JP2013232511A - Control device and motor unit including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a control device having a structure which determines a relative position relationship between a first substrate part and a second substrate part in the state that only a circuit board is prepared, and to provide a motor unit including the control device.SOLUTION: A control device 1B of a motor unit 1 includes: a circuit board 70 and a housing 60. The housing 60 houses the circuit board 70. The circuit board 70 includes: a first substrate part 71 having a first main surface 71A; a second substrate part 72 having a second main surface 72A; a connection part 73 connecting an end part of the first substrate part 71 with an end part of the second substrate part 72; a heat radiation component 71D attached to the first main surface 71A; and an electrolytic capacitor 72C which is attached to the second main surface 72A and contacts with the heat radiation component 71D with the connection part 73 bent thereby regulating changes in a relative position between the first substrate part 71 and the second substrate part 72.

Description

  The present invention relates to a control device having a circuit board and a housing, and a motor unit including the device.

With reference to FIG. 12, the structure of the conventional control apparatus 300 is demonstrated.
The control device 300 includes a circuit board 310 and a housing 320. The circuit board 310 includes a first board part 311, a second board part 312, and a connection part 313.

  The first substrate portion 311 is formed of a rigid substrate. The first substrate portion 311 has a heating element 311A. The second substrate portion 312 is formed of a rigid substrate. The connection part 313 is formed of a flexible substrate. The housing 320 includes a bottom wall 321 that supports the first substrate portion 311 and a support column 322 that supports the second substrate portion 312.

  In the control device 300, the first substrate portion 311 is disposed on the bottom wall 321 of the housing 320, and the second substrate portion 312 is supported by the support column 322 of the housing 320. As a result, the circuit board 310 is disposed in a state where the first main surface 311B of the first substrate portion 311 and the second back surface 312A of the second substrate portion 312 face each other and are parallel to each other. As such a control device, for example, a control device described in Patent Document 1 is known.

JP 2007-27280 A

  Since the control device 300 has a configuration in which the second substrate portion 312 is supported by the support column 322, the relative positional relationship between the first substrate portion 311 and the second substrate portion 312 in the state of the circuit board 310 alone at the time of manufacture. Can't decide. For this reason, it is necessary to adjust the relative positional relationship between the first substrate portion 311 and the second substrate portion 312 in a state where the circuit board 310 is placed on the bottom wall 321 of the housing 320. This leaves room for improvement from the viewpoint of workability.

  In order to solve the above-described problems, the present invention includes a control device having a configuration capable of determining the relative positional relationship between the first substrate portion and the second substrate portion in the state of the circuit board alone, and this device. The object is to provide a motor unit.

  (1) The first means is the control device having the invention according to claim 1, that is, the circuit board and the housing, wherein the housing accommodates the circuit board, and the circuit board has the first main surface. A first substrate portion having a second main surface, a connecting portion connecting the end portion of the first substrate portion and the end portion of the second substrate portion, and the first main portion. A first positioning element attached to a surface, and a first positioning part attached to the second main surface and contacting the first positioning element in a state in which the connecting part is bent; The gist of the present invention is that the control device includes a second positioning element that regulates a change in the relative posture of the second positioning element.

  In the control device, the first substrate portion and the second substrate portion are positioned by contacting the first positioning element and the second positioning element, which are elements attached to the first substrate portion and the second substrate portion, with each other. Is done. For this reason, the relative positional relationship between the first substrate portion and the second substrate portion can be determined in the state of the circuit board alone.

  (2) The second means is the invention according to claim 2, that is, the second substrate portion has a circuit element as the second positioning element on the second main surface, and the first positioning element Is a control device according to claim 1, which is made of a metal material and contacts the circuit element.

  In the control device, the heat of the circuit element moves to the first positioning element made of a metal material. For this reason, compared with the structure assumed that the 1st positioning element was formed with the resin material, the temperature of a circuit element does not rise easily.

  (3) The third means is the invention according to claim 3, that is, the first substrate portion has a heat dissipation component, and the first positioning element is in contact with the heat dissipation component. The gist is that it is a control device.

  In the control device, the heat of the circuit element moves in the order of the first positioning element of the metal material and the heat dissipating component. For this reason, the effect which suppresses the temperature rise of a circuit element is high compared with the structure assumed not to have a heat radiating component.

  (4) The fourth means is the control device having the invention according to claim 4, ie, the circuit board and the housing, wherein the housing accommodates the circuit board, and the circuit board has the first main surface. A first substrate portion having a second main surface, a connecting portion connecting the end portion of the first substrate portion and the end portion of the second substrate portion, and the first main portion. A first fixed portion attached to the surface and a second fixed portion attached to the second main surface, wherein the first fixed portion is attached to the first main surface and the second fixed portion is the second It is a control device comprising a positioning component that regulates a change in relative posture between the first substrate portion and the second substrate portion when the connecting portion is bent by being attached to the main surface. The gist.

  In the control apparatus, the first substrate portion and the second substrate portion are positioned by positioning components that are components attached to the first main surface and the second main surface. For this reason, the relative positional relationship between the first substrate portion and the second substrate portion can be determined in the state of the circuit board alone.

  (5) The fifth means is the invention according to claim 5, that is, the control device has a multilayer printed board formed of a thermoplastic resin film as the circuit board. The gist of the present invention is the control device described in 1. above.

  (6) The sixth means is the motor unit provided with the control device according to any one of claims 1 to 5, that is, the invention according to claim 6.

  The present invention provides a control device having a configuration capable of determining a relative positional relationship between a first substrate portion and a second substrate portion in a state of a circuit board alone, and a motor unit including the device. Objective.

