TWI668437B - Device handler - Google Patents
Device handler Download PDFInfo
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- TWI668437B TWI668437B TW106119875A TW106119875A TWI668437B TW I668437 B TWI668437 B TW I668437B TW 106119875 A TW106119875 A TW 106119875A TW 106119875 A TW106119875 A TW 106119875A TW I668437 B TWI668437 B TW I668437B
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- visual inspection
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- tray
- loading
- tool
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
本發明揭露一種元件處理器，包括：裝載部(100)，裝載裝有多個元件(1)的托盤(2)，並使托盤(2)線性移動；第一底面視覺檢查部，與裝載部(100)內的托盤(2)的運送方向垂直，並且設置在裝載部(100)一側以對元件(1)執行視覺檢查；第一導軌(680)，與裝載部(100)的托盤(2)的移動方向垂直；第一運送工具(610)，與第一導軌(680)結合，進而沿第一導軌(680)移動，且為了執行視覺檢查，從裝載部(100)拾取元件運送到第一底面視覺檢查部；第二導軌(690)，與第一導軌(680)平行；第二底面視覺檢查部，與裝載部(100)內的托盤(2)的運送方向相垂直，且設置在裝載部(100)一側，對元件(1)執行視覺檢查；第二運送工具(630)，與第二導軌(690)結合，進而沿第二導軌(690)移動，且為了執行視覺檢查，從裝載部(100)拾取元件運送到第二底面視覺檢查部；卸載部(310、320、330)，從裝載部(100)接收裝有完成視覺檢查的元件(1)的托盤(2)，根據視覺檢查結果在托盤(2)分類元件(1)。 The present invention discloses a component processor comprising: a loading portion (100) for loading a tray (2) containing a plurality of components (1) and linearly moving the tray (2); a first bottom visual inspection portion, and a loading portion The conveyance direction of the tray (2) in (100) is vertical, and is disposed on the side of the loading portion (100) to perform visual inspection on the component (1); the first guide rail (680), and the tray of the loading portion (100) ( 2) the moving direction is vertical; the first transporting tool (610) is combined with the first rail (680) to move along the first rail (680), and in order to perform a visual inspection, the loading component is picked up from the loading section (100) to a first bottom visual inspection portion; a second guide rail (690) parallel to the first guide rail (680); and a second bottom visual inspection portion perpendicular to the transport direction of the tray (2) in the loading portion (100) On the side of the loading portion (100), a visual inspection is performed on the component (1); a second transporting tool (630) is coupled to the second rail (690), thereby moving along the second rail (690), and in order to perform a visual inspection , the pick-up component from the loading unit (100) is transported to the second bottom visual inspection unit; the unloading unit (310, 320, 330) is connected from the loading unit (100) With complete visual inspection of the element (1) of the tray (2), in accordance with the results of visual inspection of the tray (2) Classification element (1).
Description
本發明涉及元件處理器，詳言之，係涉及對元件執行視覺檢查的元件處理器。 The present invention relates to component processors, and more particularly to component processors that perform visual inspection of components.
完成半導體製程的半導體元件在完成視覺檢查等固定的檢查之後係裝載於客戶的托盤後出廠。 The semiconductor component that has completed the semiconductor process is shipped to the customer's tray after being subjected to a fixed inspection such as visual inspection.
然後，出廠的半導體元件經過用雷射在表面等標記序號、製造商標識等的打標製程。 Then, the manufactured semiconductor component is subjected to a marking process using a laser marking such as a surface number, a manufacturer's logo, or the like.
另外，半導體元件最終經過檢查半導體外觀狀態以及形成在表面的標識是否合格的製程，例如，檢查引線(lead)或者球柵是否處於正常狀態，以及檢查半導體元件的是否有裂紋(crack)、刮痕(scratch)等。 In addition, the semiconductor element is finally subjected to a process of inspecting the appearance state of the semiconductor and whether the mark formed on the surface is acceptable, for example, checking whether the lead or the ball grid is in a normal state, and checking whether the semiconductor element has cracks or scratches. (scratch) and so on.
另一方面，增加檢查半導體元件的外觀狀態以及打標是否合格的檢查的同時，根據該檢查時間以及各個模組的配置，將影響用於執行整體製程的時間以及裝置大小。 On the other hand, while the inspection for checking the appearance state of the semiconductor element and the qualification of the marking is added, the time for performing the overall process and the size of the device will be affected according to the inspection time and the configuration of each module.
尤其是，裝有多個元件的托盤的裝載、對各個元件進行視覺檢查的一個以上的模組、根據檢查之後的檢查結果的卸載模組結構以及配置，裝置的大小會有所不同。 In particular, the loading of the trays containing the plurality of components, the one or more modules for visually inspecting the respective components, and the structure and arrangement of the unloading modules according to the inspection results after the inspection may vary in size.
然後，裝置的大小限制可根據設置在元件檢查線上的元件處理器的數量，或者根據預先設定的數量設置元件處理器而影響用於生產元件的設置成本。 Then, the size limit of the device may affect the installation cost for the production component according to the number of component processors disposed on the component inspection line or by setting the component processor according to a preset amount.
本發明的目的在於提供如下的元件處理器：有效配置用於視覺檢查等的模組，進而提高對元件的檢查速度，另一方面縮小裝置尺寸，最終能夠節省元件生產成本。 An object of the present invention is to provide an element processor that effectively configures a module for visual inspection or the like, thereby improving the inspection speed of components, and on the other hand, reducing the size of the device, and finally saving component production costs.
本發明是為了達成上述目的而提出的，本發明揭露一種元件處理器，包括：裝載部100，裝載裝有多個元件1的托盤2，並使托盤2線性移動；第一底面視覺檢查部，與所述裝載部100內的托盤2的運送方向垂直，並且設置在所述裝載部100的一側來對元件1執行視覺檢查；第一導軌680，與所述裝載部100的托盤2的移動方向垂直；第一運送工具610，與所述第一導軌680結合，進而沿著所述第一導軌680移動，並且為了執行視覺檢查，從所述裝載部100拾取元件運送到所述第一底面視覺檢查部；第二導軌690，與所述第一導軌680平行；第二底面視覺檢查部，與所述裝載部100內的托盤2的運送方向垂直，並且設置在所述裝載部100的一側，對元件1執行視覺檢查；第二運送工具630，與所述第二導軌690結合，進而沿著所述第二導軌690移動，並且為了執行視覺檢查，從所述裝載部100拾取元件運送到所述第二底面視覺檢查部；卸載部310、320、330，從所述裝載部100接收裝有完成視覺檢查的元件1的托盤2，根據所述視覺檢查結果在該托盤2分類元件1。 The present invention has been made to achieve the above object, and an object processor includes a loading unit 100 that loads a tray 2 containing a plurality of components 1 and linearly moves the tray 2; a first bottom visual inspection unit, It is perpendicular to the conveyance direction of the tray 2 in the loading section 100, and is disposed on one side of the loading section 100 to perform visual inspection on the component 1; the first guide rail 680, and the movement of the tray 2 of the loading section 100 The direction is vertical; a first transport tool 610 is coupled to the first rail 680 to move along the first rail 680, and in order to perform a visual inspection, the pick-up component is transported from the loading portion 100 to the first bottom surface a visual inspection unit; a second guide rail 690 parallel to the first guide rail 680; a second bottom visual inspection portion perpendicular to a transport direction of the tray 2 in the loading unit 100, and one of the loading portions 100 On the side, a visual inspection is performed on the element 1; a second transport tool 630 is combined with the second guide rail 690 to move along the second guide rail 690, and is picked up from the loading portion 100 in order to perform a visual inspection The component is transported to the second bottom visual inspection unit; the unloading portions 310, 320, 330 receive the tray 2 containing the component 1 for visual inspection from the loading portion 100, and sort the tray 2 according to the visual inspection result. Element 1.
