TWI676695B - 遮罩板及成膜方法 - Google Patents
遮罩板及成膜方法 Download PDFInfo
- Publication number
- TWI676695B TWI676695B TW107118376A TW107118376A TWI676695B TW I676695 B TWI676695 B TW I676695B TW 107118376 A TW107118376 A TW 107118376A TW 107118376 A TW107118376 A TW 107118376A TW I676695 B TWI676695 B TW I676695B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- mask
- plate
- pattern
- mask plate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000000873 masking effect Effects 0.000 claims abstract description 33
- 230000035699 permeability Effects 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 32
- 239000000696 magnetic material Substances 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 230000004907 flux Effects 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000859 sublimation Methods 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017168211A JP6471200B1 (ja) | 2017-09-01 | 2017-09-01 | マスクプレート及び成膜方法 |
| JP2017-168211 | 2017-09-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201912817A TW201912817A (zh) | 2019-04-01 |
| TWI676695B true TWI676695B (zh) | 2019-11-11 |
Family
ID=65356210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107118376A TWI676695B (zh) | 2017-09-01 | 2018-05-30 | 遮罩板及成膜方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6471200B1 (ko) |
| KR (1) | KR102132642B1 (ko) |
| CN (1) | CN109423602B (ko) |
| TW (1) | TWI676695B (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075639A (ja) * | 2000-08-29 | 2002-03-15 | Sony Corp | パターン形成装置、パターン形成方法、有機電界発光素子ディスプレイの製造装置及び製造方法 |
| JP2005302457A (ja) * | 2004-04-09 | 2005-10-27 | Toray Ind Inc | 蒸着マスクおよびその製造方法並びに有機電界発光装置の製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4506214B2 (ja) * | 2003-03-13 | 2010-07-21 | 東レ株式会社 | 有機電界発光装置およびその製造方法 |
| EP1802177A4 (en) * | 2004-09-08 | 2010-04-14 | Toray Industries | ORGANIC ELECTROLUMINESCENCE ELEMENT AND METHOD OF MANUFACTURING THEREOF |
| JP4428285B2 (ja) * | 2005-05-16 | 2010-03-10 | セイコーエプソン株式会社 | マスク保持構造、成膜方法、及び電気光学装置の製造方法 |
| JP2010085588A (ja) * | 2008-09-30 | 2010-04-15 | Sony Corp | 光学部品の製造方法および光学部品、並びに表示装置の製造方法および表示装置 |
| WO2013039019A1 (ja) * | 2011-09-14 | 2013-03-21 | トヨタ自動車東日本株式会社 | 光電変換デバイス用電極及び光電変換デバイス |
| JP2013093278A (ja) | 2011-10-27 | 2013-05-16 | Hitachi High-Technologies Corp | 有機ｅｌデバイス製造装置 |
| JP5825139B2 (ja) * | 2012-02-21 | 2015-12-02 | 大日本印刷株式会社 | 蒸着マスクの製造方法 |
| JP5516816B1 (ja) * | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
| CN103695842B (zh) * | 2013-12-31 | 2015-12-09 | 信利半导体有限公司 | 一种掩膜板及其制作方法 |
| KR20160035170A (ko) * | 2014-09-22 | 2016-03-31 | 삼성디스플레이 주식회사 | 마스크 조립체 및 이를 이용한 증착 장치 |
| CN106884139B (zh) * | 2017-03-20 | 2022-04-26 | 京东方科技集团股份有限公司 | 一种蒸镀掩膜版、其制作方法、电磁蒸镀装置及蒸镀方法 |
-
2017
- 2017-09-01 JP JP2017168211A patent/JP6471200B1/ja active Active
-
2018
- 2018-05-30 TW TW107118376A patent/TWI676695B/zh active
- 2018-07-18 CN CN201810788659.6A patent/CN109423602B/zh active Active
- 2018-08-30 KR KR1020180102540A patent/KR102132642B1/ko active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075639A (ja) * | 2000-08-29 | 2002-03-15 | Sony Corp | パターン形成装置、パターン形成方法、有機電界発光素子ディスプレイの製造装置及び製造方法 |
| JP2005302457A (ja) * | 2004-04-09 | 2005-10-27 | Toray Ind Inc | 蒸着マスクおよびその製造方法並びに有機電界発光装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109423602B (zh) | 2019-09-20 |
| KR102132642B1 (ko) | 2020-07-10 |
| KR20190025510A (ko) | 2019-03-11 |
| CN109423602A (zh) | 2019-03-05 |
| JP2019044228A (ja) | 2019-03-22 |
| TW201912817A (zh) | 2019-04-01 |
| JP6471200B1 (ja) | 2019-02-13 |
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