JP6024202B2 - Control device and motor unit including the same - Google Patents

Description

  The present invention relates to a control device having a circuit board body and a connection terminal, and a motor unit including the device.

The control device of Patent Document 1 includes a circuit board and a housing.
The housing has a bottom wall, a substrate support portion, and a receiving space. The housing accommodates the circuit board in the accommodation space. The housing has a configuration in which the substrate support portion rises from the bottom wall.

  The circuit board has a circuit board body and a connector. The circuit board body is supported by the board support member with respect to the bottom wall through a space. The circuit board body has a configuration in which the connection terminal rises on the surface opposite to the bottom wall.

JP 2004-253466 A

  In the control device, when a connection terminal of a device different from the control device is inserted into the connection terminal of the control device, a load is applied to the circuit board body via the connection terminal of the control device. Thereby, the circuit board body may be deformed toward the bottom wall of the housing.

  In order to solve the above-described problems, an object of the present invention is to provide a control device capable of suppressing deformation of a circuit board main body and a motor unit having the same.

(1) The first means is the circuit board main body having the invention according to claim 1, ie, a main surface, a back surface forming a surface opposite to the main surface, and a connection terminal rising on the main surface. A housing having a bottom wall, a substrate support portion that stands on the bottom wall and supports the back surface, and a metal terminal support portion that supports a portion of the back surface corresponding to the connection terminal, and the terminal support And the heat generating element is a control device that comes into contact with the terminal support portion .

  The terminal support portion of the control device supports the connection terminal of the circuit board body from the back side. For this reason, the terminal support portion receives a load applied to the circuit board body via the connection terminal of the control device when a connection terminal of a device different from the control device is inserted into the connection terminal of the control device. Therefore, deformation of the circuit board body when a connection terminal of another device is connected to the terminal support portion is suppressed. Further, the terminal support portion radiates heat from the heating element. For this reason, the temperature rise of a heat generating element is suppressed.

  (2) The second means is the invention according to claim 2, that is, the circuit board main body has two connection terminals, the housing has two terminal support portions, One of the terminal support portions supports one of the connection terminals via the circuit board main body, the other of the terminal support portions supports the other of the connection terminals via the circuit board main body, and the heating element Is a control device according to claim 1, which is located between the two terminal support portions.

  In the control device, the heat of the heating element moves to each of the two terminal support portions. For this reason, the cooling effect of a heat generating element becomes high compared with the structure assumed that one of the two terminal support parts was abbreviate | omitted.

  (3) The third means is the control device according to claim 1 or 2, wherein the heating element is attached to the back surface of the circuit board body. .

(4) A fourth means is the control device according to claim 1 or 2, wherein the heat generating element is attached to a side surface of the terminal support portion.
(5) The fifth means is the invention according to claim 5, that is, the control device has a multilayer printed board formed of a thermoplastic resin film as the circuit board main body. The gist of the present invention is the control device described in the section.

  (6) The sixth means is the motor unit provided with the control device according to any one of claims 1 to 5, that is, the invention according to claim 6.

  The present invention provides a control device capable of suppressing deformation of a circuit board body, and a motor unit having the same.

It is sectional drawing regarding the motor unit of 1st Embodiment of this invention, and is sectional drawing which shows the cross-sectional structure of the plane in alignment with an axial direction. The top view which shows the planar structure of the electric motor of 1st Embodiment. It is a figure regarding the 1st circuit board of the control apparatus of 1st Embodiment, (a) is an expanded view which shows the expansion | deployment structure of a 1st circuit board, (b) is the arrow view of (a) of the state which bent the connection part. The side view which shows the side structure seen from Y3. It is sectional drawing regarding the motor unit of 1st Embodiment, and is sectional drawing which shows the cross-section of the Z1-Z1 plane of FIG. It is sectional drawing regarding the motor unit of 1st Embodiment, and is sectional drawing which shows the cross-sectional structure of the plane in alignment with an axial direction. It is a perspective view regarding the control apparatus of 2nd Embodiment of this invention, and is a perspective view which shows the external perspective structure. It is sectional drawing regarding the control apparatus of 2nd Embodiment, and sectional drawing which shows the cross-section of the Z6-Z6 plane of FIG. It is a top view regarding the control apparatus of 2nd Embodiment, and is a top view which shows the planar structure of the state which abbreviate | omitted the cover and the 1st circuit board. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane in alignment with an axial direction. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane in alignment with an axial direction. It is sectional drawing regarding the motor unit of other embodiment of this invention, and sectional drawing which shows the cross-sectional structure of the plane in alignment with an axial direction.

(First embodiment)
With reference to FIG. 1, the structure of the motor unit 1 of this embodiment is demonstrated.
The motor unit 1 includes an electric motor 1A and a control device 1B. The electric motor 1 </ b> A includes a rotor 10, a stator 20, a bus bar 30, a motor housing 40, ball bearings 43 and 44, a bracket 50, and a resolver 60. The control device 1B includes a housing 70, a first circuit board 80, and a second circuit board 90 (see FIG. 4). The control device 1B controls the operation of the electric motor 1A.