It is sectional drawing regarding the motor unit of 1st Embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane of an axial direction. It is sectional drawing regarding the control apparatus of 1st Embodiment, and is sectional drawing which shows the cross-section of the Z1-Z1 plane of FIG. The expanded view which shows the expanded structure of the circuit board of 1st Embodiment. It is a perspective view regarding the circuit board of 1st Embodiment, (a) is a perspective view which shows the perspective structure of a part of circuit board in the state before a connection part is bent, (b) is after a connection part is bent The perspective view which shows the one part perspective structure of the circuit board of a state. It is a perspective view regarding the control apparatus of 2nd Embodiment of this invention, and is a perspective view which shows the external perspective structure. It is sectional drawing of the control apparatus of 2nd Embodiment, and sectional drawing which shows the cross-section of the Z5-Z5 plane of FIG. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane of an axial direction. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane of an axial direction. It is a figure regarding the circuit board of other embodiment of this invention, (a) is a front view which shows the front structure of a part of circuit board when the 2nd board | substrate part is seen from the front, (b) is the 2nd board | substrate part. The side view which shows the side structure of a part of circuit board when seeing from the side. The side view which is the figure regarding the circuit board of other embodiment of this invention, and shows the side structure of a part of circuit board. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane of an axial direction. Sectional drawing which shows the cross-section of the conventional control apparatus.

(First embodiment)
With reference to FIG. 1, the structure of the motor unit 1 of this embodiment is demonstrated.
The motor unit 1 includes an electric motor 1A, a control device 1B, and a speed reducer 1C. The motor unit 1 has a configuration in which the control device 1B is located between the electric motor 1A and the speed reducer 1C.

  The electric motor 1 </ b> A includes a rotor 10, a stator 20, a bus bar 30, a motor housing 40, ball bearings 43 and 44, and a resolver 50. The control device 1B includes a housing 60 and a circuit board 70. The control device 1B controls the operation of the electric motor 1A. The reduction gear 1 </ b> C includes a worm shaft 80, a worm wheel 90, and a gear housing 100. The reduction gear 1C transmits the rotational torque of the output shaft 11 to the steering shaft 2 in a state where the rotational speed of the output shaft 11 of the electric motor 1A is decelerated.

The direction of the motor unit 1 is defined as follows.
(A) A direction along the central axis (hereinafter, “central axis J”) of the rotor 10 is referred to as “axial direction ZA”. A direction orthogonal to the axial direction ZA is referred to as a “radial direction ZB”. The direction in which the rotor 10 rotates is referred to as “circumferential direction ZC”.
(B) In the axial direction ZA, a direction passing through the electric motor 1A, the control device 1B, and the speed reducer 1C in this order is referred to as an “upward direction ZA1”. In the axial direction ZA, a direction passing through the reducer 1C, the control device 1B, and the electric motor 1A in this order is referred to as a “downward direction ZA2”.
(C) In the radial direction ZB, a direction approaching the central axis J is referred to as an “inward direction ZB1”. In the radial direction ZB, a direction away from the central axis J is referred to as an “outward direction ZB2”.

  The rotor 10 has an output shaft 11, a rotor core 12, and a permanent magnet 13. The rotor core 12 has a cylindrical shape. The rotor core 12 is press-fitted into the output shaft 11. The permanent magnet 13 is fixed to the outer peripheral surface of the rotor core 12. The permanent magnet 13 has 10 magnetic poles in the circumferential direction ZC.

  The stator 20 has a stator core 21 and a field part 22. The stator 20 forms a magnetic field that generates a rotational force of the rotor 10 when a current is supplied from a power source (not shown). The stator core 21 passes the magnetic flux of the field portion 22. The stator core 21 is press-fitted into the inner peripheral surface of the stator holding portion 41 of the motor housing 40. The field part 22 forms a magnetic field around the field part 22 when current is supplied from the power source. The field magnet portion 22 forms a concentrated winding by winding a conductive wire around the stator core 21. Field unit 22 has four U-phase coils, four V-phase coils, and four W-phase coils.

  The bus bar 30 includes a copper plate 31 and a support member 32. The bus bar 30 is attached to the stator core 21 at a position in the upward direction ZA1 of the stator core 21. The bus bar 30 electrically connects the stator 20 and the circuit board 70.

  Copper plate 31 has U-phase copper plate 31U, V-phase copper plate 31V, and W-phase copper plate 31W. The U-phase copper plate 31U is connected to the coil end of each U-phase coil. An end portion of the U-phase copper plate 31U extends in the upward direction ZA1 and is connected to the circuit board 70 (see FIG. 2). The V-phase copper plate 31V is connected to the coil end of each V-phase coil. The end of the V-phase copper plate 31V extends in the upward direction ZA1 and is connected to the circuit board 70 (see FIG. 2). The W-phase copper plate 31W is connected to the coil end of each W-phase coil. An end portion of the W-phase copper plate 31W extends in the upward direction ZA1 and is connected to the circuit board 70 (see FIG. 2).

  The support member 32 has a copper plate support portion 32A and three leg portions 32B. The support member 32 has a structure in which the copper plate support portion 32A and the leg portion 32B are integrally formed of the same resin material. The copper plate support portion 32A has an annular shape. The copper plate support portion 32 </ b> A supports the copper plate 31. The leg portion 32B extends in the downward direction ZA2 from the outer peripheral portion of the copper plate support portion 32A. The leg portions 32B are separated from each other in the circumferential direction ZC. The leg portion 32B is attached to the outer peripheral portion of the stator core 21 at the lower end portion.

