JP2002319781A - Electronic part mounting module - Google Patents
Electronic part mounting moduleInfo
- Publication number
- JP2002319781A JP2002319781A JP2001122971A JP2001122971A JP2002319781A JP 2002319781 A JP2002319781 A JP 2002319781A JP 2001122971 A JP2001122971 A JP 2001122971A JP 2001122971 A JP2001122971 A JP 2001122971A JP 2002319781 A JP2002319781 A JP 2002319781A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- pattern
- mounting module
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子機器の内部
部品であるフリップチップ、ＣＳＰ（チップサイズパッ
ケージ）実装品等の電子部品をプリント基板に搭載して
なる電子部品実装モジュールに関し、特に、電子部品の
放熱構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting module in which electronic components such as flip-chip and CSP (chip size package) components, which are internal components of electronic equipment, are mounted on a printed circuit board. The present invention relates to a heat radiation structure for components.
【０００２】[0002]
【従来の技術】近年、プリント基板上へＬＳＩ部品を実
装してなるＬＳＩ実装モジュールは、図５に示すよう
に、プリント基板１の導体パターン２にＩＣベアチップ
３の端子４を対向させてバンプ５を介して実装し、回路
接続部を樹脂のシール材６でシールするフリップチップ
実装方式が一般に採用されている。フリップチップ実装
方式では、ＩＣベアチップ３の背面が上部を向いてお
り、断熱性の高い空気に露出すると放熱特性上不利にな
るため、ＰＤＰ（プラズマディスプレイパネル）ドライ
バＩＣ等の高発熱デバイス等では、図５に示すように、
ＩＣベアチップ３の背面にＡｌ板等の良熱伝導体からな
る放熱板７を熱伝導性接着剤８で接着することにより、
熱拡散させて放熱する方式が採用されている。2. Description of the Related Art In recent years, an LSI mounting module in which LSI components are mounted on a printed circuit board has a structure in which a terminal 4 of an IC bare chip 3 is opposed to a conductor pattern 2 of the printed circuit board 1 as shown in FIG. In general, a flip-chip mounting method in which a circuit connecting portion is sealed with a resin sealing material 6 is adopted. In the flip-chip mounting method, the back surface of the IC bare chip 3 faces upward, and when exposed to air having high heat insulation, it is disadvantageous in terms of heat radiation characteristics. Therefore, in a high heat generation device such as a PDP (plasma display panel) driver IC, As shown in FIG.
By bonding a heat radiating plate 7 made of a good thermal conductor such as an Al plate to the back surface of the IC bare chip 3 with a heat conductive adhesive 8,
A method of dissipating heat and dissipating heat is adopted.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うに構成されたＬＳＩ実装モジュールでは、ベアチップ
の背面にＡｌ等の放熱板を接着する方式であるため、放
熱板の重量がベアチップに直接加わり、ベアチップとプ
リント基板との接合部が破壊するという問題がある。特
に、プリント基板がフレキシブルプリント基板である場
合、基板及び基板上に形成された導電パターンが可撓性
を有するため、チップと基板との接合部の破壊の可能性
が更に増大するという問題がある。However, in the LSI mounting module configured as described above, since a heat radiating plate such as Al is adhered to the back surface of the bare chip, the weight of the heat radiating plate is directly added to the bare chip, and the bare chip There is a problem that the joint between the substrate and the printed circuit board is broken. In particular, when the printed board is a flexible printed board, the board and the conductive pattern formed on the board have flexibility, so that there is a problem that the possibility of breakage of the joint between the chip and the board is further increased. .
【０００４】本発明は、上記問題点に鑑みなされたもの
で、基板と電子部品との接合部に無理な荷重が加わるこ
とが無く、放熱特性及び信頼性に優れた電子部品実装モ
ジュールを提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an electronic component mounting module which does not apply an excessive load to a joint between a substrate and an electronic component and has excellent heat radiation characteristics and reliability. The purpose is to.
