TWI660803B - Laser bonding apparatus for three-dimensional molded sculptures and method for bonding the same - Google Patents

Laser bonding apparatus for three-dimensional molded sculptures and method for bonding the same Download PDF

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Publication number
TWI660803B
TWI660803B TW106121201A TW106121201A TWI660803B TW I660803 B TWI660803 B TW I660803B TW 106121201 A TW106121201 A TW 106121201A TW 106121201 A TW106121201 A TW 106121201A TW I660803 B TWI660803 B TW I660803B
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Taiwan
Prior art keywords
dimensional structures
dimensional
laser welding
dimensional structure
laser
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TW106121201A
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Chinese (zh)
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TW201815504A (en
Inventor
崔在濬
金秉祿
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科泰機械股份有限公司
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Publication of TW201815504A publication Critical patent/TW201815504A/en
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Publication of TWI660803B publication Critical patent/TWI660803B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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Abstract

本發明提供如下的用於三維結構物的雷射焊接裝置及方法，即，除了如印刷電路板(PCB)基板、玻璃基板等整體呈平面形態的基板之外，根據客戶公司的要求，還可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)自動焊接電子元件，並且，可防止電子元件和三維結構物的排列不良及由此造成的焊接不良。 The present invention provides a laser welding device and method for three-dimensional structures, in addition to substrates such as printed circuit board (PCB) substrates, glass substrates, and the like that are generally planar, and according to the requirements of customer companies, Automatically solder electronic components to three-dimensional structures that have regular or irregular shapes in the curved part (for example, structures used in automobile taillights or headlights), and can prevent poor alignment of electronic components and three-dimensional structures and cause this. Bad welding.

Description

用於三維結構物的雷射焊接裝置及方法    Laser welding device and method for three-dimensional structure   

本發明涉及雷射焊接技術，更詳細地，涉及根據客戶公司的要求，也可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)上自動焊接電子元件的雷射焊接裝置及方法。 The present invention relates to laser welding technology, and more specifically, to a three-dimensional structure (for example, a structure for a taillight or a headlight of a car) that can also be in a regular or irregular shape according to the requirements of a customer company. Laser welding device and method for automatically welding electronic components.

隨著電子產品的小型化及高功能化，從灰塵或濕氣、電、機械負荷等各種外部環境保護半導體晶片的半導體封裝的方式很難僅通過以往的焊接方式來實現輕薄短小化，因此使用雷射焊接方式。雷射焊接方式為將半導體晶片附著在載體基板或電路載帶之電路圖案上並利用雷射進行焊接的方式。 With the miniaturization and high functionality of electronic products, it is difficult to achieve the reduction in thickness, thickness, and shortness of semiconductor packaging methods from various external environmental protection semiconductor chips such as dust, moisture, electricity, and mechanical loads. Laser welding method. The laser welding method is a method in which a semiconductor wafer is attached to a circuit pattern of a carrier substrate or a circuit carrier tape and soldered by laser.

日本核准專利號第3303832號中公開了用於使半導體晶片的各個電極全部與配線基板相連接的雷射焊接技術。根據日本核准專利第3303832號，用於吸附半導體晶片的吸附頭部由雷射光束穿透過的玻璃構成，基座與珀耳帖元件相結合。整個半導體晶片通過雷射光束直接被加熱，從而會急劇加熱。配線基板通過與基座相結合的珀耳帖元件急劇加熱及急劇冷卻。 Japanese Approved Patent No. 3303832 discloses a laser welding technique for connecting all the electrodes of a semiconductor wafer to a wiring substrate. According to Japanese Approved Patent No. 3303832, the suction head for suctioning a semiconductor wafer is made of glass through which a laser beam passes, and the base is combined with a Peltier element. The entire semiconductor wafer is directly heated by the laser beam, which causes rapid heating. The wiring substrate is rapidly heated and cooled by a Peltier element coupled to the base.

美國公開專利第2016/004938號涉及半導體晶片封裝，公開了為了在電路基板連接半導體晶片管芯而利用雷射的焊接技術。根據美國公開專利第2016/004938號，包括朝向半導體管芯照射雷射光束來使流量(flux)揮發並使泵(bump)和電路板之間電連接的泵回流步驟。 US Published Patent No. 2016/004938 relates to a semiconductor wafer package, and discloses a soldering technique using a laser in order to connect a semiconductor wafer die to a circuit substrate. According to U.S. Published Patent No. 2016/004938, a pump reflow step including irradiating a laser beam toward a semiconductor die to volatilize a flux and to electrically connect a pump and a circuit board is included.

韓國核准專利第10-0913579號公開了如柔性印刷電路(FPC，Flexible Printed Circuit)、帶載封裝(TCP，Tape Carrier Package)及公共塊柔性印刷電路(CBF，Common Block Flexible Printed Circuit)、驅動器積體電路(Driver IC，Driver Integrated Circuit)的對驅動用電路基板進行焊接的裝置。根據韓國核准專利第10-0913579號，將要與驅動用電路基板焊接的基板移送到焊接工作位置及取出，並將驅動用電路基板焊接在基板上，藉以實現基於焊接工作的工站時間(tact time)的縮減及工作的高速化。 Korean Approved Patent No. 10-0913579 discloses, for example, Flexible Printed Circuit (FPC), Tape Carrier Package (TCP), Common Block Flexible Printed Circuit (CBF), and driver IC. Device for soldering a drive circuit board to a driver IC (Driver IC). According to Korean Approved Patent No. 10-0913579, the substrate to be soldered to the driving circuit substrate is moved to a welding work position and taken out, and the driving circuit substrate is soldered to the substrate, thereby realizing the tact time based on the welding work. ) Reduction and faster work.

通常，為了將包括如半導體晶片的電子元件或積體電路(IC)、轉換器(TR)、電阻器件(R)及電容器(C)的裝置附著在印刷電路板而使用再流焊裝置。當前，再流焊裝置大致分為大量再流(mass reflow)裝置和雷射再流焊裝置。 In general, a reflow soldering apparatus is used for attaching a device including an electronic component such as a semiconductor wafer or an integrated circuit (IC), a converter (TR), a resistance device (R), and a capacitor (C) to a printed circuit board. At present, reflow welding devices are roughly classified into mass reflow devices and laser reflow devices.

大量再流焊裝置中，將附著有如焊球、焊盤或焊膏的焊接物質的多個基板設置於輸送帶並驅動輸送帶。基板根據所驅動的輸送帶通過具有紅外線加熱器(infrared heater)或陶瓷加熱器的加熱區間。此時，紅外線加熱器形成於輸送帶的上側和下側，紅外線加熱器對基板上的焊球施加熱量來將半導體器件附著在基板上。 In a large number of reflow soldering apparatuses, a plurality of substrates to which a solder substance such as a solder ball, a pad, or a solder paste is attached are set on a conveyor belt and the conveyor belt is driven. The substrate passes through a heating section having an infrared heater or a ceramic heater according to the driven conveyor belt. At this time, infrared heaters are formed on the upper and lower sides of the conveyor belt, and the infrared heaters apply heat to the solder balls on the substrate to attach the semiconductor devices to the substrate.