The direction of the motor unit 1 is defined as follows.
(A) A direction along the central axis (hereinafter, “central axis J”) of the rotor 10 is referred to as “axial direction ZA”. A direction orthogonal to the axial direction ZA is referred to as a “radial direction ZB”. The direction in which the rotor 10 rotates is referred to as “circumferential direction ZC”.
(B) In the axial direction ZA, a direction passing through the electric motor 1A and the control device 1B in this order is referred to as “upward direction ZA1”. In the axial direction ZA, a direction passing through the control device 1B and the electric motor 1A in this order is referred to as a “downward direction ZA2”.
(C) In the radial direction ZB, a direction approaching the central axis J is referred to as an “inward direction ZB1”. In the radial direction ZB, a direction away from the central axis J is referred to as an “outward direction ZB2”.

  The rotor 10 has an output shaft 11, a rotor core 12, and a permanent magnet 13. The rotor core 12 has a cylindrical shape. The rotor core 12 is press-fitted into the output shaft 11. The permanent magnet 13 is fixed to the outer peripheral surface of the rotor core 12. The permanent magnet 13 has 10 magnetic poles in the circumferential direction ZC.

  The stator 20 has a stator core 21 and a field part 22. The stator 20 forms a magnetic field that generates a rotational force of the rotor 10 when current is supplied from a power source (not shown) to the conductive wire. The stator core 21 passes the magnetic flux of the field portion 22. The stator core 21 is press-fitted into the inner peripheral surface of the stator holding portion 41 of the motor housing 40. The field magnet portion 22 forms a concentrated winding by winding a conductive wire around the stator core 21. Field unit 22 has four U-phase coils, four V-phase coils, and four W-phase coils.

  The bus bar 30 includes a copper plate 31, a support member 32, and a circuit connection member 33. The bus bar 30 is located in the upward direction ZA1 of the stator core 21. The bus bar 30 is attached to the stator core 21. The bus bar 30 electrically connects the stator 20 and the second circuit board 90 via the first circuit board 80.

  Copper plate 31 has U-phase copper plate 31U, V-phase copper plate 31V, and W-phase copper plate 31W. The U-phase copper plate 31U is connected to the coil end of each U-phase coil. The V-phase copper plate 31V is connected to the coil end of each V-phase coil. The W-phase copper plate 31W is connected to the coil end of each W-phase coil.

  The support member 32 has a copper plate support portion 32A and three leg portions 32B. The support member 32 has a structure in which a copper plate support portion 32A and a leg portion 32B are integrally formed of the same resin material. The copper plate support portion 32A has an annular shape. The copper plate support portion 32 </ b> A supports the copper plate 31. The leg portion 32B extends in the downward direction ZA2 from the outer peripheral portion of the copper plate support portion 32A. The leg portions 32B are separated from each other in the circumferential direction ZC. The leg portion 32B is attached to the outer peripheral portion of the stator core 21 at the lower end portion.

  The circuit connection member 33 electrically connects the copper plate 31 and the first circuit board 80. The circuit connection member 33 includes a lead wire 33A and a connector portion 33B. The lead wire 33A is fixed to the copper plate 31 at one end. The lead wire 33A is connected to the connector portion 33B at the other end. The lead wire 33A is drawn in the upward direction ZA1 from the cover portion 52 of the bracket 50 through the bus bar through hole 52A (see FIG. 2). The connector portion 33B is fitted to the bus bar connector 84.

  The motor housing 40 has a stator holding portion 41 and a cover portion 42. The motor housing 40 has a structure in which a stator holding portion 41 and a cover portion 42 are integrally formed of the same metal plate. The motor housing 40 houses a part of the rotor 10, the stator 20, and the bus bar 30.

  The stator holding portion 41 has a cylindrical shape. The stator holding portion 41 has an opening portion 41A. The opening portion 41A opens toward the upward direction ZA1 at the upper end portion of the stator holding portion 41. The cover portion 42 has a bearing support portion 42A. The cover portion 42 closes the lower end portion of the stator holding portion 41.

The ball bearing 43 is fixed to the upper end portion of the output shaft 11 and the bearing support portion 55. The ball bearing 43 supports the output shaft 11 in a state where the rotor 10 can rotate with respect to the stator 20.
The ball bearing 44 is fixed to the lower end portion of the output shaft 11 and the bearing support portion 42A. The ball bearing 44 supports the output shaft 11 in a state where the rotor 10 can rotate with respect to the stator 20.

  The bracket 50 includes a side wall 51, a cover portion 52, a mounting portion 53, a resolver support portion 54, and a bearing support portion 55. The bracket 50 has a structure in which a side wall 51, a cover portion 52, a mounting portion 53, a resolver support portion 54, and a bearing support portion 55 are integrally formed of the same metal material.

  The side wall 51 has a cylindrical shape. The side wall 51 is fixed to the opening portion 41 </ b> A of the motor housing 40. The side wall 51 has a connector through hole (not shown). The cover portion 52 is located at an intermediate portion of the side wall 51 in the axial direction ZA. The cover portion 52 closes the opening portion 41A. The cover portion 52 has a bus bar through hole 52A and a resolver through hole 52B (see FIG. 2). The attachment portion 53 extends in the outward direction ZB <b> 2 at the upper end portion of the side wall 51. The attachment portion 53 is fixed to the attachment portion 74 of the housing 70 with a bolt 56. The resolver support portion 54 has a cylindrical shape. The resolver support portion 54 extends from the cover portion 52 in the downward direction ZA2. The bearing support portion 55 has a cylindrical shape. The bearing support portion 55 is located in the inward direction ZB1 with respect to the resolver support portion 54.

