TWI651918B - Semiconductor package structure and motor for motor drive - Google Patents

Abstract

The present invention relates to a semiconductor package structure and a motor for driving a motor. The semiconductor packaging structure includes: a coil component, a motor driving unit, packaging material and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process and is electrically connected to the coil component. The packaging material is used to package the coil component and the motor driving unit into a semiconductor packaging structure. The hole is formed in a set position of the semiconductor package structure. By using the hole, the semiconductor package structure can be easily combined with other components of the motor to greatly simplify and accelerate the manufacturing process of the motor, and to miniaturize the motor.

Description

Semiconductor package structure for motor driving and motor

The invention relates to a semiconductor package structure and a motor for driving a motor.

The components of the conventional motor drive are usually made in different processes, and then the components are assembled as a drive assembly, which makes it difficult to reduce the size of the drive assembly of the conventional motor, and because the components are manufactured in different processes, the conventional motor The drive module manufacturing process is complex and costly. In addition, when assembling a conventional motor, there are quite a lot of components of the conventional motor, which makes the manufacturing process of the motor quite complicated, the process is complicated, and it is difficult to reduce the size of the conventional motor.

The invention provides a semiconductor package structure for motor driving. In one embodiment, the semiconductor package structure includes: a coil component, a motor driving unit, packaging material, and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process. The motor driving unit is disposed in the coil component and is electrically connected to the coil component. The packaging material is used to package the coil component into a semiconductor packaging structure. The hole is formed in a set position of the semiconductor package structure.

The present invention provides a motor. In one embodiment, the motor includes a semiconductor package structure and a rotor. The semiconductor packaging structure includes: a coil component, a motor driving unit, packaging material and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process. The motor driving unit is disposed in the coil component and is electrically connected to the coil component. The packaging material is used to package the coil component into the semiconductor packaging structure. The hole is formed in a set position of the semiconductor package structure. The rotor has a hub and a permanent magnet, the rotor is rotatably provided to the hole, the permanent magnet is coupled to the hub, and the permanent magnet corresponds to the coil component.

The invention provides a semiconductor package structure for motor driving. In one embodiment, the semiconductor package structure includes: a coil component, a motor driving unit, packaging material, and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process, and the motor driving unit is electrically connected to the coil component. The packaging material is used to package the coil component and the motor driving unit into a semiconductor packaging structure. The hole is formed in a set position of the semiconductor package structure.

The present invention provides a motor. In one embodiment, the motor includes a semiconductor package structure and a rotor. The semiconductor packaging structure includes: a coil component, a motor driving unit, packaging material and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process, and the motor driving unit is electrically connected to the coil component. The packaging material is used to package the coil component and the motor driving unit into the semiconductor packaging structure. The hole is formed in a set position of the semiconductor package structure. The rotor has a hub and a permanent magnet, the rotor is rotatably provided to the hole, the permanent magnet is coupled to the hub, and the permanent magnet corresponds to the coil component.

By using the semiconductor packaging structure for motor driving of the present invention, the coil component and the motor driving unit are manufactured together by a semiconductor process, and it is not necessary to separately manufacture the manufacturing process and related costs by using other different processes. In addition, by using the hole, the semiconductor package structure can be easily combined with other components of the motor to greatly simplify and accelerate the manufacturing process of the motor, and the motor can be miniaturized.

FIG. 1 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for motor driving according to the present invention. Referring to FIG. 1, the semiconductor package structure 10 of the present invention is applied to a motor and can control and drive the motor. In one embodiment, the semiconductor package structure 10 includes a coil component 11, a motor driving unit 12 and a packaging material 13. The coil assembly 11 and the motor driving unit 12 are manufactured by a semiconductor process. Semiconductor manufacturing processes include: film growth, lithographic exposure, etching molding, packaging, and some other processes, which can also be extended to micro-electro-mechanical processes based on semiconductor processes, and can include anisotropic etching, electroforming, and microlithographic electroforming molds. Some of these processes. However, the semiconductor process of the present invention is not limited to the above-mentioned processes.