根據大量再流焊裝置，電子元件或裝置在約50℃至約230~290℃之間的高熱條件下受到約210秒鐘(sec)的熱量。因 此，電子元件或裝置有可能受到熱量的損傷，由此，電子元件或裝置的特性或壽命會降低。並且，紅外線加熱器對焊球施加熱量來使電子元件或裝置與基板相結合需要3~10分鐘(min)左右的時間，從而並不存在經濟性。並且，大量再流焊工序中，在附著於基板的器件中，因對熱量脆弱的器件施加熱量而發生不良，對整個基板施加熱量，因此，會在基板上發生熱變形。 According to a large number of reflow soldering devices, electronic components or devices are exposed to heat for about 210 seconds (sec) under high heat conditions between about 50 ° C and about 230-290 ° C. Therefore, the electronic component or device may be damaged by heat, and the characteristics or life of the electronic component or device may be reduced. In addition, it takes about 3 to 10 minutes (min) for the infrared heater to apply heat to the solder ball to bond the electronic component or device to the substrate, so there is no economical effect. In addition, in a large number of reflow soldering processes, among the devices attached to the substrate, heat is applied to the thermally fragile devices, which causes failure, and applies heat to the entire substrate. Therefore, thermal deformation occurs on the substrate.

另一方面，汽車用頭燈最近被發光二極體(LED)所代替，發光二極體頭燈結構物的形態從平面變為三維形狀。其中，在焊接發光二極體的基板的形態呈階梯型、碗(bowl)型等不規則基板的情況下，當通過大量再流焊工序，使發光二極體與不規則基板相結合時，能量不均等地向各個部位傳遞並導致焊接不良，向基板整體施加熱能，因此，在基板整體中，發生熱變形的可能性變得更高。 On the other hand, automotive headlights have recently been replaced by light emitting diodes (LEDs), and the shape of the light emitting diode headlight structure has changed from a flat surface to a three-dimensional shape. Among them, in a case where the shape of the substrate for welding the light emitting diode is an irregular substrate such as a stepped shape or a bowl type, when the light emitting diode is combined with the irregular substrate through a large number of reflow soldering processes, Energy is unevenly transmitted to various parts, causing soldering failure, and thermal energy is applied to the entire substrate. Therefore, the possibility of thermal deformation in the entire substrate becomes higher.

除汽車用頭燈之外，焊接半導體晶片的基板的形態只要是三維不規則形態，則很難避免如上所述的大量再流焊工序的缺點。 Except for automotive headlamps, as long as the shape of the substrate for soldering the semiconductor wafer is a three-dimensional irregular shape, it is difficult to avoid the disadvantages of the large number of reflow soldering steps as described above.

因此，在基板的形態為三維或者在不規則的環境下，向各個焊接部位照射均勻的雷射光束，可簡單調節雷射光束的各個照射區域的雷射再流焊技術成為極為有用的解決方案。 Therefore, when the shape of the substrate is three-dimensional or in an irregular environment, a uniform laser beam is irradiated to each welding part, and the laser reflow welding technology that can easily adjust each irradiation area of the laser beam becomes a very useful solution. .

即便如此，至今的雷射再流焊技術僅適用於在如手機、TV的裝置的印刷電路板、如玻璃基板的整體呈平面形態的基板。在基板不呈平面形態或者半導體器件附著的位置整體上不規則的情況下，很難通過以往的雷射焊接技術進行作業。 Even so, the laser reflow soldering technology hitherto is only applicable to printed circuit boards in devices such as mobile phones and TVs, and substrates such as glass substrates in which the entire surface is flat. In the case where the substrate is not in a planar form or the position where the semiconductor device is attached is irregular as a whole, it is difficult to perform operations by conventional laser welding technology.

因此，需要在如圖1所示的三維結構物(例如，用於汽車尾燈或前燈的結構物)的各個部位有效焊接電子元件的新的雷 射焊接裝置和方法。 Therefore, there is a need for a new laser welding apparatus and method for effectively welding electronic components at various parts of a three-dimensional structure (for example, a structure for a taillight or a headlight of a car) as shown in FIG. 1.

本發明基於如上所述的背景而提出，本發明提供如下的用於三維結構物的雷射焊接裝置及方法，即，除了如印刷電路板(PCB)基板、玻璃基板等整體呈平面形態的基板之外，還可在彎曲部分呈規則形態或不規則形態的三維結構物自動焊接電子元件。 The present invention is based on the above-mentioned background. The present invention provides a laser welding device and method for three-dimensional structures, that is, in addition to substrates such as printed circuit board (PCB) substrates, glass substrates, and the like that are generally in a planar form In addition, electronic components can be automatically soldered on three-dimensional structures with regular or irregular shapes in the curved portion.

並且，本發明提供可防止電子元件和三維結構物的排列不良及由此造成的焊接不良的用於三維結構物的雷射焊接裝置及方法。 In addition, the present invention provides a laser welding apparatus and method for a three-dimensional structure, which can prevent a poor arrangement of an electronic component and a three-dimensional structure, and welding defects caused thereby.

可通過對以下的實施例進行的說明來容易理解本發明的其他目的。 Other objects of the present invention can be easily understood by describing the following examples.

為了實現如上所述的目的，本發明的三維結構物雷射焊接裝置包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。 In order to achieve the above-mentioned object, the laser welding device for a three-dimensional structure of the present invention includes a three-dimensional structure providing unit that provides a plurality of three-dimensional structures, and the plurality of three-dimensional structures are coated with an adhesive substance and the adhesive substance An electronic component is attached to the laser welding part, and the electronic component attached to the plurality of three-dimensional structures is irradiated with laser to perform welding.

本發明的三維結構物雷射焊接裝置包括：電子元件提供部，裝載並移送多個電子元件；三維結構物提供部，支撐並移送多個三維結構物；黏結物質塗敷部，在上述多個三維結構物上塗敷黏結物質；電子元件附著部，在上述多個三維結構物之塗敷有黏結物質的部分附著上述電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。 The three-dimensional structure laser welding device of the present invention includes: an electronic component providing section that loads and transfers a plurality of electronic components; a three-dimensional structure providing section that supports and transfers a plurality of three-dimensional structures; and an adhesive substance coating section, Adhesive material is applied to the three-dimensional structure; the electronic component attachment portion attaches the electronic component to the plurality of three-dimensional structures where the adhesive material is applied; and the laser welding portion attaches the electronic component attached to the plurality of three-dimensional structures. Laser welding is performed.

其中，根據客戶公司的要求，三維結構物可為彎曲部分呈規則形態或不規則形態的被附著物。尤其，三維結構物可為用於汽車尾燈或前燈的結構物。 Among them, according to the requirements of the client company, the three-dimensional structure may be an adhered object in which the curved portion has a regular shape or an irregular shape. In particular, the three-dimensional structure may be a structure for a car taillight or a headlight.

本發明的三維結構物雷射焊接方法包括：在工作臺設置作為被附著物的多個三維結構物的步驟；借助工作臺移送部移送設置有上述多個三維結構物的工作臺的步驟；在上述多個三維結構物上塗敷黏結物質的步驟；在上述多個三維結構物之塗敷有黏結物質的部分拾取並附著電子元件的步驟；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。 The laser welding method for a three-dimensional structure according to the present invention includes the steps of setting a plurality of three-dimensional structures as objects to be attached on a table; the step of transferring a table provided with the plurality of three-dimensional structures by a table transfer section; The step of coating the plurality of three-dimensional structures with an adhesive substance; the step of picking up and attaching an electronic component to the plurality of three-dimensional structures where the adhesive substance is coated; Shot to perform the welding step.

本發明的用於三維結構物的雷射焊接裝置提供如下的效果： The laser welding device for three-dimensional structures of the present invention provides the following effects:

第一、根據客戶公司的要求，也可在彎曲部分呈規則形態或不規則形態的三維結構物雷射焊接電子元件。 First, according to the requirements of the client company, laser-welded electronic components can also be used in the three-dimensional structure of the curved part in a regular or irregular shape.