【０００５】[0005]
【課題を解決するための手段】本発明に係る電子部品実
装モジュールは、絶縁体からなるベース材の上に導電パ
ターンが形成されたプリント基板と、このプリント基板
に実装される電子部品とを備えた電子部品実装モジュー
ルにおいて、前記プリント基板は、前記電子部品が実装
される基板本体と、この基板本体から張り出して良熱伝
導体からなる放熱パターンが形成された張り出し部とを
有し、前記張り出し部は、前記基板本体に対して折り返
されて前記放熱パターンが前記電子部品と熱的に接して
放熱部を形成してなることを特徴とする。An electronic component mounting module according to the present invention includes a printed circuit board having a conductive pattern formed on a base material made of an insulator, and an electronic component mounted on the printed circuit board. In the electronic component mounting module, the printed board has a board main body on which the electronic component is mounted, and an overhanging portion formed from a good heat conductor and extending from the board main body. The part is folded back on the substrate body, and the heat radiation pattern is in thermal contact with the electronic component to form a heat radiation part.
【０００６】本発明によれば、プリント基板が、電子部
品が実装される基板本体と、この基板本体から張り出す
張り出し部とを備えて構成され、張り出し部には、良熱
伝導体からなる放熱パターンを形成し、この張り出し部
が基板本体に対して折り返されて前記放熱パターンが電
子部品と熱的に接して放熱部を形成するようにしている
ので、電子部品で発生した熱は、張り出し部の放熱パタ
ーンを介して放熱される。そして、電子部品には、ベー
ス材と放熱パターンからなる張り出し部の荷重しか加わ
らないので、電子部品と基板本体との接合部の荷重によ
る破壊の発生がなく、十分な放熱特性を維持しつつ、基
板と実装部品との接合信頼性を向上させることができ
る。According to the present invention, a printed circuit board is provided with a board main body on which electronic components are mounted, and an overhang portion protruding from the board main body. A pattern is formed, and the overhanging portion is folded back with respect to the substrate body so that the heat dissipation pattern is in thermal contact with the electronic component to form a heat dissipation portion. Is dissipated through the heat radiation pattern. And, since only the load of the overhang portion composed of the base material and the heat radiation pattern is applied to the electronic component, there is no occurrence of destruction due to the load of the joint portion between the electronic component and the substrate body, while maintaining sufficient heat radiation characteristics, It is possible to improve the bonding reliability between the substrate and the mounted component.
【０００７】なお、張り出し部が、ベース材の放熱パタ
ーンと反対側の面に放熱パターンとスルーホールを介し
て接続された良熱伝導体からなる背面放熱パターンを更
に形成してなるものであると、電子部品での発熱は、放
熱パターンとその裏側の背面放熱パターンの両方を介し
て発散されるので、更に放熱特性を向上させることがで
きる。[0007] It is preferable that the overhanging portion further includes a back surface heat radiation pattern made of a good heat conductor connected to the heat radiation pattern through a through hole on a surface of the base material opposite to the heat radiation pattern. In addition, heat generated in the electronic component is radiated through both the heat radiation pattern and the rear heat radiation pattern on the back side of the electronic component, so that the heat radiation characteristics can be further improved.
【０００８】また、基板本体の電子部品が搭載された面
とは反対側の面に良熱伝導体からなる放熱板を添設し、
基板本体上に放熱パターンから放熱板と対向する位置に
延びる熱伝達パターンを形成し、この熱伝達パターンと
放熱板とをスルーホールで接続するように構成すると、
電子部品での発熱は、放熱パターン、熱伝達パターン及
び放熱板を介して放熱されるので、電子部品に放熱板の
荷重が直接加わることなく、放熱板を接続したのと同等
の放熱特性を得ることができる。In addition, a heat radiating plate made of a good heat conductor is provided on the surface of the substrate body opposite to the surface on which the electronic components are mounted,
Forming a heat transfer pattern extending from the heat dissipation pattern to a position facing the heat sink on the substrate body, and connecting the heat transfer pattern and the heat sink with through holes,
The heat generated by the electronic component is radiated through the heat radiation pattern, the heat transfer pattern, and the heat radiating plate, so that a heat radiation characteristic equivalent to connecting the heat radiating plate is obtained without directly applying the load of the heat radiating plate to the electronic component. be able to.