所述元件處理器還可包括第一上面視覺檢查部420，該第一上面視覺檢查部420與所述第一導軌680結合，並且在所述第一運送工具610移動到所述第一底面視覺檢查部時，檢查在所述裝載部100的托盤2裝載的元件1的上面。 The component processor may further include a first upper visual inspection portion 420 coupled with the first guide rail 680 and moving to the first bottom surface visually at the first transport tool 610 At the time of the inspection unit, the upper surface of the component 1 loaded on the tray 2 of the loading unit 100 is inspected.
所述元件處理器還可包括第二上面視覺檢查部440，該第二上面視覺檢查部440與所述第二導軌690結合，並且在所述第一運送工具610移動到所述第一底面視覺檢查部時，檢查在所述裝載部100的托盤2裝載的元件1的上面。 The component processor may further include a second upper visual inspection portion 440 that is coupled to the second rail 690 and that moves the first transport tool 610 to the first bottom surface At the time of the inspection unit, the upper surface of the component 1 loaded on the tray 2 of the loading unit 100 is inspected.
所述第一底面視覺檢查部可包括：3D視覺檢查部410，對由所述第一運送工具610拾取並運送的元件1的底面執行3D視覺檢查；2D視覺檢查部460，對由所述第一運送工具610拾取的元件1的底面執行2D視覺檢查。 The first bottom visual inspection unit may include a 3D visual inspection unit 410 that performs a 3D visual inspection on the bottom surface of the component 1 picked up and transported by the first transport tool 610, and a 2D visual inspection unit 460 A bottom surface of the component 1 picked up by the transport tool 610 performs a 2D visual inspection.
所述第二底面視覺檢查部可包括：視覺檢查部430，對於由所述第一運送工具610拾取的元件1的底面至少執行追加2D視覺檢查以及追加3D視覺檢查中的一種視覺檢查；側面檢查部470，對由所述第一運送工具610拾取的直角四邊形元件1的側面執行視覺檢查。 The second bottom visual inspection unit may include a visual inspection unit 430 that performs at least one of an additional 2D visual inspection and an additional 3D visual inspection on the bottom surface of the component 1 picked up by the first transporting tool 610; The portion 470 performs a visual inspection on the side surface of the rectangular quadrilateral element 1 picked up by the first transporting tool 610.
可從所述裝載部100依次配置所述視覺檢查部430以及所述側面檢查部470。 The visual inspection unit 430 and the side inspection unit 470 may be disposed in order from the loading unit 100.
所述側面檢查部470可包括一對圖像獲取部471，所述一對圖像獲取部471相互面對面配置在由所述第二運送工具630拾取的元件1的移動通道兩側，並且獲取移動的元件1的側面圖像。 The side inspection portion 470 may include a pair of image acquisition portions 471 that are disposed face to face on both sides of the moving passage of the component 1 picked up by the second conveyance tool 630, and acquire movement Side image of component 1.
所述元件1的平面形狀為直角四邊形；在所述第二運送工具630移動到所述一對圖像獲取部471之間時，所述一對圖像獲取部471獲取所述元件1從側面中相互面對的第一側面圖像；為使所述一對圖像獲取部471獲取所述元件1的側面中相互面對的第二側面的圖像，所述第二運送工具630將所述元件1旋轉90°之後，再次移動到所述裝載部100側，同時所述一對圖像獲取部471可獲取所述元件1的側面中相互面對的第二側面的圖像。 The planar shape of the element 1 is a right-angled quadrangle; when the second transporting tool 630 is moved between the pair of image acquiring portions 471, the pair of image acquiring portions 471 acquire the element 1 from the side a first side image facing each other; in order for the pair of image acquiring portions 471 to acquire an image of the second side facing each other in the side surface of the element 1, the second transporting tool 630 After the element 1 is rotated by 90°, it is moved to the loading unit 100 side again, and the pair of image acquiring units 471 can acquire images of the second side faces of the side faces of the elements 1 facing each other.
所述第二運送工具630可包括排成多列的多個拾取器。 The second transport tool 630 can include a plurality of pickers arranged in a plurality of columns.
根據本發明的元件處理器具有如下的優點：在裝載裝有多個元件的托盤的裝載部中，使用於視覺檢查的視覺檢查模組位於裝載部一側，並且上面檢查模組連動於運送工具的移動來對元件上面進行檢查，進而根據有效配置模組，可縮小元件處理器的大小，其中上面檢查模組是為了執行視覺檢查，從托盤拾取元件的運送工具移動到視覺檢查模組時，對裝載於托盤的元件上面執行檢查。 The component processor according to the present invention has an advantage in that in a loading portion in which a tray containing a plurality of components is loaded, a visual inspection module for visual inspection is located on one side of the loading portion, and the upper inspection module is coupled to the transportation tool The movement of the component to check the size of the component processor according to the effective configuration module, wherein the upper inspection module is for performing visual inspection, and when the transportation tool of the pallet picking component is moved to the visual inspection module, A check is performed on the components loaded on the tray.
另外，根據本發明的元件處理器具有如下的優點：根據有效配置模組，可以相同大小為基準留出多餘空間，據此能夠設置用於追加執行視覺檢查的視覺檢查模組，進而還能夠實現可執行解析度或者檢查內容不同的視覺檢查的結構，因此能夠增加元件處理器的功能。 In addition, the component processor according to the present invention has the advantage that, according to the effective configuration module, excess space can be reserved based on the same size, and accordingly, a visual inspection module for additionally performing visual inspection can be provided, and further The structure of the visual inspection in which the resolution or the content is different can be performed, and thus the function of the component processor can be increased.
另外，依次進行視覺檢查以及上面檢查，進而提高對元件的檢查效率，由此提高元件處理器的檢查速度，最終能夠提高元件處理器的性能。 In addition, the visual inspection and the above inspection are sequentially performed, thereby improving the inspection efficiency of the components, thereby improving the inspection speed of the component processor, and finally improving the performance of the component processor.
