JP2007250593A - Device, method and program of making wafer transfer procedure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for making an automatic transfer procedure of a wafer from carrier to carrier. <P>SOLUTION: A wafer included in a wafer arrangement provided from a factory but not included in a wafer arrangement requested from next process is picked up, a carrier corresponding to that wafer is assumed anew, and the wafer is arranged on the assumed carrier thus determining a target wafer arrangement (S2). One carrier is selected and a provided wafer arrangement is compared with a target wafer arrangement for that selected wafer, a wafer to be evacuated from that carrier is evacuated, a wafer to be moved in that carrier is moved, and a wafer to be transferred from other carrier into this carrier is transferred. The operation is repeated for all carriers thus making a transfer procedure (S3). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer transfer procedure creation device, a wafer transfer procedure creation method, and a wafer transfer procedure creation program. More specifically, the present invention relates to a wafer transfer procedure for changing the arrangement state of wafers mounted on a plurality of carriers. The present invention relates to a wafer transfer procedure creation device, a wafer transfer procedure creation method, and a wafer transfer procedure creation program for generating a loading procedure.

  Generally, semiconductor devices such as transistors, ICs, and LSIs are manufactured by performing tens to hundreds of processes on a semiconductor wafer. For this reason, many manufacturing apparatuses are installed in the semiconductor factory, and a carrier carrying a wafer is transported between the manufacturing apparatuses and supplied to each manufacturing apparatus. In recent years, semiconductor factories are often required to produce small quantities of various products. In this case, since the number and order of the processes differ depending on the types to be manufactured, a plurality of types having different process arrangements pass through one manufacturing apparatus.

  Semiconductor device manufacturing apparatuses include a single wafer type manufacturing apparatus that processes wafers mounted on a carrier one by one and a batch type manufacturing apparatus that simultaneously processes a plurality of wafers mounted on a carrier. Conventionally, when a batch type manufacturing apparatus is used in order to accelerate the delivery time of a product, for example, even if only 12 wafers are contained in a carrier containing 24 wafers, Only the 12 wafers were processed in advance without waiting for arrival. However, in order to improve the operating efficiency of the batch-type manufacturing apparatus, it is preferable to perform the processing with a full wafer mounted on the carrier. For this reason, the operation | work which transfers a wafer from one carrier to another carrier between manufacturing apparatuses is needed.

  In recent years, in a semiconductor factory, many manufacturing apparatuses and transfer apparatuses that transfer carriers between the manufacturing apparatuses have been automated to save labor (for example, see Patent Document 1). However, the transfer of the wafer between the carriers for increasing the operating efficiency of the manufacturing apparatus is performed in accordance with an instruction from the operator each time.

JP 2003-197711 A

  The present invention provides a wafer transfer procedure creation device, a wafer transfer procedure creation method, and a wafer transfer procedure creation program capable of creating a transfer procedure for automatically transferring a wafer from carrier to carrier. With the goal.

According to one aspect of the invention,
A wafer transfer procedure creating device for generating a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
Sequentially selecting one carrier from the plurality of carriers,
For each carrier selected
Based on the comparison result between the current wafer arrangement state and the target wafer arrangement state, if there is a wafer to be evacuated from the one carrier, a first procedure for evacuating the wafer is generated,
Based on the comparison result, a second procedure is generated for moving a wafer to be moved in the one carrier, if any.
On the basis of the comparison result, there is provided a wafer transfer procedure creating apparatus that generates a third procedure for transferring a wafer to be transferred from another carrier to the one carrier, if any.

According to another aspect of the present invention,
A wafer transfer procedure creation method for generating a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
Sequentially selecting one carrier from the plurality of carriers;
Generating a wafer transfer procedure for the selected one carrier;
With
The step of generating the wafer transfer procedure is as follows:
Generating a first procedure for evacuating any wafer to be evacuated from the one carrier based on a comparison result between the current wafer arrangement state and a target wafer arrangement state;
Generating a second procedure for moving any wafers to be moved within the one carrier based on the comparison result; and
Generating a third procedure for transferring, if any, a wafer to be transferred to the one carrier from another carrier based on the comparison result;
A method for creating a wafer transfer procedure is provided.

Furthermore, according to yet another aspect of the present invention,
A wafer transfer procedure creation program for causing a computer to generate a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
In the computer,
Sequentially selecting one carrier from the plurality of carriers,
For each carrier selected
The current wafer arrangement state in the selected one carrier is extracted from the database storing the arrangement state of the wafers mounted on the plurality of carriers and stored in the memory, and the stored current wafer is stored. A function for comparing the arrangement state of the target and the target wafer arrangement state,
A function for generating a first procedure for evacuating a wafer to be evacuated from the one carrier, based on a comparison result between a current wafer arrangement state and a target wafer arrangement state;
A function for generating a second procedure for moving, if any, a wafer to be moved in the one carrier based on the comparison result;
Based on the comparison result, a function of generating a third procedure for transferring a wafer to be transferred from another carrier to the one carrier, if any,
A wafer transfer procedure creation program characterized by realizing the above is provided.

  According to the present invention, it is possible to create a transfer procedure for automatically transferring a wafer from a carrier to a carrier.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view illustrating the contamination restriction in the present embodiment.
FIG. 2 is a schematic view illustrating the contamination restriction of the sorter in the present embodiment.
FIG. 3 is an overhead view illustrating a semiconductor factory in which the wafer transfer procedure creation device according to the present embodiment is installed.
FIG. 4 is a block diagram illustrating the main configuration of the wafer transfer procedure creation device according to this embodiment.
FIG. 5 is a flowchart illustrating the wafer transfer procedure creation method according to this embodiment.
In this embodiment, the “wafer” is, for example, a wafer made of a single crystal of silicon, the “carrier” is a container for transporting a plurality of wafers, and the “sorter” is, for example, a wafer. This is a wafer transfer device that holds the wafer by sucking the back surface and transfers the wafer from the carrier to the carrier.

First, contamination restrictions on wafers, carriers, and sorters that must be observed when creating a wafer transfer procedure will be described.
As illustrated in FIG. 1, in this embodiment, the contamination state of the wafer and the carrier is classified into, for example, six categories α (alpha), β (beta), γ (gamma), δ (delta), and ε (epsilon). , Ζ (zeta). For example, a wafer contaminated by an apparatus that performs a process using a certain substance α is assumed to belong to the category α. Carriers contaminated with the substance α also belong to the category α.

  The arrows shown in FIG. 1 indicate directions in which wafers can be transferred between carriers. As shown in FIG. 1, it is possible to transfer wafers belonging to this category between carriers belonging to the same category. For example, a category α wafer can be transferred from a category α carrier to another category α carrier.

  On the other hand, there are certain restrictions on the transfer of wafers between carriers belonging to different categories. For example, a wafer belonging to category γ cannot be transferred to a category β carrier. This is because the category β carrier is secondarily contaminated by the substance γ.