The coil assembly 11 has a plurality of coil layers. In the embodiment of FIG. 1, three coil layers are shown, but the present invention is not limited to the three coil layers. The coil layers are stacked. In one embodiment, the coil layers include a bottom coil layer 111, a coil layer 112, and a top coil layer 113. The bottom coil layer 111 is disposed at the bottom positions of the coil layers, and the top coil layer 113 is disposed at the top positions of the coil layers. In the embodiment of FIG. 1, the top coil layer 113 is disposed on the bottom coil layer 111. Each coil layer includes a plurality of coils. The bottom coil layer 111 is taken as an example for illustration. The bottom coil layer 111 includes a plurality of coils 1111 and 1112, and the coils 1111 and 1112 are arranged at the same plane height. With reference to FIG. 1 and FIG. 3, the top coil layer 113 includes a plurality of coils 1131, 1132, 1133, and the coils 1131, 1132, 1133 are disposed at the same plane height.

In one embodiment, there is an intermediary unit between adjacent coil layers, and the coil layers are electrically connected. In the embodiment of FIG. 1, an intermediary unit 114 is provided between the adjacent bottom coil layer 111 and the coil layer 112, and an intermediary unit 115 is provided between the adjacent coil layer 112 and the top coil layer 113. The coil assembly 11 includes two intermediary units 114 and 115. In one embodiment, the coil component 11 may have more than three coil layers, for example, four layers, five layers, or more layers, so as to adjust the number of coil layers as needed for practical applications.

In one embodiment, the intermediary unit 114 includes an insulating layer 1141 and at least one conductive post 1142. The at least one conductive post 1142 is electrically connected to the adjacent bottom coil layer 111 and the coil layer 112. In one embodiment, the at least one conductive post 1142 is fabricated by an electroforming process. The at least one conductive post 1142 is electrically connected to one of the coils of the bottom coil layer 111 to one of the coils of the coil layer 112. In one embodiment, the interposer may be a substrate.

The coil component 11 is disposed between a first installation height H1 and a second installation height H2. The first installation height H1 is one of the lowest position heights of the coil component 11 and the second installation height H2 is the coil component 11 One of the highest position heights, the second setting height H2 is greater than the first setting height H1. The first installation height H1 is the lowest installation height of the bottom coil layer 111. The second installation height H2 is the highest installation height of the top coil layer 113.

The motor driving unit 12 is disposed between the first installation height H1 and the second installation height H2 and is electrically connected to the coil assembly 11. The motor driving unit 12 may be a motor-driven die, that is, an unpackaged die; or the motor driving unit 12 may be a motor-driven chip package, that is, a packaged die. Chip. The motor driving unit 12 may include a sensing element, a driving circuit, a control circuit, and the like.

In one embodiment, the motor driving unit 12 is disposed on the intermediate unit 114 and is disposed on the insulating layer 1141 of the intermediate unit 114. The motor driving unit 12 is electrically connected to the coil layer 112.

The packaging material 13 is used for packaging the coil component 11. In the embodiment of FIG. 1, the motor driving unit 12 is disposed in the intermediary unit 114, that is, the motor driving unit 12 is disposed in the coil component 11, so the packaging material 13 is used to encapsulate the coil component 11.

In an embodiment, the motor driving unit may be disposed on the coil component, so that a packaging material encapsulates the coil component and the motor driving unit.

In one embodiment, the semiconductor package structure 10 of the present invention further includes a plurality of electrical connection ports 15 electrically connected to the coil component 11 or the motor driving unit 12. The electrical ports 15 can be solder balls or pins. The electrical connection ports 15 may include an I / O port, a power terminal, and a ground terminal.

The hole 14 is formed in a predetermined position of the semiconductor package structure 10. In one embodiment, the hole 14 is formed in a central position of the semiconductor package structure 10. In one embodiment, the hole 14 is a through hole. The semiconductor package structure 10 further includes a carrier board 19. The coil assembly 11 and the motor driving unit 12 are disposed on the carrier board 19. The carrier plate 19 may be a substrate. The carrier plate 19 has a perforation and communicates with the hole 14 so that the hole 14 is a through hole. Referring to FIG. 2, a three-dimensional schematic diagram of an embodiment of a semiconductor package structure for motor driving according to the present invention is shown. The semiconductor package structure 10 has a hollow ring shape, and its central position is the hole 14. In one embodiment, the semiconductor package structure 10 may be circular, triangular, or polygonal in shape.

