TWI665276B - Composition and laminated body - Google Patents

Composition and laminated body Download PDF

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TWI665276B
TWI665276B TW104134147A TW104134147A TWI665276B TW I665276 B TWI665276 B TW I665276B TW 104134147 A TW104134147 A TW 104134147A TW 104134147 A TW104134147 A TW 104134147A TW I665276 B TWI665276 B TW I665276B
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mass
composition
laminated body
propylene
copolymer
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TW201619326A (en
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田邨奈穗子
石田康之
中道夏樹
高橋宏光
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日商東麗薄膜先端加工股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10Homopolymers or copolymers of propene
    • C08L23/14Copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10Homopolymers or copolymers of propene
    • C09J123/14Copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02Homopolymers or copolymers of hydrocarbons
    • C09J125/04Homopolymers or copolymers of styrene
    • C09J125/08Copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)

Abstract

本發明係關於一種組成物,其係用以提供貼合於被黏著體時之黏著特性及加工特性優異之積層體;及關於一種由前述組成物所構成之積層體。 The present invention relates to a composition for providing a laminated body having excellent adhesion characteristics and processing characteristics when adhered to an adherend, and a laminated body composed of the foregoing composition.

一種組成物,其特徵在於:其係滿足以下之條件1及2。 A composition characterized in that it satisfies the following conditions 1 and 2.

條件1 頻率1Hz、溫度0℃之剪切損失正切(tanδ0℃)為0.20以上0.60以下。 Condition 1 The shear loss tangent (tanδ 0 ° C ) at a frequency of 1 Hz and a temperature of 0 ° C is 0.20 or more and 0.60 or less.

條件2 頻率1Hz、溫度100℃之剪切損失正切(tanδ100℃)為0.40以上0.80以下。 Condition 2 The shear loss tangent (tan δ 100 ° C ) at a frequency of 1 Hz and a temperature of 100 ° C is 0.40 or more and 0.80 or less.

Description

組成物及積層體 Composition and laminated body

本發明係有關於一種組成物、及一種由前述組成物所構成之積層體,該組成物係用以提供貼合於被黏著體時之黏著特性及加工特性優異之積層體。 The present invention relates to a composition and a laminated body composed of the aforementioned composition, and the composition is used to provide a laminated body having excellent adhesion characteristics and processing characteristics when adhered to an adherend.

為防止包含合成樹脂、金屬、玻璃等各種素材的製品於加工步驟、輸送步驟、保存中所生成的傷痕或髒污,多有黏貼保護表面的材料來處理。其代表例為表面保護膜,一般係使用在包含熱塑性樹脂或紙的支撐基材上形成有黏著層者,藉由使黏著層面貼附於被黏著體並以支撐基材加以被覆來保護表面。 In order to prevent the products containing synthetic resin, metal, glass and other materials from being damaged or stained during the processing steps, transportation steps, and storage, many materials are used to protect the surface. A typical example of this is a surface protection film, which is generally one in which an adhesive layer is formed on a supporting substrate containing a thermoplastic resin or paper, and the surface is protected by attaching an adhesive layer to an adherend and coating the substrate with the supporting substrate.

特別是近年來,液晶顯示器或觸控面板裝置普及化,而此等係由包含合成樹脂的多數個光學片、光學薄膜等構件所構成。所述光學用構件,由於需極力減少光學變形等缺點,而為了防止可能成為缺點來源的傷痕或髒污,則大多使用表面保護膜。 Especially in recent years, liquid crystal displays or touch panel devices have become widespread, and these are composed of a plurality of members such as optical sheets and optical films containing synthetic resin. In order to prevent defects such as optical distortion as much as possible for the optical member, a surface protective film is often used in order to prevent a flaw or a stain that may be a source of the defect.

就表面保護膜之特性而言,其係被要求:不易於衝壓(punching)加工等受外力時,或因溫度、濕度等之環境變化而自被黏著體剝離;自被黏著體剝離時可容易剝離;此外,剝離時於被黏著體上不殘留有黏著劑 及黏著劑成分。 In terms of the characteristics of the surface protective film, it is required that it is not easy to peel from the adherend when it is subjected to external force such as punching processing or due to environmental changes such as temperature and humidity; it can be easily peeled from the adherend. Peeling; In addition, no adhesive remains on the adherend during peeling And adhesive ingredients.

上述光學用構件中尤以具有如擴散板、稜鏡片之表面具有凹凸之構件,在貼合表面保護膜後,由於凹凸部與黏著層之接觸面積少,於衝壓加工等受外力時,有無法完全充分吸收外力而自被黏著體剝離的情形。針對此點,已知有將黏著層軟化的方法、使用增黏劑來提高黏著力的方法等(例如專利文獻1~4)。 Among the above-mentioned optical members, particularly those having unevenness on the surface of the diffuser plate and the cymbal, for example, after bonding the surface protection film, the contact area between the unevenness portion and the adhesive layer is small. When the external force is fully absorbed and peeled off from the adherend. In this regard, a method of softening the adhesive layer, a method of improving the adhesive force using a thickener, and the like are known (for example, Patent Documents 1 to 4).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2008-214437號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-214437

[專利文獻2]日本特開2005-298630號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2005-298630

[專利文獻3]日本特開平05-194923號公報 [Patent Document 3] Japanese Unexamined Patent Publication No. 05-194923

[專利文獻4]日本特開2012-111793號公報 [Patent Document 4] Japanese Patent Application Publication No. 2012-111793

然而,就上述方法而言,有隨著時間經過黏著力增大,致剝離性惡化的情形,而難以兼具剝離性與加工特性。 However, in the above-mentioned method, there is a case where the adhesive force increases with time and the peelability deteriorates, and it is difficult to have both peelability and processing characteristics.

本發明之課題係鑑於上述課題,而提供一種組成物、及一種由前述組成物所構成之積層體,該組成物係用以提供貼合於被黏著體時之黏著特性及加工特性優異之積層體。 The problem of the present invention is to provide a composition and a laminated body composed of the aforementioned composition in view of the above-mentioned problems, and the composition is used to provide a laminated layer having excellent adhesion characteristics and processing characteristics when adhered to an adherend. body.

本案發明人等為解決上述課題而反覆致力 研究的結果,完成以下發明。亦即,本發明係如下所述。 The inventors of this case have repeatedly worked to solve the above problems As a result of the studies, the following inventions were completed. That is, the present invention is as follows.

1)一種組成物,其特徵在於其係滿足以下之條件1及2。 1) A composition characterized in that it satisfies the following conditions 1 and 2.

條件1 頻率1Hz、溫度0℃之剪切損失正切(tanδ0℃)為0.20以上0.60以下 Condition 1 The shear loss tangent (tan δ 0 ° C ) at a frequency of 1 Hz and a temperature of 0 ° C is 0.20 or more and 0.60 or less

條件2 頻率1Hz、溫度100℃之剪切損失正切(tanδ100℃)為0.40以上0.80以下 Condition 2 The shear loss tangent (tan δ 100 ° C ) at a frequency of 1 Hz and a temperature of 100 ° C is 0.40 or more and 0.80 or less

2)如1)所記載的組成物,關於於頻率1Hz、溫度60℃之剪切損失正切(tanδ60℃),及溫度100℃之剪切損失正切(tanδ100℃),前述組成物係滿足以下之條件3。 2) 1) the composition described in respect to the frequency 1Hz, temperature 60 ℃ shear loss tangent (tanδ 60 ℃), temperature 100 ℃ and shearing loss tangent (tanδ 100 ℃), the composition of the system to meet Condition 3 below.

條件3 0.20≦tanδ100℃-tanδ60℃≦0.60 Condition 3 0.20 ≦ tanδ 100 ℃ -tanδ 60 ℃ ≦ 0.60

3)如1)或2)所記載的組成物,其中前述組成物於示差掃描熱量測定中在60℃以上100℃以下之範圍具有吸熱波峰。 3) The composition according to 1) or 2), wherein the composition has an endothermic peak in a range of 60 ° C. to 100 ° C. in differential scanning calorimetry.

4)如1)~3)中任一項所記載的組成物,其中前述組成物含有至少以下之(1)至(3)之成分。 4) The composition according to any one of 1) to 3), wherein the composition contains at least the following components (1) to (3).

(1)苯乙烯系彈性體 (1) Styrenic elastomer

(2)丙烯‧α-烯烴共聚物 (2) Propylene · α-olefin copolymer

(3)賦黏劑 (3) Adhesive

5)一種積層體,其係於基材的一側之面上具有黏著層之積層體中,前述黏著層含有如1)~4)中任一項所記載的組成物。 5) A laminated body comprising a laminated body having an adhesive layer on one side of a substrate, wherein the adhesive layer contains the composition according to any one of 1) to 4).

6)如5)所記載的積層體,其係用於稜鏡片之表面保護。 6) The laminated body according to 5), which is used for surface protection of a sepal.

鑑於上述課題,根據本發明可提供一種組成物,其係用以提供貼合於被黏著體時之黏著特性及加工特性優異之積層體;及提供一種由前述組成物所構成之積層體。 In view of the above-mentioned problems, according to the present invention, there can be provided a composition for providing a laminated body having excellent adhesion characteristics and processing characteristics when adhered to an adherend, and a laminated body composed of the aforementioned composition.

[實施發明之形態] [Form of Implementing Invention]

以下,就本發明之組成物及積層體的構成要件加以詳細說明。 Hereinafter, the constituent elements of the composition and the laminated body of the present invention will be described in detail.

<組成物> <Composition>

本發明之組成物係以滿足以下之條件1及2作為特徵。 The composition of the present invention is characterized by satisfying the following conditions 1 and 2.

