TWI648240B - Low dielectric constant dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere and Preparation method and temperature-compensated - Google Patents

Low dielectric constant dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere and Preparation method and temperature-compensated Download PDF

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TWI648240B
TWI648240B TW106137487A TW106137487A TWI648240B TW I648240 B TWI648240 B TW I648240B TW 106137487 A TW106137487 A TW 106137487A TW 106137487 A TW106137487 A TW 106137487A TW I648240 B TWI648240 B TW I648240B
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TW201917105A (en
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林建基
曹中亜
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信昌電子陶瓷股份有限公司
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Abstract

本發明係有關耐還原性氣氛超低溫燒結的低介電常數溫度補償型積層陶瓷電容器用之介電瓷粉組成物,特別適合供製造電容溫度係數為0±30ppm/℃範圍(即所謂的NP0規格或稱C0G規格)的積層陶瓷電容器用。燒結溫度在1000℃以下,可與銅內電極相匹配,在還原氣氛下燒結,製成積層陶瓷電容器。本發明係由100重量份如下所示之第一成份a莫耳MgO、b莫耳CaO、c莫耳SiO2、d莫耳ZrO2及e莫耳TiO2,且a+b=1,且0.35≦a≦0.80,0.20≦b≦0.65,0.40≦c≦0.90,0.05≦d≦0.35,0.05≦e≦0.25,與4~20重量份由Li2O、BaO、ZnO、SiO2、和B2O3所組成的第二成份的玻璃熔塊(frit),其中玻璃熔塊(frit)的組成為0%≦Li2O≦25%,10%≦BaO≦60%,0%≦ZnO≦30%,5%≦SiO2≦40%,5%≦B2O3≦45%。 The invention relates to a dielectric porcelain powder composition for a low dielectric constant temperature compensating multilayer ceramic capacitor for ultra-low temperature sintering in a reducing atmosphere, and is particularly suitable for manufacturing a temperature coefficient of capacitance of 0±30ppm/°C (so-called NP0 specification). Or C0G specification) for laminated ceramic capacitors. The sintering temperature is below 1000 ° C, and it can be matched with the copper internal electrode and sintered under a reducing atmosphere to form a laminated ceramic capacitor. The present invention comprises 100 parts by weight of the first components a mole MgO, b mole CaO, c mole SiO 2 , d mole ZrO 2 and e mole TiO 2 as shown below, and a+b=1, and 0.35≦a≦0.80, 0.20≦b≦0.65, 0.40≦c≦0.90, 0.05≦d≦0.35, 0.05≦e≦0.25, and 4-20 parts by weight of Li 2 O, BaO, ZnO, SiO 2 , and B a glass frit of a second component consisting of 2 O 3 , wherein the composition of the glass frit is 0% ≦ Li 2 O ≦ 25%, 10% ≦ BaO ≦ 60%, 0% ≦ ZnO ≦ 30%, 5% ≦SiO 2 ≦ 40%, 5% ≦B 2 O 3 ≦ 45%.

Description

耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物及其 製備方法及其製成之溫度補償型積層陶瓷電容器 Low dielectric constant dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere and Preparation method and temperature-compensated multilayer ceramic capacitor thereof

本發明係一種耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物及其製備方法,可供用來製造溫度補償型的積層陶瓷電容器。本發明更適合供電子工業協會(Electronic Industry Association,簡稱E.I.A.)所規定之溫度係數為NP0或稱C0G規格所採用,亦即電容器其電容值的溫度係數(1/C)(△C/△T)須在0±30ppm/℃之範圍內。 The invention relates to a low-k dielectric porcelain powder composition which is resistant to a low-temperature sintering in a reducing atmosphere and a preparation method thereof, and can be used for manufacturing a temperature-compensated multilayer ceramic capacitor. The invention is more suitable for use by the Electronic Industry Association (EIA), the temperature coefficient is NP0 or C0G specification, that is, the temperature coefficient of the capacitance value of the capacitor (1/C) (△C/△T ) must be in the range of 0 ± 30ppm / °C.

一般陶瓷電容器依其瓷粉組成的介電常數高低可分成三類:高介電常數型(Hi-K),中介電常數型(Mid-K)及溫度補償型(TC)。高介電常數型其介電常數達4000~15000,但其值隨溫度變化而變化很大。中介電常數型的介電常數約1400~3000,介電常數隨溫度的變化較小但常是非線性。溫度補償型的介電常數約8~100,介電常數隨溫度的變化最小且常是線性的變化。 Generally, ceramic capacitors can be classified into three types according to the dielectric constant of the porcelain powder composition: high dielectric constant type (Hi-K), dielectric constant type (Mid-K) and temperature compensation type (TC). The high dielectric constant type has a dielectric constant of 4000 to 15000, but its value varies greatly with temperature. The dielectric constant of the dielectric constant type is about 1400 to 3000, and the dielectric constant changes little with temperature but is often nonlinear. The temperature-compensated dielectric constant is about 8 to 100, and the dielectric constant changes minimally with temperature and is often linear.

