TWI664305B - Three dimension revolution and rotation deposition turntable structure - Google Patents

Abstract

The invention is a 3D vapor-deposited male auto-rotating plating pot structure, which includes: a rotary base; a rotary top plate running around the rotary base by supporting members; a plating pot auto-rotating module having a cantilever coupled to the rotary top plate; The disk is coupled to the bottom side of the cantilever; and its self-rotating plating disk is combined to the cantilever and runs in a circular orbit; and a plurality of wafer carriers are fixed on the self-rotating plating disk by a rotating shaft, and the outer ring teeth The teeth are combined with the rotation of the gear plate.

Description

3D Evaporation of Male Rotary Plating Pot Structure

The invention is a 3D vapor-deposited male auto-rotation plating pot structure, particularly a 3D vapor-deposited male auto-rotation plating pot structure.

The Republic of China Patent Bulletin No. 00470215 (hereinafter referred to as the 215 patent) discloses a fixed structure of a revolving wafer carrier. It mainly discloses a revolving rack and a rotatable wafer carrier P13. However, the following exist: Questions: 1. Only the rotation of P110, P120 with 2 rotation axes, the wafer cannot rotate during evaporation, and the directivity will cause shadows and the film thickness will be inconsistent. 2. The wafer carrier P13 must be rotated by the drive of the shaft AP131, and the shaft AP131 plus the drive unit that must rotate with it will increase the volume of the equipment. 3. The entire wafer carrier P13 must be supported by the roller P112, and the matching on both sides of the roller P112 is completely disproportionate, which will cause the rotation structure to be unstable and easily damaged.

The Republic of China Patent Bulletin No. M316262 (hereinafter referred to as the 262 patent), discloses a to-be-plated bearing device of a vacuum evaporation machine. Although it discloses a rotating frame with 3 rotation axes rotating P120, P120, and P130, and a rotatable bearing Disk and rotatable rotating body, however, it has the following problems: 1. All load-bearing disks P14 provide suspension support by the first support rod P12, which will cause the drive shaft B1 to bear all structural support forces, plus The drive shaft B1 also rotates frequently, so it is easy to produce a high failure rate. 2. The carrier plate P14 is suspended by only the first support rod P12, which makes the carrier plate P14 easy to shake when it rotates, thus affecting the coating quality. 3. The rotating body P15 is rotated by the extension rod P131 being turned by the protruding rod P152. Such a structural behavior will easily cause the wafer on the rotating body P15 to be excessively shaken. In addition to easily causing damage to the wafer, It is easy for the wafer to fall under sudden vibration. 4. When the rotating body P15 is rotated, the wafer will be flipped directly from the top to the bottom and rotated non-linearly, so the uniformity of the coating will be seriously affected.

In addition, with the continuous improvement of semiconductor process technology, many of the electronic components currently fabricated on wafers already have more complex three-dimensional (3D) structures, because three-dimensional structures will produce many different shadows from different angles, and the above The evaporation machine cannot effectively overcome the problem of shadows on the three-dimensional electronic component 421 evaporation process, that is, the problem of poor step coverage.

The invention is a 3D evaporation public auto-rotation plating pot structure, which mainly solves the problem of unstable support of the plating pot structure, unable to provide linear operation, and poor design of the evaporation angle when the wafer is vaporized by the plating pot Problems such as poor thickness uniformity, poor step coverage, and inconsistent coating structure.

The invention provides a 3D vapor-deposited male self-rotating plating pot structure, which includes: a revolution base plate, which is a circular orbit; a revolution top plate, which has a plurality of support members, and the bottom of each support member is rotated by a revolution A runner runs around the revolution chassis; a plurality of plating pan rotation modules, each of the plating pan rotation modules includes: a cantilever, which is coupled to the revolution top disc at an inclined angle; a gear disc, which is coupled to the bottom of the cantilever On the side, the gear plate is formed with an inner ring tooth; and a self-rotating plating plate, which is coupled to a cantilever through a rotating shaft, and the end of the self-rotating plating plate is linearly running on a revolution chassis; and a plurality of wafer carrier plates, Each wafer carrier is fixed on a self-rotating plating plate by a rotating shaft, and a linear and smooth rotation combination is generated by an outer ring tooth and an inner ring tooth of each wafer carrier.

