TWI677424B - 具有高z-方向導電率之複合材料及製造複合材料的方法 - Google Patents
具有高z-方向導電率之複合材料及製造複合材料的方法 Download PDFInfo
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Abstract
本發明係關於一種具有高Z-方向導電率之可固化複合材料。該可固化複合材料包含兩層或更多層經可固化基質樹脂灌注或浸漬之增強碳纖維及含有至少導電性奈米尺寸顆粒(例如碳奈米管)、及輕質碳面紗之層間區域。根據另一實施例,該層間區域進一步含有聚合性增韌顆粒。亦揭示製造複合材料及結構之方法。
Description
本申請案主張2014年9月22日申請之美國臨時專利申請案第62/053,469號之權利,該案之揭示內容以全文引用的方式併入本文。
在航太工業中,在飛機主要及次要結構中使用纖維強化聚合物複合材料正變得較為盛行。傳統上,複合結構係如下製備:藉由於成形面上鋪放複數層(layer)(或層(ply))經樹脂浸漬之纖維增強(稱為預浸材),接著使其固結及/或固化。纖維強化聚合物複合材料之優點包括強度-重量比高、耐疲勞度極佳、耐腐蝕及具可撓性,允許顯著減少組成部件、及減少對緊固件及接頭的需求。然而,此等材料在應用於現代飛機之主要及次要結構時,因基質樹脂之介電性質而存在特殊挑戰。雖然於複合材料中使用碳纖維作為增強纖維可因其等石墨性質沿著其等縱向傳遞某種程度之導電率,但該等複合材料中之基質樹脂之介電性降低該等複合材料之總體導電率。
20‧‧‧可固化複合材料
21a‧‧‧層間區域
21b‧‧‧層間區域
22‧‧‧增強纖維層
23‧‧‧增強纖維層
24‧‧‧增強纖維層
25‧‧‧導電性奈米顆粒
26‧‧‧聚合性增韌顆粒
27‧‧‧碳面紗
41‧‧‧可固化樹脂膜
42‧‧‧碳面紗
43‧‧‧碳纖維層
圖1顯示雷擊事件期間在複合材料翼盒上產生「邊緣輝光(edge glow)」現象之典型電流路徑。
圖2顯示應用在複合材料翼之典型結構之翼樑帽邊緣的密封劑。
圖3根據本發明之一實施例示意性繪示具有含有聚合性增韌顆
粒、導電性奈米顆粒及碳面紗之層間區域之可固化複合材料。
圖4根據本發明之一實施例示意性繪示含顆粒樹脂膜及經層壓至碳纖維層之各側之上的碳面紗。
圖5為多種複合材料層壓板之導電率數據的圖示小結,其顯示無增韌顆粒下之多壁奈米碳管(MWCNT)及碳面紗之協同效果。
圖6為多種複合材料層壓板之導電率數據的圖示小結,其顯示具有增韌顆粒之MWCNT及碳面紗之協同效果。
圖7為多種複合材料層壓板之導電率數據的圖示小結,其顯示碳黑及碳面紗之協同效果。
圖8為多種複合材料層壓板之衝擊後壓縮(Compression After Impact;CAI)數據的圖示小結,其顯示碳面紗及導電性奈米顆粒之效果。
為滿足飛機之雷擊保護之要求及避免被稱為「邊緣輝光」之現象(尤其對於複合材料翼組件),需要提高纖維強化聚合物複合材料之導電率。邊緣輝光現象在複合蒙皮/翼樑組件中自身表現為具有足以成為燃料蒸氣之潛在點火源之能量的明亮輝光或火花。
此邊緣輝光現象可於雷擊事件時間出現,尤其在具有低Z-方向導電率之複合材料層壓板上。於雷擊事件期間,帶有高強度電流之暫態電荷因連接兩個複合部件之緊固件移動通過該蒙皮且接著進入翼結構(例如,結構翼樑或肋)。因此,通常在複合蒙皮/翼樑組件中,電流部分地在該蒙皮上移動及部分地通過代表一層燃料箱壁之翼樑。
電流橫向地從緊固件穿過翼樑之相鄰複合層,且因相較於樹脂基質的較高導電率傾向於沿纖維移動。此通路可在翼樑/肋帽邊緣產生被熟悉此項技術者稱為「邊緣輝光」現象之典型明亮輝光或火花。
圖1顯示雷擊事件期間複合材料翼盒上潛在關鍵電流路徑。當纖
維強化層間之樹脂具有高電阻時,邊緣輝光現象表現更為危險,且因此,電流傾向於不在相鄰層間流動。若Z-方向導電率過低,則於雷擊期間可在層間產生顯著電壓降,就此增加邊緣輝光之風險。
邊緣輝光現象與複合材料邊緣上之電子表面拋射或電漿產生相關且常常表現為一種樹脂爆炸。就此現象之性質而言之不確定性已引發一些與雷擊事件期間燃料蒸汽點火能力相關聯之關注。
常規解決方案為在燃料箱上施加密封劑(見圖2)。此燃料箱密封劑之一實例為來自Le Joint Francais之PR 1776 B類密封劑。然而,此方法導致額外重量,且因標準化之缺乏及密封劑施加困難而並非總是有效。隨時間之流逝,該密封劑因老化變得失效,或可被油箱內燃料完全洗去。此外,雷擊可於裁邊上引發可使邊緣密封劑破碎之高壓氣體之產生。仍存在對可解決如上所討論之邊緣輝光問題同時提供優良機械特性(諸如抗衝擊及抗層離)之多功能複合材料之需要。
在航太工業內廣泛接受的是,對飛機複合結構之兩個主要設計影響因素為其等可抗特定衝擊及抗於此等事件後損害之擴散。
層離為複合材料之重要故障模式。當在兩個層壓層彼此脫膠時就會發生層離。重要的設計限制因素包含引發層離所需之能量及擴散該層離所需之能量。
改良複合結構之耐衝擊性性能之需要(尤其對於飛機主要結構)已引發新一代用層間增韌顆粒韌化之複合材料之發展(常定義為「第三代複合材料」)。此技術解決方案為碳纖維強化複合材料提供高耐衝擊性,且於相鄰層間建立電學上絕緣層間區域,導致整體複合結構導電率(尤其在Z-方向上)顯著降低。該「Z-方向」係指與增強纖維配置成複合結構之平面或貫穿該複合結構之厚度的軸正交的方向。
複合材料之導電率可藉由於纖維強化聚合物複合材料之基質樹脂中、或於多層複合結構(例如預浸材疊層)之層間區域中併入不同導
電材料(諸如導電性顆粒)改良。例如,可以高負載方式添加金屬填充劑從而提高樹脂導電率,但此可導致顯著增重及與耐衝擊性相關特性(諸如衝擊後壓縮強度(CSAI或CAI)及層間斷裂韌性)之削弱。因而,當前技術水平的解決方案可改良複合材料之Z-方向導電率而不(同時)改良其機械性能。有經改良之衝擊性能之固化複合材料係具有經改良之CAI及斷裂韌性之復合材料。CAI係測量複合材料耐抗損傷之能力之量度。在測量CAI之試驗中,使固化複合材料經受特定能量之衝擊且接著壓縮負載。在衝擊之後及壓縮試驗之前量測損傷的面積及凹痕深度。於該試驗期間,將複合材料加以束縛限制以確保不會發生彈性不穩定並記錄複合材料之強度。
斷裂韌性為描述含有裂紋之材料避免斷裂能力之性質,且為用於航太應用之材料之最重要性質之一。斷裂韌性係當存在裂紋時表示材料抗脆性斷裂的定量方式。
斷裂韌性可量化為應變能釋放率(Gc),應變能釋放率(Gc)是在斷裂期間每單位新產生斷裂表面積所消散的能量。Gc包含GIc(1型-張開型)或GIIc(II型-平面內剪切)。下標「Ic」表示在垂直於裂紋之法線拉伸應力下產生之I型裂紋張開,而下標「IIc」表示因平行於裂紋之平面及垂直於裂紋前緣之剪切應力之作用而產生之II型裂紋。可藉由檢測I型斷裂韌性來確定層離之引發及發展。