  The motor housing 40 has a stator holding portion 41 and a cover portion 42. The motor housing 40 has a structure in which a stator holding portion 41 and a cover portion 42 are integrally formed of the same metal plate. The motor housing 40 houses a part of the rotor 10, the stator 20, and the bus bar 30.

  The stator holding portion 41 has a cylindrical shape. The stator holding portion 41 has an opening portion 41A. The opening portion 41A opens toward the upward direction ZA1 at the upper end portion of the stator holding portion 41. The cover portion 42 has a bearing support portion 42A. The cover portion 42 closes the lower end portion of the stator holding portion 41.

  The ball bearing 43 is press-fitted into the upper end portion of the output shaft 11. The ball bearing 43 is fixed to the bearing support portion 65. The ball bearing 43 supports the output shaft 11 in a state where the rotor 10 can rotate with respect to the stator 20.

  The ball bearing 44 is press-fitted into the lower end portion of the output shaft 11. The ball bearing 44 is fixed to the bearing support portion 42A. The ball bearing 44 supports the output shaft 11 in a state where the rotor 10 can rotate with respect to the stator 20.

  The resolver 50 is located in the upward direction ZA1 with respect to the bus bar 30 and in the inward direction ZB1 with respect to the bus bar 30. The resolver 50 outputs a voltage signal corresponding to the rotational position of the rotor 10 to the circuit board 70. The resolver 50 includes a resolver rotor 51, a resolver stator 52, and a circuit connection member 53 (see FIG. 2). The resolver 50 has a variable reluctance resolver configuration.

  The resolver rotor 51 is press-fitted into the output shaft 11. The resolver stator 52 is fixed to the resolver support portion 64. The resolver stator 52 has a resolver core 52A and a resolver coil 52B. The resolver core 52A is press-fitted into the resolver support portion 64. The resolver coil 52B is formed by a conductive wire wound around the resolver core 52A. The circuit connection member 53 includes a plurality of pin terminals. The circuit connection member 53 extends in the upward direction ZA1 from the resolver stator 52 and is connected to the circuit board 70 (see FIG. 2). The circuit connection member 53 electrically connects the coil end portion of the resolver coil 52 </ b> B and the circuit board 70.

  The housing 60 is fixed to the opening portion 41 </ b> A of the motor housing 40. The housing 60 includes a side wall 61, a cover portion 62, a mounting portion 63, a resolver support portion 64, and a bearing support portion 65. The housing 60 has a structure in which a side wall 61, a cover portion 62, a mounting portion 63, a resolver support portion 64, and a bearing support portion 65 are integrally formed of the same metal material.

  The side wall 61 has a cylindrical shape. The side wall 61 is fixed to the opening portion 41 </ b> A of the motor housing 40. The side wall 61 has a connector insertion portion 61A. The cover portion 62 is located at an intermediate portion of the side wall 61 in the axial direction ZA. The cover portion 62 closes the opening portion 41A. The cover portion 62 has a bus bar through hole and a resolver through hole (both not shown). The attachment portion 63 extends in the outward direction ZB2 at the upper end portion of the side wall 61. The attachment portion 63 is fixed to the attachment portion 104 of the gear housing 100 with a bolt 66. The resolver support portion 64 has a cylindrical shape. The resolver support portion 64 extends from the cover portion 62 in the downward direction ZA2. The bearing support portion 65 has a cylindrical shape. The bearing support portion 65 is located in the inward direction ZB1 relative to the resolver support portion 64. The bearing support portion 65 extends from the cover portion 62 in the upward direction ZA1. The bearing support portion 65 is inserted into the insertion hole 71 </ b> C of the circuit board 70.

  The circuit board 70 is fixed to the upper surface of the cover portion 62 of the housing 60. The circuit board 70 is formed as a multilayer printed board in which a plurality of thermoplastic films are laminated. The circuit board 70 has a through hole and an interlayer connection portion (not shown) made of a conductive paste filled in the through hole. The circuit board 70 is configured by thermocompression bonding in a state where a thermoplastic film on which a conductor pattern and a conductive paste are formed is laminated.

  The worm shaft 80 rotates integrally with the output shaft 11. The worm shaft 80 has a gear portion 81 and a connection portion 82. The worm shaft 80 meshes with the worm wheel 90 at the gear portion 81. The worm shaft 80 has a configuration in which the connection member 110 is fixed at the connection portion 82. The worm shaft 80 is coupled to the output shaft 11 by the connecting member 110.

The worm wheel 90 is fixed to the steering shaft 2. The worm wheel 90 transmits the rotation of the worm shaft 80 to the steering shaft 2.
The gear housing 100 accommodates the worm shaft 80 and the worm wheel 90. The gear housing 100 includes a shaft housing portion 101, a wheel housing portion 102, a side wall 103, and a mounting portion 104. The gear housing 100 has a structure in which a shaft housing portion 101, a wheel housing portion 102, a side wall 103, and a mounting portion 104 are integrally formed of the same metal material. The gear housing 100 has a configuration in which a cover member 120, a lock nut 121, and ball bearings 122 and 123 are attached to the shaft housing portion 101.