With the implementation of the present invention, at least the following improved effects can be achieved: 1. When a wafer can be lifted to vaporize a wafer, the uniformity of the thickness of the coating is better due to the design of the evaporation angle. 2. All revolutions and rotations can be operated in a linear and stable manner, and the wafer carrier can be rotated linearly. 3. The linear and smooth rotation of the wafer carrier can improve the step coverage and make the coating structure consistent. Fourth, by providing up and down support, provide solid structural support.

In order to allow any person skilled in the art to understand and implement the technical content of the present invention, and according to the content disclosed in this specification, the scope of patent applications and the drawings, any person skilled in the art can easily understand the related purposes and advantages of the present invention. Therefore, detailed features and advantages of the present invention will be described in detail in the embodiments.

As shown in FIGS. 2 to 4, this embodiment is a 3D vapor-deposited male auto-rotating plating pot structure 100, which includes: a revolution base 10, a revolution top plate 20, and a plurality of plating pot rotation modules 30; And a plurality of wafer carriers 40.

The revolving chassis 10 is used as the bottom support of the entire revolving plating structure 100. In order to achieve the effect of rotation, the revolving chassis 10 may be a circular orbit.

The orbiting top plate 20 has a plurality of supporting members 210 so that the orbiting top plate 20 can be mounted on the orbiting bottom plate 10. In order to effectively rotate the revolving top plate 20, a revolving wheel 220 may be provided at the bottom of each support member 210. The revolving wheel 220 can smoothly run the revolving top disc 20 on the revolving chassis 10.

In order to enable the orbiting top plate 20 to be arranged on the orbiting bottom plate 10 in the simplest and most stable manner, the plurality of supporting members 210 may be three supporting members 210, and each supporting member 210 is arranged at an equal interval from each other. This can form a three-legged structure.

In order to make the 3D vapor-deposited self-rotating plating pot structure 100 operate regularly, the orbiting chassis 10 and the orbiting pan 20 are mutually parallel structures, and both the orbiting chassis 10 and the orbiting pan 20 are arranged horizontally.

As shown in FIG. 5, a plurality of plating pot rotation modules 30 each include: a cantilever 310; a gear plate 320; and a rotation plating plate 330. The above-mentioned plurality of plating pan rotation modules 30 can be three plating pan rotation modules 30 and are arranged at equal intervals and symmetrical to each other.

As shown in FIG. 6, the cantilever 310 is coupled to the orbiting top plate 20 at an inclined angle. The cantilever 310 is mainly used to support the gear plate 320 and the rotation plating plate 330. In order to respond to the requirements of different tilt angles of different products during evaporation, the cantilever 310 can be designed to be combined with the orbit top plate 20 through an angle adjuster 50.

The above-mentioned angle adjuster 50 may include a first angle adjustment unit 510 and a second angle adjustment unit 520. By using the first angle adjustment unit 510 and the second angle adjustment unit 520, the evaporation angle θ can be generated. Fine-tuning at different angles.

In this embodiment, an 18-degree included angle formed by the self-rotating plating plate 330 and the orbiting top plate 20 is defined as a reference angle X. The adjustment angle of the first angle adjustment unit 510 may be +3, +1, -1, or -3 degrees of the reference angle. The adjustment angle of the second angle adjustment unit 520 may be +2, 0, or -2 degrees of the reference angle.

The gear plate 320 is fixedly coupled to the bottom side of the cantilever 310. The gear plate 320 has a circular opening 321 therein, and the circular opening 321 is formed with an inner annular tooth 322. The gear plate 320 is mainly used to provide a force point when the wafer carrier 40 rotates.

The self-rotating plating plate 330 is a circular plate-like structure. The center of the rotation plating plate 330 is coupled to the cantilever 310 through a rotating shaft 60, and the end of the rotation plating plate 330 runs linearly on the revolution chassis 10. At this time, the revolution chassis 10 also shares the revolution plating structure 100 The required structural support force will make the self-rotating plating pot structure 100 more stable during operation.