於一些實施例中,位於多層複合材料之層間區域處之導電性奈米顆粒及輕質碳面紗之組合產生協同效果,導致改良Z-向導電率。此外,藉由添加特定聚合性增韌顆粒,亦可獲得CAI及GIc之改良。在一些情況中,已發現導電性奈米顆粒及碳面紗之組合導致Z-方向導電率相較於未修改版本之相同複合材料高2個以上數量級,而不會使機械性能(包含CAI及I型(GIc)中之層離抗性)下降,且不會負面地影響材料製造能力及加工能力。此外,自具有導電性奈米顆粒及碳面紗之組合
獲得之導電性效果遠大於其等個別導電性效果之和。
本發明之一實施例係關於由兩層或更多層已用可固化或可熱固性樹脂灌注或預浸漬之增強纖維組成的可固化複合材料。於相鄰層增強纖維間之層間區域含有分散於整個可固化基質樹脂之導電性奈米顆粒、包埋於相同基質樹脂中之聚合性增韌顆粒及碳面紗。該等導電性奈米顆粒相較於該等聚合性增韌顆粒在尺寸上明顯更小。該等聚合性增韌顆粒可在該複合材料固化時實質上不溶於該樹脂基質中,及固化後仍在層間區域中呈離散顆粒(於本文中稱為「不溶性」顆粒)。於一些實施例中,該等聚合性增韌顆粒為當加熱周圍樹脂時尺寸增大之可膨脹顆粒。於一些實施例中,該等聚合性增韌顆粒包含不溶性顆粒及「可溶性」熱塑性顆粒。「可溶性」熱塑性顆粒係指當加熱其混合物時或於基質樹脂之固化週期期間溶解於周圍樹脂基質中,且不會在固化樹脂基質中呈離散顆粒之固體顆粒。
層間區域中之樹脂(無導電性奈米顆粒、碳面紗或增韌顆粒)可為與浸漬增強纖維之基質樹脂相同或不同。於一些實施例中,浸漬增強纖維之基質樹脂亦含有分散於其中之導電性奈米顆粒。
圖3根據本發明之一實施例示意性繪示可固化複合材料20。複合材料20含有形成於已用可固化基質樹脂灌注或浸漬之增強纖維層22、23、24之間之層間區域21a及21b。層間區域21a及21b各含有其中分散有於導電性奈米顆粒25之可固化基質樹脂、包埋於相同基質樹脂中之聚合性增韌顆粒26及碳面紗27。該層間樹脂之組成(無導電性奈米顆粒25、增韌顆粒26、及碳面紗27)可為與浸漬纖維層22、23、24之基質樹脂之組成相似或不同。當該層間樹脂係與浸漬纖維層22、23、24之基質樹脂之組成相似時,樹脂基質含有一種或更多種共同熱固性樹脂。聚合性增韌顆粒26可並排放置,並一同形成單層顆粒。依此方式,層間區域之深度係由該等顆粒之尺寸決定。於一些實施例中,增
韌顆粒26之尺寸相似(例如,具有大約相同直徑之球形顆粒),且該層間區域之深度為與增韌顆粒26之平均直徑大約相同或大於其平均直徑。
於一些實施例中,層間區域中含有導電性奈米顆粒、聚合性增韌顆粒及碳面紗之組合的固化複合材料具有以下特性:Z-方向上之導電率大於約10S/m(西門子/米)(根據4探針測試方法,於DC條件下測量)、270in-lbs(或30.5J)下之CAI大於約35Ksi(或約241MPa)(根據ASTM-D7137測量)、及I型(GIc)下之層間斷裂韌性大於約1.7in-lb/in2(或約295J/m2)(根據ASTM-D5528測量)。
於一替代性實施例中,於相鄰增強纖維層間之層間區域含有分散於整個基質樹脂之導電性奈米顆粒及包埋於相同基質樹脂中之碳面紗之組合,但不存在聚合性增韌顆粒。實例為,如圖3中所示之可固化複合材料可經修改,從而層間區域21a及21b含有帶有分散導電性奈米顆粒25及碳面紗27之可固化基質樹脂,但無聚合性增韌顆粒26。於此實施例中,該層間區域之深度係由碳面紗之厚度決定。
於一些實施例中,位於多層複合材料之層間區域處之導電性奈米顆粒及輕質碳面紗之組合產生協同效果,導致改良Z-方向導電率。在一些情況中,已發現導電性奈米顆粒及碳面紗之組合導致Z-方向導電率較未修改版本之相同複合材料高1個以上數量級,而不會使機械性能(包含CAI及I型(GIc)中之層離抗性)下降。此外,自具有導電性奈米顆粒及碳面紗之組合獲得之導電性效果遠大於其等個別導電性效果之和。
於一些實施例中,層間區域中含有導電性奈米顆粒及碳面紗之組合但無聚合性顆粒的固化複合材料具有以下特性:Z-方向上之導電率大於約10S/m(西門子/米)(根據4探針測試方法於DC條件下測量)、270in-lbs(或30.5J)下之CAI大於約30Ksi(或約206MPa)(根據ASTM-
D7137測量)、及I型(GIc)下之層間斷裂韌性大於約1.5in-lb/in2(或約260J/m2)(根據ASTM-D5528測量)。
本文中所揭示之複合材料為可成功用於需要高機械性能及高導電率之此等飛機應用之多功能材料。於固化狀態下,該複合材料之改良導電率可以起到將電流(諸如由雷擊產生之電流)傳播或驅散至由複合材料製得之複合結構之較大區域上之作用,就此降低對該複合結構之局部部分之災難性傷害之可能。因而,使用此多功能複合材料可為用於減輕雷擊之直接效果及防止如上討論之複合材料中邊緣輝光現象之有效解決方案。此外,固化複合材料提供電磁遮蔽之額外益處。
導電性奈米顆粒
如本文中所使用之術語「奈米顆粒」係指至少一維度小於約0.1微米(<100奈米)及縱橫比為約50:1至5000:1之材料。奈米顆粒之尺寸可藉由動態光散射(DSL)技術測定。例如,可使用奈米顆粒分析儀(諸如來自Horiba之SZ-100)。
該等奈米顆粒可為任何適宜三維形狀,包括(例如)球形、橢球形、球狀、盤狀、樹枝狀、棒狀、圓盤狀、長方體或多面體。
如本文中所使用之術語「縱橫比」係指三維物體之最長尺寸與最短尺寸之比例。當針對球形或實質上球形顆粒使用此術語時,相關比率可為球體之最大橫截面直徑與最小橫截面直徑之比。實例為,完美球形顆粒將具有1:1之縱橫比。
於一實施例中,該等奈米顆粒為由全部或大部分於分子規模上排列成五邊形或六邊形(或二者)之碳原子組成。適合本文預期目的之碳奈米尺寸結構包括(但不限於)碳奈米管、碳奈米纖維、碳奈米繩、碳奈米帶、碳奈米纖絲、碳奈米針、碳奈米片、碳奈米棒、碳奈米錐、碳奈米捲軸(捲軸狀)及碳奈米歐姆、碳黑、石墨奈米片或奈米點、石墨烯、及其他類型富勒烯材料。任何此等富勒烯材料可具有部
分或全部金屬塗層。
較佳碳奈米顆粒為碳奈米管(CNT)。通常地,CNT係外徑為於約0.4nm至約100nm之範圍內的管形、股狀結構,例如,該外徑可為少於約50nm或少於約25nm。
該等CNT可具有任何對掌性。涵蓋扶手椅奈米管。此外,該等CNT可係半導體奈米管或顯示導電性之任何其他類型。適宜CNT可包括單壁碳奈米管(SWCNT)、雙壁碳奈米管(DWCNT)及多壁碳奈米管(MWCNT)。於一實施例中,該碳奈米材料為MWCNT。
於另一實施例中,導電性奈米顆粒可包括導電率大於約1000S/m之金屬奈米顆粒、金屬或碳塗覆奈米顆粒及其組合。適宜金屬奈米顆粒包括任何已知金屬之顆粒,包含(但不限於)銀、金、鉑、鈀、鎳、銅、鉛、錫、鋁、鈦、合金及其混合物。於一些實施例中,該金屬材料具有大於約1 x 107S/m,或大於約3 x 107S/m之導電率。
