from the carrying-out place is the receiving groove BS18 of the carrier C2 that is carried into the carrying-in destination.

In addition, the substrate corresponding to the process work PJ2 (the cleanliness is level 4) W is moved into a containment block composed of the containment grooves BS13 to BS10 of the carrier C2. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove BS13 of the carrier C2 that is moved in, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS12 of the carrier C2 that is moved into the destination, and the substrate W that is removed from the receiving groove AS7 of the carrier C1 that is moved into is the receiving groove BS11 of the carrier C2 that is moved into the destination. On the other hand, the substrate W from which the receiving groove AS8 of the carrier C1 is carried out is the receiving groove BS10 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ3 (the cleanliness is level 1) is moved into a receiving block composed of the receiving grooves BS25 to BS22 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is carried out is the receiving groove BS25 of the carrier C2 that is carried in, and the receiving groove AS10 of the carrier C1 that is carried out is carried out. The substrate W is the receiving groove BS24 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS11 of the carrier C1 that is moved in is the receiving groove BS23 of the carrier C2 that is carried in. On the other hand, the substrate W that has been carried out from the receiving groove AS12 of the carrier C1 is the receiving groove BS22 of the carrier C2 that is carried in.

In addition, the substrate W corresponding to the process work PJ4 (the cleanliness is level 3) is moved into a receiving block composed of the receiving grooves BS17 to BS14 of the carrier C2. Specifically, the substrate W from which the receiving groove AS17 of the carrier C1 is removed is the receiving groove BS17 of the carrier C2 that is moved in, and the receiving groove AS18 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove BS16 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS19 of the carrier C1 that is moved in is the receiving groove BS15 of the carrier C2 that is carried in. Since moving out The substrate W from which the receiving groove AS20 of the carrier C1 is carried out is the receiving groove BS14 of the carrier C2 that is carried in.

FIG. 14 is a diagram showing a groove diagram for explaining a sixth carry-in example. The sixth loading example shown in FIG. 14 is an example showing a plurality of substrates W contained in the carrier C1, and a process with a high degree of self-cleanliness is sequentially and upwardly stored in the predetermined containing blocks of the carriers C2 and C3. .

In the sixth carrying-in example, the carriers at the carrying-in destination are dispersed in carriers C2 and C3. The substrate W corresponding to the process work PJ1 (the cleanliness is level 2) is moved into a receiving block composed of the receiving grooves CS25 to CS22 of the carrier C3. Specifically, the substrate W from which the storage groove AS1 of the carrier C1 is removed from is the storage groove CS25 of the carrier C3 that is moved into the destination, and the storage groove AS2 of the carrier C1 from the place is removed The substrate W is the receiving groove CS24 of the carrier C3 that is carried into the carry-in destination, and the substrate W that is carried out from the receiving groove AS3 of the carrier C1 that is carried in is the receiving groove CS23 of the carrier C3 carried into the carry-in destination, On the other hand, the substrate W to be carried out of the storage groove AS4 of the carrier C1 from the carrying-out place is the housing groove CS22 of the carrier C3 carried into the carrying-in destination.

In addition, the substrate W corresponding to the process work PJ2 (the cleanliness is level 4) is moved into a receiving block composed of the receiving grooves CS21 to CS18 of the carrier C3. Specifically, the substrate W from which the receiving groove AS5 of the carrier C1 is removed is the receiving groove CS21 of the carrier C3 that is moved into the destination, and the receiving groove AS6 of the carrier C1 is removed from the carrier. The substrate W is the receiving groove CS20 of the carrier C3 that is moved into the destination, and the substrate W that is removed from the receiving groove AS7 of the carrier C1 that is moved into is the receiving groove CS19 of the carrier C3 that is moved into the destination. The substrate W from which the receiving groove AS8 of the carrier C1 has been carried out is the carrier carried in to the destination. C3 containment trench CS18.