1‧‧‧元件 1‧‧‧ components
2‧‧‧托盤 2‧‧‧Tray
100‧‧‧裝載部 100‧‧‧Loading Department
200‧‧‧空托盤部 200‧‧‧ Empty tray department
310、320、330‧‧‧卸載部 310, 320, 330‧‧‧ Unloading Department
410‧‧‧3D視覺檢查部 410‧‧‧3D Visual Inspection Department
420‧‧‧第一上面視覺檢查部 420‧‧‧First Visual Inspection Department
430‧‧‧視覺檢查部 430‧‧ visual inspection department
440‧‧‧第二上面視覺檢查部 440‧‧‧Second Top Visual Inspection Department
450‧‧‧第三上面視覺檢查部 450‧‧‧The third upper visual inspection department
460‧‧‧2D視覺檢查部 460‧‧‧2D Visual Inspection Department
470‧‧‧側面檢查部 470‧‧‧ Side Inspection Department
471‧‧‧圖像獲取部 471‧‧‧Image Acquisition Department
610‧‧‧第一運送工具 610‧‧‧First delivery tool
620‧‧‧分揀工具 620‧‧‧ sorting tools
630‧‧‧第二運送工具 630‧‧‧Second delivery tool
680‧‧‧第一導軌 680‧‧‧First rail
690‧‧‧第二導軌 690‧‧‧Second rail
圖1是根據本發明第一實施例的元件處理器的一示例的平面圖；圖2是示出圖1的側面檢查部的一示例的概念圖；以及圖3是示出圖1的側面檢查部的另一示例的概念圖。 1 is a plan view showing an example of a component processor according to a first embodiment of the present invention; FIG. 2 is a conceptual view showing an example of a side inspection portion of FIG. 1; and FIG. 3 is a side inspection portion of FIG. A conceptual diagram of another example.
以下，參照附圖說明根據本發明的元件處理器。 Hereinafter, an element processor according to the present invention will be described with reference to the drawings.
如圖1所示，根據本發明的元件處理器包括：裝載部100，裝載裝有多個元件1的托盤2，並使托盤2線性移動；第一底面視覺檢查部，與裝載部100內的托盤2的運送方向垂直並設置在裝載部100的一側，對元件1執行視覺檢查；第一導軌680，與裝載部100的托盤2的移動方向垂直；第一運送工具610，與第一導軌680結合，進而沿著第一導軌680移動，並且從裝載部100拾取元件運送到第一底面視覺檢查部，以執行視覺檢查；卸載部310、320、330，從裝載部100接收裝有完成視覺檢查的元件1的托盤2，根據視覺檢查結果在托盤2分類元件1。 As shown in FIG. 1, the component processor according to the present invention includes: a loading unit 100 that loads a tray 2 containing a plurality of components 1 and linearly moves the tray 2; a first bottom visual inspection portion, and a loading portion 100 The conveyance direction of the tray 2 is perpendicular and disposed on one side of the loading portion 100, and visual inspection is performed on the component 1; the first guide rail 680 is perpendicular to the moving direction of the tray 2 of the loading portion 100; the first conveyance tool 610, and the first guide rail The 680 is combined to move along the first guide rail 680, and the pickup component is transported from the loading portion 100 to the first bottom visual inspection portion to perform visual inspection; the unloading portions 310, 320, 330 receive the completed vision from the loading portion 100. The tray 2 of the component 1 is inspected, and the component 1 is sorted in the tray 2 based on the visual inspection result.
在此，對於元件1，只要是完成半導體製程的半導體元件，都可以成為元件1的對象，具體有SD記憶體(RAM)、快閃記憶體、CPU、WLCSP等。 Here, the element 1 may be an object of the element 1 as long as it is a semiconductor device that completes a semiconductor process, and specifically includes an SD memory (RAM), a flash memory, a CPU, a WLCSP, and the like.
托盤2是裝載並運送8×10等行列結構的多個元件1的結構；一般是儲存元件等規格化的托盤。 The tray 2 is a structure in which a plurality of elements 1 of an 8×10 line structure are loaded and transported; generally, a standardized tray such as a storage element.
裝載部100是作為裝載作為檢查對象的元件1以執行視覺檢查的裝載結構，可具有各種結構。 The loading unit 100 is a loading structure that performs loading inspection as an element 1 to be inspected, and can have various configurations.
例如，裝載部100以安裝在形成於托盤2的裝載槽的狀態下運送裝有多個元件1的托盤2。 For example, the loading unit 100 transports the tray 2 in which the plurality of elements 1 are mounted in a state of being mounted on a loading slot formed in the tray 2.
裝載部100可具有各種結構，在圖1以及韓國公開專利公報第10-2008-0092671號所示，裝載部100可包括：引導部(圖未示出)，引導裝載有多個元件1的托盤2的移動；驅動部(圖未示出)，用於沿著引導部移動托盤2。 The loading unit 100 may have various structures, and the loading unit 100 may include a guiding portion (not shown) for guiding a tray loaded with a plurality of components 1 as shown in FIG. 1 and Korean Patent Laid-Open Publication No. 10-2008-0092671. Movement of 2; a driving portion (not shown) for moving the tray 2 along the guiding portion.
所述第一底面視覺檢查部可具有各種結構，並且所述第一底面視覺檢查部的結構如下：與裝載部100內的托盤2的運送方向垂直，並且 設置在裝載部100的一側，對元件1至少執行2D視覺檢查以及3D視覺檢查中的一種視覺檢查。 The first bottom visual inspection portion may have various structures, and the first bottom visual inspection portion is configured as follows: perpendicular to the conveying direction of the tray 2 in the loading portion 100, and Provided on one side of the loading unit 100, at least one of the 2D visual inspection and the 3D visual inspection is performed on the component 1.
尤其是，所述第一底面視覺檢查部作為利用攝影機、掃描器等獲取元件1的底面等的外觀圖像的結構，可具有各種結構。 In particular, the first bottom surface visual inspection unit has various configurations as a configuration for acquiring an external image such as a bottom surface of the element 1 by a camera, a scanner, or the like.
在此，通過所述第一底面視覺檢查部獲取的圖像可靈活應用於利用程式等分析圖像之後判斷是否合格的視覺檢查。 Here, the image acquired by the first bottom surface visual inspection unit can be flexibly applied to a visual inspection that judges whether or not it is acceptable after analyzing an image using a program or the like.
另一方面，所述第一底面視覺檢查部根據視覺檢查的種類可具有各種結構，尤其是較佳為使上述第一底面視覺檢查部構成能夠全部執行2D視覺檢查以及3D視覺檢查。 On the other hand, the first bottom visual inspection unit may have various configurations depending on the type of visual inspection. In particular, it is preferable that the first bottom visual inspection unit configuration can perform both 2D visual inspection and 3D visual inspection.