FIG. 3 is a schematic top view of an embodiment of a semiconductor package structure for a motor drive according to the present invention. Referring to FIG. 3, in one embodiment, each coil is spirally extended from a central end point to an outer end point. The coil is electrically connected to other coils by the central end point or the outer end point. The spiral shape may be a circular spiral shape, a triangular spiral shape, a square spiral shape, or a spiral shape of other shapes. In an embodiment, the coil 1131 includes a central end point 1136 and an outer end point 1137. The coil 1131 extends spirally from the central end point 1136 to the outer end point 1137. The coil 1131 is electrically connected to the coil 1133 by the outer terminal 1137. In one embodiment, the coil 1131 is connected in series with the coil 1133 and is a single-phase coil connection. In other embodiments, if three-phase coils are connected, the coils in the same coil layer may not be electrically connected.

By using the semiconductor packaging structure for motor driving of the present invention, the coil component and the motor driving unit are manufactured together by a semiconductor process, and it is not necessary to separately manufacture the manufacturing process and related costs by using other different processes.

FIG. 4 is a schematic cross-sectional view showing an embodiment in which a semiconductor packaging structure for motor driving according to the present invention is combined with a shaft tube and a plate. Referring to FIG. 4, in an embodiment, the semiconductor package structure 10 further includes a shaft tube 16 disposed in the hole 14. The shaft tube 16 is tightly fitted in the hole 14. The shaft tube 16 may be a metal shaft tube or a plastic shaft tube. In one embodiment, the semiconductor package structure 10 further includes a board body 17, and the shaft tube 16 is fixedly disposed on the board body 17. The board body 17 may be a circuit board, a printed circuit board, a base plate, a mother board, a metal plate, a plastic plate, or a substrate. The plate body 17 may be a frame body.

In one embodiment, the semiconductor package structure 10 further includes a metal fixing component 18 disposed on an outer peripheral wall of the shaft tube 16. The metal fixing component 18 is welded to the plate body 17. In an embodiment, the metal fixing component 18 includes a plurality of metal pins 181, and the metal pins 181 are used to weld and bond to该 板 体 17。 The plate body 17.

FIG. 5 is a schematic cross-sectional view of an embodiment of a motor according to the present invention. Referring to FIG. 5, the motor 30 includes a semiconductor package structure 10 and a rotor 20. For the semiconductor package structure 10, please refer to the above description of the semiconductor package structure 10 in FIG. 4, which will not be described here. However, the semiconductor package structure 10 of FIG. 5 does not have the metal fixing component 18 of the semiconductor package structure 10 of FIG. 4. In the semiconductor package structure 10 of FIG. 5, the shaft tube 16 and the plate body 17 are integrally formed. The shaft tube 16 and the plate body 17 form a blind hole. The semiconductor package structure 10 further includes a shaft sleeve 161 disposed in the shaft tube 16. The shaft sleeve 161 may be a bearing.

The rotor 20 includes a hub 21 and a permanent magnet 22. The rotor 20 is rotatably provided to the hole 14. In one embodiment, the rotor 20 further includes a central shaft 23. The central shaft 23 is rotatably disposed on the shaft tube 16. The permanent magnet 22 is coupled to the hub 21. In one embodiment, the permanent magnet 22 is an annular body, and the permanent magnet 22 is coupled to an inner peripheral wall of the hub 21. The permanent magnet 22 corresponds to the coil assembly 10.

By using the hole 14, the semiconductor package structure 10 can be easily combined with other components of the motor, such as the shaft tube 16 and the rotor 20. After the rotor 20 is disposed in the hole 14, the motor 30 can be completed, which can greatly Simplify and speed up the process of making motors, and make motors smaller.

FIG. 6 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for motor driving according to the present invention. Referring to FIG. 6, the semiconductor package structure 40 includes a coil component 11, a motor driving unit 12 and a packaging material 13. Compared with the embodiment of FIG. 1, the same components in the embodiment of FIG. 6 are given the same component numbers. In one embodiment, the semiconductor package structure 40 further includes a bearing 41 formed at a relative position of the hole 14. The bearing 41 is formed on an inner peripheral wall of the hole 14. The bearing 41 is manufactured by a semiconductor process.

In one embodiment, the semiconductor package structure 40 further includes a carrier board 42. The coil assembly 11 and the motor driving unit 12 are disposed on the carrier board 42. The carrier plate 42 can be a substrate. The hole 14 is a blind hole, that is, the carrier plate 42 is not perforated.