第二、可防止電子元件和三維結構物的排列不良、黏結物質塗敷不良及電子元件附著不良和焊接不良。 Second, it can prevent poor arrangement of electronic components and three-dimensional structures, poor application of adhesive substances, poor adhesion of electronic components and poor soldering.

本發明的效果不侷限於如上所述的效果，並應理解為，包括可從本發明的詳細說明或申請專利範圍中所記載之發明的結構推論得到的所有效果。 The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be deduced from the structure of the invention described in the detailed description of the invention or the scope of the patent application.

30‧‧‧焊錫膏或非導電膠(NCP) 30‧‧‧ solder paste or non-conductive paste (NCP)

40‧‧‧電子元件 40‧‧‧Electronic components

110‧‧‧三維結構物 110‧‧‧ three-dimensional structure

120‧‧‧三維結構物 120‧‧‧ three-dimensional structure

200‧‧‧雷射焊接裝置 200‧‧‧laser welding device

210‧‧‧電子元件提供部 210‧‧‧Electronic component supply department

211‧‧‧托盤 211‧‧‧tray

212‧‧‧托盤移送部 212‧‧‧Tray Transfer Department

220‧‧‧黏結物質塗敷部 220‧‧‧ Adhesive substance coating section

221‧‧‧第一台架 221‧‧‧The first rack

222‧‧‧第一移送部 222‧‧‧First Transfer Department

223‧‧‧分配器 223‧‧‧Distributor

230‧‧‧電子元件附著部 230‧‧‧Electronic component attachment section

231‧‧‧第二台架 231‧‧‧Second Shelf

232‧‧‧第二移送部 232‧‧‧Second Transfer Department

233‧‧‧器件附著部 233‧‧‧Device attachment

240‧‧‧雷射焊接部 240‧‧‧Laser Welding Department

241‧‧‧第三台架 241‧‧‧The third platform

242‧‧‧第三移送部 242‧‧‧Third Transfer Department

243‧‧‧雷射光束照射部 243‧‧‧Laser beam irradiation unit

250‧‧‧三維結構物提供部 250‧‧‧Three-dimensional structure supply department

251‧‧‧工作臺 251‧‧‧Workbench

252‧‧‧工作臺移送部 252‧‧‧Workbench Transfer Department

261‧‧‧工作臺 261‧‧‧Workbench

262‧‧‧工作臺移送部 262‧‧‧Workbench Transfer Department

511‧‧‧設置部 511‧‧‧Setting Department

512‧‧‧驅動軸 512‧‧‧Drive shaft

513‧‧‧驅動帶 513‧‧‧Drive Belt

514‧‧‧結合部 514‧‧‧Combination

515‧‧‧支撐部 515‧‧‧ support

521‧‧‧第一馬達 521‧‧‧First Motor

522‧‧‧第二馬達522‧‧‧Second motor

圖1為用於說明三維結構物的示意圖。 FIG. 1 is a schematic diagram for explaining a three-dimensional structure.

圖2為用於說明本發明的用於三維結構物的雷射焊接裝置的示意圖。 FIG. 2 is a schematic diagram for explaining a laser welding apparatus for a three-dimensional structure according to the present invention.

圖3為用於說明本發明的用於三維結構物的雷射焊 接裝置的動作的示意圖。 Fig. 3 is a schematic diagram for explaining the operation of the laser welding apparatus for a three-dimensional structure according to the present invention.

圖4為用於說明通過本發明的用於三維結構物的雷射焊接裝置來在三維結構物焊接電子元件的過程的示意圖。 FIG. 4 is a schematic diagram for explaining a process of soldering electronic components to a three-dimensional structure by the laser welding device for a three-dimensional structure according to the present invention.

圖5為用於說明提供呈不規則形態的三維結構物的三維結構物提供部的結構的示意圖。 FIG. 5 is a schematic diagram for explaining a structure of a three-dimensional structure providing unit that provides a three-dimensional structure in an irregular shape.

圖6為用於說明通過本發明的用於三維結構物的雷射焊接方法的流程圖。 6 is a flowchart for explaining a laser welding method for a three-dimensional structure by the present invention.

以下，參照附圖說明本發明。但是，本發明能夠以多種不同形式來實現，因此，不限定於在這裡說明的實施例。而且，為了明確說明本發明，在附圖中省略了與說明無關的部分，在整個說明書中，對類似的部分使用了類似的元件符號。 Hereinafter, the present invention will be described with reference to the drawings. However, the present invention can be implemented in many different forms, and therefore is not limited to the embodiments described here. Moreover, in order to clearly illustrate the present invention, parts that are not related to the description are omitted in the drawings, and similar element symbols are used for similar parts throughout the specification.

在整個說明書中，當某個部分與其他部分「連接(接續、接觸、結合)」時，其不僅包括「直接連接」的情況，也包括在此中間留有其他部件而「間接連接」的情況。並且，當某個部分「包括」某個結構要素時，除非有特別相反的記載，其意味著還可具有其他結構要素，而不是意味著其他結構要素除外。 Throughout the manual, when a part is "connected (connected, contacted, combined)" with other parts, it includes not only the case of "direct connection", but also the case of "indirect connection" with other parts left in the middle. . In addition, when a certain part “includes” a certain structural element, unless there is a special contrary description, it means that it can also have other structural elements, and it does not mean that other structural elements are excluded.

本說明書中所使用的術語僅為了說明特定的實施例而被使用，並非意圖限定本發明。若在文脈上沒有明顯不同的意思，則單數形式表述包括複數形式表述。在本說明書中，「包括」或「具有」等術語是指在說明書中所記載的特徵、數目、步驟、動作、結構要素、部件或它們的組合的存在，而應理解為不預先排除一個或一個以上的其他特徵、數目、步驟、動作、結構要素、部件或它們的組合的存在或附加功能性。 The terms used in the present specification are used only for explaining specific embodiments, and are not intended to limit the present invention. If there is no obvious difference in context, the singular expression includes the plural expression. In this specification, terms such as "including" or "having" refer to the existence of features, numbers, steps, actions, structural elements, components, or combinations thereof described in the specification, and it should be understood that one or The presence or additional functionality of more than one other feature, number, step, action, structural element, part, or combination thereof.

如圖1所示，本發明的用於三維結構物的雷射焊接裝置可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)上雷射焊接電子元件。三維結構物為通過注塑成型來製造而成的注塑物。過去，以三維結構物的輕型錫進行焊接，但是，隨著製造業的模式逐漸變為智慧工廠(Smart Factory)化和大批量定制生產模式，本申請人考慮縮短製造時間和節省製造費用而開發用於三維結構物的雷射焊接裝置。 As shown in FIG. 1, the laser welding device for a three-dimensional structure of the present invention can be used to mine a three-dimensional structure (for example, a structure for a taillight or a headlight of a car) having a regular or irregular shape in a bent portion. Welding electronic components. The three-dimensional structure is an injection-molded article manufactured by injection molding. In the past, soldering was performed with light-weight tin of a three-dimensional structure. However, as the manufacturing model gradually changed to a smart factory and mass customization production mode, the applicant developed it in consideration of shortening manufacturing time and saving manufacturing costs. Laser welding device for three-dimensional structures.