  The resolver 60 is positioned in the upward direction ZA1 with respect to the bus bar 30 and in the inward direction ZB1 with respect to the bus bar 30. The resolver 60 outputs a voltage signal corresponding to the rotational position of the rotor 10 to the first circuit board 80. The resolver 60 includes a resolver rotor 61, a resolver stator 62, and a circuit connection member 63. The resolver 60 has a variable reluctance resolver configuration.

  The resolver rotor 61 is press-fitted into the output shaft 11. The resolver stator 62 has a resolver core 62A and a resolver coil 62B. The resolver core 62 </ b> A is press-fitted into the resolver support portion 54. The resolver coil 62B is formed by a conductive wire wound around the resolver core 62A.

  The circuit connection member 63 electrically connects the coil end of the resolver coil 62 </ b> B and the first circuit board 80. The circuit connection member 63 has a lead wire 63A and a connector portion 63B. The lead wire 63A is fixed to the coil end of the resolver coil 62B at one end. The lead wire 63A is connected to the connector portion 63B at the other end. The lead wire 63A is drawn in the upward direction ZA1 with respect to the cover portion 52 of the bracket 50 via the resolver through hole 52B (see FIG. 2). The connector portion 63B is fitted to the resolver connector 85.

  The housing 70 is located at the upper end of the motor unit 1. The housing 70 covers the bracket 50 from the upward direction ZA1. The housing 70 is fixed to the bracket 50 by bolts 56. The housing 70 includes a housing main body 71, a bus bar terminal support portion 75, and a resolver terminal support portion 76. The housing 70 has a configuration in which a housing main body 71, a bus bar terminal support portion 75, and a resolver terminal support portion 76 are individually formed. The bus bar terminal support portion 75 and the resolver terminal support portion 76 correspond to “terminal support portions”.

  The housing body 71 has a bottom wall 72, a side wall 73, and a mounting portion 74. The housing main body 71 has a structure in which a bottom wall 72, a side wall 73, and a mounting portion 74 are integrally formed of the same metal material. The bottom wall 72 has a disk shape along the radial direction ZB. The side wall 73 has a cylindrical shape. The side wall 73 extends from the outer peripheral edge of the bottom wall 72 in the downward direction ZA2. The side wall 73 has a substrate support portion 73A. The substrate support portion 73A has a step shape. The side wall 73 supports the back surface 81B of the circuit board body 81 of the first circuit board 80 at the board support portion 73A. The attachment portion 74 extends from the lower end portion of the side wall 73 in the outward direction ZB2. The attachment portion 74 is located at a location corresponding to the attachment portion 53 of the bracket 50.

  The bus bar terminal support portion 75 is formed of a metal material. The bus bar terminal support portion 75 has a quadrangular prism shape that is rectangular in plan view. The bus bar terminal support portion 75 contacts the back surface 81B of the circuit board body 81 of the first circuit board 80 at the lower end surface. The bus bar terminal support portion 75 is fixed to the bottom wall 72 with bolts (not shown). The bus bar terminal support portion 75 is larger than the size of the bus bar connector 84 in the longitudinal direction of the bus bar connector 84. The bus bar terminal support portion 75 is located at a location corresponding to the bus bar connector 84. The lower end surface of the bus bar terminal support portion 75 covers the entire upper surface of the connector case 84B of the bus bar connector 84.

  The resolver terminal support portion 76 is formed of a metal material. The resolver terminal support portion 76 has a quadrangular prism shape that is rectangular in plan view. The resolver terminal support portion 76 contacts the back surface 81B of the circuit board body 81 of the first circuit board 80 at the lower end surface. The resolver terminal support portion 76 is fixed to the bottom wall 72 with bolts (not shown). The resolver terminal support portion 76 is larger than the size of the resolver connector 85 in the longitudinal direction of the resolver connector 85. The resolver terminal support portion 76 is located at a location corresponding to the resolver connector 85. The lower end surface of the resolver terminal support portion 76 covers the entire upper surface of the connector case 85B of the resolver connector 85.

A configuration of the first circuit board 80 will be described with reference to FIGS. 1 and 3.
The first circuit board 80 is located in the upward direction ZA1 with respect to the cover portion 52 of the bracket 50 via a space. The first circuit board 80 includes a circuit board main body 81, a connecting portion 82 (see FIG. 3A), and a vertical substrate portion 83. The first circuit board 80 has a control circuit that controls the switching of the power elements 92 (both of which are shown in FIG. 4) of the second circuit board 90. The first circuit board 80 receives a voltage signal based on the induced voltage of the resolver coil 62 </ b> B through the circuit connection member 63.