【０００９】[0009]
【発明の実施の形態】以下、この発明の好ましい実施の
形態を説明する。図１は、本発明の第１の実施形態に係
る電子部品実装モジュールの構成を示す図で、同図
（ａ）はフレキシブルプリント基板を展開した状態の平
面図、同図（ｂ）は完成状態の平面図、同図（ｃ）は同
図（ｂ）のＡ−Ａ′断面図である。この電子部品実装モ
ジュールは、ポリイミド、ポリエチレンテレフタレート
等の可撓性樹脂からなるベースフィルム１１の上に銅箔
からなる導電パターン１２及び放熱パターン１３が形成
されたフレキシブルプリント基板１０と、このフレキシ
ブルプリント基板１０の導電パターン１２上に実装され
たＩＣベアチップ２０や図示しないコンデンサ等の電子
部品とからなる。ＩＣベアチップ２０は、その回路面を
フレキシブルプリント基板１０の導電パターン１２に対
向させてバンプ２１を介して実装される。ＩＣベアチッ
プ２０と導電パターン１２との接合部は樹脂のシール材
２２でシールされる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a view showing the configuration of an electronic component mounting module according to a first embodiment of the present invention. FIG. 1 (a) is a plan view showing a state in which a flexible printed board is developed, and FIG. 1 (b) is a completed state. (C) is a cross-sectional view taken along the line AA 'in (b) of FIG. The electronic component mounting module includes a flexible printed board 10 having a conductive pattern 12 made of copper foil and a heat radiation pattern 13 formed on a base film 11 made of a flexible resin such as polyimide or polyethylene terephthalate. It comprises electronic components such as an IC bare chip 20 mounted on the ten conductive patterns 12 and a capacitor (not shown). The IC bare chip 20 is mounted via bumps 21 with its circuit surface facing the conductive pattern 12 of the flexible printed circuit board 10. The joint between the IC bare chip 20 and the conductive pattern 12 is sealed with a resin sealing material 22.
【００１０】一方、フレキシブルプリント基板１０は、
ＩＣベアチップ２０が実装されると共に、導電パターン
１２が形成された矩形状の基板本体１４と、この基板本
体１４のＩＣベアチップ２０が実装された部分の両側か
ら側方に延びる張り出し部１５とからなる。両張り出し
部１５に形成された放熱パターン１３は、例えば銅箔に
Ａｕメッキを施して形成された良熱伝導体からなるグラ
ンドプレーンで、例えば図示のように４つのＩＣベアチ
ップ１２が一直線上に並んで実装されている場合、張り
出し部１５を基板本体１４側に折り曲げたときにＩＣベ
アチップ２０を２つずつ覆うのに十分な広さに形成され
ている。On the other hand, the flexible printed circuit board 10
It comprises a rectangular substrate body 14 on which the IC bear chip 20 is mounted and on which the conductive pattern 12 is formed, and an overhang 15 extending laterally from both sides of the portion of the substrate body 14 on which the IC bear chip 20 is mounted. . The heat radiation pattern 13 formed on both overhang portions 15 is a ground plane made of a good thermal conductor formed by, for example, applying Au plating to a copper foil. For example, four IC bare chips 12 are arranged in a straight line as shown in the figure. When the overhang 15 is bent toward the substrate body 14, it is formed wide enough to cover the IC bare chips 20 two by two.