  The shaft housing portion 101 has an internal space 101A. The internal space 101A is formed as a through hole penetrating the gear housing 100 along the central axis J. The shaft accommodating portion 101 accommodates the worm shaft 80 in the internal space 101A. The wheel accommodating portion 102 has an internal space 102A. The wheel accommodating portion 102 accommodates a part of the worm wheel 90 and the steering shaft 2 in the internal space 102A. The side wall 103 has a cylindrical shape. Side wall 103 is located at the lower end of gear housing 100. The attachment portion 104 extends in the outward direction ZB2 from the lower end portion of the side wall 103. The attachment portion 104 faces the attachment portion 63 when the gear housing 100 is attached to the housing 60.

  The cover member 120 closes the internal space 101 </ b> A at the upper end portion of the shaft housing portion 101. The cover member 120 has a male screw (not shown) that meshes with a female screw (not shown) formed in the gear housing 100 on the outer peripheral surface.

  The lock nut 121 is engaged with the male screw of the cover member 120. The lock nut 121 prevents the cover member 120 from loosening with respect to the gear housing 100.

  The ball bearing 122 is press-fitted into the lower end portion of the worm shaft 80. The ball bearing 122 is fixed to the lower end portion of the shaft housing portion 101. The ball bearing 122 supports the worm shaft 80 in a state where the worm shaft 80 can rotate with respect to the gear housing 100.

  The ball bearing 123 is press-fitted into the upper end portion of the worm shaft 80. The ball bearing 123 is fixed to the upper end portion of the shaft housing portion 101. The ball bearing 123 supports the worm shaft 80 in a state where the worm shaft 80 can rotate with respect to the gear housing 100.

A detailed configuration of the circuit board 70 will be described with reference to FIGS.
The circuit board 70 includes a first board portion 71, a second board portion 72, a connecting portion 73, a bus bar connection portion 74 (see FIG. 2), and a resolver connection portion 75 (see FIG. 2). The circuit board 70 has a structure in which a first board portion 71, a second board portion 72, a connecting portion 73, a bus bar connection portion 74, and a resolver connection portion 75 are integrally formed (see FIG. 3).

  The first substrate portion 71 has a flat plate shape along the radial direction ZB. The first substrate portion 71 includes a first main surface 71A, a first back surface 71B, an insertion hole 71C, two heat radiation components 71D, two through holes 71E, two conductive portions 71F, and six power elements 71G. Field effect transistor, one toroidal coil 71H (see FIG. 2), and one external connector 71I. The first substrate portion 71 is fixed to the upper surface of the cover portion 62 on the first back surface 71B. The first substrate portion 71 constitutes an inverter circuit with six power elements 71G. The heat dissipating component 71D corresponds to a “first positioning element”.

  The heat dissipation component 71D is formed of aluminum. The heat dissipation component 71 </ b> D is attached on the first main surface 71 </ b> A of the first substrate portion 71. The heat dissipation component 71D has a rectangular shape in plan view (see FIG. 3). The heat dissipation component 71D is attached to the first substrate portion 71 corresponding to the electrolytic capacitor 72C in a state where the second substrate portion 72 stands upright with respect to the first substrate portion 71.

  The conductive portion 71F is formed by filling the through hole 71E with a metal conductive paste. The conductive portion 71F is located at a portion corresponding to the heat dissipation component 71D in the first substrate portion 71. The conductive portion 71F is in contact with the heat dissipation component 71D. The conductive portion 71F corresponds to a “heat dissipating component”.

  The second substrate portion 72 stands upright with respect to the first substrate portion 71. The second substrate portion 72 extends from the first substrate portion 71 in the upward direction ZA1. The second substrate portion 72 has a second main surface 72A, a second back surface 72B, and two electrolytic capacitors 72C. The second substrate portion 72 includes a part of a control circuit that controls switching of the power element 71 </ b> G of the first substrate portion 71. The electrolytic capacitor 72C corresponds to a “second positioning element” and a “circuit element”.

  The electrolytic capacitor 72C is attached to the second main surface 72A in an upright state with respect to the second main surface 72A. In the electrolytic capacitor 72C, in the state where the second substrate portion 72 stands upright with respect to the first substrate portion 71, the distance in the axial direction ZA between the electrolytic capacitor 72C and the first main surface 71A of the first substrate portion 71 is the heat dissipation component 71D. The first substrate portion 71 is attached to a portion of the second substrate portion 72 that is equal to the height in the axial direction ZA from the first main surface 71A. Each electrolytic capacitor 72 </ b> C contacts the upper surface of each heat radiating component 71 </ b> D in a state where the second substrate portion 72 stands upright with respect to the first substrate portion 71. Each electrolytic capacitor 72C is fixed to each heat radiating component 71D corresponding to each electrolytic capacitor 72C by an adhesive. The electrolytic capacitor 72C is a power supply smoothing capacitor, and absorbs current fluctuations accompanying high-speed switching of the power element 71G.

  The connecting portion 73 connects the outer end portion of the first substrate portion 71 and the lower end portion of the second substrate portion 72 to each other. The connecting portion 73 is bent in a state where the second substrate portion 72 is upright with respect to the first substrate portion 71.

  The bus bar connection portion 74 is orthogonal to the first substrate portion 71 in the planar direction of the first substrate portion 71 (see FIG. 2). The bus bar connection portion 74 is fixed to the upper surface of the cover portion 62 (see FIG. 2). The bus bar connecting portion 74 is connected to the end of the copper plate 31 of the bus bar 30 (see FIG. 2).

  The resolver connection portion 75 is orthogonal to the first substrate portion 71 in the planar direction of the first substrate portion 71 (see FIG. 2). The resolver connecting portion 75 is located on the opposite side of the bus bar connecting portion 74 with respect to the first substrate portion 71 in the planar direction of the first substrate portion 71 (see FIG. 2). The resolver connection portion 75 is connected to the circuit connection member 53 of the resolver 50 (see FIG. 2).