可經金屬塗覆之適宜有機或無機奈米顆粒包括(但不限於)奈米黏土、碳奈米管、碳奈米纖維、富勒烯、碳奈米繩、碳奈米帶、碳奈米纖絲、碳奈米針、碳奈米片、碳奈米棒、碳奈米錐、碳奈米捲軸及碳奈米歐姆、以及對應氮化硼組分、無機奈米顆粒或奈米纖維(諸如玻璃奈米球、矽奈米球、矽奈米管、奈米二氧化鈦、中空奈米顆粒)、聚合性奈米顆粒或奈米纖維(諸如聚醚碸奈米纖維、聚醚碸奈米球、聚醚醚碸奈米纖維、聚醚醚碸奈米球、聚醚醯亞胺奈米纖維、聚醯亞胺奈米球、聚醯亞胺奈米纖維、聚醯亞胺奈米纖維、聚醯胺奈米纖維、聚醯胺奈米球、彈性奈米球、聚芳醚酮(PAEK)奈米纖維、聚芳醚酮奈米球、聚苯硫醚奈米纖維、聚醯胺醯亞胺奈米纖維、液晶聚合物奈米纖維)。
金屬奈米顆粒可為任何適宜形狀及形態,且可具有高比表面積及低表觀密度(諸如薄片、粉末、纖維、球、樹突狀、圓盤或具有奈
米尺寸之任何其他三維物體,單獨或組合)。於一些實施例中,該等金屬奈米顆粒可具有少於約2.0g/cm3之表觀密度(AD)及高於約0.1m2/g之比表面積(SSA)。可藉由國際標準ISO 60測定AD。可用J.Am.Chem.Soc.,60,309(1938)by Brunauer,Emmett and Teller,adsorption isotherm of nitrogen中所述之BET方法測定SSA。
用於本文預期目的之導電性奈米顆粒可以於總樹脂含量之約0.1重量%至約10重量%之範圍存在於複合材料中。於一實施例中,該等導電性奈米顆粒為CNT,其以總樹脂含量之約0.5重量%至約1.5重量%範圍內之量存在。如本文中所使用,「重量%」係指重量百分比。
碳面紗
碳面紗為面積重量為約1gsm(g/m2)至約30gsm(包括約2gsm至約10gsm,及於一些實施例中,約2gsm至約6gsm)之隨意排列纖維的輕質、非編織面紗。
該面紗之纖維為可經金屬塗覆之碳纖維。金屬塗層可為任何適宜金屬,包括(但不限於)銀、金、鉑、鈀、鎳、銅、鉛、錫、鋁、鈦、合金及其混合物。
該非編織面紗係由混合、隨意排列之纖維及少量用於將該等纖維固定在一起之聚合黏合劑組成。希望提供具有足量黏合劑以將纖維固定在一起之非編織面紗,但該黏合劑的量足夠小以使所得面紗對於液體(諸如液體樹脂)而言為可通透的/有孔的。為此,黏合劑之量基於該面紗之總重量計為少於30重量%。典型黏合劑包括聚乙烯醇(PVA)、聚酯、苯乙烯丙烯酸、乙烯基丙烯酸、環氧樹脂、苯氧基、聚胺基甲酸酯、聚醯胺、丙烯酸酯、其混合物及共聚物。適宜碳面紗之一實例為由Technical Fiber Products Ltd.(TFP,U.K.)提供之OptiveilTM。
於一些實施例中,該非編織面紗具有可撓性及自撐性,意為其
不需要支撐載體。此外,該非編織面紗為未附著至另一層纖維之單層材料。該非編織面紗之纖維可係短切或連續纖維長絲或其組合。
該面紗中之大多數非編織纖維可具有於約0.01至約15微米範圍內之橫截面直徑。於一些實施例中,大部分該等纖維之直徑係於約4至約7微米之範圍內。
如上所討論之非編織碳面紗可藉由習知之濕成網(wet-laid)法(作為實例)生產。於濕成網法中,將濕潤短切纖維分散至含有黏合劑、及其他化學試劑(諸如表面活性劑、黏度調節劑、消泡劑等)之水漿液中。一旦將短切纖維引入漿液中,即劇烈攪動該漿液以使該等纖維變為分散。將含有該等纖維之漿液沉積至活動篩之上,其中大部分水被移除而形成網。視需要地,接著將液體黏合劑施覆至該網。將所得面紗乾燥以移除任何剩餘水,且若需要,使黏合劑固化。所得非編織面紗為以隨機方向排列之分散、個別纖維絲之組件。當需要纖維及/或重量之均勻分佈時,通常使用濕成網法。
於一實施例中,該碳面紗之至少一側上用如於已公開之美國專利公開案第2011/10159764號中所述之薄層金屬金屬化,該案以引用之方式併入本文中。或者,亦可使用任何其他當前技術之金屬化製程來生產金屬塗覆面紗,其包括物理沉積(諸如濺鍍、燒結)、及電解沉積。於一實施例中,該金屬塗覆碳面紗具有約1gsm至約30gsm、或約1gsm至約15gsm之面積重量、及約5重量%至約50重量%之金屬含量(基於該面紗之總重量計)。
聚合性增韌顆粒
適於本文中目的之聚合性增韌顆粒包括熱塑性或彈性顆粒。此等聚合性增韌顆粒不具有導電性塗層(諸如金屬)。
於一些實施例中,該等聚合性增韌顆粒包括於固化期間實質上不溶於複合材料之熱固性基質樹脂,且在固化後於固化樹脂基質中呈
離散顆粒之顆粒。於某些實施例中,不溶性聚合性顆粒亦為在固化期間之複合材料之熱固性基質樹脂中之可膨脹顆粒。如上所討論,亦可使用不溶性聚合性顆粒與可溶性熱塑性顆粒之組合作為額外增韌劑。
於一些實施例中,增韌顆粒係以約2重量%至約20重量%(包括約5重量%至約15重量%、及約8重量%至約12重量%)之含量(基於含於複合材料中之基質樹脂之總重量計)均勻分散於形成在相鄰增強纖維層間的層間區域。
該等聚合性增韌顆粒可為任何三維形狀,且於一些實施例中,其等實質上為球形。於一些實施例中,該等增韌顆粒具有少於5:1之縱橫比,例如,該縱橫比可為約1:1。就增韌顆粒而言,術語「縱橫比」係指顆粒之最大橫截面尺寸與該顆粒之最小橫截面尺寸之比。
對於球形顆粒(有約為1:1之縱橫比),平均粒度係指其直徑。對於非球形顆粒,該平均粒度係指顆粒之最大橫截面尺寸。
對於本文中所揭示之目的,該聚合性增韌顆粒可具有小於約100μm之平均粒度(d50),例如,於約10μm至約50μm之範圍內、或於約15μm至約30μm之範圍內。如本文中所揭示之平均粒度可藉由雷射繞射技術測量,例如,使用於0.002奈米至2000微米範圍內操作之Malvern Mastersizer 2000。「d50」代表粒度分布之中值,或者為在此分佈內使得50%之顆粒具有此粒度值或小於此粒度值之值。
於一些實施例中,該等聚合性增韌顆粒之尺寸相較於該等導電性奈米顆粒更大。例如,該等聚合性增韌顆粒之平均粒度(d50)可比該等導電性奈米顆粒之最小尺寸大至少100倍。
實例為,當導該等電性奈米顆粒為碳奈米管時,該等增韌顆粒之平均粒度(d50)比碳奈米管之直徑大至少100倍、或大1000倍。
判斷某些顆粒係不溶或可溶涉及到該等顆粒在所處特定樹脂系統中之溶解性。該樹脂系統可包含一或多種熱固性樹脂、固化劑及/
或觸媒、及用於調節未固化或固化基質樹脂之性質之少量可選添加劑。