作為本發明的用於三維結構物的雷射焊接裝置200的一例，可包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。根據如上所述的實施例，可在額外的其他裝置中執行在多個三維結構物上塗敷黏結物質並在上述黏結物質上附著電子元件的工序。本發明的用於三維結構物的雷射焊接裝置200的三維結構物提供部通過額外的其他裝置來提供塗敷黏結物質並向雷射焊接位置移送在黏結物質上附著有電子元件的多個三維結構物的作用。 As an example of the laser welding device 200 for a three-dimensional structure of the present invention, the three-dimensional structure providing unit may include a plurality of three-dimensional structures, and the plurality of three-dimensional structures may be coated with an adhesive substance and bonded thereon. Electronic components are attached to the material; a laser welding section irradiates the electronic components attached to the plurality of three-dimensional structures with laser light to perform welding. According to the embodiment described above, the process of applying a bonding substance to a plurality of three-dimensional structures and attaching an electronic component to the above-mentioned bonding substance may be performed in an additional other device. The three-dimensional structure providing part of the laser welding apparatus 200 for three-dimensional structures of the present invention provides a plurality of three-dimensional structures having electronic components adhered to the bonding material by applying additional bonding materials to the laser welding position through additional other devices. The role of structures.

作為另一例，如圖2所示，本發明的用於三維結構物的雷射焊接裝置200可大致包括電子元件提供部210、三維結構物提供部250、黏結物質塗敷部220、電子元件附著部230及雷射焊接部240。 As another example, as shown in FIG. 2, the laser welding device 200 for a three-dimensional structure of the present invention may roughly include an electronic component providing section 210, a three-dimensional structure providing section 250, an adhesive substance coating section 220, and an electronic component attachment. 230 and laser welding 240.

電子元件提供部210裝載並移送多個電子元件。電子元件包括半導體晶片、積體電路(IC)、發光二極體元件、電阻器、電容器、感應器、變壓器或繼電器中的至少一個。電子元件提供部 210可包括托盤211，裝載多個電子元件；托盤移送部212，於一方向上移送托盤211。 The electronic component supply unit 210 loads and transfers a plurality of electronic components. The electronic component includes at least one of a semiconductor wafer, an integrated circuit (IC), a light emitting diode element, a resistor, a capacitor, an inductor, a transformer, or a relay. The electronic component providing section 210 may include a tray 211 for loading a plurality of electronic components, and a tray transfer section 212 for transferring the tray 211 in one direction.

三維結構物提供部250支撐並移送多個三維結構物。多個三維結構物為彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)。 The three-dimensional structure providing unit 250 supports and transfers a plurality of three-dimensional structures. The plurality of three-dimensional structures are three-dimensional structures (for example, a structure for a taillight or a headlight of a car) whose curved portions have a regular shape or an irregular shape.

三維結構物提供部250可包括：工作臺251，支撐多個三維結構物；工作臺移送部252，用於移送設置有多個三維結構物的工作臺。 The three-dimensional structure providing unit 250 may include a table 251 to support a plurality of three-dimensional structures, and a table transfer unit 252 to transfer a table provided with a plurality of three-dimensional structures.

例如，黏結物質塗敷部220在多個三維結構物上塗敷焊錫膏或非導電膠(NCP)。作為非導電膠的一例，可包括作為偶聯劑的N-甲基-3-氨丙基三甲氧基矽烷(N-methyl-3-amino propyltrimethoxysilane)、作為黏結性改進劑的聚酯丙烯酸酯(polyester acrylate)。 For example, the adhesive substance applying part 220 applies a solder paste or a non-conductive paste (NCP) on a plurality of three-dimensional structures. Examples of the non-conductive adhesive include N-methyl-3-aminopropyltrimethoxysilane as a coupling agent, and polyester acrylate (an adhesive improver) polyester acrylate).

黏結物質塗敷部220可包括：分配器223，在設置於工作臺251的多個三維結構物上塗敷焊錫膏或非導電膠；第一移送部222，使分配器223沿著與托盤的移送方向垂直的方向相對於上述工作臺251進行上下移送；第一台架221，支撐第一移送部222。 The adhesive substance coating part 220 may include a dispenser 223 for applying solder paste or non-conductive adhesive on a plurality of three-dimensional structures provided on the work table 251, and a first transfer part 222 for moving the dispenser 223 along with the tray The vertical direction moves up and down relative to the above-mentioned work table 251; the first stage 221 supports the first transfer part 222.

黏結物質塗敷部220可包括檢測多個三維結構物和分配器的排列狀態及焊錫膏或非導電膠的塗敷狀態的第一監控部。第一監控部可包括控制部，上述控制部對電荷耦合器(CCD)攝像頭、捕捉影像的擷取板(capture board)、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷塗敷狀態是否正常或不良。 The adhesive substance applying part 220 may include a first monitoring part that detects an arrangement state of a plurality of three-dimensional structures and a dispenser and a coating state of a solder paste or a non-conductive adhesive. The first monitoring unit may include a control unit that compares a charge coupled device (CCD) camera, a capture board that captures an image, an image processing board, an image input from the image processing board, and a reference image to Determine whether the application state is normal or defective.

電子元件附著部230在多個三維結構物之塗敷有焊 錫膏或非導電膠的部分附著電子元件。電子元件包括半導體晶片、積體電路、發光二極體元件、電阻器、電容器、感應器、變壓器或繼電器中的至少一個 The electronic component attachment portion 230 attaches electronic components to portions of a plurality of three-dimensional structures to which solder paste or non-conductive paste is applied. The electronic component includes at least one of a semiconductor wafer, an integrated circuit, a light emitting diode element, a resistor, a capacitor, an inductor, a transformer, or a relay

電子元件附著部230可包括：器件附著部233，從托盤211拾取電子元件來附著在多個三維結構物之塗敷有焊錫膏或非導電膠的部分；第二移送部232，使器件附著部233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送；第二台架231，支撐第二移送部232。 The electronic component attaching section 230 may include a device attaching section 233 that picks up electronic components from the tray 211 to attach to portions of the three-dimensional structure that are coated with solder paste or non-conductive glue; a second transfer section 232 that enables the device attaching section 233 moves up and down relative to the table 251 in a direction perpendicular to the direction in which the tray is transferred; the second stage 231 supports the second transfer portion 232.

上述電子元件附著部230可包括檢測多個三維結構物和電子元件的排列狀態及電子元件附著狀態的第二監控部。第二監控部可包括控制部，上述控制部對電荷耦合器攝像頭、捕捉影像的擷取板、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷排列狀態和電子元件附著狀態是否正常或不良。 The electronic component attaching unit 230 may include a second monitoring unit that detects an arrangement state of the plurality of three-dimensional structures and electronic components and an electronic component attaching state. The second monitoring unit may include a control unit that compares the charge coupler camera, the capture board that captures the image, the image processing board, the image input from the image processing board, and the reference image to determine the arrangement status and the attachment of electronic components Whether the condition is normal or bad.

雷射焊接部240向附著於多個三維結構物的電子元件照射面光源或線形態的雷射光束來進行焊接。作為一例，雷射焊接部240可包括：雷射光束照射部243；第三移送部242，使雷射光束照射部243沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送；第三台架241，支撐第三移送部242。 The laser welding section 240 irradiates an electronic component attached to a plurality of three-dimensional structures with a surface light source or a laser beam in a linear form to perform welding. As an example, the laser welding portion 240 may include a laser beam irradiating portion 243 and a third transfer portion 242 that causes the laser beam irradiating portion 243 to move up and down relative to the table 251 in a direction perpendicular to the transfer direction of the tray; The third stage 241 supports the third transfer section 242.

雷射光束照射部243可包括：向附著於多個三維結構物的電子元件輸出並照射雷射光束的雷射振盪器；將從雷射振盪器輸出之高斯形態的雷射轉換為能源均勻分佈的面光源的雷射光束成形部和光學系統。 The laser beam irradiating part 243 may include: a laser oscillator that outputs and irradiates a laser beam to electronic components attached to a plurality of three-dimensional structures; and converts a laser output from the laser oscillator in a Gaussian form into a uniform energy distribution. Laser beam shaping unit and optical system for surface light source.