  The first circuit board 80 is formed as a multilayer printed board in which a plurality of thermoplastic resin films are laminated. The first circuit board 80 has a through hole having a conductor pattern as a bottom surface and an interlayer connection portion (not shown) made of a conductive paste filled in the through hole. The first circuit board 80 is configured by thermocompression bonding in a state where a thermoplastic resin film on which a conductor pattern and a conductive paste are formed is laminated.

  The circuit board body 81 has a flat plate shape along the radial direction ZB. The circuit board body 81 has a T shape in plan view (see FIG. 3A). The circuit board body 81 is located on the board support portion 73 </ b> A of the housing 70. The circuit board main body 81 is located in the downward direction ZA2 with respect to the bottom wall 72 via a space. The circuit board main body 81 includes a main surface 81A, a back surface 81B, one bus bar connector 84, one resolver connector 85, one external connector 86 (see FIG. 3A), and one heating element 87. It has a film capacitor for smoothing power. The circuit board body 81 faces the bottom wall 72 on the back surface 81B. The bus bar connector 84 and the resolver connector 85 correspond to “connectors”.

  The bus bar connector 84 is attached to the main surface 81 </ b> A of the circuit board main body 81. The longitudinal dimension of the bus bar connector 84 is larger than the longitudinal dimension of the resolver connector 85. The bus bar connector 84 has a connection terminal 84A and a connector case 84B (see FIG. 3A).

  The connection terminal 84A is electrically connected to the circuit board body 81. The connection terminal 84 </ b> A stands upright from the main surface 81 </ b> A of the circuit board main body 81. The connection terminal 84A is electrically connected to the circuit connection member 33 in a state where the connector portion 33B of the circuit connection member 33 of the bus bar 30 is fitted to the connector case 84B. The connector case 84B has a box shape that opens toward the downward direction ZA2. The connector case 84B accommodates the connection terminal 84A (see FIG. 3A).

  The resolver connector 85 is attached to the main surface 81 </ b> A of the circuit board main body 81. The resolver connector 85 is located at a certain distance in the radial direction ZB with respect to the bus bar connector 84. The resolver connector 85 faces and is parallel to the resolver connector 85. The resolver connector 85 has a connection terminal 85A and a connector case 85B (see FIG. 3A).

  The connection terminal 85A is electrically connected to the circuit board body 81. The connection terminal 85 </ b> A stands upright from the main surface 81 </ b> A of the circuit board main body 81. The connection terminal 85A is electrically connected to the circuit connection member 63 in a state where the connector portion 63B of the circuit connection member 63 of the resolver 60 is fitted into the connector case 85B. The connector case 85B has a box shape that opens toward the downward direction ZA2. The connector case 85B accommodates the connection terminal 85A (see FIG. 3A).

  The heating element 87 is attached to the back surface 81 </ b> B of the circuit board main body 81. The heating element 87 is located between the bus bar terminal support portion 75 and the resolver terminal support portion 76 in the radial direction ZB. The heating element 87 contacts the bus bar terminal support portion 75, the resolver terminal support portion 76, and the bottom wall 72. The heating element 87 absorbs current fluctuations accompanying the high-speed switching of the power element 92.

The connecting portion 82 connects the circuit board main body 81 and the vertical board portion 83 to each other (see FIG. 3A). The connecting portion 82 is bent (see FIG. 3B).
The vertical substrate portion 83 has a flat plate shape along the axial direction ZA. The vertical board portion 83 stands upright with respect to the circuit board main body 81 (see FIG. 3B). The vertical board portion 83 extends in the upward direction ZA1 with respect to the circuit board body 81.

The configuration of the second circuit board 90 will be described with reference to FIG.
The second circuit board 90 is located on the opposite side to the side on which the vertical board portion 83 is located with respect to the bus bar terminal support portion 75 in the radial direction ZB. The second circuit board 90 includes a ceramic substrate 91, field effect transistors as six power elements 92, and a harness (not shown). The second circuit board 90 constitutes an inverter circuit with six power elements 92.

  The ceramic substrate 91 is made of alumina. The ceramic substrate 91 has a flat plate shape along the axial direction ZA. The ceramic substrate 91 has a main surface 91A and a back surface (not shown). Ceramic substrate 91 has a configuration in which power element 92 is attached to main surface 91A. The ceramic substrate 91 is fixed to the bottom wall 72 on the back surface.

The operation of the control device 1B will be described with reference to FIG.
The control device 1B has a first function and a second function. The first function is a function that suppresses deformation of the circuit board body 81. The second function shows a function of radiating heat from the heating element 87.

Details of the first function of the control device 1B will be described.
The bus bar connector 84 receives a load in the upward direction ZA1 when the connector portion 33B of the circuit connection member 33 is fitted into the connector case 84B. For this reason, the bus bar connector 84 pushes the circuit board body 81 in the upward direction ZA1. At this time, the back surface 81 </ b> B of the circuit board main body 81 is in contact with the bus bar terminal support portion 75, so that the load applied to the circuit board main body 81 is received by the bus bar terminal support portion 75. For this reason, it is suppressed that the circuit board main body 81 deform | transforms into the upward direction ZA1. Since the same applies to the connection of the resolver connector 85 and the circuit connection member 63 (both see FIG. 1), description thereof is omitted.