積層陶瓷電容器的內電極和陶瓷介電層須一起共燒,因此常見商品化之積層陶瓷電容器之瓷粉組成依燒成溫度可概分為高溫燒成系與低溫燒成系兩種,高溫燒成系之燒成溫度約在1250℃~1300℃,因其燒成溫度較高,故其內電極一般需採用熔點較高,且價格昂貴的鈀(Pd)系貴金屬。低溫燒成系由於燒成溫度在1150℃以下,故其內電極可採用價格便宜,銀含量較高之銀鈀合金金屬(Ag/Pd)來降低成本而較經濟。 The internal electrode of the multilayer ceramic capacitor and the ceramic dielectric layer must be co-fired together. Therefore, the ceramic powder composition of the commercially available laminated ceramic capacitor can be roughly classified into a high temperature firing system and a low temperature firing system depending on the firing temperature. The firing temperature of the system is about 1250 ° C ~ 1300 ° C. Because of its high firing temperature, the internal electrode generally needs to use a palladium (Pd) noble metal with a high melting point and an expensive price. Since the low-temperature firing system has a firing temperature of 1150 ° C or less, the internal electrode can be reduced in cost and economical by using a silver-palladium alloy metal (Ag/Pd) which is inexpensive and has a high silver content.

近年來,手機及通訊市場快速成長,高頻元件需求大幅增加。內電極若是採用Cu,其成本更低於銀鈀合金金屬(Ag/Pd)且更具優越的導電特性、較低的等效串聯電阻(ESR,Equivalent Series Resistance)與散逸係數(Dissipation Factor,DF)更適合用來製作高頻元件。 In recent years, the mobile phone and communication markets have grown rapidly, and the demand for high-frequency components has increased dramatically. If the internal electrode is made of Cu, the cost is lower than that of silver-palladium alloy metal (Ag/Pd) and it has superior electrical conductivity, lower Equivalent Series Resistance (ESR) and Dissipation Factor (DF). ) is more suitable for making high frequency components.

一般溫度補償型電容器瓷粉組成的介電常數雖約在8~100間,但現行技術在製造10pF以下的低電容值NP0積層陶瓷電容器時,若瓷粉的介電常數較高,因積層層數較少,常因製程控制不易,陶瓷電容的電容值常偏離規格值以致良率偏低;因此現行製造10pF以下的積層陶瓷電容器常選用低介電常數為20以下的瓷粉來製造,以求提升良率而最適經濟生產。 Generally, the dielectric constant of the ceramic powder composition of the temperature-compensated capacitor is about 8 to 100. However, in the current technology, when manufacturing a low-capacitance NP0 multilayer ceramic capacitor of 10 pF or less, if the dielectric constant of the ceramic powder is high, the laminated layer is The number is small, often due to process control is not easy, the capacitance value of the ceramic capacitor often deviates from the specification value, so that the yield is low; therefore, the current production of multilayer ceramic capacitors below 10pF is often made of porcelain powder with a low dielectric constant of 20 or less. Seek to improve yield and optimize economic production.

一般低溫燒成系介電瓷粉組成,通常是用高溫燒成的主成份再添加各種燒結助劑(Sintering aid),諸如玻璃(glass),玻璃熔塊(frit)或助熔劑(flux)等以降低燒成溫度,一般此玻璃或玻璃熔塊皆含Pb或Cd或Bi等低熔點成份。而Pb、Cd為對環境生態有害物質,因應環保潮流,開發出不含Pb、Cd之介電瓷粉組成有其必要性。 Generally, low-temperature firing is a composition of dielectric porcelain powder, usually by using a high-temperature fired main component and adding various sintering aids such as glass, frit or flux. In order to lower the firing temperature, generally the glass or glass frit contains a low melting point component such as Pb or Cd or Bi. Pb and Cd are harmful substances to the environment and ecology. In response to the trend of environmental protection, it is necessary to develop a composition of dielectric porcelain powder containing no Pb or Cd.

在實際積層陶瓷電容器的製程上,由於銅金屬熔點較低(~1050℃)且易在高溫空氣下氧化成絶緣體而喪失電極的作用,因此不適合在傳統的大氣環境下與陶瓷粉共燒,而須在N2或N2/H2等還原氣氛共燒,因此開發出能耐還原性氣氛超低溫燒結的低介電常數介電瓷粉有其必要性。 In the process of the actual laminated ceramic capacitor, since the copper metal has a low melting point (~1050 ° C) and is easily oxidized into an insulator under high temperature air and loses the role of the electrode, it is not suitable for co-firing with the ceramic powder in the conventional atmospheric environment. However, it is necessary to co-fire in a reducing atmosphere such as N 2 or N 2 /H 2 . Therefore, it is necessary to develop a low-k dielectric porcelain powder which can be sintered at a low temperature in a reducing atmosphere.