In addition, the substrate W corresponding to the process work PJ3 (the cleanliness is level 1) is moved into a receiving block composed of the receiving grooves BS25 to BS22 of the carrier C2. Specifically, the substrate W from which the receiving groove AS9 of the carrier C1 is carried out is the receiving groove BS25 of the carrier C2 that is carried in, and the receiving groove AS10 of the carrier C1 that is carried out is carried out. The substrate W is the receiving groove BS24 of the carrier C2 that is carried in, and the substrate W that is removed from the receiving groove AS11 of the carrier C1 that is moved in is the receiving groove BS23 of the carrier C2 that is carried in. On the other hand, the substrate W that has been carried out from the receiving groove AS12 of the carrier C1 is the receiving groove BS22 of the carrier C2 that is carried in.

The substrate W corresponding to the process work PJ4 (the cleanliness is level 3) is moved into a receiving block composed of the receiving grooves BS21 to BS18 of the carrier C2. Specifically, the substrate W from which the receiving groove AS17 of the carrier C1 is removed is the receiving groove BS21 of the carrier C2 that is moved in, and the receiving groove AS18 of the carrier C1 is removed from the carrier. The substrate W is the accommodating groove BS20 of the carrier C2 that is moved into the destination, and the substrate W that is the accommodating groove AS19 from the carrier C1 that is moved in is the accommodating groove BS19 of the carrier C2 that is carried in. On the other hand, the substrate W from the receiving groove AS20 of the carrier C1 carried out is carried into the receiving groove BS18 of the carrier C2 carried in the destination.

As described above, according to the fifth and sixth carry-in examples, since the substrate W with high cleanliness is stored in the upper storage block, there is no case where the substrate with low cleanliness is stored over the substrate with high cleanliness. Thereby, the problem of substrate contamination caused by dust falling can be effectively suppressed.

In addition, in the 5th and 6th carry-in examples, the substrates were placed in each storage block. W is moved in from above. That is, in each of the storage blocks, when the substrate W is carried into a predetermined storage groove, the substrate W is not carried under the storage groove. Thereby, the substrate W that has been carried into the receiving groove can be prevented from being contaminated.

Furthermore, in the sixth moving-in example, after the substrate W corresponding to the process work PJ3 (cleanliness is level 1) is carried into the predetermined storage block of the carrier C2, it will correspond to the process work PJ1 (cleanness is The substrate W of level 2) is carried into the predetermined storage block of the carrier C3.

Although the embodiments of the present invention have been described above, the present invention may be implemented in other forms.

For example, in the second embodiment described above, although an example has been described in which the process jobs PJ1 to PJ4 include cleanliness information CL1 to CL4, the process jobs PJ1 to PJ4 do not necessarily include cleanliness information CL1 to CL4. In this case, for example, the examples shown in FIGS. 15 to 18 may be used.

FIG. 15 is a diagram for explaining a control operation CJ and a process operation of a modification of the second embodiment. Fig. 16 is a block diagram showing an electrical configuration of a modification of the second embodiment. FIG. 17 is a diagram showing a recipe specification table. FIG. 18 is a diagram showing a cleanliness-recipe ID correspondence table.

As shown in FIG. 15, the cleanliness information CL1 to CL4 do not correspond to the process work PJ1 to PJ4. As shown in FIG. 16, in addition to the recipe storage section 19, the storage device 16 further includes a cleanliness level storage section 51. As shown in FIG. 17, the recipe storage unit 19 stores recipes corresponding to ID1 to ID4 as recipe prescription tables. In addition, as shown in FIG. 18, the cleanliness level storage unit 51 stores a cleanliness level (ie, cleanliness) corresponding to the recipe ID as a cleanliness-recipe ID correspondence table.

As shown in Figure 17, in the recipe specification table, it is specified that ID1 ~ ID4 formula. The recipe includes at least one of the "Pre-Treatment" step, the "Treatment" step, and the "Post-Treatment" step.

The "Pre-Treatment" step is performed before the "Treatment" step which is the main cleaning step of the substrate W. In addition, the "Post-Treatment" step is a post-processing step performed after the "Treatment" step.