FIG. 7 is a schematic cross-sectional view of an embodiment of the motor of the present invention. Referring to FIG. 7, the motor 60 includes a semiconductor package structure 40 and a rotor 50. For the semiconductor package structure 40, please refer to the above description of the semiconductor package structure 40 of FIG. 6, which will not be described here. The rotor 50 includes a hub 51 and a permanent magnet 52. The rotor 50 is rotatably provided to the hole 14. In one embodiment, the rotor 50 further includes a central shaft 53. The central shaft 53 is rotatably disposed on the bearing 41.

With this hole, the shaft tube or bearing can be directly set in the hole. In addition, when manufacturing the motor, the semiconductor package structure only needs to be manufactured, and then the rotor is disposed in the hole to complete the motor, so the manufacturing process of the motor can be greatly simplified and accelerated, and the motor can be miniaturized.

FIG. 8 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for motor driving according to the present invention. Referring to FIG. 8, in an embodiment, the semiconductor package structure 70 includes a coil component 71 and a motor driving unit 72, a packaging material 73 and a hole 74. The coil assembly 71 includes a plurality of coil layers. The coil layers are stacked. In one embodiment, the coil layers include a bottom coil layer 711, a coil layer 712, and a top coil layer 713. The motor driving unit 72 is disposed on the top coil layer 713. The packaging material 73 encapsulates the coil assembly 71 and the motor driving unit 72.

The coil component 71 is disposed between a first installation height H1 and a second installation height H2. The first installation height H1 is one of the lowest position heights of the coil component 71, and the second installation height H2 is the coil component 71. One of the highest position heights, the second setting height H2 is greater than the first setting height H1. The first installation height H1 is the lowest installation height of the bottom coil layer 711. The second installation height H2 is one of the highest installation heights of the packaging material 73. The motor driving unit 72 is disposed between the first installation height H1 and the second installation height H2.

The hole 74 is formed in a predetermined position of the semiconductor package structure 70. In one embodiment, the hole 74 is formed in a central position of the semiconductor package structure 70. By using the hole 74, the semiconductor package structure 70 can be easily combined with other components of the motor, for example, the shaft tube 16, the shaft sleeve 161, and the rotor 20 of FIG. Completing the motor can greatly simplify and speed up the process of making the motor, and can make the motor smaller.

The above embodiments are only for explaining the principle of the present invention and its effects, but not for limiting the present invention. Modifications and changes made by those skilled in the art to the above embodiments still do not violate the spirit of the present invention. The scope of rights of the present invention should be listed in the scope of patent application described later.

10‧‧‧Semiconductor Package Structure

11‧‧‧coil assembly

12‧‧‧motor drive unit

13‧‧‧Packaging material

14‧‧‧ Hole

15‧‧‧electrical port

16‧‧‧ shaft tube

17‧‧‧ plate

18‧‧‧ metal fixed components

19‧‧‧ Carrier Board

20‧‧‧rotor

21‧‧‧ Wheel

22‧‧‧Permanent magnet

23‧‧‧ center axis

30‧‧‧Motor

40‧‧‧Semiconductor Package Structure

41‧‧‧bearing

42‧‧‧ Carrier Board

50‧‧‧rotor

51‧‧‧ Wheel

52‧‧‧Permanent magnet

53‧‧‧center axis

60‧‧‧Motor

70‧‧‧Semiconductor package structure

71‧‧‧coil assembly

72‧‧‧motor drive unit

73‧‧‧Packaging materials

111‧‧‧ bottom coil layer

112‧‧‧coil layer

113‧‧‧Top coil layer

114, 115‧‧‧ intermediary units

161‧‧‧shaft sleeve

181‧‧‧Metal pins

711‧‧‧bottom coil layer

712‧‧‧coil layer

713‧‧‧Top coil layer

1111, 1112‧‧‧ coil

1131, 1132, 1133‧‧‧ coils

1136‧‧‧Central End

1137‧‧‧ outer endpoint

1141‧‧‧Insulation

1142‧‧‧conducting post

H1‧‧‧First setting height

H2‧‧‧Second setting height

FIG. 1 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for a motor drive according to the present invention;

2 is a schematic perspective view showing an embodiment of a semiconductor package structure for motor driving according to the present invention;

FIG. 3 is a schematic top view of an embodiment of a semiconductor package structure for motor driving according to the present invention; FIG.