例如，所述第一底面視覺檢查部可包括：對由第一運送工具610拾取並運送的元件1的底面執行3D視覺檢查的3D視覺檢查部410；對由第一運送工具610拾取並運送的元件1的底面執行2D視覺檢查的2D視覺檢查部460。 For example, the first bottom visual inspection portion may include a 3D visual inspection portion 410 that performs a 3D visual inspection on the bottom surface of the component 1 picked up and transported by the first transport tool 610; and is picked up and transported by the first transport tool 610. The 2D visual inspection unit 460 that performs 2D visual inspection on the bottom surface of the element 1 is performed.
3D視覺檢查部410作為對由第一運送工具610拾取並運送的元件1的底面執行3D視覺檢查的結構，可具有各種結構。 The 3D visual inspection unit 410 has a configuration in which a 3D visual inspection is performed on the bottom surface of the element 1 picked up and transported by the first transport tool 610, and has various configurations.
例如，3D視覺檢查部410可包括：第一圖像獲取部，獲取由第一運送工具610拾取並運送的元件1的底面圖像，以執行3D視覺檢查；第一光源部，將光照射於由第一運送工具610拾取並運送的元件1的底面，以使第一圖像獲取部獲取圖像。 For example, the 3D visual inspection section 410 may include a first image acquisition section that acquires a bottom image of the component 1 picked up and transported by the first transporting tool 610 to perform a 3D visual inspection; and a first light source section that illuminates the light The bottom surface of the component 1 picked up and transported by the first transport tool 610 causes the first image acquisition section to acquire an image.
然後，2D視覺檢查部460可包括：第二圖像獲取部，獲取由第一運送工具610拾取的元件1的底面圖像，以執行2D視覺檢查；第二光源部，將光照射於由第一運送工具610拾取的元件1的底面，以使第二圖像獲取部獲取圖像。 Then, the 2D visual inspection unit 460 may include: a second image acquisition unit that acquires a bottom image of the component 1 picked up by the first transport tool 610 to perform a 2D visual inspection; and a second light source portion that illuminates the light A conveyance tool 610 picks up the bottom surface of the component 1 to cause the second image acquisition section to acquire an image.
另一方面，根據2D視覺檢查部460以及3D視覺檢查部410的結構以及配置，所述第一底面視覺檢查部可具有各種結構。 On the other hand, the first bottom visual inspection unit may have various configurations according to the configuration and arrangement of the 2D visual inspection unit 460 and the 3D visual inspection unit 410.
首先，所述第一底面視覺檢查部的結構與韓國公開專利公報第10-2010-0122140號的實施例以及圖2a和圖2b示出的相同。 First, the structure of the first bottom visual inspection portion is the same as that shown in the embodiment of Korean Laid-Open Patent Publication No. 10-2010-0122140 and Figs. 2a and 2b.
在此，3D視覺檢查部410的第一光源部可具有各種結構，並且可使用諸如雷射的單色光、白色光等。 Here, the first light source section of the 3D visual inspection section 410 may have various structures, and monochromatic light such as laser light, white light, or the like may be used.
尤其是，作為檢測物件的三維形狀超小的情況下，若使用雷射，則散反射大，因此很難檢測，最好使用散反射少的白色光。 In particular, when the three-dimensional shape of the object to be detected is extremely small, if a laser is used, the scattered reflection is large, so that it is difficult to detect, and it is preferable to use white light with less scattered reflection.
然後，3D視覺檢查部410的第一光源部較佳以狹縫形狀照射於元件1的表面，並且可包括光纖、狹縫部，其中光纖從光源傳達光，狹縫部與所述光纖連接並將狹縫形狀的光照射於元件1表面。 Then, the first light source portion of the 3D visual inspection portion 410 is preferably irradiated on the surface of the element 1 in a slit shape, and may include an optical fiber, a slit portion, wherein the optical fiber transmits light from the light source, and the slit portion is connected to the optical fiber and narrow The slit-shaped light is irradiated onto the surface of the element 1.
第一導軌680可具有各種結構，並且第一導軌680的結構如下：與裝載部100中的托盤2的移動方向垂直配置，並且支撐後述的第一運送工具610和第一上面視覺檢查部的同時引導第一運送工具610和第一上面視覺檢查部的移動。 The first guide rail 680 may have various structures, and the first guide rail 680 is configured as follows: disposed perpendicularly to the moving direction of the tray 2 in the loading portion 100, and supporting the first transporting tool 610 and the first upper visual inspection portion, which will be described later The movement of the first transport tool 610 and the first upper visual inspection portion is guided.
尤其是，第一導軌680設置有線性驅動模組，以用於驅動第一運送工具610以及第一上面視覺檢查部420的線性移動，並且為使第一運送工具610以及第一上面視覺檢查部420相互連動地移動，第一導軌680可移動地結合支撐部件，該支撐部件結合並支撐第一運送工具610以及第一上面視覺檢查部420。 In particular, the first guide rail 680 is provided with a linear drive module for driving the linear movement of the first transport tool 610 and the first upper visual inspection portion 420, and for the first transport tool 610 and the first upper visual inspection portion. The 420 moves in conjunction with each other, and the first guide rail 680 movably couples the support member that engages and supports the first transport tool 610 and the first upper visual inspection portion 420.
所述線性驅動模組是用於沿著第一導軌680線性移動支撐部件的結構，可具有各種結構；具體有旋轉馬達、皮帶和皮帶輪的結構以及螺旋升降機的結構等。 The linear drive module is a structure for linearly moving the support member along the first guide rail 680, and has various structures; specifically, a structure of a rotary motor, a belt and a pulley, and a structure of a screw jack.
支撐部件作為結合第一運送工具610以及第一上面視覺檢查部420全部以使第一運送工具610和第一上面視覺檢查部420相互連動地移動的結構，只要是可沿著第一導軌680線性移動的結構，可以使用任何一種結構。 The support member is configured to combine the first transport tool 610 and the first upper visual inspection portion 420 to move the first transport tool 610 and the first upper visual inspection portion 420 in conjunction with each other as long as it is linear along the first guide rail 680. The structure of the movement can be any structure.
第一運送工具610可具有各種結構，並且第一運送工具610的結構如下：與第一導軌680結合，進而沿著第一導軌680移動，並且為了執行視覺檢查，從裝載部100拾取元件運送到第一底面視覺檢查部。 The first transporting tool 610 may have various structures, and the first transporting tool 610 is structured as follows: in combination with the first rail 680, thereby moving along the first rail 680, and in order to perform visual inspection, picking up components from the loading section 100 to The first bottom visual inspection unit.
例如，第一運送工具610包括用於拾取一個以上的元件1的拾取工具(圖未示出)，較佳為設置多個拾取工具，並且設置成一列或者多列，以提高檢查速度。 For example, the first transport tool 610 includes a pick-up tool (not shown) for picking up more than one component 1, preferably a plurality of pick-up tools, and arranged in one or more columns to increase the inspection speed.