  However, conversely, it is possible to transfer a wafer belonging to category β to a carrier of category γ. This is because the category γ has a higher degree of contamination than the category β, so even if a category β wafer is transferred to the category γ carrier, the category γ carrier is not further contaminated. However, in this case, since the wafer transferred from the carrier of category β to the carrier of category γ is contaminated by the carrier of category γ, it will belong to category γ thereafter. Thus, a wafer mounted on a carrier of a certain category belongs to the same category as this carrier. As an example, category β is a state contaminated with aluminum (Al), and category γ is a state contaminated with copper (Cu).

  As described above, there is an order between categories depending on the degree of contamination, and even if transfer from one category carrier to another category carrier is possible, the reverse transfer is prohibited. A relationship exists. In addition, there is a relationship that enables transfer in both directions, such as category α and category β. Furthermore, there is a relationship in which transfer is prohibited in both directions, such as category δ and category ε. Note that the wafer and the carrier are transferred to a category having a lower degree of contamination through a cleaning process.

  Further, when the sorter arm is attracted to the back surface of the wafer and held, the contamination is diffused between the arm and the wafer. For this reason, the sorter is also imposed with a contamination restriction as illustrated in FIG. Sorters are classified into categories excluding category α, that is, categories β, γ, δ, ε, and ζ. When the wafer is transferred from the carrier arranged at the first port to the carrier arranged at the second port, the sorter belonging to the category β can select any of the categories α to ζ from the carriers belonging to the category β or the category α. Wafers can also be transferred to other carriers.

  A sorter belonging to category γ can transfer a wafer from a carrier of category γ or category β to a carrier of category γ or category ζ. Further, the sorter belonging to category δ can transfer the wafer from the carrier of category δ or category β to the carrier of category δ. Furthermore, a sorter belonging to category ε can transfer a wafer from a carrier of category ε or category β to a carrier of category ε. Furthermore, a sorter belonging to category ζ can transfer a wafer from a carrier of category ζ only to a carrier of category ζ.

  In this way, the wafer can be moved between different categories as long as the constraints shown in FIG. 1 are observed. However, the category of the moved wafer is the same category as the destination carrier. On the other hand, if the carrier and sorter categories are changed, the subsequent carrier and sorter operation method will change, so the carrier and sorter categories will be fixed, and transfer to change these categories will not be possible. Not allowed.

A wafer transfer procedure creation apparatus that creates a procedure for transferring a wafer from a carrier to a carrier in consideration of such contamination restrictions will be described.
As illustrated in FIG. 3, the wafer transfer procedure creation device 10 according to the present embodiment is installed in the semiconductor factory 100. In the semiconductor factory 100, a plurality of manufacturing apparatuses 11 are installed, and a transport apparatus 12 that transports carriers between these manufacturing apparatuses 11 is provided. The conveying device 12 includes a rail 13 laid so as to connect the manufacturing apparatuses 11, and a plurality of carts 14 guided by the rail 13 to convey carriers. A stocker 15 is provided on the track of the rail 13 to get on and off the carrier with respect to the transport device 12 and temporarily hold the carrier, and a sorter 16 is provided adjacent to the stocker 15. A wafer transfer procedure creation device 10 is disposed adjacent to the sorter 16. The wafer transfer procedure creation device 10 generates a wafer transfer procedure for changing the arrangement state (hereinafter referred to as “wafer configuration”) of wafers mounted on a plurality of carriers to another arrangement state. . Then, based on the generated transfer procedure, the sorter 16 transfers the wafer, and the wafers are automatically rearranged between the carriers.

  As shown in FIG. 4, the wafer transfer procedure creation apparatus 10 includes an input unit 1, a target configuration determination unit 2, a transfer procedure determination unit 3, an output unit 4, and a memory 5. Further, the wafer transfer procedure creating apparatus 10 is connected to a database 21 provided in the semiconductor factory 100 (see FIG. 3). The database 21 stores the wafer configuration of carriers existing in the semiconductor factory 100. The database 21 also stores information on sorter contamination restrictions as shown in FIG.

  The input unit 1 is a part for inputting a wafer configuration required for the next process (hereinafter also referred to as “requested wafer configuration”), and includes, for example, a keyboard and a display panel or a touch panel display. Alternatively, the input unit 1 may be an interface that receives commands from a higher-level automation system that performs process management of the entire semiconductor factory. Hereinafter, the current wafer configuration of the carrier provided from the database 21 in the semiconductor factory to the wafer transfer procedure creation apparatus 10 is referred to as “provided wafer configuration”.

  The target configuration determination unit 2 executes a target configuration determination step shown in step S2 of FIG. The target configuration determination unit 2 includes, as a transfer target, a wafer configuration that includes the required wafer configuration, includes a transfer destination of a wafer that is included in the provided wafer configuration and is not included in the required wafer configuration, and satisfies the contamination constraint. It is determined as a wafer configuration (hereinafter referred to as “target wafer configuration”).

The transfer procedure determination unit 3 executes a transfer procedure determination step shown in step S3 and a sorter selection step shown in step S4. The transfer procedure determination unit 3 generates a specific transfer procedure for shifting from the provided wafer configuration to the target wafer configuration determined by the target configuration determination unit 2, and selects a sorter for performing the transfer. Is. The target configuration determining unit 2 and the transfer procedure determining unit 3 are a CPU (Central Processing Unit) of a computer.
Can be realized.

  The output unit 4 is a part that outputs the transfer procedure determined by the transfer procedure determination unit 3, and is, for example, an interface that outputs a transfer command to the sorter. In addition, a display panel for displaying the transfer procedure to the worker may be provided, and this display panel may also be used as the display panel of the input unit 1.

  The memory 5 is connected to the target configuration determination unit 2 and the transfer procedure determination unit 3 and temporarily stores data extracted from the database 21 by the target configuration determination unit 2 and the transfer procedure determination unit 3. . The memory 5 can be realized by a semiconductor storage device such as a RAM (Random Access Memory).

Next, the operation of the wafer transfer procedure creation apparatus configured as described above, that is, the wafer transfer procedure creation method will be described.
FIG. 6 is a flowchart showing the target configuration determination step shown in FIG.
FIGS. 7 to 12 are schematic views illustrating the wafer configuration at each stage of the target configuration determination process, where (a) in each drawing shows the wafer configuration (target) after transfer, and (b) shows transfer. The previous wafer configuration is shown.
FIG. 13 is a diagram illustrating a part of data stored in the database 21.

  The standard number of wafers that can be mounted on one carrier is about 25. However, in the specific examples shown in FIGS. 7 to 12, eight carriers are provided for the sake of simplicity of explanation and illustration. It is assumed that a plurality of wafers can be mounted, and slot numbers p1 to p8 are attached to the slots in which the wafers are mounted from one end of the carrier toward the other end.

The situation in which the present embodiment is implemented is, for example, a scene where the wafer configuration needs to be rearranged when processing is performed in a certain manufacturing apparatus 11 installed in the semiconductor factory 100.
First, as shown in step S <b> 1 of FIG. 5, the worker inputs the requested wafer configuration to the input unit 1. For example, in this specific example, as shown in FIG. 7A, the required wafer configuration includes two carriers, carrier A belonging to category γ and carrier B belonging to category β, and slots p5 to p8 of carrier A. Has four wafers W1, two wafers W2 are loaded in the slots p1 and p2 of the carrier B, and two wafers W3 are loaded in the slots p5 and p6 of the carrier B. . The four wafers W1 belong to the same lot L1, the two wafers W2 belong to the other same lot L2, and the two wafers W3 belong to the other same lot L3.