Details of the second function of the control device 1B will be described.
When the motor unit 1 is driven, the heating element 87 generates heat. The heat of the heating element 87 moves to the bus bar terminal support portion 75 and the resolver terminal support portion 76. The heat transferred to the bus bar terminal support portion 75 and the resolver terminal support portion 76 moves to the bottom wall 72. In addition, the heat at the upper end of the heating element 87 moves to the bottom wall 72. The heat transferred to the bottom wall 72 is radiated to the outside of the housing 70. As described above, the control device 1 </ b> B has three heat dissipation paths with respect to the heating element 87. For this reason, compared with the structure which does not have the thermal radiation path with respect to the heat generating element 87, the temperature rise of the heat generating element 87 is suppressed.

The motor unit 1 of this embodiment has the following effects.
(1) The control device 1 </ b> B has a configuration in which a portion corresponding to the bus bar connector 84 in the circuit board body 81 is supported by the bus bar terminal support portion 75. According to this configuration, the load applied to the circuit board main body 81 as the circuit connecting member 33 of the bus bar 30 is connected to the bus bar connector 84 is received by the bus bar terminal supporting portion 75. For this reason, deformation of the circuit board body 81 is suppressed.

  The control device 1 </ b> B has a configuration in which a portion corresponding to the resolver connector 85 in the circuit board body 81 is supported by a resolver terminal support portion 76. According to this configuration, the load applied to the circuit board main body 81 as the circuit connecting member 63 of the resolver 60 is connected to the resolver connector 85 is received by the resolver terminal support portion 76. For this reason, deformation of the circuit board body 81 is suppressed.

  (2) The control device 1 </ b> B has a configuration in which the heating element 87 is in contact with the bus bar terminal support portion 75 and the resolver terminal support portion 76. According to this configuration, the heat of the heating element 87 moves to the bus bar terminal support portion 75 and the resolver terminal support portion 76. Therefore, the temperature rise of the heating element 87 is suppressed.

  (3) The control device 1B has a configuration in which the heat generating element 87 is in contact with the bottom wall 72. With this configuration, the heat of the heating element 87 moves to the bottom wall 72. Therefore, the temperature rise of the heating element 87 is suppressed.

(Second Embodiment)
6 and 7 show the configuration of the control device 100 of the present embodiment.
The control device 100 of this embodiment is different from the control device 1B (see FIG. 1) of the first embodiment in that it is formed separately from the electric motor 1A (see FIG. 1). In the following description, the components of the second embodiment that are described to correspond to the components of the first embodiment have the same or similar functions as the corresponding components of the first embodiment. .

As shown in FIG. 7, the control device 100 includes a first circuit board 110, a second circuit board 120 (see FIG. 8), a housing 130, and a cover 140.
The housing 130 is made of a metal material. The housing 130 has a rectangular box shape in plan view (see FIG. 6). The housing 130 accommodates the first circuit board 110 and the second circuit board 120. The housing 130 includes a housing main body 131, a bus bar terminal support portion 134 corresponding to the bus bar terminal support portion 75 of the first embodiment, and a resolver terminal support portion 135 corresponding to the resolver terminal support portion 76 of the first embodiment. The housing 130 has a configuration in which a housing body 131, a bus bar terminal support portion 134, and a resolver terminal support portion 135 are individually formed. The bus bar terminal support portion 134 and the resolver terminal support portion 135 correspond to “terminal support portions”.

  The housing body 131 has a bottom wall 132 and a side wall 133. The housing body 131 has a structure in which the bottom wall 132 and the side wall 133 are integrally formed of the same metal material. The side wall 133 has a substrate support portion 133A and a fitting protrusion 133B. The side wall 133 has a substrate support portion 133A at the upper end. The side wall 133 supports the back surface 111B of the circuit board body 111 of the first circuit board 110 at the board support portion 133A. The side wall 133 has a fitting protrusion 133B on the upper end surface.

  The cover 140 covers the side wall 133 of the housing 130 from the side opposite to the bottom wall 132. The cover 140 is fixed to the side wall 133 of the housing 130 by bolts (not shown). The cover 140 has a fitting concave portion 141. The fitting concave portion 141 is fitted into the fitting protrusion 133B.

  The first circuit board 110 has a control circuit corresponding to the control circuit of the first circuit board 80 of the first embodiment. The first circuit board 110 is located with respect to the bottom wall 132 through a space. The first circuit board 110 is positioned with respect to the cover 140 via a space. The first circuit board 110 is formed as a multilayer printed board in which a plurality of thermoplastic resin films are laminated. The first circuit board 110 includes a circuit board body 111, a bus bar connector 112, a resolver connector 113, and a power supply smoothing film capacitor as a heating element 114. The bus bar connector 112, the resolver connector 113, and the heating element 114 correspond to the bus bar connector 84, the resolver connector 85, and the heating element 87 of the first embodiment. The bus bar connector 112 and the resolver connector 113 correspond to “connectors”.

  The circuit board body 111 has a flat plate shape. The circuit board body 111 is located on the bottom wall 132 with a space therebetween. The circuit board main body 111 is parallel to the bottom wall 132. The circuit board main body 111 has a main surface 111A and a back surface 111B.