可使用熱載臺顯微鏡(Hot stage microscopy)確定顆粒在樹脂系統中為不溶、部分可溶、或可膨脹。首先,藉由顯微鏡表徵乾燥聚合性顆粒(不與樹脂組合)之樣本,及使用來自自the National Institutes of Health(Bethesda,Maryland,USA)之Image J軟體分析圖像,來確定平均粒度及體積。其次,透過機械混合將顆粒之樣本分散於期望的基質樹脂。再次,將所得混合物之樣本置於顯微鏡載玻片上,接著將該載玻片置於顯微鏡下方之熱載臺設置中。然後,將該樣本以所欲變溫速率加熱至所需固化溫度,繼而以10幀每秒連續記錄該等顆粒之任何尺寸、體積或形狀改變。一般針對球形顆粒測量直徑,而測量最長邊係就非球形顆粒而言,從而使用Image J軟體測定尺寸及體積改變。所有熱載臺測試可在不含固化劑或觸媒之基質樹脂之10重量%顆粒負載率下進行。
當在增韌顆粒經歷上述熱載臺顯微鏡分析及該顆粒相較初始「乾燥」顆粒之直徑或體積改變量為零或小於5%時,該顆粒則被認為係不可溶的、及不可膨脹的。當增韌顆粒經歷上述熱載臺顯微鏡分析及該粒子之直徑或體積增加大於5%時,該顆粒則被認為係「可膨脹的」且不可溶的。該膨脹係因周圍樹脂灌注至顆粒之外表面中而引起的。
於一些實施例中,不溶性顆粒包括在熱載臺顯微鏡分析期間會熔化但不與基質樹脂相容,且因此在冷卻時會再形成為離散顆粒之顆粒。僅就分析目的而言,該等不溶性顆粒可在熱載臺顯微鏡分析期間流動及結晶度亦可改變。
於直徑或體積難以測定之情況下,可使用替代分析。可根據固化時間表製造由單向預浸材帶及含有10%之顆粒負載(基於富樹脂層
間區域中之總基質樹脂之重量計)之16層準各向同性複合面板,及隨後從橫截面方向切割固化面板,以藉由顯微鏡評估。若固化後該等顆粒仍為可識別、離散顆粒,則該等顆粒可被認為不溶性顆粒。若該等顆粒完全溶解於該層間區域及包圍纖維床之樹脂,且於冷卻時不可作為離散顆粒識別,則該等顆粒不被認為係不溶性層間顆粒。
對於環氧基基質樹脂,不溶性聚合性顆粒之組合物可含有至少一種選自以下之聚合物:脂族聚醯胺(PA)、環脂族聚醯胺、芳族聚醯胺、聚鄰苯二甲醯胺(PPA)、聚芳醚酮(PAEK)(諸如聚醚醚酮(PEEK)及聚醚酮酮(PEKK))、聚苯硫醚(PPS)、聚醯胺醯亞胺、液晶聚合物(LCP)、其共聚物、及其衍生物。於一些實施例中,該等聚合性顆粒之組合物含有至少一種選自以下之彈性聚合物或物質:交聯聚丁二烯、聚丙烯酸系化合物、聚丙烯腈、聚苯乙烯、其共聚物、及其衍生物(例如,由Zeon Chemicals Inc.銷售之DuoMod DP5045)。
於一些實施例中,該等不溶性顆粒為在固化製程期間不會溶解且作為離散顆粒留存在固化複合材料之層間區域中之不溶性熱塑性顆粒。適宜不溶性熱塑性顆粒之實例包括聚醯胺醯亞胺(PAl)顆粒及聚醯胺(PA)顆粒(例如,尼龍),及聚鄰苯二甲醯胺(PPA)顆粒,其等在固化週期期間不溶於環氧樹脂系統中。
特定等級之聚醯亞胺顆粒可能適合作為不溶性增韌顆粒。例如,自二苯甲酮四羧酸二酐(BTDA)、4,4'-亞甲基二苯胺(MDA)、及2,4-甲苯二胺(TDA)製得,且具有包含介於90及92%之間之芳族碳之非鄰苯二甲醯亞胺碳含量之聚醯亞胺。
已發現,不溶性熱塑性顆粒作為層間增韌劑可有效避免損失熱/濕性能。因為該等熱塑性顆粒即使在固化之後仍不溶於基質樹脂中,故其可賦予固化樹脂經改良之韌性、損傷耐受性、熱/濕性能、加工性、抗微龜裂性、及經降低之溶劑敏感性。
製造於本文中所描述之不溶性顆粒之方法可包括(以任何順序)乳化、沈澱、乳化聚合、洗滌、乾燥、擠壓、碾磨、研磨、冷研磨、噴射研磨及/或篩分顆粒。熟習該項技術者將明瞭,可藉由任何此項技術中已知之諸多方法實現此等步驟。
出於本文預期目的使用之不溶性顆粒包含交聯熱塑性顆粒。根據一實施例,該交聯熱塑性顆粒係由藉由使具有一或多個反應性基團之一種或更多種可交聯熱塑性聚合物與對該等反應性基團具化學反應性之交聯劑反應所建立的交聯網絡(crosslinking network)所組成,其中該交聯劑藉由該等反應性基團直接使該等聚合物鏈彼此交聯。該等反應性基團可為聚合物主鏈上之端基或側基。可將該實施例之直接交聯反應描述為藉由利用一或多個反應性基團直接使聚合物鏈交聯而「綁繫(tying-up)」該等聚合物分子。
可藉由如已於2010年12月2日公開之美國專利申請公開案第2010/0304118號中所述之方法生產以上交聯熱塑性顆粒,其全文以引用之方式併入本文。此方法包括將有反應性官能團之熱塑性聚合物、交聯劑、及觸媒溶解於不會與水混溶之常見溶劑中。接著,在水中藉由使用非離子表面活性劑產生乳液,藉此形成乳化顆粒。該等乳化顆粒隨後經乾燥及固化,以致聚合鏈呈化學性交聯。反應條件及交聯劑之類型將決定顆粒之最終性質。反應條件諸如溫度會導致更大程度之交聯。較佳為有兩個或更多個反應活性部位(即官能團)之交聯劑。所得交聯熱塑性顆粒為可添加至可固化樹脂之離散、自由移動顆粒。此等交聯熱塑性顆粒於固化期間亦可在可固化樹脂中膨脹。
易於交聯之帶有反應性基團之適宜熱塑性聚合物的實例包括(但不限於)以下一或多者:聚醚、聚碳酸酯、聚醚醯亞胺(PEl)、聚醯胺、聚醯亞胺、聚碸、聚醚碸(PES)、聚苯醚(PPO)、聚醚酮、聚芳醚酮(PAEK)(諸如聚醚醚酮(PEEK)及聚醚酮酮(PEKK))、聚苯硫醚
(PPS)、聚羥基醚、苯乙烯-丁二烯、聚丙烯酸酯、聚羥丙酮、聚對苯二甲酸丁二酯、聚醯胺-醯亞胺、聚醚醚碸(PEES)、其摻合物、或其共聚物、PES均聚物(諸如來自Sumitomo Chemical Co.之SUMIKAEXCEL 5003P或來自Solvay之Radel® PES)、或PEES均聚物。PES共聚物之具體實例包括具有不同重複單位比值之PES/PEES共聚物。上述之熱塑性塑料可作為單一組分使用以形成顆粒,或當使用多於一種熱塑性聚合物時,形成混合結構、或混合顆粒。
於其他實施例中,該等交聯熱塑性顆粒係由熱塑性聚合物之摻合物形成。於其他實施例中,於本文中所描述之交聯顆粒可由其中使用兩種或更多種熱塑性聚合物之混合結構形成。
可交聯之熱塑性聚合物上之反應性基團可為以下之一種或更多種:胺、羥基、酸酐、縮水甘油基、羧酸、馬來醯亞胺、異氰酸酯、酚醛樹脂、橋亞甲基四氫化鄰苯二甲醯亞胺、氰酸酯、乙炔、乙烯基、乙烯基酯、二烯、或其衍生物。在某些情況下,聚合物鏈上的不飽和可作為交聯點(對於丙烯酸及甲基丙烯酸族及一些不飽和橡膠、乙烯基酯或不飽和聚酯)。反應性基團之數目可為每鏈上最少一個反應性基團及(於一些實施例中)被認為係建立連接聚合物主鏈所需之最低比例;為生產緊密交聯聚合物或互穿網絡,較佳為數目為約一或大於一。具有大於2之官能度之聚合物將易於生產高反應凝膠。
取決於熱塑性聚合物端基之化學性質/官能度,可選擇具有多個反應性部位之適宜多官能交聯劑。此等交聯劑之實例為:烷基化三聚氰胺衍生物(例如CYMEL® 303)、酸氯化物(例如1,3,5-苯三醯三氯)、多官能環氧樹脂(例如,ARALDITE® MY0501、MY721)、羧酸(例如苯四甲酸)。
於另一實施例中,該交聯熱塑性顆粒由互穿聚合物網絡(IPN)所組成,其係由與獨立交聯網絡纏結之熱塑性聚合物鏈構成。該IPN係