  In this specific example, for simplification of description, wafers belonging to the same lot are not distinguished from each other. However, if necessary, individual wafers may be distinguished within the same lot.

  Meanwhile, at this time, the wafer configuration shown in FIG. 7B is provided from the factory. That is, the provided wafer configuration (provided wafer configuration) includes three carriers: a carrier A belonging to category γ, a carrier B belonging to category β, and a carrier C belonging to category β. In slots p1 to p4 of carrier A, Includes four wafers W1 belonging to the lot L1, four wafers W4 belonging to the lot L4 in slots p5 to p8, and two wafers belonging to the lot L2 in the slots p1 and p2 of the carrier B. W2 is loaded, four wafers W5 belonging to the lot L5 are loaded in the slots p3 to p6, and two wafers W3 belonging to the lot L3 are loaded in the slots p1 and p2 of the carrier C, and the slots p3 to p6 are loaded. Has a configuration in which four wafers W6 belonging to the lot L6 are mounted. The slots p7 and p8 of the carrier B and the slots p7 and p8 of the carrier C are empty slots. The provided wafer configuration data is stored in the database 21 in advance. FIG. 13 shows data representing the provided wafer configuration shown in FIG.

  Accordingly, in the provided wafer configuration shown in FIG. 7B, there are surplus wafers W4, W5, and W6 (lots L4, L5, and L6) that are not included in the required wafer configuration shown in FIG. 7A. Accordingly, when the wafer is transferred so that the wafer configuration shown in FIG. 7A is generated from the wafer configuration shown in FIG. 7B, the destinations of the wafers W4, W5, and W6 are lost.

Therefore, in the present embodiment, a target configuration determination step as shown in step S2 of FIG. 5 and FIG. 6 is performed. The processing contents of this target configuration determination step are outlined as follows.

<1> Recognize required wafer configuration and provided wafer configuration (steps S21 and S22),
<2> Pick up surplus wafers included in the provided wafer configuration and not included in the required wafer configuration (steps S23 and S24),
<3> Assuming a new carrier corresponding to this surplus wafer (steps S25 and S27),
<4> A surplus wafer is placed on the newly assumed carrier (steps S26 and S28).

Hereinafter, specific implementation methods of these processes will be described. Note that the following steps are all virtually performed by moving and generating data in the computer and between the computer and the database, and do not actually transfer the wafer.

  First, as shown in step S <b> 21 of FIG. 6, a memory area for storing the wafer configuration before and after the transfer is secured in the memory 5. At this time, as will be described later, since a carrier may be newly established in the target configuration determination step, the storage area is ensured to be larger than the size corresponding to the wafer configuration shown in FIGS. 7A and 7B. Keep it.

Next, the required wafer configuration data shown in FIG. 7A is read from the input unit 1 and written into the storage area of the memory 5. Further, the provided wafer configuration data shown in FIG. 7B is extracted from the database 21 and written in the storage area of the memory 5. The provided wafer configuration data is data as illustrated in FIG. Thus, the wafer configuration shown in FIGS. 7A and 7B, that is, the initial wafer configuration is written in the storage area of the memory 5. At this time, the wafer configuration shown in FIG. 7A is “targetSlotMap”, and the wafer configuration shown in FIG. 7B is “beforeSlotMap”.
Next, as shown in step S <b> 22 of FIG. 6 and FIG. 8, data representing all wafers included in “targetSlotMap” and “beforeSlotMap” is extracted.

  Next, as shown in step S23, among the wafers mounted on the carrier (carrier C in this specific example) that is included in “beforeSlotMap” but not included in “targetSlotMap”, it is included in “targetSlotMap”. An unexisting wafer (wafer W6 in this specific example) is set as “restLots”.

  Next, as shown in step S24 and FIG. 9, wafers (wafers W4, W4, W4, W6) excluding “restLots” (wafers W6) from wafers (wafers W4 to W6) included in “beforeSlotMap” but not included in “targetSlotMap”. W5) is extracted and is set as “strayLots”.

  Next, as shown in step S25 and FIG. 10, a carrier (carrier C) corresponding to a carrier (carrier C) that is included in “beforeSlotMap” and not included in “targetSlotMap” is newly established in “targetSlotMap”. That is, an area corresponding to the carrier C is set in the storage area of the memory 5. Since the category of the carrier C is the category β, the category of the newly established carrier is also the category β.

  Next, as shown in step S26 and FIG. 11, “restLots” (wafer W6) is placed on the newly established carrier C in “targetSlotMap”. At this time, the slot in which the wafer W6 is loaded in the carrier C of “targetSlotMap” is the same as the slot in which the wafer W6 is loaded in the carrier C of “beforeSlotMap”. That is, the wafer W6 is mounted in the slots p3 to p6 of the carrier C.

  Next, as shown in step S27 and FIG. 12, the same number of carriers as the number of lots (that is, the number of types of wafers) constituting “strayLots” are newly provided in both “beforeSlotMap” and “targetSlotMap”. In this specific example, since there are two types of lots constituting “straylots”, that is, lot L4 (wafer W4) and lot L5 (wafer W5), both carriers “BeforeSlotMap” and “targetSlotMap” have two carriers X1 and X2 is provided. At this time, the category of the carrier X1 is the same category γ as the wafer W4, and the category of the carrier X2 is the same category β as the wafer W5.

  Next, as shown in step S28, the lot L4 (four wafers W4) which is “strayLots” is arranged on the carrier X1 in the “targetSlotMap”, and the carrier X2 in “targetSlotMap” is “strayLots”. A certain lot L5 (four wafers W5) is arranged. At this time, in each carrier, the wafers are packed in order from the slot with the smallest slot number. As a result, as shown in FIG. 12A, the wafer configuration (target wafer configuration) to be transferred is determined.

Next, as shown in step S <b> 3 of FIG. 5, the transfer procedure determining unit 3 determines the transfer procedure for forming the target wafer configuration from the wafer configuration before the transfer.
FIG. 14 (a) is a diagram showing a target wafer configuration, (b) is a diagram showing a wafer configuration before transfer,
15 and 16 are flowcharts showing the transfer procedure determining step shown in FIG.
FIG. 17 to FIG. 21 are diagrams showing the wafer configuration at each stage of the transfer procedure determining step, where (a) in each figure shows the wafer configuration (target) after transfer, and (b) before transfer. The wafer configuration (before) is shown.

  The contamination restriction of the wafer and the carrier is taken into consideration in the target configuration determining process shown in step S2, and therefore need not be considered in this process (transfer procedure determining process). On the other hand, in this step, it is important how smoothly the wafer moves between carriers. Therefore, in this step, in order to make the explanation easy to understand, the provided wafer configuration as shown in FIG. 14B is shown in FIG. 14A instead of the specific example described in the target configuration determination step described above. A specific example of rearrangement to such a target wafer configuration will be described.