條件1:頻率1Hz、溫度0℃之剪切損失正切(tanδ0℃)為0.20以上0.60以下。 Condition 1: The shear loss tangent (tan δ 0 ° C ) at a frequency of 1 Hz and a temperature of 0 ° C is 0.20 or more and 0.60 or less.

條件2:頻率1Hz、溫度100℃之剪切損失正切(tanδ100℃)為0.40以上0.80以下。 Condition 2: The shear loss tangent (tan δ 100 ° C ) at a frequency of 1 Hz and a temperature of 100 ° C is 0.40 or more and 0.80 or less.

藉由滿足上述條件1及2,將本發明之組成物用於用以保護被黏著體之積層體的黏著層時,可得到良好的黏著特性及加工特性。亦即,對被黏著體之貼合性優異,衝壓加工時不易產生剝離,此外,可容易自被黏著體剝離。上述tanδ0℃較佳為0.30以上0.50以下,又,tanδ100℃較佳為0.50以上0.80以下。 By satisfying the above conditions 1 and 2, when the composition of the present invention is used for an adhesive layer for protecting a laminated body of an adherend, good adhesive properties and processing characteristics can be obtained. That is, it has excellent adhesion to the adherend, and it is difficult to peel off during press processing, and it can be easily peeled from the adherend. The tan δ 0 ° C is preferably 0.30 to 0.50, and the tan δ 100 ° C is preferably 0.50 to 0.80.

於此,所謂的損失正切係指將藉由動態黏彈性測定而得的耗損模數除以儲存模數所得之值。此外,耗損模數係指施加應力時,其能量以熱的形式逸散之 黏性成分;儲存模數係指蓄積能量於內部而保持應力之彈性成分。 Here, the so-called loss tangent refers to a value obtained by dividing a loss modulus obtained by dynamic viscoelasticity measurement by a storage modulus. In addition, the loss modulus refers to the dissipation of energy in the form of heat when stress is applied. Viscous component; storage modulus refers to the elastic component that accumulates energy inside and maintains stress.

此外,所謂的動態黏彈性測定係指藉由對試料隨著時間賦予變化(振動)之變形或應力,並測定隨之產生之應力或變形,來探究試料之力學性質的測定,其測定模式有拉伸/壓縮、剪切、3點彎曲等多種,而在本發明中,損失正切係於頻率1Hz、變形0.01%下,以剪切模式所測定之值為對象。關於測定方法詳細敘述於後。 In addition, the so-called dynamic viscoelasticity measurement refers to the measurement of the mechanical properties of a sample by imparting a change (vibration) to the sample over time and measuring the resulting stress or deformation. The measurement mode is There are various types such as tensile / compression, shear, and 3-point bending. In the present invention, the loss tangent is at a frequency of 1 Hz and a distortion of 0.01%, and the value measured in the shear mode is an object. The measurement method will be described in detail later.

上述tanδ0℃小於0.20的情形下有加工特性降低的情形,大於0.60的情形下有剝離性降低的情形。又,上述tanδ100℃小於0.40的情形下有加工特性降低的情形,大於0.80的情形下有隨著時間黏著力變大剝離性降低的情形。 When the tan δ 0 ° C is less than 0.20, the processing characteristics may be reduced, and when it is greater than 0.60, the peelability may be reduced. When the tan δ 100 ° C is lower than 0.40, the processing characteristics may be reduced, and when the tan δ is higher than 0.80, the adhesive force may increase with time and the peelability may decrease.

再者,本發明之組成物於頻率1Hz、溫度60℃之剪切損失正切(tanδ60℃)與溫度100℃之剪切損失正切(tanδ100℃)之差(tanδ100℃-tanδ60℃)較佳為0.20以上0.60以下。更佳為0.30以上0.60以下,進一步較佳為0.40以上0.60以下。 In addition, the composition of the present invention has a difference between a tan delta shear tangent (tanδ 60 ° C ) at a frequency of 1 Hz and a temperature of 60 ° C and a tan delta shear tan (tanδ 100 ° C ) at a temperature of 100 ° C (tanδ 100 ° C- tanδ 60 ° C ) It is preferably 0.20 or more and 0.60 or less. It is more preferably 0.30 or more and 0.60 or less, and still more preferably 0.40 or more and 0.60 or less.

tanδ100℃與tanδ60℃之差(tanδ100℃-tanδ60℃)小於0.20的情形下有加工特性降低的情形,大於0.60的情形下有剝離性降低的情形。 When the difference between tanδ 100 ° C and tanδ 60 ° C (tanδ 100 ° C- tanδ 60 ° C ) is less than 0.20, the processing characteristics may be reduced, and when it is greater than 0.60, the peelability may be reduced.

本發明之組成物較佳為於示差掃描熱量測定中在60℃以上100℃以下之範圍具有吸熱波峰。更佳為在70℃以上100℃以下之範圍,特佳為在70℃以上90℃以下之範圍,組成物具有吸熱波峰為宜。藉由在60℃以上 100℃以下之範圍具有吸熱波峰,將本發明之組成物使用於用以保護被黏著體之積層體之黏著層的情形下,可較佳地控制黏著特性與加工特性。 The composition of the present invention preferably has an endothermic peak in a range of 60 ° C to 100 ° C in differential scanning calorimetry. The temperature is more preferably in the range of 70 ° C to 100 ° C, and particularly preferably in the range of 70 ° C to 90 ° C. The composition preferably has an endothermic peak. By being above 60 ℃ A temperature range of 100 ° C or lower has an endothermic wave peak. When the composition of the present invention is used to protect an adhesion layer of a laminated body of an adherend, the adhesion characteristics and processing characteristics can be better controlled.

前述吸熱波峰小於60℃的情形下,有耐熱性降低的情形,超過100℃的情形下,有加工特性降低的情形。 When the endothermic peak is less than 60 ° C, heat resistance may be reduced, and when it exceeds 100 ° C, processing characteristics may be reduced.

本發明之組成物只要滿足構成要件的條件1及2,則沒有特別限定,但亦可使用丙烯酸系、聚矽氧系等之交聯系,天然橡膠系、合成橡膠系等之非交聯系,或擬似交聯系(熱塑化系)之任一材料,而從回收利用性的觀點來看,較佳為將熱塑性樹脂作為主成分。於此,所謂的將熱塑性樹脂作為主成分係意指組成物中之熱塑性樹脂比例為50質量%以上,更佳為70質量%以上,進一步更佳為90質量%以上。 The composition of the present invention is not particularly limited as long as it satisfies the conditions 1 and 2 constituting the requirements. However, it is also possible to use a cross connection of acrylic, polysiloxane, or the like, or a non-cross connection of natural rubber, synthetic rubber, or Any material that is pseudo-connected (thermoplastic) is preferably a thermoplastic resin as a main component from the viewpoint of recyclability. Here, the term "using a thermoplastic resin as a main component" means that the proportion of the thermoplastic resin in the composition is 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more.

又,本發明之組成物較佳為含有至少苯乙烯系彈性體、丙烯‧α-烯烴共聚物及賦黏劑。 The composition of the present invention preferably contains at least a styrene-based elastomer, a propylene · α-olefin copolymer, and a tackifier.

本發明中所謂的苯乙烯系彈性體係指具有源自苯乙烯的結構單元,於室溫呈現橡膠狀彈性之樹脂,其係可使用周知者,可列舉例如苯乙烯‧丁二烯共聚物(SBR)、苯乙烯‧異戊二烯‧苯乙烯共聚物(SIS)、苯乙烯‧丁二烯‧苯乙烯共聚物(SBS)等的苯乙烯與二烯之共聚物及彼等之氫化物,例如苯乙烯‧乙烯‧丁烯‧苯乙烯共聚物(SEBS)等、苯乙烯與異丁烯之共聚物,例如苯乙烯‧異丁烯‧苯乙烯三嵌段共聚物(SIBS)、苯乙烯‧異丁烯二嵌段共聚物(SIB)、或該等之混合物等的苯乙 烯‧異丁烯嵌段共聚物等。此等之苯乙烯系彈性體可僅使用1種,亦可併用2種以上。上述苯乙烯系彈性體中尤以使用氫化苯乙烯‧丁二烯共聚物(HSBR)、苯乙烯‧乙烯‧丁烯‧苯乙烯共聚物(SEBS)、苯乙烯‧異丁烯‧苯乙烯三嵌段共聚物(SIBS)、苯乙烯‧異丁烯二嵌段共聚物(SIB)、或此等混合物為佳。 The styrene-based elastic system in the present invention refers to a resin having a structural unit derived from styrene and exhibiting rubber-like elasticity at room temperature. A well-known one can be used, and examples thereof include a styrene-butadiene copolymer (SBR ), Styrene, isoprene, styrene copolymer (SIS), styrene, butadiene, styrene copolymer (SBS), styrene and diene copolymers and their hydrides, such as Styrene, ethylene, butene, styrene copolymer (SEBS), copolymers of styrene and isobutylene, such as styrene, isobutylene, styrene triblock copolymer (SIBS), styrene, isobutylene diblock copolymerization (SIB), or a mixture of these Ene · isobutylene block copolymer, etc. These styrene-based elastomers may be used alone or in combination of two or more. Among the above styrene-based elastomers, hydrogenated styrene · butadiene copolymer (HSBR), styrene · ethylene · butene · styrene copolymer (SEBS), and styrene · isobutylene · styrene triblock copolymer are particularly used. (SIBS), styrene-isobutylene diblock copolymer (SIB), or a mixture thereof is preferred.