藉由在熱塑性聚合物存在下使具有一或多個反應性基團之一或多種化合物(例如,交聯單體或交聯聚合物)與對該等反應性基團具化學反應性之交聯劑反應而建立。該反應(其係在特定交聯或固化條件下發生)使得該等化合物經由該等反應性基團而交聯,因而形成獨立交聯的網絡。因此,該等熱塑性聚合物鏈可在分子水平上與獨立交聯網絡纏結以形成IPN。此方法可描述成藉由形成個別及獨立交聯網絡,藉此建立互穿網絡而「綁繫」該等熱塑性聚合物鏈。因此,於該實施例中,該熱塑性聚合物上不需要具有反應性基團。可藉由如美國專利專利案第8,846,818號中所述之方法生產此類型交聯顆粒,其內容以全文引用之方式併入本文。所得交聯熱塑性顆粒為可添加至可固化樹脂之離散顆粒。此等交聯熱塑性顆粒於固化期間亦可在可固化樹脂中膨脹。
作為一實例,具有IPN之交聯顆粒可藉由以下建立:(i)形成含有熱塑性聚合物、多官能環氧樹脂及能夠使該環氧樹脂交聯之胺固化劑之乳液;(ii)自該乳液移除溶劑並收集呈固體顆粒形式之濃縮物;(iii)乾燥該等顆粒接著再進行固化(例如,藉由加熱),以致該環氧樹脂變得交聯。由於固化的結果,該交聯環氧樹脂於各顆粒中與該熱塑性聚合物形成IPN。
該等可膨脹、交聯熱塑性顆粒亦於固化期間與其等所處之周圍基質樹脂形成「梯度介面」。如本文所用之術語「梯度介面」係指該等顆粒各者與該周圍基質樹脂之間之逐漸且強力之介面。藉由使用熱力學上與熱固性樹脂(例如環氧樹脂)相容之工程化交聯熱塑性顆粒可獲得梯度介面。交聯熱塑性顆粒之核中熱塑性聚合物之濃度在中心處最大,並隨著基質樹脂自外表面進入顆粒且移向核,而朝向顆粒之外表面逐漸減小。這種熱塑性聚合物濃度自熱塑性顆粒之核至外表面之逐漸減小在該等熱塑性顆粒各者與該周圍基質樹脂之間會形成梯度介面。因此,熱固性樹脂及熱塑性顆粒之間沒有極明顯之輪廓或過渡。
若呈現極明顯之輪廓或過渡,則相較於包含梯度介面之複合材料,複合材料中熱塑性顆粒及熱固性樹脂之間之該介面將遠遠較弱。因此,此等交聯熱塑性顆粒被視為係「可膨脹」,此乃因當在將樹脂加熱時包圍該顆粒之樹脂可透過該顆粒之外表面擴散至顆粒中,且其黏度降低,因而導致粒度增加。然而,該等交聯顆粒在樹脂固化之後將呈離散且可識別之顆粒存在。
本文中所描述之交聯熱塑性顆粒為可添加至可熱固性樹脂(諸如環氧基樹脂)之離散、自由移動顆粒(即呈分割狀態),及其等以化學方式交聯,以防止其在樹脂固化週期期間總體溶解於樹脂中。此外,將其等設計為熱力學上與熱固性樹脂相容。
本文所用「離散顆粒」係指可在基質樹脂中識別且可藉由使用掃描電子顯微鏡(SEM)、光學顯微鏡、或示差干涉相差顯微鏡(DIC)偵測之顆粒。
在使用時,可溶性熱塑性顆粒包含選自聚芳颯(例如聚醚碸(PES))、聚醚醚碸(PEES)、聚醚醯亞胺(PEl)及聚醯亞胺(PI)之微粒熱塑性聚合物。如先前所述,此等可溶性熱塑性顆粒係指當加熱其混合物時或於基質樹脂之固化週期期間可溶解於周圍樹脂基質,且不會在已固化基質樹脂中呈離散顆粒之固體顆粒(例如粉末)。如本文中所使用,「溶解」於該周圍樹脂意指與該樹脂形成均質相或連續相。
基質樹脂
用於浸漬/灌注該增強纖維之可固化樹脂基質(或樹脂組合物)係指可含有一或多種未固化熱固性樹脂之可硬化或可熱固性樹脂,其包含(但不限於)環氧樹脂、醯亞胺(諸如聚醯亞胺及雙馬來醯亞胺)、乙烯基酯樹脂、氰酸酯樹脂、異氰酸酯改質之環氧樹脂、酚系樹脂、苯并噁嗪、甲醛縮合樹脂(諸如脲、三聚氰胺及苯酚)、不飽和聚酯、雜化物、摻合物及其組合。
合適的環氧樹脂包括芳族二胺、芳族單一級胺、胺基苯酚、多元酚、多元醇、多羧酸之聚縮水甘油基衍生物。合適的環氧樹脂之實例包括雙酚諸如雙酚A、雙酚F、雙酚S及雙酚K之聚縮水甘油醚;及基於甲酚及苯酚之酚醛樹脂之聚縮水甘油醚。
具體實例為4,4’-二胺基二苯基甲烷(TGDDM)之四縮水甘油衍生物、甲苯二酚二縮水甘油醚、三縮水甘油基-對-胺基苯酚、三縮水甘油基-間-胺基苯酚、溴雙酚F二縮水甘油醚、二胺基二苯基甲烷之四縮水甘油衍生物、三羥基苯基甲烷三縮水甘油醚、苯酚-甲醛酚醛清漆之聚縮水甘油醚、鄰甲酚酚醛清漆之聚縮水甘油醚或四苯基乙烷之四縮水甘油醚。
適用於該基質樹脂中之市售環氧樹脂包括N,N,N',N'-四縮水甘油基二胺二苯基甲烷(例如來自Huntsman之MY 9663、MY 720及MY 721)、N,N,N',N'-四縮水甘油基-雙(4-胺基苯基)-1,4-二異丙苯(例如來自Momentive之EPON 1071)、N,N,N',N'-四縮水甘油基-雙(4-胺基-3,5-二甲基苯基)-1,4-二異丙苯(例如來自Momentive之EPON 1072)、對胺基苯酚之三縮水甘油醚(例如來自Hunstman之MY 0510)、間胺基苯酚之三縮水甘油醚(例如來自Hunstman之MY 0610)、基於雙酚A之材料(例如2,2-雙(4,4'-二羥基苯基)丙烷)之二縮水甘油醚(例如來自Dow之DER 661,或來自Momentive之EPON 828)及於25℃下之黏度較佳為8至20Pa.s之酚醛清漆樹脂、苯酚酚醛清漆樹脂之縮水甘油醚(例如來自Dow之DEN 431或DEN 438)、二環戊二烯基酚系酚醛清漆(例如來自Huntsman之Tactix 556)、1,2-鄰苯二甲酸二縮水甘油酯(例如GLY CEL A-100)、二羥基二苯基甲烷(雙酚F)之二縮水甘油基衍生物(例如來自Huntsman之PY 306)。其他適宜環氧樹脂包括環脂族,諸如3',4'-環氧基環己基-3,4-環氧基環己烷羧酸酯(例如,來自Huntsman之CY 179)。
一般而言,該可固化基質樹脂包含一或多種熱固性樹脂,且可與其他添加劑組合,諸如固化劑、固化觸媒、共聚單體、流變控制劑、增黏劑、無機或有機填充劑、作為增韌劑之熱塑性及/或彈性聚合物、穩定劑、抑制劑、顏料、染料、阻燃劑、反應性稀釋劑、及為熟習此項技藝者熟知用於改良固化前或後基質樹脂性質之其他添加劑。
適用於該可固化基質樹脂組合物之增韌劑包括(但不限於)均聚物或共聚物,其係單獨存在或與以下物質組合:聚醯胺、共聚醯胺、聚醯亞胺、芳族聚醯胺、聚酮、聚醚醯亞胺(PEI)、聚醚酮(PEK)、聚醚酮酮(PEKK)、聚醚醚酮(PEEK)、聚醚碸(PES)、聚醚醚碸(PEES)、聚酯、聚胺基甲酸酯、聚碸、多硫化物、聚苯醚(PPO)及改質PPO、聚(環氧乙烷)(PEO)及聚環氧丙烷、聚苯乙烯、聚丁二烯、聚丙烯酸酯、聚甲基丙烯酸酯、聚丙烯酸系化合物、聚苯碸、高性能烴聚合物、液晶聚合物、彈性體及嵌段式彈性體。