  That is, as shown in FIG. 14A, in the target wafer configuration determined in the target configuration determination step, six wafers W11 belonging to the lot L11 are mounted in the slots p1 to p6 of the carrier A, and the slot of the carrier B It is assumed that six wafers W12 belonging to lot L12 are mounted on p1 to p6, and six wafers W13 belonging to lot L13 are mounted on slots p1 to p6 of carrier C. On the other hand, as shown in FIG. 14B, in the provided wafer configuration before transfer, the wafer W12 is mounted in the slots p1 and p2 of the carriers A, B, and C, and the wafer W11 is inserted in the slots p3 and p4. Are mounted, and the wafer W13 is mounted in each of the slots p5 and p6.

The processing contents of the transfer procedure determination step are outlined as follows.

<1> Select one carrier (step S32),
<2> For this selected carrier, the provided wafer configuration and the target wafer configuration are compared, a wafer that needs to be transferred to this carrier from another carrier, a wafer that needs to move a slot within this carrier, Pick up each wafer that needs to be retreated from this carrier to another carrier (steps S33 to S35),
<3> The wafer to be evacuated from the carrier is evacuated (steps S36 to S40),
<4> Move the wafer whose slot is to be moved in this carrier (steps S41 and S42),
<5> A wafer to be transferred from another carrier is transferred (steps S43 and S44).
<6> Then, the above procedures <1> to <5> are repeated for all carriers (step S31).

Hereinafter, specific implementation methods of these processes will be described. The following steps are all performed by moving / generating data in the computer and between the computer and the database 21, and do not actually transfer the wafer.

First, as shown in step S31 of FIG. 15, it is determined whether or not there is a carrier that has not been transferred, and if it exists, the process proceeds to step S32, and if not, a transfer procedure determining step. Exit.
If there is an untransferred carrier and the process proceeds to step S32, as shown in FIG. 17, one of the carriers that have not been transferred (carriers A, B, and C in this specific example). (For example, carrier A) is selected, and this carrier is set to “focusedCarrier”.

  Next, as shown in step S <b> 33, data representing the current wafer configuration of “focused Carrier” (carrier A) (before transfer) is extracted from the database 21 and stored in the memory 5. On the other hand, data representing the target wafer configuration of “focused Carrier” (carrier A) is created in the above-described target configuration determination step (step S2 in FIG. 5) and stored in the memory 5. At this time, the current wafer configuration of “focusedCarrier” is “before FocusedMap”, and the target wafer configuration is “target FocusedMap”.

  Then, as shown in step S <b> 34, among the wafers constituting “target FocusedMap”, wafers not included in “before FocusedMap” are set as “need Wafers”. That is, the “need Wafers” are wafers that must be transferred from other carriers (carriers B and C). In this specific example, “needWafers” is four wafers W11 mounted on carriers B and C.

  Further, among the wafers constituting the “target FocusedMap”, wafers included in the “before FocusedMap” and requiring movement within the carrier are referred to as “needSelfWafers”. In this specific example, “needSelfWafers” is two wafers W11 mounted on the carrier A.

  Furthermore, among the wafers included in “before FocusedMap”, wafers that do not constitute “target FocusedMap” are referred to as “evacuate Wafers”. In other words, this “evacuate Wafers” is a wafer that must be evacuated from “focused Carrier”. In this specific example, “evacuate Wafers” are each two wafers W12 and W13 mounted on the carrier A.

Next, as shown in step S <b> 35, the carriers on which “needWafers” are mounted (that is, carriers B and C) are set to “needCarriers”.
Next, the process proceeds to step S36, and it is determined whether or not “evacuate Wafers” exists. If present, the process proceeds to step S37 shown in FIG. 16, and if not, the process proceeds to step S41.

  If “evacuate Wafers” exists and the process proceeds to step S37, it is determined whether or not there is a carrier that can save all “evacuate Wafers” with reference to the database 21, and if there is a corresponding carrier, step The process proceeds to S38, and if it does not exist, the process proceeds to Step S39. It should be noted that the category of the carrier for saving the “evacuated Wafers” needs to be the same as that of “focused Carrier”.

If there is a corresponding carrier and the process proceeds to step S38, one carrier is selected from the corresponding carriers and set as a save destination carrier. At this time, if the above-mentioned “evacuate Wafers” is included in the configuration after the transfer, and there is a carrier in which a slot in which this “evacuate Wafers” is to be stored is available, this carrier is selected. If there is no such carrier, an arbitrary carrier is selected.
On the other hand, when the corresponding carrier does not exist and the process proceeds to step S39, a carrier of the same category as “focused Carrier” is newly established in the storage area of the memory 5, and this is set as a save destination carrier.

  In this specific example, as described above, “evacuate Wafers” are each two wafers W12 and W13 mounted on the carrier A. On the other hand, carriers B and C each have only two slots, and there are no carriers with four slots available. Accordingly, there is no carrier that can save all “evacuate Wafers”. Therefore, the process proceeds to step S39, and as shown in FIG. 18, a carrier X1 of the same category as “focused Carrier” (carrier A) is generated in the memory 5, and this is set as a save destination carrier.

  Next, the process proceeds from step S38 or step S39 to step S40, and as shown in FIG. 19, “evacuate Wafers” is transferred to the evacuation destination carrier. At this time, if the “evacuationwafers” is included in the configuration after the transfer of the save destination carrier, and the slot where this “evacuatewafers” is to be stored is empty, “evacuatewafers” is transferred to that slot. Otherwise, transfer to any slot. This transfer is referred to as “procedure 1”.

  Next, the process proceeds to step S41, and it is determined whether “needSelfWafers” exists. When “needSelfWafers” exists, “needSelfWafers” is transferred from slot to slot in “focusedCarrier” as shown in step S42 and FIG. This transfer is referred to as “procedure 2”. Thereafter, the process proceeds to step S43. On the other hand, when “needSelfWafers” does not exist, the process proceeds directly from step S41 to step S43.

  Next, as shown in step S43, it is determined whether or not “needCarriers” exists. If “needCarriers” exists, the process proceeds to step S44, where one carrier is selected from “needCarriers”, and “needWafers” is transferred from this carrier to a predetermined slot of “focusedCarrier”. This transfer is referred to as “procedure 3”. Then, the carrier whose transfer has been completed is removed from “needCarriers”. Thereafter, the process returns to step S43, and step S44 is repeated until there is no “needWafers”.

  In this specific example, as shown in FIG. 21, the carrier B which is “needCarriers” and the wafer W11 which is “needWafers” mounted on the carrier C are transferred to the carrier A which is “focusedCarrier”. Thereby, the transfer concerning the carrier A is completed.

  When “needSafes” disappears, the process returns from step S43 to step S31. Then, as shown in step S31, the presence / absence of a carrier that has not been transferred is determined. If there is a carrier that has not been transferred, this is designated as “focusedCarrier” (step S32), and step S33. Steps shown in S44 are repeated. In this specific example, the steps shown in steps S33 to S44 are repeated for carriers B and C. When the transfer of all carriers is completed, the transfer procedure determining step shown in step S3 of FIG. 5 is completed. Thus, a wafer transfer procedure is created.