苯乙烯系彈性體的重量平均分子量較佳為50,000~400,000的範圍,更佳為50,000~200,000的範圍。就重量平均分子量小於50,000而言,黏著層的凝聚力降低,而有自被黏著體剝離時發生殘膠的情形;超過400,000時有黏度變高而導致生產性降低的情形。 The weight average molecular weight of the styrene-based elastomer is preferably in the range of 50,000 to 400,000, and more preferably in the range of 50,000 to 200,000. When the weight-average molecular weight is less than 50,000, the cohesive force of the adhesive layer is reduced, and adhesive residue may occur when it is peeled from the adherend. When it exceeds 400,000, the viscosity may increase and the productivity may decrease.

苯乙烯系彈性體中的苯乙烯含量較佳為5~30質量%的範圍,更佳為8~20質量%的範圍。就苯乙烯含量小於5質量%而言,有黏著層的凝聚力降低,而有自被黏著體剝離時發生殘膠的情形;超過30質量%時變得對被黏著體的貼合性降低,特別是對具有凹凸的被黏著體的黏著性有不足的情形。 The styrene content in the styrene-based elastomer is preferably in the range of 5 to 30% by mass, and more preferably in the range of 8 to 20% by mass. When the styrene content is less than 5% by mass, the cohesive force of the adhesive layer is reduced, and adhesive residue may occur when it is peeled from the adherend. When it exceeds 30% by mass, the adhesion to the adherend is reduced. This is a case where the adhesion to the adherend having unevenness is insufficient.

又,所謂的前述丙烯‧α-烯烴共聚物係指由源自丙烯的結構單元及乙烯、源自α-烯烴的結構單元所構成的共聚物。可列舉例如丙烯‧乙烯共聚物、丙烯‧1-丁烯共聚物、丙烯‧1-戊烯共聚物、丙烯‧1-己烯共聚物、丙烯‧1-辛烯共聚物、丙烯‧乙烯‧1-丁烯共聚物等,但可使用的不限於此等。本發明中,丙烯‧α-烯烴共聚物可僅使用1種,亦可併用2種以上。 The aforementioned propylene · α-olefin copolymer refers to a copolymer composed of a structural unit derived from propylene, ethylene, and a structural unit derived from an α-olefin. Examples include propylene‧ethylene copolymer, propylene‧1-butene copolymer, propylene‧1-pentene copolymer, propylene‧1-hexene copolymer, propylene‧1-octene copolymer, propylene‧ethylene‧1 -Butene copolymer and the like, but it is not limited thereto. In the present invention, only one kind of propylene · α-olefin copolymer may be used, or two or more kinds may be used in combination.

前述丙烯‧α-烯烴共聚物較佳為具有熔點 於60℃以上100℃以下的範圍。更佳為70℃以上100℃以下的範圍,特佳為70℃以上90℃以下的範圍。丙烯‧α-烯烴共聚物的熔點可藉由改變α-烯烴的種類、共聚合比率來控制。 The aforementioned propylene · α-olefin copolymer preferably has a melting point In the range of 60 ° C to 100 ° C. The temperature is more preferably in the range of 70 ° C to 100 ° C, and particularly preferably in the range of 70 ° C to 90 ° C. The melting point of propylene · α-olefin copolymer can be controlled by changing the type of α-olefin and the copolymerization ratio.

又,所謂的前述賦黏劑係如JIS Z0109(1992)中所定義,其係為了提高黏著層之黏著性所摻合的材料,可使用軟化點為80~150℃者。可使用例如脂肪族系共聚物、芳香族系共聚物、脂肪族‧芳香族系共聚物、脂環式系共聚物等之石油樹脂、萜烯系樹脂、萜烯酚系樹脂、松香系樹脂、烷基酚系樹脂、二甲苯系樹脂或此等之氫化物等一般所使用者。本發明中,賦黏劑可僅使用1種,亦可併用2種以上。 The so-called tackifier is defined in JIS Z0109 (1992). It is a material blended to improve the adhesion of the adhesive layer, and a softening point of 80 to 150 ° C. can be used. For example, petroleum resins, terpene resins, terpene phenol resins, rosin resins, petroleum resins such as aliphatic copolymers, aromatic copolymers, aliphatic and aromatic copolymers, and alicyclic copolymers can be used. Alkylphenol-based resins, xylene-based resins, or these hydrides are generally used. In the present invention, only one kind of the tackifier may be used, or two or more kinds may be used in combination.

在本發明之組成物中,將組成物整體設為100質量%時,上述苯乙烯系彈性體、丙烯‧α-烯烴共聚物、賦黏劑的總含量較佳為60質量%以上,更佳為70質量%以上,進一步更佳為80質量%以上。前述總含量小於60質量%的情形下,有黏著特性與加工特性之平衡降低的情形。 In the composition of the present invention, when the entire composition is 100% by mass, the total content of the styrene-based elastomer, propylene · α-olefin copolymer, and tackifier is preferably 60% by mass or more, and more preferably It is 70% by mass or more, and more preferably 80% by mass or more. When the aforementioned total content is less than 60% by mass, there may be a case where the balance between the adhesion property and the processing property is reduced.

又,將組成物全體設為100質量%時,苯乙烯系彈性體的含量較佳為40質量%以上,更佳為50質量%以上。此外,丙烯‧α-烯烴共聚物的含量較佳為10質量%以上,更佳為15質量%以上。再者,賦黏劑的含量較佳為5質量%以上,更佳為10質量%以上。 When the entire composition is 100% by mass, the content of the styrene-based elastomer is preferably 40% by mass or more, and more preferably 50% by mass or more. The content of the propylene · α-olefin copolymer is preferably 10% by mass or more, and more preferably 15% by mass or more. The content of the tackifier is preferably 5% by mass or more, and more preferably 10% by mass or more.

在不損及本發明目的的範圍,本發明之組成物除上述苯乙烯系彈性體、丙烯‧α-烯烴共聚物、賦 黏劑以外,亦可適宜地添加用以調整黏著力的其它樹脂成分、添加劑等。 To the extent that the object of the present invention is not impaired, the composition of the present invention includes the above-mentioned styrene-based elastomer, propylene · α-olefin copolymer, and In addition to the adhesive, other resin components, additives, and the like may be appropriately added to adjust the adhesion.

作為用以調整黏著力的其它樹脂成分,可使用聚烯烴等之樹脂,可列舉例如低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、直鏈狀低密度聚乙烯、低結晶性或非晶性之乙烯‧α-烯烴共聚物、聚丙烯、丙烯‧乙烯共聚物(無規共聚物及/或嵌段共聚物)、有別於上述丙烯‧α-烯烴共聚物的丙烯‧α-烯烴共聚物、丙烯‧乙烯‧α-烯烴共聚物、乙烯‧(甲基)丙烯酸乙酯共聚物、乙烯‧(甲基)丙烯酸甲酯共聚物、乙烯‧(甲基)丙烯酸正丁酯共聚物、乙烯‧乙酸乙烯酯共聚物等。此等樹脂係可單獨使用,亦可併用2種。 As another resin component for adjusting the adhesive force, a resin such as polyolefin can be used, and examples thereof include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, low crystallinity, and non- Crystalline ethylene‧α-olefin copolymers, polypropylene, propylene‧ethylene copolymers (random copolymers and / or block copolymers), propylene‧α-olefins different from the above-mentioned propylene‧α-olefin copolymers Copolymers, propylene‧ethylene‧α-olefin copolymers, ethylene‧ (meth) acrylate copolymers, ethylene‧ (meth) acrylate copolymers, ethylene‧ (butyl) (meth) acrylate copolymers, Ethylene, vinyl acetate copolymers, etc. These resins can be used alone or in combination of two.

將組成物全體設為100質量%時,用以調整黏著力的其它樹脂成分的總含量較佳為20質量%以下,更佳為10質量%以下。用以調整黏著力的其它樹脂成分的總含量超過20質量%時,將本發明之組成物用於用以保護被黏著體之積層體之黏著層的情形下,有兼具黏著特性與加工特性為困難的情形。 When the entire composition is 100% by mass, the total content of other resin components for adjusting the adhesion is preferably 20% by mass or less, and more preferably 10% by mass or less. When the total content of other resin components for adjusting adhesion exceeds 20% by mass, when the composition of the present invention is used to protect an adhesive layer of a laminated body of an adherend, it has both adhesive properties and processing properties. For difficult situations.

作為添加劑例如可添加滑劑、抗氧化劑、耐候劑、抗靜電劑、抗黏著加速劑(adhesive acceleration inhibitor)等。此等添加劑可單一成分使用,亦可併用2種以上。將組成物全體設為100質量%時,添加劑的總含量較佳為3質量%以下,更佳為2質量%以下。添加劑的總含量較3質量%多的情形下有從黏著層滲出,而使製品產生缺點的情形、污染被黏著體的情形。 As the additive, for example, a slip agent, an antioxidant, a weathering agent, an antistatic agent, an anti-adhesive acceleration inhibitor, or the like can be added. These additives may be used alone or in combination of two or more. When the entire composition is 100% by mass, the total content of the additives is preferably 3% by mass or less, and more preferably 2% by mass or less. In the case where the total content of the additive is more than 3% by mass, there may be a case where the product oozes out from the adhesive layer, causing defects in the product, and a case where the adherend is contaminated.

<積層體> <Layered body>

本發明之積層體的特徵在於在基材的其中一面具有黏著層的積層體,前述黏著層係包含前述之組成物。以下,就本發明之積層體詳細加以說明。 The laminated body of the present invention is characterized by a laminated body having an adhesive layer on one side of a substrate, and the adhesive layer includes the aforementioned composition. Hereinafter, the laminated body of this invention is demonstrated in detail.