可視需要於可固化基質樹脂中添加固化劑及/或觸媒,但使用該等固化劑及/或觸媒可提高固化速率及/或降低固化溫度(若需要)。適宜地,該固化劑係選自已知之固化劑,例如,芳族或脂族胺、或胍衍生物。芳族胺固化劑為較佳,較佳係每分子具有至少兩個胺基之芳族胺,且尤佳係二胺基二苯基碸,例如,其中胺基在相對於碸基之間-或對-位置。特定實例為3,3'-及4-,4'-二胺基二苯基碸(DDS);亞甲基二苯胺;雙(4-胺基-3,5-二甲基苯基)-1,4-二異丙基苯;雙(4-胺基苯基)-1,4-二異丙基苯;4,4’亞甲基雙-(2,6-二乙基)-苯胺(來自Lonza之MDEA);4,4’亞甲基雙-(3-氯-2,6-二乙基)-苯胺(來自Lonza之MCDEA);4,4’亞甲基雙-(2,6-二異丙基)-苯胺(來自Lonza之M-DIPA);3,5-二乙基甲苯-2,4/2,6-二胺(來自Lonza之D-ETDA 80);4,4’亞甲基雙-(2-異丙基-6-甲基)-苯胺(來自Lonza之M-MIPA);4-氯苯基-
N,N-二甲基-脲(例如Monuron);3,4-二氯苯基-N,N-二甲基-脲(例如DIURON TM)及二氰基二醯胺(例如,來自Pacific Anchor Chemical之AMICURE TM CG 1200)。
適宜之固化劑亦包括酸酐,特別是多羧酸酐,諸如耐地酸酐(nadic anhydride)、甲基耐地酸酐(methylnadic anhydride)、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、內伸甲基四氫鄰苯二甲酸酐、及偏苯三甲酸酐。
層間區域中可固化基質樹脂亦係含有一種或更多種如上所討論之類型之未固化熱固性樹脂之可硬化或可熱固性樹脂。於某些實施例中,層間區域中該可固化基質樹脂係與含有增強纖維之區域中之基質樹脂相同。於其他實施例中,層間區域中該樹脂係與含有增強纖維之區域中之基質樹脂不同。
增強纖維
基於本文目的之增強纖維包含具有高拉伸強度(例如,大於500ksi(或3447MPa))之碳或石墨纖維。該等增強纖維可呈由多根細絲製成之連續束之形式,呈連續單向或多向纖維、或呈編織織物或多軸向織物。單向纖維係指僅於一個方向上伸展(或延伸)之纖維。多軸向織物包括非捲曲織物。於一些實施例中,該等增強纖維係呈單向纖維或編織織物,而非非編織層之形式。此外,該等碳纖維可為經上膠或未經上膠。
就結構應用而言,預浸材或複合材料內該等增強纖維之含量可為於30體積%至70體積%之範圍內,於一些實施例中,50體積%至70體積%。
複合預浸材及層壓板之製造
如本文所使用之術語「預浸材」係指至少一部分纖維體積已被可固化樹脂組合物浸漬之纖維薄片或層。用於製造航太結構之預浸材
通常為單向增強纖維(例如碳纖維)之樹脂浸漬片,其通常稱為「帶」或「單向帶」。該等預浸材可為經完全浸漬之預浸材或經部分浸漬之預浸材。浸漬增強纖維之基質樹脂可呈部分固化狀態或未固化狀態。如文中所用術語「浸漬」係指已經歷浸漬製程之纖維,藉此該等纖維係至少部分經基質樹脂包圍或被包埋入基質樹脂中。
通常地,該預浸材係呈可彎曲或可撓性形式,其準備好鋪放及模製形成三維結構,隨後固化成最終複合部件/結構。此類型預浸材尤其適用於製造承重結構部件,諸如飛機機翼、機身、艙壁及操縱面。該等經固化預浸材之重要性質係高強度及剛度加上經降低的重量。
為形成複合結構,可將複數個預浸材層以堆疊順序鋪放於工具上以形成「預浸材疊層」。該疊層中之該等預浸材層可以相對於彼此的所選擇定向定位,例如0°、±45°、90°等。可藉由可包括(但不限於)手工疊層(hand lay-up)、自動化鋪帶疊層(automated tape layup)(ATL)、先進纖維鋪放(advanced fiber placement)(AFP)及長絲纏繞(filament winding)之技術製得預浸材疊層。
根據一實施例,特定量之導電性奈米顆粒及聚合性增韌顆粒係於碳增強纖維之浸漬之前(即製造預浸材之前)與可固化樹脂組合物混合。於此實施例中,首先藉由將含有顆粒之樹脂組合物塗覆至離型紙之上製造樹脂膜。其次,藉助加熱及壓力將一片或兩片此樹脂膜層壓至碳纖維層之一側或兩側以浸漬該等纖維,藉此形成有特定纖維面積重量及樹脂含量之經樹脂浸漬之纖維層(或預浸材層)。在層壓製程期間,過濾出該等增韌顆粒,且因該等顆粒之尺寸大於纖維長絲間間距之事實其仍在該纖維層外部。隨後,將其中含有增韌顆粒之兩層或更多層預浸材層逐一往上疊合形成複合疊層,並於相鄰預浸材層間置放非編織碳面紗。因該層壓製程,將該等聚合性增韌顆粒及該碳面紗放
置於兩個相鄰碳纖維層間之層間區域內。當藉助施加壓力固結該疊層時,因該碳面紗之厚度及多孔特性,至少一些聚合性增韌顆粒及至少一些導電性奈米顆粒穿透該碳面紗。在固化時,該碳面紗變成包埋於層間區域之基質樹脂內。於此實施例中,層間區域中該基質樹脂係與浸漬增強纖維之基質樹脂相同,且該等導電性奈米顆粒均勻分散至整個基質樹脂中。
於圖4中示意性繪示之另一實施例中,將含有導電性奈米顆粒及聚合性增韌顆粒之可固化樹脂膜41、及碳面紗42層壓至碳纖維層43之各側之上,因此將面紗42夾在各樹脂膜41及該碳纖維層43之間。藉助加熱及壓力進行層壓以浸漬該等纖維,藉此形成有特定纖維面積重量及樹脂含量之預浸材層。在層壓製程期間,該等聚合性顆粒被過濾出及仍留存在該纖維層外部,且至少一些聚合性顆粒及至少一些導電性奈米顆粒可穿透該面紗。將複數個此預浸材層疊放以形成有碳面紗、導電性奈米顆粒及包埋在層間區域中之聚合性顆粒之複合材料層壓板。
於一替代性實施例中,改進參考圖4描述之方法,從而可固化樹脂膜41含有已分散之導電性奈米顆粒而非聚合性增韌顆粒。接著該所得複合材料層壓板含有碳面紗及包埋在層間區域之導電性奈米顆粒。
根據另一實施例,特定量之導電性奈米顆粒係於碳增強纖維之浸漬之前(即製造預浸材之前)與可固化樹脂組合物混合。於此實施例中,首先藉由將含有顆粒之樹脂組合物塗覆至離型紙之上製造樹脂膜。其次,藉助加熱及壓力將一片或兩片此樹脂膜層壓至碳纖維層之一側或兩側以浸漬該等纖維,藉此形成有特定纖維面積重量及樹脂含量之經樹脂浸漬之纖維層(或預浸材層)。隨後,將兩層或更多層預浸材層逐一往上疊合形成複合疊層,並於相鄰預浸材層間置放有非編織碳面紗。因該層壓製程,將該碳面紗放置於兩相鄰碳纖維層間之層間
區域內。當固結該疊層時,至少一些導電性奈米顆粒因該碳面紗之厚度及多孔特性穿透該碳面紗。在固化時,該碳面紗變成包埋於層間區域之基質樹脂內。於此實施例中,層間區域中該基質樹脂係與浸漬增強纖維之基質樹脂相同,且該等導電性奈米顆粒均勻分散於整個基質樹脂中。
可於至多約200℃(例如,於約170℃至約190℃之範圍內)之溫度下使本文所揭示之複合材料和預浸材疊層固化,並視需要使用高壓以抑制逸出氣體之變形效應或抑制空隙形成。適宜壓力為至多10bar(1MPa),例如,於約3bar(0.3MPa)至約7bar(0.7MPa)之範圍內。於一些實施例中,該固化溫度係藉由以至多5℃/分鐘(例如,2℃/分鐘至3℃/分鐘)加熱來獲得,並維持至多9小時至多6小時(例如2至4小時)之所需時間。於基質樹脂中使用觸媒可允許甚至更低之固化溫度。可完全釋放壓力並可藉由以至多5℃/分鐘(例如,至多3℃/分鐘)冷卻來降低溫度。可於在190℃至350℃範圍內的溫度及大氣壓下進行後固化,使用適宜加熱速率來提高該基質樹脂之玻璃轉化溫度。