  Next, as shown in step S4 of FIG. 5, the sorter contamination constraint is checked for each transfer procedure described above to check that each transfer procedure satisfies the contamination constraint, and the contamination constraint is satisfied. Select a sorter. Specifically, referring to the information on the contamination restriction of the sorter stored in the database 21 (see FIG. 2), “procedure 1” in step S40, “procedure 2” in step S42, “procedure 3” in step S44. For each of “”, a set of usable sorters is obtained. Then, a product set of the acquired sets is obtained, and a sorter included in the product set is selected as a sorter that can be used for the entire transfer procedure. If the product set is an empty set, it is determined that it is impossible to execute each of the above-described procedures with one sorter while observing the contamination restriction, and an error message is output.

  Next, as shown in step S5, the output unit 4 outputs the created transfer procedure. For example, a signal instructing replenishment of the newly assumed carriers X1 and X2 (see FIG. 13) in the target configuration determining step (step S2), the transfer operation created in the transfer procedure determining step (step S3), , “Procedure 1”, “Procedure 2”, and “Procedure 3” are repeated for the number of carriers, and a signal indicating a series of operations, and a signal indicating the sorter selected in the sorter selection step (step S4), Output to software that manages wafer transfer. As a result, the software searches for empty carriers belonging to the requested category from the factory, inserts predetermined carriers into the first and second ports of the selected sorter, and loads the carriers. The wafer is transferred by driving the sorter arm in conjunction with the insertion. Then, as shown in FIG. 3, the set of carriers whose wafers have been rearranged by the sorter 16 are transported by the stocker 15 and the transport device 12 toward the manufacturing apparatus 11 that performs the post-process. Further, the data on the wafer configuration stored in the database 21 is rewritten to data representing the wafer configuration after the transfer.

Next, the effect of this embodiment will be described.
In general, the contamination state of a wafer differs depending on the processes that have been performed so far, and the contamination state of the carrier and sorter also differs depending on the wafer that has been handled so far. For this reason, when an unlimited number of wafers are transferred to the carrier by the sorter, contaminants diffuse between the wafer, the sorter, and the carrier. Therefore, there are restrictions on the sorters and carriers that can be used (contamination restrictions) depending on the contamination state of the wafer. Conventionally, the presence of this contamination restriction has made it difficult to automate wafer transfer between carriers.
On the other hand, in the present embodiment, when a wafer not included in the required wafer configuration is included in the provided wafer configuration in the target configuration determination process shown in step S2, a carrier of the same category as this wafer is selected. By newly installing, the transfer destination of all the wafers can be secured while satisfying the contamination restriction.

  Further, in the present embodiment, in the transfer procedure determining step shown in step S3, carriers are selected one by one, and wafers that are not to be mounted on this carrier in the target wafer configuration are retracted from the selected carriers (procedures). 1) The transfer procedure is created so that the wafer is moved in this carrier (procedure 2), and then the necessary wafer is transferred to the selected carrier from another carrier (procedure 3). . In addition, when there is no appropriate retreat destination carrier when retreating the wafer, a new carrier that satisfies the contamination restriction is provided. Thus, the wafers can be reliably transferred without causing the wafers to be in contact with each other or the destination of the wafers to be lost.

Further, in the present embodiment, since the sorter satisfying the contamination restriction is selected in all transfer procedures in the sorter selection process shown in step S4, the sorter capable of executing all procedures in one unit is automatically selected. Can be selected.
According to the present embodiment, these effects enable automatic wafer transfer between carriers without requiring an operator's instruction. As a result, an automated system for the entire semiconductor factory can be constructed with the wafer transfer procedure creation device 10 according to the present embodiment as one element. Thereby, automation of the semiconductor factory which improved the operating efficiency of the manufacturing apparatus can be promoted.

  In the present embodiment, an example in which the transfer procedure is created by the transfer procedure determination process shown in step S3 after the target wafer configuration is determined by the target configuration determination process shown in step S2 is shown. However, the present invention is not limited to this, and when the required wafer configuration includes all the wafers constituting the provided wafer configuration and satisfies the contamination restriction, the required wafer configuration can be directly used as the target wafer configuration. In this case, the target configuration determination step is not necessary. Alternatively, the target wafer configuration may be input by an operator or stored in the database 21 in advance. In these cases, the target configuration determination step is not necessary. Even in these cases, it is possible to check whether or not the target wafer configuration satisfies the contamination constraint in the sorter selection process shown in step S4.

In the present embodiment, the example of selecting a sorter that satisfies the contamination constraint in all transfer procedures in the sorter selection process shown in step S4 has been described. However, the present invention is not limited to this, and all transfer processes are performed. When there is no sorter that satisfies the contamination constraint in the loading procedure, a plurality of sorters may be used to execute the entire procedure while complying with the contamination constraint in each transfer procedure.
Furthermore, the contamination restriction is not limited to the restriction shown in FIG. 1, and can be arbitrarily set on the user side according to the contents of the process to be executed and the degree of cleanliness required for the product.
Furthermore, the wafer transfer procedure creation apparatus according to the present invention can be used not only for rearranging the wafer configuration between manufacturing apparatuses but also for mounting a maintenance wafer on a carrier in order to maintain the manufacturing apparatus. it can.

Next, a second embodiment of the present invention will be described.
The present embodiment is an example in which the first embodiment described above is applied to a carrier having 25 slots. Further, in the present embodiment, the types of sorters prepared are more limited than those in the first embodiment. Configurations other than those described above in the present embodiment are the same as those in the first embodiment. That is, the contamination restriction in the present embodiment is the same as the contamination restriction in the first embodiment, and follows the rules shown in FIG. Further, the wafer transfer procedure creation device and the wafer transfer procedure creation method according to the present embodiment are the same as those in the first embodiment.

FIG. 22 is a diagram showing sorter types in the present embodiment.
23 to 27 are diagrams showing a wafer configuration at each stage of the wafer transfer procedure creating method according to the present embodiment, in which (a) in each drawing shows a wafer configuration (target) after transfer, b) shows the wafer configuration (before) before transfer.

  As shown in FIG. 22, in this embodiment, four sorters are set. That is, the sorter No. 1 can transfer a wafer from a carrier belonging to category β to a carrier belonging to category β or γ. 2 and sorter no. 3 can transfer a wafer from a carrier of category β to a carrier of category β. 4 can transfer a wafer from a carrier of category β to a carrier of category ζ. Information regarding the contamination restriction of the sorter is stored in the database 21.

Hereinafter, a specific example of the wafer transfer procedure creation method according to the present embodiment will be described.
First, as shown in step S1 of FIG. 5, the required wafer configuration is input to the input unit 1 (see FIG. 4). At this time, as shown in FIG. 23A, the required wafer configuration includes two carriers, carrier A belonging to category β and carrier B belonging to category γ, and belongs to lot L21 in slots p1 and p2 of carrier A. Two wafers W21 are mounted, and 20 wafers W22 belonging to the lot L22 are mounted in slots p1 to p20 of the carrier B.

