CN108401410B - Printed circuit board suitable for top shielding case and lower shield cover - Google Patents
Printed circuit board suitable for top shielding case and lower shield cover Download PDFInfo
- Publication number
- CN108401410B CN108401410B CN201810320359.5A CN201810320359A CN108401410B CN 108401410 B CN108401410 B CN 108401410B CN 201810320359 A CN201810320359 A CN 201810320359A CN 108401410 B CN108401410 B CN 108401410B
- Authority
- CN
- China
- Prior art keywords
- shielding case
- printed circuit
- circuit board
- lower shield
- shield cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of printed circuit boards suitable for top shielding case and lower shield cover, the design of insulating layer is increased on a printed circuit, it can prevent welding metal overflow situation when shielding case is welded with printed circuit board, also can avoid other side shielding case missing solder or interfere with the missing of right and left weld pad welding.
Description
Technical field
The technology of the present invention, which is related to circuit board, prevents electromagnetic interference field, particularly relates to a kind of avoidable shielding case and printing
The printed circuit board of scolding tin overflow when circuit board is welded.
Background technique
Electronic device substantially can comprising with one or more processing or driving element a printed circuit board (PCB,
Printed circuit board), such as the drive circuit board of display panel, these processing elements can generate heat in running
Amount and electromagnetic interference (EMI).Furthermore be limited to the size of single unit system sometimes, each element and between available space compared with
Small, needing intensive stack height and thinner external form to limit seems the space of radiator, so that heat and electromagnetic interference
It is even more serious.In general, for the driving element and its circuit in protection circuit plate, it will use shielding case more
(shielding can) completely cuts off heat and electromagnetic interference.
Summary of the invention
The main purpose system of the present invention provides a kind of printed circuit board suitable for top shielding case and lower shield cover, can
Scolding tin overflow situation when prevention shielding case and printed circuit board are welded avoids other other side shielding case missing solder or dry
Relate to the missing to right and left weld pad welding.In order to achieve the above object, system of the present invention takes following technological means to be reached,
Wherein, the present invention provides a kind of printed circuit board suitable for top shielding case and lower shield cover, comprising: a printed circuit
Plate, a top shielding case and a lower section shielding case.The printed circuit board is provided with circuit element and a welding section, the welding
Area includes a plurality of weld pads, a welding metal and an insulating layer, and a plurality of weld pads are electrically independent mutually and along the welding
The setting of area surface, which is set on the weld pad, which is formed on the weld pad and the weld pad is made to be divided into one the
One area and one second area, and the welding metal being located in firstth area and secondth area is isolated.The top shielding case to
It is welded with firstth area, the lower shield cover with secondth area to weld.
In a preferred embodiment of the present invention, which is a strip structure, and along a center point of the welding section
It is arranged every line.
In a preferred embodiment of the present invention, there is the insulating layer between two adjacent weld pads.
In a preferred embodiment of the present invention, which is set to the side of the printed circuit board.
In a preferred embodiment of the present invention, the thickness of the insulating layer is greater than the thickness of the welding metal.
In a preferred embodiment of the present invention, which is a high-temperature insulation ink layer or a high-temperature insulation adhesive tape.
In a preferred embodiment of the present invention, which is formed on the weld pad by wire mark mode.
In a preferred embodiment of the present invention, which is formed on the weld pad by laminating type.
In a preferred embodiment of the present invention, the top shielding case, the lower shield cover all include a shell and a plurality of
Pin, the pin with the weld pad to weld, and the pin of the top shielding case and the lower shield cover is mode in correspondence with each other
Setting.
Detailed description of the invention
Fig. 1 is the printed circuit board first embodiment structural representation that the present invention is suitable for top shielding case and lower shield cover
Figure.
Fig. 2 is the printed circuit board second embodiment structural representation that the present invention is suitable for top shielding case and lower shield cover
Figure.
Fig. 3 is that the present invention is suitable for top shielding case and the structure of the printed circuit board 3rd embodiment of lower shield cover is shown
It is intended to.
Fig. 4 is that the present invention is suitable for top shielding case and the section of the printed circuit board 3rd embodiment of lower shield cover shows
It is intended to.
Fig. 5 be the printed circuit board 3rd embodiment that the present invention is suitable for top shielding case and lower shield cover with shielding
Schematic diagram after cover welding.
Fig. 6 be the printed circuit board fourth embodiment that the present invention is suitable for top shielding case and lower shield cover with shielding
Schematic diagram after cover welding.