所述拾取工具作為通過真空壓拾取元件1的結構，可具有各種結構。 The pick-up tool can have various structures as a structure by which the vacuum pickup element 1 is passed.
另一方面，在第一導軌680還可設置第一上面視覺檢查部420，該第一上面視覺檢查部420與第一導軌680結合，並且在第一運送工具610移動到第一底面視覺檢查部時，檢查裝載於裝載部100的托盤2的元件1的上面。 On the other hand, a first upper visual inspection portion 420 may be further disposed on the first guide rail 680, the first upper visual inspection portion 420 is coupled to the first guide rail 680, and moved to the first bottom surface visual inspection portion at the first conveyance tool 610. At the time, the upper surface of the component 1 of the tray 2 loaded on the loading unit 100 is inspected.
第一上面視覺檢查部420可具有各種結構，並且第一上面視覺檢查部420的結構如下：與第一導軌680結合，並且在第一運送工具610向第一底面視覺檢查部移動時，檢查裝載於裝載部100的托盤2的元件1的上面。 The first upper visual inspection portion 420 may have various structures, and the first upper visual inspection portion 420 is configured as follows: in combination with the first guide rail 680, and inspecting loading when the first transporting tool 610 moves toward the first bottom visual inspection portion On the upper surface of the component 1 of the tray 2 of the loading unit 100.
第一上面視覺檢查部420獲取裝載於托盤2的元件1的圖像，分析獲取的元件1的圖像，尤其是對應於通過第一底面視覺檢查部獲取的底面分析元件1上面的圖像來檢查元件狀態。 The first upper visual inspection unit 420 acquires an image of the element 1 loaded on the tray 2, and analyzes the acquired image of the element 1, in particular, corresponding to the image on the bottom surface analysis element 1 acquired by the first bottom surface visual inspection portion. Check the component status.
尤其是，第一上面視覺檢查部420可靈活應用於檢查在元件上面的標記(文字、標識等)。 In particular, the first upper visual inspection section 420 can be flexibly applied to inspect marks (characters, logos, etc.) on the components.
另一方面，在通過第一運送工具610拾取進而在第一底面視覺檢查部完成檢查之後，第一上面視覺檢查部420對裝載於托盤2的元件1執行視覺檢查是最有效的。 On the other hand, after the first transport tool 610 picks up and then completes the inspection by the first bottom visual inspection unit, the first upper visual inspection unit 420 is most effective in performing visual inspection on the component 1 loaded on the tray 2.
然後，根據檢查條件，使第一上面視覺檢查部420構成能夠獲取一個元件1或者二個以上元件1的圖像。 Then, based on the inspection conditions, the first upper visual inspection unit 420 constitutes an image capable of acquiring one element 1 or two or more elements 1.
此時，為了檢查以及移動效率，第一上面視覺檢查部420可連動於第一運送工具610的移動來進行移動。 At this time, for the inspection and the movement efficiency, the first upper visual inspection unit 420 can move in conjunction with the movement of the first transport tool 610.
卸載部310、320、330可具有各種結構，並且卸載部310、320、330結構如下：從裝載部100接收裝有完成視覺檢查的元件1的托盤2，根據視覺檢查結果在該托盤2分類元件1。 The unloading portions 310, 320, 330 may have various structures, and the unloading portions 310, 320, 330 are structured as follows: a tray 2 containing the component 1 for performing visual inspection is received from the loading portion 100, and components are sorted in the tray 2 according to visual inspection results. 1.
較佳為，卸載部310、320、330具有與裝載部100類似的結構，並且根據元件1的檢查結果數量，賦予合格(G)、不合格1或者異常(R1)、不合格2或者異常2(R2)等的分類等級。 Preferably, the unloading portions 310, 320, 330 have a structure similar to that of the loading portion 100, and are given a pass (G), a fail 1 or an abnormality (R1), a fail 2, or an abnormality 2 according to the number of inspection results of the component 1. Classification level of (R2), etc.
然後，卸載部310、320、330可平行地設置多個卸載托盤部，該等卸載托盤部包括平行地設置在裝載部100一側的引導部(圖未示出)；用於沿著引導部移動托盤2的驅動部(圖未示出)。 Then, the unloading portions 310, 320, 330 may be provided in parallel with a plurality of unloading tray portions including guide portions (not shown) disposed in parallel on one side of the loading portion 100; for following the guide portions The driving portion (not shown) of the tray 2 is moved.
另一方面，托盤2在裝載部100與卸載部310、320、330之間可被托盤運送裝置(圖未示出)運送，並且還可包括空托盤部200，將未裝載有元件1的空托盤2供應於卸載部310、320、330。 On the other hand, the tray 2 can be transported between the loading portion 100 and the unloading portions 310, 320, 330 by a tray transport device (not shown), and can also include an empty tray portion 200, which will be empty without the component 1 The tray 2 is supplied to the unloading portions 310, 320, 330.
此時，空托盤部200可包括：平行地設置在裝載部100一側的引導部(圖未示出)、用於沿著引導部移動托盤2的驅動部(圖未示出)。 At this time, the empty tray portion 200 may include a guide portion (not shown) provided in parallel on the loading portion 100 side, and a driving portion (not shown) for moving the tray 2 along the guide portion.
另外，卸載部310、320、330可單獨設置分揀工具620，該分揀工具620在各個卸載托盤部之間按照各個卸載托盤部的分類等級運送元件1。 Further, the unloading portions 310, 320, 330 may separately provide the sorting tool 620 that transports the components 1 between the respective unloading tray portions in accordance with the sorting level of each of the unloading tray portions.
所述分揀工具620具有與上述第一運送工具610相同或者類似的結構，並且可具有雙列結構或者單列結構。 The sorting tool 620 has the same or similar structure as the first transporting tool 610 described above, and may have a double column structure or a single column structure.
另一方面，卸載部310、320、330是舉例說明在裝載部100中裝載的托盤2重新裝載的狀態下進行卸載的實施例，但可以是裝載元件1後進行卸載的結構，可使用任何一種結構；其中卸載結構包括裝載於形成有裝載元件1的口袋的載帶後進行卸載的所謂捲帶模組等。 On the other hand, the unloading portions 310, 320, and 330 are examples in which the unloading is performed in a state where the tray 2 loaded in the loading unit 100 is reloaded, but may be a structure in which the component 1 is loaded and unloaded, and any one may be used. The structure; wherein the unloading structure includes a so-called take-up reel module or the like that is loaded after being loaded on a carrier tape in which the pocket of the loading member 1 is formed.