  On the other hand, a provided wafer configuration as shown in FIG. 23B is provided from the factory. As shown in FIG. 23B, the provided wafer configuration includes two carriers, carrier A belonging to category β and carrier B belonging to category γ, and 20 sheets belonging to lot L22 in slots p1 to p20 of carrier A. Wafer W22 is mounted, two wafers W21 belonging to lot L21 are mounted in slots p21 and p22, and three wafers W23 belonging to lot L23 are mounted in slots p23 to p25. There is no wafer mounted on.

  Next, as shown in step S2 of FIG. 5, a target configuration determination step is performed. First, as shown in step S21 of FIG. 6, a storage area is secured in the target configuration determination unit 2 and the initial wafer configuration is written. That is, the requested wafer configuration data is read from the input unit 1 and stored in the memory 5, and the provided wafer configuration data is extracted from the database 21 and stored in the memory 5. At this time, the required wafer configuration shown in FIG. 23A is “targetSlotMap”, and the provided wafer configuration shown in FIG. 23B is “beforeSlotMap”.

  Next, as shown in step S <b> 22, the data of all the wafers is extracted from “targetSlotMap” and “beforeSlotMap” stored in the memory 5. In this specific example, the data extracted at this time is the data of the wafers W21, W22, and W23.

  Next, as shown in step S <b> 23, wafers not included in “targetSlotMap” among wafers mounted on a carrier that is included in “beforeSlotMap” but not included in “targetSlotMap” are set as “restLots”. In this specific example, since there is no carrier that is included in “beforeSlotMap” and not included in “targetSlotMap”, there is also no “restLots”.

  Next, as shown in step S24, a wafer obtained by removing “restLots” from a wafer (wafer W23) included in “beforeSlotMap” but not included in “targetSlotMap” is defined as “strayLots”. In this specific example, “strayLots” is the wafer W23.

  Next, as shown in step S25, a carrier corresponding to a carrier that is included in “beforeSlotMap” and not included in “targetSlotMap” is newly created in “targetSlotMap”. In this specific example, since there is no carrier that is included in “beforeSlotMap” and not included in “targetSlotMap”, nothing is done in this step.

  Next, as shown in step S26, “restLots” is arranged on the carrier newly established in step S25. In this specific example, since there is no newly established carrier or “restLots”, nothing is done.

  Next, as shown in step S27 and FIG. 24, the same number of carriers as the number of types of wafers (number of lots) constituting “strayLots” are newly established in both “beforeSlotMap” and “targetSlotMap”. In this specific example, since the wafer constituting “strayLots” is one type of wafer W23, one carrier X is provided in both “beforeSlotMap” and “targetSlotMap”. That is, an area corresponding to a new carrier X is set in the storage area of the memory 5. Further, since the wafer W23 is stored in the carrier A and the contamination category of the carrier A is the category β, the contamination category of the carrier X is also set to the category β.

  Next, as shown in step S28, three wafers W23 are placed in the slots p1 to p3 of the carrier X in the “targetSlotMap”. Thereby, the target wafer configuration as shown in FIG. 24A is determined.

  As described above, after the target wafer configuration is determined by the target configuration determination step shown in step S2 of FIG. 5, the transfer procedure determination step is performed as shown in step S3. First, the process proceeds to step S31 in FIG. 15. Since there are untransferred carriers (carriers A, B, and X), the process proceeds to step S32, and carrier A is selected from the untransferred carriers. “focusedCarrier”.

  Next, as shown in step S <b> 33, data (“before FocusedMap”) representing the current wafer configuration of “focused Carrier” (carrier A) (before transfer) (“before FocusedMap”) is extracted from the database 21. At this time, data (“target FocusedMap”) representing the target wafer configuration of “focusedCarrier” (carrier A) is determined by the above-described target configuration determination step (step S 2) and stored in the memory 5.

  Then, as shown in step S <b> 34, among the wafers (wafer W <b> 21) constituting the “target FocusedMap”, wafers not included in the “before FocusedMap” are set as “need Wafers”. In this specific example, “needSafes” does not exist.

  Further, among the wafers (wafer W21) constituting the “target FocusedMap”, wafers included in the “before FocusedMap” and needing movement within the carrier are referred to as “needSelfWafers”. In this specific example, “needSelfWafers” is set as the wafer W21.

  Further, among the wafers (wafers W21, W22, and W23) included in the “before FocusedMap”, wafers that do not constitute the “target FocusedMap” are referred to as “evacuate Wafers”. In this specific example, “evacuate Wafers” are 20 wafers W22 and 3 wafers W23.

  Next, as shown in step S <b> 35, the carrier on which “needWafers” is mounted is referred to as “needCarriers”. In this specific example, since “needWafers” does not exist, “needCarriers” does not exist.

  Next, the process proceeds to step S36, and since “evacuate Wafers” exists, the process proceeds to step S37 shown in FIG. 16, and with reference to the database 21, there is a carrier in which all the “evacuate Wafers” (wafers W22 and W23) can be saved. Determine if it exists. In this specific example, since the wafers W22 and W23 can be evacuated to the carrier X belonging to the category β, the process proceeds to step S38, and the carrier X is selected as the evacuation destination carrier.

  In step S40, as shown in FIG. 25, “evacuated Wafers” (wafers W22 and W23) are transferred from “focused Carrier” (carrier A) to the evacuation destination carrier (carrier X). At this time, the carrier X of the target wafer configuration (target) shown in FIG. 25A includes “evacuate Wafers” (wafer W23), and slots p1 to p3 in which the wafer W23 is to be stored are vacant. The wafer W23 is transferred to this slot. Accordingly, the transfer destination of the wafer W22 is set to slots p4 to p23. This transfer is referred to as “procedure 1”.

Next, the process proceeds to step S41, and since “needSelfWafers” exists, the process proceeds to step S42, and as shown in FIG. To slots p1 and p2. This transfer is referred to as “procedure 2”.
Next, the process proceeds to step S43, and since “needCarriers” does not exist, the process returns to step S31 illustrated in FIG. Thereby, the transfer of the carrier A is completed.

Next, the process proceeds to step S32, and the carrier B that has not been transferred is defined as “focusedCarrier”.
Next, as shown in step S <b> 33, data (“before FocusedMap”) representing the current wafer configuration of “focused Carrier” (carrier B) is extracted from the database 21. Data representing the target wafer configuration of carrier B (“target FocusedMap”) is stored in the memory 5.

  Next, the process proceeds to step S34, where “need Wafers”, “need Self Wafers”, and “evacuate Wafers” are set. As described above, “needWafers” is a wafer that is not included in “before FocusedMap” among the wafers (wafer W22) constituting “target FocusedMap”, and is wafer W22 at this point in this specific example. In addition, “needSelfWafers” is a wafer included in “before FocusedMap” among the wafers (wafer W22) constituting “target FocusedMap” and needs to be moved within the carrier. Then it does not exist. Further, “evacuate Wafers” is a wafer that does not constitute “target FocusedMap” among the wafers included in “before FocusedMap”, and does not exist at this point of this specific example.

