TWI665053B - 晶圓之兩面研磨裝置及兩面研磨方法 - Google Patents
晶圓之兩面研磨裝置及兩面研磨方法 Download PDFInfo
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- TWI665053B TWI665053B TW107102186A TW107102186A TWI665053B TW I665053 B TWI665053 B TW I665053B TW 107102186 A TW107102186 A TW 107102186A TW 107102186 A TW107102186 A TW 107102186A TW I665053 B TWI665053 B TW I665053B
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- Prior art keywords
- wafer
- flow rate
- gbir
- polishing
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2017072755A JP6743746B2 (ja) | 2017-03-31 | 2017-03-31 | ウェーハの両面研磨装置および両面研磨方法 |
JP2017-072755 | 2017-03-31 |
Publications (2)
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TW201836765A TW201836765A (zh) | 2018-10-16 |
TWI665053B true TWI665053B (zh) | 2019-07-11 |
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TW107102186A TWI665053B (zh) | 2017-03-31 | 2018-01-22 | 晶圓之兩面研磨裝置及兩面研磨方法 |
Country Status (2)
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JP (1) | JP6743746B2 (ja) |
TW (1) | TWI665053B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7081544B2 (ja) * | 2019-03-22 | 2022-06-07 | 株式会社Sumco | ワークの両面研磨方法及びワークの両面研磨装置 |
CN113894635B (zh) * | 2021-11-03 | 2022-06-21 | 安徽格楠机械有限公司 | 基于自学习的智能硅基晶圆超精密研磨抛光机 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201334051A (zh) * | 2011-11-07 | 2013-08-16 | Shinetsu Handotai Kk | 雙面研磨方法 |
TW201529227A (zh) * | 2013-11-18 | 2015-08-01 | Sumco Corp | 工件之兩面硏磨裝置及兩面硏磨方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07111255A (ja) * | 1993-10-12 | 1995-04-25 | Nippon Steel Corp | ウェーハ研磨装置 |
JP3935757B2 (ja) * | 2002-03-28 | 2007-06-27 | 信越半導体株式会社 | ウエーハの両面研磨装置及び両面研磨方法 |
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2017
- 2017-03-31 JP JP2017072755A patent/JP6743746B2/ja active Active
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2018
- 2018-01-22 TW TW107102186A patent/TWI665053B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201334051A (zh) * | 2011-11-07 | 2013-08-16 | Shinetsu Handotai Kk | 雙面研磨方法 |
TW201529227A (zh) * | 2013-11-18 | 2015-08-01 | Sumco Corp | 工件之兩面硏磨裝置及兩面硏磨方法 |
Also Published As
Publication number | Publication date |
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JP6743746B2 (ja) | 2020-08-19 |
TW201836765A (zh) | 2018-10-16 |
JP2018171695A (ja) | 2018-11-08 |
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