【００１１】このような電子部品実装モジュールでは、
フレキシブルプリント基板１０にＩＣベアチップ２０な
どの電子部品を実装したのち、両側の張り出し部１５の
放熱パターン１３が形成された面にシリコーン樹脂、ア
クリル樹脂、Ａｇ，Ｃｕペースト等の熱伝導性接着剤１
６を塗布して、両側の張り出し部１５を内側に１８０°
折り返す。そして、放熱パターン１３を熱伝導性接着剤
１６を介してＩＣベアチップ２０の背面と熱的に接触さ
せて熱伝導性接着剤１６を硬化させれば、モジュールが
完成する。In such an electronic component mounting module,
After mounting electronic components such as an IC bare chip 20 on the flexible printed circuit board 10, a heat conductive adhesive 1 such as silicone resin, acrylic resin, Ag, Cu paste, etc.
6 and apply overhangs 15 on both sides 180 °
Turn back. Then, the heat radiation pattern 13 is brought into thermal contact with the back surface of the IC bare chip 20 via the heat conductive adhesive 16 to cure the heat conductive adhesive 16, thereby completing the module.
【００１２】この実施形態に係るＦＰＣによれば、ＩＣ
ベアチップ２０での発熱を、その背面に熱伝導性接着剤
１６によって接着された面積の広い放熱パターン１３に
よって発散させて放熱させることができる。この場合、
Ａｌ板等の放熱板を使用せず、配線基板の一部を放熱部
として用いることにより、モジュール全体の軽薄化、コ
スト削減及び放熱板の加重による接合部破壊の回避が可
能になる。According to the FPC of this embodiment, the IC
The heat generated by the bare chip 20 can be radiated and radiated by the heat radiation pattern 13 having a large area adhered to the rear surface thereof by the heat conductive adhesive 16. in this case,
By using a part of the wiring board as a heat radiating portion without using a heat radiating plate such as an Al plate, it is possible to reduce the weight of the entire module, reduce the cost, and avoid the joint breakage due to the weight of the heat radiating plate.
【００１３】図２は、本発明の第２の実施形態に係る電
子部品実装モジュールの構成を示す図で、同図（ａ）は
フレキシブルプリント基板を展開した状態の平面図、同
図（ｂ）は完成状態の平面図、同図（ｃ）は同図（ｂ）
のＢ−Ｂ′断面図である。なお、図２において図１と同
一部分には同一符号を付して重複する部分の説明は割愛
する。この実施形態では、基板本体１４のＩＣベアチッ
プ２０が実装された部分の両側面から基板本体１４の上
端を取り囲むように張り出し部３１が形成されている。
張り出し部３１には、張り出し部３１を上から下に折り
返した際に、４つのＩＣベアチップ２０を覆うのに十分
な広さの放熱パターン３２が形成されている。このよう
な形態であっても、先の実施形態に係る電子部品実装モ
ジュールと同様の効果を奏する。FIG. 2 is a view showing a configuration of an electronic component mounting module according to a second embodiment of the present invention. FIG. 2A is a plan view showing a state in which a flexible printed board is expanded, and FIG. Is a plan view of the completed state, and FIG.
BB 'sectional drawing of FIG. In FIG. 2, the same portions as those in FIG. 1 are denoted by the same reference numerals, and the description of the overlapping portions will be omitted. In this embodiment, overhang portions 31 are formed so as to surround the upper end of the substrate main body 14 from both sides of the portion of the substrate main body 14 where the IC bare chip 20 is mounted.
A heat radiation pattern 32 having a sufficient width to cover the four IC bear chips 20 when the overhang portion 31 is folded from top to bottom is formed on the overhang portion 31. Even in such a mode, the same effects as those of the electronic component mounting module according to the above embodiment can be obtained.