  With reference to FIG. 1 and FIG. 4, the manufacturing method and operation of the control device 1B will be described. FIG. 4 shows the positional relationship between one electrolytic capacitor 72C and one heat dissipation component 71D when the posture of the second substrate portion 72 relative to the first substrate portion 71 is changed.

The manufacturing method of the control device 1B includes a circuit board bending process and a circuit board assembly process.
In the circuit board bending step, the operator applies an adhesive to the upper surface of the heat dissipation component 71D. Then, as shown in FIG. 4, the worker changes the posture of the second substrate portion 72 with respect to the first substrate portion 71. At this time, the connecting portion 73 is bent. Then, the worker completes the change of the posture of the second substrate portion 72 with respect to the first substrate portion 71 based on the fact that each electrolytic capacitor 72C comes into contact with each heat radiation component 71D. At this time, the first main surface 71A of the first substrate portion 71 and the second main surface 72A of the second substrate portion 72 are orthogonal to each other. Further, the electrolytic capacitor 72C is fixed to the heat dissipation component 71D by an adhesive. Thus, the relative attitude | position of the 1st board | substrate part 71 and the 2nd board | substrate part 72 is determined by making the electrolytic capacitor 72C contact the heat radiating component 71D.

  In the circuit board assembly process, the operator attaches the circuit board 70 in a state in which the second board part 72 stands upright with respect to the first board part 71 to the housing 60 (see FIG. 1) by the circuit board bending process. Since the electrolytic substrate 72C is fixed to the heat dissipating component 71D, the second substrate portion 72 is maintained upright with respect to the first substrate portion 71. Therefore, the operator can easily place the circuit board 70 on the housing 60. Can be incorporated.

With reference to FIG. 1, the heat radiation of the electrolytic capacitor 72C will be described.
When the motor unit 1 is driven, the electrolytic capacitor 72C of the second substrate portion 72 generates heat. At this time, the heat of the electrolytic capacitor 72C moves to the heat dissipation component 71D. Then, the heat of the heat dissipation component 71D moves to the housing 60 via the conductive portion 71F. For this reason, the amount of heat transferred from the electrolytic capacitor 72C to the first substrate portion 71 is increased as compared with the configuration in which the heat radiation component 71D is omitted. In addition, the amount of heat transferred from the electrolytic capacitor 72C to the first substrate portion 71 is further increased by the conductive portion 71F. Since the conductive portion 71 </ b> F contacts the housing 60, the heat of the electrolytic capacitor 72 </ b> C moves to the housing 60. As described above, since the heat of the electrolytic capacitor 72C moves to the outside of the electrolytic capacitor 72C, the temperature rise of the electrolytic capacitor 72C is suppressed.

The motor unit 1 of this embodiment has the following effects.
(1) The control device 1B includes a circuit board 70 having a first board part 71 to which a heat dissipation component 71D is attached and a second board part 72 to which an electrolytic capacitor 72C is attached. According to this configuration, when the postures of the first substrate portion 71 and the second substrate portion 72 are changed by the circuit board bending step, the heat dissipation component 71D and the electrolytic capacitor 72C come into contact with each other, thereby The second substrate portion 72 is positioned. For this reason, the relative positional relationship between the first substrate portion 71 and the second substrate portion 72 can be determined in the state where the circuit board 70 is alone.

  (2) The circuit board 70 has a configuration in which the electrolytic capacitor 72C is in contact with the heat dissipating component 71D formed of a metal material. According to this configuration, the heat of the electrolytic capacitor 72C moves to the heat dissipation component 71D. For this reason, the temperature of the electrolytic capacitor 72C is unlikely to increase as compared with a configuration in which the heat dissipation component 71D is assumed to be formed of a resin material.

  (3) The circuit board 70 includes a conductive portion 71F that contacts the heat dissipation component 71D. According to this configuration, the heat of the electrolytic capacitor 72C moves in the order of the heat dissipation component 71D and the conductive portion 71F. For this reason, the effect which suppresses the temperature rise of the electrolytic capacitor 72C is high compared with the structure assumed not to have the electroconductive part 71F.

  (4) The control device 1 </ b> B includes the circuit board 70 in which the second board portion 72 stands upright with respect to the first board portion 71. According to this configuration, the size in the radial direction ZB of the circuit board 70 is reduced as compared with the configuration in which the first substrate portion 71 and the second substrate portion 72 are assumed to be formed as a single flat circuit board. be able to. For this reason, the dimension of the radial direction ZB of the control apparatus 1B can be made small.

  (5) On the circuit board 70, the heat dissipation component 71D and the electrolytic capacitor 72C are fixed by an adhesive. According to this configuration, the posture of the second substrate portion 72 with respect to the first substrate portion 71 is maintained. Therefore, the circuit board 70 can be easily assembled into the housing 60.

(Second Embodiment)
5 and 6 show the configuration of the control device 200 of the present embodiment.
The control device 200 of this embodiment is different from the control device 1B (see FIG. 1) of the first embodiment in that it is formed separately from the electric motor 1A (see FIG. 1). In the following description, the components of the second embodiment that are described to correspond to the components of the first embodiment have the same or similar functions as the corresponding components of the first embodiment. .