關於低介電常數溫度補償型陶瓷電容器組成物,雖然美國專利第4,506,026號所揭示一種由主成份MgO-CaO-TiO2-Al2O3-SiO2-Nb2O5和副成份PbO-Bi2O3-CdO-ZnO-SiO2-B2O3玻璃所構成的組成物,符合E.I.A.的NPO規格要求,其介電常數約14-18,而製成之電容器其散逸因數(Dissipation Factor,tan δ)為0.0002以上,亦即Q值(=1/tan δ)約只有5000左右或更低。美國專利第4,533,974號所揭示由主成份MgO-ZnO-CaO-TiO2和副成份CdO-MgO-ZnO-B2O3-SiO2 flux所構成的組成物,其介電常數約20,但兩發明組成其燒結溫度都大於1100℃,且都是鈦酸物,在還原氣氛下燒結陶瓷體容易半導化而致絶緣電阻下降,因此必須在氧化氣氛下燒結因而無法使用於與銅內電極共燒。 Regarding a low dielectric constant temperature compensating ceramic capacitor composition, a main component of MgO-CaO-TiO 2 -Al 2 O 3 -SiO 2 -Nb 2 O 5 and a subcomponent PbO-Bi are disclosed in U.S. Patent No. 4,506,026. The composition of 2 O 3 -CdO-ZnO-SiO 2- B 2 O 3 glass meets the requirements of EIA's NPO specification, and its dielectric constant is about 14-18, and the resulting capacitor has a dissipation factor (Dissipation Factor, Tan δ ) is 0.0002 or more, that is, the Q value (=1/tan δ ) is about 5,000 or less. A composition comprising a main component of MgO-ZnO-CaO-TiO 2 and a by-component CdO-MgO-ZnO-B 2 O 3 -SiO 2 flux disclosed in U.S. Patent No. 4,533,974, having a dielectric constant of about 20, but two The invention has a sintering temperature of more than 1100 ° C and is a titanic acid. The sintered ceramic body is easily semiconducting under a reducing atmosphere and the insulation resistance is lowered. Therefore, it must be sintered under an oxidizing atmosphere and thus cannot be used together with the copper internal electrode. burn.

因此能在還原氣氛且燒成溫度在1000℃以下,以及以 MgO-CaO-SiO2-ZrO2-TiO2為主成份添加Li2O-BaO-ZnO-SiO2-B2O3玻璃熔塊副成份之不含Pb,Cd,Bi且耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物尚未出現。 Therefore, the Li 2 O-BaO-ZnO-SiO 2 -B 2 O 3 glass frit can be added in a reducing atmosphere and the firing temperature is below 1000 ° C, and MgO-CaO-SiO 2 -ZrO 2 -TiO 2 as a main component. The low dielectric constant dielectric powder composition of the subcomponent containing no Pb, Cd, Bi and ultra-low temperature sintering in a reducing atmosphere has not appeared.

本發明選用適當主成份系統,添加不含Pb、Cd、Bi之燒結助劑將燒結溫度降低至1000℃以下,且可耐還原氣氛燒結而可使用更價廉的銅內電極而降低成本製造更經濟且電性更佳的積層陶瓷電容器。 The invention selects a suitable main component system, and adds a sintering aid containing no Pb, Cd or Bi to lower the sintering temperature to below 1000 ° C, and can be sintered in a reducing atmosphere, and can be manufactured at a lower cost by using a cheaper copper internal electrode. Economical and electrically reliable multilayer ceramic capacitors.

本發明之目的即在開發一種能在1000℃以下且耐還原性氣氛超低溫燒結的積層陶瓷電容器組成,且不含鉛、鎘、鉍等成份,且可耐還原氣氛下燒結而其電氣特性之介電常數可達18以下,Q值為1000以上,溫度係數符合E.I.A.之NP0規格,即0±30ppm/℃以內,適合於供製造溫度補償型積層陶瓷電容器使用之介電瓷粉組成。 The object of the present invention is to develop a laminated ceramic capacitor which can be sintered at a low temperature of 1000 ° C or less in a reducing atmosphere, and which does not contain lead, cadmium, tellurium and the like, and can be sintered under a reducing atmosphere and its electrical properties are introduced. The electric constant can be up to 18 or less, the Q value is above 1000, and the temperature coefficient is in accordance with the IA0 specification of EIA, that is, 0±30ppm/°C, which is suitable for the dielectric porcelain powder used for manufacturing the temperature compensation type multilayer ceramic capacitor.