  The bus bar connector 112 is attached to the main surface 111 </ b> A of the circuit board main body 111. The bus bar connector 112 includes a connection terminal 112A corresponding to the connection terminal 84A of the first embodiment, and a connector case 112B corresponding to the connector case 84B of the first embodiment. The connection terminal 112 </ b> A stands upright on the main surface 111 </ b> A of the circuit board main body 111.

  The resolver connector 113 is attached to the main surface 111 </ b> A of the circuit board main body 111. The resolver connector 113 includes a connection terminal 113A corresponding to the connection terminal 85A of the first embodiment, and a connector case 113B corresponding to the connector case 85B of the first embodiment. The connection terminal 113 </ b> A stands upright on the main surface 111 </ b> A of the circuit board main body 111.

  The heating element 114 is attached to the back surface 111 </ b> B of the circuit board main body 111. The heating element 114 is located between the bus bar terminal support part 134 and the resolver terminal support part 135. The heating element 114 contacts the bus bar terminal support portion 134, the resolver terminal support portion 135, and the bottom wall 132.

  As shown in FIG. 8, the second circuit board 120 is located between the bus bar terminal support portion 134 and the portion of the side wall 133 that faces the bus bar terminal support portion 134. The second circuit board 120 is fixed to the bottom wall 132. The second circuit board 120 includes a ceramic substrate 121 corresponding to the ceramic substrate 91 of the first embodiment, a power element 122 corresponding to the power element 92 of the first embodiment, and a harness (illustrated) corresponding to the harness of the first embodiment. Abbreviation). The second circuit board 120 has an inverter circuit corresponding to the inverter circuit of the second circuit board 90 of the first embodiment.

  Since the operation of the control device 100 is the same as that of the control device 1B, description thereof is omitted. Moreover, the control apparatus 100 of this embodiment has the same effects as the effects (1) to (3) of the motor unit 1 of the first embodiment.

(Other embodiments)
The present invention includes an embodiment different from the first and second embodiments. Hereinafter, modifications of the first and second embodiments as other embodiments of the present invention will be described. The following modifications can be combined with each other.

  The control device 1B of the first embodiment has a configuration in which the bus bar terminal support portion 75 is in contact with the back surface 81B of the circuit board body 81. On the other hand, the control device 1 </ b> B according to the modification has a configuration in which the bus bar terminal support portion 75 faces the back surface 81 </ b> B of the circuit board main body 81 via a gap. In short, the bus bar terminal support portion 75 has a gap with respect to the back surface 81B of the circuit board main body 81 to the extent that excessive stress is not generated at the joint portion between the circuit board main body 81 and the connection terminal 84A due to the deformation of the circuit board main body 81. It may be located via. Similar changes can be made to the control device 100 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure where the resolver terminal support part 76 contacts the back surface 81B of the circuit board main body 81. FIG. On the other hand, the control device 1B of the modification has a configuration in which the resolver terminal support portion 76 faces the back surface 81B of the circuit board body 81 with a gap. In short, the resolver terminal support portion 76 has a gap with respect to the back surface 81B of the circuit board body 81 to the extent that excessive stress is not generated at the joint portion between the circuit board body 81 and the connection terminal 84A due to the deformation of the circuit board body 81. It may be located via. Similar changes can be made to the control device 100 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure where the dimension of the bus-bar terminal support part 75 is larger than the dimension of the bus-bar connector 84 in the longitudinal direction of the bus-bar connector 84. FIG. On the other hand, the control device 1 </ b> B according to the modified example has a configuration in which the size of the bus bar terminal support portion 75 is not more than the size of the bus bar connector 84 in the longitudinal direction of the bus bar connector 84. The bus bar terminal support portion 75 of the modified example is located at the portion of the bottom wall 72 corresponding to the middle portion of the bus bar connector 84 in the longitudinal direction. The bus bar terminal support portion 75 supports an intermediate portion in the longitudinal direction of the bus bar connector 84.

  The control device 1 </ b> B of the first embodiment has a configuration in which the dimension of the resolver terminal support portion 76 is larger than the dimension of the resolver connector 85 in the longitudinal direction of the resolver connector 85. On the other hand, the control device 1 </ b> B according to the modification has a configuration in which the dimension of the resolver terminal support portion 76 is equal to or smaller than the dimension of the resolver connector 85 in the longitudinal direction of the resolver connector 85. The resolver terminal support portion 76 of the modified example is located at a portion of the bottom wall 72 corresponding to an intermediate portion in the longitudinal direction of the resolver connector 85. The resolver terminal support portion 76 supports an intermediate portion in the longitudinal direction of the resolver connector 85.