<基材> <Substrate>

構成本發明之積層體的基材並未特別限定,可使用例如聚烯烴、聚酯等的樹脂。其中,從生產性、加工適性等的觀點來看,較佳為以聚烯烴為主成分。於此,所稱「以聚烯烴為主成分」,係意指將基材全體設為100質量%時,聚烯烴的比例為50質量%以上,更佳為70質量%以上。 The base material constituting the laminated body of the present invention is not particularly limited, and resins such as polyolefin and polyester can be used. Among them, from the viewpoints of productivity and processing suitability, polyolefins are preferred as the main component. Here, the term "mainly containing polyolefin" means that when the entire substrate is 100% by mass, the proportion of polyolefin is 50% by mass or more, and more preferably 70% by mass or more.

作為前述聚烯烴,可列舉例如低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、直鏈狀低密度聚乙烯、低結晶性或非晶性之乙烯‧α-烯烴共聚物、聚丙烯、丙烯‧乙烯共聚物(無規共聚物及/或嵌段共聚物)、丙烯‧α-烯烴共聚物、丙烯‧乙烯‧α-烯烴共聚物、乙烯‧(甲基)丙烯酸乙酯共聚物、乙烯‧(甲基)丙烯酸甲酯共聚物、乙烯‧(甲基)丙烯酸正丁酯共聚物、乙烯‧乙酸乙烯酯共聚物等。此等可單獨使用,亦可併用。此外,作為前述α-烯烴,只要可與丙烯、乙烯共聚合則沒有特別限定,可列舉例如1-丁烯、1-己烯、4-甲基-1-戊烯、1-辛烯、1-戊烯、1-庚烯等。上述聚烯烴中尤以可獲得高剛性的聚丙烯、丙烯‧乙烯共聚物(無規共聚物及/或嵌段共聚物)、丙烯‧乙烯‧α-烯烴共聚物、丙烯‧α-烯烴共聚物等之丙烯系材料為更佳。 Examples of the polyolefin include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, low crystalline or amorphous ethylene · α-olefin copolymer, polypropylene, Propylene‧ethylene copolymer (random copolymer and / or block copolymer), propylene‧α-olefin copolymer, propylene‧ethylene‧α-olefin copolymer, ethylene‧ethyl (meth) acrylate copolymer, ethylene ‧Methyl (meth) acrylate copolymer, ethylene ‧ (butyl) (meth) acrylate copolymer, ethylene ‧ vinyl acetate copolymer, etc. These can be used alone or in combination. The α-olefin is not particularly limited as long as it can be copolymerized with propylene and ethylene, and examples thereof include 1-butene, 1-hexene, 4-methyl-1-pentene, 1-octene, and 1 -Pentene, 1-heptene and the like. Among the above-mentioned polyolefins, it is particularly possible to obtain high-rigidity polypropylene, propylene‧ethylene copolymers (random copolymers and / or block copolymers), propylene‧ethylene‧α-olefin copolymers, and propylene‧α-olefin copolymers. Equal acrylic materials are more preferred.

本發明之基材主要使用的聚烯烴的熔融流動速率(MFR;以230℃、2.16kg之條件測定)較佳為2~30g/分鐘的範圍,尤以5~30g/分鐘的範圍為佳。MFR小於2g/分鐘時,有因熔融黏度過高而導致生產性降低的情形。又,MFR較30g/分鐘大時,有基材會變脆而於積層體製造時、使用時不易處理的情形。 The melt flow rate (MFR; measured under the conditions of 230 ° C. and 2.16 kg) of the polyolefin mainly used in the substrate of the present invention is preferably in the range of 2 to 30 g / min, particularly preferably in the range of 5 to 30 g / min. When the MFR is less than 2 g / minute, productivity may be reduced due to excessively high melt viscosity. Moreover, when MFR is larger than 30 g / min, a base material may become brittle, and it may become difficult to handle at the time of manufacture of a laminated body, and use.

本發明中的基材亦可作成2層構成以上。 The substrate in the present invention may be composed of two or more layers.

又,構成本發明之基材的組成物中,在不損及作為本發明積層體之特性的範圍,亦可適當添加潤滑劑、抗氧化劑、耐候劑、抗靜電劑、結晶核劑(crystal nucleating agent)、顏料等的各種添加劑。 In addition, to the composition constituting the substrate of the present invention, a lubricant, an antioxidant, a weathering agent, an antistatic agent, and a crystal nucleating agent (crystal nucleating agent) may be appropriately added within a range that does not impair the characteristics of the laminated body of the present invention. agents), pigments and other additives.

基材的厚度可配合積層體的要求特性來適當調整,較佳為5~200μm,更佳為10~100μm,特佳為10~80μm。較5μm薄時有強度不足,於製造步驟運送困難的情形、於加工時、使用時發生破裂的情形。較200μm厚時,則有薄膜的透明性不足、或生產性降低的情形。 The thickness of the substrate can be appropriately adjusted in accordance with the required characteristics of the laminate, and is preferably 5 to 200 μm, more preferably 10 to 100 μm, and particularly preferably 10 to 80 μm. When it is thinner than 5 μm, it may have insufficient strength, may be difficult to transport in the manufacturing step, and may crack during processing and use. When the thickness is more than 200 μm, the transparency of the film may be insufficient or the productivity may be reduced.

<黏著層> <Adhesive layer>

構成本發明之積層體的黏著層較佳使用前述之組成物。 The above-mentioned composition is preferably used as the adhesive layer constituting the laminated body of the present invention.

本發明之黏著層的厚度可因應被黏著體的材質、厚度、表面形狀、要求程度而適當調整,較佳為1~20μm,進一步較佳為2~10μm,特佳為2~8μm。黏著層的厚度小於1μm時,有無法對被黏著體展現充分的黏著力的情形;大於20μm的情況下則有黏著力過大、生產性降低的情形。 The thickness of the adhesive layer of the present invention can be appropriately adjusted according to the material, thickness, surface shape, and required degree of the adherend, preferably 1 to 20 μm, further preferably 2 to 10 μm, and particularly preferably 2 to 8 μm. When the thickness of the adhesive layer is less than 1 μm, it may not be possible to exhibit sufficient adhesion to the adherend; when it is larger than 20 μm, the adhesive force may be too large and the productivity may be reduced.

<脫模層> <Release layer>

本發明之積層體係至少具有基材與黏著層的積層體,而其較佳之一態樣係在基材之與黏著層相反之一側的面設置脫模層而作成3層積層構成。構成脫模層的材料或厚度、表面形狀,只要基於黏著層的黏著力、積層體製造時、使用時的加工適性等觀點來選擇、調整即可,可採用該領域所周知之技術。較佳的是,從良好地控制脫模性觀點來看,較佳為以含有0.5質量%~10質量%之同時具有多氟烴基及聚氧乙烯基的含氟化合物的丙烯系樹脂為主而構成。 The laminated system of the present invention has at least a laminated body of a base material and an adhesive layer, and a preferred aspect thereof is to form a three-layer laminated structure by providing a release layer on a surface of the base material opposite to the side of the adhesive layer. The material, thickness, and surface shape of the release layer may be selected and adjusted based on the viewpoints of the adhesive force of the adhesive layer, processing suitability of the laminated body during manufacture, and use, and techniques known in this field may be used. From the viewpoint of good mold release control, it is preferable to mainly use a propylene resin containing 0.5% to 10% by mass of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group. Make up.

作為該丙烯系樹脂,可為與構成上述基材的丙烯系樹脂相同者亦可為相異者,在將後述之該脫模層的表面粗糙度粗面化成以Rz表示為3.0μm以上方面,較佳含有至少20質量%以上的丙烯與乙烯及/或α-烯烴的共聚物。在丙烯系聚合物為與乙烯及/或α-烯烴之共聚物的情形下,單體含量愈多,愈可降低該共聚物的熔點,從容易實施共擠出、可低溫擠出來看,更佳為單體含量為3~7質量%的範圍。此外,欲對脫模層賦予耐熱性的情況下,亦可適當加以選定,俾能減少此單體含量,而得到所期望的耐熱性。 The propylene-based resin may be the same as or different from the propylene-based resin constituting the substrate described above, and the surface roughness of the release layer described later is roughened to 3.0 μm or more in terms of Rz, A copolymer containing at least 20% by mass or more of propylene and ethylene and / or an α-olefin is preferred. When the propylene polymer is a copolymer with ethylene and / or α-olefin, the more the monomer content, the lower the melting point of the copolymer. From the viewpoint of easy co-extrusion and low-temperature extrusion, the more Preferably, the monomer content is in the range of 3 to 7 mass%. In addition, in the case where heat resistance is to be imparted to the release layer, it may be appropriately selected so that the monomer content can be reduced and desired heat resistance can be obtained.

又,前述丙烯系樹脂在230℃下的MFR較佳為3~40g/10分鐘的範圍。特別是,MFR為10~40g/10分鐘的範圍者,可低溫擠出,而且,透過與低密度聚乙烯組合,易將脫模層粗面化,因而更佳。 The MFR of the propylene resin at 230 ° C is preferably in the range of 3 to 40 g / 10 minutes. In particular, those having an MFR in the range of 10 to 40 g / 10 minutes can be extruded at a low temperature. Furthermore, by combining with a low-density polyethylene, it is easy to roughen the release layer, so it is more preferable.

此外,為了將脫模層粗面化,較佳含有至 少4質量%之與前述丙烯系樹脂缺乏相溶性的高壓法低密度聚乙烯。 In addition, in order to roughen the release layer, it is preferably contained to A high-pressure process low-density polyethylene having 4 mass% less compatibility with the aforementioned propylene resin.