雷射光束成形部可以為形成均勻的方形光束的光導向部。光導向部能夠以與光纖維具有0.2mm以上且0.5mm以下的 隔開距離的方式設置，光導向部的長度可為1.0m以上且1.5m以下。若光導向部的長度小於1.0m，則因在光導向部的內部發生閃射後所輸出的雷射的光均勻度下降而導致被附著物P的照射區域的溫度分佈不均勻。另一方面，若光導向部的長度為1.5m以上，則雖然雷射的光均勻度良好，但因光均勻化模組的總長度變長而導致製造費用上升，且不方便保管及移送光均勻化模組。 The laser beam shaping portion may be a light guide portion that forms a uniform square beam. The light guide portion can be installed at a distance from the optical fiber of 0.2 mm to 0.5 mm, and the length of the light guide portion can be 1.0 m to 1.5 m. If the length of the light guide portion is less than 1.0 m, the uniformity of the temperature distribution of the area to be irradiated by the adherend P will be uneven because the uniformity of the laser light output after the flicker occurs inside the light guide portion will decrease. On the other hand, if the length of the light guide is 1.5 m or more, although the laser light uniformity is good, the total length of the light homogenization module becomes longer, which increases the manufacturing cost, and it is inconvenient to store and transfer the light. Homogenization module.

在光導向部與光纖維之間無需用於使雷射光束均勻的任何光學透鏡。光纖維的數值孔徑(NA)為0.2以上且0.3以下。由此，從光纖維射出的雷射光束全部入射於光導向部的內部。 No optical lens is needed between the light guide and the optical fiber to make the laser beam uniform. The numerical aperture (NA) of the optical fiber is 0.2 or more and 0.3 or less. As a result, all the laser beams emitted from the optical fiber enter the inside of the light guide.

光導向部由於使用作為使雷射穿過的介質的具有高透過率的母材，因此形成為剖面為四方形的正六面體，並在與使雷射穿過的光軸水準的側面形成全反射塗敷膜，在與上述光軸垂直的上部面和下部面形成無反射塗敷膜。由此，可防止穿過光導向部的雷射光束向外部損失的現象。 Since the light guide portion uses a base material having a high transmittance as a medium through which the laser passes, it is formed into a regular hexahedron having a cross section in a square shape, and is formed on a side surface level with the optical axis through which the laser passes. In the reflection coating film, a non-reflection coating film is formed on an upper surface and a lower surface perpendicular to the optical axis. This prevents the laser beam passing through the light guide from being lost to the outside.

作為光學系統的一例，可以為對經過光導向部而發散的均勻的方形光束進行聚光的聚光透鏡和使所聚光的均勻的方形光束維持規定工作距離並發散的發散透鏡。可通過聚光透鏡和發散透鏡的曲率半徑組合來調節均勻的方形光束的大小和工作距離。 As an example of the optical system, a condensing lens for condensing a uniform square light beam diverging through the light guide portion and a diverging lens for maintaining the converged uniform square light beam while maintaining a predetermined working distance may be used. The size and working distance of a uniform square beam can be adjusted by the combination of the radius of curvature of the condenser lens and the divergent lens.

雷射焊接部240可包括檢測多個三維結構物和雷射焊接部的排列狀態及焊接狀態的第三監控部。第三監控部可包括控制部，上述控制部對電荷耦合器攝像頭、捕捉影像的擷取板、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷排列狀態和焊接狀態是否正常或不良。 The laser welding portion 240 may include a third monitoring portion that detects an arrangement state and a welding state of the plurality of three-dimensional structures and the laser welding portion. The third monitoring unit may include a control unit that compares the charge coupled camera, the capture board that captures the image, the image processing board, the image input from the image processing board, and the reference image to determine whether the arrangement state and the welding state are Normal or bad.

作為雷射焊接部240的一例，隨著設置有多個三維結 構物的工作臺251被移送，並根據三維結構物的形態，可調節雷射的照射強度和照射區域。由此，在基板的形態為三維形態或不規則形態的情況下，也可在焊接部位照射均勻的雷射光束，並可通過調節雷射光束的各照射區域來容易地進行焊接。 As an example of the laser welding portion 240, as the table 251 provided with a plurality of three-dimensional structures is transferred, the irradiation intensity and irradiation area of the laser can be adjusted according to the form of the three-dimensional structures. Therefore, even when the shape of the substrate is a three-dimensional shape or an irregular shape, a uniform laser beam can be irradiated on the welding portion, and welding can be easily performed by adjusting each irradiation area of the laser beam.

圖3為用於說明用於呈規則形態的三維結構物的雷射焊接裝置的動作的示意圖。圖4為用於說明通過用於呈規則形態的三維結構物的雷射焊接裝置來在三維結構物焊接電子元件的過程的示意圖。 FIG. 3 is a schematic diagram for explaining the operation of a laser welding apparatus for a three-dimensional structure having a regular shape. FIG. 4 is a schematic diagram for explaining a process of soldering electronic components to a three-dimensional structure by a laser welding device for a three-dimensional structure having a regular shape.

首先，參照圖3來進行說明，用於呈規則形態的三維結構物的雷射焊接裝置可包括：第一工作臺251及第二工作臺261，支撐多個三維結構物110；第一工作臺移送部252及第二工作臺移送部262，用於移送設置有多個三維結構物110的第一工作臺251及第二工作臺261。可根據客戶所要求的生產量，增加工作臺和工作臺移送部的設置台數。 First, with reference to FIG. 3, a laser welding device for a three-dimensional structure having a regular shape may include: a first workbench 251 and a second workbench 261 to support a plurality of three-dimensional structures 110; a first workbench The transfer unit 252 and the second table transfer unit 262 are used to transfer the first table 251 and the second table 261 provided with the plurality of three-dimensional structures 110. According to the production volume required by customers, the number of worktables and worktable transfer sections can be increased.

如圖3所示，可與第一工作臺移送部252及第二工作臺移送部262分開地設置用來於一方向上移送裝載有多個電子元件之托盤211的托盤移送部212。托盤211裝載於托盤移送部212而被移送，使用完向外部排出。 As shown in FIG. 3, a tray transfer unit 212 may be provided separately from the first table transfer unit 252 and the second table transfer unit 262 to transfer a tray 211 on which a plurality of electronic components are mounted in one direction. The tray 211 is loaded on the tray transfer unit 212 and transferred, and is discharged to the outside after use.

第一工作臺251及第二工作臺261借助第一工作臺移送部252及第二工作臺移送部262而被移送並經過第一台架221。在第一台架221上設置有分配器223和第一移送部222，上述分配器223在多個三維結構物110上塗敷焊錫膏或非導電膠，上述第一移送部222使分配器233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第一台架221上設置用來檢測多個 三維結構物110和分配器223的排列狀態及焊錫膏或非導電膠塗敷狀態的視覺模組。 The first table 251 and the second table 261 are transferred by the first table transfer unit 252 and the second table transfer unit 262 and pass through the first stage 221. A distributor 223 and a first transfer unit 222 are provided on the first stage 221. The distributor 223 applies solder paste or non-conductive adhesive to a plurality of three-dimensional structures 110, and the first transfer unit 222 causes the distributor 233 to A vertical direction with respect to the tray transfer direction is carried out with respect to the table 251. A vision module may be provided on the first stage 221 to detect the arrangement state of the plurality of three-dimensional structures 110 and the dispenser 223 and the state of the solder paste or non-conductive glue application.