Therefore, the cleaner the substrate W is, the more the recipe with more cleaning steps in the above-mentioned cleaning step is performed. From FIG. 18, it can be understood that the cleanliness of the substrate W from ID1 to ID4 is in the order of ID3, ID1, ID4, and ID2. The cleanliness of the substrate W can also be changed and adjusted by adjusting the conditions of each cleaning step (for example, the cleaning time or the flow rate of the cleaning solution). Therefore, the cleanliness of the substrate W may be specified according to the conditions of each cleaning step (for example, the cleaning time or the flow rate of the cleaning liquid).

As shown in FIG. 18, the cleanliness level storage unit 51 stores the cleanliness specified by the recipe specification table shown in FIG. 17 as a cleanliness-recipe ID correspondence table. In this table, the levels of cleanliness are defined corresponding to ID1 to ID4. Levels 1 to 4 of the cleanliness are the same as the second embodiment described above. Those with higher cleanliness from the substrate W are sequentially defined as level 1, level 2, level 3, and level 4.

The carry-in destination of each substrate W is determined by the CPU 17 (the storage groove determination unit 22) based on the cleanliness (level 1 to level 4) specified in the cleanliness-recipe ID correspondence table shown in FIG. The destination for carrying in the substrate W of each process PJ1 to PJ4 (cleanliness level) is as described in the aforementioned second embodiment. Thereby, the same effect as that described in the second embodiment can be exhibited.

FIG. 19 is a diagram showing an example of a control work creation screen 52 according to another modification of the second embodiment.

The control work creation screen 52 of the other modification is different from the control work creation screen 23 of the second embodiment described above in that the carry-in position input screen 27 further includes a cleanliness level input screen 53 for inputting cleanliness. The other structures are the same as those of the control work creation screen 23 described above. In FIG. 19, parts corresponding to the parts shown in FIG. 12 described above are given the same reference numerals, and descriptions thereof are omitted.

According to the control work production screen 52, the cleanliness level (level 1 to level 4) can be input to the cleanliness level input screen 53 for each process work PJ1 to PJ4. The cleanliness level (level 1 to level 4) to which the cleanliness level input screen 53 is inputted is the cleanliness level specified by the recipe as described above.

The CPU 17 (accommodating groove determining unit 22) determines the carrying destination of each substrate W based on the cleanliness level input to the cleanliness level input screen 53. The destination for carrying in the substrate W of each process PJ1 to PJ4 (cleanliness level) is as described in the aforementioned second embodiment. Thereby, the same effect as that described in the second embodiment can be exhibited.

In addition, in the aforementioned first embodiment, the carry-in position input screen 27 may have a configuration that does not include the storage block designation screen 34. In this case, as long as the CPU 17 (receiving groove determining unit 22) can make the loading position (the state shown in FIG. 6) and the unloading position of the substrate W of the loading carrier (carrier C1) per process PJ1 to PJ4. The substrates W (carriers C2 and C3) in each process PJ1 to PJ4 contain the substrate W in the same position (the state shown in Figure 7 or Figure 8) in the same way to determine the destination of each substrate W.

In addition, in each of the foregoing embodiments, a plurality of substrates W corresponding to the same process work PJ1 to PJ4 may be housed in a plurality of receivers in a spaced-apart manner. 容 槽。 Capacity trench.

In addition, in each of the foregoing embodiments, an unprocessed substrate W may be stored in an unloading carrier (carriers C2 and C3).

In addition, in each of the foregoing embodiments, the substrates W corresponding to different process operations PJ1 to PJ4 can be randomly taken out from the loading carrier (carrier C1), and the substrates W can be stored in the unloading carrier according to the process operations PJ1 to PJ4 Containment block scheduled by the vehicle (carriers C2, C3).

In addition, in each of the aforementioned embodiments, two loading carriers may be selected. In this case, with respect to one of the two loading carriers (for example, carriers C1 and C2) and the unloading carrier (for example, carrier C3), the storage destination of the substrate W is determined according to each process work PJ1 to PJ4. .

Although the embodiments of the present invention have been described in detail, these are only specific examples used for understanding the technical content of the present invention, and the interpretation of the present invention should not be limited to these specific examples. The scope of the present invention is only limited by the accompanying The scope of the attached patent is limited.

This application corresponds to Japanese Patent Application No. 2014-110523, filed with the Japan Patent Office on May 28, 2014, and all disclosures of this application are incorporated herein by reference.