再者,上述脫模層較佳由含有0.5質量%~10質量%之同時具有多氟烴基及聚氧乙烯基的含氟化合物的丙烯系樹脂構成而成。該具有多氟烴基及聚氧乙烯基的含氟化合物,例如作為單體(a)可列舉具有碳數1~18之全氟烷基的(甲基)丙烯酸酯等,可將後述之單體(b)、單體(c)之具有聚氧乙烯基的(甲基)丙烯酸酯等共聚合而得。 The mold release layer is preferably made of a propylene resin containing 0.5 to 10% by mass of a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group. Examples of the fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group include, as the monomer (a), a (meth) acrylic acid ester having a perfluoroalkyl group having 1 to 18 carbon atoms, and a monomer described later may be used. (b) A copolymer obtained by copolymerizing a (meth) acrylate having a polyoxyethylene group with the monomer (c).

作為上述單體(a)之全氟烷基較佳為碳數1~18,尤以1~6者為更佳。此全氟烷基可為直鏈狀及分枝狀任一種。此等可僅單獨使用1種,亦可組合2種以上使用。 The perfluoroalkyl group as the monomer (a) is preferably 1 to 18 carbon atoms, and more preferably 1 to 6 carbon atoms. The perfluoroalkyl group may be linear or branched. These may be used alone or in combination of two or more.

此具有全氟烷基的(甲基)丙烯酸酯係由共榮社化學(股)等販售,或者亦能以市售之含氟化合物為原料,以已知之方法來合成。 This (meth) acrylic acid ester having a perfluoroalkyl group is sold by Kyoeisha Chemical Co., Ltd. or the like, or can be synthesized by a known method using a commercially available fluorine-containing compound as a raw material.

作為含有聚氧乙烯基的單體(b),較佳為具有氧乙烯單元(-CH2-CH2-O-)以1~30個接連而成的結構者,尤以該單元有1~20個者為佳。此外,該鏈中亦可含有氧丙烯單元(-CH2-CH(CH3)-O-)。作為較佳實例,可例示氧乙烯單元為8個的聚乙二醇單甲基丙烯酸酯等。單體(b)可僅單獨取1種、或組合2種以上。 As the polyoxyethylene-containing monomer (b), it is preferable to have a structure in which 1 to 30 oxyethylene units (-CH 2 -CH 2 -O-) are connected in succession, and the unit has 1 to 30 in particular. Twenty is better. In addition, the chain may contain an oxypropylene unit (-CH 2 -CH (CH 3 ) -O-). As a preferred example, a polyethylene glycol monomethacrylate having eight oxyethylene units and the like can be exemplified. The monomer (b) may be used alone or in combination of two or more.

又,作為含有聚氧乙烯基的另一個其它的單體(c),係具有氧乙烯單元以1~30個接連而成的結構,且於兩末端具有雙鍵的二(甲基)丙烯酸酯,作為較佳 之具體實例,可例示鏈數為8的聚乙二醇二甲基丙烯酸酯等。此單體(c)亦可僅單獨取1種、或組合2種以上。 In addition, as another monomer (c) containing polyoxyethylene group, it is a di (meth) acrylate having a structure in which 1 to 30 oxyethylene units are connected successively and having double bonds at both ends. As better Specific examples include polyethylene glycol dimethacrylate having a chain number of 8, and the like. This monomer (c) may be used alone or in combination of two or more.

就該單體(a)、單體(b)、單體(c)各者的比例而言,較佳的是單體(a)為1~80質量%、單體(b)為1~80質量%、單體(c)為1~50質量%。 The ratio of each of the monomer (a), the monomer (b), and the monomer (c) is preferably 1 to 80% by mass and 1 to 80% by mass of the monomer (a). 80% by mass, and the monomer (c) is 1 to 50% by mass.

此外,對於上述具有多氟烴基及聚氧乙烯基的含氟化合物,除上述3種單體外,亦能以小於50質量%的範圍共聚合可與此等共聚合的單體。作為此單體,可舉出亞甲基、乙酸乙烯酯、氯化乙烯、氟化乙烯、鹵化乙烯、苯乙烯、甲基苯乙烯、(甲基)丙烯酸及其酯、(甲基)丙烯醯胺單體、(甲基)烯丙基單體等。 In addition, in addition to the above-mentioned three monomers, the above-mentioned fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group can be copolymerized in a range of less than 50% by mass of a monomer that can be copolymerized with these. Examples of the monomer include methylene, vinyl acetate, vinyl chloride, ethylene fluoride, vinyl halide, styrene, methylstyrene, (meth) acrylic acid and its ester, and (meth) acrylic acid. Amine monomer, (meth) allyl monomer, and the like.

用於使用上述單體而得到上述具有多氟烴基及聚氧乙烯基的含氟化合物之聚合方式,可為塊狀聚合(bulk polymerization)、溶液聚合、懸浮聚合、乳化聚合任一種,而且除熱聚合以外,還可採用光聚合、能量線聚合。 The polymerization method used to obtain the above-mentioned fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group by using the above monomers may be any of bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization, and the heat is removed. In addition to polymerization, photopolymerization and energy ray polymerization can also be used.

作為聚合起始劑,可使用既有之有機偶氮化合物、過氧化物、過硫酸鹽等。 As the polymerization initiator, existing organic azo compounds, peroxides, persulfates, and the like can be used.

本發明所使用之該含氟化合物的重量平均分子量較佳為1,000~100,000,尤以5,000~20,000為佳。重量平均分子量的調整可藉由硫醇(thiol)、硫醇(mercaptan)、α-甲基苯乙烯等的聚合鏈轉移劑來調整。 The weight average molecular weight of the fluorine-containing compound used in the present invention is preferably 1,000 to 100,000, and particularly preferably 5,000 to 20,000. The weight average molecular weight can be adjusted with a polymer chain transfer agent such as thiol, mercaptan, or α-methylstyrene.

又,本發明之脫模層中的該含氟化合物的比例較佳為0.5質量%~10質量%。小於0.5質量%時易發生與黏著層的黏連,而有不易獲得所期望的收捲力的情 形。又,欲使其含有大於10質量%時,由於對樹脂的溶解度較低,不易均勻地摻混,此外,在熔融擠出時,構成脫模層用之丙烯系樹脂會受到該含氟化合物的影響,沿擠出螺桿部滑動,而有不易均勻地排出的情形。 The proportion of the fluorine-containing compound in the release layer of the present invention is preferably 0.5% by mass to 10% by mass. When it is less than 0.5% by mass, adhesion to the adhesive layer is likely to occur, and it is difficult to obtain a desired winding force. shape. When it is desired to contain more than 10% by mass, it is difficult to blend uniformly because the solubility in the resin is low. In addition, during melt extrusion, the propylene-based resin constituting the release layer is subjected to the fluorine-containing compound. In some cases, it may slide along the extrusion screw and may not be discharged uniformly.

此外,本發明之脫模層,除該含氟化合物外,更佳為同時含有0.1質量%~10質量%之平均粒徑1~20μm的無機或有機粒子。從平滑性及黏連性觀點來看,特佳為該無機或有機粒子的平均粒徑為3~15μm與較大之粒徑者。 In addition, in addition to the fluorine-containing compound, the release layer of the present invention preferably contains inorganic or organic particles having an average particle diameter of 1 to 20 μm in an amount of 0.1% to 10% by mass. From the viewpoint of smoothness and blocking properties, it is particularly preferable that the average particle diameter of the inorganic or organic particles is 3 to 15 μm and a larger particle diameter.

作為該無機粒子,除矽石以外,尚可列舉碳酸鈣、碳酸鎂、氧化鈦、黏土、滑石、氫氧化鎂、氫氧化鋁、沸石等,其中更佳為矽石。 Examples of the inorganic particles include silica, calcium carbonate, magnesium carbonate, titanium oxide, clay, talc, magnesium hydroxide, aluminum hydroxide, and zeolite. Among them, silica is more preferred.

作為有機粒子,可列舉聚苯乙烯或聚甲基丙烯酸甲酯等。 Examples of the organic particles include polystyrene and polymethyl methacrylate.

藉由上述含氟化合物、無機或有機粒子及後述之脫模層的表面粗糙度的加乘效果,更容易獲得不易發生黏連,良好的捲出性。 With the multiplier effect of the surface roughness of the fluorine-containing compound, inorganic or organic particles, and a release layer described later, it is easier to obtain blocking, and good rollability.

本發明之脫模層的表面粗糙度較佳為以十點平均粗糙度(Rz)為3μm以上。Rz小於3μm時,在積層體的製造步驟中捲繞成卷狀時,有容易產生皺褶,而致使品質劣化的情形。此表面粗糙度能以對作為主體的丙烯系樹脂少量混合添加如前述缺乏相溶性的乙烯系樹脂之方法等來達成。 The surface roughness of the release layer of the present invention is preferably such that the ten-point average roughness (Rz) is 3 μm or more. When Rz is less than 3 μm, wrinkles are likely to occur when rolled into a roll shape in the manufacturing process of a laminated body, and quality may be deteriorated. This surface roughness can be achieved by a method of mixing and adding a small amount of a main propylene-based resin, such as the aforementioned ethylene-based resin lacking compatibility.

<積層體的製造方法> <Manufacturing method of laminated body>

其次就本發明之積層體的製造方法加以說明。 Next, the manufacturing method of the laminated body of this invention is demonstrated.