應用
文中所述組合物可用於製造鑄造或模製結構材料,且係尤其適用於製造具有改良體積導電率之纖維增強型承重或耐衝擊複合結構。
本文中所揭示之複合材料可應用於製造運輸應用(包括航太、航空、航海及陸地交通工具、汽車、及鐵路)之組件。例如,可使用該等複合材料製造主要及次要飛機結構、空間及彈道結構。此等結構組件包括複合機翼結構。本文中所揭示之該等複合材料亦可應用於建築及建造應用、及其他商業應用。顯然,該等複合材料係特別適用於製造承重或耐衝擊結構。
實例:
測量方法
根據以下用於測量Z-方向導電率及機械特性之步驟測試以下實例中所製造之複合樣品。
導電率測量
表1中定義測試樣品之尺寸及公差。
將樣品表面拋光以移除過量樹脂;接著使用銀膏在相對的表面上建立兩個電極。將樣品夾在兩塊銅板之間,以減小電線與樣品表面之接觸電阻。
根據4線伏特安培測量方法使用Keithley 6221/2182A DELTA型系統測定Z-方向DC導電率。
準備測試樣品(1英吋x 1英吋),並藉由施加10mA電流進行測試。在將該電流穩定於2%之內後,記錄電極之間電勢電壓值。根據下式計算Z-方向電阻率及導電率:電阻率(p)[ohm-m]=(V/I)/t˙A
導電率(σ)(S/m)=1/p
其中:V=電勢電壓(伏特)
I=強制電流(安培)
T=具有z尺寸之樣品之厚度(m)
A=X尺寸乘Y尺寸之橫截面面積(m2)
於25℃標準濕度條件下進行測量。記錄平均值及對應標準偏差結果。
機械特徵
根據表2中記錄之方法進行測量機械性能之測試。
表2中RT表示室溫。
實例1
基於表3中所揭示調配物製備四種不同樹脂組合物。對照1.1及對照2.1為兩個具有或沒有層間顆粒之基線樹脂系統,及樹脂1.0及樹脂2.0為其兩個經MWCNT改質形式。以重量/重量之百分比(w/w)形式記錄該等組合物。
Araldite® PY306為獲自Huntsman之雙酚F二縮水甘油醚樹脂,Araldite® MY0510為獲自Huntsman之對胺基苯酚樹脂之三縮水甘油醚,SUMIKAEXCEL 5003P為獲自Sumitomo Chemical Co.之聚醚碸聚合物,MWCNT係指具有15nm之平均直徑、及約1nm之平均長度之多壁碳奈米管,TGP3551係指Vestasint® TGP3551,一種來自Evonik之聚醯胺粉末,其在固化時不溶解,P84顆粒為具有44微米之平均粒度分佈d50之芳族聚合物顆粒,其於固化時膨脹及溶解入樹脂中,交聯TP顆粒為來自Cytec Industries Inc.之具有25微米之平均粒度的交聯PES-PEES顆粒,及4,4’DDS係指4,4'-二胺基二苯基碸。
將預定量之MWCNT分散入環氧樹脂混合物。接著將其餘組分添加至母料並混合直至獲得均質混合物。
隨後使用熱熔型浸漬製程,使用該等樹脂組合物製備四種不同單向(UD)預浸材。藉由將樹脂組合物塗覆至離型紙之上製造樹脂膜。隨後,藉助加熱及壓力將兩片此等樹脂膜層壓至單向碳纖維層(來自Toho Tenax之IM65E,USA)之連續層之兩側以形成預浸材。於表4中顯示該等預浸材之特性。所示之百分比(%)為重量百分比。
藉由堆疊該等預浸材製造複合材料層壓板,以形成具有準各向同性構形之疊層(各疊層為約0.110英吋厚),隨後固結及在高壓釜中於177℃下固化2小時。根據相同步驟製備一些層壓板,但於堆疊之前將單一4gsm非編織碳面紗壓至該預浸材之一側之上,從而該碳面紗係兩相鄰預浸材之間的中間層。
各非編織碳面紗係由中間模數碳纖維組成,且使用濕式(wet laid)(即造紙)製程及作為黏合劑之環氧-胺基甲酸酯共聚物之乳液製造該膜。該碳面紗為極薄且多孔,從而該等熱塑性顆粒(當存在時)於該等疊層固結期間穿透該面紗。
測量該已固化層壓板之z-方向導電率及於表5中記錄結果。所示之百分比(%)為重量百分比。
結果顯示,碳奈米管及碳面紗之組合可提高該已固化層壓板之Z-方向導電率,該提高遠大於藉由加總分別僅經兩種碳材料之一者改質之樹脂系統所獲得的導電率值預期之值。
對於無層間增韌顆粒之層壓板,層壓板5.3具有65.22S/m之z-方向導電率值,其遠大於僅具有MWCNT之層壓板5.1之導電率值(15.3S/m)及僅具有碳面紗之層壓板5.2之導電率值(8.01S/m)之和。圖5為表5中所記錄之z-方向導電率結果的圖示小結,顯示無增韌顆粒下MWCNT及碳面紗之協同效果。
對於具有層間增韌顆粒之層壓板,測得層壓板6.3之z-方向導電率值為31.46S/m。此值遠大於僅具有MWCNT之層壓板6.1之導電率值(5.54S/m)及僅含有碳面紗之層壓板6.2之導電率值(11.07S/m)之和。圖6為表5中所記錄之z-方向導電率結果的圖示小結,顯示存在增韌顆粒下MWCNT及碳面紗之協同效果。
據信層壓板5.3及6.3所達到之高導電率值係導電性面紗及MWCNT間協同效果之結果。此等正相互作用在具有層間增韌顆粒及不具有層間增韌顆粒之複合材料中顯而易見。此外,碳面紗及MWCNT之存在在相鄰結構纖維層間產生定義明確的層間區域。此效
果亦減少電子測量之變異係數(COV)。
實例2
基於表6中所揭示調配物製備三種不同樹脂組合物。以重量/重量(w/w)之百分比形式記錄組合物。對照7.0為基線顆粒增韌樹脂系統;樹脂7.1及樹脂7.2為其碳改質形式。選擇相對低濃度之碳填料以製備有適用於標準預浸材製程之流變特徵的調配物。
Vestamid® Z2649為固化時不溶於樹脂系統之來自Evonik的聚醯胺10,10粉末。所使用之碳黑係由Timcal,UK提供之Ensaco 250。
首先將預定量之碳填料(MWCNT或碳黑)分散至環氧樹脂組分中。接著將其餘組分添加至母料並混合直至獲得均質混合物。
隨後藉由熱熔型浸漬製程使用三種樹脂組合物製備不同單向(UD)預浸材。於表7中顯示該等預浸材之特性。
藉由堆疊該等預浸材製造複合材料層壓板以形成具有準各向同性構形之0.118英吋厚疊層,隨後在高壓釜中於180℃下固化2小時。製備一些有單一4gsm非編織碳面紗(來自Technical Fibre Products之Optiveil®)之層壓板作為兩相鄰預浸材之間的中間層。測量該已固化層壓板之z-方向導電率及於表8中記錄結果。
觀察到添加相對低濃度之碳奈米管或碳黑僅可適度提高固化層壓板之z-方向導電率,如針對層壓板10.1(0.57S/m)及層壓板10.2(0.26S/m)所示。當僅使用具有低面積重量之碳面紗改質顆粒增韌預浸材(對照11.0)時,可達成一定程度改良(導電率=7.42S/m)。顯然,當使用碳填料及碳面紗之組合時,固化層壓板之Z-方向導電率之改良係遠大於加總僅經碳填料改質之層壓板之導電率值及僅經碳面紗改質之層壓板之導電率值所預期之值。