Claims (13)

A substrate processing device includes a container holding section for holding a substrate receiving container for carrying out a substrate and a substrate receiving container for carrying in, and the substrate receiving container for carrying in a state of being stacked in a vertical direction has a plurality of Each of the storage positions for one substrate is provided with a plurality of storage blocks formed by the plurality of storage positions adjacent to each other. The substrate processing section executes the processing of the substrates carried out from the above-mentioned substrate receiving container for carrying out. A recipe corresponding to a manufacturing process corresponding to the substrate; a substrate transfer mechanism that takes the processed substrate processed by the substrate processing unit from the substrate processing unit and transfers the processed substrate into the substrate receiving container for the transfer; and The carrying-in position determining unit determines the storage position corresponding to the same processing job as the storage position included in the common storage block according to the processing work corresponding to the processed substrate. Carry-in destination storage position, and the carry-in destination storage position is the processed substrate by the above The above-mentioned storage position carried by the board transfer mechanism; the cleanliness information showing the cleanliness of the substrate processed by the above-mentioned substrate processing section corresponds to the above-mentioned process work, and the above-mentioned carrying-position determining section is based on the above corresponding to the above-mentioned processed substrate Cleanliness information, and the above-mentioned processed substrate with high cleanliness is stored in the above-mentioned storage block to determine the carrying-in destination storage position. For example, the substrate processing apparatus of the scope of application for patent No. 1 further includes: a cleanliness input unit that inputs the cleanliness of the substrate corresponding to the above-mentioned process work; and the carrying-in position determination unit according to the above-mentioned cleanliness input unit The cleanliness of the substrate is input to determine the carrying-in destination storage position. A substrate processing apparatus includes: a container holding section for holding a substrate receiving container for carrying out a substrate and a substrate receiving container for carrying in, and the substrate receiving container for carrying in has a plurality of substrates for storing one substrate each. Storage location; substrate processing unit, which executes recipes corresponding to the manufacturing process corresponding to the substrate for the substrates carried out from the above-mentioned substrate-receiving container, and a substrate transfer mechanism that receives the substrates from the substrate processing unit The processed substrate processed by the processing unit is carried into the above-mentioned substrate-receiving container; the carrying-in position determination unit determines the carrying-in destination storage location in accordance with the processing work unit corresponding to the processed substrate, and the carrying-in The destination storage position is the storage position in which the processed substrate is carried by the substrate transfer mechanism; and a carry-in position input unit for inputting carry-in position information as information related to the carry-in destination storage position, and Can designate the above-mentioned moving-in destination storage location by the above-mentioned process work unit; the above-mentioned moving-in position According to the above-described loading unit determines location by the position of the carry input of the input means, the receiving position is determined. For example, the substrate processing apparatus of the third scope of the application for a patent, wherein a storage block is formed by a plurality of the above-mentioned storage positions adjacent to each other, and the substrate-receiving container for carrying in has a plurality of the storage blocks, and the carrying-in position determination unit The above-mentioned moving-in destination storage position corresponding to the same process work is determined as the above-mentioned storage position included in the common storage block. For example, the substrate processing apparatus of the fourth scope of the patent application, wherein a plurality of the storage positions are stacked in the up-down direction, and the carrying-in position determination unit sequentially loads the processed substrates from the storage block above. Way to determine the above-mentioned loading destination storage location. For example, the substrate processing apparatus of the fourth scope of the application for a patent, wherein a plurality of the above-mentioned storage positions are stacked in the up-down direction, and the carrying-in position determination unit is configured to store the processed substrates with high cleanliness on the above-mentioned ones. The method of accommodating blocks determines the accommodating location of the above-mentioned carry-in destination. For example, the substrate processing apparatus of the sixth scope of the patent application, wherein the above-mentioned process work corresponds to cleanliness information showing the cleanliness of the substrate after being processed by the above-mentioned substrate processing section, and the carrying-in position determination section corresponds to the above-mentioned processing completion. The cleanliness information of the substrate is used to determine the above-mentioned loading destination storage position. For example, the substrate processing apparatus of the scope of application for patent No. 5, wherein the carrying-in position determination unit determines the carrying-in destination in