本發明之積層體的製造方法並沒有特別限定,例如為基材、黏著層、脫模層之3層積層構成的情形下,可列舉將構成各者的樹脂組成物由個別的擠出機中熔融擠出,使其在噴嘴內積層一體化的所謂的共擠出法;將上述基材、黏著層、脫模層各自個別地熔融擠出後,藉由積層法予以積層的方法等,而從生產性觀點來看較佳以共擠出法來製造。就共擠出法而言,可採用充氣法、T模法等周知之方法,而從厚度精確度優良或控制表面形狀觀點來看,特佳為採T模法的熱熔融共擠出法。 The manufacturing method of the laminated body of this invention is not specifically limited, For example, when it consists of three laminated layers of a base material, an adhesive layer, and a mold release layer, the resin composition which comprises each can be mentioned in a separate extruder. A so-called co-extrusion method in which melt extrusion is performed to integrate layers in a nozzle; a method in which the above-mentioned base material, adhesive layer, and release layer are individually melt-extruded and then laminated by a lamination method, etc. From the viewpoint of productivity, it is preferably produced by a coextrusion method. As for the co-extrusion method, a well-known method such as an inflation method and a T-die method can be used, and from the viewpoint of excellent thickness accuracy or control of the surface shape, a hot melt co-extrusion method using a T-die method is particularly preferred.

於此,賦黏劑若使用預先與苯乙烯系彈性體及/或丙烯‧α-烯烴共聚物均勻混合,而經母粒(master pellet)化者,熔融擠出構成黏著層的樹脂時,可易於得到均勻的黏著層而為佳。母粒中之賦黏劑含量可配合賦黏劑、所混合樹脂的物性而適宜調整,從生產性的觀點來看,較佳為30質量%以上,更佳為40質量%以上。 Here, if the tackifier is uniformly mixed with a styrene-based elastomer and / or a propylene α-olefin copolymer beforehand, and is master pelletized, the resin constituting the adhesive layer may be melt-extruded. It is preferable to obtain a uniform adhesive layer easily. The content of the tackifier in the masterbatch can be appropriately adjusted according to the physical properties of the tackifier and the resin to be mixed. From the viewpoint of productivity, it is preferably 30% by mass or more, more preferably 40% by mass or more.

<用途例> <Application example>

由本發明之組成物構成的積層體可作為防止合成樹脂板、金屬板、玻璃板等的製造、加工、運送時的劃傷、防止髒污附著用的表面保護膜使用,特別適用於表面上具有凹凸的被黏著體。例如使用於由合成樹脂構成之顯示器用構件的擴散板或稜鏡片等,其中由本發明之組成物構成的積層體特佳為使用於稜鏡片的表面保護。 The laminated body composed of the composition of the present invention can be used as a surface protective film for preventing scratches during the manufacture, processing, and transportation of synthetic resin plates, metal plates, and glass plates, and for preventing the adhesion of dirt, and is particularly suitable for having Concavo-convex adherend. For example, a diffuser plate or a cymbal used for a display member made of a synthetic resin, and the laminated body composed of the composition of the present invention is particularly preferably used for surface protection of a cymbal.

由本發明之組成物構成的積層體所保護的稜鏡片,係將三角柱狀的稜鏡平行片體表面地配置於片體的單面,使其稜線為外表面者。構成稜鏡的材料並未 特別限定,係使用具透光性之樹脂,可列舉例如丙烯酸系樹脂、聚碳酸酯等。稜鏡之相鄰稜線間的距離較佳為10~1,000μm,更佳為10~300μm。稜鏡的高度(三角柱的底邊起至稜線之垂線的長度)較佳為5~200μm,更佳為10~100μm。又,由本發明所保護的稜鏡片,可僅由相同形狀的稜鏡構成,亦可由2種以上之不同形狀的稜鏡構成。由不同形狀的稜鏡構成的情形下,有例如高度不同的大小稜鏡逐一交互地配置、或1個大的稜鏡與複數個小的稜鏡交互地配置的情形,其可視目的而適當設計。 The cymbals protected by the laminated body composed of the composition of the present invention are those in which triangular columnar cymbals are arranged parallel to the surface of the sheet on one side of the sheet, and the ridge line is the outer surface. The materials that make up 稜鏡 It is specifically limited to use a light-transmitting resin, and examples thereof include acrylic resins and polycarbonates. The distance between the adjacent edges of is preferably 10 to 1,000 μm, and more preferably 10 to 300 μm. The height of 长度 (the length of the perpendicular from the bottom of the triangular column to the ridgeline) is preferably 5 to 200 μm, and more preferably 10 to 100 μm. In addition, the cymbals protected by the present invention may be composed of only cymbals of the same shape, or of two or more different types of cymbals. In the case of 稜鏡 with different shapes, for example, 稜鏡 with different heights are arranged alternately one by one, or 1 large 稜鏡 is alternately arranged with a plurality of small 稜鏡, and it may be appropriately designed according to the purpose. .

[實施例] [Example]

以下,基於實施例對本發明進一步具體地加以說明,惟本發明不受限於此等實施例。此外,各種物性的測定及評價係根據以下方法實施。 Hereinafter, the present invention will be further specifically described based on examples, but the present invention is not limited to these examples. The measurement and evaluation of various physical properties are performed according to the following methods.

(1)動態黏彈性測定 (1) Determination of dynamic viscoelasticity

將構成例示於實施例及比較例中之組成物的樹脂以所指定的混合比摻混,使用東洋精機製作所製LABO PLASTOMILL 100MR3,以溫度200℃、旋轉數20rpm進行混練15分鐘。接著,將所得混練物熔融成型為厚度2mm,使用TA Instriments公司製流變儀AR2000ex,於溫度-80~120℃、以升溫速度3℃/分鐘、頻率1Hz、變形0.01%,以剪切模式評價組成物之黏彈性。由所得結果,求得於100℃之損失正切(tanδ100℃)、於0℃之損失正切(tanδ0℃)、於60℃之損失正切與於100℃之損失正切差(tanδ100℃-tanδ60℃)。 The resins constituting the compositions illustrated in the examples and comparative examples were blended at a specified mixing ratio, and kneaded for 15 minutes at a temperature of 200 ° C and a number of revolutions of 20 rpm using LABO PLASTOMILL 100MR3 manufactured by Toyo Seiki Seisakusho. Next, the obtained kneaded product was melt-molded to a thickness of 2 mm, and was evaluated in a shear mode using a rheometer AR2000ex manufactured by TA Instriments, at a temperature of -80 to 120 ° C, a heating rate of 3 ° C / min, a frequency of 1 Hz, and a deformation of 0.01%. Viscoelasticity of the composition. From the obtained results, the loss tangent at 100 ° C (tanδ 100 ° C ), the loss tangent at 0 ° C (tanδ 0 ° C ), the difference between the loss tangent at 60 ° C and the loss tangent at 100 ° C (tanδ 100 ° C- tanδ) 60 ° C ).

(2)示差掃描熱量測定 (2) Differential scanning calorimetry

以與上述(1)同樣的方法將例示於實施例及比較例的組成物混練後,將所得之混練物熔融成型為厚度50μm,進一步秤量5mg,作為測定用試料。其後,將試料採取而置於鋁製盤,使用示差掃描熱量計(SEIKO電子工業製RDC220),於氮氣環境下,從室溫以40℃/分鐘升溫至230℃,於230℃保持5分鐘後,以40℃/分鐘降溫至20℃,於40℃保持5分鐘。其後,進一步再度以40℃/分鐘升溫至230℃,確認此時所得之吸熱波峰溫度(Tm)。 After the compositions exemplified in the examples and comparative examples were kneaded in the same manner as in the above (1), the obtained kneaded materials were melt-molded to a thickness of 50 μm, and further weighed 5 mg as a measurement sample. Thereafter, the sample was taken and placed on an aluminum plate, and a differential scanning calorimeter (SEIKO Electronics Industry RDC220) was used to raise the temperature from room temperature to 40 ° C / minute to 230 ° C under a nitrogen atmosphere, and held at 230 ° C for 5 minutes. After that, the temperature was lowered to 20 ° C at 40 ° C / min, and the temperature was maintained at 40 ° C for 5 minutes. Thereafter, the temperature was further increased to 230 ° C at 40 ° C / minute, and the endothermic peak temperature (T m ) obtained at this time was confirmed.

(3)對稜鏡片的貼合 (3) Lamination of sepals

將實施例及比較例所得的積層體,使用輥壓機(安田精機製作所(股)特殊壓接輥),以0.35MPa之條件貼合於厚度160μm、表面粗糙度(Rz)27μm的稜鏡片上。 The laminated bodies obtained in the examples and comparative examples were bonded to a cymbal with a thickness of 160 μm and a surface roughness (Rz) of 27 μm using a roller press (special pressure bonding roller of Yasuda Seiki Seisakusho Co., Ltd.) under the condition of 0.35 MPa. .

(4)剝離性 (4) Peelability

將於上述(3)所得的試樣於溫度23℃、相對濕度50%的條件下保存1週後,使用拉伸試驗機(ORIENTEC(股)“Tensilon”萬能試驗機),以拉伸速度300mm/分鐘、剝離角度180°,測定剝離力(S),根據下述基準評價剝離性。 After the sample obtained in the above (3) was stored at a temperature of 23 ° C and a relative humidity of 50% for one week, a tensile tester (ORIENTEC (Tensilon) universal tester) was used at a tensile speed of 300 mm / Min, peeling angle 180 °, peeling force (S) was measured, and peelability was evaluated according to the following criteria.

5:0.02N/25mm≦S≦0.08N/25mm 5: 0.02N / 25mm ≦ S ≦ 0.08N / 25mm

3:0.08N/25mm<S≦0.12N/25mm 3: 0.08N / 25mm <S ≦ 0.12N / 25mm

1:S<0.02N/25mm、或S>0.12N/25mm。 1: S <0.02N / 25mm, or S> 0.12N / 25mm.