參考表8,層壓板11.1(碳面紗+MWCNT)產生12.17S/m之z-方向導電率,其相比對照11.0(僅面紗)及層壓板10.1(僅MWCNT)之預期累加值(7.99S/m)大約50%。
觀察到經碳黑改質之樹脂系統具有相同趨勢。層壓板11.2產生18.09S/m之Z-方向導電率,其係超過對照11.0(僅面紗)及層壓板10.2(僅MWCNT)之預期累加值(7.68S/m)的兩倍。
圖7為表8中所記錄之z-方向導電率結果之圖示小結,顯示碳面紗及碳黑之協同效果。據信針對層壓板11.1及11.2測得之高導電率值係固化層壓板之層間區域內輕質碳面紗及導電性奈米顆粒之間之正向協同作用的結果。該協同作用可為固化時在導電性碳纖維微網絡內原位形成導電性奈米網絡的結果。
對固化層壓板進行機械測試及於表9中記錄結果。
結果顯示輕質碳面紗及奈米顆粒之組合未對複合材料之機械性能產生任何顯著變化。圖8顯示表9中所記錄之於230in-lbs衝擊力下之CAI結果的圖示小結。如從圖8之結果可見,該等CAI值實質上未受碳面紗或導電性奈米顆粒之存在影響。
Claims (20)
- 一種可固化複合材料,其包括:至少兩層經可固化基質樹脂浸漬之增強碳纖維;及形成於相鄰層之增強碳纖維間之層間區域,該層間區域包含(i)與浸漬該增強碳纖維的該基質樹脂相同或不同的可固化基質樹脂,(ii)分散遍及於在該層間區域之該基質樹脂中之導電性奈米尺寸顆粒,及(iii)未經塗覆的非編織碳面紗,其係包埋於在該層間區域之該基質樹脂中,其中該等導電性奈米尺寸顆粒各者之至少一維度小於約100nm,其中該非編織碳面紗包含隨意排列的未經塗覆的碳纖維且具有約1gsm至約10gsm之面積重量,且該導電性奈米尺寸顆粒及該非編織碳面紗係在該層間區域中僅有的導電成分。
- 如請求項1之可固化複合材料,其中該層間區域另外包括聚合性顆粒。
- 如請求項1之可固化複合材料,其中該導電性奈米尺寸顆粒係選自由下列組成之群之碳基、奈米尺寸結構:碳奈米管(CNT)、碳奈米纖維、碳奈米繩、碳奈米帶、碳奈米纖絲、碳奈米針、碳奈米片、碳奈米棒、碳奈米錐、具有捲軸形狀之碳奈米捲軸、碳奈米歐姆(nano-ohms)、碳黑顆粒、石墨奈米小板、石墨奈米點、石墨烯、及其組合。
- 如請求項3之可固化複合材料,其中該碳基、奈米尺寸結構為碳奈米管(CNT)。
- 如請求項1之可固化複合材料,其中該導電性奈米尺寸顆粒係以基於該複合材料中該基質樹脂之總重量計在約0.1重量%至約10重量%範圍內之量存在。
- 如請求項2之可固化複合材料,其中至少一些聚合性顆粒穿透該非編織碳面紗。
- 如請求項2之可固化複合材料,其中該等聚合性顆粒係以基於該複合材料中該基質樹脂之總重量計約2重量%至約20重量%的含量存在。
- 如請求項2之可固化複合材料,其中該等聚合性顆粒係不溶性熱塑性或彈性顆粒,且該等不溶性顆粒在該複合材料固化時仍於該層間區域處保持為離散顆粒。
- 如請求項8之可固化複合材料,其中該等聚合性顆粒係包括至少一種選自由下列組成之群之熱塑性聚合物的不溶性熱塑性顆粒:聚醯亞胺、聚醯胺醯亞胺、聚醯胺、聚鄰苯二甲醯胺、聚醚酮、聚醚醚酮、聚醚酮酮、聚芳醚酮、聚苯硫醚、液晶聚合物、及其共聚物。
- 如請求項8之可固化複合材料,其中該等聚合性顆粒係包括至少一種選自由下列組成之群之聚合性材料的不溶性彈性顆粒:交聯聚丁二烯、聚丙烯酸系化合物、聚丙烯腈、及聚苯乙烯。
- 如請求項2之可固化複合材料,其中該等聚合性顆粒係交聯顆粒,各顆粒包括以下中之一者:(a)藉由使具有一個或更多個反應性基團之可交聯熱塑性聚合物與對該等反應性基團具化學反應性之交聯劑交聯所建立之交聯網絡,及(b)包含與獨立交聯網絡纏結之熱塑性聚合物鏈之互穿聚合物網絡(IPN),其中該IPN係藉由使至少一種具有一或多個反應性基團之化合物、對該等反應性基團具化學反應性之交聯劑、及熱塑性聚合物反應所建立。
- 如請求項1之可固化複合材料,其中浸漬該等增強碳纖維之該可固化基質樹脂進一步包括分散各處之導電性奈米尺寸顆粒。
- 如請求項1之可固化複合材料,其中浸漬該等增強碳纖維之該基質樹脂包括一種或更多種熱固性樹脂。
- 如請求項13之可固化複合材料,其中該等熱固性樹脂係選自:環氧樹脂、醯亞胺、乙烯基酯樹脂、氰酸酯樹脂、酚系樹脂、苯并噁嗪、甲醛縮合樹脂、不飽和聚酯、及其組合。
- 如請求項1之可固化複合材料,其中至少一層增強碳纖維係呈連續單向纖維或編織織物之形式。
- 一種製造複合結構之方法,該方法包括:(a)形成複數個預浸材層,各預浸材層包括包埋於可固化基質樹脂中之增強碳纖維之纖維層、及分散於該基質樹脂各處之導電性奈米尺寸顆粒;(b)將該等預浸材層與至少一個未經塗覆的非編織碳面紗一同疊合成堆疊配置,以致將至少一個未經塗覆的非編織碳面紗放置於兩個相鄰預浸材層之間,從而形成層壓板;(c)藉助施加壓力使該層壓板固結;及(d)使該層壓板固化;其中該等導電性奈米尺寸顆粒各者之至少一維度小於100nm,且在(a)中,該增強碳纖維及該導電性奈米尺寸顆粒係在該預浸材層中僅有的導電成分,且其中該未經塗覆的非編織碳面紗包含隨意排列的未經塗覆的碳纖維且具有約1gsm至約10gsm之面積重量。
- 如請求項16之方法,其中(a)中之各預浸材層進一步包括鄰近該增強碳纖維之纖維層之至少一側放置的聚合性顆粒,及於(c)中之固結後,至少一些聚合性顆粒穿透該未經塗覆的非編織碳面紗。
- 一種製造複合材料之方法,該方法包括:(a)形成至少一個包括分散於其中之導電性奈米尺寸顆粒之可固化樹脂膜;(c)將該至少一個可固化樹脂膜與至少一個未經塗覆的非編織碳面紗及增強碳纖維之纖維層組合,以致將該非編織碳面紗放置於該樹脂膜與該纖維層之間;(e)對該可固化樹脂膜、該非編織碳面紗及該纖維層施加熱及壓力,以形成具有經樹脂浸漬之碳纖維及經樹脂浸漬之碳面紗之預浸材層,其中該等導電性奈米尺寸顆粒之至少一維度小於100nm,且係在(a)之該樹脂膜中僅有的導電材料,且其中該未經塗覆的非編織碳面紗包含隨意排列的未經塗覆的碳纖維且具有約1gsm至約10gsm之面積重量。
- 如請求項18之方法,其中(a)中之該至少一個可固化樹脂膜進一步包括聚合性顆粒,及於(e)中施加熱及壓力之後,至少一些聚合性顆粒穿透該非編織碳面紗。
- 如請求項18之方法,其中於(a)中形成兩個可固化樹脂膜,及於(c)中將兩個未經塗覆的非編織碳面紗與該等兩個樹脂膜及該纖維層組合,以致將該纖維層放置於該等兩個未經塗覆的非編織碳面紗之間,且各樹脂膜與該等未經塗覆的非編織碳面紗之一者接觸。
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