具有如上所述結構的元件處理器具有如下的優點：裝載裝有多個元件1的托盤2的裝載部100中，使用於視覺檢查的視覺檢查模組(第一底面視覺檢查部)位於裝載部100的一側，並且上面檢查模組(第一上面視覺檢查部420)連動於第一運送工具610的移動，以對元件1上面進行檢查，進而根據有效配置模組，可縮小元件處理器的大小，其中上面檢查模組為了進行視覺檢查，在從托盤2拾取元件1的第一運送工具610移動到視覺檢查模組時，對裝載於托盤2的元件1上面執行視覺檢查。 The component processor having the above configuration has an advantage in that the visual inspection module (first bottom visual inspection portion) for visual inspection is placed in the loading portion in the loading portion 100 on which the tray 2 containing the plurality of components 1 is loaded. One side of 100, and the upper inspection module (first upper visual inspection unit 420) is linked to the movement of the first transport tool 610 to inspect the upper surface of the component 1, and thereby the component processor can be reduced according to the effective configuration module. The size, in which the upper inspection module performs a visual inspection on the component 1 loaded on the tray 2 when the first conveyance tool 610 picking up the component 1 from the tray 2 is moved to the visual inspection module for visual inspection.
另一方面，根據本發明的元件處理器，根據如上所述的第一底面視覺檢查部以及第一上面視覺檢查部420的配置由於存在多餘的空間，進而還可設置用於對元件處理器增加功能的模組，設置視覺檢查模組等，執行與第一底面視覺檢查部以及第一上面視覺檢查部420不同種類的視覺檢查。 On the other hand, according to the component processor of the present invention, according to the configuration of the first bottom visual inspection portion and the first upper visual inspection portion 420 as described above, since there is excess space, it is further provided for adding to the component processor. The function module is provided with a visual inspection module or the like, and performs different types of visual inspections from the first bottom visual inspection unit and the first upper visual inspection unit 420.
舉另一示例，本發明可包括：裝載部100，裝載裝有多個元件1的托盤2，並使托盤2線性移動；導軌，與所述裝載部100的托盤2的移動方向垂直；底面視覺檢查部，與所述裝載部100內的托盤2的運送方向相垂直，並且設置在所述裝載部100一側來對元件1執行視覺檢查；運送工具， 與所述導軌結合，進而沿著所述導軌移動，並且為了執行視覺檢查，從所述裝載部100拾取元件運送到所述底面視覺檢查部；卸載部310、320、330，從所述裝載部100接收裝有完成視覺檢查的元件1的托盤2，根據視覺檢查結果在該托盤2分類元件1。 As another example, the present invention may include a loading unit 100 that loads a tray 2 containing a plurality of components 1 and linearly moves the tray 2; a guide rail that is perpendicular to a moving direction of the tray 2 of the loading section 100; The inspection unit is perpendicular to the conveyance direction of the tray 2 in the loading unit 100, and is disposed on the side of the loading unit 100 to perform visual inspection on the component 1; Cooperating with the guide rail to move along the guide rail, and in order to perform visual inspection, picking up components from the loading portion 100 to the bottom visual inspection portion; unloading portions 310, 320, 330 from the loading portion 100 receives the tray 2 containing the component 1 for performing visual inspection, and classifies the component 1 in the tray 2 based on the visual inspection result.
所述底面視覺檢查部包括：視覺檢查部430，對於由所述運送工具拾取的元件1底面至少執行2D視覺檢查以及3D視覺檢查中的一種視覺檢查；側面檢查部470，對由所述運送工具拾取的直角四邊形的元件1的側面執行視覺檢查。 The bottom visual inspection unit includes: a visual inspection unit 430 that performs at least one of a 2D visual inspection and a 3D visual inspection on the bottom surface of the component 1 picked up by the transportation tool; a side inspection portion 470, which is used by the transportation tool The side of the right-angled quadrilateral element 1 is picked up for visual inspection.
作為一實施例，本發明的元件處理器包括：第一導軌680以及第二導軌690作為導軌；第一運送工具610以及第二運送工具630作為運送工具；第一底面視覺檢查部以及第二底面視覺檢查部作為底面視覺檢查部。 As an embodiment, the component processor of the present invention includes: a first guide rail 680 and a second guide rail 690 as guide rails; a first transport tool 610 and a second transport tool 630 as a transport tool; a first bottom visual inspection portion and a second bottom surface The visual inspection unit serves as a bottom visual inspection unit.
具體地說，例如，如圖1所示，根據本發明的元件處理器可包括：第二導軌690，以裝載部100的托盤2的運送方向為基準，在第一導軌680的後方與第一導軌680平行配置；第二底面視覺檢查部，與裝載部100內的托盤2的運送方向垂直，並設置在裝載部100一側，對元件1執行視覺檢查；第二運送工具630，與第二導軌690結合，進而沿著第二導軌690移動，並且為了執行視覺檢查從裝載部100拾取元件運送到第二底面視覺檢查部。 Specifically, for example, as shown in FIG. 1, the component processor according to the present invention may include a second guide rail 690 that is rearward of the first guide rail 680 and first with respect to the transport direction of the tray 2 of the loading portion 100. The guide rails 680 are arranged in parallel; the second bottom visual inspection unit is perpendicular to the transport direction of the tray 2 in the loading unit 100, and is disposed on the side of the loading unit 100 to perform visual inspection on the component 1; the second transport tool 630, and the second The guide rails 690 are coupled to move along the second guide rail 690, and are transported from the loading portion 100 to the second bottom visual inspection portion for performing visual inspection.
第二導軌690可具有類似於第一導軌的結構，並且第二導軌690的結構如下：以裝載部100的托盤2的運送方向為基準，在第一導軌680的後方與第一導軌680平行地配置。 The second rail 690 may have a structure similar to the first rail, and the second rail 690 is structured as follows: in parallel with the first rail 680 at the rear of the first rail 680 with reference to the transport direction of the tray 2 of the loading portion 100 Configuration.
所述第二底面視覺檢查部具有與第一底面視覺檢查部類似的結構，並且根據視覺檢查的種類以及方式可具有各種結構，並且所述第二底面視覺檢查部的結構如下：與裝載部100內的托盤2的運送方向垂直，並設置在裝載部100的一側，可對元件1至少執行2D視覺檢查以及3D視覺檢查中的一種追加視覺檢查。 The second bottom visual inspection portion has a structure similar to that of the first bottom visual inspection portion, and may have various structures according to the type and manner of visual inspection, and the second bottom visual inspection portion is configured as follows: The transport direction of the inner tray 2 is vertical and is provided on one side of the loading unit 100, and at least one of the 2D visual inspection and the 3D visual inspection can be performed on the component 1 for additional visual inspection.
例如，所述第二底面視覺檢查部至少執行解析度不同的2D視覺檢查以及3D視覺檢查中的一種視覺檢查，例如檢查輕微裂紋、輕微劃痕、毛邊(Burr)等。 For example, the second bottom visual inspection unit performs at least one of a 2D visual inspection and a 3D visual inspection having different degrees of resolution, such as checking for a slight crack, a slight scratch, a Burr, and the like.