(5)加工特性 (5) Processing characteristics

以目視觀察經下述處理之稜鏡片與積層體的貼合狀態:將於上述(3)所得的試樣於溫度23℃、相對濕度50%條件下保存24小時後,以Thomson型衝壓刀具進行模切,剛衝壓後及以溫度40℃、相對濕度50%條件下保存1週 ;並根據以下基準進行評價。 Visually observe the bonding state of the cymbals and the laminated body after the following treatment: After the sample obtained in the above (3) is stored at a temperature of 23 ° C. and a relative humidity of 50% for 24 hours, it is processed with a Thomson type punching tool. Die-cut, stored for one week immediately after stamping and at a temperature of 40 ° C and a relative humidity of 50% ; And evaluated based on the following criteria.

5:剛衝壓後及於40℃保存1週後,均完全沒看到剝離 5: Immediately after pressing and after storage at 40 ° C for 1 week, no peeling was observed at all.

4:剛衝壓後完全沒看到剝離,但於40℃保存1週後端部有非常輕微的剝離 4: No peeling was observed at all immediately after punching, but there was very slight peeling at the rear end after storage at 40 ° C for 1 week

3:剛衝壓後及於40℃保存1週後,端部均有非常輕微的剝離 3: Immediately after the stamping and after storage at 40 ° C for 1 week, the ends are very slightly peeled off.

2:於40℃保存1週後,端部試樣周圍的全長1/2以上剝離 2: After storage at 40 ° C for 1 week, 1/2 or more of the entire length around the end sample is peeled off

1:剛衝壓後,端部試樣周圍的全長1/2以上剝離。 1: Immediately after punching, the entire length around the end sample is peeled off by more than 1/2.

(組成物) (Composition)

如實施例1~5、比較例1~4所示準備以下之組成物A~E、X~Z、S之材料,如以上述(1)、(2)所示,實施動態黏彈性測定及示差掃描熱量測定。將結果顯示於表1。 Prepare the following materials A to E, X to Z, and S as shown in Examples 1 to 5 and Comparative Examples 1 to 4, and perform dynamic viscoelasticity measurement as shown in (1) and (2) above. Differential scanning calorimetry. The results are shown in Table 1.

(實施例1) (Example 1)

組成物A:使用14質量%SEBS(旭化成Chemicals製Tuftec H1052)、30質量%HSBR(JSR製1321P)作為苯乙烯系彈性體;使用20質量%丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7080、熔點83℃)作為丙烯‧α-烯烴共聚物;使用36質量%之氫化萜烯酚(Yasuhara Chemical製YS Polyster TH130)的50質量%母粒作為賦黏劑。 Composition A: 14% by mass of SEBS (Tuftec H1052, manufactured by Asahi Kasei Chemicals) and 30% by mass of HSBR (1321P, manufactured by JSR) were used as styrene-based elastomers; 20% by mass of propylene ‧ 1-butene copolymer (Tafmer, manufactured by Mitsui Chemicals) XM-7080 (melting point: 83 ° C.) was used as a propylene · α-olefin copolymer; 36% by mass of a hydrogenated terpene phenol (YS Polyster TH130 manufactured by Yasuhara Chemical) was used as a tackifier.

其中,前述該氫化萜烯酚的50質量%母粒,係使用預先用雙軸擠出機而將50質量%前述氫化萜烯酚與50質量%前述SEBS經母粒化者。 The 50% by mass master batch of the hydrogenated terpene phenol is obtained by granulating 50% by mass of the hydrogenated terpene phenol and 50% by mass of the SEBS with a biaxial extruder.

(實施例2) (Example 2)

組成物B:除了使用8質量%SEBS(旭化成Chemicals 製Tuftec H1052)、27質量%HSBR(JSR製1321P)、25質量%丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7080、熔點83℃)、40質量%之氫化萜烯酚(Yasuhara Chemical製YS Polyster TH130)的50質量%母粒以外,與組成物A同樣地進行。 Composition B: Except the use of 8% by mass of SEBS (Asahi Kasei Chemicals Tuftec H1052), 27% by mass HSBR (1321P made by JSR), 25% by mass propylene‧1-butene copolymer (Tafmer XM-7080 manufactured by Mitsui Chemicals, melting point 83 ° C), and 40% by mass of hydrogenated terpene phenol (Yasuhara Except for 50% by mass of master batches of YS Polyster TH130 (manufactured by Chemical Co., Ltd.), it was carried out in the same manner as in Composition A.

(實施例3) (Example 3)

組成物C:除了使用丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7070、熔點75℃)作為丙烯‧α-烯烴共聚物以外,與組成物B同樣地進行。 Composition C: The same procedure as in Composition B was performed except that a propylene‧1-butene copolymer (Tafmer XM-7070 manufactured by Mitsui Chemicals, melting point: 75 ° C) was used as the propylene · α-olefin copolymer.

(實施例4) (Example 4)

組成物D:除了使用14質量%SEBS(旭化成Chemicals製Tuftec H1052)、30質量%HSBR(JSR製Dynaron 1321P)、10質量%丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7080、熔點83℃)、36質量%之氫化萜烯酚(Yasuhara Chemical製YS Polyster TH130)的50質量%母粒、10質量%之密度921kg/m3、於190℃之MFR為5g/分鐘之己烯共聚合聚乙烯(LLDPE)以外,與組成物A同樣地進行。 Composition D: Except 14% by mass of SEBS (Tuftec H1052 manufactured by Asahi Kasei Chemicals), 30% by mass of HSBR (Dynaron 1321P manufactured by JSR), 10% by mass of propylene ‧ 1-butene copolymer (Tafmer XM-7080 manufactured by Mitsui Chemicals, melting point 83 ° C), 36% by mass of hydrogenated terpene phenol (YS Polyster TH130 manufactured by Yasuhara Chemical), 50% by mass master batch, 10% by mass of 921 kg / m 3 , and a MFR at 190 ° C of 5 g / min. Except for the polymerization of polyethylene (LLDPE), it was carried out in the same manner as in Composition A.

(實施例5) (Example 5)

組成物E:除了使用25質量%SEBS(旭化成Chemicals製Tuftec H1052)、30質量%HSBR(JSR製Dynaron 1321P)、10質量%丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7080、熔點83℃)、20質量%之氫化萜烯酚(Yasuhara Chemical製YS Polyster TH130)的50質量%母粒、15質量%主要由非晶性聚丙烯構成之樹脂(住友化學製Tafthren T3712)以外,與組成物A同樣地進行。 Composition E: Except using 25% by mass of SEBS (Tuftec H1052 manufactured by Asahi Kasei Chemicals), 30% by mass of HSBR (Dynaron 1321P manufactured by JSR), 10% by mass of propylene ‧ 1-butene copolymer (Tafmer XM-7080 manufactured by Mitsui Chemicals, melting point) 83 ° C), 20% by mass of 50% by mass master batch of hydrogenated terpene phenol (YS Polyster TH130 manufactured by Yasuhara Chemical), 15% by mass of resin mainly composed of amorphous polypropylene (Tafthren T3712 manufactured by Sumitomo Chemical), and Composition A was performed in the same manner.

(比較例1) (Comparative example 1)

組成物X:除了使用15質量%SEBS(旭化成Chemicals製Tuftec H1052)、30質量%HSBR(JSR製Dynaron 1321P)、30質量%之氫化萜烯酚(Yasuhara Chemical製YS Polyster TH130)的50質量%母粒、25質量%與於實施例4中所使用者相同的LLDPE以外,與組成物A同樣地進行。 Composition X: Except 50% by mass of 15% by mass of SEBS (Tuftec H1052 manufactured by Asahi Kasei Chemicals), 30% by mass of HSBR (Dynaron 1321P manufactured by JSR), and 30% by mass of hydrogenated terpene phenol (YS Polyster TH130, manufactured by Yasuhara Chemical) Except for the pellets and 25% by mass of the same LLDPE as those used by the user in Example 4, the same procedure was performed as in Composition A.

(比較例2) (Comparative example 2)

組成物Y:除了使用50質量%SEBS(旭化成Chemicals製Tuftec H1052)、50質量%HSBR(JSR製Dynaron 1321P)以外,與組成物A同樣地進行。 Composition Y: It carried out similarly to composition A except using 50 mass% of SEBS (Tuftec H1052 manufactured by Asahi Kasei Chemicals) and 50 mass% of HSBR (Dynaron 1321P manufactured by JSR).

(比較例3) (Comparative example 3)

組成物Z:除了使用70質量%丙烯‧1-丁烯共聚物(三井化學製Tafmer XM-7080、熔點83℃)、30質量%主要由非晶性聚丙烯構成之樹脂(住友化學製Tafthren T3712)以外,與組成物A同樣地進行。 Composition Z: Except the use of 70% by mass propylene‧1-butene copolymer (Tafmer XM-7080 manufactured by Mitsui Chemicals, melting point: 83 ° C), and 30% by mass of resin mainly composed of amorphous polypropylene (Tafthren T3712 manufactured by Sumitomo Chemical) ) Was carried out in the same manner as in Composition A.

(比較例4) (Comparative Example 4)

組成物S:除了使用35質量%SEBS(旭化成Chemicals製Tuftec H1052)、35質量%HSBR(JSR製Dynaron 1321P)、30質量%主要由非晶性聚丙烯構成之樹脂(住友化學製Tafthren T3712)以外,與組成物A同樣地進行。 Composition S: Except using 35% by mass of SEBS (Tuftec H1052 manufactured by Asahi Kasei Chemicals), 35% by mass of HSBR (Dynaron 1321P manufactured by JSR), and 30% by mass of a resin composed mainly of amorphous polypropylene (Tafthren T3712, manufactured by Sumitomo Chemical) It is carried out in the same manner as in Composition A.

(積層體) (Laminated body)

如下述之實施例及比較例所示,作成積層體,並實施評價。將評價結果顯示於表2。 As shown in the following Examples and Comparative Examples, a laminated body was prepared and evaluated. The evaluation results are shown in Table 2.