As illustrated in FIG. 6, the control device 200 includes a circuit board 210, a housing 220, and a cover 230.
The housing 220 is made of a metal material. The housing 220 has a rectangular box shape in plan view (see FIG. 5). The housing 220 accommodates the circuit board 210. The housing 220 has a bottom wall 221 and a side wall 222. The housing 220 has a structure in which the bottom wall 221 and the side wall 222 are integrally formed of the same metal material. The side wall 222 has a fitting protrusion 222A and a connector insertion portion 222B (see FIG. 5). The fitting protrusion 222 </ b> A protrudes from the end surface of the side wall 222. The connector insertion portion 222B is formed as a through hole that penetrates the side wall 222 in the thickness direction.

  The cover 230 covers the side wall 222 from the side opposite to the bottom wall 221. The cover 230 is fixed to the side wall 222 by bolts (not shown). The cover 230 has a fitting recess 231. The fitting recess 231 is fitted into the fitting protrusion 222A.

  The circuit board 210 corresponds to a structure in which the bus bar connection part 74 and the resolver connection part 75 are omitted from the circuit board 70 of the first embodiment. The circuit board 210 includes a first substrate portion 211 corresponding to the first substrate portion 71 of the first embodiment, a second substrate portion 212 corresponding to the second substrate portion 72 of the first embodiment, and a connection of the first embodiment. A connecting portion 213 corresponding to the portion 73 is provided.

  The first substrate portion 211 includes a first main surface 211A, a first back surface 211B, two heat dissipating components 211C corresponding to the heat dissipating component 71D of the first embodiment, and two corresponding to the through holes 71E of the first embodiment. Through hole 211D, two conductive portions 211E corresponding to conductive portion 71F of the first embodiment, six power elements 211F corresponding to power element 71G of the first embodiment, and one external connector 211G (FIG. 5) See). The first board portion 211 has a power circuit corresponding to the power circuit of the circuit board 70 of the first embodiment. The first substrate portion 211 has a configuration in which a heat dissipation component 211C, a power element 211F, and an external connector 211G are attached on the first main surface 211A. The first substrate portion 211 is fixed to the bottom wall 221 on the first back surface 211B. The external connector 211G protrudes outside the housing 220 via the connector insertion portion 222B (see FIG. 5). The heat radiation component 211C corresponds to a “first positioning element”. The conductive portion 211E corresponds to a “heat dissipating component”.

  The second substrate portion 212 stands upright with respect to the first substrate portion 211. The second substrate portion 212 has a second main surface 212A and two electrolytic capacitors 212B corresponding to the electrolytic capacitor 72C of the first embodiment. The electrolytic capacitor 212B is in contact with the heat dissipation component 211C. The electrolytic capacitor 72C corresponds to a “second positioning element” and a “circuit element”.

The connecting portion 213 connects one end of the first substrate portion 211 and one end of the second substrate portion 212 to each other. The connecting portion 213 is bent.
Since the operation of the control device 200 is the same as that of the control device 1B, description thereof is omitted. Moreover, the control apparatus 200 of this embodiment has the same effects as the effects (1) to (5) of the motor unit 1 of the first embodiment.

(Other embodiments)
The present invention includes an embodiment different from the first and second embodiments. Hereinafter, modifications of the first and second embodiments as other embodiments of the present invention will be described. The following modifications can be combined with each other.

  The control device 1B of the first embodiment includes the circuit board 70 in which the second board portion 72 stands upright in the upward direction ZA1 with respect to the first board portion 71. On the other hand, as shown in FIG. 7, the control device 1 </ b> B according to the modification includes a circuit board 70 in which the second board portion 72 stands upright in the downward direction ZA <b> 2 with respect to the first board portion 71. The resolver support portion 64 of the modified housing 60 has a cutout portion 64A for suppressing interference with the two electrolytic capacitors 72C. Further, the housing 60 according to the modified example has a substrate insertion portion 67 for inserting the second substrate portion 72. The board insertion portion 67 penetrates the cover portion 62 in the axial direction ZA at the outer peripheral portion of the cover portion 62. The modified motor unit 1 has a configuration in which the second substrate portion 72 overlaps the resolver 50 in the axial direction ZA. According to this configuration, the dimension in the axial direction ZA of the motor unit 1 can be reduced as compared with the motor unit 1 of the first embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure by which the circuit board 70 is fixed to the cover part 62 of the housing 60. FIG. On the other hand, the control device 1B according to the modification has a configuration that is fixed to the gear housing 100 as shown in FIG. The first substrate portion 71 is fixed to the lower end surface of the shaft housing portion 101. The second substrate portion 72 stands upright in the downward direction ZA2 with respect to the first substrate portion 71. The housing 60 has a configuration in which the connector insertion portion 61 </ b> A is omitted from the side wall 61. The gear housing 100 has a connector insertion portion 103A. The external connector 71I is inserted into the connector insertion portion 103A. The gear housing 100 corresponds to a “housing”.

  The motor unit 1 having the control device 1 </ b> B according to the modification has a configuration in which the gear housing 100 is fixed to the housing 60. On the other hand, the motor unit 1 of another modification has a configuration in which the gear housing 100 is fixed to the motor housing 40. That is, the motor unit 1 of another modified example does not have the housing 60. The motor unit 1 of another modified example has a configuration as a sensorless motor instead of the resolver 50. Further, the motor unit 1 of another modified example does not have the ball bearing 43. According to this configuration, the dimension of the motor unit 1 in the axial direction ZA can be reduced. Further, the number of parts constituting the motor unit 1 can be reduced.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 by which flat plate-shaped thermal radiation component 71D was attached to the 1st board | substrate part 71. As shown in FIG. On the other hand, as shown in FIG. 9, the control device 1 </ b> B according to the modification includes a circuit board 70 in which the heat dissipation component 240 is attached to the first board portion 71. The heat dissipation component 240 is made of aluminum. The heat dissipation component 240 has an element housing portion 241 in which a part of the electrolytic capacitor 72C is housed. An adhesive is applied to the inner surface of the element housing portion 241. The heat radiation component 240 corresponds to a “first positioning element”.