【００１４】図３は、本発明の第３の実施形態に係る電
子部品実装モジュールの構成を示す図で、同図（ａ）は
フレキシブルプリント基板を展開した状態の平面図、同
図（ｂ）は要部の断面図である。なお、図３において図
１と同一部分には同一符号を付して重複する部分の説明
は割愛する。この実施形態では、基板本体１４から張り
出す張り出し部４１の両面に放熱パターン４２及び裏面
放熱パターン４３を形成し、これらをスルーホール４４
を介して連結したものである。FIG. 3 is a view showing the configuration of an electronic component mounting module according to a third embodiment of the present invention. FIG. 3A is a plan view showing a state in which a flexible printed board is developed, and FIG. Is a sectional view of a main part. In FIG. 3, the same portions as those in FIG. 1 are denoted by the same reference numerals, and the description of the overlapping portions will be omitted. In this embodiment, a heat radiation pattern 42 and a back surface heat radiation pattern 43 are formed on both surfaces of a projecting portion 41 projecting from the substrate
Are connected via a.
【００１５】この実施形態によれば、放熱パターンがベ
ースフィルム１１の両面に形成され、これら放熱パター
ン４２，４３がスルーホール４４を介して接続されてい
るので、放熱特性を先の実施例の約２倍とすることがで
きる。また、この構造であると、裏面放熱パターン４３
に更に放熱板を接着することもでき、この場合、放熱特
性は更に向上する。According to this embodiment, since the heat radiation patterns are formed on both sides of the base film 11 and these heat radiation patterns 42 and 43 are connected through the through holes 44, the heat radiation characteristics can be reduced to about the same as in the previous embodiment. It can be doubled. Also, with this structure, the backside heat radiation pattern 43
In this case, a heat radiating plate can be further adhered.
【００１６】図４は、本発明の第４の実施形態に係る電
子部品実装モジュールの構成を示す図で、同図（ａ）は
フレキシブルプリント基板を展開した状態の平面図、同
図（ｂ）は要部の断面図である。なお、図４において図
１と同一部分には同一符号を付して重複する部分の説明
は割愛する。この実施形態では、張り出し部５１に形成
された放熱パターン５２から熱伝達パターン５３が、基
板本体１４の一端に形成された出力パターン５４の近傍
まで延び、出力パターン５４の裏面に形成された裏面放
熱パターン５５にスルーホール５６を介して接続されて
いる。そして、裏面放熱パターン５５に、補強板として
も機能するＡｌ等の放熱板５７を添設している。FIG. 4 is a view showing a configuration of an electronic component mounting module according to a fourth embodiment of the present invention. FIG. 4A is a plan view showing a state in which a flexible printed board is expanded, and FIG. Is a sectional view of a main part. In FIG. 4, the same portions as those in FIG. 1 are denoted by the same reference numerals, and the description of the overlapping portions will be omitted. In this embodiment, the heat transfer pattern 53 extends from the heat radiation pattern 52 formed on the overhang portion 51 to the vicinity of the output pattern 54 formed on one end of the substrate body 14, and the heat radiation pattern 53 formed on the rear surface of the output pattern 54 It is connected to the pattern 55 via a through hole 56. Further, a heat radiating plate 57 made of Al or the like, which also functions as a reinforcing plate, is attached to the back surface heat radiating pattern 55.
【００１７】この構成によれば、張り出し部５１を基板
本体１４側に折り返して放熱パターン５２とＩＣベアチ
ップ２０とを接触させることで、ＩＣベアチップ２０で
発生した熱が、放熱パターン５２、熱伝達パターン５
３、スルーホール５６、裏面放熱パターン５５、放熱板
５７を介して放熱される。このように構成することで、
ＩＣベアチップ２０に放熱板５７の荷重を加えることな
く、放熱板による高い放熱特性が実現できる。According to this configuration, the heat generated by the IC bear chip 20 is transferred to the heat transfer pattern 52 and the heat transfer pattern 5
3, heat is radiated through the through hole 56, the backside heat radiation pattern 55, and the heat radiation plate 57. With this configuration,
Without applying a load of the heat radiating plate 57 to the IC bare chip 20, high heat radiating characteristics by the heat radiating plate can be realized.