  -The control apparatus 1B of 1st Embodiment has the housing 70 in which the bus-bar terminal support part 75, the resolver terminal support part 76, and the housing main body 71 were formed separately. On the other hand, the control device 1B of the modified example has a housing 70 in which at least one of the bus bar terminal support portion 75 and the resolver terminal support portion 76 and the housing body 71 are integrally formed of the same metal material. Similar changes can be made to the control device 100 of the second embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure which the heat generating element 87 contacts the bus-bar terminal support part 75 and the resolver terminal support part 76. FIG. On the other hand, the control device 1 </ b> B according to the modified example has a configuration in which the heat generating element 87 is located at a predetermined distance from at least one of the bus bar terminal support portion 75 and the resolver terminal support portion 76. In short, the heat generating element 87 is not limited to the configuration in contact with the bus bar terminal support portion 75 and the resolver terminal support portion 76, but the bus bar terminal support portion 75 and the resolver terminal support portion 76 to the extent that the required cooling performance of the heat generating element 87 can be ensured. May be located via a gap. Similar changes can be made to the control device 100 of the second embodiment.

  The control device 1B of the first embodiment has a configuration in which the heat generating element 87 is in contact with the bottom wall 72. On the other hand, the control device 1 </ b> B according to the modified example has a configuration in which the heat generating element 87 is located at a predetermined distance from the bottom wall 72. In short, the heating element 87 is not limited to the configuration in contact with the bottom wall 72, and may be positioned with a gap with respect to the bottom wall 72 to the extent that the necessary cooling performance of the heating element 87 can be ensured. Similar changes can be made to the control device 100 of the second embodiment.

  The control device 1B of the first embodiment has a structure in which the first circuit board 80 is formed as a multilayer printed wiring board in which a plurality of thermoplastic resin films are laminated. On the other hand, the control device 1B of the modified example has a structure in which the first circuit board 80 is formed as a printed wiring board that uses a thermosetting resin as a base material. Similar changes can be made to the control device 100 of the second embodiment.

  The control device 1 </ b> B according to the first embodiment includes the first circuit board 80 having the circuit board main body 81, the connecting part 82, and the vertical board part 83. On the other hand, the control device 1B according to the first embodiment includes the first circuit board 80 from which at least one of the connecting portion 82 and the vertical substrate portion 83 is omitted.

  -The control apparatus 1B of 1st Embodiment has the structure which the film capacitor as the heat generating element 87 contacts the bus-bar terminal support part 75 and the resolver terminal support part 76. FIG. On the other hand, as shown in FIG. 9, the control device 1 </ b> B according to the modified example has a configuration in which the second circuit board 150 is attached to the bus bar terminal support portion 75 and the resolver terminal support portion 76 as a heating element instead of the film capacitor. .

The second circuit board 150 includes a first power board 151 and a second power board 152.
The first power board 151 is fixed to the side surface of the bus bar terminal support portion 75. The first power substrate 151 includes a ceramic substrate 153, four power elements 154, and a harness (not shown). The harness electrically connects the ceramic substrate 153 and the circuit board main body 81. The power element 154 is attached to the side surface of the bus bar terminal support portion 75 via the ceramic substrate 153.

  The second power substrate 152 is fixed to the side surface of the resolver terminal support portion 76. The second power substrate 152 includes a ceramic substrate 155, two power elements 156, and a harness (not shown). The harness electrically connects the ceramic substrate 155 and the circuit board body 81. The power element 156 is attached to the side surface of the resolver terminal support portion 76 via the ceramic substrate 155.

  According to this configuration, the heat of the power element 154 moves to the bus bar terminal support portion 75 via the ceramic substrate 153. The heat transferred to the bus bar terminal support portion 75 is radiated to the outside of the housing 70 through the bottom wall 72. Thus, the bus bar terminal support portion 75 suppresses the temperature rise of the power element 154. Since the power element 156 and the resolver terminal support portion 76 are the same, description thereof is omitted.

  The control device 1 </ b> B according to the modification includes a second circuit board 150 including a first power board 151 and a second power board 152. On the other hand, as shown in FIG. 10, in the control device 1B of another modified example, the second circuit board 150 includes one ceramic substrate 157, power elements 154 and 156, and a harness (not shown). The ceramic substrate 157 is fixed to the side surface of the bus bar terminal support portion 75. Power elements 154 and 156 are mounted on ceramic substrate 157. The control device 1B of another modification is close to each other in the radial direction ZB of the bus bar connector 84 and the resolver connector 85. Accordingly, the bus bar terminal support portion 75 and the resolver terminal support portion 76 also approach each other in the radial direction ZB. The power elements 154 and 156 face the resolver terminal support portion 76.

  According to this configuration, the heat of the power elements 154 and 156 moves to the bus bar terminal support portion 75 via the ceramic substrate 157. Further, the heat of the power elements 154 and 156 moves to the resolver terminal support portion 76. For this reason, the temperature rise of the power elements 154 and 156 is further suppressed. The ceramic substrate 157 can also be fixed to the side surface of the resolver terminal support portion 76. Moreover, the same change can be added also to the control apparatus 100 of 2nd Embodiment.

  -The control apparatus 1B of the said modification has the structure by which the power elements 154 and 156 are attached to the side surface of the bus-bar terminal support part 75 and the side surface of the resolver terminal support part 76 via the ceramic board | substrates 153 and 155. On the other hand, in the control device 1B of still another modified example, the ceramic substrates 153 and 155 are omitted, that is, the power elements 154 and 156 are attached to the side surface of the bus bar terminal support portion 75 and the side surface of the resolver terminal support portion 76. It has a configuration. The bus bar terminal support portion 75 and the resolver terminal support portion 76 have conductive patterns that connect the power elements 154 and 156 and a harness (not shown). Similar changes can be made to the control device 1B of another modification shown in FIG.