such a manner that the processed substrates are sequentially carried from above into each storage position included in each storage block. Containment location. For example, the substrate processing apparatus according to any one of claims 3 to 8, wherein a storage block is formed by a plurality of the storage positions adjacent to each other, and the substrate receiving container for carrying in has a plurality of the storage blocks. The above-mentioned carry-in position input unit includes a block designation unit, and the block designation unit specifies the accommodation block including the accommodation location of the carry-in destination. A method for determining a substrate carrying position is executed by a substrate processing apparatus and used to determine a carrying destination storage position of the processing position where the processed substrate is carried by the substrate carrying mechanism; the substrate processing apparatus includes : Receiving container holding section, which is used to hold the substrate receiving container for carrying out and the substrate receiving container for carrying in, and the state in which the substrate receiving container for carrying in is stacked in the upper and lower directions has a plurality of containers for each one substrate. Position and has a plurality of storage blocks formed by a plurality of the above-mentioned storage positions adjacent to each other; a substrate processing section, which executes and processes manufacturing processes corresponding to the substrates carried out from the substrate-receiving container for the carrying-out substrate. Corresponding formula; and a substrate transfer mechanism, which takes the processed substrate processed by the substrate processing section from the substrate processing section, and transfers the substrate into the substrate receiving container for carrying in; such a method for determining a substrate carrying position, It includes: a carrying-in position determination step, which is based on the system corresponding to the processed substrate Work to determine the carrying-in destination storage position in such a way that the carrying-in destination storage position corresponding to the same process work becomes the carrying-in position included in the common storage block; the display is implemented by the substrate processing unit The cleanliness information of the cleanliness of the processed substrate corresponds to the above-mentioned process work. The above-mentioned step of determining the carry-in position includes the following steps: according to the cleanliness information corresponding to the processed substrate, the above-mentioned cleanliness information is increased. The manner in which the processed substrate is stored in the above-mentioned storage block determines the storage location of the above-mentioned carry-in destination. For example, the method for determining a substrate carry-in position according to item 10 of the patent application, wherein the substrate processing apparatus further includes: a cleanness input unit that inputs the cleanliness of the substrate corresponding to the above-mentioned process work; the step of determining the carry-in position includes a basis The step of determining the carrying-in destination storage position is determined by the cleanness of the substrate input by the cleanness input unit. A method for determining a substrate carrying position is executed by a substrate processing apparatus and used to determine a carrying destination storage position of the processing position where the processed substrate is carried by the substrate carrying mechanism; the substrate processing apparatus includes : A container holding section for holding a substrate holding container for carrying out and a substrate holding container for carrying in, and the substrate holding container for carrying in has a plurality of storage positions for storing one substrate each; a substrate processing section, which For the substrates carried out from the above-mentioned substrate-receiving container, a recipe corresponding to the processing work corresponding to the substrate is executed; the substrate transfer mechanism receives from the substrate processing section the processing that has been processed in the substrate processing section. A substrate, and carry it into the above-mentioned substrate-receiving container for carrying in; and a carrying-in position input unit for inputting carrying-in position information as information related to the carrying-in destination storage position, and can specify the carrying-in destination by the above-mentioned process work unit Containment location, and the move-in destination accommodation location is the above The board is carried in the above-mentioned storage position carried by the above-mentioned substrate transfer mechanism; such a method for determining the substrate carry-in position includes the process work unit corresponding to the processed substrate to determine the carry-in position of the above-mentioned destination storage position. A determining step. The carrying-in position determining step includes a step of determining the carrying-in destination storage position based on the carrying-in position information input by the carrying-in position input unit. For example, the method for determining a substrate carrying-in position according to item 12 of the patent application, wherein a storage block is formed by a plurality of the above-mentioned storage positions adjacent to each other, and the substrate-receiving container for the carrying-in has a plurality of the storage blocks and the loading-in position The input unit includes a block designation unit for designating the storage block including the storage location of the carry-in destination, and the step of determining the carry-in position includes determining the carrying-in purpose based on the block designated by the block designation unit. Steps to Ground Containment.