With the above structure, when the revolving top plate 20 rotates, the self-rotating plating plate 330 will be driven to move. When the self-rotating plating plate 330 moves, it interacts with the orbiting chassis 10, so the self-rotating plating plate 330 rotates under the support of the rotating shaft 60.

A plurality of wafer carriers 40, each wafer carrier 40 is used to carry a wafer 420 or an object to be evaporated, and each wafer carrier 40 is fixed on the autorotation plate 330 by a rotating shaft 60. At the time of setting, each wafer carrier 40 can be arranged on the same concentric circle of the auto-rotation plating plate 330 in an equidistant arrangement, and one outer ring tooth 410 and an inner ring tooth of each wafer carrier 40 The teeth 322 produce a linear and smooth rotation type joint.

With the above-mentioned structure, each of the wafer carriers 40 is moved when the self-rotating plating plate 330 is rotated. When the wafer carrier 40 moves, the outer ring teeth 410 of the wafer carrier 40 and the inner ring teeth 322 interact with each other. Therefore, under the support of the rotating shaft 60, the wafer carrier 40 will be caused to rotate linearly.

This embodiment uses three axes to revolve and rotate the plating pot, thereby causing more position and angle changes between the wafer 420 and the evaporation source 70, thereby improving the uniformity of the evaporation and achieving a relatively Good Step Coverage and consistent coating structure.

As shown in FIGS. 7 and 8, the first axis 910 is an axis formed by the center points of the revolution chassis 10 and the revolution top disc 20; and the second axis 920 refers to the axis of the rotation plate 60 of the rotation plating plate 330. Centerline; regarding the third axis 930, it is the centerline of the wafer carrier 40 and its rotation axis 60.

During operation, driven by a motor, the orbiting plating pot structure 100 revolves along the first axis 910. At this time, the orbiting plating plate 330 and the wafer tray 40 will also revolve; while the orbiting plating plate 33 orbits, The rotation plating plate 33 will also rotate along the second axis 920; when the rotation plating plate 330 rotates, the wafer carrier 40 will also be rotated along the third axis 930.

Since the above-mentioned revolution and rotation are performed in a linear manner, the wafer carrier 40 rotates with the rotation of the plating plate 330, which can cause various changes in the angle of the wafer 420 and the evaporation source 70, in addition to improving the wafer The vapor deposition angle θ difference between the center and the edge of the sheet 420 improves the uniformity of vapor deposition and step coverage of the three-dimensional electronic component 421, and can also dynamically overcome the shadow of the three-dimensional electronic component 421 due to the three-dimensional pattern structure. At the same time, the uniformity of the coating can be increased to make the coating structure more consistent.

When the evaporation angle θ is different, the thickness of the coating film will make a difference in the structure of the coating. Therefore, the design of the evaporation angle θ degree can be greater than or equal to 70 degrees, and the definition of the evaporation angle θ degree refers to the wafer carrier. The angle formed by the surface 40 and an evaporation angle ray 940 is a straight line formed by the evaporation source 70 and the edge of one of the wafer carriers 40.

In order to achieve better step coverage, the difference in angle between the maximum evaporation angle θ degree and the minimum evaporation angle θ degree of any wafer carrier 40 may be designed to be greater than or equal to 10 degrees. The above-mentioned evaporation angle θ can be fine-tuned by the first angle adjustment unit 510 or the second angle adjustment unit 520 according to the requirements of different products.

However, the above embodiments are used to explain the characteristics of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it based on it, rather than to limit the scope of the patent for this creation. Equivalent modifications or modifications made by the spirit of disclosure should still be included in the scope of patent application described below.