  -The control apparatus 1B of 1st Embodiment has the bus-bar terminal support part 75 and the resolver terminal support part 76 as a terminal support part. On the other hand, as shown in FIG. 11, the control device 1 </ b> B according to the modification has a configuration in which the bus bar terminal support portion 75 and the resolver terminal support portion 76 are omitted, and a configuration in which the second circuit board 160 is included.

The second circuit board 160 includes a first power board 161 and a second power board 162.
The first power board 161 is orthogonal to the circuit board body 81. The first power board 161 is located at a location corresponding to the bus bar connector 84. The first power substrate 161 includes a ceramic substrate 163, four power elements 164, and a harness (not shown). The ceramic substrate 163 is fixed to the bottom wall 72. The ceramic substrate 163 supports the back surface 81B of the circuit board main body 81 at the lower end thereof. The harness electrically connects the ceramic substrate 163 and the circuit board body 81.

  The second power board 162 is orthogonal to the circuit board body 81. The second power board 162 is located at a location corresponding to the resolver connector 85. The second power substrate 162 includes a ceramic substrate 165, two power elements 166, and a harness (not shown). The ceramic substrate 165 supports the back surface 81B of the circuit board main body 81 at the lower end thereof.

  According to this configuration, when the circuit connection member 33 of the bus bar 30 is connected to the bus bar connector 84, the first power board 161 receives a load applied by the circuit connection member 33 to the circuit board body 81 via the bus bar connector 84. In addition, when the circuit connection member 63 of the resolver 60 is connected to the resolver connector 85, the second power substrate 162 receives a load that the circuit connection member 63 applies to the circuit substrate body 81 through the resolver connector 85. Thus, the first power board 161 also functions to support the bus bar connector 84. Further, the second power board 162 also functions to support the resolver connector 85. For this reason, the number of parts which comprise control device 1B can be decreased. The ceramic substrate 163 and the ceramic substrate 165 correspond to “connector support portions”. Moreover, the same change can be added also to the control apparatus 100 of 2nd Embodiment.

  -The control apparatus 1B of 1st Embodiment has the structure by which the 1st circuit board 80 is supported by the board | substrate support part 73A formed in the side wall 73. FIG. On the other hand, the control device 1 </ b> B according to the modification has a configuration in which the first circuit board 80 is supported by a board support portion formed separately from the side wall 73. The board support portion rises from the bottom wall 72 and supports the back surface 81 </ b> B of the circuit board body 81. Similar changes can be made to the control device 100 of the second embodiment.

  -The electric motor 1A of 1st Embodiment has the resolver 60 as a rotation position detection apparatus. On the other hand, the electric motor 1A of the modified example has a Hall IC instead of the resolver 60 as a rotational position detection device. Moreover, the electric motor 1A of another modified example has a configuration as a sensorless motor in which the rotational position detection device is omitted. The electric motor 1A of another modified example has a configuration in which the resolver support portion 54 is omitted from the bracket 50, the resolver connector 85 is omitted from the first circuit board 80, and the resolver terminal support portion 76 is omitted from the housing 70.

  DESCRIPTION OF SYMBOLS 1 ... Motor unit, 1B ... Control apparatus, 70 ... Housing, 72 ... Bottom wall, 73A ... Board | substrate support part, 75 ... Bus-bar terminal support part (terminal support part), 76 ... Resolver terminal support part (terminal support part), 81 ... Circuit board main body, 81A ... main surface, 81B ... back surface, 84A ... connection terminal, 85A ... connection terminal, 87 ... heating element, 100 ... control device, 111 ... circuit board main body, 111A ... main surface, 111B ... back surface, 112A ... Connection terminal, 113A ... Connection terminal, 114 ... Heat element, 130 ... Housing, 132 ... Bottom wall, 133A ... Substrate support part, 134 ... Bus bar terminal support part (terminal support part), 135 ... Resolver terminal support part (terminal support) portion).

Claims (6)

A circuit board main body having a main surface, a back surface forming a surface opposite to the main surface, and a connection terminal rising on the main surface;
A housing having a bottom wall, a substrate support portion that stands on the bottom wall and supports the back surface, and a metal terminal support portion that supports a portion of the back surface corresponding to the connection terminal;
A heating element radiated by the terminal support portion ,
The heating element contacts the terminal support portion.
Control apparatus. The circuit board body has two of the connection terminals,
The housing has two terminal support portions;
One of the terminal support portions supports one of the connection terminals via the circuit board body,
The other of the terminal support portions supports the other of the connection terminals via the circuit board body,
The control device according to claim 1, wherein the heating element is located between two terminal support portions. The control device according to claim 1, wherein the heating element is attached to the back surface of the circuit board main body. The control device according to claim 1, wherein the heating element is attached to a side surface of the terminal support portion. The control device according to any one of claims 1 to 4, wherein the control device includes a multilayer printed board formed of a thermoplastic resin film as the circuit board main body.   The motor unit provided with the control apparatus as described in any one of Claims 1-5.