TWI674836B - Printed Circuit Board Suitable For A Top Shield Can And A Bottom Shield Can - Google Patents

Abstract

The invention provides a printed circuit board suitable for an upper shield cover and a lower shield cover. The design of adding an insulating layer on the printed circuit board can prevent the welding metal from overflowing when the shield cover and the printed circuit board are soldered. Avoid missing welding on the other side of the shielding cover or interference with the left and right pad welding.

Description

Printed circuit board suitable for upper shield and lower shield

The technology of the present invention relates to the field of electromagnetic interference prevention of circuit boards, and particularly to a printed circuit board that can avoid solder overflow when a shield cover is soldered to the printed circuit board.

An electronic device basically includes a printed circuit board (PCB) with one or more processing or driving elements, such as a driving circuit board of a display panel. These processing elements generate heat and electromagnetic interference (EMI) during operation. ). Furthermore, sometimes limited by the size of the overall device, the available space between each component and each other is small. The dense stack height and thinner shape limit the space like a heat sink, allowing heat and electromagnetic interference. More serious. Generally speaking, in order to protect the driving components on the circuit board and their circuits, a shielding can is often used to isolate heat and electromagnetic interference.

The main object of the present invention is to provide a printed circuit board suitable for an upper shield cover and a lower shield cover, which can prevent the solder overflow situation when the shield cover and the printed circuit board are soldered, and prevent the other side shield cover from being soldered or interfered. Missing to the left and right pads. In order to achieve the above objective, the present invention adopts the following technical means to achieve it, wherein the present invention provides a printed circuit board suitable for an upper shield cover and a lower shield cover, including: Brush the circuit board, an upper shield and a lower shield. The printed circuit board is provided with circuit components and a soldering zone. The soldering zone includes a plurality of solder pads, a solder metal, and an insulating layer. The solder pads are electrically independent of each other and are disposed along the surface of the solder zone. The insulating layer is disposed on the bonding pad, and the insulating layer is formed on the bonding pad and divides the bonding pad into a first region and a second region, and isolates the welding metal on the first region and the second region. The upper shield is used for welding with the first area, and the lower shield is used for welding with the second area.

In a preferred embodiment of the present invention, the insulating layer is a long structure and is disposed along a central dividing line of the soldering zone.

In a preferred embodiment of the present invention, the insulating layer is provided between two adjacent solder pads.

In a preferred embodiment of the present invention, the bonding pad is disposed on a side of the printed circuit board.

In a preferred embodiment of the present invention, the thickness of the insulating layer is greater than the thickness of the welding metal.

In a preferred embodiment of the present invention, the insulating layer is a high-temperature-resistant insulating ink layer or a high-temperature-resistant insulating tape.

In a preferred embodiment of the present invention, the insulating layer is formed on the bonding pad through a screen printing method.

In a preferred embodiment of the present invention, the insulating layer is formed on the bonding pad through a bonding method.

In a preferred embodiment of the present invention, the upper shield cover and the lower shield cover both include a housing and a plurality of pins, the pins are used for welding with the welding pad, and the upper shield cover and the lower shield cover The pins are set to correspond to each other.

1‧‧‧ top shield

2‧‧‧ lower shield

3,3a‧‧‧ printed circuit board

321‧‧‧pad

323,323a‧‧‧Insulation

4‧‧‧ central divider

FIG. 1 is a schematic diagram of a printed circuit board according to a first embodiment of the present invention applicable to an upper shield cover and a lower shield cover after soldering to the shield cover.

FIG. 2 is a schematic diagram of a second embodiment of a printed circuit board suitable for an upper shield cover and a lower shield cover of the present invention after soldering to the shield cover.

Please refer to FIG. 1 and FIG. 2, which are a schematic structural view and a cross-sectional schematic view of a first embodiment of a printed circuit board suitable for an upper shield cover and a lower shield cover of the present invention. The first embodiment of the present invention provides a printed circuit board 3 suitable for the upper shield 1 and the lower shield 2. In an embodiment, the printed circuit board 3 is preferably a driving circuit board for a display screen, or a small and medium circuit board with overall electromagnetic interference (EMI) protection requirements, but it is not limited thereto.

Please refer to FIG. 1, the printed circuit board 3 is provided with circuit components and a soldering area, and the soldering area is used for soldering to the upper shield cover 1 and the lower shield cover 2, and includes a plurality of solder pads 321, A solder metal and an insulating layer 323. Preferably, the bonding area is disposed on a side of the printed circuit board 3.