Next, as shown in step S <b> 35, the carrier (carrier X) on which “needWafers” (wafer W <b> 22) is mounted is referred to as “needCarriers”.
Next, the process proceeds to step S36, and since “evacuate Wafers” does not exist, the process proceeds to step S41. Since “needSelfWafers” does not exist, the process proceeds to step S43, and “needCarriers” (carrier X) exists. Therefore, the process proceeds to step S44, and “needCarriers” (carrier X) is transferred from “needCarriers” (carrier X) to slots “p1” to “p20” of “focusedCarrier” (carrier B) as shown in FIG. This transfer is referred to as procedure 3. Then, the carrier X is removed from “needCarriers”.

  Next, the process returns to step S43, and since “needCarriers” no longer exists, the process returns to step S31. Thereby, the transfer of the carrier B is completed, and the transfer of the carrier X is also completed. Therefore, in step S31, since there is no untransferred carrier, the transfer procedure determining step is terminated.

Next, as shown in step S4 of FIG. 5, the sorter that satisfies the contamination restriction is selected with reference to the contamination restriction information (see FIG. 22) of the sorter stored in the database 21.
In “procedure 1” in step S40, as shown in FIGS. 24B and 25B, wafers W22 and W23 are transferred from carrier A belonging to category β to carrier X belonging to category β. . Therefore, this transfer is a transfer of (β → β), and the set of usable sorters is (No. 1, No. 2, No. 3) from FIG.
In “procedure 2” in step S42, as shown in FIGS. 25B and 26B, the transfer of the wafer W21 is performed in the carrier A belonging to the category β. Therefore, this transfer is also a transfer of (β → β), and the set of usable sorters is (No. 1, No. 2, No. 3) from FIG.
In “procedure 3” shown in step S44, as shown in FIGS. 26B and 27B, the wafer W22 is transferred from the carrier X belonging to the category β to the carrier B belonging to the category γ. Therefore, this transfer is a transfer of (β → γ), and from FIG. 22, the set of usable sorters is (No. 1).

  For this reason, the set of usable sorters (No. 1, No. 2, No. 3), (No. 1, No. 2, No. 3), (No. 1) is (No. 1). ). That is, the above-described procedures 1 to 3 are performed according to the sorter No. If 1 is used, it can be performed while observing the contamination constraints. Therefore, as the sorter to be used, the sorter No. 1 is selected.

Next, as shown in step S5, the output unit 4 outputs the transfer procedure created as described above. That is, a signal for instructing replenishment of a newly assumed carrier X (see FIG. 24), a signal for instructing the above-mentioned “procedure 1”, “procedure 2”, and “procedure 3”, and “sorter No. 1” as the sorter. Is output to the software for managing the transfer of the wafer. As a result, the sorter No. 1 executes this transfer procedure to transfer the wafer. Thereafter, the data stored in the database 21 is updated to data representing the wafer configuration after transfer.
Thus, in this embodiment, even when a carrier with 25 slots is used, the wafer transfer procedure can be created without human intervention. The effects of the present embodiment other than those described above are the same as those of the first embodiment described above.

  In the wafer transfer procedure creation device 10 according to each of the above-described embodiments, the example in which the target configuration determination unit 2 and the transfer procedure determination unit 3 are provided has been described, but these may be configured by one processor. . In this case, the functions of the target configuration determination unit 2 and the transfer procedure determination unit 3 may be realized by a program.

  Such a program is a wafer transfer procedure creation program that causes a computer to generate a wafer transfer procedure for changing the arrangement state (wafer configuration) of wafers mounted on a plurality of carriers. In other words, the program selects one carrier from a plurality of carriers in sequence, and is selected from a database in which the arrangement state of wafers mounted on the plurality of carriers is stored for each selected carrier. A function of extracting the current wafer arrangement state (provided wafer configuration) in one carrier and storing it in a memory, and comparing the stored provided wafer configuration with the target wafer arrangement state (target wafer configuration); Based on the comparison result, if there is a wafer to be evacuated from the selected one carrier, the function for generating the first procedure (procedure 1) for evacuating the wafer and the one result based on the comparison result described above. A function for generating a second procedure (procedure 2) for moving a wafer to be moved in the carrier of the carrier, and the ratio described above Based on the results, it is used for realizing the, and generating a third procedure of transferring it if any wafer to be transferred to one of the carriers (step 3) from other carriers.

  In addition, the first procedure refers to, for example, a database, and if there is another carrier capable of storing a wafer to be evacuated, the wafer to be evacuated is transferred to the other carrier, and the wafer to be evacuated is transferred. If there is no other carrier that can be stored, a new carrier belonging to the same contamination category as the wafer to be evacuated is provided in the memory, and the procedure for transferring the wafer to be evacuated to this new carrier is adopted. Thereby, the function of the above-mentioned transfer procedure determination part 3 is realizable.

  Furthermore, this program is included in, for example, the current wafer arrangement state (provided wafer configuration), and there are surplus wafers that are not included in the wafer arrangement state (required wafer configuration) required to be realized. In the computer, a new carrier belonging to the same contamination category as the surplus wafer is assumed in the memory, and the surplus wafer is placed on the new carrier, so that the target wafer arrangement state (target wafer configuration) ) Is further realized. Thereby, the function of the above-mentioned target structure determination part 2 is realizable.

  Furthermore, this program, for example, has the function of obtaining, from a database, a set of sorters that can execute the first to third procedures based on wafer and carrier contamination constraints, and the product of these sets. The function of selecting a sorter that can execute all the first to third procedures by obtaining the set is further realized.