【００１８】なお、本発明は、ＰＤＰモジュールの他、
発熱量が大きいバンプ実装品（フリップチップ、ＣＳＰ
（チップサイズパッケージ）実装品等）に適用可能であ
る。また、本発明は、上述したＦＰＣに限らず、多層板
等のＲＰＣ（リジットプリント回路）においても、張り
出し部の折り曲げ部を部分的に屈曲可能な構成とするこ
とにより適用可能となる。The present invention provides a PDP module,
Bump mounting products that generate a large amount of heat (flip chip, CSP
(Chip size package) mounted products). In addition, the present invention is not limited to the above-described FPC, but can be applied to an RPC (rigid printed circuit) such as a multilayer board by making the bent portion of the overhang portion partially bendable.
【００１９】[0019]
【発明の効果】以上のように、本発明によれば、プリン
ト基板が、電子部品が実装される基板本体と、この基板
本体から張り出す張り出し部とを備えて構成され、張り
出し部には、良熱伝導体からなる放熱パターンを形成
し、この張り出し部が基板本体に対して折り返されて前
記放熱パターンが電子部品と熱的に接して放熱部を形成
するようにしているので、電子部品と基板本体との接合
部の荷重による破壊の発生がなく、十分な放熱特性を維
持しつつ、基板と実装部品との接合信頼性を向上させる
ことができる。As described above, according to the present invention, the printed circuit board is provided with the board body on which the electronic components are mounted, and the overhanging portion protruding from the board body. A heat radiation pattern made of a good heat conductor is formed, and the overhang portion is folded back with respect to the substrate body so that the heat radiation pattern is in thermal contact with the electronic component to form a heat radiation portion. It is possible to improve the bonding reliability between the board and the mounted component while maintaining sufficient heat radiation characteristics without causing breakage due to the load of the bonding portion with the board body.
【図１】 本発明の第１の実施形態に係る電子部品実装
モジュールを示す図で、同図（ａ）は一部を展開した平
面図、同図（ｂ）は平面図、同図（ｃ）は（ｂ）のＡ−
Ａ′断面図である。FIGS. 1A and 1B are views showing an electronic component mounting module according to a first embodiment of the present invention, wherein FIG. 1A is a partially expanded plan view, FIG. 1B is a plan view, and FIG. ) Is A- of (b).
It is A 'sectional drawing.
【図２】 本発明の第２の実施形態に係る電子部品実装
モジュールを示す図で、同図（ａ）は一部を展開した平
面図、同図（ｂ）は平面図、同図（ｃ）は（ｂ）のＢ−
Ｂ′断面図である。FIGS. 2A and 2B are views showing an electronic component mounting module according to a second embodiment of the present invention, wherein FIG. 2A is a partially expanded plan view, FIG. 2B is a plan view, and FIG. ) Is B- of (b).
It is B 'sectional drawing.
【図３】 本発明の第３の実施形態に係る電子部品実装
モジュールを示す図で、同図（ａ）は一部を展開した平
面図、同図（ｂ）は要部の断面図である。3A and 3B are views showing an electronic component mounting module according to a third embodiment of the present invention, wherein FIG. 3A is a partially expanded plan view and FIG. 3B is a cross-sectional view of a main part. .
【図４】 本発明の第４の実施形態に係る電子部品実装
モジュールを示す図で、同図（ａ）は一部を展開した平
面図、同図（ｂ）はＣ−Ｃ′断面図である。4A and 4B are views showing an electronic component mounting module according to a fourth embodiment of the present invention, wherein FIG. 4A is a partially expanded plan view, and FIG. is there.
【図５】 従来のフリップチップ実装方式による電子部
品実装モジュールの断面図である。FIG. 5 is a cross-sectional view of an electronic component mounting module using a conventional flip-chip mounting method.
