CN108401410A - Printed circuit board suitable for top shielding case and lower shield cover - Google Patents
Printed circuit board suitable for top shielding case and lower shield cover Download PDFInfo
- Publication number
- CN108401410A CN108401410A CN201810320359.5A CN201810320359A CN108401410A CN 108401410 A CN108401410 A CN 108401410A CN 201810320359 A CN201810320359 A CN 201810320359A CN 108401410 A CN108401410 A CN 108401410A
- Authority
- CN
- China
- Prior art keywords
- shielding case
- printed circuit
- circuit board
- lower shield
- shield cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of printed circuit boards suitable for top shielding case and lower shield cover, the design of insulating layer is increased on a printed circuit, it can prevent welding metal overflow situation when shielding case is welded with printed circuit board, also can avoid other side shielding case missing solder or interfere with the missing of right and left weld pad welding.
Description
Technical field
The technology of the present invention, which is related to circuit board, prevents electromagnetic interference field, particularly relates to a kind of avoidable shielding case and printing
The printed circuit board of scolding tin overflow when circuit board is welded.
Background technology
Electronic device substantially can include with one or more processing or driving element a printed circuit board (PCB,
Printed circuit board), for example, display panel drive circuit board, these processing elements can running when generate heat
Amount and electromagnetic interference (EMI).Furthermore be limited to the size of single unit system sometimes, each element and between free space compared with
It is small, need intensive stack height and thinner external form limit seem radiator space so that heat and electromagnetic interference
It is even more serious.In general, for the driving element and its circuit in protection circuit plates, shielding case (shielding can mostly be used
Can) completely cut off heat and electromagnetic interference.
Invention content
The main purpose system of the present invention provides a kind of printed circuit board suitable for top shielding case and lower shield cover, can
Prevent scolding tin overflow situation when shielding case is welded with printed circuit board, avoids causing other other side shielding case missing solder or dry
Relate to the missing to right and left weld pad welding.In order to achieve the above object, system of the present invention takes following technological means to be reached,
Wherein, the present invention provides a kind of printed circuit board suitable for top shielding case and lower shield cover, including：One printed circuit
Plate, a top shielding case and a lower section shielding case.The printed circuit board is provided with circuit element and a welding section, the welding
Area includes a plurality of weld pads, a welding metal and an insulating layer, and such weld pad is electrically independent mutually and along the welding section table
Face is arranged, which is set on the weld pad, which is formed on the weld pad and the weld pad is made to be divided into one first area
And one second area, and the welding metal being isolated in firstth area and secondth area.The top shielding case to this
Firstth area weld, the lower shield cover to secondth area weld.
In a preferred embodiment of the present invention, which is a strip structure, and along a center point of the welding section
It is arranged every line.
In a preferred embodiment of the present invention, there is the insulating layer between two adjacent weld pads.
In a preferred embodiment of the present invention, which is set to the side of the printed circuit board.
In a preferred embodiment of the present invention, the thickness of the insulating layer is more than the thickness of the welding metal.
In a preferred embodiment of the present invention, which is a high-temperature insulation ink layer or a high-temperature insulation adhesive tape.
In a preferred embodiment of the present invention, which is formed in through wire mark mode on the weld pad.
In a preferred embodiment of the present invention, which is formed in through laminating type on the weld pad.
In a preferred embodiment of the present invention, the top shielding case, the lower shield cover all include a shell and a plurality of
Pin, the pin with the weld pad to weld, and the pin of the top shielding case and the lower shield cover is mode in correspondence with each other
Setting.
Description of the drawings
Fig. 1 is the printed circuit board first embodiment structural representation that the present invention is suitable for top shielding case and lower shield cover
Figure.
Fig. 2 is the printed circuit board second embodiment structural representation that the present invention is suitable for top shielding case and lower shield cover
Figure.
Fig. 3 is that the present invention is suitable for top shielding case and the structure of the printed circuit board 3rd embodiment of lower shield cover is shown
It is intended to.
Fig. 4 is that the present invention is suitable for top shielding case and the section of the printed circuit board 3rd embodiment of lower shield cover shows
It is intended to.
Fig. 5 is that the present invention is suitable for top shielding case and the printed circuit board 3rd embodiment of lower shield cover and shielding
Schematic diagram after cover welding.
Fig. 6 is that the present invention is suitable for top shielding case and the printed circuit board fourth embodiment of lower shield cover and shielding
Schematic diagram after cover welding.