當在多個三維結構物110上塗敷焊錫膏或非導電膠時，借助第一工作臺移送部252及第二工作臺移送部262移送第一工作臺251及第二工作臺261並經過第二台架231。在第二台架231上設置有器件附著部233和第二移送部232，上述器件附著部233從托盤211拾取電子元件來附著在多個三維結構物110之塗敷有焊錫膏或非導電膠的部分，上述第二移送部232使器件附著部233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第二台架231上設置用來檢測多個三維結構物110和器件附著部233的排列狀態及電子元件附著狀態的視覺模組。 When applying a solder paste or a non-conductive adhesive to a plurality of three-dimensional structures 110, the first table 251 and the second table 261 are transferred by the first table transfer section 252 and the second table transfer section 262 and pass through the second table.台 架 231. A device attachment portion 233 and a second transfer portion 232 are provided on the second stage 231. The device attachment portion 233 picks up electronic components from the tray 211 to attach to a plurality of three-dimensional structures 110, and is coated with solder paste or non-conductive glue. In part, the second transfer unit 232 causes the device attaching unit 233 to move up and down relative to the table 251 in a direction perpendicular to the transfer direction of the tray. A visual module for detecting the arrangement state of the three-dimensional structures 110 and the device attachment portion 233 and the attachment state of the electronic components may be provided on the second stage 231.

當在多個三維結構物110上附著電子元件時，借助第一工作臺移送部252及第二工作臺移送部262移送第一工作臺251及第二工作臺261並經過第三台架241。在第三台架241上設置有雷射光束照射部243和第三移送部242，上述雷射光束照射部243向附著於多個三維結構物110上的電子元件照射雷射光束，上述第三移送部242使雷射光束照射部243沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第三台架241上設置用來檢測多個三維結構物110和雷射光束照射部243的排列狀態及焊接狀態的視覺模組。 When electronic components are attached to the plurality of three-dimensional structures 110, the first table 251 and the second table 261 are transferred by the first table transfer section 252 and the second table transfer section 262 and pass through the third stage 241. The third stage 241 is provided with a laser beam irradiating section 243 and a third transfer section 242. The laser beam irradiating section 243 irradiates a laser beam to an electronic component attached to a plurality of three-dimensional structures 110. The transfer unit 242 causes the laser beam irradiation unit 243 to move up and down relative to the table 251 in a direction perpendicular to the transfer direction of the tray. A vision module for detecting an arrangement state and a welding state of the plurality of three-dimensional structures 110 and the laser beam irradiation part 243 may be provided on the third stage 241.

參照圖4，借助分配器223在設置於工作臺251並借助工作臺移送部而被移送的多個三維結構物110上依次塗敷焊錫膏或非導電膠30，借助器件附著部233在焊錫膏或非導電膠30上附著電子元件40，借助雷射光束照射部243焊接電子元件40。 4, a solder paste or a non-conductive paste 30 is sequentially applied to a plurality of three-dimensional structures 110 provided on the table 251 and transferred by the table transfer unit by means of a dispenser 223, and the solder paste is applied by means of a device attachment portion 233. The electronic component 40 is attached to the non-conductive adhesive 30, and the electronic component 40 is soldered by the laser beam irradiation portion 243.

以上，在圖3和圖4中，說明利用提供呈規則形態的三維結構物的三維結構物提供部來雷射焊接電子元件的裝置及其焊接過程。 In the foregoing, in FIG. 3 and FIG. 4, the apparatus for laser-welding electronic components by using the three-dimensional structure providing part that provides the three-dimensional structure in a regular shape and the welding process thereof have been described.

以下，參照圖5來說明提供呈不規則形態的三維結構物的三維結構物提供部的結構。 Hereinafter, the structure of a three-dimensional structure providing unit that provides a three-dimensional structure in an irregular shape will be described with reference to FIG. 5.

如圖5所示，三維結構物提供部包括：設置部511，用於設置呈不規則形態的多個三維結構物120；驅動軸512，與設置部511相連接；驅動帶513，與驅動軸512相連接；第一馬達521，使驅動帶513旋轉；結合部514，與驅動軸512相結合；支撐部515，以能夠使結合部514進行上下旋轉的方式與結合部514相結合；以及第二馬達522，與結合部514相連接，並使結合部514進行上下旋轉。 As shown in FIG. 5, the three-dimensional structure providing section includes a setting section 511 for setting a plurality of three-dimensional structures 120 in an irregular shape, a driving shaft 512 connected to the setting section 511, and a driving belt 513 connected to the driving shaft. 512 is connected; a first motor 521 rotates the driving belt 513; a coupling portion 514 is coupled with the driving shaft 512; a support portion 515 is coupled with the coupling portion 514 in a manner capable of rotating the coupling portion 514 up and down; and The two motors 522 are connected to the joint portion 514 and rotate the joint portion 514 up and down.

雖然未在圖5中示出，但本發明的三維結構物雷射焊接裝置可通過包括呈不規則形態的三維結構物、焊錫膏或非導電膠(NCP)、電子元件、用於存儲為了照射雷射光束而驅動第一馬達521和第二馬達522的工作設定檔的儲存部、根據工作設定檔驅動第一馬達521和第二馬達522的馬達驅動部而構成。 Although not shown in FIG. 5, the three-dimensional structure laser soldering device of the present invention may be used for storing three-dimensional structures in irregular shapes, solder paste or non-conductive paste (NCP), electronic components, and storage for irradiation. The laser beam drives the first and second motors 521 and 522 to store a working profile of a working profile, and a motor driving unit that drives the first and second motors 521 and 522 according to the working profile.

如圖6所示，在圖3和圖4中的用於三維結構物的雷射焊接裝置中實現的雷射焊接方法可大致包括裝載步驟、塗敷步驟、拾取及附著步驟、焊接步驟、卸載步驟。 As shown in FIG. 6, the laser welding method implemented in the laser welding apparatus for three-dimensional structures in FIGS. 3 and 4 may roughly include a loading step, a coating step, a picking and attaching step, a welding step, and an unloading. step.

裝載步驟包括在工作臺上設置作為被附著物的多個三維結構物的步驟S611。塗敷步驟包括借助工作臺移送部移送設置有多個三維結構物的工作臺的步驟S612和在多個三維結構物上塗敷黏結物質的步驟S613。作為一例，工作臺的移送距離、移送速度 及移送位置預先被設定並儲存於用於三維結構物的雷射焊接裝置的儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S613之後，可包括通過監控部來檢測焊錫膏或非導電膠塗敷狀態並判斷塗敷狀態是否正常或不良的步驟。 The loading step includes a step S611 of setting a plurality of three-dimensional structures as objects to be attached on the table. The coating step includes a step S612 of transferring a table provided with a plurality of three-dimensional structures by a table transfer unit, and a step S613 of applying a bonding substance to the plurality of three-dimensional structures. As an example, the transfer distance, the transfer speed, and the transfer position of the table are set in advance and stored in a storage section of a laser welding apparatus for a three-dimensional structure. However, it is checked whether the table is moved to the accurately set transfer position, and a monitoring unit including a vision module is used to repair the misaligned position. After step S613, a step of detecting the application state of the solder paste or the non-conductive paste by the monitoring unit and determining whether the application state is normal or defective may be included.