具體舉例說明，所述第二底面視覺檢查部可包括：視覺檢查部430，對於由第一運送工具610拾取的元件1的底面至少執行2D視覺檢查以 及3D視覺檢查中的一種視覺檢查；側面檢查部470，對由第一運送工具610拾取的直角四邊形元件1的側面執行視覺檢查。 Specifically, the second bottom visual inspection portion may include: a visual inspection portion 430 that performs at least 2D visual inspection on the bottom surface of the component 1 picked up by the first transport tool 610. And a visual inspection in the 3D visual inspection; the side inspection portion 470 performs a visual inspection on the side surface of the rectangular quadrilateral element 1 picked up by the first conveyance tool 610.
視覺檢查部430根據視覺檢查方式可具有各種結構，所述視覺檢查部430可對由第一運送工具610拾取的元件1的底面至少執行追加2D視覺檢查以及追加3D視覺檢查中的一種視覺檢查。 The visual inspection unit 430 can have various configurations according to the visual inspection method, and the visual inspection unit 430 can perform at least one of the additional 2D visual inspection and the additional 3D visual inspection on the bottom surface of the element 1 picked up by the first transport tool 610.
側面檢查部470作為由第一運送工具610拾取的直角四邊形元件1側面執行視覺檢查的結構，可具有各種結構。 The side inspection portion 470 has a configuration in which the side surface of the rectangular quadrilateral element 1 picked up by the first conveyance tool 610 is visually inspected, and has various configurations.
例如，側面檢查部470可包括一對圖像獲取部471，該對圖像獲取部471相互面對面配置在由第二運送工具630拾取的元件1的移動通道兩側，以獲取移動的元件1的側面圖像。 For example, the side inspection portion 470 may include a pair of image acquisition portions 471 disposed to face each other on both sides of the movement path of the element 1 picked up by the second conveyance tool 630 to acquire the moving element 1 Side image.
該對圖像獲取部471可具有各種結構，具體有攝影機、掃描器等，並且該對圖像獲取部471的結構如下：相互面對面配置在由第二運送工具630拾取的元件1的移動通道兩側，並且獲取由第二運送工具630拾取的一個以上的元件1側面圖像。 The pair of image acquisition sections 471 may have various configurations, specifically a camera, a scanner, etc., and the pair of image acquisition sections 471 are configured as follows: two moving channels disposed on the component 1 picked up by the second transport tool 630 Side, and acquires one side image of one or more elements 1 picked up by the second transport tool 630.
尤其是，如圖2以及圖3所示，該對圖像獲取部471的獲取方式如下：元件1的平面形狀為直角四邊形，當第二運送工具630在該對圖像獲取部471之間移動時，該對圖像獲取部471可獲取元件1的側面中相互面對的第一側面的圖像。 In particular, as shown in FIGS. 2 and 3, the pair of image acquiring sections 471 are acquired in such a manner that the planar shape of the element 1 is a rectangular quadrangle, and the second transporting tool 630 moves between the pair of image acquiring sections 471. At this time, the pair of image acquiring sections 471 can acquire images of the first side faces facing each other in the side faces of the component 1.
然後，如圖2(a)或者圖3(a)所示，第二運送工具630在移動到該對圖像獲取部471之間時，該對圖像獲取部471獲取在元件1的側面中相互面對的第一側面的圖像；之後如圖2(b)以及圖3(b)所示，第二運送工具630將元件1旋轉90°，以使該對圖像獲取部471獲取在元件1的側面中相互面對的第二側面的圖像；之後如圖2(c)以及圖3(c)所示，再次向裝載部100側移動，同時該對圖像獲取部471可獲取在元件1的側面中相互面對的第二側面的圖像。 Then, as shown in FIG. 2(a) or FIG. 3(a), when the second transporting tool 630 moves between the pair of image acquiring sections 471, the pair of image acquiring sections 471 are acquired in the side of the component 1. An image of the first side facing each other; then, as shown in FIGS. 2(b) and 3(b), the second transporting tool 630 rotates the element 1 by 90° so that the pair of image acquiring units 471 acquires An image of the second side facing each other in the side surface of the element 1; thereafter, as shown in FIG. 2(c) and FIG. 3(c), the loading portion 100 is moved again, and the pair of image acquiring portions 471 can acquire An image of the second side facing each other in the side of the element 1.
也就是說，如圖2(a)或者圖3(a)所示，在拾取元件1的第二運送工具630以第一方向(例如，遠離裝載部100的方向)移動的同時，所述一對圖像獲取部471首次獲取第一側面的圖像，如圖2(b)以及圖3(b)所示；通過第二運送工具630旋轉90°，之後如圖2(c)以及圖3(c)所示， 拾取元件1的第二運送工具630以第二方向(例如，向裝載部100側的方向)移動的同時可第二次獲取第二側面的圖像。 That is, as shown in FIG. 2(a) or FIG. 3(a), while the second transporting tool 630 of the pickup element 1 is moved in the first direction (for example, away from the loading portion 100), the one The image of the first side is first acquired by the image acquisition section 471 as shown in FIGS. 2(b) and 3(b); rotated by 90° by the second transport tool 630, and then as shown in FIG. 2(c) and FIG. (c), The second transport tool 630 of the pickup element 1 can acquire the image of the second side a second time while moving in the second direction (for example, the direction toward the loading portion 100 side).
在此，第二運送工具630可包括配置成多列的多個拾取器。 Here, the second transport tool 630 may include a plurality of pickers configured in a plurality of columns.
此時，如圖2以及圖3所示，以各個列的拾取器為基準，可分別配置一對圖像獲取部471，並且相互面對面設置該對圖像獲取部471。 At this time, as shown in FIG. 2 and FIG. 3, a pair of image acquiring sections 471 are respectively disposed on the basis of the pickups of the respective columns, and the pair of image acquiring sections 471 are disposed facing each other.
另一方面，可從裝載部100依次配置視覺檢查部430以及側面檢查部470。 On the other hand, the visual inspection unit 430 and the side inspection unit 470 can be disposed in order from the loading unit 100.
第二運送工具630可具有與上述第一運送工具610相同或者類似的結構，並且第二運送工具630的結構如下：結合於第二導軌690，進而沿著第二導軌690移動，並且執行從裝載部100拾取元件運送到第二底面視覺檢查部的視覺檢查。 The second transport tool 630 may have the same or similar structure as the first transport tool 610 described above, and the second transport tool 630 is structured as follows: coupled to the second rail 690, and thus moved along the second rail 690, and performs loading from The portion 100 picks up the component and transports it to a visual inspection of the second bottom visual inspection portion.
另一方面，第二導軌690還可設置後續上面視覺檢查部(圖未示出)，即第二上面視覺檢查部440，該後續上面視覺檢查部執行與上述第一上面視覺檢查部420類似的檢查。 On the other hand, the second guide rail 690 may further be provided with a subsequent upper visual inspection portion (not shown), that is, a second upper visual inspection portion 440 which performs similar to the first upper visual inspection portion 420 described above. an examination.