4 is a schematic cross-sectional view showing an embodiment of a combination of a semiconductor package structure for motor driving, a shaft tube, and a plate body according to the present invention;

5 is a schematic cross-sectional view of an embodiment of a motor according to the present invention;

6 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for motor driving according to the present invention;

FIG. 7 shows a schematic cross-sectional view of an embodiment of the motor of the present invention; and

FIG. 8 is a schematic cross-sectional view of an embodiment of a semiconductor package structure for motor driving according to the present invention.

Claims (58)

A semiconductor packaging structure for motor drive includes: a coil component manufactured by a semiconductor process; a motor drive unit manufactured by a semiconductor process, disposed in the coil component, and electrically connected to the coil component; packaging material The package of the coil component is a semiconductor package structure; and a hole is formed at a set position of the semiconductor package structure. A semiconductor packaging structure for motor driving includes: a coil component manufactured by a semiconductor process; a motor driving unit manufactured by a semiconductor process and electrically connected to the coil component; packaging material for packaging the coil component and the motor The driving unit is a semiconductor package structure; and a hole is formed at a set position of the semiconductor package structure. For example, the semiconductor package structure for motor drive of item 1 or 2 of the request further includes a bearing formed at a relative position of the hole. For example, the semiconductor package structure for motor drive of claim 3, wherein the bearing is manufactured by a semiconductor process. For example, the semiconductor package structure for motor driving of item 1 or 2 of the request, further comprising a shaft tube, which is arranged in the hole. For example, the semiconductor package structure for motor driving of item 5 of the claim further includes a plate body, and the shaft tube is fixedly disposed on the plate body. For example, the semiconductor package structure for a motor drive according to claim 6, further comprising a metal fixing component disposed on the outer peripheral wall of the shaft tube, and the metal fixing component is welded to the plate body. For example, the semiconductor package structure for motor drive of claim 5, wherein the shaft tube is tightly fitted in the hole. For example, the semiconductor package structure for a motor drive according to claim 6, wherein the board is a frame. If the semiconductor package structure for motor driving according to item 1 or 2 of the request, further comprising a carrier board, the coil assembly and the motor driving unit are disposed on the carrier board. For example, the semiconductor package structure for a motor drive according to claim 1 or 2, wherein the hole is a through hole. For example, the semiconductor package structure for a motor drive according to claim 1 or 2, wherein the hole is a blind hole. For example, the semiconductor package structure for a motor drive according to claim 1 or 2, wherein the semiconductor package structure has a ring shape. For example, the semiconductor package structure for driving a motor according to claim 1 or 2, wherein the motor driving unit is a motor driving die. For example, the semiconductor package structure for motor driving of item 1 or 2 of the claim, wherein the motor driving unit is a motor driving chip package. For example, the semiconductor package structure for motor drive of item 1 or 2 of the request further includes a plurality of electrical ports for electrically connecting the coil component or the motor drive unit. For example, the semiconductor package structure for motor driving of item 1 or 2 of the claim, wherein the coil component has a plurality of coil layers, and the coil layers are arranged in a stack, each coil layer includes a plurality of coils, and between adjacent coil layers With an intermediary unit, the coil layers are electrically connected. For example, the semiconductor package structure for driving a motor according to claim 17, wherein the motor driving unit is disposed in the at least one intermediary unit. For example, the semiconductor package structure for motor driving of item 17, wherein the coils of each coil layer are arranged at the same plane height. For example, the semiconductor package structure for a motor drive according to claim 17, wherein the interposer includes an insulation layer and at least one conductive pillar, and the at least one conductive pillar is electrically connected to the adjacent coil layer. For example, the semiconductor package structure for a motor drive according to claim 20, wherein the at least one conductive pillar is manufactured by an electroforming process. For example, the semiconductor package structure for motor driving according to claim 20, wherein the motor driving unit is disposed on the insulating layer. For example, the semiconductor package structure for a motor drive of claim 17, wherein the interposer is a substrate. For example, the semiconductor package structure for motor driving of item 17, wherein the coil component and the motor driving unit are disposed between a first setting height and a second setting height, the first setting height is the coil component One of the lowest position heights, the second setting height is one of the highest position heights of the coil component, and the second setting height is greater than the first setting height. For example, the semiconductor package structure for motor driving of item 24, wherein the coil layers include a bottom coil layer and a top coil layer, the bottom coil layer is disposed at a bottom position of one of