拾取及附著步驟包括借助工作臺移送部移送在多個三維結構物上塗敷有焊錫膏或非導電膠的工作臺的步驟S614和從托盤拾取電子元件來附著在焊錫膏或非導電膠上的步驟S615。作為一例，工作臺的移送距離、移送速度及移送位置預先被設定並儲存於儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S615之後，可包括通過監控部來檢測電子元件附著狀態並判斷電子元件附著狀態是否正常或不良的步驟。 The picking and attaching step includes a step S614 of transferring a worktable on which a plurality of three-dimensional structures are coated with solder paste or non-conductive paste by a table transfer section, and a step of picking up electronic components from a tray to attach to the solder paste or non-conductive paste. S615. As an example, the transfer distance, transfer speed, and transfer position of the table are set in advance and stored in the storage section. However, it is checked whether the table is moved to the accurately set transfer position, and a monitoring unit including a vision module is used to repair the misaligned position. After step S615, it may include the steps of detecting the electronic component attaching state and determining whether the electronic component attaching state is normal or defective by the monitoring unit.

焊接步驟包括借助工作臺移送部移送在多個三維結構物110上附著有電子元件的工作臺的步驟S616和通過向電子元件照射雷射光束來進行焊接的步驟S617。作為一例，工作臺的移送距離、移送速度及移送位置預先被設定並儲存於用於三維結構物的雷射焊接裝置的儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S617之後，可包括通過監控部來檢測焊接狀態並判斷焊接狀態是否正常或不良的步驟。 The soldering step includes a step S616 of transferring a table having electronic components attached to a plurality of three-dimensional structures 110 by a table transfer section, and a step S617 of performing welding by irradiating a laser beam to the electronic components. As an example, a transfer distance, a transfer speed, and a transfer position of the table are set in advance and stored in a storage section of a laser welding apparatus for a three-dimensional structure. However, it is checked whether the table is moved to the accurately set transfer position, and a monitoring unit including a vision module is used to repair the misaligned position. After step S617, a step of detecting the welding state by the monitoring unit and determining whether the welding state is normal or defective may be included.

卸載步驟包括步驟S618，在上述步驟S618中，在多個三維結構物依次塗敷焊錫膏或非導電膠，在所塗敷的焊錫膏或非導電膠上附著電子元件，若結束雷射焊接，則從工作臺排出多個三 維結構物。 The unloading step includes step S618. In the above step S618, a plurality of three-dimensional structures are sequentially coated with solder paste or non-conductive glue, and electronic components are attached to the applied solder paste or non-conductive glue. If laser welding is ended, A plurality of three-dimensional structures are discharged from the workbench.

以上，舉例對本發明進行了說明，本發明所屬技術領域的普通技術人員可理解在不變更本發明的技術思想或必要特徵的情況下，可容易地將發明變形為其他具體形式。因此，應理解為以上所記述的實施例在所有方面上僅用於舉例，而不用於限定本發明。例如，能夠以分散的方式實施以單一形式說明的各結構要素，同樣也能夠以結合的形式實施以分散的方式說明的結構要素。 The present invention has been described above by way of examples. Those of ordinary skill in the art to which the present invention pertains can understand that the invention can be easily modified into other specific forms without changing the technical idea or necessary features of the present invention. Therefore, it should be understood that the embodiments described above are merely examples in all aspects and are not intended to limit the present invention. For example, the structural elements described in a single form can be implemented in a distributed manner, and the structural elements explained in a distributed manner can also be implemented in a combined manner.

如前所述，以發明的最佳具體實施方式說明了發明的具體實施方式。 As described above, the specific embodiments of the invention have been described with the best embodiments of the invention.

(產業上之可利用性)     (Industrial availability)    

本說明書的技術可利用於雷射焊接裝置。 The technique of this specification can be applied to a laser welding apparatus.

Claims (18)