Appended drawing reference:
Top shielding case 1,10
Lower shield cover 2,20
Shell 11,21
Pin 12,22,102,202
Printed circuit board 3,3a, 30
Circuit element 31
Welding section 32
Weld pad 321,301
First area 3211
Second area 3212
Welding metal 322
Insulating layer 323,323a
Central strip line 4
Spacing A, B
Specific embodiment
Refering to Figure 1, its first embodiment structure for being suitable for top shielding case and lower shield cover for the present invention
Schematic diagram.The shielding case that first embodiment of the invention provides includes a top shielding case 10 and a lower section shielding case 20.On
Square shielding case 10 and lower shield cover 20 respectively include a plurality of pins (102,202), and this waits pins (102,202)
It is designed using alternating expression shape, by the way that pin to be melted to the weldering in tin welding (Hot bar) technology and printed circuit board 30 with hot pressing
Pad 301 presses, and protects internal electronic component not by electromagnetic interference influence.Due to top shielding case 10, lower shield cover 20
Pin (102,202) use alternating expression shape, can be because the spacing A between pin be excessive, and it is dry to influence shielding electromagnetism
The effect disturbed.
It please refers to shown in Fig. 2, is suitable for the second embodiment structure of top shielding case and lower shield cover for the present invention
Schematic diagram.Under the consideration of shielding electromagnetic interference effect and overall appearance design, top shielding case 10 and lower shield cover
20 pin (102,202) can keep the spacing B between pin smaller, as shown in Figure 2 using symmetrical shape design.But
Using the pin of symmetrical shape, when tin welding processing procedure is melted in hot pressing, the scolding tin of liquid is easy overflow, causes the shielding of the other side
The unstable factors such as cover missing solder generate.
Please refer to shown in Fig. 3 and Fig. 4, it is suitable for the printing of top shielding case and lower shield cover for the present invention
The structural schematic diagram and diagrammatic cross-section of circuit board 3rd embodiment.Third embodiment of the invention provides a kind of suitable for top
The printed circuit board 3 of shielding case 1 and lower shield cover 2.In an embodiment, 3 preferably of the printed circuit board is display
The drive circuit board of screen, or have minitype circuit board among whole electromagnetic interference (EMI) protection requirements, but not limited to this.
It please refers to shown in Fig. 3, circuit element 31 and a welding section 32, the weldering is provided on the printed circuit board 3
Area 32 is met to weld with the top shielding case 1 and the lower shield cover 2 comprising a plurality of weld pads 321, one weld
Metal 322 and an insulating layer 323.Preferably, the welding section 32 are set to the side of the printed circuit board 3.
It please refers to shown in Fig. 3, which can be that the welding section is formed in the way of metal sputtering
32 metallic film, wherein the equal metallic films are electrically independent mutually to each other and are arranged along 32 surface of welding section.Metal
The material preferably of film can be selected chromium, copper, gold etc. and be easy to stick together with the welding metal 322, provide Diffusion Barrier and be not easy oxygen
The metal of change.
It please refers to shown in Fig. 3, which is set on the weld pad 321, and 322 preferably of the welding metal can
Tin metal or tin alloy are selected, tin alloy has many advantages, such as low melting point, is easy to weld, reflow, is suitble to as welding metal 322
Material.
It please refers to shown in Fig. 3, which is formed in the side of the weld pad 321, can be a high-temperature insulation
Ink layer or a high-temperature insulation adhesive tape can be formed in the weld pad by wire mark, dispensing, locally sprayed or adhesive tape gluing mode
On 321.Wherein, it is made according to wire mark mode, which can be higher than thickness in face；It is pasted according to adhesive tape
Conjunction mode makes, which has more sharp corner, can by cut or cutting mode remove corner.
In an embodiment, which is a strip structure, and along a central strip of the welding section 32
Line 4 is arranged, and divides the weld pad 321 for one first area 3211 and one second area 3212, and is isolated and is located at firstth area
3211 and secondth area 3212 on welding metal 322.In order to avoid welding metal 322 in welding overflow to another
Area, therefore the thickness of the insulating layer 323 need to be greater than the thickness of the welding metal 322.
Please refer to shown in Fig. 4, the top shielding case 1, the lower shield cover 2 respectively include a shell (11,21) and
A plurality of pins (12,22), equal pins (12,22) with the weld pad 321 to weld.Wherein, which uses
To weld with the pin 12 of the top shielding case 1, and the pin 22 of secondth area 3212 and the lower shield cover 2 welds.
Please refer to shown in Fig. 5, it is suitable for the printed circuit board of top shielding case and lower shield cover for the present invention
3rd embodiment with shielding case welding after schematic diagram.In an embodiment of the present invention, the top shielding case 1 and the lower section are shielded
The pin (12,22) for covering cover 2 is that mode is arranged in correspondence with each other, but not limited to this, the top shielding case 1 and the lower shield
The pin of cover 2 also can be that the mode of intermeshing is arranged.
