TWI673114B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI673114B
TWI673114B TW107123495A TW107123495A TWI673114B TW I673114 B TWI673114 B TW I673114B TW 107123495 A TW107123495 A TW 107123495A TW 107123495 A TW107123495 A TW 107123495A TW I673114 B TWI673114 B TW I673114B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
holding portion
hole
processing apparatus
Prior art date
Application number
TW107123495A
Other languages
English (en)
Chinese (zh)
Other versions
TW201912255A (zh
Inventor
梅田栄次
郷原隆行
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201912255A publication Critical patent/TW201912255A/zh
Application granted granted Critical
Publication of TWI673114B publication Critical patent/TWI673114B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW107123495A 2017-08-24 2018-07-06 基板處理裝置 TWI673114B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017161445A JP6982433B2 (ja) 2017-08-24 2017-08-24 基板処理装置
JP2017-161445 2017-08-24

Publications (2)

Publication Number Publication Date
TW201912255A TW201912255A (zh) 2019-04-01
TWI673114B true TWI673114B (zh) 2019-10-01

Family

ID=65440064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107123495A TWI673114B (zh) 2017-08-24 2018-07-06 基板處理裝置

Country Status (3)

Country Link
JP (1) JP6982433B2 (ja)
TW (1) TWI673114B (ja)
WO (1) WO2019039066A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115456A (ja) * 2013-12-11 2015-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TW201717303A (zh) * 2011-12-28 2017-05-16 東京威力科創股份有限公司 基板處理裝置
TWI602232B (zh) * 2015-01-20 2017-10-11 思可林集團股份有限公司 基板處理裝置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6118758B2 (ja) * 2014-05-01 2017-04-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP6672023B2 (ja) * 2016-03-08 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201717303A (zh) * 2011-12-28 2017-05-16 東京威力科創股份有限公司 基板處理裝置
JP2015115456A (ja) * 2013-12-11 2015-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI602232B (zh) * 2015-01-20 2017-10-11 思可林集團股份有限公司 基板處理裝置

Also Published As

Publication number Publication date
JP6982433B2 (ja) 2021-12-17
WO2019039066A1 (ja) 2019-02-28
JP2019039039A (ja) 2019-03-14
TW201912255A (zh) 2019-04-01

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