為達上述之目的,本發明有關之耐還原性氣氛超低溫燒結的低介電常數積層陶瓷電容器之介電瓷粉組成由100重量份之具有各莫耳數比0.35≦MgO≦0.80,0.20≦CaO≦0.65,0.40≦SiO2≦0.90,0.05≦ZrO2≦0.35,0.05≦TiO2≦0.25,與4~20重量份由Li2O、BaO、SiO2、ZnO和B2O3所組成的第二成份的玻璃熔塊(frit),其中玻璃熔塊(frit)的組成為0%≦Li2O≦25%,10%≦BaO≦60%,5%≦SiO2≦40%,0%≦ZnO≦30%,5%≦B2O3≦45%。 In order to achieve the above object, the dielectric powder composition of the low dielectric constant laminated ceramic capacitor of the ultra-low temperature sintering resistance in the present invention has a molar ratio of 0.35 ≦MgO ≦ 0.80, 0.20 ≦ CaO per 100 parts by weight. ≦0.65, 0.40≦SiO 2 ≦0.90, 0.05≦ZrO 2 ≦0.35, 0.05≦TiO 2 ≦0.25, and 4-20 parts by weight of Li 2 O, BaO, SiO 2 , ZnO and B 2 O 3 A two-component glass frit in which the composition of the glass frit is 0% ≦ Li 2 O ≦ 25%, 10% ≦ BaO ≦ 60%, 5% ≦ SiO 2 ≦ 40%, 0% ≦ ZnO ≦ 30%, 5% ≦ B 2 O 3 ≦ 45%.

依以上之組成範圍,係以煆燒形成CaMgSi2O6,Ca2MgSi2O7,Ca2Zr5Ti2O16,CaTiO3等為主成份,添加frit來共同作用降低燒結溫度至1000℃以下,並提高燒結體緻密性。控制不同的CaMgSi2O6,Ca2MgSi2O7,Ca2Zr5Ti2O16,CaTiO3等相的含量比例,可調整介電常數及電容值溫度係數;添加玻璃熔塊可提高燒結密度,提昇絕緣電阻。 According to the above composition range, CaMgSi 2 O 6 , Ca 2 MgSi 2 O 7 , Ca 2 Zr 5 Ti 2 O 16 , CaTiO 3 and the like are formed by calcination, and frit is added to reduce the sintering temperature to 1000 ° C. Hereinafter, the compactness of the sintered body is improved. Control the content ratio of different CaMgSi 2 O 6 , Ca 2 MgSi 2 O 7 , Ca 2 Zr 5 Ti 2 O 16 , CaTiO 3 phases, adjust the dielectric constant and capacitance temperature coefficient; add glass frit to improve sintering Density, increase insulation resistance.

為進一步揭示本案之技術內容,請參閱以下之實施例: To further reveal the technical content of this case, please refer to the following examples:

本發明的介電瓷粉組成物是以Mg(OH)2(氫氧化鎂)或MgCO3(碳酸鎂),CaCO3(碳酸鈣),SiO2(氧化矽),ZrO2(氧化鋯),TiO2(氧化鈦)為起始原料,依表(1)中所示之組成比例秤重,於球磨中濕式混合16小時,倒出烘乾後於窯爐中以1050℃以上高溫煆燒2小時,煆燒料再經粗碎細磨至1.0μm以下作為本發明中之第一成份。 The dielectric porcelain powder composition of the present invention is Mg(OH) 2 (magnesium hydroxide) or MgCO 3 (magnesium carbonate), CaCO 3 (calcium carbonate), SiO 2 (yttria), ZrO 2 (zirconia), TiO 2 (titanium oxide) is used as a starting material, and is weighed according to the composition ratio shown in Table (1). It is wet-mixed in a ball mill for 16 hours, poured out and dried, and then simmered in a kiln at a temperature of 1050 ° C or higher. After 2 hours, the crucible was finely ground to 1.0 μm or less as the first component in the present invention.

第二成份之玻璃熔塊(frit)則以氧化鋅(ZnO)、碳酸鋇(BaCO3)、碳酸鋰(Li2CO3)、硼酸(H3BO3)、氧化矽(SiO2)為起始原料依0%≦Li2O≦25%,10%≦BaO≦60%,5%≦SiO2≦40%,0%≦ZnO≦30%,5%≦B2O3≦45%的總和100%之配方組成,依比例秤量、混合、烘乾後於1200℃熔融水淬再經粗碎細磨至1.5μm以下。 The glass frit of the second component starts from zinc oxide (ZnO), barium carbonate (BaCO 3 ), lithium carbonate (Li 2 CO 3 ), boric acid (H 3 BO 3 ), and cerium oxide (SiO 2 ). The starting material is based on 0% ≦ Li 2 O ≦ 25%, 10% ≦ BaO ≦ 60%, 5% ≦ SiO 2 ≦ 40%, 0% ≦ ZnO ≦ 30%, 5% ≦ B 2 O 3 ≦ 45% 100% of the formula, according to the proportion of weighing, mixing, drying, melt water quenching at 1200 ° C and fine grinding to 1.5 μm or less.