  According to this configuration, the facing area of the electrolytic capacitor 72C and the heat dissipation component 240 is larger than that of the heat dissipation component 71D. For this reason, the electrolytic capacitor 72 </ b> C is easily fixed to the heat dissipation component 240. Further, since a part of the electrolytic capacitor 72C is accommodated in the element accommodating portion 241 of the heat radiating component 240, the first of the surface directions of the first substrate portion 71 as indicated by the arrow ZD in FIG. The electrolytic capacitor 72 </ b> C is restricted from moving in a direction parallel to the surface direction of the two substrate portions 72. For this reason, the relative attitude | position of the 1st board | substrate part 71 and the 2nd board | substrate part 72 is determined with sufficient precision. Similar changes can be made to the control device 200 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 by which the relative attitude | position of the 1st board | substrate part 71 and the 2nd board | substrate part 72 is decided by the contact of the electrolytic capacitor 72C and the thermal radiation component 71D. On the other hand, the control device 1B according to the modified example includes the circuit board 70 in which the relative posture between the first board portion 71 and the second board portion 72 is determined by the contact of an element other than the electrolytic capacitor 72C and an element other than the heat dissipation component 71D. Have. In short, the circuit board 70 is configured such that the elements on the first main surface 71A of the first substrate portion 71 and the elements on the second main surface 72A of the second substrate portion 72 are brought into contact with each other to contact the first substrate portion 71 and the second substrate portion. Any configuration that can determine a relative posture with respect to 72 may be used.

  -The control apparatus 1B of 1st Embodiment has the structure where each electrolytic capacitor 72C contacts each heat radiating component 71D. On the other hand, the control device 1B according to the modified example has a configuration in which one electrolytic capacitor 72C is in contact with the heat dissipating component 71D corresponding to the electrolytic capacitor 72C. The electrolytic capacitor 72C not in contact with the heat radiating component 71D is opposed to the heat radiating component 71D through a gap. Note that the control device 1B according to the modification may have a configuration in which no adhesive is interposed between the electrolytic capacitor 72C that does not contact the heat dissipation component 71D and the heat dissipation component 71D.

  In the control device 1B of the first embodiment, the attitude of the second substrate portion 72 relative to the first substrate portion 71 is determined by the elements of the first substrate portion 71 and the elements of the second substrate portion 72. On the other hand, as shown in FIG. 10, the control device 1 </ b> B according to the modified example has a second substrate portion with respect to the first substrate portion 71 by the positioning component 250 formed separately from the first substrate portion 71 and the second substrate portion 72. 72 postures are determined.

  As shown in FIG. 10A, the positioning component 250 includes a first fixing portion 251, a second fixing portion 252, and a positioning body 253. The positioning component 250 has a structure in which the first fixed portion 251, the second fixed portion 252, and the positioning main body 253 are integrally formed of the same resin material. The positioning component 250 regulates a change in relative posture between the first substrate portion 71 and the second substrate portion 72 in a state where the connecting portion 73 is bent.

  The first fixed portion 251 and the second fixed portion 252 have the same shape. Each of the fixed portions 251 and 252 is formed with slits 251A and 252A. The positioning body 253 has a bent shape.

  The first substrate portion 71 has a first insertion portion 71J. The first insertion portion 71J is formed as a through-hole penetrating in the thickness direction of the first substrate portion 71. The first fixed portion 251 is attached to the first main surface 71A by being inserted into the first insertion portion 71J. The second substrate portion 72 has a second insertion portion 72D. The second insertion portion 72 </ b> D is formed as a through-hole penetrating in the thickness direction of the second substrate portion 72. The second fixed portion 252 is attached to the second main surface 72A by being inserted into the second insertion portion 72D.

  Further, as shown in FIGS. 10B and 10C, the relative posture between the first substrate portion 71 and the second substrate portion 72 is changed by changing the shape of the positioning component 250. You can also. FIG. 10B shows a circuit board 70 having a structure in which an angle AG formed by the first substrate portion 71 and the second substrate portion 72 is larger than 90 °. FIG. 10C shows a circuit board 70 having a structure in which an angle AG formed by the first substrate portion 71 and the second substrate portion 72 is smaller than 90 °.

  -Control device 1B of a 1st embodiment has circuit board 70 formed as a multilayer printed circuit board with which a plurality of thermoplastic resin films were laminated. On the other hand, the control device 1B according to the modified example is a circuit board in which the first board portion 71 and the second board portion 72 are formed as a printed board having a thermosetting resin as a base material, and the connecting portion 73 is formed as a flexible printed board. 70. Similar changes can be made to the control device 200 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 in which the number of the thermoplastic resin films laminated | stacked in the 1st board | substrate part 71, the 2nd board | substrate part 72, and the connection part 73 are mutually equal. On the other hand, the control device 1B according to the modified example is a circuit board in which the number of thermoplastic resin films laminated in the connecting portion 73 is smaller than the number of thermoplastic resin films laminated in the first substrate portion 71 and the second substrate portion 72. 70. Similar changes can be made to the control device 200 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 which has the bus-bar connection part 74 and the resolver connection part 75. FIG. On the other hand, the control device 1B according to the modified example includes the circuit board 70 from which the bus bar connection portion 74 and the resolver connection portion 75 are omitted. The control device 1 </ b> B according to the modified example includes a connection circuit board (not shown) formed separately from the circuit board 70. The connection circuit board has a bus bar connection portion 74 and a resolver connection portion 75. The connection circuit board is electrically connected to the circuit board 70 by wire bonding or the like. The connection circuit board is fixed to a portion of the cover portion 62 that is different from the circuit board 70.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 which has the through hole 71E and the electroconductive part 71F. On the other hand, the control device 1B according to the modified example includes a circuit board 70 in which a heat dissipation component formed of a metal material is attached to the through hole 71E instead of the conductive portion 71F. Further, the control device 1B according to another modified example includes a circuit board 70 from which the through hole 71E and the conductive portion 71F are omitted. Similar changes can be made to the control device 200 of the second embodiment.

