TWI666346B - 電鍍設備 - Google Patents

電鍍設備 Download PDF

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Publication number
TWI666346B
TWI666346B TW107141288A TW107141288A TWI666346B TW I666346 B TWI666346 B TW I666346B TW 107141288 A TW107141288 A TW 107141288A TW 107141288 A TW107141288 A TW 107141288A TW I666346 B TWI666346 B TW I666346B
Authority
TW
Taiwan
Prior art keywords
extension
rotating cathode
electrolyte
supply unit
item
Prior art date
Application number
TW107141288A
Other languages
English (en)
Chinese (zh)
Other versions
TW201925547A (zh
Inventor
李東垠
李載坤
金鍾權
鄭官顥
Original Assignee
南韓商波斯可股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商波斯可股份有限公司 filed Critical 南韓商波斯可股份有限公司
Publication of TW201925547A publication Critical patent/TW201925547A/zh
Application granted granted Critical
Publication of TWI666346B publication Critical patent/TWI666346B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
TW107141288A 2017-11-28 2018-11-20 電鍍設備 TWI666346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2017-0160541 2017-11-28
KR1020170160541A KR102045630B1 (ko) 2017-11-28 2017-11-28 전주 도금 장치

Publications (2)

Publication Number Publication Date
TW201925547A TW201925547A (zh) 2019-07-01
TWI666346B true TWI666346B (zh) 2019-07-21

Family

ID=66665655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107141288A TWI666346B (zh) 2017-11-28 2018-11-20 電鍍設備

Country Status (3)

Country Link
KR (1) KR102045630B1 (ko)
TW (1) TWI666346B (ko)
WO (1) WO2019107740A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113089034B (zh) * 2021-04-02 2021-10-08 广东嘉元科技股份有限公司 一种侧液槽、电解液流动方法、生箔机及其工作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1523137A (zh) * 2003-02-17 2004-08-25 未来金属株式会社 使用电铸技术的金属纤维制造装置及其方法
US6984456B2 (en) * 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
TWI342900B (ko) * 2006-11-08 2011-06-01

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426127B2 (ja) * 2001-03-29 2010-03-03 三井金属鉱業株式会社 金属箔電解製造装置
KR100451253B1 (ko) * 2001-11-09 2004-10-06 엘지전선 주식회사 전해동박 제조장치
JP2010090467A (ja) * 2008-10-10 2010-04-22 Mitsubishi Materials Corp めっき装置
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984456B2 (en) * 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
CN1523137A (zh) * 2003-02-17 2004-08-25 未来金属株式会社 使用电铸技术的金属纤维制造装置及其方法
TWI342900B (ko) * 2006-11-08 2011-06-01

Also Published As

Publication number Publication date
KR102045630B1 (ko) 2019-11-15
KR20190061799A (ko) 2019-06-05
WO2019107740A1 (ko) 2019-06-06
TW201925547A (zh) 2019-07-01

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MM4A Annulment or lapse of patent due to non-payment of fees