Please more as shown in fig.6, its printed circuit board for being suitable for top shielding case and lower shield cover for the present invention
Fourth embodiment with shielding case welding after schematic diagram.Fourth embodiment of the invention is similar to 3rd embodiment, different places
It is, the insulating layer 323a of fourth embodiment printed circuit board 3a is adjacent other than being arranged along central strip line 4
Also there is insulating layer 323a between two weld pads 321.
Welding section 32 is set to the side of the printed circuit board 3 by the present invention, using insulating layer 323 as barricade,
To prevent tin overflow from causing to interfere.Similarly, it when welding section 32 is set in 3 general plane of printed circuit board, can also make
Make insulating layer 323 prevents tin overflow from causing to interfere as barricade.
In conclusion a kind of printed circuit board suitable for top shielding case and lower shield cover provided by the invention,
The design of insulating layer is increased on a printed circuit, can prevent scolding tin overflow feelings when shielding case is welded with printed circuit board
Shape, and can avoid causing other other side shielding case missing solder or interfere with the welding of right and left weld pad.
Claims (7)
1. a kind of printed circuit board suitable for top shielding case and lower shield cover characterized by comprising
One printed circuit board is provided with circuit element and a welding section, which is set to the side of the printed circuit board,
The welding section includes a plurality of weld pads, a plurality of welding metals and an insulating layer, and electrical property is independent simultaneously mutually for a plurality of weld pads
It is arranged along the welding section surface, which is respectively arranged on a plurality of weld pads, which is formed in
On a plurality of weld pads and each weld pad is made to be divided into one first area and one second area, and is isolated and is located at firstth area and is somebody's turn to do
Welding metal in secondth area, the thickness of the insulating layer are greater than the thickness of each welding metal；
One top shielding case, to be welded with firstth area；And
One lower section shielding case, to be welded with secondth area.
2. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the insulating layer
For a strip structure, and it is arranged along a central strip line of the welding section.
3. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein adjacent two
There is the insulating layer between the weld pad.
4. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the insulating layer
For a high-temperature insulation ink layer or a high-temperature insulation adhesive tape.
5. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the insulating layer
It is formed on the weld pad by wire mark mode.
6. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the insulating layer
It is formed on the weld pad by laminating type.
7. being suitable for the printed circuit board of top shielding case and lower shield cover as described in claim 1, wherein the top is shielded
Cover cover, the lower shield cover all includes a shell and a plurality of pins, a plurality of pins to a plurality of weld pads point
It does not weld, and the pin of the top shielding case and the lower shield cover is that mode is arranged in correspondence with each other.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320359.5A CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
| TW107113391A TWI674836B (en) | 2018-04-11 | 2018-04-19 | Printed Circuit Board Suitable For A Top Shield Can And A Bottom Shield Can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320359.5A CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108401410A CN108401410A (en) | 2018-08-14 |
| CN108401410B true CN108401410B (en) | 2019-08-06 |
Family
ID=63100002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810320359.5A Active CN108401410B (en) | 2018-04-11 | 2018-04-11 | Printed circuit board suitable for top shielding case and lower shield cover |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108401410B (en) |
| TW (1) | TWI674836B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1507735A (en) * | 2002-02-04 | 2004-06-23 | ���µ�����ҵ��ʽ���� | Foldable cell phone device |
| CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3629913A1 (en) * | 1986-09-03 | 1988-03-17 | Standard Elektrik Lorenz Ag | Screening housing |
| JPH06188756A (en) * | 1992-12-18 | 1994-07-08 | Murata Mfg Co Ltd | Card type high frequency equipment |
| JP3493808B2 (en) * | 1995-05-23 | 2004-02-03 | ソニー株式会社 | Electromagnetic wave shielding device |
| JPH10256768A (en) * | 1997-03-07 | 1998-09-25 | Alps Electric Co Ltd | Shielding case for electronic apparatus |
| US8013258B2 (en) * | 2008-06-11 | 2011-09-06 | Mediatek Inc. | Shielding device |
| CN101932191B (en) * | 2009-06-25 | 2012-09-05 | 北京普源精电科技有限公司 | Measuring equipment and amplifying circuit, impedance component and multilayer printed circuit board thereof |
| WO2015158008A1 (en) * | 2014-04-18 | 2015-10-22 | 华为终端有限公司 | Shielding film, shielding circuit board and terminal device |
| US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
| CN105246314B (en) * | 2015-10-14 | 2018-09-04 | 小米科技有限责任公司 | Shielding case, pcb board and terminal device |
-
2018
- 2018-04-11 CN CN201810320359.5A patent/CN108401410B/en active Active
- 2018-04-19 TW TW107113391A patent/TWI674836B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1507735A (en) * | 2002-02-04 | 2004-06-23 | ���µ�����ҵ��ʽ���� | Foldable cell phone device |
| CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI674836B (en) | 2019-10-11 |
| CN108401410A (en) | 2018-08-14 |
| TW201944883A (en) | 2019-11-16 |
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