一種三維結構物雷射焊接裝置，包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接，上述多個三維結構物為彎曲部分呈規則形態的被附著物。A laser welding device for a three-dimensional structure includes: a three-dimensional structure providing part, which provides a plurality of three-dimensional structures, an adhesive substance is coated on the plurality of three-dimensional structures, and electronic components are attached to the adhesive substance; laser welding; The electronic components attached to the plurality of three-dimensional structures are irradiated with laser to perform soldering, and the plurality of three-dimensional structures are adherends having a regular shape in a bent portion. 一種三維結構物雷射焊接裝置，包括：電子元件提供部，裝載並移送多個電子元件；三維結構物提供部，支撐並移送多個三維結構物；黏結物質塗敷部，在上述多個三維結構物上塗敷黏結物質；電子元件附著部，在上述多個三維結構物之塗敷有黏結物質的部分附著上述電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接，上述多個三維結構物為彎曲部分呈規則形態的被附著物。A laser welding device for a three-dimensional structure includes: an electronic component providing section for loading and transferring a plurality of electronic components; a three-dimensional structure providing section for supporting and transferring a plurality of three-dimensional structures; Adhesive material is applied to the structure; the electronic component attachment portion attaches the electronic component to the plurality of three-dimensional structures where the adhesive material is applied; the laser welding portion irradiates the electronic component attached to the plurality of three-dimensional structures. The laser is used for welding, and the plurality of three-dimensional structures are objects to be adhered having a regular shape in a bent portion. 如請求項2之三維結構物雷射焊接裝置，其中，上述電子元件提供部包括：托盤，裝載上述多個電子元件；托盤移送部，於一方向上移送上述托盤。According to the three-dimensional structure laser welding device of claim 2, wherein the electronic component providing section includes: a tray on which the plurality of electronic components are loaded; and a tray transfer section for transferring the tray in one direction. 如請求項1至3中任一項之三維結構物雷射焊接裝置，其中，上述三維結構物提供部包括：工作臺，支撐多個三維結構物；工作臺移送部，用於移送設置有上述多個三維結構物的上述工作臺。The three-dimensional structure laser welding device according to any one of claims 1 to 3, wherein the three-dimensional structure providing unit includes: a table supporting a plurality of three-dimensional structures; and a table transferring unit configured to transfer the above-mentioned structure. The above-mentioned workbench of a plurality of three-dimensional structures. 如請求項4之三維結構物雷射焊接裝置，其中，上述黏結物質塗敷部包括：分配器，在設置於上述工作臺的多個三維結構物上塗敷焊錫膏或非導電膠(NCP)；第一移送部，使上述分配器沿著與上述托盤的移送方向垂直的方向相對於上述工作臺進行上下移送；第一台架，支撐上述第一移送部。According to the laser welding device for a three-dimensional structure of claim 4, wherein the adhesive substance coating section includes: a dispenser, a solder paste or a non-conductive paste (NCP) is applied to a plurality of three-dimensional structures provided on the workbench; The first transfer unit moves the dispenser up and down relative to the table along a direction perpendicular to the transfer direction of the tray; the first stage supports the first transfer unit. 如請求項5之三維結構物雷射焊接裝置，其中，上述黏結物質塗敷部還包括檢測上述多個三維結構物和分配器的排列狀態及焊錫膏或非導電膠(NCP)的塗敷狀態的第一監控部。For example, the three-dimensional structure laser welding device of claim 5, wherein the adhesive substance coating section further includes detecting an arrangement state of the plurality of three-dimensional structures and a dispenser, and a coating state of a solder paste or a non-conductive paste (NCP). First monitoring department. 如請求項4之三維結構物雷射焊接裝置，其中，上述電子元件附著部包括：器件附著部，從上述托盤拾取(pickup)電子元件來附著在上述多個三維結構物之塗敷有焊錫膏或非導電膠的部分；第二移送部，使上述器件附著部沿著與上述托盤的移送方向垂直的方向相對於上述工作臺進行上下移送；第二台架，支撐上述第二移送部。The three-dimensional structure laser soldering device according to claim 4, wherein the electronic component attaching section includes a device attaching section that picks up electronic components from the tray to adhere to the plurality of three-dimensional structures and is coated with solder paste. Or a non-conductive adhesive portion; a second transfer portion that moves the device attachment portion up and down relative to the table along a direction perpendicular to the transfer direction of the tray; and a second rack that supports the second transfer portion. 如請求項7之三維結構物雷射焊接裝置，其中，上述電子元件附著部還包括檢測上述多個三維結構物和器件附著部的排列狀態及電子元件的附著狀態的第二監控部。According to the three-dimensional structure laser welding device of claim 7, wherein the electronic component attachment section further includes a second monitoring section that detects an arrangement state of the plurality of three-dimensional structures and device attachment sections and an attachment state of the electronic components. 如請求項1或2之三維結構物雷射焊接裝置，其中，上述雷射焊接部包括：雷射振盪器，向附著於上述多個三維結構物的電子元件輸出並照射雷射光束；雷射光束照射部，包括將從上述雷射振盪器輸出之高斯形態的雷射轉換為能源均勻分佈的面光源的雷射光束成形部和光學系統；第三移送部，使上述雷射光束照射部沿著與裝載有上述電子元件的托盤的移送方向垂直的方向相對於支撐上述多個三維結構物的工作臺進行上下移送；第三台架，支撐上述第三移送部。The laser welding device for a three-dimensional structure according to claim 1 or 2, wherein the laser welding section includes: a laser oscillator that outputs and irradiates a laser beam to electronic components attached to the plurality of three-dimensional structures; The beam irradiating unit includes a laser beam shaping unit and an optical system that convert the laser output from the Gaussian shape of the laser oscillator into a surface light source with uniform energy distribution; and a third transfer unit that causes the laser beam irradiating unit to A direction perpendicular to the transfer direction of the tray on which the electronic components are loaded is transferred up and down with respect to a table supporting the plurality of three-dimensional structures; and a third stage supports the third transfer portion. 如請求項9之三維結構物雷射焊接裝置，其中，上述雷射焊接部還包括檢測上述多個三維結構物和雷射光束照射部的排列狀態及焊接狀態的第三監控部。According to the three-dimensional structure laser welding device of claim 9, wherein the laser welding unit further includes a third monitoring unit that detects an arrangement state and a welding state of the plurality of three-dimensional structures and a laser beam irradiation unit. 如請求項1或2之三維結構物雷射焊接裝置，其中，上述多個三維結構物為用於汽車尾燈或前燈的結構物。The three-dimensional structure laser welding device according to claim 1 or 2, wherein the plurality of three-dimensional structures are structures for a taillight or a headlight of a car. 一種三維結構物雷射焊接方法，包括：提供多個三維結構物的步驟，在作為彎曲部分呈規則形態的被附著物的上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。A laser welding method for a three-dimensional structure includes the steps of providing a plurality of three-dimensional structures, coating the plurality of three-dimensional structures that are adherends in a regular shape with a curved portion, and applying an adhesion substance to the adhesion substance. There is an electronic component; a step of irradiating the electronic component attached to the plurality of three-dimensional structures with a laser to perform soldering. 一種三維結構物雷射焊接方法，包括：在工作臺設置作為彎曲部分呈規則形態的被附著物的多個三維結構物的步驟；借助工作臺移送部移送設置有上述多個三維結構物的工作臺的步驟；在上述多個三維結構物上塗敷黏結物質的步驟；在上述多個三維結構物之塗敷有黏結物質的部分拾取並附著電子元件的步驟；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。A laser welding method for a three-dimensional structure includes the steps of setting a plurality of three-dimensional structures as adhered objects with a regular shape in a curved portion on a table; and transferring the work provided with the plurality of three-dimensional structures by a table transfer unit. A step of applying a substrate; a step of applying an adhesive substance on the plurality of three-dimensional structures; a step of picking up and attaching an electronic component to a portion of the plurality of three-dimensional structures where the adhesive substance is applied; Of electronic components irradiated with laser for soldering. 如請求項13之三維結構物雷射焊接方法，其中，在上述多個三維結構物上塗敷黏結物質的步驟中，上述黏結物質為焊錫膏或非導電膠。According to the three-dimensional structure laser welding method of claim 13, wherein in the step of applying an adhesive substance on the plurality of three-dimensional structures, the adhesive substance is a solder paste or a non-conductive paste. 如請求項12或13之三維結構物雷射焊接方法，其中，上述多個三維結構物為用於汽車尾燈或前燈的結構物。The laser welding method for a three-dimensional structure according to claim 12 or 13, wherein the plurality of three-dimensional structures are structures used for automobile taillights or headlights. 一種三維結構物雷射焊接裝置，包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接，上述三維結構物提供部包括：設置部，用於設置多個三維結構物；驅動軸，與上述設置部相連接；驅動帶，與上述驅動軸相連接；第一馬達，使上述驅動帶旋轉；結合部，與上述驅動軸相結合；支撐部，以能夠使上述結合部進行上下旋轉的方式與上述結合部相結合；第二馬達，與上述結合部相連接，並使上述結合部進行上下旋轉。A laser welding device for a three-dimensional structure includes: a three-dimensional structure providing part, which provides a plurality of three-dimensional structures, an adhesive substance is coated on the plurality of three-dimensional structures, and electronic components are attached to the adhesive substance; laser welding; The three-dimensional structure providing part includes: a setting part for setting a plurality of three-dimensional structures; and a driving shaft connected to the setting part. A drive belt connected to the drive shaft; a first motor that rotates the drive belt; a coupling portion that is coupled to the drive shaft; a support portion that is capable of rotating the coupling portion up and down with the coupling portion Combined; the second motor is connected with the joint portion and rotates the joint portion up and down. 一種三維結構物雷射焊接裝置，包括：電子元件提供部，裝載並移送多個電子元件；三維結構物提供部，支撐並移送多個三維結構物；黏結物質塗敷部，在上述多個三維結構物上塗敷黏結物質；電子元件附著部，在上述多個三維結構物之塗敷有黏結物質的部分附著上述電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接，上述三維結構物提供部包括：設置部，用於設置多個三維結構物；驅動軸，與上述設置部相連接；驅動帶，與上述驅動軸相連接；第一馬達，使上述驅動帶旋轉；結合部，與上述驅動軸相結合；支撐部，以能夠使上述結合部進行上下旋轉的方式與上述結合部相結合；第二馬達，與上述結合部相連接，並使上述結合部進行上下旋轉。A laser welding device for a three-dimensional structure includes: an electronic component providing section for loading and transferring a plurality of electronic components; a three-dimensional structure providing section for supporting and transferring a plurality of three-dimensional structures; Adhesive material is applied to the structure; the electronic component attachment portion attaches the electronic component to the plurality of three-dimensional structures where the adhesive material is applied; the laser welding portion irradiates the electronic component attached to the plurality of three-dimensional structures. The laser is used for welding. The three-dimensional structure providing section includes: a setting section for setting a plurality of three-dimensional structures; a driving shaft connected to the setting section; a driving belt connected to the driving shaft; a first motor, The driving belt is rotated; the coupling portion is coupled with the driving shaft; the supporting portion is coupled with the coupling portion so that the coupling portion can be rotated up and down; the second motor is connected with the coupling portion and makes The joint portion rotates up and down. 如請求項16或17之三維結構物雷射焊接裝置，其中，上述多個三維結構物為彎曲部分呈規則形態的被附著物。The laser welding device for a three-dimensional structure according to claim 16 or 17, wherein the plurality of three-dimensional structures are objects to be adhered having a regular shape in the bent portion.
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