It is a figure which shows the contamination restrictions in the 1st Embodiment of this invention. It is a figure which shows the contamination restrictions of the sorter in this embodiment. It is an overhead view which shows the semiconductor factory in this embodiment. It is a block diagram which shows the wafer transfer procedure preparation apparatus which concerns on this embodiment. It is a flowchart which shows the wafer transfer procedure preparation method which concerns on this embodiment. It is a flowchart figure which shows the target structure determination process shown in FIG. (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ). (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ) And shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ) And shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ) And shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ) And shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a target structure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure (before) before transfer. ) And shows the next stage of FIG. It is a figure which illustrates some data memorize | stored in the database. (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows a target wafer structure, (b) shows the wafer structure before transfer. It is a flowchart figure which shows the transfer procedure determination process shown in FIG. It is a flowchart figure which shows the transfer procedure determination process shown in FIG. 5, and is a figure following FIG. (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure ((b) before transfer) before). (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure ((b) before transfer) before) and shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure ((b) before transfer) before) and shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure ((b) before transfer) before) and shows the next stage of FIG. (A) And (b) is a figure which shows the wafer structure of a transfer procedure determination process, (a) shows the wafer structure (target) after transfer, (b) is the wafer structure ((b) before transfer) before) and shows the next stage of FIG. It is a figure which shows the kind of sorter in the 2nd Embodiment of this invention. (A) And (b) is a figure which shows the wafer structure of the wafer transfer procedure preparation method concerning this embodiment, (a) shows the wafer structure (target) after transfer, (b) is transfer. The wafer structure (before) before mounting is shown. (A) And (b) is a figure which shows the wafer structure of the wafer transfer procedure preparation method concerning this embodiment, (a) shows the wafer structure (target) after transfer, (b) is transfer. The wafer configuration (before) is shown, and the next stage of FIG. 23 is shown. (A) And (b) is a figure which shows the wafer structure of the wafer transfer procedure preparation method concerning this embodiment, (a) shows the wafer structure (target) after transfer, (b) is transfer. The wafer configuration before loading is shown and the next stage of FIG. 24 is shown. (A) And (b) is a figure which shows the wafer structure of the wafer transfer procedure preparation method concerning this embodiment, (a) shows the wafer structure (target) after transfer, (b) is transfer. The wafer configuration before loading is shown, and the next stage of FIG. 25 is shown. (A) And (b) is a figure which shows the wafer structure of the wafer transfer procedure preparation method concerning this embodiment, (a) shows the wafer structure (target) after transfer, (b) is transfer. The wafer configuration (before) before loading is shown, and the next stage of FIG. 26 is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Input part, 2 Target structure determination part, 3 Transfer procedure determination part, 4 Output part, 5 Memory, 10 Wafer transfer procedure preparation apparatus, 11 Manufacturing apparatus, 12 Transfer apparatus, 13 Rail, 14 Cart, 15 Stocker, 16 Sorter, 21, database, 100 semiconductor factory, A, B, C, X, X1, X2 carrier, L1-L6, L11-L13, L21-L23 lot, p1-p25 slot, W1-W6, W11-W13, W21 ~ W23 Wafer, α, β, γ, δ, ε, ζ Category

Claims (12)

A wafer transfer procedure creating device for generating a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
Sequentially selecting one carrier from the plurality of carriers,
For each carrier selected
Based on the comparison result between the current wafer arrangement state and the target wafer arrangement state, if there is a wafer to be evacuated from the one carrier, a first procedure for evacuating the wafer is generated,
Based on the comparison result, a second procedure is generated for moving a wafer to be moved in the one carrier, if any.
A wafer transfer procedure creating apparatus for generating a third procedure for transferring a wafer to be transferred from another carrier to the one carrier based on the comparison result.   In the first procedure, if there is another carrier capable of storing the wafer to be evacuated, the wafer to be evacuated is transferred to the other carrier, and the other carrier capable of accommodating the wafer to be evacuated is stored. 2. The wafer transfer according to claim 1, wherein a new carrier belonging to the same contamination category as the wafer to be evacuated is provided and the wafer to be evacuated is transferred to the new carrier. Loading procedure creation device.   If there are surplus wafers that are included in the current wafer placement state and are not included in the wafer placement state that is required to be realized, a new carrier belonging to the same contamination category as the surplus wafer is added. The wafer transfer procedure creating apparatus according to claim 1, wherein the target wafer arrangement state is generated by assuming that the surplus wafer is arranged on the new carrier.   Based on the contamination restrictions of the wafer and the carrier, a set of sorters capable of executing the first to third procedures is respectively obtained, and a product set of the sets is obtained to obtain the first to third procedures. 4. A wafer transfer procedure creation device according to claim 1, wherein a sorter capable of performing all of the above is selected. A wafer transfer procedure creation method for generating a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
Sequentially selecting one carrier from the plurality of carriers;
Generating a wafer transfer procedure for the selected one carrier;
With
The step of generating the wafer transfer procedure is as follows:
Generating a first procedure for evacuating any wafer to be evacuated from the one carrier based on a comparison result between the current wafer arrangement state and a target wafer arrangement state;
Generating a second procedure for moving any wafers to be moved within the one carrier based on the comparison result; and
Generating a third procedure for transferring, if any, a wafer to be transferred to the one carrier from another carrier based on the comparison result;
A wafer transfer procedure creation method characterized by comprising: The step of generating the first procedure includes:
Determining the presence or absence of another carrier capable of storing the wafer to be retracted;
If there is another carrier capable of storing the wafer to be retracted, the wafer to be retracted is transferred to the other carrier, and if there is no other carrier capable of storing the wafer to be retracted, the retract is performed. Providing a new carrier belonging to the same contamination category as the wafer to be transferred, and transferring the wafer to be evacuated to the new carrier;
The wafer transfer procedure creating method according to claim 5, wherein:   If there are surplus wafers that are included in the current wafer placement state and not included in the wafer placement state that is required to be realized, a new carrier that belongs to the same contamination category as the surplus wafer is added. The wafer transfer according to claim 5, further comprising a step of generating the target wafer arrangement state by assuming that the surplus wafer is arranged on the new carrier. Procedure creation method. Obtaining each set of sorters capable of performing the first to third procedures based on contamination constraints of the wafer and the carrier;
Selecting a sorter capable of executing all of the first to third procedures by obtaining a product set of the sets;
The wafer transfer procedure creating method according to any one of claims 5 to 7, further comprising: A wafer transfer procedure creation program for causing a computer to generate a transfer procedure of the wafer for changing the arrangement state of wafers mounted on a plurality of carriers,
In the computer,
Sequentially selecting one carrier from the plurality of carriers,
For each carrier selected
The current wafer arrangement state in the selected one carrier is extracted from the database storing the arrangement state of the wafers mounted on the plurality of carriers and stored in the memory, and the stored current wafer is stored. A function for comparing the arrangement state of the target and the target wafer arrangement state,
Based on the comparison result, a function for generating a first procedure for evacuating a wafer to be evacuated from the one carrier, if any,
A function for generating a second procedure for moving, if any, a wafer to be moved in the one carrier based on the comparison result;
Based on the comparison result, a function of generating a third procedure for transferring a wafer to be transferred from another carrier to the one carrier, if any,
A wafer transfer procedure creation program characterized by realizing the above.   In the first procedure, referring to the database, if there is another carrier capable of storing the wafer to be evacuated, the wafer to be evacuated is transferred to the other carrier, and the wafer to be evacuated If there is no other carrier that can store the wafer, a new carrier belonging to the same contamination category as the wafer to be evacuated is provided in the memory, and the wafer to be evacuated is transferred to the new carrier. The wafer transfer procedure creation program according to claim 9.   If there are surplus wafers that are included in the current wafer placement state and are not included in the wafer placement state required to be realized, the computer belongs to the same contamination category as the surplus wafer. 10. The function of generating the target wafer arrangement state is further realized by assuming a new carrier in the memory and arranging the surplus wafer on the new carrier. Or the wafer transfer procedure creation program according to 10. In the computer,
A function of respectively obtaining a set of sorters capable of executing the first to third procedures from the database based on contamination restrictions of the wafer and the carrier;
A function of selecting a sorter capable of executing all of the first to third procedures by obtaining a product set of the sets;
The wafer transfer procedure creation program according to any one of claims 9 to 11, further comprising:

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