Reference numeral：
Top shielding case 1,10
Lower shield cover 2,20
Shell 11,21
Pin 12,22,102,202
Printed circuit board 3,3a, 30
Circuit element 31
Welding section 32
Weld pad 321,301
First area 3211
Second area 3212
Welding metal 322
Insulating layer 323,323a
Central strip line 4
Spacing A, B
Specific implementation mode
Refering to Figure 1, it is suitable for the first embodiment structure of top shielding case and lower shield cover for the present invention
Schematic diagram.The shielding case that first embodiment of the invention provides includes a top shielding case 10 and a lower section shielding case 20.Top
Shielding case 10 and lower shield cover 20 include respectively a plurality of pins (102,202), and such pin (102,202) is using friendship
Wrong formula shape design is pressed through pin is melted tin welding (Hot bar) technology with hot pressing with the weld pad 301 on printed circuit board 30
It closes, protects internal electronic component not by electromagnetic interference influence.Due to top shielding case 10, the pin of lower shield cover 20
(102,202) alternating expression shape is used, can be because the spacing A between pin be excessive, and influence the effect of shielding electromagnetic interference.
It please refers to shown in Fig. 2, is suitable for the second embodiment structure of top shielding case and lower shield cover for the present invention
Schematic diagram.Under the consideration of shielding electromagnetic interference effect and overall appearance design, top shielding case 10 and lower shield cover
20 pin (102,202) can use symmetrical shape to design, and keep the spacing B between pin smaller, as shown in Figure 2.But it adopts
With the pin of symmetrical shape, when tin welding processing procedure is melted in hot pressing, the scolding tin of liquid is easy overflow, causes the shielding case of the other side
The destabilizing factors such as missing solder generate.
Shown in Fig. 3 and Fig. 4, it is suitable for printing electricity of the top shielding case with lower shield cover for the present invention
The structural schematic diagram and diagrammatic cross-section of road plate 3rd embodiment.Third embodiment of the invention provides a kind of suitable for top screen
Cover the printed circuit board 3 of cover 1 and lower shield cover 2.In an embodiment, 3 preferably of the printed circuit board be display screen it
Drive circuit board, or have minitype circuit board among whole electromagnetic interference (EMI) protection requirements, but not limited to this.
It please refers to shown in Fig. 3, circuit element 31 and a welding section 32, the welding is provided on the printed circuit board 3
Area 32 to the top shielding case 1 and the lower shield cover 2 welding comprising a plurality of weld pads 321, a welding metal
322 and an insulating layer 323.Preferably, the welding section 32 are set to the side of the printed circuit board 3.
It please refers to shown in Fig. 3, such weld pad 321 can be the gold that the welding section 32 is formed in the way of metal sputtering
Belong to film, wherein such metallic film is electrically independent mutually to each other and is arranged along 32 surface of welding section.Metallic film it
Material preferably can be selected chromium, copper, gold etc. and be easy to stick together with the welding metal 322, provide Diffusion Barrier not oxidizable gold
Belong to.
It please refers to shown in Fig. 3, which is set on the weld pad 321, and 322 preferably of the welding metal is optional
With tin metal or tin alloy, tin alloy has many advantages, such as low melting point, is easy to welding, reflow, is suitble to the material as welding metal 322
Material.
It please refers to shown in Fig. 3, which is formed in the side of the weld pad 321, can be high-temperature insulation oil
Layer of ink or a high-temperature insulation adhesive tape, permeable wire mark, dispensing, locally sprayed or adhesive tape gluing mode are formed in the weld pad
On 321.Wherein, it is made according to wire mark mode, which can be higher than thickness in face；It is pasted according to adhesive tape
Conjunction mode makes, which has more sharp corner, can pass through cut or cutting mode remove corner.
In an embodiment, which is a strip structure, and along a central strip line of the welding section 32
4 settings, make the weld pad 321 divide for one first area 3211 and one second area 3212, and be isolated positioned at firstth area 3211 and
Welding metal 322 in secondth area 3212.In order to avoid welding metal 322 welding when overflow to another area, therefore this absolutely
The thickness of edge layer 323 need to be more than the thickness of the welding metal 322.
It please refers to shown in Fig. 4, the top shielding case 1, the lower shield cover 2 are respective including a shell (11,21) and multiple
Several pins (12,22), such pin (12,22) to the weld pad 321 weld.Wherein, firstth area 3211 to this
The pin 12 of top shielding case 1 welds, and secondth area 3212 and the pin 22 of the lower shield cover 2 weld.
Shown in Fig. 5, it is suitable for the printed circuit board of top shielding case and lower shield cover for the present invention
3rd embodiment with shielding case weld after schematic diagram.In an embodiment of the present invention, the top shielding case 1 and the lower shield
The pin (12,22) of cover 2 is that mode is arranged in correspondence with each other, but not limited to this, the top shielding case 1 and the lower shield cover 2 it
Pin also can be that the mode of intermeshing is arranged.
Please more as shown in fig.6, it is suitable for the printed circuit board of top shielding case and lower shield cover for the present invention
Fourth embodiment with shielding case weld after schematic diagram.Fourth embodiment of the invention is similar to 3rd embodiment, different places
It is, for the insulating layer 323a of fourth embodiment printed circuit board 3a other than being arranged along central strip line 4, adjacent two should
Also there is insulating layer 323a between weld pad 321.