  -The circuit board 70 of 1st Embodiment has the structure by which the through-hole 71E is formed in the 1st board | substrate part 71. FIG. On the other hand, the circuit board 70 according to the modification has a configuration in which the through hole 71E is omitted from the first substrate portion 71. The first substrate portion 71 has a configuration in which a heat dissipating component formed separately from the heat dissipating component 71D as the first positioning element is attached on the first main surface 71A. The heat radiating component 71D is in contact with the upper surface of the heat radiating component. Similar changes can be made to the control device 200 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the circuit board 70 which has the thermal radiation component 71D in the 1st board | substrate part 71, and has the electrolytic capacitor 72C in the 2nd board | substrate part 72. FIG. On the other hand, the control device 1 </ b> B according to the modification includes a circuit board 70 having an electrolytic capacitor 72 </ b> C in the first board portion 71 and a heat dissipation component 71 </ b> D in the second board portion 72. Similar changes can be made to the control device 200 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure by which the upper end part of the 2nd board | substrate part 72 is not being fixed to the side wall 61 of the housing 60. FIG. On the other hand, as shown in FIG. 11, the control device 1 </ b> B according to the modification has a configuration in which the upper end portion of the second substrate portion 72 is fixed by the substrate support member 68 attached to the side wall 61 of the housing 60. The substrate support member 68 has a cylindrical shape. The substrate support member 68 is fixed to a portion of the side wall 61 of the housing 60 that faces the upper end portion of the second substrate portion 72. The second substrate portion 72 is fixed to the substrate support member 68 with bolts 69 with the second back surface 72 </ b> B in contact with the end surface of the substrate support member 68. According to this configuration, the upper end portion of the second substrate portion 72 is prevented from vibrating due to vibration or the like generated when the electric motor 1A (see FIG. 1) is driven.

  -The electric motor 1A of 1st Embodiment has the resolver 50 as a rotation position detection apparatus. On the other hand, the electric motor 1A according to the modification has a Hall IC instead of the resolver 50 as a rotational position detection device. Moreover, the electric motor 1A of another modified example has a configuration as a sensorless motor in which the rotational position detection device is omitted. The electric motor 1 </ b> A of another modification has a configuration in which the resolver support portion 64 is omitted from the housing 60 and the resolver connection portion 75 is omitted from the circuit board 70.

  DESCRIPTION OF SYMBOLS 1 ... Motor unit, 1B ... Control apparatus, 60 ... Housing, 70 ... Circuit board, 71 ... 1st board | substrate part, 71A ... 1st main surface, 71D ... Radiation component (1st positioning element), 71F ... Conductive part (heat dissipation) Parts), 72 ... second substrate portion, 72A ... second main surface, 72C ... electrolytic capacitor (second positioning element, circuit element), 73 ... connection portion, 200 ... control device, 210 ... circuit substrate, 211 ... first Substrate portion, 211A ... first main surface, 211C ... heat radiating component (first positioning element), 211E ... conductive portion (heat radiating component), 212 ... second substrate portion, 212A ... second main surface, 212B ... electrolytic capacitor (first 2 positioning element, circuit element), 213... Connecting part, 220... Housing, 250 .. positioning part, 251... First fixing part, 252.

Claims (6)

A control device having a circuit board and a housing,
The housing houses the circuit board;
The circuit board is
A first substrate portion having a first major surface;
A second substrate portion having a second major surface;
A connecting portion that connects the end portion of the first substrate portion and the end portion of the second substrate portion;
A first positioning element attached to the first main surface;
A change in the relative posture between the first substrate portion and the second substrate portion is regulated by contacting the first positioning element in a state in which the connection portion is bent and attached to the second main surface. A control device comprising: a second positioning element. The second substrate portion has a circuit element as the second positioning element on the second main surface,
The control device according to claim 1, wherein the first positioning element is made of a metal material and contacts the circuit element. The first substrate portion has a heat dissipation component;
The control device according to claim 2, wherein the first positioning element is in contact with the heat dissipation component. A control device having a circuit board and a housing,
The housing houses the circuit board;
The circuit board is
A first substrate portion having a first major surface;
A second substrate portion having a second major surface;
A connecting portion that connects the end portion of the first substrate portion and the end portion of the second substrate portion;
A first fixed portion attached to the first main surface; and a second fixed portion attached to the second main surface, wherein the first fixed portion is attached to the first main surface and the second fixed portion. Is attached to the second main surface, and a control device comprising a positioning component that regulates a change in relative posture between the first substrate portion and the second substrate portion when the connecting portion is bent. . The control device according to any one of claims 1 to 4, wherein the control device has a multilayer printed board formed of a thermoplastic resin film as the circuit board.   The motor unit provided with the control apparatus as described in any one of Claims 1-5.