再以表(2)之重量比例,秤量第一成份主料及第二成份之frit於球磨中濕式混合16小時,烘乾後即得最終配方粉。此配方粉中再添加入20%含有10%聚乙烯醇(polyvinyl alcohol,即PVA)溶液,予以造粒後,以1.5Ton/cm2的壓力來壓製成直徑10mm,厚1.0mm之圓板形生胚片,並於試片兩側分別利用網印(Screen Printing)方式塗上銅金屬膏(Copper paste),並進行與銅金屬共燒(Co-firing)處理;在共燒處理上,先將塗上銅金屬膏之介電陶瓷組成物試片,於600℃之高純氮氣(99.999% N2)環境下持溫4小時進行脫脂反應;隨後,再進一步升溫至1000℃以下之純氮氣或氮/氫混合氣氛(氫氣佔混合氣體之體積比例為0~1.5%間)環境下,進行持溫2小時之燒結反應。介電陶瓷組成物與銅金屬於還原氣氛下共燒結後,依照下列的測試條件來測定其電性及燒結密度:即頻率1MHz,測試電壓1Vrms,測定電容值並計算介電常數ε及量測D.F.值(即散逸因素tanδ);以直流電壓500V,充電1分鐘,溫度25℃,測定電阻值;以25℃的電容值為基準,測定125℃時之電容溫度係數,電容溫度係數以下列公式計算。溫度係數(ppm/℃):〔(C125-C25)/C25〕*〔1/(125-25)〕*106;測量燒結體重量及體積來計算出燒結體密度,並由光學顯微鏡(OM) 來觀察其顯微結構,由這些資料來綜合研判組成是否合乎要求。 Then, according to the weight ratio of Table (2), the frit of the first component main ingredient and the second component is weighed and mixed in a ball mill for 16 hours, and the final formula powder is obtained after drying. The formula powder was further added with a 20% solution containing 10% polyvinyl alcohol (PVA), granulated, and then pressed into a disk shape having a diameter of 10 mm and a thickness of 1.0 mm at a pressure of 1.5 Ton/cm 2 . The embryonic sheet is coated on the two sides of the test piece by a screen printing method, and a copper paste is co-firing; in the co-firing treatment, A test piece of a dielectric ceramic composition coated with a copper metal paste is subjected to a degreasing reaction under a high purity nitrogen gas (99.999% N 2 ) atmosphere of 600 ° C for 4 hours; and then, the temperature is further increased to a pure nitrogen gas of 1000 ° C or less. Or a nitrogen/hydrogen mixed atmosphere (a ratio of hydrogen to a mixed gas of 0 to 1.5%) is subjected to a sintering reaction for 2 hours. After the dielectric ceramic composition and the copper metal are co-sintered under a reducing atmosphere, the electrical properties and the sintered density are measured according to the following test conditions: the frequency is 1 MHz, the test voltage is 1 Vrms, the capacitance value is measured, and the dielectric constant ε and the measurement are calculated. DF value (ie, dissipation factor tan δ); with DC voltage of 500V, charging for 1 minute, temperature of 25 ° C, measuring resistance value; with 25 ° C capacitance value as reference, measuring the temperature coefficient of capacitance at 125 ° C, capacitance temperature coefficient by the following formula Calculation. Temperature coefficient (ppm/°C): [(C 125 -C 25 )/C 25 ]*[1/(125-25)]*10 6 ; The weight and volume of the sintered body were measured to calculate the density of the sintered body, and by optical The microscope (OM) is used to observe the microstructure, and it is up to the data to judge whether the composition is satisfactory.

上述的試料配方可再進一步製成積層陶瓷電容器,其方法如下:對配方粉100重量份,添加由聚甲基丙烯酸甲酯10份,丁酮/乙醇溶劑30份,丁基苄基酞酸酯4份等成份所組成之有機粘結劑,置於球磨機中均勻混合16小時,製成澆注成形用瓷漿,再將此瓷漿放入塗佈機,使瓷漿均勻塗佈於基板上,每次塗佈之介電層膜厚約20~30μm,經80℃烘乾後,再印刷銅內電極材料成份為銅之電極層,如此重覆數次達到所需之厚度及層數後,再將此成形體切割成4.0L×2.0Wmm大小之生胚晶片,此生胚晶片先經低於600℃脫脂處理80小時後,於960~1000℃燒結3小時,燒結後的晶片大小約為3.2L×1.6Wmm,再經銅外電極燒附後,依照下列測試條件:頻率1MHz,測試電壓1Vrms,測定D.F值及電容值並計算其介電常數ε值;以直流電壓50V,充電1分鐘後,測定絕緣電阻值;以每秒100V之速率昇高直流電壓,測定其破壞電壓;以25℃之電容值為基準,測定電容溫度變化係數,來完整評估積層陶瓷電容器之電氣特性。本實施例結果如表(3)所示。 The above sample formulation can be further formed into a laminated ceramic capacitor by the following method: 10 parts by weight of methyl methacrylate, 30 parts of methyl ethyl ketone/ethanol solvent, and butyl benzyl phthalate are added to 100 parts by weight of the formula powder. The organic binder composed of 4 parts and the like is uniformly mixed in a ball mill for 16 hours to prepare a porcelain slurry for casting molding, and then the porcelain slurry is placed in a coating machine to uniformly coat the porcelain slurry on the substrate. Each time the dielectric layer film is about 20~30μm thick, after drying at 80°C, the copper electrode material component is printed as the electrode layer of copper, so after repeated times to reach the required thickness and number of layers, The shaped body is then cut into a 4.0 L × 2.0 W mm green embryo wafer, which is first degreased at 600 ° C for 80 hours and then sintered at 960 to 1000 ° C for 3 hours. The sintered wafer size is about 3.2 L ×1.6 W mm, after being baked by the copper outer electrode, according to the following test conditions: frequency 1MHz, test voltage 1Vrms, measure DF value and capacitance value and calculate its dielectric constant ε value; charge with DC voltage 50V, 1 After a minute, measure the insulation resistance value; increase at a rate of 100V per second The voltage is measured, and the breakdown voltage is measured. The capacitance coefficient of capacitance is measured on the basis of the capacitance value of 25 ° C to completely evaluate the electrical characteristics of the multilayer ceramic capacitor. The results of this example are shown in Table (3).