亦即，對於所述第二底面視覺檢查部以及第二上面視覺檢查部440的設置，可與第一底面視覺檢查部以及第一上面視覺檢查部420的結合和移動相同或者類似。 That is, the arrangement of the second bottom visual inspection unit and the second upper visual inspection unit 440 may be the same as or similar to the combination and movement of the first bottom visual inspection unit and the first upper visual inspection unit 420.
與上述相反，如圖1所示，對於所述第一底面視覺檢查部以及第一上面視覺檢查部420的組合結構，以裝載部100內的托盤2的運送方向配置多列(圖1的情況配置為兩列)。 In contrast to the above, as shown in FIG. 1, in the combined configuration of the first bottom visual inspection unit and the first upper visual inspection unit 420, a plurality of rows are arranged in the transport direction of the tray 2 in the loading unit 100 (the case of FIG. 1). Configured in two columns).
此時，能夠以與裝載部100內的托盤2的運送方向垂直的方向配置所述第一底面視覺檢查部以及第一上面視覺檢查部420。 At this time, the first bottom surface visual inspection unit and the first upper visual inspection unit 420 can be disposed in a direction perpendicular to the conveyance direction of the tray 2 in the loading unit 100.
然後，為使第一上面視覺檢查部420以與裝載部100內的托盤2的運送方向垂直的方向線性移動，可設置一個以上的導軌680、690。 Then, in order to linearly move the first upper visual inspection unit 420 in a direction perpendicular to the transport direction of the tray 2 in the loading unit 100, one or more guide rails 680 and 690 may be provided.
另一方面，第二導軌690作為用於引導第二運送工具690以及第二上面視覺檢查部440線性移動的結構，可具有與第一導軌680類似的結構。 On the other hand, the second guide rail 690 has a structure similar to that of the first guide rail 680 as a structure for guiding the second conveyance tool 690 and the second upper visual inspection portion 440 to linearly move.
再者，第二導軌690可與第一導軌680構成一個部件，此時第一底面視覺檢查部以及第一上面視覺檢查部420可配置在第一導軌680的前 方側；第二底面視覺檢查部以及第二上面視覺檢查部440可配置在第二導軌690的前方側。 Furthermore, the second guide rail 690 can form a component with the first guide rail 680, and the first bottom visual inspection portion and the first upper visual inspection portion 420 can be disposed in front of the first guide rail 680. The square side; the second bottom visual inspection unit and the second upper visual inspection unit 440 may be disposed on the front side of the second guide rail 690.
所述第二底面視覺檢查部作為執行與第一底面視覺檢查部類似的檢查的結構，可具有與第一底面視覺檢查部類似的結構，並且作為至少執行2D視覺檢查以及3D視覺檢查中的一種視覺檢查的結構，可具有各種結構。 The second bottom surface visual inspection portion may have a structure similar to that of the first bottom surface visual inspection portion as a structure for performing an inspection similar to the first bottom surface visual inspection portion, and as at least one of performing 2D visual inspection and 3D visual inspection. The structure of the visual inspection can have various structures.
另一方面，如圖1所示，所述元件處理器在第一底面視覺檢查部以及第一上面視覺檢查部420的組合結構上還可包括第三上面視覺檢查部450，該第三上面視覺檢查部450設置在裝載部100內的托盤2的運送路徑上，並對元件1執行視覺檢查。 On the other hand, as shown in FIG. 1, the component processor may further include a third upper visual inspection portion 450 on the combined structure of the first bottom visual inspection portion and the first upper visual inspection portion 420, the third upper visual The inspection unit 450 is disposed on the conveyance path of the tray 2 in the loading unit 100, and performs visual inspection on the component 1.
在裝載部100與卸載部310、320、330之間通過托盤傳送裝置(圖未示出)運送托盤2時，為了防止第三上面視覺檢查部450干涉，使第三上面視覺檢查部450沿著與裝載部100內的托盤2的運送路徑相垂直的水平方向線性移動。 When the tray 2 is transported between the loading unit 100 and the unloading units 310, 320, 330 by a tray transport device (not shown), in order to prevent the third upper visual inspection unit 450 from interfering, the third upper visual inspection portion 450 is caused to follow along It moves linearly in the horizontal direction perpendicular to the conveyance path of the tray 2 in the loading unit 100.
亦即，第三上面視覺檢查部450設置在裝載部100的末端部分，為了在托盤傳送裝置(圖未示出)運送托盤2時防止第三上面視覺檢查部450干涉，可使第三上面視覺檢查部450向裝載部100的一側(即，圖面中的右側)移動。 That is, the third upper visual inspection portion 450 is provided at the end portion of the loading portion 100, and in order to prevent the third upper visual inspection portion 450 from interfering when the tray conveyance device (not shown) transports the tray 2, the third upper vision can be made. The inspection unit 450 moves to one side of the loading unit 100 (that is, the right side in the drawing).
另一方面，第三上面視覺檢查部450作為與上述第一上面視覺檢查部420或者第二上面視覺檢查部440類似的結構，並且作為至少執行2D視覺檢查以及3D視覺檢查中一種視覺檢查的結構，可具有各種結構。 On the other hand, the third upper visual inspection section 450 has a structure similar to that of the first upper visual inspection section 420 or the second upper visual inspection section 440 described above, and is a structure that performs at least one visual inspection in 2D visual inspection and 3D visual inspection. It can have various structures.
以上，示例性說明本發明的較佳實施例，但是本發明並不被上述特定實施例限定，並且可在申請專利範圍記載的範疇內做出適當改變。 The preferred embodiments of the present invention are exemplified above, but the present invention is not limited to the specific embodiments described above, and may be appropriately modified within the scope of the claims.
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2016
- 2016-06-14 KR KR1020160073780A patent/KR102594344B1/en active IP Right Grant
-
2017
- 2017-06-14 WO PCT/KR2017/006216 patent/WO2017217772A1/en active Application Filing
- 2017-06-14 TW TW106119875A patent/TWI668437B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234361A (en) * | 2002-02-07 | 2003-08-22 | Mitsui High Tec Inc | Method and facilities for inspecting semiconductor device |
| TW200901349A (en) * | 2007-03-30 | 2009-01-01 | Intekplus Co Ltd | Vision inspection system for semiconductor devices |
| CN101652848A (en) * | 2007-04-13 | 2010-02-17 | 宰体有限公司 | Be used to detect the device of semiconductor equipment |
| US20090049681A1 (en) * | 2007-08-23 | 2009-02-26 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
| KR20140022988A (en) * | 2012-08-14 | 2014-02-26 | (주)제이티 | Device handler and reel fixing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201743050A (en) | 2017-12-16 |
| KR20170140964A (en) | 2017-12-22 |
| WO2017217772A1 (en) | 2017-12-21 |
| KR102594344B1 (en) | 2023-10-26 |
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