１…プリント基板、２，１２…導電パターン、３，２０
…ＩＣベアチップ、５，２１…バンプ、６，２２…シー
ル材、７…放熱板、８，１６…熱伝導性接着剤、１０…
フレキシブルプリント基板、１１…ベースフィルム、１
３，３２，４２，５２…放熱パターン、１４…基板本
体、１５，３１，４１，５１…張り出し部、４３，５５
…裏面放熱パターン、４４，５６…スルーホール、５３
…熱伝達パターン、５４…出力パターン。1: printed circuit board, 2, 12: conductive pattern, 3, 20
... IC bare chip, 5,21 ... Bump, 6,22 ... Seal material, 7 ... Heat radiation plate, 8,16 ... Heat conductive adhesive, 10 ...
Flexible printed circuit board, 11 ... base film, 1
3, 32, 42, 52: heat radiation pattern, 14: substrate body, 15, 31, 41, 51 ... overhang, 43, 55
... heat radiation pattern on the back, 44, 56 ... through-hole, 53
... heat transfer pattern, 54 ... output pattern.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/18 Ｈ０１Ｌ 23/36 Ｄ Ｆターム(参考） 5E322 AA11 AB06 EA11 FA04 FA06 5E336 AA04 BB01 BB12 BB15 BC21 CC31 CC58 DD28 EE01 EE05 EE07 GG03 5E338 AA01 AA12 BB51 BB54 BB65 BB71 CC06 CC08 CD22 CD24 EE02 EE24 5F036 AA01 BA04 BA23 BB08 BB21 BC05 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) H05K 1/18 H01L 23/36 DF term (reference) 5E322 AA11 AB06 EA11 FA04 FA06 5E336 AA04 BB01 BB12 BB15 BC21 CC31 CC58 DD28 EE01 EE05 EE07 GG03 5E338 AA01 AA12 BB51 BB54 BB65 BB71 CC06 CC08 CD22 CD24 EE02 EE24 5F036 AA01 BA04 BA23 BB08 BB21 BC05
Claims (4)
ーンが形成されたプリント基板と、 このプリント基板に実装される電子部品とを備えた電子
部品実装モジュールにおいて、 前記プリント基板は、前記電子部品が実装される基板本
体と、この基板本体から張り出して良熱伝導体からなる
放熱パターンが形成された張り出し部とを有し、前記張
り出し部は、前記基板本体に対して折り返されて前記放
熱パターンが前記電子部品と熱的に接して放熱部を形成
してなることを特徴とする電子部品実装モジュール。1. An electronic component mounting module comprising: a printed board on which a conductive pattern is formed on a base material made of an insulator; and an electronic component mounted on the printed board. It has a substrate main body on which components are mounted, and an overhanging portion overhanging from the substrate main body and formed with a heat radiation pattern made of a good heat conductor, wherein the overhanging portion is folded back with respect to the substrate main body to release the heat radiation. An electronic component mounting module, wherein the pattern is in thermal contact with the electronic component to form a heat radiating portion.
放熱パターンと反対側の面に前記放熱パターンとスルー
ホールを介して接続された良熱伝導体からなる背面放熱
パターンを更に形成してなるものであることを特徴とす
る請求項１記載の電子部品実装モジュール。2. The overhanging portion further includes a back surface heat radiation pattern made of a good heat conductor connected to the heat radiation pattern via a through hole on a surface of the base material opposite to the heat radiation pattern. The electronic component mounting module according to claim 1, wherein the electronic component mounting module is a module.
た面とは反対側の面に良熱伝導体からなる放熱板を添設
し、前記基板本体上に前記放熱パターンから前記放熱板
に対向する位置に延びる熱伝達パターンを形成し、この
熱伝達パターンと前記放熱板とをスルーホールで接続し
てなることを特徴とする請求項１記載の電子部品実装モ
ジュール。3. A heat radiating plate made of a good heat conductor is attached to a surface of the substrate body opposite to a surface on which the electronic component is mounted, and a heat radiating plate is provided on the substrate body from the heat radiating pattern. 2. The electronic component mounting module according to claim 1, wherein a heat transfer pattern extending to a position facing the heat transfer pattern is formed, and the heat transfer pattern is connected to the heat radiating plate by a through hole.
ント基板であることを特徴とする請求項１〜３のいずれ
か１項記載の電子部品実装モジュール。4. The electronic component mounting module according to claim 1, wherein the printed board is a flexible printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001122971A JP2002319781A (en) | 2001-04-20 | 2001-04-20 | Electronic part mounting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001122971A JP2002319781A (en) | 2001-04-20 | 2001-04-20 | Electronic part mounting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002319781A true JP2002319781A (en) | 2002-10-31 |
Family
ID=18972599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001122971A Pending JP2002319781A (en) | 2001-04-20 | 2001-04-20 | Electronic part mounting module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002319781A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004271819A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Electro-optical device, projection display device, and electronic equipment |
| KR100739152B1 (en) * | 2006-02-27 | 2007-07-13 | 엘지전자 주식회사 | Flexible substrate and plasma display apparatus using the same |
| JP2007199393A (en) * | 2006-01-26 | 2007-08-09 | Nec Lcd Technologies Ltd | Liquid crystal display device |
| JP2010507179A (en) * | 2006-10-11 | 2010-03-04 | 日東電工株式会社 | Heat transfer device for hard drive preamplifier |
| WO2013130363A1 (en) * | 2012-03-02 | 2013-09-06 | General Electric Company | Flexible cable for low profile electrical device |
| JP2013232511A (en) * | 2012-04-27 | 2013-11-14 | Jtekt Corp | Control device and motor unit including the same |
| CN103532300A (en) * | 2012-07-03 | 2014-01-22 | 株式会社捷太格特 | Control device and motor unit including the control device |
| JP2019140365A (en) * | 2018-02-13 | 2019-08-22 | ▲き▼邦科技股▲分▼有限公司 | Thin film flip chip package and flexible substrate thereof |
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2001
- 2001-04-20 JP JP2001122971A patent/JP2002319781A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004271819A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Electro-optical device, projection display device, and electronic equipment |
| JP2007199393A (en) * | 2006-01-26 | 2007-08-09 | Nec Lcd Technologies Ltd | Liquid crystal display device |
| KR100739152B1 (en) * | 2006-02-27 | 2007-07-13 | 엘지전자 주식회사 | Flexible substrate and plasma display apparatus using the same |
| JP2010507179A (en) * | 2006-10-11 | 2010-03-04 | 日東電工株式会社 | Heat transfer device for hard drive preamplifier |
| US8213125B2 (en) | 2006-10-11 | 2012-07-03 | Nitto Denko Corporation | Heat transfer for a hard-drive pre-amp |
| US8434223B2 (en) | 2006-10-11 | 2013-05-07 | Nitto Denko Corporation | Method for manufacturing a substrate supporting an integrated circuit chip |
| WO2013130363A1 (en) * | 2012-03-02 | 2013-09-06 | General Electric Company | Flexible cable for low profile electrical device |
| US8859909B2 (en) | 2012-03-02 | 2014-10-14 | Amphenol Thermometrics, Inc. | Flexible cable for low profile electrical device |
| CN104704928A (en) * | 2012-03-02 | 2015-06-10 | 通用电气公司 | Flexible cable for low profile electrical device |
| JP2013232511A (en) * | 2012-04-27 | 2013-11-14 | Jtekt Corp | Control device and motor unit including the same |
| CN103532300A (en) * | 2012-07-03 | 2014-01-22 | 株式会社捷太格特 | Control device and motor unit including the control device |
| JP2014013799A (en) * | 2012-07-03 | 2014-01-23 | Jtekt Corp | Control device and motor unit including the same |
| US9398724B2 (en) | 2012-07-03 | 2016-07-19 | Jtekt Corporation | Control device and motor unit including the control device |
| JP2019140365A (en) * | 2018-02-13 | 2019-08-22 | ▲き▼邦科技股▲分▼有限公司 | Thin film flip chip package and flexible substrate thereof |
| US10580729B2 (en) | 2018-02-13 | 2020-03-03 | Chipbond Technology Corporation | Chip on film package and flexible substrate thereof |
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