本發明係以介電常數20以下,電容溫度係數符合企業可用的COJ規格(即-55℃~125℃,0±120ppm),D.F值(即散逸因數tanδ)為0.001以下,絕緣電阻在1×1011Ω以上,燒結密度達3.10g/cm3以上為目標。表(2)之試料中除1,6,7,14,19,22,23,24,25,26等試料無法符合本發明之目標外,其餘試料均可符合目標,故以下就請求範圍之理由分述如下:由試料1所示,當frit=2重量份時,D.F值太高且燒結密度皆較目標值為低,由試料6所示,當frit=25重量份時,燒結產生黏片現象以致無法量測電性,表示玻璃熔塊過量,而frit=4~20重量份時,均可符合目標值,因此frit最適添加量範圍為4%≦frit≦20%。 The invention has a dielectric constant of 20 or less, a temperature coefficient of capacitance conforming to the COJ specification available to the enterprise (ie, -55 ° C to 125 ° C, 0 ± 120 ppm), a DF value (ie, a dissipation factor tan δ) of 0.001 or less, and an insulation resistance of 1×. 10 11 Ω or more, and the sintered density is 3.10 g/cm 3 or more. In the sample of Table (2), except for the samples of 1, 6, 7, 14, 19, 22, 23, 24, 25, 26, etc., the other samples can meet the objectives of the present invention, so the following is the scope of the request. The reason is as follows: As shown in the sample 1, when frit = 2 parts by weight, the DF value is too high and the sintered density is lower than the target value, as shown by the sample 6, when frit = 25 parts by weight, sintering produces stickiness. The film phenomenon can not measure the electrical property, indicating that the glass frit is excessive, and the frit=4~20 parts by weight can meet the target value, so the optimum amount of frit is 4% ≦frit≦20%.

試料7~26主要係在調整第一成份之MgO,CaO,SiO2,ZrO2,TiO2之比率,以尋求最佳範圍,在此範圍中試料均可符合目標之電 氣特性,燒結密度,和顯微鏡結構。 Samples 7 to 26 are mainly used to adjust the ratio of MgO, CaO, SiO 2 , ZrO 2 and TiO 2 of the first component to find the optimum range, in which the sample can meet the electrical characteristics of the target, the sintered density, and Microscope structure.

由試料7及14所示,當MgO=30m/o時有D.F值太高,不符合特性要求。或當MgO=85m/o時,有D.F不良之現象,當MgO=35m/o~80m/o時,各項性質皆滿足目標值,故MgO之最適範圍為35m/o≦MgO≦80m/oAs shown by the samples 7 and 14, when the MgO = 30 m / o , the DF value is too high and does not meet the characteristic requirements. Or when MgO=85 m / o , there is a phenomenon of DF failure. When MgO=35 m / o ~80 m / o , each property satisfies the target value, so the optimum range of MgO is 35 m / o ≦MgO ≦80 m / o .

由試料7及14所示,當CaO=70m/o時,D.F值偏離目標值,當CaO=15m/o時,D.F值亦偏離目標值,當CaO=20m/o~65m/o時,各項性質皆滿足目標值,故CaO之最適範圍為20m/o≦CaO≦65m/oAs shown in samples 7 and 14, when CaO = 70 m / o , the DF value deviates from the target value. When CaO = 15 m / o , the DF value also deviates from the target value, when CaO = 20 m / o ~ 65 m / o , each property meets the target value, so the optimum range of CaO is 20 m / o ≦ CaO ≦ 65 m / o .

由試料19及22所示,當SiO2=35m/o時,溫度係數偏離目標值,當SiO2=95m/o時,溫度係數亦偏離目標值,當SiO2=40m/o~90m/o時,各項性質皆滿足目標值,故SiO2之最適範圍為40m/o≦SiO2≦90m/oAs shown by the samples 19 and 22, when SiO 2 = 35 m / o , the temperature coefficient deviates from the target value, and when SiO 2 = 95 m / o , the temperature coefficient also deviates from the target value when SiO 2 = 40 m / o ~ At 90 m / o , each property satisfies the target value, so the optimum range of SiO 2 is 40 m / o ≦ SiO 2 ≦ 90 m / o .