Please refer to FIG. 1, the bonding pads 321 may be metal thin films formed in the bonding area by a metal sputtering method, wherein the metal thin films are electrically independent of each other and disposed along a surface of the bonding area. As the material of the metal thin film, chromium, copper, gold, and the like, which can easily adhere to the welding metal and provide a diffusion barrier that is not easily oxidized, can be selected.

Please refer to FIG. 1, the soldering metal is disposed on the soldering pad 321. The soldering metal is preferably tin metal or a tin alloy. The tin alloy has the advantages of low melting point, easy soldering, and reflow soldering, and is suitable for soldering. Material of metal 322.

Please refer to FIG. 1, the insulating layer 323 is formed on one side of the pad 321. The insulating layer 323 can be a high-temperature-resistant insulating ink layer or a high-temperature-resistant insulating tape, which can be screen-printed, dispensed, partially sprayed, or taped. A bonding method is formed on the bonding pad 321. Wherein, if the screen printing method is used to make the film, the edge film thickness of the insulating layer 323 will be higher than the in-plane thickness; if it is made using tape, the edge of the insulating layer 323 will have sharper edges, which can be cut or cut. Way to remove corners.

In one embodiment, the insulating layer 323 is a long structure, and is disposed along a central separation line 4 of the welding area, so that the bonding pad 321 is divided into a first area and a second area, and is isolated. Welding metal on the first area and the second area. In order to prevent the welding metal from overflowing to another area during welding, the thickness of the insulating layer 323 needs to be greater than the thickness of the welding metal.

Please refer to FIG. 1, the upper shield cover 1 and the lower shield cover 2 each include a housing and a plurality of pins, and the pins are used for welding with the solder pad 321. The first region is used for soldering to the pins of the upper shield cover 1, and the second region is used for soldering to the pins of the lower shield cover 2.

Please refer to FIG. 1 at the same time, which is a schematic diagram of a first embodiment of a printed circuit board suitable for an upper shield and a lower shield of the present invention after soldering to the shield. In an embodiment of the present invention, the pins of the upper shield 1 and the lower shield 2 are provided in a corresponding manner, but are not limited thereto, and the pins of the upper shield 1 and the lower shield 2 may also be Set in a staggered manner.

Please refer to FIG. 2 more, which is a schematic diagram of a second embodiment of a printed circuit board suitable for an upper shield cover and a lower shield cover of the present invention after soldering to the shield cover. The second embodiment of the present invention is similar to the first embodiment, except that the printed circuit board 3a of the second embodiment is absolutely In addition to the edge layer 323 a being provided along the central dividing line 4, an insulating layer 323 a is also provided between two adjacent pads 321.

In the present invention, a soldering zone is provided on the side of the printed circuit board 3, and the insulating layer 323 is used as a retaining wall to prevent interference caused by tin overflow. Similarly, when the soldering area is disposed on the general plane of the printed circuit board 3, an insulating layer 323 can also be made as a retaining wall to prevent interference caused by tin overflow.

In summary, the present invention provides a printed circuit board suitable for an upper shield cover and a lower shield cover. The design of an insulation layer is added to the printed circuit board to prevent solder overflow when the shield cover and the printed circuit board are soldered. Flow conditions, and can avoid the other side shield cover empty welding or interference with left and right pad welding.

Claims (8)

A printed circuit board suitable for an upper shield cover and a lower shield cover includes: a printed circuit board provided with circuit elements and a soldering zone, the soldering zone including a plurality of solder pads, a solder metal, and an insulating layer, etc. The solder pads are electrically independent from each other and are disposed along the surface of the soldering pad. The soldering metal is disposed on the solder pad. The insulating layer is a long strip structure and is disposed along a central dividing line of the soldering pad. The welding pad is divided into a first area and a second area, and the welding metal located on the first area and the second area is isolated; an upper shield is used for welding with the first area; ; And a lower shield for soldering to the second area. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of the patent application, wherein the insulating layer is provided between two adjacent pads. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of the patent application, wherein the soldering area is disposed on a side of the printed circuit board. The printed circuit board applicable to the upper shield and the lower shield as described in item 1 of the scope of the patent application, wherein the thickness of the insulating layer is greater than the thickness of the solder metal. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of the patent application, wherein the insulating layer is a high-temperature-resistant insulating ink layer or a high-temperature-resistant insulating tape. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of the patent application, wherein the insulating layer is formed on the bonding pad through a screen printing method. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of the patent application, wherein the insulating layer is formed on the bonding pad through a bonding method. The printed circuit board applicable to the upper shield cover and the lower shield cover described in item 1 of the scope of patent application, wherein the upper shield cover and the lower shield cover both include a housing and a plurality of pins, and the pins are used for Solder with the pad, and the pins of the upper shield and the lower shield are provided in a corresponding manner.