(實施例1’) (Example 1 ')

如下準備各層之構成樹脂。 The constituent resin of each layer was prepared as follows.

黏著層:使用實施例1所示之組成物A。 Adhesive layer: Composition A shown in Example 1 was used.

基材:使用在230℃測定之MFR為5g/10分鐘的市售均聚丙烯。 Substrate: A commercially available average polypropylene having an MFR of 5 g / 10 minutes measured at 230 ° C was used.

脫模層:除了45質量%之與於基材所使用者相同的均聚丙烯、24質量%在230℃測定之MFR為5g/10分鐘的丙烯-乙烯‧無規共聚物(乙烯含量5質量%)、6質量%在190℃測定之MFR為2g/10分鐘的密度919kg/m3的低密度聚乙烯外,預先準備於90質量%之上述均聚丙烯中包含4質量%之平均粒徑11μm的矽石、6質量%之具有多氟烴基及聚氧乙烯基的含氟化合物的混合組成物作為母料,取25質量%以亨舍爾混合機(Henschel mixer)均勻混合之。 Mold release layer: Except for 45% by mass of the same polypropylene as the user of the substrate, 24% by mass of propylene-ethylene · random copolymer (Methylene content: 5 mass) measured at 230 ° C with an MFR of 5 g / 10 min. %), 6 mass% Low-density polyethylene having a MFR measured at 190 ° C of 2 g / 10 minutes and a density of 919 kg / m 3 , prepared in advance in 90 mass% of the above-mentioned homopolypropylene containing an average particle diameter of 4 mass% A mixed composition of 11 μm silica, 6% by mass of a fluoro compound having a polyfluorocarbon group and polyoxyethylene group was used as a master batch, and 25% by mass was uniformly mixed with a Henschel mixer.

其中,具有多氟烴基及聚氧化乙烯基的含氟化合物係使用;以25質量%作為單體(a)的C6F13之丙烯酸全氟烷基酯(CH2=CHCOOC2H4C6F13)、50質量%作為單體(b)的氧化乙烯重複單元為8個的聚乙二醇單丙烯酸酯{CH2=CHCOO(CH2CH2O)8H}、及25質量%作為單體(c)的氧化乙烯重複單元為8個的聚乙二醇二甲基丙烯酸酯{CH2=C(CH3)COO(CH2CH2O)8COC(CH3)=CH2}的比例,使用三氟甲苯作為溶劑,使用作為聚合起始劑的2,2’-偶氮雙(2,4-二甲基戊腈)、且使用作為鏈轉移劑的月桂基硫醇,於氮氣流下,一面攪拌一面使其在60℃下進行5小時聚合,其後,在甲醇中進行沉澱‧過濾後,進行減壓乾燥而成者。 Among them, a fluorine-containing compound having a polyfluorohydrocarbon group and a polyoxyethylene group is used; a C 6 F 13 acrylic perfluoroalkyl ester (CH 2 = CHCOOC 2 H 4 C 6 ) having 25% by mass as a monomer (a). F 13 ), 50% by mass of the ethylene oxide repeating unit as the monomer (b), 8 polyethylene glycol monoacrylates {CH 2 = CHCOO (CH 2 CH 2 O) 8 H}, and 25% by mass as Polyethylene glycol dimethacrylate with 8 ethylene oxide repeating units in monomer (c) {CH 2 = C (CH 3 ) COO (CH 2 CH 2 O) 8 COC (CH 3 ) = CH 2 } Using trifluorotoluene as a solvent, 2,2'-azobis (2,4-dimethylvaleronitrile) as a polymerization initiator, and lauryl mercaptan as a chain transfer agent. Polymerization was carried out at 60 ° C for 5 hours while stirring under a nitrogen stream, followed by precipitation in methanol, filtration, and drying under reduced pressure.

接著,將各層之構成樹脂投入至具有包含 φ115mm(基材用)、φ90mm(黏著層用)、φ65mm(脫模層用)之3台擠出機的噴嘴寬度2,400mm的多歧管T模複合製膜機的各個擠出機中,調整各擠出機的排出量,使其成為黏著層厚度比率12.5%、脫模層厚度比率8.5%、基材厚度比率79%,再由複合T模中在擠出溫度各為200℃下予以擠出,成型為薄膜厚度40μm的3層積層薄膜。其後,對稜鏡片貼合後,評價剝離性及加工特性。 Next, the constituent resin of each layer is charged Adjust the diameter of each extruder of the multi-manifold T-die composite film making machine with a nozzle width of 2,400 mm in three extruders of φ115 mm (for substrates), φ90 mm (for adhesive layers), and φ65 mm (for release layers) The discharge amount of each extruder was set to 12.5% of the thickness of the adhesive layer, 8.5% of the thickness of the release layer, and 79% of the thickness of the substrate, and then extruded from the compound T die at an extrusion temperature of 200 ° C. Then, a three-layer laminated film having a film thickness of 40 μm was molded. Then, after bonding to the cymbals, the peelability and processing characteristics were evaluated.

(實施例2’) (Example 2 ')

除黏著層使用實施例2所示之組成物B以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition B shown in Example 2 was used as the adhesive layer, and evaluated.

(實施例3’) (Example 3 ')

除黏著層使用實施例3所示之組成物C以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition C shown in Example 3 was used as the adhesive layer, and evaluation was performed.

(實施例4’) (Example 4 ')

除黏著層使用實施例4所示之組成物D以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition D shown in Example 4 was used as the adhesive layer, and evaluated.

(實施例5’) (Example 5 ')

除黏著層使用實施例5所示之組成物E以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition E shown in Example 5 was used as the adhesive layer, and evaluated.

(比較例1’) (Comparative Example 1 ')

除黏著層使用比較例1所示之組成物X以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition X shown in Comparative Example 1 was used as the adhesive layer, and evaluated.

(比較例2’) (Comparative Example 2 ')

除黏著層使用比較例2所示之組成物Y以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was prepared in the same manner as in Example 1 'except that the composition Y shown in Comparative Example 2 was used as the adhesive layer, and evaluated.

(比較例3’) (Comparative Example 3 ')

除黏著層使用比較例3所示之組成物Z以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition Z shown in Comparative Example 3 was used as the adhesive layer, and evaluated.

(比較例4’) (Comparative Example 4 ')

除黏著層使用比較例4所示之組成物S以外,與實施例1’同樣地進行,做成積層體,並實施評價。 A laminated body was produced in the same manner as in Example 1 'except that the composition S shown in Comparative Example 4 was used as the adhesive layer, and evaluated.

滿足本發明要件的實施例1’~5’的積層體,其剝離性及加工特性優異,另一方面,未滿足本發明之要件的比較例1’~4’,其結果剝離性或加工特性變差。 The laminates of Examples 1 'to 5' that satisfy the requirements of the present invention have excellent peelability and processing characteristics. On the other hand, Comparative Examples 1 'to 4' that do not satisfy the requirements of the present invention have peelability or processing characteristics as a result. Worse.

[產業上之可利用性] [Industrial availability]

本發明之組成物及積層體,不僅是可用作供防止表面具有凹凸的被黏著體產生傷痕、髒污的表面保護膜,亦可較佳地使用作為合成樹脂、金屬、玻璃等各種素材所構成之各式各樣製品的表面保護膜用途。 The composition and the laminated body of the present invention can be used not only as a surface protection film for preventing scratches or stains on adherends having unevenness on the surface, but also as various materials such as synthetic resins, metals, and glass. The surface protection film used in various products.

Claims (4)

一種組成物,其特徵在於其含有至少以下之(1)至(3)之成分:(1)苯乙烯系彈性體(2)丙烯‧α-烯烴共聚物(3)賦黏劑;且該組成物於示差掃描熱量測定中在60℃以上100℃以下之範圍具有吸熱波峰,以及滿足以下之條件1及2:條件1 頻率1Hz、溫度0℃之剪切損失正切(tanδ0℃)為0.20以上0.60以下;條件2 頻率1Hz、溫度100℃之剪切損失正切(tanδ100℃)為0.40以上0.80以下。A composition characterized in that it contains at least the following components (1) to (3): (1) a styrene-based elastomer (2) a propylene · α-olefin copolymer (3) a tackifier; and An object has endothermic peaks in the range of 60 ° C to 100 ° C in differential scanning calorimetry, and the following conditions 1 and 2 are satisfied: Condition 1 The shear loss tangent (tanδ 0 ° C ) of frequency 1Hz and temperature 0 ° C is 0.20 or more 0.60 or less; Condition 2 The shear loss tangent (tan δ 100 ° C ) at a frequency of 1 Hz and a temperature of 100 ° C is 0.40 or more and 0.80 or less. 如請求項1之組成物,其中關於於頻率1Hz、溫度60℃之剪切損失正切(tanδ60℃),及溫度100℃之剪切損失正切(tanδ100℃),該組成物係滿足以下之條件3;條件3 0.20≦tanδ100℃-tanδ60℃≦0.60。For example, if the composition of claim 1 relates to a shear loss tangent (tanδ 60 ° C ) at a frequency of 1 Hz and a temperature of 60 ° C , and a shear loss tangent (tanδ 100 ° C ) at a temperature of 100 ° C , the composition satisfies the following Condition 3; Condition 3 0.20 ≦ tanδ 100 ° C -tanδ 60 ° C ≦ 0.60. 一種積層體,其係於基材的一側之面上具有黏著層之積層體中,該黏著層含有如請求項1或2之組成物。A laminated body is a laminated body having an adhesive layer on one side of a substrate, and the adhesive layer contains the composition as claimed in claim 1 or 2. 如請求項3之積層體,其係用於稜鏡片之表面保護。The laminated body of claim 3 is used for the surface protection of cymbals.
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