由試料23及24所示,當ZrO2=0m/o與40m/o時,前者有D.F值太高且IR不佳,後者亦有D.F值太高不符合特性要求的現象,當ZrO2=5m/o~35m/o時,各項性質皆滿足目標值,故ZrO2之最適範圍為5m/o≦ZrO2≦35m/oAs shown by the samples 23 and 24, when ZrO 2 = 0 m / o and 40 m / o , the former has a DF value which is too high and the IR is not good, and the latter also has a phenomenon that the DF value is too high and does not meet the characteristic requirement, when ZrO When 2 = 5 m / o ~ 35 m / o , each property satisfies the target value, so the optimum range of ZrO 2 is 5 m / o ≦ZrO 2 ≦ 35 m / o .

由試料25及26所示,當TiO2=0m/o時,溫度係數太高超出目標值,當TiO2=30m/o時,有IR不佳遠遠偏離目標值的現象,當TiO2=5m/o~25m/o時,各項性質皆滿足目標值,故TiO2之最適範圍為5m/o~25m/oAs shown by the samples 25 and 26, when TiO 2 = 0 m / o , the temperature coefficient is too high to exceed the target value, and when TiO 2 = 30 m / o , there is a phenomenon that the IR is not far from the target value, when TiO When 2 = 5 m / o ~ 25 m / o , each property satisfies the target value, so the optimum range of TiO 2 is 5 m / o ~ 25 m / o .

Claims (10)

一種耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物,其組成成份由100重量份包括a莫耳MgO、b莫耳CaO、c莫耳SiO2、d莫耳ZrO2及e莫耳TiO2,其中a+b=1,且0.35≦a≦0.80,0.20≦b≦0.65,0.40≦c≦0.90,0.05≦d≦0.35,0.05≦e≦0.25組成第一成份,該第一成份經煆燒形成CaMgSi2O6、Ca2MgSi2O7、Ca2Zr5Ti2O16、CaTiO3後與4~20重量份且包括Li2O、BaO、SiO2、ZnO、和B2O3的第二成份的玻璃熔塊(frit)加以配合組成該介電瓷粉組成物。 A low dielectric constant dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere, and its composition comprises 100 parts by weight including a mole MgO, b mole CaO, c mole SiO 2 , d mole ZrO 2 and e Mo Er TiO 2 , wherein a+b=1, and 0.35≦a≦0.80, 0.20≦b≦0.65, 0.40≦c≦0.90, 0.05≦d≦0.35, 0.05≦e≦0.25 constitute the first component, the first The composition is calcined to form CaMgSi 2 O 6 , Ca 2 MgSi 2 O 7 , Ca 2 Zr 5 Ti 2 O 16 , CaTiO 3 and 4 to 20 parts by weight and includes Li 2 O, BaO, SiO 2 , ZnO, and B. A glass frit of the second component of 2 O 3 is combined to form the dielectric porcelain powder composition. 如申請專利範圍第1項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物,其中該第一成份中之各組成成份係以Mg(OH)2(氫氧化鎂)或MgCO3(碳酸鎂),CaCO3(碳酸鈣),SiO2(氧化矽),ZrO2(氧化鋯),TiO2(氧化鈦)為起始原料,於球磨中濕式混合16小時,倒出烘乾後於窯爐中以1050℃以上高溫煆燒2小時,煆燒料為該CaMgSi2O6、Ca2MgSi2O7、Ca2Zr5Ti2O16、CaTiO3等相,再經粗碎細磨至1.0μm以下形成陶瓷瓷粉。 A low-k dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere as described in claim 1, wherein each component of the first component is Mg(OH) 2 (magnesium hydroxide) Or MgCO 3 (magnesium carbonate), CaCO 3 (calcium carbonate), SiO 2 (yttria), ZrO 2 (zirconia), TiO 2 (titanium oxide) as starting materials, wet mixing in a ball mill for 16 hours, pouring After drying, it is calcined in a kiln at a high temperature of 1050 ° C or higher for 2 hours, and the calcined material is the CaMgSi 2 O 6 , Ca 2 MgSi 2 O 7 , Ca 2 Zr 5 Ti 2 O 16 , CaTiO 3 phase, etc. The ceramic powder is formed by finely grinding to 1.0 μm or less. 如申請專利範圍第1項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物,其中該第二成份之該玻璃熔塊之近似組成為重量百分比0%≦Li2O≦25%,10%≦BaO≦60%,5%≦SiO2≦40%,0%≦ZnO≦30%,5%≦B2O3≦45%。 The low dielectric constant dielectric powder composition for ultra-low temperature sintering in a reducing atmosphere according to claim 1, wherein the glass frit of the second component has an approximate composition of 0% by weight ≦ Li 2 O ≦ 25%, 10% ≦ BaO ≦ 60%, 5% ≦ SiO 2 ≦ 40%, 0% ≦ ZnO ≦ 30%, 5% ≦ B 2 O 3 ≦ 45%. 如申請專利範圍第3項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物,其中該第二成份中之該玻璃熔塊之各組成成份依比例秤量、混合、烘乾後於1200℃熔融水淬再經粗碎細磨至1.5μm以下。 The low dielectric constant dielectric porcelain powder composition which is ultra-low temperature sintered in a reducing atmosphere as described in claim 3, wherein each component of the glass frit in the second component is weighed, mixed, and baked. After drying, it is melted by water at 1200 ° C and finely ground to 1.5 μm or less. 一種耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物的製備方法,係包含陶瓷瓷粉與Li2O-BaO-ZnO-SiO2-B2O3玻璃熔塊在室溫下濕式混合而成,其中該陶瓷瓷粉係由如申請專利範圍第2項所形成的該陶瓷瓷 粉。 Method for preparing low dielectric constant dielectric porcelain powder composition resistant to reduction atmosphere and ultra-low temperature sintering, comprising ceramic ceramic powder and Li 2 O-BaO-ZnO-SiO 2 -B 2 O 3 glass frit at room temperature The ceramic powder is formed by wet mixing, wherein the ceramic porcelain powder is formed from the ceramic ceramic powder as set forth in claim 2 of the patent application. 一種耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物的製備方法,係包含陶瓷瓷粉與Li2O-BaO-ZnO-SiO2-B2O3玻璃熔塊在室溫下濕式混合而成,其中該玻璃熔塊係由如專利範圍第4項所形成的該玻璃熔塊。 Method for preparing low dielectric constant dielectric porcelain powder composition resistant to reduction atmosphere and ultra-low temperature sintering, comprising ceramic ceramic powder and Li 2 O-BaO-ZnO-SiO 2 -B 2 O 3 glass frit at room temperature Wet mixing, wherein the glass frit is the glass frit formed as in item 4 of the patent. 一種耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物製成之溫度補償型積層陶瓷電容器,該組成物是由100重量份MgO-CaO-SiO2-ZrO2-TiO2組成第一成份,該第一成份經煆燒形成CaMgSi2O6、Ca2MgSi2O7、Ca2Zr5Ti2O16、CaTiO3等相,與4~20重量份的第二成份玻璃熔塊加以配合的組成物,再於該組成物中添加有機粘結劑,於球磨機中均勻混合,製成澆注成形用瓷漿,再將該瓷漿均勻塗佈於基板上經烘乾後,再印刷內電極材料,如此重覆數次達到積層陶瓷電容器所需的陶瓷結構,經燒結而成的積層陶瓷電容器。 A temperature-compensated multilayer ceramic capacitor made of a low-k dielectric sintered porcelain powder composition which is resistant to a low-temperature sintering in a reducing atmosphere, and the composition is composed of 100 parts by weight of MgO-CaO-SiO 2 -ZrO 2 -TiO 2 a component, the first component is calcined to form a phase of CaMgSi 2 O 6 , Ca 2 MgSi 2 O 7 , Ca 2 Zr 5 Ti 2 O 16 , CaTiO 3 , and 4 to 20 parts by weight of a second component glass frit The composition to be compounded is further added with an organic binder in the composition, and uniformly mixed in a ball mill to prepare a porcelain slurry for casting molding, and the porcelain slurry is uniformly coated on the substrate, dried, and then printed. The inner electrode material is a laminated ceramic capacitor which is sintered several times to reach the ceramic structure required for the laminated ceramic capacitor. 如申請專利範圍第7項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物製成之溫度補償型積層陶瓷電容器,其中該第二成份之該玻璃熔塊之近似組成為重量百分比0%≦Li2O≦25%,10%≦BaO≦60%,5%≦SiO2≦40%,0%≦ZnO≦30%,5%≦B2O3≦45%。 A temperature-compensated multilayer ceramic capacitor made of a low-k dielectric sintered porcelain powder composition having a reducing atmosphere atmosphere and a reductive atmosphere according to claim 7, wherein the second component of the glass frit is approximated It is 0% ≦ Li 2 O ≦ 25%, 10% ≦ BaO ≦ 60%, 5% ≦ SiO 2 ≦ 40%, 0% ≦ ZnO ≦ 30%, 5% ≦ B 2 O 3 ≦ 45%. 如申請專利範圍第7項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物製成之溫度補償型積層陶瓷電容器,其中該有機粘結劑由聚甲基丙烯酸甲酯,丁酮/乙醇溶劑,丁基苄基酞酸酯等成份所組成。 A temperature-compensated multilayer ceramic capacitor made of a low-k dielectric sintered porcelain powder composition having a reducing atmosphere and a low-temperature-sintering atmosphere as described in claim 7, wherein the organic binder is composed of polymethyl methacrylate , butanone / ethanol solvent, butyl benzyl phthalate and other components. 如申請專利範圍第7項所述之耐還原性氣氛超低溫燒結的低介電常數介電瓷粉組成物製成之溫度補償型積層陶瓷電容器,其中該內電極材料之成份為銅。 A temperature-compensated multilayer ceramic capacitor made of a low-k dielectric sintered porcelain powder composition which is resistant to a reducing atmosphere and has a reductive atmosphere as described in claim 7, wherein the internal electrode material is made of copper.
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