Welding section 32 is set to the side of the printed circuit board 3 by the present invention, using insulating layer 323 as barricade, is used
To prevent tin overflow from causing to interfere.Similarly, it when welding section 32 is set in 3 general plane of printed circuit board, can also make absolutely
Edge layer 323 prevents tin overflow from causing to interfere as barricade.
In conclusion a kind of printed circuit board suitable for top shielding case and lower shield cover provided by the invention,
The design of insulating layer is increased on a printed circuit, can prevent scolding tin overflow feelings when shielding case is welded with printed circuit board
Shape, and can avoid causing other other side shielding case missing solder or interfere with right and left weld pad welding.
Claims (9)
1. a kind of printed circuit board suitable for top shielding case and lower shield cover, which is characterized in that including：
One printed circuit board, is provided with circuit element and a welding section, which includes a plurality of weld pads, a welding metal
And an insulating layer, such weld pad is electrically independent mutually to be simultaneously arranged along the welding section surface, which is set to the weldering
On pad, which is formed on the weld pad and the weld pad is made to be divided into one first area and one second area, and be isolated be located at this
Welding metal in one area and secondth area；
One top shielding case, to be welded with firstth area；And
One lower section shielding case, to be welded with secondth area.
2. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein insulating layer as described in claim 1
For a strip structure, and it is arranged along a central strip line of the welding section.
3. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein adjacent two
There is the insulating layer between the weld pad.
4. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein welding section as described in claim 1
It is set to the side of the printed circuit board.
5. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein insulating layer as described in claim 1
Thickness be more than the welding metal thickness.
6. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein insulating layer as described in claim 1
For a high-temperature insulation ink layer or a high-temperature insulation adhesive tape.
7. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein insulating layer as described in claim 1
System is formed in through wire mark mode on the weld pad.
8. being suitable for the printed circuit board of top shielding case and lower shield cover, the wherein insulating layer as described in claim 1
System is formed in through laminating type on the weld pad.
9. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the top is shielded
It includes a shell and a plurality of pins to cover cover, the lower shield cover all, and the pin with the weld pad to weld, and the top is shielded
The pin for covering cover and the lower shield cover is that mode is arranged in correspondence with each other.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320359.5A CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
| TW107113391A TWI674836B (en) | 2018-04-11 | 2018-04-19 | Printed Circuit Board Suitable For A Top Shield Can And A Bottom Shield Can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320359.5A CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108401410A true CN108401410A (en) | 2018-08-14 |
| CN108401410B CN108401410B (en) | 2019-08-06 |
Family
ID=63100002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810320359.5A Active CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108401410B (en) |
| TW (1) | TWI674836B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3629913A1 (en) * | 1986-09-03 | 1988-03-17 | Standard Elektrik Lorenz Ag | Screening housing |
| JPH06188756A (en) * | 1992-12-18 | 1994-07-08 | Murata Mfg Co Ltd | Card type high frequency equipment |
| CN1145573A (en) * | 1995-05-23 | 1997-03-19 | 索尼公司 | Electromagnetic wave screening arrangement |
| CN1101128C (en) * | 1997-03-07 | 2003-02-05 | 阿尔卑斯电气株式会社 | Shielded box for electronic device |
| CN1507735A (en) * | 2002-02-04 | 2004-06-23 | ���µ�����ҵ��ʽ���� | Foldable cell phone device |
| CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8013258B2 (en) * | 2008-06-11 | 2011-09-06 | Mediatek Inc. | Shielding device |
| CN101932191B (en) * | 2009-06-25 | 2012-09-05 | 北京普源精电科技有限公司 | Measuring equipment and amplifying circuit, impedance component and multilayer printed circuit board thereof |
| CN104981347B (en) * | 2014-04-18 | 2017-07-14 | 华为终端有限公司 | A kind of screened film, screened circuit plate and terminal device |
| US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
| CN105246314B (en) * | 2015-10-14 | 2018-09-04 | 小米科技有限责任公司 | Shielding case, pcb board and terminal device |
-
2018
- 2018-04-11 CN CN201810320359.5A patent/CN108401410B/en active Active
- 2018-04-19 TW TW107113391A patent/TWI674836B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3629913A1 (en) * | 1986-09-03 | 1988-03-17 | Standard Elektrik Lorenz Ag | Screening housing |
| JPH06188756A (en) * | 1992-12-18 | 1994-07-08 | Murata Mfg Co Ltd | Card type high frequency equipment |
| CN1145573A (en) * | 1995-05-23 | 1997-03-19 | 索尼公司 | Electromagnetic wave screening arrangement |
| CN1101128C (en) * | 1997-03-07 | 2003-02-05 | 阿尔卑斯电气株式会社 | Shielded box for electronic device |
| CN1507735A (en) * | 2002-02-04 | 2004-06-23 | ���µ�����ҵ��ʽ���� | Foldable cell phone device |
| CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201944883A (en) | 2019-11-16 |
| TWI674836B (en) | 2019-10-11 |
| CN108401410B (en) | 2019-08-06 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |