KR100739152B1 - Flexible substrate and plasma display apparatus using the same - Google Patents

Abstract

A flexible substrate and a plasma display apparatus using the same are provided to improve reliability by reducing an operation temperature of a chip formed on a substrate by including a thermal diffusion pattern in a substrate base. A flexible substrate base(100) has both end parts connected to an external substrate. A chip connection pad part(150) is formed on the top of the flexible substrate base. An interconnection line part is connected to the chip connection pad part and has an end part where an external substrate connection pad is formed. A first heat dissipation pattern includes at least a part of chip installation space from the chip connection pad part. A second heat dissipation pattern is connected to the first heat dissipation pattern, and is extended to one side of both end parts of the flexible substrate base to be connected to the external substrate.

Description

FLEXIBLE SUBSTRATE AND PLASMA DISPLAY APPARATUS USING THE SAME}

1 is a plan view showing a connection structure between a plasma display panel and a driving substrate.

2 is a plan view showing a substrate wiring structure of a typical tape carrying package.

Figure 3 is a photograph showing the structure of a typical tape carrying package.

Figure 4 is a plan view showing the structure of a tape carrying package according to an embodiment of the present invention.

5 is a plan view showing the structure of a tape carrying package according to another embodiment of the present invention.

Figure 6 is a plan view showing the structure of a tape carrying package according to another embodiment of the present invention.

*** Explanation of symbols for main parts of drawing ***

10: plasma display device 20: plasma display panel

30: drive board 40: tape carrying package

100: tape carrying package 110: substrate base

120: heat dissipation pattern 125: lower chip heat dissipation pattern

130: panel side wiring 140: driver board side wiring

150, 151, 152: chip connection pad

The present invention relates to a flexible substrate and a plasma display apparatus using the same, and more particularly, to a flexible substrate and a plasma display apparatus using the same to improve heat generation characteristics by configuring a heat radiation pattern on the flexible substrate having a heat generating source.

As is generally known, a plasma display panel (PDP) discharges a gas injected in a discharge cell isolated by a barrier rib, and the ultraviolet rays generated therein excite phosphors of R, G, and B. By emitting light. Such a simple structure makes it easy to manufacture, high brightness and high light emission efficiency, memory function, high non-linearity, wide viewing angle of more than 160 °, such as a large display device has been spotlighted.

1 illustrates a schematic structure of a general plasma display apparatus 10. As shown in FIG. 1, a plasma display panel 20 having electrodes exposed thereon and a driving substrate 30 for providing a driving voltage to the panel 20 are shown. ), And a tape carrier package (hereinafter referred to as TCP) 40, which is a type of flexible substrate that connects electrodes for each cell of the panel 20 and the driving substrate 30. Has An electrical and physical connection between the plasma display panel 20 and the TCP 40 and an electrical and physical connection between the TCP 40 and the driving substrate 30 may be referred to as an anisotropic conductive film (ACF). use.

FIG. 2 shows the structure of the TCP 40 on which the driving driver chip is mounted while in charge of the connection between the plasma display panel 20 and the driving substrate 30. As shown in FIG. 4, the basic configuration of the specific plasma display panel 20 may include a wiring 43 densely arranged on the flexible substrate 42, and connected to the wiring 43 to receive power from the driving substrate 30. It consists of a drive driver chip 41 provided to an electrode. In general, since the driving driver chip 41 receives a small number of voltages and driving control signals, the driving driver chip 41 alternately outputs a large number of signals having high power, and thus the number of wirings connected to the driving substrate 30 is small. The number of wirings connected to the plasma display panel 20 side is large. Therefore, the wirings of the driving driver chip 41 may be connected by utilizing the space on the driving substrate 30 side, so that the wiring 43 is not separated by a boundary of the center of the driving driver chip 41. This is most often the case.

3 is a photograph showing the structure of a TCP applied to an actual plasma display apparatus. As shown in FIG. 3, two driving drivers are mounted, and a limited width having a width similar to that of a wiring connected to the plasma display panel 20 is shown. According to the TCP structure, the wiring can be arranged freely using various possible areas.

As described above, the TCP in which the driver driver chip is mounted is widely applied to a plasma display device, an LCD display device, or another type of flexible substrate display device. However, unlike LCDs that are driven at low voltages of 10V or less, the plasma display driving device uses a high current for discharging while driving at high voltages ranging from 60 to 100V as data signals and 180 to 220V as sustain signals. The power to which the wiring 43 formed on the 42 flows and the power to be driven by the driving driver chip 41 formed on the flexible substrate 42 are increased. This raises the driving temperature of the driving driver chip 41. The generated heat is transferred through the wiring 43 arranged by utilizing the flexible substrate 42 and the entire area of the flexible substrate 42 thereon. Although it should be transferred to the connected plasma display panel 20 or the driving substrate 30 side, the thermal contact portion with the driving driver chip 41 is limited, and thus it is difficult to effectively transfer heat generated by the driving driver chip 41. Therefore, complementary measures, such as mounting a separate heat sink and fan structure on the TCP 40, are carried out.

As described above, an object of the present invention, which is newly proposed to dissipate heat generated from a chip on a flexible substrate to the outside, is to increase the substrate base size of the flexible substrate, and to intermediate the mounting space of the chip disposed on the substrate base. By further including a portion and a heat dissipation pattern extended to be connected to the external substrate for heat diffusion, by including a heat diffusion pattern in the substrate base itself lowers the driving temperature of the chip formed on the substrate reliability To provide a flexible substrate and a plasma display device using the same to increase the.

Another object of the embodiments of the present invention is to form at least one pattern including at least one lower portion of the chip mounted on the flexible substrate and extending to at least one connection portion of the flexible substrate, whereby the chip formed on the flexible substrate is generated. It is to provide a flexible substrate that can easily dissipate the heat to lower the driving temperature and simplify the additional heat dissipation structure.

Another object of the embodiment of the present invention is to provide a heat dissipation pattern for dissipating the heat of the chip mounted on the flexible board to the connection side of the flexible board only by changing the mask to be used when performing wiring patterning on the flexible board. By forming together with, to provide a flexible substrate to increase the limit allowable current value of the flexible substrate by increasing the heat dissipation efficiency at no extra cost.

Another object of the embodiment of the present invention is to apply a flexible substrate with a heat radiation pattern between the panel and the driving substrate, thereby effectively dissipating heat from the flexible substrate with a large amount of heat, thereby improving the operation stability and reliability of the product and reducing the heat dissipation cost. To provide a device.

In order to achieve the above object, the flexible substrate according to an embodiment of the present invention includes a flexible substrate base configured in the form that the external substrate and both ends are connected; A chip connection pad part formed on the flexible substrate base; A wiring part extending from the chip connection pad part and having an external substrate connection pad formed at an end thereof; A first heat dissipation pattern including at least a portion of a chip mounting space between the chip connection pads; And a second heat dissipation pattern connected to the first heat dissipation pattern and extending to at least one side of both ends of the flexible substrate base to be connected to the external substrate.

In addition, the plasma display device using a flexible substrate according to another embodiment of the present invention, the plasma display panel having a connection electrode; A substrate including a driving circuit and an electrode for driving the plasma display panel; And a flexible substrate electrically connecting the electrodes of the plasma display panel and the electrodes of the substrate on which the driving circuit is configured, through the wiring and the mounted chip, wherein the flexible substrate is separate from the wiring, and the lower region of the mounted chip. A first heat dissipation pattern comprising at least a portion of the first heat dissipation pattern; And a second heat dissipation pattern connected to the first heat dissipation pattern and extending to a connection region with the substrate including the plasma display panel or the driving circuit.

Embodiments of the present invention as described above will be described in detail with reference to the accompanying drawings.

4 illustrates a structure of an embodiment of the present invention, and as shown, a structure in which a heat dissipation pattern 120 is further configured on a tape carrier package (TCP) 100, which is a kind of flexible substrate, may be confirmed.

That is, the structure is a wire 130 having a flexible substrate base 100 defined according to the size and length of the both ends of the polyimide to be connected to the external substrate and an external connection pad formed on the flexible substrate base 100. , 140, a chip connection pad 150 formed on the wires 130 and 140, and a space between the chip connection pad 150 and an outer portion of the wires 130 and 140 for driving driver chip connection. It consists of a heat radiation pattern 120 surrounding.

In general, the wirings 130 and 140 are connected to the driving driver chip mounted thereon, and are disposed by utilizing all possible flexible substrate bases 100, so that the wirings 130 and 140 are based on the wiring convenience regardless of the arrangement position of the driving driver chip. There is a tendency for the work (Artwork) to be implemented, it is not possible to implement the heat radiation pattern 120 as shown. Therefore, in the present exemplary embodiment, the driving substrate side wiring 140 and the display panel connection side wiring 130 are divided based on the arrangement position of the driving driver chip, which is a heating element, and the chip connection pad 150 on which the driving driver chip is to be mounted. After the chip heat dissipation pattern 125 is formed in the empty space therebetween, the corresponding pattern is configured to be connected to the heat dissipation pattern 120. In addition, the heat dissipation pattern 120 includes the flexible substrate base 100 having at least one side connected to an external substrate side so that the heat dissipation pattern 125 of the lower chip may quickly propagate heat from the chip to the external substrate side. Extend to one side of both ends of. The illustrated structure is an ideal structure, in which the heat dissipation pattern 120 is connected to both ends of the flexible substrate base 100.

In addition, while adhering to the width and length of the limited flexible substrate base 100 or increasing the width slightly so that the external extension pad of the heat dissipation pattern is located, the surplus space is configured in the middle area to maximize the heat dissipation pattern in the surplus space. By forming 120, the possibility of releasing heat into the air is increased.

In general, when wiring is formed on the flexible substrate base 100, a copper (Cu) sheet is laminated on the polyimide flexible substrate base 100, and then patterned using a wiring-shaped mask. By changing the structure, the heat radiation pattern 120 may be formed all at once. In other words, it is possible to increase the heat dissipation efficiency only by a simple process without additional manufacturing cost.

The reason why the wiring is used as copper is because copper is a soft metal having high electrical conductivity and is easy to be processed and easily bent together with the flexible substrate. In addition, the copper is preferably a material having a higher thermal conductivity than aluminum, which is a widely used heat sink material, and thus has optimal conditions for use as a heat radiation pattern. As is known, the thermal conductivity of aluminum is 247 W / mK and the thermal conductivity of copper is 398 W / mK. Of course, the heat dissipation pattern may be formed of another metal, or may be newly applied to a non-metallic material having high thermal conductivity, and may be newly applied to a material having low electrical conductivity but high thermal conductivity. It is preferable that it is 200 W / mK or more. This is a considerably higher thermal conductivity compared to the thermal conductivity of 0.5 ~ 1.5W / mK of the resin constituting the ACF (material connecting the flexible substrate and the external substrate) under investigation to increase the thermal conductivity.

As shown in FIG. 4, the heat dissipation pattern 120 may use all of the space between the chip connection pads 150 and the spaces around the wires 130 and 140, but it is optimal as described above. While the lower chip heat dissipation pattern 125 is formed in a part of the space between the 150, the desired purpose can be achieved when the pattern extends to at least one of the four heat dissipation patterns 120 extending. If a part of the wiring must pass between the chip connection pads 150, it is limited to one side so that the lower chip heat dissipation pattern 125 is connected to the heat dissipation pattern 120 only at one side. The heat dissipation pattern 120 may also be concentrated on the left side or the right side.

The heat dissipation pattern 120 must be electrically insulated from the wires 130 and 140, but if necessary, the heat dissipation pattern 120 is connected to the ground electrodes of the wires 130 and 140 to simultaneously perform heat dissipation and electrode functions. You may.

If two chips are used as shown in FIG. 3, or if a predetermined wiring must be connected through the chip connection pad 150, a modification as shown in FIG. 5 is possible. As such, there is a method of utilizing a space between two pairs of driving driver chip connection pads 151 and 152 as a space for connecting through wires. Even in this case, since the lower chip heat dissipation patterns 125 are connected to the heat dissipation pattern 120 at one side, the heat generation of the driving driver chip can be easily discharged to the outside.

6 is a further modification of the embodiment of the present invention, while forming the heat radiation pattern 120 to pass horizontally between the wiring (130, 140), the heat radiation pattern 120 in the surplus space in the outer region of the wiring (130, 140) ) Is formed. This is also the case in which the heat dissipation pattern 120 is formed in earnest, but when a part of the wires 130 and 140 must penetrate the separated chip connection pad 150, a portion that can penetrate through four places This is useful when you want to distribute to several places. In particular, the present invention can be applied to two driving driver chips to be mounted.

Although each arrangement has left and right symmetry in various cases of the wires 130 and 140 and the heat dissipation patterns 120 and 125, such symmetry is not necessarily required, so symmetry is ignored for convenience. Also, the substrate base 110 is not necessarily symmetrical.

In each case presented in the embodiments of the present invention, an important key part is at least a part of the lower chip heat dissipation pattern 125 formed under the driving driver chip, which is a heating element to be mounted, thereby rapidly connecting heat generated by the driving driver chip. The heat dissipation pattern 120 may be diffused to the heat dissipation pattern 120, and the heat dissipation pattern 120 may diffuse the heat into the air using its own area, but the heat dissipation pattern may be diffused more rapidly to an external substrate that is connected first. The external substrate having a large area must have an extension pattern to the external substrate to serve as a heat sink for the heat generated by the driver driver chip.

The above-described flexible board can be widely applied to various flexible connection board packages (eg, TCP, or chip on film) that require thermal diffusion, and in particular, a substrate to which a driving device for switching a large current is applied. It can also be used as a substrate for many high speed computing devices.

When the flexible substrate having the heat dissipation pattern is applied to a plasma display device, the flexible substrate is mainly driven to provide an appropriate voltage and current to a plasma display panel having a large number of driving electrodes and a cell driving electrode of the plasma display panel. It can be used when connecting between substrates. Like the structure of the flexible substrate connecting most display panels and the driving substrate, the flexible substrate connecting the plasma display panel and the driving substrate is equipped with a driver driver chip for switching high voltage and high current. In order to achieve this, the driving driver chip should appropriately provide a high voltage of 60 to 100 V for the data signal and 180 to 220 V for the sustain signal for sustaining the discharge from the driving circuit board to the electrodes of each display panel. This operation is performed by the driving driver chip, and a large amount of current that can handle the power consumption due to the discharge must be able to flow, so the heat generation amount of the driving driver chip is inevitably large.

Therefore, in order to ensure the limit permissible current value of the flexible board on which the driving heat generation chip is generated and the device reliability, a heat dissipation pattern (metal or non-metal thermal conductive material such as copper) having high thermal conductivity is formed between the wirings of the flexible board. As a result, the heat generated by the driving driver chip is rapidly diffused into the air and connected to an external substrate (a panel or a driving substrate) to increase the reliability of the device and increase the limit allowable current value. In addition, it is possible to minimize a structure such as a heat sink or a fan separately provided to increase the driving driver reliability and the limit allowable current value on the flexible board, thereby reducing costs and reducing power consumption.

As described above, the flexible substrate and the plasma display apparatus using the same according to the embodiment of the present invention enlarge the substrate base size of the flexible substrate and include a part of the middle of the mounting space of the chip disposed on the substrate base. By further configuring a heat dissipation pattern extended to be connected to an external substrate for heat diffusion, by including a heat diffusion pattern in the substrate base itself to lower the drive temperature of the chip formed on the substrate to increase the reliability It works.

The flexible substrate according to the embodiment of the present invention includes at least one heat dissipation pattern including at least a lower portion of a chip mounted on the flexible substrate and extending to at least one of both end portions of both sides of the flexible substrate for connection with the external substrate. By forming the above, there is an effect that can easily dissipate the heat generated by the chip formed on the flexible substrate to lower the driving temperature and simplify the additional heat dissipation structure.

The flexible board according to the embodiment of the present invention has a heat radiation pattern for dissipating the heat of the chip mounted on the flexible board to the connection part side of the flexible board only by changing the mask to be used when wiring patterning on the flexible board. By forming together with the general wiring, it is possible to increase the heat dissipation efficiency at no additional cost to increase the limit allowable current value of the flexible substrate.

Plasma display panel using a flexible substrate according to an embodiment of the present invention by applying a flexible substrate having a heat radiation pattern for diffusing heat of the driving driver chip mounted between the plasma display panel and the driving substrate, the heat generated in the flexible substrate By effectively dissipating the product, it is possible to increase the operational stability and reliability of the product and to reduce the heat dissipation cost.

Claims (14)

A flexible substrate base configured to have an external substrate connected to both ends thereof; A chip connection pad part formed on the flexible substrate base; A wiring part extending from the chip connection pad part and having an external substrate connection pad formed at an end thereof; A first heat dissipation pattern including at least a portion of a chip mounting space between the chip connection pads; And a second heat dissipation pattern connected to the first heat dissipation pattern and extending to at least one side of both ends of the flexible substrate base to be connected to the external substrate. The method of claim 1, The second heat dissipation pattern is a flexible substrate, characterized in that connected to the ground line of the wiring portion. The chip connection pad unit of claim 1, wherein the chip connection pad unit is formed in a plurality of pairs, and some of the wiring units are formed between the pair of chip connection pad units, or the chip connection pad unit is not connected to the chip connection pad unit. A flexible substrate, characterized in that arranged to pass between the pair. The method of claim 1, The flexible substrate base is defined to further include a surplus area other than the substrate area required by the wiring unit while maintaining the width of the both end portions, and the flexible substrate is formed with a portion of the second heat dissipation pattern in the surplus area. . The method of claim 1, And the wiring part and the first and second heat dissipation patterns are made of the same material. The method of claim 1, The first and second heat dissipation pattern is a flexible substrate, characterized in that arranged to surround the wiring portion from the outside. The method of claim 1, And the second heat dissipation pattern is disposed in parallel to a region between the wiring portions. The method of claim 1, The first and second heat dissipation pattern is a flexible substrate, characterized in that the thermal conductivity is made of a metal or non-metal material of 200W / mK or more. The method of claim 1, The flexible substrate comprising the first and second heat dissipation pattern is a tape transport package (TCP). A plasma display panel having a connection electrode; A substrate including a driving circuit and an electrode for driving the plasma display panel; And a flexible substrate electrically connecting the electrodes of the plasma display panel and the electrodes of the substrate on which the driving circuit is configured through the wiring and the mounted chip. The flexible substrate may include: a first heat dissipation pattern including at least a portion of the mounted chip lower region, separate from the wiring; And a second heat dissipation pattern connected to the first heat dissipation pattern, the second heat dissipation pattern extending to a connection area with the substrate including the plasma display panel or the driving circuit. The method of claim 10, The wiring on the flexible substrate and the first and second heat dissipation patterns are formed of the same metal material and are electrically insulated. The method of claim 10, And the second heat dissipation pattern is formed on the entire surplus region other than the wiring region in the substrate base surface of the flexible substrate. The plasma display apparatus of claim 10, wherein the chip mounted on the flexible substrate is a driver driver chip that provides an address or discharge power to a cell electrode on the plasma display panel. The method of claim 10, The thermal conductivity of the first and second heat dissipation pattern is a plasma display device using a flexible substrate, characterized in that more than 200W / mK.

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