the coil layers, and the top coil The layer is disposed on top of one of the coil layers. For example, the semiconductor package structure for motor driving of item 25, wherein the first setting height is a lowest setting height of the bottom coil layer, and the second setting height is a highest setting height of the top coil layer. . For example, the semiconductor package structure for motor driving according to claim 25, wherein the motor driving unit is disposed on the top coil layer. For example, the semiconductor package structure for motor driving according to item 27, wherein the first setting height is a lowest setting height of the bottom coil layer, and the second setting height is a highest setting height of the packaging material. For example, the semiconductor package structure for driving a motor according to claim 1 or 2, wherein the hole is formed in a central position of the semiconductor package structure. A motor includes: a semiconductor package structure including: a coil component manufactured by a semiconductor process; a motor drive unit manufactured by a semiconductor process and disposed in the coil component and electrically connected to the coil component; packaging material The coil component is a semiconductor package structure; and a hole is formed at a set position of the semiconductor package structure; and a rotor having a hub and a permanent magnet is rotatably provided to the hole and the permanent magnet Is coupled to the hub, and the permanent magnet corresponds to the coil component. A motor includes: a semiconductor package structure including: a coil component manufactured by a semiconductor process; a motor drive unit manufactured by a semiconductor process and electrically connected to the coil component; packaging material for packaging the coil component and the motor The driving unit is a semiconductor package structure; and a hole formed at a set position of the semiconductor package structure; and a rotor having a hub and a permanent magnet, the rotor is rotatably provided to the hole, and the permanent magnet is coupled to the hole A wheel hub, and the permanent magnet corresponds to the coil component. If the motor of item 30 or 31 is requested, it further includes a bearing formed at the relative position of the hole. The motor of claim 32, wherein the bearing is manufactured by a semiconductor process. If the motor of item 30 or 31 is requested, a shaft tube is additionally provided in the hole. For example, the motor of item 34 further includes a plate body, and the shaft tube system is fixedly disposed on the plate body. For example, the motor of claim 35 further includes a metal fixing component disposed on the outer peripheral wall of the shaft tube, and the metal fixing component is welded to the plate body. The motor of item 34, wherein the shaft tube fits tightly in the hole. For example, the motor of claim 35, wherein the plate is a frame. If the motor of item 30 or 31 is requested, it further includes a carrier board, and the coil assembly and the motor driving unit are disposed on the carrier board. For the motor of item 30 or 31, the hole is a through hole. For the motor of item 30 or 31, the hole is a blind hole. The motor of claim 30 or 31, wherein the semiconductor package structure is annular. The motor of claim 30 or 31, wherein the motor driving unit is a motor driving die. The motor of claim 30 or 31, wherein the motor driving unit is a motor driving chip package. For example, the motor of item 30 or 31 includes a plurality of electrical ports for electrically connecting the coil assembly or the motor driving unit. For example, the motor of item 30 or 31, wherein the coil component has a plurality of coil layers, and the coil layers are arranged in a stack, each coil layer includes a plurality of coils, and an intermediary unit is provided between adjacent coil layers. The coil layer is electrically connected. The motor of claim 46, wherein the motor driving unit is disposed in the at least one intermediary unit. For the motor of item 46, the coils of each coil layer are arranged at the same plane height. The motor of claim 46, wherein the intermediary unit includes an insulating layer and at least one conductive post, and the at least one conductive post is electrically connected to an adjacent coil layer. The motor according to item 49, wherein the at least one conductive pillar is made by an electroforming process. The motor of claim 49, wherein the motor driving unit is disposed on the insulation layer. The motor of claim 46, wherein the intermediary unit is a substrate. If the motor of item 46 is requested, wherein the coil component and the motor driving unit are disposed between a first setting height and a second setting height, the first setting height is one of the lowest position heights of the coil component, the The second setting height is a highest position height of the coil component, and the second setting height is greater than the first setting height. If the motor according to item 53, wherein the coil layers include a bottom coil layer and a top coil layer, the bottom coil layer is disposed at a bottom position of the coil layers, and the top coil layer is disposed on the coil layers. One of the top positions. For example, the motor of claim 54, wherein the first setting height is a lowest setting height of the bottom coil layer, and the second setting height is a highest setting height of the top coil layer. The motor of claim 54, wherein the motor driving unit is disposed on the top coil layer. For example, the motor according to item 56, wherein the first setting height is a lowest setting height of the bottom coil layer, and the second setting height is a highest setting height of the packaging material. The motor of claim 30 or 31, wherein the hole is formed in a central position of the semiconductor package structure.