B1‧‧‧Drive shaft

P112‧‧‧roller

P12‧‧‧First pole

P120, P120‧‧‧rotation axis

P130‧‧‧Rotary shaft

P13‧‧‧Wafer Carrier

AP131‧‧‧Shaft

P131‧‧‧Extension rod

P14‧‧‧carriage tray

P15‧‧‧Rotating body

P152‧‧‧Stud

Structure of 100‧‧‧3D vapor-deposited male self-rotating plating pot

10‧‧‧ revolution chassis

20‧‧‧revolving top plate

210‧‧‧ support

220‧‧‧Rotary runner

30‧‧‧Plating pan rotation module

310‧‧‧ cantilever

320‧‧‧Gear plate

321‧‧‧round opening

322‧‧‧Internal ring tooth

330‧‧‧rotating plate

40‧‧‧ Wafer Carrier

410‧‧‧ Outer annular teeth

420‧‧‧wafer

421‧‧‧Three-dimensional electronic components

50‧‧‧Angle Adjuster

510‧‧‧First angle adjustment unit

520‧‧‧Second Angle Adjustment Unit

60‧‧‧rotation shaft

70‧‧‧ evaporation source

910‧‧‧ 1st axis

920‧‧‧ 2nd axis

930‧‧‧3rd axis

940‧‧‧Evaporation angle rays

θ‧‧‧ evaporation angle

X‧‧‧ reference angle

[Fig. 1] is a fixed structure diagram of a conventional self-rotating wafer carrier; [Fig. 2] is a diagram of a conventional vacuum evaporation machine's object-bearing device; [Fig. 3] is a Embodiment diagram of a 3D vapor deposition male auto-rotation pot structure of the present invention; [FIG. 4] is a diagram of a 3D vapor deposition male auto-rotation pot structure example of the present invention; [FIG. 5] is the present invention [Figure 6] is a diagram of an embodiment of an angle adjuster operation and a partially enlarged embodiment of the present invention; [Figure 7] is a first axis, a second axis, and The third axis position embodiment diagram; and [FIG. 8] is an embodiment position diagram of a three-dimensional electronic component on a wafer carrier and a spin plate.

Claims (10)

A 3D vapor-deposited male self-rotating plating pot structure, comprising: a revolution base plate, which is a circular orbit; a revolution top plate, which has a plurality of support members, and a bottom of each support member is provided with a revolution wheel. , Which runs on the orbit chassis; a plurality of plated pan rotation modules, each of which includes: a cantilever, which is coupled to the orbit top plate at an inclined angle; a gear plate, which is coupled to the cantilever On the bottom side, the gear plate is formed with an inner ring tooth; and a self-rotating plated plate, which is coupled to the cantilever by a rotating shaft, and an end portion of the self-rotating plated plate runs linearly around the orbiting plate; and a plurality of Wafer carriers, each of which is fixed on a self-rotating plated plate by a rotating shaft, and is produced by an outer ring tooth and an inner ring tooth of each wafer carrier Linear smooth rotation combined. According to the public auto-rotation plating pot structure described in item 1 of the patent application scope, wherein the cantilever is combined with the orbital top plate through an angle adjuster. According to the structure of a male autorotation plating pot described in item 2 of the scope of patent application, wherein the angle adjuster includes a first angle adjustment unit and a second angle adjustment unit, and the autorotation plate and the orbit top plate are shaped An angle of 18 degrees is defined as a reference angle. According to the public auto-rotation plating pot structure described in item 3 of the scope of patent application, wherein the adjustment angle of the first angle adjustment unit is +3, +1, -1, or -3 degrees of the reference angle. According to the public auto-rotation plating pot structure described in item 3 of the scope of patent application, wherein the adjustment angle of the second angle adjustment unit is +2, 0, or -2 degrees of the reference angle. According to the public auto-rotation plating pot structure described in item 1 of the patent application scope, wherein the evaporation angle is greater than or equal to 70 degrees, and the evaporation angle is the angle formed by the surface of the wafer carrier and an evaporation angle ray, and the The evaporation angle ray is a straight line formed by the evaporation source and an edge of one of the wafer carriers. According to the structure of the male auto-rotation plating pot described in item 6 of the scope of patent application, the angle difference between the largest evaporation angle and the smallest evaporation angle is greater than or equal to 10 degrees. According to the structure of a male auto-rotating plating pot as described in item 1 of the scope of patent application, wherein the orbiting base and the orbiting top plate are arranged in parallel with each other and in a horizontal state. According to the public auto-rotation plating pot structure described in item 1 of the patent application scope, wherein the plurality of support members are three support members and are arranged at an equal interval from each other. According to the public rotation plating pot structure described in item 1 of the scope of patent application, wherein the plurality of plating pot rotation modules are three plating pot rotation modules, and are arranged at equal intervals from each other.